POWER MODULE

Abstract

A power module (20) is provided. The power module (20) comprises: a first semiconductor chip (32); a second semiconductor chip (42) electrically coupled to the first semiconductor chip (32); and a fluid-tight housing (22) enclosing an interior (30) of the housing (22) and having an inlet (92) for introducing a coolant into the interior (30) and an outlet (94) for draining the coolant from the interior (30), wherein a first side of the housing (22) is at least partially formed by a first driver board (24) for controlling the first semiconductor chip (32) and for electrically coupling the power module (20) to a first external device, wherein the first driver board (24) is electrically coupled to the first semiconductor chip (32).wherein a second side of the housing (22) opposite the first side of the housing (22) is at least partially formed by a second driver board (26) for controlling the second semiconductor chip (42) and for electrically coupling the power module (20) to a second external device, wherein the second driver board (26) is electrically coupled to the second semiconductor chip (42), wherein the first driver board (24) is mechanically coupled to the second driver board (26) by a frame (28) of the housing (22), and wherein the first and second semiconductor chips (32, 42) are arranged in the interior (30) of the housing (22) such that the first and second semiconductor chips (32, 42) can be cooled by the coolant.

Description

[0001] The invention relates to a power module. The power module can be an electrical converter, e.g., an inverter or a rectifier, and / or can form or comprise one or more half-bridges.

[0002] A conventional power module may include a carrier, at least one semiconductor chip mounted on the carrier, and a driver board arranged over the semiconductor chip. The carrier may include a DBC (direct bonded copper) substrate or an IMS (insulated metal substrate). The carrier may include or be a heat sink. The heat sink may include cooling fins for cooling the power module by convection. The driver board may be configured to electrically contact and / or control the semiconductor chip. The semiconductor chip may be a high-performance semiconductor chip.

[0003] As technology advances, semiconductor chips are becoming smaller and smaller. However, these semiconductor chips may need to handle the same or even higher currents than before. Thus, the power density in the semiconductor chips is becoming ever greater. This increasing power density leads to increased heat generation during operation of the power modules. This heat can impair the semiconductor chips and / or their functions, especially if the semiconductor chips are based on SiC, GaN, or GaO, for example, and / or if one of the semiconductor chips is a high-performance semiconductor chip. In conventional power modules, however, the semiconductor chips are separated from the heat sink by the carrier layers. This reduces the power module's ability to dissipate heat from the semiconductor chips.This can lead to a reduction in the service life, reliability and / or performance of the semiconductor chips and thus of the corresponding power module.

[0004] Furthermore, in conventional power modules, the semiconductor chips can be electrically coupled to the carrier, the driver board, and / or each other via corresponding wire bonds. However, the wire bonds can introduce high inductance into the power module when the power module is in operation. Furthermore, wire bond lift-off and / or solder fatigue can limit the reliability of the corresponding electrical connections and thus the reliability of the power module. Furthermore, due to different coefficients of thermal expansion (CTEs) between the semiconductor chips and the wire bonds, which include or are made of aluminum, cracks can develop between the semiconductor chips and the corresponding wire bonds (CTE of the semiconductor chip ≈ 4 × 10-6 / °C, CTE of the aluminum = 23 × 10-6 / °C).This may result in a reduction in the lifetime, reliability and / or performance of the semiconductor chips and thus of the power module.

[0005] Therefore, an object of the present invention is to provide a power module which has a long lifetime, good reliability and / or high performance and which in particular provides very good heat dissipation from semiconductor chips of the power module.

[0006] The problem is solved by the subject matter of the independent claim. Advantageous embodiments are recited in the dependent claims.

[0007] One aspect relates to a power module. The power module comprises: a first semiconductor chip; a second semiconductor chip electrically coupled to the first semiconductor chip; and a fluid-tight housing enclosing an interior of the housing and having an inlet for introducing an insulated coolant into the interior and an outlet for discharging the coolant from the interior. A first side of the housing is at least partially formed by a first driver board for driving the first semiconductor chip and for electrically coupling the power module to a first external device, wherein the first driver board is electrically coupled to the first semiconductor chip.A second side of the housing, opposite the first side of the housing, is at least partially formed by a second driver board for driving the second semiconductor chip and for electrically coupling the power module to a second external device, wherein the second driver board is electrically coupled to the second semiconductor chip. The first driver board is mechanically coupled to the second driver board by a frame of the housing. The first and second semiconductor chips are arranged in the interior of the housing such that the first and second semiconductor chips can be cooled by the coolant.

[0008] The fact that the semiconductor chips can be cooled by the liquid coolant can contribute to excellent heat dissipation from the semiconductor chip. This can contribute to good reliability and / or high performance of the power module. Using the first driver board and the second driver board as the housing saves space and costs and allows the power module to be implemented with only a few components, thereby reducing complexity and extending the service life of the power module.

[0009] The fact that the semiconductor chips can be cooled by the coolant can mean that the coolant can flow around the semiconductor chips and can touch the semiconductor chips when the coolant flows through the interior of the housing, in particular during operation of the power module. This can contribute to very good heat dissipation from the semiconductor chips. This can contribute to high performance of the semiconductor chips and thus of the power module. Since the coolant contacts the semiconductor chips and thus one or more of the corresponding electrical contacts, patterns and / or electrically conductive lines and / or coupling rails, the coolant can have dielectric and / or electrically insulating properties so that no short circuits are caused in the interior. The coolant can, for example, be a dielectric oil.

[0010] The first and second semiconductor chips can form a half-bridge of the power module. A type of the second semiconductor chip can correspond to a type of the first semiconductor chip. At least one of the semiconductor chips can be a high-power semiconductor chip. The high-power semiconductor chip can be configured to process high voltages, e.g., more than 100 V, and / or high currents, e.g., more than 10 A.

[0011] The first driver board may comprise a dielectric and fluid-tight first body, e.g., comprising one or more layers of pre-impregnated fibers, and a plurality of electrically conductive busbars, electrical lines, and / or patterns. These busbars may be arranged on a surface of the dielectric and fluid-tight first body or embedded therein. For example, the first driver board may be the first printed circuit board (PCB). The second driver board may comprise a dielectric and fluid-tight second body, e.g., comprising one or more layers of pre-impregnated fibers and a plurality of electrically conductive busbars, electrical lines, and / or patterns. These busbars may be arranged on a surface of the dielectric and fluid-tight second body or embedded therein. For example, the second driver board may be a second PCB.

[0012] A seal may be arranged between the first and second driver boards and / or between one of the driver boards and the frame to form the fluid-tight housing of the power module. The seal may be an O-ring.

[0013] The first external device may be an AC device, e.g., a load, e.g., an electrical machine, e.g., a rotating electrical machine, e.g., a generator or an electric motor. The second external device may be a DC device, e.g., a DC capacitor, an intermediate circuit, or a battery. The fact that the first and / or second power terminal is / are accessible from outside the power module may mean that the first and / or second power terminal may protrude at least partially from the housing or that the first and / or second power terminal may be arranged in corresponding recesses of the housing that are exposed to the outside.

[0014] According to one embodiment, the first driver board comprises: one or more first electronic components for driving the first semiconductor chip, wherein the first electronic components are arranged on an outer side of the housing; a first control pattern facing the interior, electrically coupled to the first semiconductor chip, and electrically coupled to at least one of the first electronic components via a first electrical line of the first driver board; and a first power pattern facing the interior and electrically coupled to the first and second semiconductor chips.

[0015] The first electronic components can be arranged on an outside of the housing, while the semiconductor chips can be arranged within the housing. The first electronic components can be configured to control the first semiconductor chip. The first electronic components can comprise active electronic components and / or passive electronic components. The passive electronic components can comprise one or more resistors, one or more capacitors, and / or one or more conductors. The active electronic components can comprise one or more chips and / or one or more transistors, wherein these chips can be arranged on the outside of the housing to control the first semiconductor chip.

[0016] The first control pattern electrically couples the first semiconductor chip to the first electronic components. The first power pattern electrically couples the first semiconductor chip to the second semiconductor chip. The first control pattern and / or the first power pattern can each comprise an electrically conductive region, e.g., a sheet, a pad, or a layer comprising, e.g., copper or aluminum. The first control pattern and / or the first power pattern can be arranged on a surface of the dielectric and fluid-tight first driver board or embedded in the latter.

[0017] The first semiconductor chip can be arranged directly on the first control pattern and / or the first power pattern. For example, electrical contacts, e.g., a first control contact and / or a first power contact of the first semiconductor chip, which face the first driver board, can touch the first control pattern or the first power pattern of the first driver board. The first electrical line can be a through via extending from the first control pattern through the first driver board to the first electronic components. Furthermore, electrical lines that electrically couple the first electronic components to one another can also be referred to as "first electrical lines" in this description. The latter first electrical lines can be arranged on or at an outer surface of the first driver board.

[0018] In this specification, "direct" electrical, physical and / or mechanical contact between two bodies, such as "direct electrical contact" or "directly disposed upon", may mean that the bodies touch without any other substance between the two bodies or that only an adhesive for fixing the bodies together may be provided between the two bodies, wherein the adhesive may be a solder or an electrically conductive adhesive.

[0019] According to one embodiment, the first driver board comprises a first power terminal for electrically coupling the power module to the first external device, wherein the first power terminal is electrically coupled to the first power pattern, and wherein the first power terminal is arranged to be accessible from outside the power module.

[0020] According to one embodiment, the first power terminal is an AC terminal of the power module. Thus, the AC terminal of the power module is arranged on the first driver board. In this context, the first power pattern can be referred to as the AC pattern of the power module.

[0021] According to one embodiment, the second driver board comprises: one or more second electronic components for driving the second semiconductor chip, wherein the second electronic components are arranged on an outer side of the housing; a second control pattern facing the interior, electrically coupled to the second semiconductor chip, and electrically coupled to at least one of the second electronic components via a second electrical line of the second driver board; a second power pattern facing the interior and electrically coupled to the second semiconductor chip; and a third power pattern facing the interior and electrically coupled to the first semiconductor chip.

[0022] The second electronic components can be configured to control the second semiconductor chip. The second electronic components can comprise active electronic components and / or passive electronic components. The passive electronic components can comprise one or more resistors, one or more capacitors, and / or one or more conductors. The active electronic components can comprise one or more chips and / or one or more transistors, wherein these chips can be arranged on the outside of the housing for controlling the second semiconductor chip.

[0023] The second control pattern electrically couples the second semiconductor chip to the second electronic components. The second control pattern, the second power pattern, and / or the third power pattern may each comprise an electrically conductive region, e.g., a sheet, a pad, or a layer comprising, e.g., copper or aluminum. The second control pattern, the second power pattern, and / or the third power pattern may be arranged on a surface of the dielectric and fluid-tight second driver board or embedded in the latter.

[0024] The second semiconductor chip can be arranged directly on the second control pattern and / or the second power pattern. For example, electrical contacts, e.g., a second control contact and / or a first power contact of the second semiconductor chip facing the second driver board, can touch the second control pattern or the second power pattern of the second driver board, respectively. The second electrical line can be a through via extending from the second control pattern through the second driver board to the second electronic components. Furthermore, electrical lines that electrically couple the second electronic components to each other can also be referred to as "second electrical lines" in this description. The latter second electrical lines can be arranged on or at an outer surface of the second driver board.

[0025] According to one embodiment, the second driver board comprises a second power terminal for electrically coupling the power module to the second external device, wherein the second power terminal is electrically coupled to the second and third power patterns, and wherein the second power terminal is arranged to be accessible from outside the power module.

[0026] According to one embodiment, the second power terminal comprises a first DC terminal and a second DC terminal, each arranged to be accessible from outside the power module, the first DC terminal being electrically coupled to the first semiconductor chip via the third power pattern, and the second DC terminal being electrically coupled to the second semiconductor chip via the second power pattern. In this context, the third power pattern may be referred to as the first DC pattern, and the second power pattern may be referred to as the second DC pattern. The first DC terminal may be electrically coupled to the third power pattern via a first bus bar of the second driver board. The second DC terminal may be electrically coupled to the second power pattern via a second bus bar of the second driver board.In this context, the second driver board may be referred to as a busbar board. The first and second DC connectors may be arranged side by side and / or form a plug or socket, as known in the art.

[0027] According to one embodiment, the first semiconductor chip comprises a first control contact, a first power contact of the first semiconductor chip and a second power contact of the first semiconductor chip, wherein the first control contact is electrically coupled to the first electronic components via the first control pattern, wherein the first power contact of the first semiconductor chip is electrically coupled to the first power terminal via the first power pattern, and wherein the second power contact of the first semiconductor chip is electrically coupled to the first DC terminal via the third power pattern.

[0028] Generally, in a power module, a "high-side" semiconductor chip refers to a semiconductor chip in which the drain contact of the semiconductor chip is connected to the positive side of the power source. Meanwhile, the source contact of the semiconductor chip is not connected to the ground of the power source, but is connected to the drain contact of the "low-side" semiconductor chip. The source contact of the "low-side" semiconductor chip is connected to the common ground. For example, the first control contact may be a first gate contact, the first power contact of the first semiconductor chip may be a first source contact, and the second power contact of the first semiconductor chip may be a first drain contact. In this case, the first semiconductor chip and the first electronic components on the first driver board may provide a high side of the power module.Alternatively, the first semiconductor chip and the first electronic components may be configured and arranged to provide a low side of the power module.

[0029] According to one embodiment, the second semiconductor chip comprises a second control contact, a first power contact of the second semiconductor chip, and a second power contact of the second semiconductor chip, wherein the second control contact is electrically coupled to the second electronic components via the second control pattern, wherein the second power contact of the second semiconductor chip is electrically coupled to the first power terminal via the first power pattern, and wherein the first power contact of the second semiconductor chip is electrically coupled to the second DC terminal via the second power pattern. For example, the second control contact can be a second gate contact, the first power contact of the second semiconductor chip can be a second source contact, and the second power contact of the second semiconductor chip can be a second drain contact.In this case, the second semiconductor chip and the second electronic components on the second driver board can provide a low side of the power module. Alternatively, the second semiconductor chip and the second electronic components can be configured and arranged such that they can provide a high side of the power module.

[0030] According to one embodiment, the electrical coupling between the first semiconductor chip and the second driver board and / or the electrical coupling between the second semiconductor chip and the first driver board is provided by corresponding electrically conductive contact rails, and the contact rails are arranged such that the contact rails can be cooled by the coolant. In particular, the contact rails can be arranged in the interior of the housing. Therefore, the contact rails can be cooled by the coolant in the interior. The fact that the contact rails can be cooled by the coolant can mean that the coolant can flow around the contact rails and touch the contact rails as the coolant flows through the interior of the housing. This can contribute to very good heat dissipation from the semiconductor chips and the driver boards.This contributes very efficiently to proper cooling of the semiconductor chips and thus the power module.

[0031] At least one of the contact rails can provide electrical contact between the first semiconductor chip, in particular the second power contact of the first semiconductor chip, and the second driver board, in particular the third power pattern of the second driver board. This contact rail can be referred to as the first contact rail. Optionally, the power module comprises two or more first contact rails that electrically couple the first semiconductor chip, in particular the second power contact of the first semiconductor chip, to the second driver board, in particular the third power pattern of the second driver board.

[0032] At least one of the contact rails can provide electrical contact between the second semiconductor chip, in particular the second power contact of the second semiconductor chip, and the first driver board, in particular the first power pattern of the first driver board. This contact rail can be referred to as a second contact rail. Optionally, the power module comprises two or more second contact rails that electrically couple the second semiconductor chip, in particular the second power contact of the second semiconductor chip, to the first driver board, in particular the first power pattern of the first driver board.

[0033] Instead of electrically coupling the first semiconductor chip to the patterns of the second driver board and / or the second semiconductor chip to the patterns of the first driver board via the corresponding contact rails, the electrical connection between the first semiconductor chip and the second driver board, and / or the second semiconductor chip and the first driver board can be a direct electrical connection.

[0034] The electrical connections inside the module can be made through direct electrical contacts or via the contact rails. Therefore, no wire bonds are required, and only a small amount of inductance may be induced during operation of the power module.

[0035] According to one embodiment, the first semiconductor chip is arranged on the first driver board and / or the second semiconductor chip is arranged on the second driver board. In other words, the first semiconductor chip can be mounted on the first driver board and / or the second semiconductor chip can be mounted on the second driver board, in particular on the sides of the driver boards facing the interior of the housing.

[0036] According to one embodiment, the power module comprises: two or more of the first semiconductor chips arranged on an electrically conductive first carrier such that the first semiconductor chips are electrically coupled to one another via the first carrier; and / or two or more of the second semiconductor chips arranged on an electrically conductive second carrier such that the second semiconductor chips are electrically coupled to one another via the second carrier. Each of the first semiconductor chips can be configured, arranged, and / or electrically contacted as the first semiconductor chip described above, wherein the first carrier can function as a first current collector that collects the currents from the second power contacts of the first semiconductor chips.Each of the second semiconductor chips can be configured, arranged, and / or electrically contacted as the second semiconductor chip described above, wherein the second carrier can function as a second current collector that collects the currents from the second power contacts of the second semiconductor chips. In other words, the first semiconductor chips can be arranged electrically parallel to one another, in particular on the first carrier, and the second semiconductor chips can be arranged electrically parallel to one another, in particular on the second carrier.

[0037] According to one embodiment, the first carrier is arranged on the second power contacts of the first semiconductor chips and is electrically coupled thereto, and / or the second power contacts of the second semiconductor chips are arranged on the second carrier and are electrically coupled thereto. In this case, the first semiconductor chips can be arranged such that the second power contacts of the first semiconductor chips are arranged on top of the first semiconductor chips, and the second semiconductor chips can be arranged such that the second power contacts of the second semiconductor chips are arranged on a bottom side of the second semiconductor chips. Therefore, the first semiconductor chips can be arranged upside down with respect to the second semiconductor chips.

[0038] According to one embodiment, the power module comprises a first housing comprising the first driver board and a second housing comprising the second driver board. The first housing and the second housing can form a fluid-tight housing of the power module. Optionally, the first electronic components can be arranged in the first housing and / or the second electronic components can be arranged in the second housing. For example, the first driver board can be embedded in the first housing and / or the second driver board can be embedded in the second housing. The fluid-tight housing of the power module can surround the housing of the power module.

[0039] These and other aspects of the invention will become apparent and explained with reference to the embodiments described below. Embodiments of the present invention will be described in more detail below with reference to the attached drawings. Fig. 1 shows a sectional side view of an embodiment of a power module. Fig. 2 shows a first side of an embodiment of a semiconductor chip of the power module of Fig. 1. Fig. 3 shows a second side of the semiconductor chip of Fig. 2. Fig. 4 shows several semiconductor chips according to the Fig. 2 and Fig. 3 shown semiconductor chip on a carrier. Fig. 5 shows a sectional side view of an embodiment of a power module.

[0040] The reference symbols used in the drawings and their meanings are summarized in the following list of reference symbols. Identical parts in the figures are generally provided with the same reference symbols.

[0041] Fig. 1 shows a sectional side view of an embodiment of a power module 20. The power module 20 comprises a first semiconductor chip 32 and a second semiconductor chip 42, as well as a fluid-tight housing 22. The fluid-tight housing 22 encloses an interior space 30 of the housing 22, in which the semiconductor chips 32, 42 are arranged. The power module 20 can be an electrical converter, e.g., an inverter or a rectifier, and / or can form or comprise one or more half-bridges.

[0042] A first side of the housing 22 is formed at least partially, e.g., completely, by a first driver board 24 for driving the first semiconductor chip 32 and for electrically coupling the power module 20 to a first external device (not shown). The first external device may be an AC device, e.g., a load, e.g., an electrical machine, e.g., a rotating electrical machine, e.g., a generator or an electric motor.

[0043] A second side of the housing 22, opposite the first side of the housing 22, is at least partially formed by a second driver board 26 for driving the second semiconductor chip 42 and for electrically coupling the power module 20 to a second external device (not shown). The second external device may be a DC device, e.g., a DC capacitor, an intermediate circuit, or a battery.

[0044] The first driver board 24 is mechanically coupled to the second driver board 26 by a frame 28 of the housing 22. The second side of the housing 22 may be formed by the frame 28. Optionally, the housing 22 may not include any outwardly facing components other than the first driver board 24, the second driver board 26, and the frame 28. Thus, the housing 22 may be formed by the first driver board 24, the second driver board 26, and the frame 28.

[0045] The fluid-tight housing 22 has an inlet 92 for introducing an insulated coolant (not shown) into the interior 30 and an outlet 94 for discharging the coolant from the interior 30. The inlet 92 and the outlet 94 can be arranged on or at least partially in the frame 28. For example, the inlet 92 and the outlet 94 can extend through corresponding recesses in the frame 28. A seal 96, e.g., an O-ring, can be arranged between the second driver board 26 and the frame 28. Optionally, another seal (not shown), e.g., another O-ring, can be arranged between the first driver board 24 and the frame 28. The second driver board 26 can be mechanically coupled to the frame 28 by one or more screws or bolts 98. Optionally, the second driver board 26 can be mechanically coupled to the frame 28 by one or more additional screws or bolts (not shown).

[0046] The first and second semiconductor chips 32, 42 are arranged in the interior 30 of the housing 22 such that the first and second semiconductor chips 32, 42 can be cooled by the coolant. The fact that the semiconductor chips 32, 42 can be cooled by the coolant can mean that the coolant can flow around the semiconductor chips 32, 42 and touch the semiconductor chips 32, 42 when the coolant flows through the interior 30 of the housing 22, particularly during operation of the power module 20. For this reason, the coolant can have dielectric and / or electrically insulating properties so as not to cause short circuits in the interior 30. The coolant can be, for example, a dielectric oil.

[0047] One or more of the semiconductor chips 32, 42 may include three or more electrical contacts. For example, the first semiconductor chip 32 may include a first control contact 38, e.g., a first gate contact, a first power contact 34 of the first semiconductor chip 32, e.g., a source contact of the first semiconductor chip 32, a second power contact 36 of the first semiconductor chip 32, e.g., a drain contact of the first semiconductor chip 32, and / or optionally one or more substrate contacts (not shown). Likewise, the second semiconductor chip 42 may include a second control contact 48, e.g., a second gate contact, a first power contact 44 of the second semiconductor chip 42, e.g., a source contact of the second semiconductor chip 42, a second power contact 46 of the second semiconductor chip 42, e.g., a drain contact of the second semiconductor chip 42, and / or one or more substrate contacts (not shown).

[0048] The first control contact 38 may face the first driver board 24. The first power contact 34 of the first semiconductor chip 32 may face the first driver board 24. The second power contact 36 of the first semiconductor chip 32 may face the second driver board 26. The second control contact 48 may face the second driver board 26. The first power contact 44 of the second semiconductor chip 42 may face the second driver board 26. The second power contact 46 of the second semiconductor chip 42 may face the first driver board 24.

[0049] A type of second semiconductor chip 42 may correspond to a type of first semiconductor chip 32. Semiconductor chips 32, 42 may comprise SiC, GaN, or GaO. At least one of semiconductor chips 32, 42 may be a high-performance semiconductor chip. The high-performance semiconductor chip may be configured to process high voltages, e.g., more than 100 V, and / or high currents, e.g., more than 10 A.

[0050] The first driver board 24 may include a dielectric and fluid-tight first body, e.g., comprising one or more layers of pre-impregnated fibers, and a plurality of first electrical lines 72 and / or electrically conductive first patterns 56, 74, as explained below. The electrically conductive first patterns 56, 74 may be arranged on a surface of this dielectric and fluid-tight first body. The first patterns 56, 74 may each include one or more small electrically conductive regions, e.g., sheets, pads, or layers, comprising, e.g., copper or aluminum. The first electrical lines 72 may be arranged on the surface of the dielectric and fluid-tight first body or embedded therein. For example, the first driver board 24 may be a first printed circuit board (PCB).

[0051] The first driver board 24 may include one or more first electronic components 70 for driving the first semiconductor chip 32. The first electronic components 70 may be arranged on an exterior side of the housing 22. The first driver board 24 may include a third power pattern 60 facing the interior space 30, electrically coupled to the first and second semiconductor chips 32, 42, and electrically coupled to the first power terminal 50. The first driver board 24 may include a first control pattern 74 facing the interior space 30 and electrically coupled to the first electronic components 72. The first driver board 24 may include a first power terminal 52, 54 for electrically coupling the power module 20 to an external first device (not shown), wherein the first power terminal 52, 54 may be arranged such that it is accessible from outside the power module 20.

[0052] The second driver board 26 may comprise a dielectric and fluid-tight second body, e.g., comprising one or more layers of pre-impregnated fibers, and a plurality of second electrical lines 82, electrically conductive second patterns 56, 76, and / or an electrically conductive third pattern 60, as explained below. The electrically conductive second and third patterns 58, 60, 76 may be arranged on a surface of this dielectric and fluid-tight second body facing the interior space 30. The second and third patterns 58, 60, 76 may each comprise one or more small electrically conductive regions, e.g., sheets, pads, or layers, comprising, e.g., copper or aluminum. The second electrical lines 82 may be arranged on the surface of the dielectric and fluid-tight second body or embedded therein. For example, the second driver board 26 may be a second printed circuit board (PCB).

[0053] The second driver board 26 may include one or more second electronic components 80 for driving the second semiconductor chip 42. The second electronic components 80 may be arranged on an exterior side of the housing 22. The electrically conductive second patterns 56, 76 include a second power pattern 56 and a second control pattern 76, and / or the third pattern 60 includes a third power pattern 60. The second power pattern 58 may be electrically coupled to the second semiconductor chip 42. The second control pattern 76 may be electrically coupled to at least one of the second electronic components 80 via one or more of the second electrical lines 82. The third power pattern 60 may be electrically coupled to the first semiconductor chip 32.

[0054] The first and second electronic components 70, 80 may each comprise active electronic components and / or passive electronic components. The passive electronic components may comprise one or more resistors, one or more capacitors, and / or one or more conductors. The active electronic components may comprise one or more chips and / or one or more transistors.

[0055] The second driver board 26 may include a second power terminal 52, 54 for electrically coupling the power module 20 to the second external device, wherein the second power terminal 52, 54 is electrically coupled to the second and third power patterns 58, 60, and wherein the second power terminal 52, 54 is arranged to be accessible from outside the power module 20. The fact that the first and / or second power terminal 52, 54, 50 is / are accessible from outside the power module 20 may mean that the first and / or second power terminal 52, 54, 50 may protrude at least partially from the housing 22, or that the first and / or second power terminal 52, 54, 50 may be arranged in corresponding recesses of the housing 22 and may be at least partially exposed to the outside.

[0056] The first control contact 38 of the first semiconductor chip 32 can be electrically coupled to the first control pattern 74 of the first driver board 24. The first power contact 34 of the first semiconductor chip 32 can be electrically coupled to the first power pattern 56 of the first driver board 24. The second power contact 36 of the first semiconductor chip 32 can be electrically coupled to the third power pattern 60 of the second driver board 26.

[0057] The second control contact 48 of the second semiconductor chip 42 can be electrically coupled to the second control pattern 76 of the second driver board 26. The first power contact 44 of the second semiconductor chip 42 can be electrically coupled to the second power pattern 58 of the second driver board 26. The second power contact 46 of the second semiconductor chip 42 can be electrically coupled to the first power pattern 56 of the first driver board 24.

[0058] The first semiconductor chip 32 can be arranged directly on the first driver board 24. The electrical couplings between the first semiconductor chip 32 and the first patterns 56, 74 of the first driver board 24 can be direct electrical connections. In this context, the direct electrical connections can be provided by the first electrical contacts 34, 38 of the first semiconductor chip 32 directly contacting the corresponding first patterns 56, 74 or by providing an adhesive only between the first semiconductor chip 32 and the corresponding first patterns 56, 74, wherein the adhesive can be a solder or an electrically conductive adhesive.

[0059] The second semiconductor chip 42 can be arranged directly on the second driver board 26. The electrical couplings between the second semiconductor chip 42 and the second patterns 58, 76 of the second driver board 26 can be direct electrical connections. In this context, the direct electrical connections can be provided by the second electrical contacts 44, 48 of the first semiconductor chip 42 directly contacting the corresponding second patterns 58, 76 or by providing an adhesive only between the second semiconductor chip 42 and the corresponding second patterns 58, 76, wherein the adhesive can be a solder or an electrically conductive adhesive.

[0060] In contrast, the electrical coupling between the first semiconductor chip 32 and the second driver board 26, e.g., the third power pattern 60, can be provided by one or more electrically conductive first contact rails 66. Alternatively or additionally, the electrical coupling between the second semiconductor chip 42 and the first driver board 24, e.g., the first power pattern 56, can be provided by one or more electrically conductive second contact rails 68. The contact rails 66, 68 can be arranged such that the contact rails 66, 68 can be cooled by the coolant when the coolant circulates in the interior space 30.The fact that the contact rails 66, 68 can be cooled by the coolant can mean that the contact rails 66, 68 can be designed and arranged such that the coolant can flow around the contact rails 66, 68 and contact the contact rails 66, 68 when the coolant flows through the interior 30 of the housing 22.

[0061] The first power terminal 50 may be an AC terminal 50. In this context, the first power pattern 56 may be referred to as the first AC pattern 56. The second power terminal 52, 54 may include a first DC terminal 52 and a second DC terminal 54, each arranged to be accessible from outside the power module 20.

[0062] The third power pattern 60 may be referred to as a first DC pattern 60, which may be coupled to the first DC terminal 52 via an electrically conductive first bus bar 62, which may be referred to as a first DC bus bar 62. The first DC terminal 52 may be electrically coupled to the first semiconductor chip 32 via the first DC bus bar 62, the first DC pattern 60, and the first contact bar 66. The second power pattern 58 may be referred to as a second DC pattern 58, which may be coupled to the second DC terminal 54 via an electrically conductive second bus bar 64, which may be referred to as a second DC bus bar 64. The second DC terminal 54 may be electrically coupled to the second semiconductor chip 42 via the second DC bus bar 64 and the second DC pattern 58.

[0063] In this embodiment, the first semiconductor chip 32 may be part of a high-side 104 of the power module 20, and the second semiconductor chip 42 may be part of a low-side 106 of the power module 20. Furthermore, the first electronic components 70 may belong to the high-side 104 of the power module 20, and the second electronic components 80 may belong to the low-side 106 of the power module 20.

[0064] Optionally, the power module 20 comprises a first housing 100 comprising the first driver board 24 and / or a second housing 102 comprising the second driver board 26. The first housing 100 and the second housing 102 may form a fluid-tight housing of the power module 20. The fluid-tight housing of the power module 20 may surround the housing 22 of the power module. Optionally, the first electronic components 70 may be arranged in the first housing 100, and / or the second electronic components 80 may be arranged in the second housing 102. For example, the first driver board 24 and optionally the first electronic components 70 may be embedded in the first housing 100, and / or the second driver board 26 and optionally the second electronic components 80 may be embedded in the second housing 102. The housings 100, 102 may comprise or be formed from a plastic and / or a dielectric.For example, the housings 100, 102 may be formed by molding.

[0065] Fig. 2 shows a first side of an embodiment of a semiconductor chip 32, 42 of the power module 20 of Fig. 1. In particular, Fig. 2 that side of the corresponding semiconductor chip 32, 42 which comprises the control contact 38, 48 and the first power contact 34, 44.

[0066] Fig. 3 shows a second side of the semiconductor chip 32, 42 of Fig. 2. In particular, Fig. 3 that side of the corresponding semiconductor chip 32, 42 which comprises the second power contact 36, 46.

[0067] Fig. 4 shows several semiconductor chips 32, 42 according to the Fig. 2 and Fig. 3 on an electrically conductive carrier 110, 112. In particular, two or more of the first semiconductor chips 32 can be arranged on an electrically conductive first carrier 110. The first semiconductor chips 32 can be mechanically and electrically coupled to one another via the first carrier 110. For example, the second power contacts 36 of the first semiconductor chips 32 can be electrically coupled to the first carrier 110 and to one another via the first carrier 110. The second power contacts 36 of the first semiconductor chips 32 can be electrically coupled directly to the first carrier 110, i.e., touch the first carrier 110, or via an electrically conductive fixing agent, such as solder or an electrically conductive adhesive. Thus, the first carrier 110 can function as a current collector that collects the currents from the first semiconductor chips 32.

[0068] Alternatively or additionally, two or more of the second semiconductor chips 42 can be arranged on an electrically conductive second carrier 112. The second semiconductor chips 42 can be electrically coupled to one another via the second carrier 112. For example, the second power contacts 46 of the second semiconductor chips 42 can be electrically coupled to the second carrier 112 and to one another via the second carrier 112. The second power contacts 46 of the second semiconductor chips 42 can be electrically coupled directly to the second carrier 112, i.e., touch the second carrier 112, or via an electrically conductive fixing agent, such as solder or an electrically conductive adhesive. Thus, the second carrier 112 can function as a current collector that collects the currents from the second semiconductor chips 42.

[0069] Each of the first semiconductor chips 32 can be configured, arranged, and / or electrically contacted like the first semiconductor chip 32 described above. Each of the second semiconductor chips 42 can be configured, arranged, and / or electrically contacted like the second semiconductor chip 42 described above. Thus, the first semiconductor chips 32 can be electrically arranged parallel to one another, and the second semiconductor chips 42 can be electrically arranged parallel to one another.

[0070] Fig. 5 shows a sectional side view of an embodiment of a power module 20. The power module 20 of Fig. 5 can be largely attributed to the power module 20, which, with reference to the Fig. 1 to 3. Therefore, only the Fig. 5, the features of the power module 20 are explained, in which the power module 20 differs from Fig. 5 of the power module 20 of the Fig. 1 to 3.

[0071] The power module of Fig. 5 comprises the carriers 110, 112, which in the reference to Fig. 4. In particular, the power module 20 according to Fig. 5, the first and second carriers 110, 112 and the corresponding first and second semiconductor chips 32, 42 can be arranged such that the first carrier 110 is arranged on the second power contacts 36 of the first semiconductor chips 32 and is electrically coupled thereto, and / or that the second power contacts 46 of the second semiconductor chips 32 are arranged on the second carrier 112 and are electrically coupled thereto. In this case, the first semiconductor chips 32 are arranged such that the first carrier 110 is arranged on the top side of the first semiconductor chips 32, and the second semiconductor chips 42 are arranged such that the second carrier 112 is arranged on the bottom side of the second semiconductor chips 42. Thus, the first semiconductor chips 32 and the first carrier 110 can be arranged upside down with respect to the second semiconductor chips 42 and the second carrier 112.

[0072] In this embodiment, the first semiconductor chips 32 and the first electronic components 70 for driving the first semiconductor chips 32 may be part of or form the high side 104 of the power module 20, and the second semiconductor chips 42 and the second electronic components 80 may be part of or form the low side 106 of the power module 20.

[0073] Furthermore, in this embodiment, more than one first contact rail 66, e.g., three first contact rails 66, are arranged to electrically couple the first semiconductor chips 32 to the second driver board 26. And / or more than one second contact rail 68, e.g., three second contact rails 68, are arranged to electrically couple the second semiconductor chips 42 to the first driver board 24.

[0074] Although the invention has been illustrated and described in detail in the drawings and in the foregoing description, such illustration and description are to be considered as illustrative or exemplary and not restrictive. In particular, the invention is not limited to the above embodiments. For example, the power module 20 may include more or fewer first and / or second semiconductor chips 32, 42. Furthermore, the semiconductor chips 32, 42 may each include more or fewer electrical contacts. Instead of coupling the first semiconductor chip(s) 32 directly to the first driver board 24 and via the first contact rail(s) 66 to the second driver board 26, the first semiconductor chip(s) 32 may be further coupled via the first contact rail(s) 66 to the first driver board 24 and directly to the second driver board 26.Instead of coupling the second semiconductor chip(s) 42 directly to the second driver board 26 and via the second contact rail(s) 68 to the first driver board 24, alternatively or additionally, the second semiconductor chip(s) 42 may be coupled to the second driver board 26 via the second contact rail(s) 68 and directly to the first driver board 24. Furthermore, the method described with reference to FIG. Fig. 1 may comprise two or more first contact rails 66 and / or two or more second contact rails 68, e.g., as described with reference to Fig. 5 described power module 20. Furthermore, the power module described with reference to Fig. 5 may have only a first contact rail 66 and / or only a second contact rail 68, e.g., as described with reference to Fig.1 described power module 20. Those skilled in the art can recognize and make further variations of the disclosed embodiments in practicing the claimed invention upon careful consideration of the drawings, the disclosure, and the appended claims. In the claims, the term "comprising" does not exclude other elements or steps, and the indefinite article "a" does not exclude a plural. A single processor or controller or other unit may perform the functions of multiple elements recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not mean that a combination of those measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope of protection. List of reference symbols 20 power module 22 housings 24 first driver board 26 second driver board 28 frames 30 Interior 32 first semiconductor chip 34 first power contact of the first semiconductor chip 36 second power contact of the first semiconductor chip 38 first control contact 42 second semiconductor chip 44 first power contact of the second semiconductor chip 46 second power contact of the second semiconductor chip 48 second control contact 50 first power connection 52 first DC connection 54 second DC connection 56 first performance sample 58 second performance pattern 60 third performance pattern 62 first busbar 64 second busbar 66 first contact rail 68 second contact rail 70 first electronic component 72 first electrical line 74 first control pattern 76 second tax pattern 70 second electronic component 72 second electrical line 92 Inlet 94 Outlet 96 Seal 98 bolts 100 first housing 102 second housing 104 High Side 106 Low Side 110 first carrier 112 second carrier

Claims

[1] Power module (20), comprising: a first semiconductor chip (32); a second semiconductor chip (42) electrically coupled to the first semiconductor chip (32); and a fluid-tight housing (22) enclosing an interior space (30) of the housing (22) and having an inlet (92) for introducing an insulated coolant into the interior space (30) and an outlet (94) for discharging the coolant from the interior space (30), wherein a first side of the housing (22) is at least partially formed by a first driver board (24) for driving the first semiconductor chip (32) and for electrically coupling the power module (22) to a first external device, wherein the first driver board (24) is electrically coupled to the first semiconductor chip (32), a second side of the housing (22) opposite the first side of the housing (22) is at least partially formed by a second driver board (26) for driving the second semiconductor chip (42) and for electrically coupling the power module (20) to a second external device, wherein the second driver board (26) is electrically coupled to the second semiconductor chip (42), the first driver board (24) is mechanically coupled to the second driver board (26) by a frame (28) of the housing (22), and the first and second semiconductor chips (32, 42) are arranged in the interior (30) of the housing (22) such that the first and second semiconductor chips (32, 42) can be cooled by the coolant. [2] The power module (20) of claim 1, wherein the first driver board (24) comprises: one or more first electronic components (70) for driving the first semiconductor chip (32), wherein the first electronic components (70) are arranged on an outer side of the housing (22); a first control pattern (74) facing the interior (30), electrically coupled to the first semiconductor chip (32) and electrically coupled to at least one of the first electronic components (70) via a first electrical line (72) of the first driver board (24), and a first power pattern (56) facing the interior (30) and electrically coupled to the first and second semiconductor chips (32, 42). [3] The power module (20) of claim 2, wherein the first driver board (24) comprises: a first power terminal (50) for electrically coupling the power module (20) to the second external device, wherein the first power terminal (50) is electrically coupled to the first power pattern (56) and wherein the first power terminal (50) is arranged to be accessible from outside the power module (20). [4] Power module (20) according to claim 3, wherein the first power connection (50) is an AC connection of the power module (20). [5] Power module (20) according to one of the preceding claims, wherein the second driver board (26) comprises: one or more second electronic components (80) for driving the second semiconductor chip (42), wherein the second electronic components (80) are arranged on an outer side of the housing (22); a second control pattern (76) facing the interior space (30), electrically coupled to the second semiconductor chip (42) and electrically coupled to at least one of the second electronic components (80) via a second electrical line (82) of the second driver board (26); a second power pattern (58) facing the interior (30) and electrically coupled to the second semiconductor chip (42), and a third power pattern (60) facing the interior (30) and electrically coupled to the first semiconductor chip (32). [6] The power module (20) of claim 5, wherein the second driver board (26) comprises: a second power terminal (52, 54) for electrically coupling the power module (20) to the second external device, wherein the second power terminal (52, 54) is electrically coupled to the second and third power patterns (58, 60) and wherein the second power terminal (52, 54) is arranged to be accessible from outside the power module (20). [7] Power module (20) according to claim 6, wherein the second power terminal (52, 54) comprises a first DC terminal (52) and a second DC terminal (54), each arranged to be accessible from outside the power module (20), the first DC terminal (52) is electrically coupled to the first semiconductor chip (32) via the third power pattern (60), and the second DC terminal (54) is electrically coupled to the second semiconductor chip (32) via the second power pattern (58). [8] Power module (20) according to claims 4 and 7, wherein the first semiconductor chip (32) comprises a first control contact (38), a first power contact (34) of the first semiconductor chip (32) and a second power contact (36) of the first semiconductor chip (32), the first control contact (38) is electrically coupled to the first electronic components (70) via the first control pattern (74), the first power contact (34) of the first semiconductor chip (32) is electrically coupled to the first power terminal (50) via the first power pattern (58), and the second power contact (36) of the first semiconductor chip (32) is electrically coupled to the first DC terminal (52) via the third power pattern (60). [9] Power module (20) according to claim 4 and 7 or 8, wherein the second semiconductor chip (42) comprises a second control contact (48), a first power contact (44) of the second semiconductor chip (42) and a second power contact (46) of the second semiconductor chip (42), the second control contact (48) is electrically coupled to the second electronic components (80) via the second control pattern (76), the second power contact (46) of the second semiconductor chip (42) is electrically coupled to the first power terminal (50) via the first power pattern (56), and the first power contact (44) of the second semiconductor chip (42) is electrically coupled to the second DC terminal (54) via the second power pattern (58). [10] Power module (20) according to one of the preceding claims, wherein the electrical coupling between the first semiconductor chip (32) and the second driver board (26) and / or the electrical coupling between the second semiconductor chip (42) and the first driver board (24) is provided by corresponding electrically conductive contact rails (66, 68), and the contact rails (66, 68) are arranged so that the contact rails (66, 68) can be cooled by the coolant. [11] Power module (20) according to one of the preceding claims, wherein the first semiconductor chip (32) is arranged on the first driver board (24) and / or the second semiconductor chip (42) is arranged on the second driver board (26). [12] Power module (20) according to one of the preceding claims, comprising: two or more of the first semiconductor chips (32) arranged on an electrically conductive first carrier (110) such that the first semiconductor chips (32) are electrically coupled to one another via the first carrier (110); and / or two or more of the second semiconductor chips (42) arranged on an electrically conductive second carrier (112) such that the second semiconductor chips (42) are electrically coupled to one another via the second carrier (112). [13] Power module (20) according to claim 12, wherein the first carrier (110) is arranged on the second power contacts (36) of the first semiconductor chips (32) and is electrically coupled thereto, and / or the second power contacts (46) of the second semiconductor chips (42) are arranged on the second carrier (112) and electrically coupled thereto. [14] Power module (20) according to one of the preceding claims, comprising: a first housing (100) comprising the first driver board (24), and a second housing (102) comprising the second driver board (26).

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