COOLING DEVICE AND SEMICONDUCTOR DEVICE

Abstract

In at least one of a plurality of cooling pin rows, an end-section gap region, which is a region between a cooling pin located at an outermost end section in a flow path width direction and an inner wall surface of a flow path, exhibits a lower flow path resistance than a flow path width direction separation region, which is a region between the cooling pins adjacent to each other in the flow path width direction.In two cooling pin rows adjacent to each other in a main flow direction, a main flow direction separation distance, which is a distance from the cooling pin contained in the cooling pin row located on an upstream side to the cooling pin contained in the cooling pin row located on a downstream side, is less than a main flow direction pin dimension, which is a length of the cooling pin contained in the cooling pin row located on the downstream side in the main flow direction.

Description

TECHNICAL AREA

[0001] The present invention relates to a cooling device and a semiconductor device.

[0002] Priority is claimed on PCT / JP2023 / 019536, filed with the Japanese Patent Office as receiving office on May 25, 2023, the contents of which are hereby incorporated by reference. STATE OF THE ART

[0003] By way of example, patent document 1 discloses a cooling device in which a plurality of cooling fins are provided in a cooling medium flow path. In the cooling device disclosed in patent document 1, heat is transferred from the cooling fins to a cooling medium in the cooling medium flow path in order to cool a semiconductor module in contact with the cooling device. Additionally, patent document 1 also discloses a cooling fin whose upstream cross-section has a semicircular shape and whose downstream cross-section has an equilateral triangular shape extending towards the downstream side. Bibliography Patent document

[0004] Patent document 1: Japanese patent no. 6616264 SUMMARY OF THE INVENTION Technical Problem

[0005] The cooling device disclosed in patent document 1 has a large number of cooling pins, which are pin-shaped cooling fins, in the flow path. When the cooling medium flowing through the flow path collides with a cooling pin in the cooling device, the flow direction of the cooling medium changes locally significantly by almost 90°. Furthermore, the cooling medium collides with the cooling pins multiple times as it flows from the upstream side to the downstream side. Thus, the cooling medium flows in such a way that the flow direction changes by 90° each time it collides with a cooling pin and meanders through the flow path. As the cooling medium meanders in this manner, frequently undergoing significant changes in flow direction, the pressure drop in the flow path increases accordingly.

[0006] The present invention was developed with regard to the problems described above, and it is therefore an object of the present invention to reduce the pressure loss in a flow path of a cooling medium in a cooling device which has a large number of cooling pins. Solution to the problem

[0007] The present invention uses the following configurations as a means of solving the problems described above.

[0008] According to a first aspect of the present invention, a cooling device is provided comprising a plurality of cooling pins arranged to extend in the same direction in a flow path of a cooling medium, wherein, in a cross-section orthogonal to a direction of extension of the cooling pins, each of the cooling pins has: an upstream curved surface section located at the farthest upstream side of the flow path and formed by an arc having a first radius of curvature, a downstream curved surface section located at the farthest downstream side of the flow path and formed by an arc having a second radius of curvature smaller than the first radius of curvature, and a connecting surface connecting the upstream curved surface section and the downstream curved surface section.wherein a plurality of cooling pin rows are provided and arranged in a principal flow direction, each of which comprises the plurality of cooling pins arranged at equal intervals in a flow path width direction orthogonal to a principal flow direction connecting an upstream side and a downstream side of the flow path and the extension direction, wherein in at least one of the plurality of cooling pin rows an end-section gap region, which is a region between the cooling pin located at an outermost end section in the flow path width direction and an inner wall surface of the flow path, has a lower flow path resistance than a flow path width direction separation region, which is a region between the cooling pins that are adjacent to each other in the flow path width direction, and wherein in two cooling pin rows that are adjacent to each other in the principal flow direction,a main flow direction separation distance, which is a distance from the cooling pin contained in the cooling pin row located on the upstream side to the cooling pin contained in the cooling pin row located on the downstream side, less than a main flow direction pin dimension, which is the length of the cooling pin contained in the cooling pin row located on the downstream side in the main flow direction.

[0009] According to a second aspect of the present invention, a semiconductor device is also provided, comprising the cooling device according to the first aspect of the present invention and a semiconductor element configured to be cooled by the cooling device. Advantageous effects of the invention

[0010] Since the end-section gap region has lower flow path resistance than the flow path width direction separation region, according to the present invention, the flow velocity of the cooling medium flowing through the gap between the cooling pin located at the end section in the flow path width direction and the inner wall surface of the flow path is higher than the flow velocity of the cooling medium flowing through the gap between the cooling pins. Therefore, the pressure of the gap between the cooling pin located at the end section in the flow path width direction and the inner wall surface of the flow path is reduced, and the cooling medium, which tends to flow along the main flow direction, is attracted towards the inner wall surface and flows in a direction inclined with respect to the main flow direction in the flow path.Furthermore, the cooling medium, flowing in a direction inclined relative to the main flow direction, is guided to the junction surface connecting the upstream curved surface section with a relatively large radius of curvature and the downstream curved surface section with a relatively small radius of curvature. Therefore, the cooling medium is likely to flow in a direction inclined relative to the main flow direction along the flow path. Accordingly, the force causing the cooling medium to flow in this inclined direction is increased, thus suppressing any significant change in the cooling medium's direction of motion until the cooling medium passes through a multitude of cooling pins in the main flow direction.Therefore, according to the present invention, it is possible to suppress frequent and significant changes in the flow direction of the cooling medium. Furthermore, it is also possible to reduce the pressure drop in the flow path of the cooling medium in the cooling device, which has a large number of such cooling pins. BRIEF DESCRIPTION OF THE DRAWINGS [ Fig. 1] A schematic top view showing a schematic configuration of a cooling device according to a first embodiment of the present invention. [ Fig. 2] A schematic cross-sectional view showing a schematic configuration of the cooling device according to the first embodiment of the present invention. [ Fig. 3] A perspective view showing a cooling pin and an upper wall section provided in the cooling device according to the first embodiment of the present invention. [ Fig. 4] A schematic horizontal cross-sectional view showing an arrangement of the cooling pins provided in the cooling device according to the first embodiment of the present invention. [ Fig. 5] A cross-sectional view along a plane orthogonal to an extension direction of each cooling pin provided in the cooling device according to the first embodiment of the present invention. [ Fig. 6] A schematic view showing a positional relationship between a plurality of cooling pins and an inner wall surface of a flow path in the cooling device according to the first embodiment of the present invention. [ Fig. 7] A view showing the result of a simulation of a flow velocity distribution around the cooling pin, which is spaced from the inner wall surface of the flow path by an end section gap distance. [ Fig. 8] A view showing the result of a simulation of a pressure distribution around the cooling pin, which is spaced from the inner wall surface of the flow path by the end section gap distance. [ Fig. 9] A view showing the result of a simulation of a flow velocity distribution in an area containing a large number of cooling pins. [ Fig. 10] A view showing the result of a simulation of a pressure distribution in an area containing a large number of cooling pins. [ Fig. 11] A schematic top view showing a schematic configuration of a cooling device according to a second embodiment of the present invention. [ Fig. 12] A schematic view showing the shape and arrangement of cooling pins located in a first area of ​​the cooling device according to the second embodiment of the present invention. [ Fig. 13] A schematic view showing the shape and arrangement of cooling pins located in a third area of ​​the cooling device according to the second embodiment of the present invention. [ Fig. 14] A schematic, partially enlarged cross-sectional view showing a semiconductor device according to a third embodiment of the present invention. [ Fig. 15] A schematic top view showing a modification example of cooling pin arrays according to the present invention. [ Fig. 16] A schematic view showing the shape and arrangement of cooling pins in a cooling device according to a fourth embodiment of the present invention. [ Fig. 17] A schematic view showing the shape and arrangement of cooling pins in a cooling device according to a fifth embodiment of the present invention. [ Fig. 18] A schematic view showing one form of a modification example of the cooling pin. DESCRIPTION OF THE EXECUTION FORMS

[0011] An embodiment of a cooling device and a semiconductor device according to the present invention is described below with reference to the drawings. (First embodiment)

[0012] Fig. Figure 1 is a schematic top view showing a schematic configuration of a cooling device 1 according to the present embodiment. Additionally, it shows Fig. Figure 2 shows a schematic cross-sectional view illustrating a schematic configuration of the cooling device 1 according to the present embodiment. In this embodiment, the cooling device 1, for example, exchanges heat between a heat-generating component X (heat source) installed on an upper surface and a cooling medium Y in order to cool the heat-generating component X. As shown in Fig. 1 and Fig. As shown in Figure 2, the cooling device 1 according to the present embodiment includes a housing 2 and cooling pins 3.

[0013] A flow path R, through which the cooling medium Y flows, is formed in the housing 2, and the housing 2 is made, for example, of a metal material with high thermal conductivity. Furthermore, the housing 2 has a cooling medium supply port 2a for supplying the cooling medium Y to the flow path R and a cooling medium discharge port 2b for discharging the cooling medium Y from the flow path R. As shown in Fig. As shown in Figure 1, the cooling medium supply port 2a and the cooling medium discharge port 2b are arranged such that they face each other, with the flow path R located between them.

[0014] In the flow path R of the housing 2, the cooling medium Y flows from the cooling medium supply port 2a to the cooling medium discharge port 2b. That is, in the flow path R, the cooling medium Y flows from the cooling medium supply port 2a as an upstream side to the cooling medium discharge port 2b as a downstream side.

[0015] In the following description, a direction connecting the upstream and downstream sides of the flow path R (that is, in the present embodiment, a direction connecting the cooling medium supply port 2a and the cooling medium discharge port 2b) is referred to as a main flow direction. Additionally, a direction along a width of the flow path R (a width direction of the flow path R orthogonal to the main flow direction) is referred to as a flow path width direction. Furthermore, the installation position of the cooling device 1 is not particularly restricted. For the sake of simplicity, a direction orthogonal to both the main flow direction and the flow path width direction is also referred to as an up-down direction.

[0016] As in Fig. As shown in Figure 2, the housing 2 in the present embodiment comprises a main body section 2c and an upper wall section 2d. The main body section 2c is designed as a box-shaped container, with its upper section being open. Furthermore, the cooling medium supply port 2a and the cooling medium discharge port 2b are formed in the main body section 2c.

[0017] The upper wall section 2d is attached to an upper end of the main body section 2c and forms an upper section of the housing 2. Furthermore, the upper wall section 2d, together with the main body section 2c, forms the flow path R. In the present embodiment, an upper surface of the upper wall section 2d is a mounting surface for the heat-generating component X. Additionally, a lower surface of the upper wall section 2d is a surface on which the cooling pins 3 are formed. That is, the cooling pins 3 are configured to be connected to the lower surface of the upper wall section 2d. The upper wall section 2d is, for example, integrally cast with the cooling pins 3.

[0018] Fig. Figure 3 is a perspective view showing the cooling pins 3 and the upper wall section 2d. Furthermore, in Fig. 3. The top and bottom are shown in reverse. As in the Fig. 1 to Fig. As shown in Figure 3, a multitude of cooling pins 3 are provided. The cooling pins 3 are arranged within the flow path R. Furthermore, the cooling pins 3 are made, for example, of the same material as the housing 2.

[0019] In the present embodiment, each cooling pin 3 is configured such that it extends downwards from the lower surface of the upper wall section 2d. That is, the cooling device 1 according to the present embodiment comprises a plurality of cooling pins 3 arranged such that they extend in the same direction in the flow path R. The direction of extension of the cooling pin 3 in the present embodiment is accordingly the upward-downward direction.

[0020] The dimensions of the protrusions of the cooling pins 3 from the upper wall section 2d are identical. That is, in the present embodiment, the dimensions of each of the cooling pins 3 are the same in the upward-downward direction. However, the dimensions of the plurality of cooling pins 3 in the upward-downward direction can also differ from one another.

[0021] Fig. Figure 4 is a schematic horizontal cross-sectional view showing the arrangement of the cooling pins 3. As in Fig. As shown in Figure 4, in the present embodiment the cooling pins 3 are arranged in a staggered pattern. As shown in Fig. As shown in Figure 4, the cooling device 1 according to the present embodiment includes cooling pin rows 4, each of which is formed by a plurality of cooling pins 3 arranged in the direction of the flow path width. Thus, a plurality of cooling pin rows 4 are provided and arranged in the main flow path direction.

[0022] In each cooling pin row 4, the spacing of the cooling pins 3 is the same in the direction of the flow path width. That is, the cooling pins 3 contained in the same cooling pin row 4 are arranged at equal intervals in the direction of the flow path width. Furthermore, in the present embodiment, the spacing of each of the cooling pins 3 is the same in all of the cooling pin rows 4.

[0023] On the other hand, in two cooling pin rows 4 adjacent to each other in the main flow direction, the phase of the arrangement of the cooling pins 3 is offset by half a division. That is, viewed from the main flow direction, the cooling pin 3 contained in the cooling pin row 4 located on the upstream side is arranged between the cooling pins 3 contained in the cooling pin row 4 located on the downstream side. In the cooling device 1 according to the present embodiment, the cooling pins 3 contained in the cooling pin row 4 located on the upstream side and the cooling pins 3 contained in the cooling pin row 4 located on the downstream side are also arranged in an offset pattern in two cooling pin rows 4 adjacent to each other in the main flow direction.

[0024] Fig. Figure 5 is a cross-sectional view along a plane orthogonal to the extension direction (upward-downward direction) of each cooling pin 3. As in Fig. As shown in Figure 5, each cooling pin 3 is configured in a shape having an upstream curved surface section 3a, a downstream curved surface section 3b, and a connecting surface 3c in a cross-section orthogonal to the extension direction of the cooling pin 3. Furthermore, the cooling pins 3 are configured such that they have the same cross-sectional shape along the plane orthogonal to the upward-downward direction in the upward-downward direction.

[0025] The upstream curved surface section 3a represents a section of the cooling pin 3 that is located closest to the upstream side of the flow path R and is configured such that a central section of it, in the direction of the flow path width, is a curved arc projecting towards the upstream side of the flow path R. Furthermore, the upstream curved surface section 3a is configured such that it is an arc with a radius of curvature R1 (first radius of curvature) centered on a center point O1. An axis passing through the center point O1 and parallel to the main flow direction is defined as a central axis L of the cooling pin 3. In the present embodiment, the upstream curved surface section 3a is also provided in a region of 90° to the left and right of the central axis L.Furthermore, the training area of ​​the upstream curved surface section 3a can be modified.

[0026] The downstream curved surface section 3b, on the other hand, represents a section of the cooling pin 3 that is located closest to the downstream side of the flow path R and is configured such that a central section of it, in the direction of the flow path width, is a curved arc projecting towards the downstream side of the flow path R. Furthermore, the downstream curved surface section 3b is configured such that it is an arc with a radius of curvature R2 (second radius of curvature) centered on a point O2. The radius of curvature R2 is smaller than the radius of curvature R1. That is, the downstream curved surface section 3b is configured such that it represents an arc with a greater curvature than the upstream curved surface section 3a.

[0027] Furthermore, center O2 is arranged such that it overlaps the central axis L, which passes through center O1. That is, center O1 and center O2 are arranged such that a line segment connecting center O1 and center O2 is parallel to the main flow direction. In the present embodiment, the downstream curved surface section 3b is also provided in a region extending 45° to the left and right of the central axis L. Furthermore, the design area of ​​the downstream curved surface section 3b can also be modified.

[0028] The connecting surface 3c connects the upstream curved surface section 3a and the downstream curved surface section 3b. In the present embodiment, each cooling pin 3 has a first connecting surface 3d, which represents the connecting surface 3c that connects the upstream curved surface section 3a and the downstream curved surface section 3b on one side in the flow path width direction. Additionally, each cooling pin 3 has a second connecting surface 3e, which represents the connecting surface 3c that connects the upstream curved surface section 3a and the downstream curved surface section 3b on the other side in the flow path width direction.

[0029] In a cooling pin 3, the first connecting surface 3d and the second connecting surface 3e are furthermore smooth surfaces without any curved section and lie closer to each other in the flow path width direction when the first connecting surface 3d and the second connecting surface 3e extend from the upstream curved surface section 3a to the downstream curved surface section 3b. Moreover, in the present embodiment, as in Fig. Figure 5 shows that each of the first connection surface 3d and the second connection surface 3e is formed in a slightly curved shape when viewed from the upward-downward direction.

[0030] Furthermore, the first connecting surface 3d and the second connecting surface 3e can also represent flat surfaces that are linear when viewed from the up-down direction. In this case, it is preferred that the first connecting surface 3d and the second connecting surface 3e are tangents to the upstream curved surface section 3a and the downstream curved surface section 3b.As a result, no curved sections are formed at a boundary between the first connecting surface 3d and the upstream curved surface section 3a, a boundary between the first connecting surface 3d and the downstream curved surface section 3b, a boundary between the second connecting surface 3e and the upstream curved surface section 3a, and a boundary between the second connecting surface 3e and the downstream curved surface section 3b.

[0031] Furthermore, in the present embodiment, a plurality of cooling pins 3 provided in the cooling device 1 are formed in the same shape. Therefore, the cooling pins 3 have the same distance (center distance Da) from the center O1 to the center O2.

[0032] Fig. Figure 6 is a schematic view showing a positional relationship between a plurality of cooling pins 3 and an inner wall surface Ra of the flow path R. As in Fig. As shown in Figure 6, in the present embodiment the cooling pins 3 are arranged in an offset pattern in two cooling pin rows 4 which are adjacent to each other in the main flow direction. Therefore, the distance from a cooling pin 3 contained in one of the two cooling pin rows 4 to the inner wall surface Ra differs from the distance from a cooling pin 3 contained in the other cooling pin row 4 to the inner wall surface Ra.

[0033] Here, in cooling pin row 4, where the distance of the cooling pin 3 at an end section in the flow path width direction to the inner wall surface Ra is short, the distance of the cooling pin 3 at the end section in the flow path width direction to the inner wall surface Ra is defined as an end section gap distance D1. That is, the distance of a cooling pin 3 located at the outermost end section in the flow path width direction to the inner wall surface Ra of the flow path R is defined as the end section gap distance D1.

[0034] In this case, for example, among the cooling pin rows 4 arranged in the main flow direction, the distance of a cooling pin 3 at an end face in the flow path width direction in an even-numbered cooling pin row 4 to the inner wall surface Ra represents the end section gap distance D1. On the other hand, among the cooling pin rows 4 arranged in the main flow direction, the distance of a cooling pin 3 at an end face in the flow path width direction in an odd-numbered cooling pin row 4 to the inner wall surface Ra is greater than the end section gap distance D1.

[0035] In contrast, in this case, for example, among the cooling pin rows 4 arranged in the main flow direction, the distance of a cooling pin 3 at the opposite end in the flow path width direction in the odd-numbered cooling pin row 4 to the inner wall surface Ra represents the end section gap distance D1. On the other hand, among the cooling pin rows 4 arranged in the main flow direction, the distance of a cooling pin 3 at the opposite end in the flow path width direction in the even-numbered cooling pin row 4 to the inner wall surface Ra is greater than the end section gap distance D1.

[0036] Furthermore, in the present embodiment, as in Fig. As shown in Figure 6, the distance between the cooling pins 3 that are adjacent to each other in the flow path width direction is defined as a flow path width direction separation distance D2. Furthermore, in two cooling pin rows 4 that are adjacent to each other in the main flow direction, the distance from a cooling pin 3 contained in the cooling pin row 4 located on the upstream side to a cooling pin 3 contained in the cooling pin row 4 located on the downstream side is defined as a main flow direction separation distance D3. Finally, the length of a cooling pin 3 in the main flow direction is defined as a main flow direction pin dimension D4.

[0037] As in Fig. As shown in Figure 6, in the present embodiment the end section gap distance D1 is smaller than the flow path width direction separation distance D2. Furthermore, the main flow direction separation distance D3 is smaller than the main flow direction pin dimension D4 of a cooling pin 3 contained in the cooling pin row 4 located on the downstream side.

[0038] Fig. Figure 7 shows the result of a simulation of a flow velocity distribution around a cooling pin 3, which is spaced from the inner wall surface Ra of the flow path R by the end-section gap distance D1. Furthermore, it shows Fig. 8 a result of a simulation of a pressure distribution around a cooling pin 3, which is spaced from the inner wall surface Ra of the flow path R by the end section gap distance D1.

[0039] In the cooling device 1 according to the present embodiment, the end-section gap spacing D1 is smaller than the flow path width direction separation distance D2. However, in each cooling pin row 4, a gap is formed between the inner wall surface Ra of the flow path R and the innermost wall surface Ra. Therefore, the flow path R has a linear flow path that extends linearly in the main flow direction in a region closest to the inner wall surface Ra. Consequently, the flow path resistance of a region (end-section gap region Sa) between the inner wall surface Ra and the cooling pin 3 closest to the inner wall surface Ra is lower than the flow path resistance of a region (flow path width direction separation region Sb) between the cooling pins 3.

[0040] Therefore, as in Fig. Figure 7 shows that the flow velocity of the cooling medium Y flowing through the gap between the cooling pin 3, located at the end section in the flow path width direction, and the inner wall surface Ra of the flow path R, is higher than the flow velocity of the cooling medium Y flowing through the gap between the cooling pins 3. Consequently, as shown in Fig. Figure 8 shows that the pressure of the gap between the cooling pin 3, which is located at the end section in the flow path width direction, and the inner wall surface Ra of the flow path R is further reduced.

[0041] Additionally, if the flow path resistance of the end section gap region Sa is less than the flow path resistance of the flow path width direction separation region Sb, the end section gap distance D1 can be equal to or greater than the flow path width direction separation distance D2.

[0042] As described above, the pressure in the gap between the cooling pin 3, located at the end section in the flow path width direction, and the inner wall surface Ra of the flow path R is reduced. Therefore, the cooling medium Y, which tends to flow along the main flow direction, is attracted towards the inner wall surface Ra and flows in a direction inclined relative to the main flow direction in the flow path R. Furthermore, the cooling medium Y, flowing in the direction inclined relative to the main flow direction, is guided to the connecting surface 3c, which connects the upstream curved surface section 3a with a relatively large radius of curvature and the downstream curved surface section 3b with a relatively small radius of curvature. Therefore, it is likely that the cooling medium Y flows in the direction inclined relative to the main flow direction in the flow path R.Accordingly, the force that causes the cooling medium Y to flow in the direction inclined with respect to the main flow is increased, which makes it possible to suppress a significant change in the direction of movement of the cooling medium Y until the cooling medium Y flows through a plurality of cooling pins 3 in the main flow direction.

[0043] Fig. Figure 9 shows a result of a simulation of a flow velocity distribution in an area that includes a large number of cooling pins 3. Fig. Figure 10 also shows a result of a simulation of a pressure distribution in the area containing the multitude of cooling pins 3.

[0044] As in Fig. As shown in Figure 9, two separating vortices (a first separating vortex Z1 and a second separating vortex Z2) are formed on the downstream side of each cooling pin 3. The first separating vortex Z1 is a separating vortex that forms on one side of the cooling pin 3 in the direction of the flow path width. Additionally, the second separating vortex Z2 is a separating vortex that forms on the other side of the cooling pin 3 in the direction of the flow path width.

[0045] The cooling medium Y flows in a direction inclined from the upstream side to the downstream side with respect to the main flow direction. In this case, as the flow moves downstream, the pressure decreases due to the separation of the flow from the connecting surface 3c of the cooling pin 3 in a section (a section of the cooling pin 3 on the other side in the flow path width direction), which in Fig. 10 is surrounded by a circle, quickly. Due to this influence, as in Fig. As shown in Figure 9, the first separating vortex Z1 increases in size as it moves downstream, and the second separating vortex Z2 decreases in size as it moves downstream. However, if the sizes of the first separating vortex Z1 and the second separating vortex Z2 are reversed, the flow direction of the cooling medium Y changes significantly by approximately 90°. That is, in the present embodiment, the flow of the cooling medium Y does not change significantly until the sizes of the first separating vortex Z1 and the second separating vortex Z2 are reversed, and the cooling medium Y flows linearly in the direction inclined with respect to the main flow direction. As a result, frequent and significant changes in the flow direction of the cooling medium Y are suppressed, making it possible to reduce the pressure drop in the flow path R.In the present simulation, it was confirmed that the pressure loss in the flow path R was reduced by 15%, while the corresponding thermal resistance remained the same, compared to a case in which the cooling pin with a circular cross-section was used.

[0046] The cooling device 1 with the configuration described above, according to the present embodiment, comprises a plurality of cooling pins 3 arranged such that they extend in the same direction in the flow path R of the cooling medium Y. Furthermore, each cooling pin 3 has, in cross-section orthogonal to the direction of extension of the cooling pin 3, the upstream curved surface section 3a, the downstream curved surface section 3b, and the connecting surface 3c. The upstream curved surface section 3a is located on the farthest upstream side of the flow path R and is formed by an arc with radius of curvature R1. The downstream curved surface section 3b, on the other hand, is located on the farthest downstream side of the flow path R and is formed by an arc with radius of curvature R2, which is smaller than radius of curvature R1.The connecting surface 3c also connects the upstream curved surface section 3a and the downstream curved surface section 3b.

[0047] Furthermore, the cooling device 1 according to the present embodiment includes cooling pin rows 4. The cooling pin row 4 comprises a plurality of cooling pins 3 arranged at equal intervals in the flow path width direction orthogonal to the main flow direction, which connects the upstream and downstream sides of the flow path R and the extension direction. In addition, a plurality of cooling pin rows 4 are provided and arranged in the main flow direction. Furthermore, in at least one of the plurality of cooling pin rows 4, the flow path resistance of the end-section gap region Sa is lower than the flow path resistance of the flow path width direction separation region Sb.Furthermore, in two cooling pin rows 4 that are adjacent to each other in the main flow direction, the main flow direction separation distance D3, which is the distance from the cooling pin 3 contained in the cooling pin row 4 located on the upstream side to the cooling pin 3 contained in the cooling pin row 4 located on the downstream side, is smaller than the main flow direction pin dimension D4, which is the length of the cooling pin 3 contained in the cooling pin row 4 located on the downstream side in the main flow direction.

[0048] Since, according to the cooling device 1 of the present embodiment, the flow path resistance of the end-section gap region Sa is lower than the flow path resistance of the flow path width direction separation region Sb, the flow velocity of the cooling medium Y flowing through the gap between the cooling pin 3, located at the end section in the flow path width direction, and the inner wall surface Ra of the flow path R, is higher than the flow velocity of the cooling medium Y flowing through the gap between the cooling pins 3. Therefore, the pressure of the gap between the cooling pin 3, located at the end section in the flow path width direction, and the inner wall surface Ra of the flow path R is reduced, and the cooling medium Y, which tends to flow along the main flow direction, is attracted towards the inner wall surface Ra and flows in the direction inclined with respect to the main flow direction in the flow path R.Furthermore, the cooling medium Y, flowing in a direction inclined relative to the main flow direction, is guided to the connecting surface 3c, which links the upstream curved surface section 3a with a relatively large radius of curvature and the downstream curved surface section 3b with a relatively small radius of curvature. Therefore, it is likely that the cooling medium Y will flow in a direction inclined relative to the main flow direction within the flow path R. Accordingly, the force causing the cooling medium Y to flow in the direction inclined relative to the main flow is increased, thus suppressing any significant change in the direction of motion of the cooling medium Y until it flows through a multitude of cooling pins 3 in the main flow direction.Therefore, according to the present embodiment, the cooling device 1 can suppress frequent and significant changes in the flow direction of the cooling medium Y. Furthermore, this makes it possible to reduce the pressure loss in the flow path R of the cooling medium Y in the cooling device, which has a large number of such cooling pins 3.

[0049] Furthermore, in the cooling device 1 according to the present embodiment, the cooling pins 3 contained in the upstream cooling pin row 4 and the cooling pins 3 contained in the downstream cooling pin row 4 are arranged in an offset pattern in two cooling pin rows 4 which are adjacent to each other in the main flow direction.

[0050] According to the cooling device 1 of the present embodiment, the flow path is also continuous in the direction inclined with respect to the main flow direction. Therefore, it is likely that the cooling medium Y flows in the direction inclined with respect to the main flow direction, and it is possible to reduce the pressure loss compared to a case in which the cooling pins 3 are arranged in a grid pattern.

[0051] Furthermore, in the cooling device 1 according to the present embodiment, each cooling pin 3 has the first connecting surface 3d, which represents the connecting surface 3c that connects the upstream curved surface section 3a and the downstream curved surface section 3b on one side in the flow path width direction, and the second connecting surface 3e, which represents the connecting surface 3c that connects the upstream curved surface section 3a and the downstream curved surface section 3b on the other side in the flow path width direction.Furthermore, the first connecting surface 3d and the second connecting surface 3e represent smooth surfaces without any curved section and are closer to each other in the flow path width direction if the first connecting surface 3d and the second connecting surface 3e extend to the downstream curved surface section 3b.

[0052] According to the cooling device 1 of the present embodiment, the first connecting surface 3d and the second connecting surface 3e can guide the cooling medium Y in a direction inclined with respect to the main flow direction. Therefore, it is likely that the cooling medium Y will flow in a direction inclined with respect to the main flow direction, and it is possible to reduce the pressure loss compared to a case in which the cooling pins 3 are arranged in a grid pattern. (Second embodiment)

[0053] Next, a second embodiment of the present invention will be described with reference to the Fig. 11 to Fig. 13 described. In addition, the description of the present embodiment omits or simplifies the description of the same sections as that of the first embodiment.

[0054] Fig. Figure 11 is a schematic top view showing a schematic configuration of a cooling device 1A according to the present embodiment. As shown in Fig. As shown in Figure 11, the cooling device 1A according to the present embodiment is divided into three regions (a first region A1, a second region A2, and a third region A3) in the main flow direction. The first region A1 is located on the upstream side, below the first region A1, the second region A2, and the third region A3. The second region A2 is located between the first region A1 and the third region A3. The third region A3 is located on the downstream side, below the first region A1, the second region A2, and the third region A3.

[0055] The cooling pins 3, which are located in the second area A2, have the same shape as the cooling pins 3 in the first embodiment and are arranged in the same way. Fig. Figure 12 is a schematic view showing the corresponding shape and arrangement of the cooling pins 3 located in the first area A1. As in Fig. As shown in Figure 12, a cooling pin 3 located in the first region A1 has a larger center distance Da than a cooling pin 3 located in the second region A2. However, the radius of curvature R1 of the cooling pin 3 located in the first region A1 is equal to the radius of curvature R1 of the cooling pin 3 located in the second region A2, and the radius of curvature R2 of the cooling pin 3 located in the first region A1 is equal to the radius of curvature R2 of the cooling pin 3 located in the second region A2.

[0056] Furthermore, the flow path width direction separation distance D2 in the first region A1 is greater than the flow path width direction separation distance D2 in the second region A2, and the main flow direction separation distance D3 in the first region A1 is greater than the main flow direction separation distance D3 in the second region A2. That is, the flow path width direction separation distance D2 in the first region A1 is greater than the flow path width direction separation distance D2 in the second region A2. Additionally, the main flow direction separation distance D3 in the first region A1 is greater than the main flow direction separation distance D3 in the second region A2.

[0057] In the first area A1, the installation density of the cooling pins 3 is lower than in the second area A2. Therefore, the pressure drop is lower in the first area A1 than in the second area A2. However, the thermal resistance is higher in the first area A1 than in the second area A2. This means that the first area A1 represents an area where reducing the pressure drop is prioritized over reducing the thermal resistance, compared to the second area A2.

[0058] In contrast, in the first region A1, the center distance Da of the cooling pin 3 is larger than in the second region A2. Therefore, the cooling medium Y can be guided in the direction that is inclined with respect to the main flow direction, as in the second region A2.

[0059] Fig. Figure 13 is a schematic view showing the shape and arrangement of the cooling pins 3 located in the third area A3. As in Fig. As shown in Figure 13, a cooling pin 3 located in the third region A3 has a smaller center distance Da than a cooling pin 3 located in the second region A2. However, the radius of curvature R1 of a cooling pin 3 located in the third region A3 is equal to the radius of curvature R1 of a cooling pin 3 located in the second region A2, and the radius of curvature R2 of a cooling pin 3 located in the third region A3 is equal to the radius of curvature R2 of a cooling pin 3 located in the second region A2.

[0060] Furthermore, the flow path width direction separation distance D2 in the third region A3 is smaller than the flow path width direction separation distance D2 in the second region A2, and the main flow direction separation distance D3 in the third region A3 is smaller than the main flow direction separation distance D3 in the second region A2. That is, the flow path width direction separation distance D2 in the third region A3 is smaller than the flow path width direction separation distance D2 in the second region A2. Moreover, the main flow direction separation distance D3 in the third region A3 is smaller than the main flow direction separation distance D3 in the second region A2.

[0061] In the third area A3, the installation density of the cooling pins is higher than in the second area A2. Therefore, the thermal resistance in the third area A3 is lower than in the second area A2. Conversely, however, the pressure drop in the third area A3 is lower than in the second area A2. This means that the third area A3 represents an area where reducing thermal resistance is prioritized over reducing pressure drop, compared to the second area A2.

[0062] In the third region A3, the center-to-center distance Da of a cooling pin 3 is also smaller than that in the second region A2. However, since the cooling pins 3 are closely spaced, the cooling medium Y can be guided in the direction that is inclined with respect to the main flow direction, as in the second region A2.

[0063] In the cooling device 1A according to the present embodiment, the center distance Da of a cooling pin 3 also decreases stepwise from the first region A1 to the third region A3. Furthermore, in the cooling device 1A according to the present embodiment, the flow path width direction separation distance D2 and the main flow direction separation distance D3 also decrease stepwise from the first region A1 to the third region A3.

[0064] The cooling device 1A with the configuration described above, according to the present embodiment, comprises cooling pins 3 having different center distances Da, which are distances from the centers of the upstream curved surface sections 3a to the centers of the downstream curved surface sections 3b. Furthermore, the cooling pins 3 with the different center distances Da have the same radius of curvature R1 and the same radius of curvature R2. In the cooling device 1A with the configuration described above, according to the present embodiment, it is therefore possible to adjust the pressure drop and the thermal resistance, while allowing the cooling medium Y to flow linearly in the direction inclined with respect to the main flow direction.

[0065] Furthermore, in the cooling device 1A according to the present embodiment, the center-to-center distances Da of a plurality of cooling pins 3, which are arranged in the main flow direction, decrease stepwise towards the downstream side in the main flow direction. That is, since the temperature of the cooling medium Y is lower on the upstream side than on the downstream side, the reduction of the pressure drop is prioritized over the reduction of the thermal resistance. Moreover, since the temperature of the cooling medium Y is higher on the downstream side than on the upstream side, the reduction of the thermal resistance is prioritized over the reduction of the pressure drop.In the cooling device 1A according to the present embodiment, it is therefore possible to reduce the pressure loss as a whole and to unify the cooling efficiency of the heat-generating component X in the main flow direction with the cooling pins 3, compared to a case in which the cooling pin with a circular cross-section is used.

[0066] Furthermore, in the present embodiment, the center distance Da of the cooling pin 3 decreases stepwise towards the downstream side in the main flow direction. However, the present invention is not limited to this configuration, and the center distance Da of the cooling pin 3 can also decrease continuously towards the downstream side in the main flow direction.

[0067] Furthermore, in the cooling device 1A according to the present embodiment, the main flow direction separation distance D3 varies depending on its position in the main flow direction. In the cooling device 1A with the configuration described above according to the present embodiment, it is therefore possible to adjust the pressure drop and the thermal resistance, while allowing the cooling medium Y to flow linearly in the direction inclined with respect to the main flow direction.

[0068] Furthermore, in the cooling device 1A according to the present embodiment, the main flow direction separation distance D3 decreases stepwise towards the downstream side in the main flow direction. This means that, since the temperature of the cooling medium Y is lower on the upstream side than on the downstream side, reducing the pressure drop is prioritized over reducing the thermal resistance on the upstream side. Moreover, since the temperature of the cooling medium Y is higher on the downstream side than on the upstream side, reducing the thermal resistance is prioritized over reducing the pressure drop on the downstream side.In the cooling device 1A according to the present embodiment, it is therefore possible to reduce the pressure loss as a whole and to unify the cooling efficiency of the heat-generating component X in the main flow direction with the cooling pins 3, compared to a case in which the cooling pin with a circular cross-section is used.

[0069] Furthermore, in the present embodiment, the main flow direction separation distance D3 decreases stepwise towards the downstream side in the main flow direction. However, the present invention is not limited to this configuration, and the main flow direction separation distance D3 can also decrease continuously towards the downstream side in the main flow direction.

[0070] Furthermore, the main flow direction separation distance D3 can also decrease gradually or continuously towards the heat-generating component X to be cooled. In this case, the thermal resistance is reduced in a region near the heat-generating component X, and the heat-generating component X can be cooled efficiently. (Third embodiment)

[0071] Next, a third embodiment of the present invention will be described with reference to Fig. 14 described. In addition, the description of the present embodiment omits or simplifies the description of the same sections as that of the first embodiment.

[0072] Fig. Figure 14 is a schematic, partially enlarged cross-sectional view showing a semiconductor device 100 according to the present embodiment. The semiconductor device 100 according to the present embodiment is, for example, a power conversion device that performs power conversion between a battery and a motor. The semiconductor device 100 further comprises a cooling device 1, a resin housing 10, an insulating circuit substrate 11, a semiconductor chip 12 (semiconductor element), an external connection 13, a conductor frame 14, a conductor wire 15, and a sealing material 16.

[0073] The cooling device 1 here represents the cooling device 1 according to the first embodiment. Furthermore, the semiconductor device 100 according to the present embodiment can also comprise the cooling device 1A according to the second embodiment instead of the cooling device 1. The cooling device 1 cools the semiconductor chip 12 and the like. The cooling device 1 collects heat that is transferred from the semiconductor chip 12 through the insulating circuit substrate 11 and the like via a coolant. The cooling device 1 acts as a base element that supports the insulating circuit substrate 11 and the like.

[0074] The resin housing 10 is further bonded to the cooling device 1, with an adhesive layer 18 positioned between them. The resin housing 10 also holds a busbar 17. In addition, the resin housing 10 has an opening section through which the semiconductor chip 12 and the like are received. As in Fig. As shown in Figure 14, the busbar 17 is held in a state in which a connecting section with the conductor frame 14 is exposed towards the inside of the opening section.

[0075] The insulating circuit substrate 11 also comprises an insulating ceramic substrate and metal layers formed on both surfaces of the insulating ceramic substrate. The metal layer formed on the front side of the insulating ceramic substrate is electrically connected to the semiconductor chip 12 and forms a section of a conductive circuit. The metal layer formed on the back side of the insulating ceramic substrate further forms a section of a heat transfer path that transfers heat from the semiconductor chip 12 and the like to the cooling device 1.

[0076] The insulating ceramic substrate can consist, for example, of aluminum oxide (Al₂O₃), aluminum nitride (AlN), or silicon-based ceramic (Si₃Ni₄). Furthermore, the metal layer can consist of, for example, copper (Cu) or aluminum (Al).

[0077] The semiconductor chip 12 is, for example, a chip on which an insulated-gate bipolar transistor (IGBT), a SiC MOSFET, or the like is formed. The semiconductor chip 12 is mounted on the insulating circuit substrate 11. Furthermore, in the present embodiment, one semiconductor chip 12 is mounted on an insulating circuit substrate 11. In addition, several semiconductor chips 12 can also be mounted on an insulating circuit substrate 11. Moreover, the semiconductor chip 12 can also be formed using a silicon (Si) semiconductor. Furthermore, the semiconductor chip 12 can likewise be formed using a wide-bandgap semiconductor, such as a silicon carbide (SiC) semiconductor or a gallium nitride (GaN) semiconductor.

[0078] The external connection 13 is held in relation to the resin housing 10. Several external connections 13 are provided, each of which is connected to the semiconductor chip 12 via the conductor wire 15. The semiconductor chip 12 is also controlled externally via the external connections 13.

[0079] The conductor frame 14 is a plate-shaped conductive element that connects the semiconductor chip 12 and the busbar 17. For example, two conductor frames 14 are connected to one semiconductor chip 12. Furthermore, the conductor frame 14 is a conductive element through which a large amount of current flows, compared to the conductor wire 15, through which a control signal flows. The conductor frame 14 is connected to the semiconductor chip 12 and the busbar 17. However, the conductor frame 14 can also connect the insulating circuit substrate 11 and the busbar 17.

[0080] The conductor wire 15 is a conductive element that connects the semiconductor chip 12 and the external connection 13. More precisely, the semiconductor chip 12 and the external connection 13 are electrically connected to each other by a process called wire bonding.

[0081] The interior of the opening section of the resin housing 10 is subsequently filled with the sealing material 16. The sealing material 16 covers the insulating circuit substrate 11, the semiconductor chip 12, and the like, to prevent them from coming into contact with air and the like. The sealing material 16 can, for example, consist of silicone gel.

[0082] Furthermore, in the semiconductor device 100 according to the present embodiment, solder 20, which is a soldering material, is provided at various locations. In particular, as shown in Fig. Figure 14 shows that solder 20 is provided at the connection section between the conductor frame 14 and the busbar 17. This means that the conductor frame 14 and the busbar 17 are connected to each other by solder 20. Furthermore, solder 20 is provided at a connection section between the conductor frame 14 and the semiconductor chip 12. This means that the conductor frame 14 and the semiconductor chip 12 are also connected to each other by solder 20.

[0083] Furthermore, the solder 20 is provided between the semiconductor chip 12 and the insulating circuit substrate 11. That is, the semiconductor chip 12 and the insulating circuit substrate 11 are connected to each other by the solder 20. In addition, the solder 20 is also provided between the insulating circuit substrate 11 and the cooling device 1. That is, the insulating circuit substrate 11 and the cooling device 1 are likewise connected to each other by the solder 20.

[0084] Furthermore, the conductor wire 15 and the external connection 13 are also connected to each other by the solder, which in Fig. Figure 14 is not shown. Furthermore, the conductor wire 15 and the semiconductor chip 12 are also connected to each other by the solder.

[0085] The semiconductor device 100 according to the present embodiment comprises the cooling device 1 according to the first embodiment. This makes it possible to reduce the pressure loss in the flow path R of the cooling medium Y.

[0086] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings; however, it is understood that the present invention is not limited to the embodiments described above. The various shapes and combinations of each component shown in the embodiments described above are merely examples and can be modified in various ways based on design requirements and the like, without departing from the core of the present invention.

[0087] For example, the embodiments described above describe a configuration in which the cooling pin rows 4 have the same number of cooling pins 3. However, the present invention is not limited to this configuration. That is to say, in the present invention, the cooling pin rows 4 can also have different numbers of cooling pins 3.

[0088] Fig. Figure 15 is a schematic top view showing a modification example of the cooling pin rows in the present invention. For example, as shown in Fig. Figure 15 shows a cooling pin row 4, which has one more cooling pin 3 by comparison, and a cooling pin row 4, which has one less cooling pin 3 by comparison, arranged alternately in the main flow direction. (Fourth embodiment)

[0089] Next, a fourth embodiment of the present invention will be described with reference to Fig. 16. In addition, the description of the present embodiment omits or simplifies the description of the same sections as that of the first embodiment.

[0090] Fig. Figure 16 is a schematic view showing the shape and arrangement of the cooling pins of the cooling device according to the present embodiment. As in Fig. As shown in Figure 16, in the present embodiment the radius of curvature R1 and the radius of curvature R2 of the cooling pin 3 vary depending on the position of the cooling pin 3 in the main flow direction. For example, even in the same region (the first region A1, the second region A2, or the third region A3) shown in Figure 16, the radii of curvature R1 and R2 of curvature R2 of the cooling pin 3 vary depending on the position of the cooling pin 3 in the main flow direction. Fig. 11 is defined, the radius of curvature R1 and the radius of curvature R2 of the cooling pin 3 depend on the position of the cooling pin 3 in the main flow direction.

[0091] In the present embodiment, the radius of curvature R1 of the cooling pin 3, which is located on the upstream side in the main flow direction, is smaller than the radius of curvature R1 of the cooling pin 3, which is located on the downstream side in the main flow direction. Fig. 16 Here, the radius of curvature R1 of the cooling pin 3, which is contained in the cooling pin row 4 located on the most upstream side, is smaller than the radius of curvature R1 of the cooling pin 3, which is contained in the middle of the cooling pin row 4 in the main flow direction, and the radius of curvature R1 of the cooling pin 3, which is contained in the cooling pin row 4 located on the most downstream side in the main flow direction. Furthermore, in Fig. 16 the radius of curvature R1 of the cooling pin 3, which is contained in the cooling pin row 4, which is located on the furthest downstream side, is greater than the radius of curvature R1 of the cooling pin 3, which is contained in the cooling pin row 4 in the middle in the main flow direction, and the radius of curvature R1 of the cooling pin 3, which is contained in the cooling pin row 4, which is located on the furthest upstream side in the main flow direction.

[0092] Furthermore, in the present embodiment, the radius of curvature R2 of the cooling pin 3, which is located on the upstream side in the main flow direction, is smaller than the radius of curvature R2 of the cooling pin 3, which is located on the downstream side in the main flow direction. Fig. 16 Here, the radius of curvature R2 of the cooling pin 3, which is contained in the cooling pin row 4 located on the most upstream side, is smaller than the radius of curvature R2 of the cooling pin 3, which is contained in the middle of the cooling pin row 4 in the main flow direction, and the radius of curvature R2 of the cooling pin 3, which is contained in the cooling pin row 4 located on the most downstream side in the main flow direction. Furthermore, in Fig. 16 the radius of curvature R2 of the cooling pin 3, which is contained in the cooling pin row 4, which is located on the furthest downstream side, is greater than the radius of curvature R2 of the cooling pin 3, which is contained in the cooling pin row 4 in the middle in the main flow direction, and the radius of curvature R2 of the cooling pin 3, which is contained in the cooling pin row 4, which is located on the furthest upstream side in the main flow direction.

[0093] Furthermore, in Fig. 16. The arrangement of the cooling pins 3 (for example, the distance interval between the centers O1) is the same in each cooling pin row 4. In this case, the separation distance D2 in the flow path width direction is in the cooling pin row 4, which is located in Fig. 16, located on the most upstream side, is increased, and the pressure loss in the cooling pin row 4, which is located on the most upstream side, is reduced. Accordingly, this can also reduce the pressure loss of the entire cooling device.

[0094] Furthermore, in the present embodiment, the surface area of ​​the cooling pin 3, which is contained in the cooling pin row 4 located on the most upstream side, is reduced, thus decreasing the flow velocity in the cooling pin row 4 located on the most upstream side. However, the temperature of the cooling medium Y decreases as the position moves towards the upstream side. Accordingly, in the present embodiment, the cooling capacity is balanced in the main flow direction.

[0095] Furthermore, in the present embodiment, the cooling pins 3, which are contained in different cooling pin rows 4, can have different center-to-center distances Da. However, in the present embodiment, the cooling pins 3, which are contained in different cooling pin rows 4, can also have the same center-to-center distance Da. (Fifth embodiment)

[0096] Next, a fifth embodiment of the present invention will be described with reference to Fig. 17 described. In addition, the description of the present embodiment omits or simplifies the description of the same sections as that of the fourth embodiment.

[0097] Fig. Figure 17 is a schematic view showing the shape and arrangement of cooling pins of a cooling device according to the present embodiment. As in Fig. As shown in Figure 17, in the present embodiment the radius of curvature R1 and the radius of curvature R2 of a cooling pin 3 vary depending on the position of the cooling pin 3 in the main flow direction as in the fourth embodiment.

[0098] In the present embodiment, the radius of curvature R1 of a cooling pin 3 located on the most upstream side in the main flow direction is also larger than the radius of curvature R1 of a cooling pin 3 located in the middle in the main flow direction, and the radius of curvature R1 of a cooling pin 3 located on the most downstream side in the main flow direction. In particular, in Fig. 17 the radius of curvature R1 of a cooling pin 3 contained in the cooling pin row 4 located on the most upstream side, is larger than the radius of curvature R1 of a cooling pin 3 contained in the middle of the cooling pin row 4 in the main flow direction, and the radius of curvature R1 of a cooling pin 3 contained in the cooling pin row 4 located on the most downstream side in the main flow direction. Furthermore, in Fig. 17 The radius of curvature R1 of a cooling pin 3 contained in the cooling pin row 4 located on the furthest downstream side is larger than the radius of curvature R1 of a cooling pin 3 contained in the cooling pin row 4 in the middle in the main flow direction. That is, in Fig. 17 a cooling pin 3 in the cooling pin row 4 has the smallest radius of curvature R1 in the middle in the main flow direction.

[0099] At the same time, in the present embodiment, the radius of curvature R2 of a cooling pin 3 located on the most upstream side in the main flow direction is larger than the radius of curvature R2 of a cooling pin 3 located in the middle in the main flow direction, and the radius of curvature R2 of a cooling pin 3 located on the most downstream side in the main flow direction. In particular, in Fig. 17 the radius of curvature R2 of a cooling pin 3 contained in the cooling pin row 4 located on the most upstream side, is larger than the radius of curvature R2 of a cooling pin 3 contained in the middle of the cooling pin row 4 in the main flow direction, and the radius of curvature R2 of a cooling pin 3 contained in the cooling pin row 4 located on the most downstream side in the main flow direction. In addition, in Fig. 17 The radius of curvature R2 of a cooling pin 3 contained in the cooling pin row 4 located on the furthest downstream side is larger than the radius of curvature R2 of a cooling pin 3 contained in the cooling pin row 4 in the middle in the main flow direction. That is, in Fig. 17 has a cooling pin 3, which is contained in the middle of the cooling pin row 4 in the main flow direction, with the smallest radius of curvature R2.

[0100] Furthermore, in Fig. 17 the arrangement spacing (for example, the distance interval between the centers O1) of the cooling pins 3 in each cooling pin row 4 is the same. In this case, the flow path width direction separation distance D2 in the cooling pin row 4, which is located in Fig. The flow velocity in cooling pin row 4, located on the most upstream side, is the smallest at 17, and increases. Furthermore, the surface area of ​​a cooling pin 3, located in cooling pin row 4 on the most upstream side, increases. Consequently, the cooling performance at the location of cooling pin row 4 on the most upstream side is improved. Therefore, it is possible to cool the heat-generating component X, located on the most upstream side, even more effectively.

[0101] Furthermore, for example, the radius of curvature R1 of a cooling pin 3 located in the cooling pin row 4 at the position where the heat-generating component X is located can also be larger than the radius of curvature R1 of the cooling pin 3 located in other cooling pin rows 4, while maintaining the arrangement spacing. Similarly, the radius of curvature R2 of a cooling pin 3 located in the cooling pin row 4 at the position where the heat-generating component X is located can also be larger than the radius of curvature R2 of the cooling pin 3 located in other cooling pin rows 4, while maintaining the arrangement spacing.

[0102] This means that, of the cooling pin row 4 located on the upstream side and the cooling pin row 4 located on the downstream side, at least one of the radii of curvature R1 and the radii of curvature R2 of all cooling pins 3 contained in the cooling pin row 4 located closer to the heat-generating component X can be larger than the corresponding radii of curvature of the cooling pins 3 contained in the cooling pin row 4 located further away from the heat-generating component X. In this case, it is possible to locally improve the cooling performance at the location where the heat-generating component X is situated.

[0103] Furthermore, in the present embodiment, the cooling pins 3, which are contained in different cooling pin rows 4, can have different center-to-center distances Da. However, in the present embodiment, the cooling pins 3, which are contained in different cooling pin rows 4, can also have the same center-to-center distance Da.

[0104] The fourth and fifth embodiments of the present invention have been described above with reference to the accompanying drawings. It is understood, however, that the present invention is not limited to the embodiments described above. The various forms and combinations of each component shown in the embodiments described above are merely examples and can be modified in various ways based on design requirements and the like, without departing from the core of the present invention.

[0105] For example, in the embodiments described above, as in Fig. As shown in Figure 18, a cooling pin 3 can also be used, in which a connecting surface 3c, which connects the upstream curved surface section 3a and the downstream curved surface section 3b, is curved and recessed.

[0106] Furthermore, the embodiments described above can also be described, for example, by means of the following supplementary remarks. (Supplementary Note 1)

[0107] A cooling device comprising: a multitude of cooling pins designed to extend in the same direction in a flow path of a cooling medium, wherein in a cross-section orthogonal to a direction of extension of the cooling pins each of the cooling pins has: an upstream curved surface section located on the most upstream side of the flow path and formed by an arc with a first radius of curvature, a downstream curved surface section located on the furthest downstream side of the flow path and formed by an arc with a second radius of curvature smaller than the first radius of curvature, and a connecting surface that connects the upstream curved surface section and the downstream curved surface section, wherein a plurality of cooling pin rows are provided and arranged in a main flow direction, each of which comprises the plurality of cooling pins arranged at equal intervals in a flow path width direction orthogonal to the main flow direction connecting an upstream side and a downstream side of the flow path and the extension direction, wherein in at least one of the plurality of cooling pin rows an end-section gap region, which is a region between the cooling pin located at an outermost end section in the flow path width direction and an inner wall surface of the flow path, has a lower flow path resistance than a flow path width direction separation region, which is a region between the cooling pins that are adjacent to each other in the flow path width direction, and wherein in two cooling pin rows adjacent to each other in the main flow direction, a main flow direction separation distance, which is a distance from the cooling pin contained in the cooling pin row located on the upstream side to the cooling pin contained in the cooling pin row located on the downstream side, is less than a main flow direction pin dimension, which is a length of the cooling pin contained in the cooling pin row located on the downstream side in the main flow direction. (Supplementary Note 2)

[0108] The cooling device according to supplementary note 1, wherein in the two cooling pin rows adjacent to each other in the main flow direction, the cooling pins contained in the cooling pin row located on the upstream side and the cooling pins contained in the cooling pin row located on the downstream side are arranged in an offset pattern. (Supplementary Note 3)

[0109] The cooling device according to supplementary note 1 or 2, wherein each of the cooling pins has a first connecting surface, which is a connecting surface that connects the upstream curved surface section and the downstream curved surface section on one side in the flow path width direction, and a second connecting surface, which is a connecting surface that connects the upstream curved surface section and the downstream curved surface section on the other side in the flow path width direction, and The first connecting surface and the second connecting surface are smooth surfaces without any curved section and are closer to each other in the flow path width direction when the first connecting surface and the second connecting surface extend to the downstream curved surface section. (Supplementary Note 4)

[0110] The cooling device according to one of the supplementary notes 1 to 3, wherein the cooling pins have different center distances, which are distances from the centers of the upstream curved surface sections to the centers of the downstream curved surface sections, and the cooling pins having different center distances have the same first radius of curvature and the same second radius of curvature. (Supplementary Note 5)

[0111] The cooling device according to supplementary note 4, wherein the center-to-center spacing of a plurality of cooling pins arranged in the main flow direction decreases stepwise or continuously towards the downstream side in the main flow direction. (Supplementary Note 6)

[0112] The cooling device according to one of the supplementary notes 1 to 5, where the main flow direction separation distance varies depending on a position in the main flow direction. (Supplementary Note 7)

[0113] The cooling device according to supplementary note 6, wherein the main flow direction separation distance decreases gradually or continuously towards the downstream side in the main flow direction. (Supplementary Note 8)

[0114] The cooling device according to supplementary note 6, wherein the main flow direction separation distance decreases gradually or continuously as the cooling pins are positioned closer to a heat source to be cooled. (Supplementary Note 9)

[0115] A semiconductor device comprising: the cooling device according to any of Supplementary Notes 1 to 8; and a semiconductor element configured to be cooled by the cooling device. (Supplementary Note 10)

[0116] The cooling device according to supplementary note 1, wherein the cooling pin included in the cooling pin row located on the upstream side differs from the cooling pin included in the cooling pin row located on the downstream side in at least one of the first radius of curvature and the second radius of curvature. (Supplementary Note 11)

[0117] The cooling device according to supplementary note 10, wherein at least one of the first radius of curvature and the second radius of curvature of the cooling pin contained in the cooling pin row located on the upstream side is smaller than the first radius of curvature and the second radius of curvature of the cooling pin contained in the cooling pin row located on the downstream side. (Supplementary Note 12)

[0118] The cooling device according to supplementary note 10, wherein, of the cooling pin array located on the upstream side and the cooling pin array located on the downstream side, at least one of the first radius of curvature and the second radius of curvature of all cooling pins contained in the cooling pin array located closer to a heat-generating component is larger than the first radius of curvature and the second radius of curvature of the cooling pins contained in the cooling pin array located further away from the heat-generating component. Reference symbol list 1 cooling device 1A Cooling device 2 cases 3 Cooling pen 3a Upstream curved surface section 3b Downstream curved surface section 3c connection surface 3D First Connection Surface 3e Second connection surface 4 cooling pin row 100 semiconductor devices A1 First Area A2 Second Area A3 Third Area D1 End section gap distance D2 Flow path width direction separation distance D3 Main flow direction separation distance D4 Main flow direction pin dimension Since center distance Sa End section gap area Sb Flow path width direction separation zone L central axis O1 Mitte O2 Mitte R Flow path R1 radius of curvature R2 radius of curvature Ra Interior wall surface X Heat-generating component Y Cooling medium Z1 First separating vertebra Z2 Second separating vertebra QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2023 / 019536

[0002] JP 6616264

[0004]

Claims

[1] A cooling device comprising: a multitude of cooling pins designed to extend in the same direction in a flow path of a cooling medium, wherein in a cross-section orthogonal to a direction of extension of the cooling pins each of the cooling pins has: an upstream curved surface section located on the most upstream side of the flow path and formed by an arc with a first radius of curvature, a downstream curved surface section located on the furthest downstream side of the flow path and formed by an arc with a second radius of curvature smaller than the first radius of curvature, and a connecting surface that connects the upstream curved surface section and the downstream curved surface section, wherein a plurality of cooling pin rows are provided and arranged in a main flow direction, each of which comprises the plurality of cooling pins arranged at equal intervals in a flow path width direction orthogonal to the main flow direction connecting an upstream side and a downstream side of the flow path and the extension direction, wherein in at least one of the plurality of cooling pin rows an end-section gap region, which is a region between the cooling pin located at an outermost end section in the flow path width direction and an inner wall surface of the flow path, has a lower flow path resistance than a flow path width direction separation region, which is a region between the cooling pins that are adjacent to each other in the flow path width direction, and wherein in two cooling pin rows adjacent to each other in the main flow direction, a main flow direction separation distance, which is a distance from the cooling pin contained in the cooling pin row located on the upstream side to the cooling pin contained in the cooling pin row located on the downstream side, is less than a main flow direction pin dimension, which is a length of the cooling pin contained in the cooling pin row located on the downstream side in the main flow direction. [2] The cooling device according to claim 1, wherein in the two cooling pin rows adjacent to each other in the main flow direction, the cooling pins contained in the cooling pin row located on the upstream side and the cooling pins contained in the cooling pin row located on the downstream side are arranged in an offset pattern. [3] The cooling device according to claim 1 or 2, wherein each of the cooling pins has a first connecting surface, which is a connecting surface that connects the upstream curved surface section and the downstream curved surface section on one side in the flow path width direction, and a second connecting surface, which is a connecting surface that connects the upstream curved surface section and the downstream curved surface section on the other side in the flow path width direction, and The first connecting surface and the second connecting surface are smooth surfaces without any curved section and are closer together in the flow path width direction when the first connecting surface and the second connecting surface extend to the downstream curved surface section. [4] The cooling device according to claim 1 or 2, wherein the cooling pins have different center distances, which are distances from the centers of the upstream curved surface sections to the centers of the downstream curved surface sections, and the cooling pins having different center distances have the same first radius of curvature and the same second radius of curvature. [5] The cooling device according to claim 4, wherein the center distances of a plurality of cooling pins arranged in the main flow direction decrease stepwise or continuously towards the downstream side in the main flow direction. [6] The cooling device according to claim 1 or 2, wherein the main flow direction separation distance varies depending on a position in the main flow direction. [7] The cooling device according to claim 6, wherein the main flow direction separation distance decreases stepwise or continuously towards the downstream side in the main flow direction. [8] The cooling device according to claim 6, wherein the main flow direction separation distance decreases stepwise or continuously as the cooling pins are arranged closer to a heat source to be cooled. [9] A semiconductor device comprising: the cooling device according to claim 1 or 2; and a semiconductor element configured to be cooled by the cooling device. [10] The cooling device according to claim 1, wherein the cooling pin included in the cooling pin row located on the upstream side differs from the cooling pin included in the cooling pin row located on the downstream side in at least one of the first radius of curvature and the second radius of curvature. [11] The cooling device according to claim 10, wherein at least one of the first radius of curvature and the second radius of curvature of the cooling pin contained in the cooling pin row located on the upstream side is smaller than the first radius of curvature and the second radius of curvature of the cooling pin contained in the cooling pin row located on the downstream side. [12] The cooling device according to claim 10, wherein of the cooling pin array located on the upstream side and the cooling pin array located on the downstream side, at least one of the first radius of curvature and the second radius of curvature of all cooling pins contained in the cooling pin array located closer to a heat-generating component is larger than the first radius of curvature and the second radius of curvature of the cooling pins contained in the cooling pin array located further away from the heat-generating component.

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