Composite heat dissipation mechanism

The compound heat dissipation mechanism addresses the challenge of heat management in powerful processors by utilizing liquid-cooled devices with airflow generators and heat dissipation fins to enhance cooling efficiency through staged heat transfer.

DE202026102240U1Active Publication Date: 2026-06-18COOLER MASTER CO LTD
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
COOLER MASTER CO LTD
Filing Date
2026-04-22
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

The increasing heat generated by powerful processors in electronic devices poses a challenge for effective heat dissipation, impacting device performance and lifespan, necessitating improved cooling solutions.

Method used

A compound heat dissipation mechanism comprising first and second liquid-cooled heat dissipation devices with heat-conducting flow tubes, airflow generators, heat dissipation fins, and cold plates, configured to efficiently transfer and dissipate heat from multiple heat sources through staged convection and conduction.

Benefits of technology

Enhances cooling efficiency by distributing airflow over multiple heat dissipation areas, promoting thermal conductivity and convection, and optimizing heat transfer paths, thereby improving overall heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A combined heat dissipation mechanism (100) for dissipating heat from heat sources, comprising: a first liquid-cooled heat dissipation device (200), comprising: a first heat-conducting flow tube (230) configured to receive a first cooling fluid, a first fluid drive (210) which is connected to the first heat-conducting flow tube (230) to form a first circulation flow path and which is configured to drive the first cooling fluid to circulate within the first circulation flow path, a first cooling device with: a first airflow generator (250) with a first air outlet and a first heat dissipation fin (240) which is arranged adjacent to the first air outlet of the first airflow generator (250) and configured to be thermally connected to the first heat-conducting flow tube (230), and a first heat exchange device (220) comprising: a first cold plate (224) which is thermally connected to the first heat-conducting flow tube (230) and is configured to be thermally connected to a first heat source, and a second liquid-cooled heat dissipation device (300), comprising: a second heat-conducting flow tube (330) configured to accommodate a second cooling fluid, and a second fluid drive (310) which is connected to the second heat-conducting flow tube (330) to form a second circulation flow path, and which is configured to drive the second cooling fluid to circulate within the second circulation flow path, and a second cooling device with: a second airflow generator (350) with a second air outlet, and a second heat dissipation fin (340) which is arranged adjacent to the second air outlet of the second airflow generator (350) and configured to be thermally connected to the second heat-conducting flow tube (330), and a second heat exchange device (320) with: a second cold plate (324) which is thermally connected to the second heat-conducting flow tube (330) and is configured to be thermally connected to a second heat source.
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