ARRANGEMENT AND METHOD FOR TESTING A WAFER

DE112024003403T5Undetermined Publication Date: 2026-07-02AUSTRIAMICROSYSTEMS AG

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Patent Information

Application Number: DE112024003403
Authority / Receiving Office: DE · DE
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2024-09-24
Filing Date: 2024-09-24
Publication Date: 2026-07-02

Application Information

Patent Timeline

24 Sep 2024

Priority

24 Sep 2024

Application

DE112024003403

02 Jul 2026

Publication

DE112024003403T5

IPC: H10P74/00; H10P72/78

CPC: G01R31/2865; G01R31/2635; G01R31/2656; G01R31/311

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Technology Topics

Mechanical engineering Materials science

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Abstract

An arrangement comprising a wafer chuck and a light source is provided. The wafer chuck has a plate with a mounting surface for mounting a wafer; the plate is positioned in the beam path of the light source and is translucent. Furthermore, a method for testing a wafer using this arrangement is provided.

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Citation Information

Patent Citations

102023126104.5
DE102023126104A1

Patent Information

Abstract

Patent Citations

102023126104.5

DE102023126104A1