Packaging device for semiconductor chip production

Abstract

The invention discloses a packaging device for semiconductor chip production, which comprises a test board, an airflow guide mechanism and a pushing mechanism, and is characterized in that the top of the test board is provided with a mounting groove, the top of the mounting groove is fixedly provided with a packaging mold seat through bolts, and one side of the top of the test board is provided with a moving mechanism; by means of uniform arrangement of the silica gel air suction soft conical heads, air pressure adsorption force is promoted to be dispersed through the silica gel air suction soft conical heads, concentrated adsorption force on fragile chip materials is reduced, concentration of local stress is avoided, the chip materials are indirectly protected, certain deformation is generated in cooperation with the flexible cones of the silica gel air suction soft conical heads, the adsorption stability is guaranteed, and the service life of the chip materials is prolonged. And the flexible fillets do not damage the chip materials, so that the protection effect on packaging operation is improved, the packaging structure can adapt to various chip materials, and the relative stability and safety of the structure are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production and packaging equipment, and specifically relates to a packaging device for semiconductor chip production. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end process of the wafer are cut into small chips (Dies) through the dicing process, and then the cut chips are attached to the islands of the corresponding substrates (lead frames) with glue. Then, the bonding pads of the chips are connected to the corresponding pins (Leads) of the substrate using ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins to form the required circuit; then, the independent chips are encapsulated and protected with a plastic shell. After plastic encapsulation, a series of operations are still required. After packaging is completed, finished product testing is carried out, usually through processes such as incoming inspection, testing, and packing. Finally, it is stored in the warehouse and shipped.

[0003] Semiconductor chip production and packaging is a process of encapsulating the manufactured semiconductor chips in a protective shell to provide functions such as physical protection, electrical connection, and thermal management. In this process, the substrate needs to be moved and packaged operations need to be carried out to cope with sampling inspection during the process flow, and the chips and packaging materials need to be moved and spliced. Since the chip material is relatively fragile, certain accidental damages will occur during the equipment transfer and taking process, reducing the yield rate to a certain extent. In addition, due to the mismatch between the thermal expansion coefficients of the chip and the substrate, uneven temperature distribution will occur during the mounting and heating process because the material contacts the high-temperature point while the rest is at a lower temperature, resulting in the accumulation of more thermal stress, which may cause the chip or substrate to deform or crack, affecting the packaging reliability. Based on this, a packaging device for semiconductor chip production is proposed. Summary of the Invention

[0004] The purpose of the present invention is to provide a packaging device for semiconductor chip production to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A packaging device for semiconductor chip production, including a test bench, an air flow guiding mechanism, and a pushing mechanism. An installation groove is opened at the top of the test bench, and a packaging mold base is fixedly installed at the top of the installation groove through bolts. A moving mechanism is arranged on one side of the top of the test bench.

[0006] The moving mechanism includes two support seats, the two support seats are fixedly installed on the top of the test bench, the opposite sides of the two support seats are movably penetrated and installed with a ball screw through bearings, one end of the ball screw is drivingly connected to a first servo motor, the opposite sides of the two support seats are fixedly installed with two slide rails, the outside of the ball screw is threadedly drivingly connected to a moving seat, the top of the moving seat is fixedly installed with a robotic arm mechanism, and the movable end of the robotic arm mechanism is fixedly installed with a lifting mechanism.

[0007] The lifting mechanism includes an outer sleeve, an inner sleeve column is movably sleeved inside the outer sleeve, a second electric control telescopic rod is fixedly installed at the top of the inner cavity of the outer sleeve, an installation cavity is opened inside the inner sleeve column, a moving piston mechanism is installed at the top of the inner cavity of the installation cavity, the moving piston mechanism includes a fifth electric control telescopic rod, the output end of the fifth electric control telescopic rod is fixedly installed with a sealing piston, a rotating support mechanism is arranged on the outside of the inner sleeve column, a suction mechanism penetrates through the inside of the rotating support mechanism, and a driving rotation mechanism is installed at the top of the rotating support mechanism.

[0008] The suction mechanism includes a communicating branch pipe, an installation ring is fixedly installed at the top of the communicating branch pipe, a rotary seal is movably installed inside the installation ring, a sealing cone ring is movably installed at the top of the installation ring, the bottom of the communicating branch pipe is communicated with an air suction shell, a rubber elastic diaphragm is fixedly installed on the inner wall of the air suction shell, and a number of silica gel air suction soft cone heads are communicated at the bottom of the air suction shell.

[0009] The air flow guiding mechanism includes a bidirectional equivalent air outlet fan, an installation frame and a communicating hose, one end of the bidirectional equivalent air outlet fan is communicated inside the communicating hose, the bidirectional equivalent air outlet fan is fixedly installed on the top of the installation frame, the installation frame is fixedly installed on the top of the test bench, and the end of the communicating hose far away from the bidirectional equivalent air outlet fan is communicated with an air flow processing mechanism.

[0010] Preferably, the first servo motor is fixedly installed on the top of the test bench, the bottoms of the two slide rails are fixedly installed on the top of the test bench, and the moving seat is slidably sleeved outside the slide rails.

[0011] Preferably, the robotic arm mechanism includes a support column, a bearing support seat is movably sleeved outside the bottom end of the support column, the bearing support seat is fixedly installed on the top of the moving seat, a driven transmission gear is fixedly sleeved on the outside of the support column, a driving transmission gear is meshed on the outside of the driven transmission gear, the bottom of the driving transmission gear is drivingly connected to a second servo motor, the second servo motor is fixedly installed on the top of the moving seat, the top end of the support column is rotationally hinged with a cross bar, the outside of the cross bar is rotationally hinged with a first electric control telescopic column, and the end of the first electric control telescopic column far away from the cross bar is rotationally hinged on the outside of the support column.

[0012] Preferably, the outer sleeve is fixedly installed on the outside of the cross bar, the output end of the second electric control telescopic rod is fixedly installed on the top of the inner sleeve column, a pressure equalizing air hole is opened on one side of the top of the outer sleeve, and a plurality of diversion air channels are opened on the top of the inner sleeve column.

[0013] Preferably, the fifth electric control telescopic rod is fixedly installed on the top of the inner cavity of the installation cavity, the sealing piston is movably sleeved on the inner side of the installation cavity, the pressure equalizing air hole communicates with the inside of the outer sleeve, the top end of the diversion air channel communicates with the inside of the outer sleeve, and the bottom end of the diversion air channel communicates with the inside of the installation cavity.

[0014] Preferably, the rotation support mechanism includes a rotating shell, the rotating shell, a support bearing is sleeved inside the rotating shell, a support ring plate is sleeved inside the support bearing, the inner side of the support ring plate is fixedly sleeved on the outside of the inner sleeve column, a support block is movably installed on the top of the support ring plate, a plurality of ball grooves are opened on the inner side of the support block, rolling balls are installed in the ball grooves in a rolling manner, the ball grooves and the rolling balls are evenly distributed in a circumferential manner on the inner side of the support block, and the bottoms of the support block, the ball grooves and the rolling balls are in sliding contact with the top of the support ring plate.

[0015] Preferably, the connecting branch pipe is fixedly sleeved inside the rotating shell, the top end of the connecting branch pipe is rotatably inserted into the inner side of the installation cavity, the installation ring is movably sleeved on the inner side of the installation cavity, the sealing cone ring is fixedly installed on the inner side of the installation cavity, the bottom of the rotary seal is in rotational sealing contact with the top of the connecting branch pipe, the silica gel suction soft cone heads are evenly distributed in a circumferential manner at the bottom of the suction shell, the silica gel suction soft cone heads are conical, and a rounded corner is provided at the outer edge of the bottom.

[0016] Preferably, the active rotation mechanism includes a driven toothed ring plate, a driving gear plate and a third servo motor, the driven toothed ring plate is fixedly installed on the top of the rotating shell, the outer side of the driving gear plate is in meshing transmission connection with the inner side of the driven toothed ring plate, the output end of the third servo motor is in transmission connection with the top of the driving gear plate, a fixed ring frame is fixedly sleeved on the outside of the third servo motor, and the inner side of the end of the fixed ring frame away from the third servo motor is fixedly sleeved on the outside of the inner sleeve column.

[0017] Preferably, the pushing mechanism includes a fixed plate. On one side of the fixed plate, an electric control telescopic rod three is fixedly installed. The output end of the electric control telescopic rod three is fixedly installed with a push-pull frame. At the top of the end of the push-pull frame away from the electric control telescopic rod three, a support ring frame is fixedly installed. The push-pull frame is slidably installed on the top of the test bench. Inside the top of the support ring frame, a support circular plate is fixedly installed. The air flow processing mechanism is fixedly installed on the top of the support circular plate. Inside the push-pull frame, a preheating mechanism is movably arranged. The preheating mechanism includes an annular shell. Inside the annular shell, a number of air outlet holes are opened. The air outlet holes are evenly distributed in a circular pattern inside the annular shell. At the bottom of the annular shell, a support ring seat is fixedly installed. The bottom of the support ring seat is in sliding contact with the top of the test bench. Inside the annular shell, an electric heating wire is fixedly installed.

[0018] Preferably, the air flow processing mechanism includes a semi-circular seat. Inside the semi-circular seat, a number of groups of concave limiting frames are fixedly installed. Inside the concave limiting frames, a pull-out sealing frame is slidably installed. Inside the pull-out sealing frame, a soot filter screen is fixedly installed. The pull-out sealing frame movably penetrates through the semi-circular seat and extends to the top of the semi-circular seat. One end of the mounting frame away from the bidirectional equivalent air outlet fan communicates with the inside of the semi-circular seat. The concave limiting frames are evenly distributed inside the semi-circular seat with the mounting frame as the symmetry axis. At the bottom of the support circular plate, two electric control telescopic rods four are fixedly installed. The tops of the two electric control telescopic rods four are fixedly installed on the top of the annular shell. The semi-circular seat is in a C shape. At both C-shaped ends of the semi-circular seat, an air outlet hose is connected. The end of the air outlet hose away from the semi-circular seat communicates with the top of the annular shell.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. When the device is in use, the material to be encapsulated is placed beside the test bench. After the device is started, first, the servo motor one rotates to drive the ball screw to rotate, and applies a spiral driving force to the moving seat. The moving seat moves under the sliding limit of the slide rail. Then, the moving seat drives the robotic arm mechanism to move, and adjusts the range of the lifting mechanism to the inside of the material placement container outside the test bench. At this time, the electric control telescopic rod two extends and drives the inner sleeve column to move downward, causing the rotating support mechanism and the suction mechanism to move downward, and bringing the silicone suction soft cone head at the bottom of the suction mechanism into contact with the chip material. At this time, the electric control telescopic rod five retracts, driving the sealing piston to move upward, and forming a negative pressure inside the installation cavity and the communicating branch pipe, and causing the rubber elastic diaphragm to deform and bulge upward. Then, the air pressure is transmitted to the bottom of the rubber elastic diaphragm of the suction shell, causing the soft cone head of the silicone suction soft cone head to be in contact with the chip material and forming an adsorption force on the chip. Then, the electric control telescopic rod two moves upward, and the moving mechanism and the robotic arm mechanism reset, and the chip material is placed inside the encapsulation mold seat, which is convenient for the operator to pick up, place, encapsulate and detect. The overall structure is stable in use and convenient for picking up and placing materials from multiple angles;

[0020] 2. By evenly arranging the silica gel suction soft cone heads, the air pressure adsorption force is dispersed through multiple silica gel suction soft cone heads, reducing the concentrated adsorption force on the fragile chip materials, avoiding the concentration of local stress, indirectly protecting the chip materials, and cooperating with the flexible cone shape of the silica gel suction soft cone heads to produce a certain deformation, ensuring the stability of adsorption. Moreover, the flexible rounded corners will not damage the chip materials, thereby increasing the protection effect on the packaging operation, being able to adapt to various chip materials, and increasing the relative stability and safety of the structure;

[0021] 3. When the two-way equivalent air outlet fan starts, the air flow enters the interior of the semi-circular seat through the connecting hose and enters the interior of the annular shell under the guidance of the air outlet hose. The air flow is heated by the electric heating wire and then is discharged through the air outlet holes. Through the connecting hose to the air outlet hose and then to the air outlet holes, the air flow is divided into two, and the two are divided into circumferential diversion, thus realizing the uniform discharge of the air flow. When the two-way equivalent air outlet fan blows air in the reverse direction, the air flow enters through the air outlet holes. At this time, the chip packaging is welded with pins, generating a certain amount of smoke. The air flow takes the smoke out, enters the air outlet hose through the diversion of the air outlet holes and the annular shell, and then enters the interior of the semi-circular seat through the diversion of the air outlet hose. Finally, it is filtered by the soot filter screen, thus realizing the filtration of the soot, avoiding the situation that the smoke affects the operators and the vision system, ensuring the stability of the welding, being convenient to use as a whole, improving the yield rate, and enhancing the product testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a front view three-dimensional external structure schematic diagram of the present invention.

[0023] Figure 2 It is a rear view three-dimensional external structure schematic diagram of the present invention.

[0024] Figure 3 It is a front view partial cross-sectional three-dimensional external structure schematic diagram of the present invention.

[0025] Figure 4 It is a right view partial cross-sectional structure schematic diagram of the present invention.

[0026] Figure 5 It is of the present invention Figure 1 The enlarged structure schematic diagram at A in the figure.

[0027] Figure 6 It is of the present invention Figure 3 The enlarged structure schematic diagram at B in the figure.

[0028] Figure 7 It is of the present invention Figure 3 The enlarged structure schematic diagram at C in the figure.

[0029] Figure 8 It is of the present invention Figure 4 The enlarged structure schematic diagram at D in the figure.

[0030] Figure 9 For the present invention Figure 4 is a schematic enlarged view of the structure at position E in the present invention.

[0031] Figure 10 For the present invention Figure 4 is a schematic enlarged view of the structure at position F in the present invention.

[0032] In the figure: 1. Test bench; 101. Installation groove; 102. Encapsulation mold base; 2. Moving mechanism; 201. Ball screw; 202. Slide rail; 203. Support base; 204. Servo motor 1; 205. Moving seat; 3. Robotic arm mechanism; 301. Servo motor 2; 302. Driving gear; 303. Driven gear; 304. Support column; 305. Cross bar; 306. Electrically controlled telescopic column 1; 307. Bearing support seat; 4. Lifting mechanism; 401. Outer sleeve; 402. Inner sleeve column; 403. Installation cavity; 404. Air flow diversion channel; 405. Equalizing air holes; 406. Electrically controlled telescopic rod 2; 5. Air flow diversion mechanism; 501. Bidirectional equivalent air outlet fan; 502. Mounting bracket; 503. Connecting hose; 6. Pushing mechanism; 601. Fixed plate; 602. Electrically controlled telescopic rod 3; 603. Pushing and pulling frame; 604. Support ring frame; 605. Support circular plate; 7. Preheating mechanism; 701. Annular shell; 702. Air outlet holes; 703. Support ring seat; 704. Electric heating wire; 8. Air flow treatment mechanism; 801. Semi-circular seat; 802. Exhaust hose; 803. Electrically controlled telescopic rod 4; 804. Pull-out sealing frame; 805. Smoke and dust filter; 806. Concave limiting frame; 9. Rotating support mechanism; 901. Rotating shell; 902. Support block; 903. Ball groove; 904. Rolling ball; 905. Support bearing; 906. Support ring plate; 10. Suction mechanism; 1001. Suction shell; 1002. Silicone suction soft cone head; 1003. Rubber elastic diaphragm; 1004. Connecting branch pipe; 1005. Rotary seal; 1006. Mounting ring; 1007. Sealing cone ring; 11. Active rotation mechanism; 1101. Driven gear ring plate; 1102. Driving gear plate; 1103. Servo motor 3; 1104. Fixed ring frame; 12. Moving piston mechanism; 1201. Electrically controlled telescopic rod 5; 1202. Sealing piston. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] Please refer toFigures 1 - 10 , the present invention provides a technical solution: a packaging device for semiconductor chip production, including a test bench 1, an air flow guiding mechanism 5 and a pushing mechanism 6. An installation groove 101 is opened at the top of the test bench 1, and a packaging mold base 102 is fixedly installed at the top of the installation groove 101 through bolts. A moving mechanism 2 is arranged on one side of the top of the test bench 1.

[0035] The moving mechanism 2 includes two support seats 203, the two support seats 203 are fixedly installed on the top of the test bench 1, a ball screw 201 is movably penetrated through the relative sides of the two support seats 203 through bearings, one end of the ball screw 201 is drivingly connected to a servo motor one 204, two slide rails 202 are fixedly installed on the relative sides of the two support seats 203, a moving seat 205 is threadedly driven on the outer side of the ball screw 201, a robotic arm mechanism 3 is fixedly installed on the top of the moving seat 205, and a lifting mechanism 4 is fixedly installed at the movable end of the robotic arm mechanism 3.

[0036] The lifting mechanism 4 includes an outer sleeve 401, an inner sleeve column 402 is movably sleeved inside the outer sleeve 401, an electric control telescopic rod two 406 is fixedly installed at the top of the inner cavity of the outer sleeve 401, an installation cavity 403 is opened inside the inner sleeve column 402, a moving piston mechanism 12 is installed at the top of the inner cavity of the installation cavity 403, the moving piston mechanism 12 includes an electric control telescopic rod five 1201, a sealing piston 1202 is fixedly installed at the output end of the electric control telescopic rod five 1201, a rotating support mechanism 9 is arranged on the outer side of the inner sleeve column 402, a suction mechanism 10 penetrates through the inside of the rotating support mechanism 9, and a driving rotation mechanism 11 is installed at the top of the rotating support mechanism 9.

[0037] The suction mechanism 10 includes a communicating branch pipe 1004, an installation ring 1006 is fixedly installed at the top of the communicating branch pipe 1004, a rotating seal 1005 is movably installed inside the installation ring 1006, a sealing cone ring 1007 is movably installed at the top of the installation ring 1006, the bottom of the communicating branch pipe 1004 is communicated with a suction shell 1001, a rubber elastic diaphragm 1003 is fixedly installed on the inner wall of the suction shell 1001, and a number of silica gel suction soft cone heads 1002 are communicated at the bottom of the suction shell 1001.

[0038] The air flow guiding mechanism 5 includes a two-way equivalent air outlet fan 501, an installation frame 502 and a communicating hose 503. One end of the two-way equivalent air outlet fan 501 is communicated inside the communicating hose 503, the two-way equivalent air outlet fan 501 is fixedly installed on the top of the installation frame 502, the installation frame 502 is fixedly installed on the top of the test bench 1, and the end of the communicating hose 503 far from the two-way equivalent air outlet fan 501 is communicated with an air flow processing mechanism 8.

[0039] Working principle of the above technical solution: During use, place the material to be encapsulated beside the test bench 1. After the device is started, first, the servo motor 1 204 rotates to drive the ball screw 201 to rotate, and applies a spiral driving force to the moving seat 205. The moving seat 205 moves under the sliding limit of the slide rail 202. Then, the moving seat 205 drives the robotic arm mechanism 3 to move, adjusting the range of the lifting mechanism 4 to the inside of the material placement container outside the test bench 1. At this time, the electric control telescopic rod 2 406 extends and drives the inner sleeve column 402 to move downward, causing the rotating support mechanism 9 and the suction mechanism 10 to move downward, and making the silicone suction soft cone head 1002 at the bottom of the suction mechanism 10 contact the chip material. At this time, the electric control telescopic rod 5 1201 retracts, driving the sealing piston 1202 to move upward, and forming a negative pressure inside the installation cavity 403 and the connecting branch pipe 1004, and causing the rubber elastic diaphragm 1003 to deform and bulge upward. Then, the air pressure is transmitted at the bottom of the rubber elastic diaphragm 1003 of the suction housing 1001, causing the soft cone head of the silicone suction soft cone head 1002 to contact the chip material and form an adsorption force on the chip. Then, the electric control telescopic rod 2 406 moves upward, and the moving mechanism 2 and the robotic arm mechanism 3 reset, placing the chip material inside the encapsulation mold base 102, facilitating the operator to pick up, place, and perform encapsulation detection. The overall structure is stable in use and convenient for picking up and placing materials from multiple angles.

[0040] In another embodiment, as Figures 1 - 4 shown, the servo motor 1 204 is fixedly installed on the top of the test bench 1, and the bottoms of the two slide rails 202 are fixedly installed on the top of the test bench 1. The moving seat 205 is slidably sleeved outside the slide rail 202.

[0041] After the servo motor 1 204 is fixed, it is convenient to drive the ball screw 201 to rotate, thus ensuring the stable cooperation and movement of the mechanism, facilitating the stable movement of the moving seat 205, and ensuring the operation of the mechanism.

[0042] In another embodiment, as Figures 1 - 4 shown, the robotic arm mechanism 3 includes a support column 304. The outer side of the bottom end of the support column 304 is movably sleeved with a bearing support seat 307. The bearing support seat 307 is fixedly installed on the top of the moving seat 205. The outer side of the support column 304 is fixedly sleeved with a driven transmission gear 303. The outer side of the driven transmission gear 303 is engaged with a driving transmission gear 302. The bottom of the driving transmission gear 302 is drivingly connected to a servo motor 2 301. The servo motor 2 301 is fixedly installed on the top of the moving seat 205. The top end of the support column 304 is rotatably hinged to a cross bar 305. The outer side of the cross bar 305 is rotatably hinged to an electric control telescopic column 1 306. The end of the electric control telescopic column 1 306 away from the cross bar 305 is rotatably hinged to the outer side of the support column 304.

[0043] When the robotic arm mechanism 3 moves along with the moving mechanism 2, the servo motor two 301 starts to rotate, driving the driving transmission gear 302 to rotate. The driving transmission gear 302 drives the driven transmission gear 303 to rotate, and drives the support column 304 to rotate. The support column 304 rotates under the support of the bearing support 307, and drives the lifting mechanism 4 out of the moving range of the test bench 1, facilitating driving the rotation angle of the lifting mechanism 4, so as to cooperate with the moving mechanism 2 to drive the lifting mechanism 4 to move, facilitating cooperation in the operation.

[0044] In another embodiment, as Figures 1 - 10 shown, the outer sleeve 401 is fixedly installed on the outside of the cross bar 305. The output end of the electric control telescopic rod two 406 is fixedly installed at the top of the inner sleeve column 402. One side of the top of the outer sleeve 401 is provided with a pressure equalizing air hole 405, and the top of the inner sleeve column 402 is provided with a number of air guiding channels 404.

[0045] The outer sleeve 401 cooperates with the movement of the cross bar 305. The telescopic movement of the electric control telescopic rod two 406 facilitates driving the up and down movement of the inner sleeve column 402. When the electric control telescopic rod two 406 and the electric control telescopic rod five 1201 move telescopically, the pressure equalizing air hole 405 and the air guiding channels 404 conduct the air pressure inside the inner sleeve column 402 and the outer sleeve 401, thereby reducing the effect of air pressure, increasing the relative stability of the structure, avoiding affecting the operation effect due to sealing, and ensuring the relative stability of the structure.

[0046] In another embodiment, as Figures 5 - 10 shown, the electric control telescopic rod five 1201 is fixedly installed at the top of the inner cavity of the installation cavity 403. The sealing piston 1202 is movably sleeved on the inside of the installation cavity 403. The pressure equalizing air hole 405 communicates with the inside of the outer sleeve 401. The top of the air guiding channel 404 communicates with the inside of the outer sleeve 401, and the bottom end of the air guiding channel 404 communicates with the inside of the installation cavity 403.

[0047] After the electric control telescopic rod five 1201 extends, it drives the sealing piston 1202 to move, thereby forming air pressure diversion inside the installation cavity 403, facilitating changing the air pressure and convenient for adsorption. When the sealing piston 1202 moves, the internal and external air pressures are conducted through the pressure equalizing air hole 405 and the air guiding channels 404, thereby stabilizing the structure operation and avoiding the situation of unsmooth air pressure diversion.

[0048] In another embodiment, as Figures 1 - 8As shown, the rotating support mechanism 9 includes a rotating shell 901. Inside the rotating shell 901, a support bearing 905 is sleeved. Inside the support bearing 905, a support ring plate 906 is sleeved. The inner side of the support ring plate 906 is fixedly sleeved on the outer side of the inner sleeve column 402. On the top of the support ring plate 906, a support block 902 is movably installed. Inside the support block 902, a number of ball grooves 903 are formed. Inside each ball groove 903, a rolling ball 904 is rollingly installed. The ball grooves 903 and the rolling balls 904 are evenly distributed in a circular pattern inside the support block 902. The bottoms of the support block 902, the ball grooves 903, and the rolling balls 904 are all in sliding contact with the top of the support ring plate 906.

[0049] When the inner sleeve column 402 moves telescopically, it will drive the support ring plate 906 to move, and then drive part of the rotating support mechanism 9 to move. The rolling balls 904 roll inside the ball grooves 903, so as to cooperate with the support block 902 to form a rotating support for the top of the support ring plate 906, facilitating the maintenance of a relatively stable rotating support effect, facilitating the cooperation with the active rotating mechanism 11 to move, and facilitating the maintenance of the relative stability of the structure.

[0050] In another embodiment, as Figures 4 - 10 shown, the connecting branch pipe 1004 is fixedly sleeved inside the rotating shell 901. The top end of the connecting branch pipe 1004 is rotatably inserted inside the installation cavity 403. The installation ring 1006 is movably sleeved inside the installation cavity 403. The sealing cone ring 1007 is fixedly installed inside the installation cavity 403. The bottom of the rotary seal 1005 is in rotary sealing contact with the top of the connecting branch pipe 1004. The silica gel suction soft cone heads 1002 are evenly distributed in a circular pattern at the bottom of the suction shell 1001. The silica gel suction soft cone heads 1002 are conical, and the outer edge of the bottom is provided with a rounded corner.

[0051] The rotary seal 1005, the installation ring 1006 and the sealing cone ring 1007 are used to achieve the effect of rotary sealing between the connecting branch pipe 1004 and the inner wall of the installation cavity 403, facilitating the maintenance of a relatively stable function, maintaining flexible extrusion rotary sealing, thus stabilizing the airtightness and maintaining the air pressure operation effect. Through the uniform arrangement of the silica gel suction soft cone heads 1002, the air pressure adsorption force is dispersed through a plurality of silica gel suction soft cone heads 1002, reducing the concentrated adsorption force on the fragile chip materials, avoiding the concentration of local stress, indirectly protecting the chip materials, and cooperating with the flexible cone shape of the silica gel suction soft cone heads 1002 to generate a certain deformation, ensuring the stability of adsorption, and the flexible rounded corners will not damage the chip materials, thereby increasing the protection effect on the encapsulation operation, being able to adapt to a variety of chip materials, and increasing the relative stability and safety of the structure.

[0052] In another embodiment, as Figures 1 - 8As shown, the active rotation mechanism 11 includes a driven gear ring plate 1101, a driving gear disk 1102, and a servo motor three 1103. The driven gear ring plate 1101 is fixedly installed on the top of the rotating housing 901. The outer side of the driving gear disk 1102 is meshed and drivingly connected to the inner side of the driven gear ring plate 1101. The output end of the servo motor three 1103 is drivingly connected to the top of the driving gear disk 1102. A fixed ring frame 1104 is fixedly sleeved on the outer side of the servo motor three 1103. The inner side of the end of the fixed ring frame 1104 away from the servo motor three 1103 is fixedly sleeved on the outer side of the inner sleeve column 402.

[0053] When the servo motor three 1103 rotates, it drives the driving gear disk 1102 to rotate, thereby driving the driven gear ring plate 1101 to move, and further applying a rotating action to the rotating housing 901. Under the supporting action of the supporting ring plate 906 and the rolling beads 904, the rotating housing 901 maintains a stable position and rotates, causing the communicating branch pipe 1004 fixedly sleeved inside the rotating housing 901 to rotate synchronously, and further driving the chip material adsorbed at the bottom of the silica gel suction soft cone head 1002 to rotate, so as to facilitate adjusting the direction of the chip material, and facilitating adjusting the position of the chip material after rotation, so as to be placed inside the encapsulation mold base 102, facilitating a stable operation effect.

[0054] In another embodiment, as Figures 1 - 7 shown, the pushing mechanism 6 includes a fixing plate 601. One side of the fixing plate 601 is fixedly installed with an electric control telescopic rod three 602. The output end of the electric control telescopic rod three 602 is fixedly installed with a push-pull frame 603. The top of the end of the push-pull frame 603 away from the electric control telescopic rod three 602 is fixedly installed with a supporting ring frame 604. The push-pull frame 603 is slidably installed on the top of the test bench 1. The inner side of the top of the supporting ring frame 604 is fixedly installed with a supporting circular plate 605. The air flow processing mechanism 8 is fixedly installed on the top of the supporting circular plate 605. A preheating mechanism 7 is movably arranged inside the push-pull frame 603. The preheating mechanism 7 includes an annular shell 701. A plurality of air outlet holes 702 are opened inside the annular shell 701. The air outlet holes 702 are evenly distributed in a circumferential manner inside the annular shell 701. The bottom of the annular shell 701 is fixedly installed with a supporting ring seat 703. The bottom of the supporting ring seat 703 is in sliding contact with the top of the test bench 1. An electric heating wire 704 is fixedly installed inside the annular shell 701.

[0055] When the electric control telescopic rod three 602 starts, it pushes the push-pull frame 603 to move, thereby driving the air flow processing mechanism 8 to move. Thus, the preheating mechanism 7 is driven to move by the air flow processing mechanism 8, and then the rotation position of the preheating mechanism 7 is adjusted, so as to maintain the moving position of the structure, facilitate changing the position of the preheating mechanism 7. The annular shell 701 plays a role in balancing the air flow, guiding and inhaling through the air outlet holes 702, and heating the blown air flow through the heating wire 704, circularly heating the encapsulation mold base 102, the chip materials not lowered from the silicone suction soft cone head 1002, and the encapsulated materials, thereby realizing preheating, reducing the thermal stress problem caused by excessive temperature difference during the encapsulation process, indirectly improving a certain yield rate, facilitating the space preheating of the inner side enclosed by the annular shell 701 and the support ring seat 703, and facilitating the cooperation with the encapsulation operation.

[0056] In another embodiment, as Figures 1 - 7 shown, the air flow processing mechanism 8 includes a semi-circular seat 801. A number of groups of concave limiting frames 806 are fixedly installed on the inner side of the semi-circular seat 801. A pull-out sealing frame 804 is slidably installed on the inner side of the concave limiting frame 806. A soot filter screen 805 is fixedly installed on the inner side of the pull-out sealing frame 804. The pull-out sealing frame 804 movably penetrates through the semi-circular seat 801 and extends to the top of the semi-circular seat 801. One end of the mounting frame 502 far from the two-way equivalent air outlet fan 501 communicates with the inside of the semi-circular seat 801. The concave limiting frames 806 are evenly distributed inside the semi-circular seat 801 with the mounting frame 502 as the symmetry axis. Two electric control telescopic rods four 803 are fixedly installed at the bottom of the support circular plate 605. The tops of the two electric control telescopic rods four 803 are fixedly installed on the top of the annular shell 701. The semi-circular seat 801 is in a C shape. Air outlet hoses 802 are communicated with both ends of the C shape of the semi-circular seat 801. One end of the air outlet hose 802 far from the semi-circular seat 801 communicates with the top of the annular shell 701.

[0057] When the two-way equivalent air outlet fan 501 starts, the air flow enters the interior of the semi-circular seat 801 through the connecting hose 503 and enters the interior of the annular shell 701 under the guidance of the air outlet hose 802. The air flow is heated by the heating wire 704 and then is discharged through the air outlet holes 702. Through the connecting hose 503 to the air outlet hose 802 and then to the air outlet holes 702, the air flow is divided into two, and the two are divided into circumferential diversion, so as to achieve uniform discharge of the air flow. When the two-way equivalent air outlet fan 501 blows air in the reverse direction, the air flow enters through the air outlet holes 702. At this time, the pin welding of the chip package generates a certain amount of smoke, and the air flow takes the smoke out. Through the diversion of the air outlet holes 702 and the annular shell 701, it enters the air outlet hose 802, and then enters the interior of the semi-circular seat 801 through the diversion of the air outlet hose 802. Finally, through the filtration of the soot filter screen 805, the filtration of the soot is achieved, avoiding the situation that the smoke affects the operators and the vision system, ensuring the stability of the welding, being convenient to use as a whole, improving the qualified rate and increasing the product testing efficiency.

[0058] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging device for semiconductor chip production, comprising a test bench (1), an airflow guiding mechanism (5) and a pushing mechanism (6), characterized in that: The top of the test bench (1) is provided with a mounting groove (101), the top of the mounting groove (101) is fixed with a packaging mold seat (102) by means of bolts, and one side of the top of the test bench (1) is provided with a moving mechanism (2); The moving mechanism (2) comprises two support seats (203), the two support seats (203) are fixedly installed on the top of the test bench (1), ball screws (201) are installed on the opposite sides of the two support seats (203) through bearings, one end of the ball screw (201) is connected to a servo motor (204), two slide rails (202) are fixedly installed on the opposite sides of the two support seats (203), the outer side of the ball screw (201) is connected to a moving seat (205) through a threaded transmission, a mechanical arm mechanism (3) is fixedly installed on the top of the moving seat (205), and a lifting mechanism (4) is fixedly installed on the movable end of the mechanical arm mechanism (3); The lifting mechanism (4) comprises an outer sleeve (401), the inner side of the outer sleeve (401) is movably sleeved with an inner sleeve column (402), an electrically controlled telescopic rod 2 (406) is fixedly mounted on the top of the inner cavity of the outer sleeve (401), an installation cavity (403) is provided inside the inner sleeve column (402), a movable piston mechanism (12) is mounted on the top of the inner cavity of the installation cavity (403), the movable piston mechanism (12) comprises an electrically controlled telescopic rod 5 (1201), a sealing piston (1202) is fixedly mounted on the output end of the electrically controlled telescopic rod 5 (1201), a rotating support mechanism (9) is arranged on the outer side of the inner sleeve column (402), a suction mechanism (10) is penetrated on the inner side of the rotating support mechanism (9), and an active rotating mechanism (11) is mounted on the top of the rotating support mechanism (9); The suction mechanism (10) comprises a connecting branch pipe (1004), a mounting ring (1006) is fixedly mounted on the top of the connecting branch pipe (1004), a rotating seal (1005) is movably mounted on the inner side of the mounting ring (1006), a sealing cone ring (1007) is movably mounted on the top of the mounting ring (1006), the bottom of the connecting branch pipe (1004) is connected to an air suction shell (1001), a rubber elastic diaphragm (1003) is fixedly mounted on the inner wall of the air suction shell (1001), and the bottom of the air suction shell (1001) is connected to a plurality of silicone air suction soft cone heads (1002); The airflow guiding mechanism (5) comprises a bidirectional equivalent air outlet fan (501), a mounting frame (502) and a connecting hose (503); one end of the bidirectional equivalent air outlet fan (501) is connected to the inner side of the connecting hose (503); the bidirectional equivalent air outlet fan (501) is fixedly mounted on the top of the mounting frame (502); the mounting frame (502) is fixedly mounted on the top of the test bench (1); and one end of the connecting hose (503) away from the bidirectional equivalent air outlet fan (501) is connected to an airflow processing mechanism (8).

2. A semiconductor chip production packaging device according to claim 1, characterized in that: The servo motor 1 (204) is fixedly mounted on the top of the test bench (1), the bottoms of the two slide rails (202) are fixedly mounted on the top of the test bench (1), and the moving seat (205) is slidably sleeved on the outer sides of the slide rails (202).

3. A semiconductor chip production packaging device according to claim 1, characterized in that: The mechanical arm mechanism (3) comprises a support column (304), the outer side of the bottom end of the support column (304) is movably sleeved with a bearing support seat (307), the bearing support seat (307) is fixedly mounted on the top of a moving seat (205), the outer side of the support column (304) is fixedly sleeved with a driven transmission gear (303), the outer side of the driven transmission gear (303) is meshed with an active transmission gear (302), the bottom of the active transmission gear (302) is transmission-connected with a servo motor 2 (301), the servo motor 2 (301) is fixedly mounted on the top of the moving seat (205), the top end of the support column (304) is rotatably hinged with a cross bar (305), the outer side of the cross bar (305) is rotatably hinged with an electric-controlled telescopic column 1 (306), and one end of the electric-controlled telescopic column 1 (306) away from the cross bar (305) is rotatably hinged on the outer side of the support column (304).

4. A semiconductor chip production packaging device according to claim 3, characterized in that: The outer sleeve (401) is fixedly mounted on the outside of the cross bar (305), the output end of the second electrically controlled telescopic rod (406) is fixedly mounted on the top of the inner sleeve column (402), a pressure equalizing air hole (405) is provided on one side of the top of the outer sleeve (401), and a plurality of flow guide air channels (404) are provided on the top of the inner sleeve column (402).

5. A semiconductor chip production packaging device according to claim 4, characterized in that: The electrically controlled telescopic rod five (1201) is fixedly mounted on the top of the inner cavity of the installation cavity (403); the sealing piston (1202) is movably sleeved on the inner side of the installation cavity (403); the pressure equalizing air hole (405) is connected to the interior of the outer sleeve (401); the top end of the flow guide air channel (404) is connected to the interior of the outer sleeve (401); and the bottom end of the flow guide air channel (404) is connected to the interior of the installation cavity (403).

6. A semiconductor chip production packaging device according to claim 1, characterized in that: The rotating support mechanism (9) comprises a rotating shell (901), wherein the rotating shell (901) is sleeved with a support bearing (905) on the inner side of the rotating shell (901), and the inner side of the support bearing (905) is sleeved with a support ring plate (906), the inner side of the support ring plate (906) is fixedly sleeved on the outer side of the inner sleeve column (402), and a support block (902) is movably mounted on the top of the support ring plate (906), and a plurality of ball grooves (903) are provided on the inner side of the support block (902), and rolling balls (904) are rollingly mounted on the inner side of the ball grooves (903), and the ball grooves (903) and the ball (904) are uniformly distributed on the inner side of the support block (902) in a circular shape, and the bottoms of the support block (902), the ball grooves (903) and the ball (904) are all in sliding contact with the top of the support ring plate (906).

7. A semiconductor chip production packaging device according to claim 6, characterized in that: The connecting branch pipe (1004) is fixedly sleeved on the inner side of the rotating shell (901), the top end of the connecting branch pipe (1004) is rotatably inserted into the inner side of the installation cavity (403), the installation ring (1006) is movably sleeved on the inner side of the installation cavity (403), the sealing cone ring (1007) is fixedly installed on the inner side of the installation cavity (403), the bottom of the rotating seal (1005) is in rotational sealing contact with the top of the connecting branch pipe (1004), the silicone suction soft cone head (1002) is evenly distributed on the bottom of the suction shell (1001) in a circumferential manner, the silicone suction soft cone head (1002) is conical, and the outer edge of the bottom is provided with a rounded corner.

8. A semiconductor chip production packaging device according to claim 6 or 7, characterized in that: The active rotating mechanism (11) comprises a driven gear ring disk (1101), a driving gear disk (1102) and a servo motor three (1103); the driven gear ring disk (1101) is fixedly mounted on the top of the rotating shell (901); the outer side of the driving gear disk (1102) is meshed and transmission-connected with the inner side of the driven gear ring disk (1101); the output end of the servo motor three (1103) is transmission-connected with the top of the driving gear disk (1102); the outer side of the servo motor three (1103) is fixedly sleeved with a fixed ring frame (1104); the inner side of the fixed ring frame (1104) away from one end of the servo motor three (1103) is fixedly sleeved on the outer side of the inner sleeve column (402).

9. A semiconductor chip production packaging device according to claim 1, characterized in that: The pushing mechanism (6) comprises a fixing plate (601), one side of which is fixedly mounted an electric-controlled telescopic rod three (602), an output end of the electric-controlled telescopic rod three (602) is fixedly mounted a push-pull frame (603), a top of the push-pull frame (603) away from one end of the electric-controlled telescopic rod three (602) is fixedly mounted a support ring frame (604), the push-pull frame (603) is slidably mounted on the top of the test bench (1), a support circular plate (605) is fixedly mounted on the inner side of the top of the support ring frame (604), and the airflow processing mechanism (8) is fixedly mounted on the support ring frame (604). A preheating mechanism (7) is movably arranged on the top of the circular plate (605) and the inner side of the push-pull frame (603). The preheating mechanism (7) comprises an annular shell (701). A plurality of air outlet holes (702) are provided on the inner side of the annular shell (701). The air outlet holes (702) are evenly distributed on the inner side of the annular shell (701) in a circular shape. A supporting ring seat (703) is fixedly installed on the bottom of the annular shell (701). The bottom of the supporting ring seat (703) is in sliding contact with the top of the test bench (1). A heating wire (704) is fixedly installed on the inner side of the annular shell (701).

10. A semiconductor chip production packaging device according to claim 9, characterized in that: The airflow processing mechanism (8) comprises a semi-annular seat (801), a plurality of groups of concave limiting frames (806) are fixedly installed on the inner side of the semi-annular seat (801), a pull-out sealing frame (804) is slidably installed on the inner side of the concave limiting frame (806), a smoke filter (805) is fixedly installed on the inner side of the pull-out sealing frame (804), the pull-out sealing frame (804) movably passes through the semi-annular seat (801) and extends to the top of the semi-annular seat (801), and one end of the mounting frame (502) away from the bidirectional equivalent air outlet fan (501) is connected to the semi-annular seat (801). The concave limiting frame (806) is evenly distributed inside the semi-annular seat (801) with the mounting frame (502) as the symmetry, two electric-controlled telescopic rods (803) are fixedly installed at the bottom of the supporting circular plate (605), and the tops of the two electric-controlled telescopic rods (803) are fixedly installed on the top of the annular shell (701), and the semi-annular seat (801) is C-shaped, and both ends of the C-shaped semi-annular seat (801) are connected to an air outlet hose (802), and one end of the air outlet hose (802) away from the semi-annular seat (801) is connected to the top of the annular shell (701).

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