Test probe for a finger tester for testing printed circuit boards, finger tester for testing printed circuit boards and method for testing printed circuit boards

The test probe design with a contact sleeve and dual contact points addresses the challenge of efficiently contacting small, closely spaced points on unpopulated circuit boards, ensuring precise and damage-free measurements by minimizing parallel movement and incorporating sensors for enhanced stability and accuracy.

DE102024138115A1Pending Publication Date: 2026-06-18ATG LUTHER & MAELZER GMBH
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Patent Information

Application Number
DE102024138115
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2026-06-18

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Abstract

The invention relates to a test probe for a test finger for testing printed circuit boards. The test probe comprises a contact sleeve and a test needle, which has a contact tip at one end. Furthermore, the test probe includes at least one sleeve spring arm, which is formed at one end at a base of the test probe and at the other end at the contact sleeve for elastically holding and electrically connecting the contact sleeve. The test needle in the contact sleeve is axially displaceable, so that the contact sleeve can be brought into contact with a test point of the printed circuit board to be tested. The test probe has a needle spring arm, which is electrically and mechanically attached to a connecting end of the test needle projecting from the contact sleeve and away from the contact tip, so that the needle spring arm counteracts any movement of the test needle with the connecting end out of the contact sleeve.This allows the test probe to form an internal sensor and the contact sleeve an external sensor for scanning a circuit board test point.
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Citation Information

Patent Citations

  • Electrical probe with contact force protection

    EP0460911A2

  • Device for contacting elements for testing

    EP0468153A1

  • Method and apparatus for measuring oxide charge on a semiconductor wafer

    EP0660387A2

  • Method for testing printed-circuit boards

    EP0853242A1

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    EP0990912A2