Masking material and deposition apparatus of metal film

Abstract

To provide a masking material capable of inhibiting a missing portion of a metal film from missing caused by residual bubbles on a surface of a substrate, and a deposition method of a metal film using the masking material.SOLUTION: A masking material includes: a mesh part 161; a mask part 162 disposed on a surface and a back of the mesh part 161 and held between an electrolyte film and a substrate; and a penetration part 163 penetrating the mask part 162 according to a prescribed pattern to expose the mesh part 161. The masking material further includes a connection passage 164 configured to connect neighboring two penetration parts 163 disposed in a part of the mask part 162 held between the electrolyte film and the mesh part 161, or a space facing an area of the substrate not forming a prescribed pattern and the penetration part 163 to circulate a plating solution.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a masking material and a metal film forming apparatus. [Background technology]

[0002] There are known inventions relating to a deposition apparatus for depositing a metal film on a substrate surface. The deposition apparatus for a metal film described in the following Patent Document 1 applies a voltage between an anode and the substrate while pressing a solid electrolyte membrane against the substrate, thereby reducing metal ions contained inside the solid electrolyte membrane to partially deposit a metal film on the substrate surface.

[0003] The solid electrolyte membrane is formed with a recess that is recessed into the contact surface that contacts the film-forming region so that the solid electrolyte membrane contacts a film-forming region of the surface of the substrate where a metal film is formed, and is not in contact with the surface other than the film-forming region.

[0004] With this configuration, when the solid electrolyte membrane is pressed against the substrate, the contact surface of the solid electrolyte membrane is in contact with the film-forming region of the substrate, and at the same time, the recess of the solid electrolyte membrane faces the surface other than the film-forming region (i.e., the non-film-forming region of the substrate), and the solid electrolyte membrane is in a non-contact state in the non-film-forming region.

[0005] In this state, when a voltage is applied between the anode and cathode (substrate), the metal ions contained in the solid electrolyte membrane migrate to the film-forming region (surface) of the substrate in contact with the solid electrolyte membrane and are reduced in the film-forming region of the substrate, causing the metal derived from the metal ions to precipitate. Meanwhile, in the non-film-forming region of the substrate facing the recessed portion of the solid electrolyte membrane, no metal is precipitated because the solid electrolyte membrane is not in contact with the non-film-forming region of the substrate. As a result, a metal coating with prominent edges can be formed in the film-forming region of the substrate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-169398 A Summary of the Invention [Problem to be solved by the invention]

[0007] In the above-mentioned solid-phase electrodeposition (SED) method, a masking material to be placed between the electrolyte membrane and the substrate, and a film forming device using the masking material for forming a metal film are being developed. However, when a masking material is placed between the electrolyte membrane and the substrate and an electrolytic solution is supplied to the surface of the substrate through the electrolyte membrane and the masking material, there is a risk that air in the penetration part will remain on the surface of the substrate as bubbles during the process in which the penetration part of the masking material is filled with plating solution. The plating solution will not come into contact with the part of the substrate surface where the bubbles remain, and there is a risk of the metal film being damaged.

[0008] The present disclosure provides a masking material capable of suppressing damage to a metal coating caused by air bubbles remaining on the surface of a substrate, and a film forming apparatus for forming a metal coating using the masking material. [Means for solving the problem]

[0009] One aspect of the present disclosure is a masking material that is disposed between an electrolyte membrane and a substrate and is used to form a metal coating of a predetermined pattern on a surface of the substrate by electrolytic plating, the masking material comprising: a mesh portion that allows a plating solution for the electrolytic plating to pass through; masking portions provided on the front and back of the mesh portion and sandwiched between the electrolyte membrane and the substrate; a penetrating portion that penetrates the masking portion according to the predetermined pattern to expose the mesh portion; and a connecting path that is provided in a part of the masking portion sandwiched between the electrolyte membrane and the mesh portion and connects two adjacent penetrating portions or a space facing a region of the substrate that does not form the predetermined pattern, thereby allowing the plating solution to flow.

[0010] Another aspect of the present disclosure is a metal film forming apparatus equipped with the masking material, the metal film forming apparatus comprising: a container in which the plating solution is contained with an opening facing the substrate covered with the electrolyte membrane; a moving mechanism that moves at least one of the container and the substrate from a state in which the container and the substrate are separated from each other to sandwich the masking material between the electrolyte membrane and the substrate; a pressure boosting mechanism that increases the pressure of the plating solution contained in the container; an anode disposed facing the electrolyte membrane inside the container; a power source that applies a voltage between the anode and the substrate; and the masking material disposed between the electrolyte membrane and the substrate. Effect of the Invention

[0011] According to each of the above aspects of the present disclosure, it is possible to provide a masking material capable of suppressing damage to a metal coating caused by air bubbles remaining on the surface of a substrate, and a film forming apparatus for forming a metal coating using the masking material. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic cross-sectional view showing an embodiment of a metal film forming apparatus according to the present disclosure. [Diagram 2] FIG. 1 is a schematic perspective view showing one embodiment of a masking material according to the present disclosure. [Diagram 3] FIG. 3 is a schematic enlarged cross-sectional view of the masking material taken along line III-III in FIG. 2 . [Figure 4] FIG. 4 is a schematic enlarged cross-sectional view of the masking material taken along line IV-IV in FIG. 2 . [Diagram 5] 3 is a schematic enlarged cross-sectional view of the masking material taken along line VV in FIG. 2. [Figure 6] FIG. 3 is a schematic enlarged cross-sectional view of the masking material taken along line VI-VI in FIG. 2 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of a masking material and a metal film forming apparatus according to the present disclosure will be described with reference to the drawings.

[0014] Fig. 1 is a schematic cross-sectional view showing an embodiment of a metal coating forming apparatus according to the present disclosure. Fig. 2 is a schematic perspective view showing an embodiment of a masking material according to the present disclosure. The metal coating forming apparatus 1 of this embodiment is an apparatus that forms a metal coating on the surface of a substrate B by solid phase electrodeposition (SED) using an electrolyte membrane 11c.

[0015] The film forming apparatus 1 includes, for example, a container 11, a moving mechanism 12, a pressure boosting mechanism 13, an anode 14, a power source 15, and a masking material 16. The film forming apparatus 1 also includes, for example, a mounting table 17 and a liquid circulation system 18.

[0016] The container 11 has, for example, a container space 11a for containing the plating solution L, an opening 11b that opens to one side of the container space 11a and faces the substrate B, an electrolyte membrane 11c that covers the opening 11b, and a frame 11d that fixes the peripheral portion of the electrolyte membrane 11c. The container 11 also has, for example, a supply flow path 11e that is connected to the container space 11a and through which the plating solution L is supplied from the liquid circulation system 18, and a discharge flow path 11f that is connected to the container space 11a and through which the plating solution L is discharged to the liquid circulation system 18. The container 11 contains the plating solution L with the opening 11b facing the substrate B covered by the electrolyte membrane 11c. The container 11 also contains and holds, for example, an anode 14 at the bottom of the container space 11a on the opposite side to the opening 11b.

[0017] The movement mechanism 12 moves at least one of the housing 11 and the substrate B from a state in which the housing 11 and the substrate B are separated from each other, and sandwiches the masking material 16 between the electrolyte membrane 11c and the substrate B, as shown in Fig. 1. In addition, the movement mechanism 12 moves at least one of the housing 11 and the substrate B from a state in which the masking material 16 is sandwiched between the electrolyte membrane 11c and the substrate B, and separates the housing 11 and the substrate B.

[0018] 1, the moving mechanism 12 is configured with a linear actuator that raises and lowers the housing 11 relative to the substrate B. The linear actuator is, for example, an electric actuator that converts the rotational motion of a motor into linear motion by a ball screw or the like. The moving mechanism 12 may also use a hydraulic or pneumatic actuator instead of the electric actuator. The configuration of the moving mechanism 12 is not particularly limited as long as it can move the housing 11 and the substrate B relatively.

[0019] 1, the pressure boosting mechanism 13 is, for example, a pump provided in the liquid supply pipe 18b of the liquid circulation system 18. The configuration of the pressure boosting mechanism 13 is not particularly limited, and may be, for example, a piston and a cylinder capable of increasing the pressure of the plating solution L contained in the container 11. By increasing the pressure of the plating solution L in the container space 11a of the container 11 by the pressure boosting mechanism 13, the masking material 16 can be pressed against the substrate B by the pressure of the plating solution L.

[0020] The anode 14 is disposed facing the electrolyte membrane 11c inside the container 11. The anode 14 is a non-porous, e.g., non-porous electrode made of the same metal as the metal coating formed on the surface of the substrate B. The anode 14 has, for example, a block or plate shape. The material of the anode 14 can be, for example, copper.

[0021] The power source 15 applies a voltage between the anode 14 and the substrate B. More specifically, for example, the positive electrode of the power source 15 is electrically connected to the anode 14, and the negative electrode of the power source 15 is electrically connected to the substrate B via the mounting table 17. When the plating solution L is contained in the container 11, a voltage is applied between the anode 14 and the substrate B by the power source 15, whereby metal ions of the anode 14 migrate to the surface of the substrate B via the plating solution L.

[0022] The plating solution L contains the metal of the metal film to be formed in an ion state. Examples of the metal include copper, nickel, gold, silver, and iron. The plating solution L is a solution in which these metals are dissolved (ionized) with an acid such as nitric acid, phosphoric acid, succinic acid, sulfuric acid, or pyrophosphoric acid. Examples of the solvent of the solution include water and alcohol. For example, when the metal is copper, the plating solution L can be an aqueous solution containing copper sulfate, copper pyrophosphate, or the like.

[0023] The electrolyte membrane 11c comes into contact with the plating solution L supplied to the accommodation space 11a of the accommodation body 11, and thereby impregnates (contains) metal ions therein together with the plating solution L. The electrolyte membrane 11c has flexibility. As a material for the electrolyte membrane 11c, for example, a fluororesin having an ion exchange function, such as Nafion (registered trademark) manufactured by DuPont, can be used. The material for the electrolyte membrane 11c is not particularly limited as long as it can transfer the metal ions of the plating solution L to the base material B. The thickness of the electrolyte membrane 11c is in the range of, for example, 20 μm to 200 μm, and may be 20 μm to 60 μm.

[0024] The masking material 16 is disposed between the electrolyte membrane 11c and the base material B, and is used to form a metal film of a predetermined pattern by electrolytic plating on the surface of the base material B. The masking material 16 has, for example, a frame body 16a and a screen mask 16b. The frame body 16a is, for example, made of a metal material or a resin material, and is a rectangular frame-shaped member having a thickness of about 1 mm to 3 mm.

[0025] The screen mask 16b has, for example, a rectangular shape corresponding to the outer shape of the frame body 16a. The peripheral portion of the screen mask 16b is fixed to, for example, one surface of the frame body 16a facing the electrolyte membrane 11c. In this way, the screen mask 16b covers the opening of the frame body 16a. A more detailed configuration of the masking material 16 of this embodiment will be described later with reference to Figs. 2 to 6.

[0026] The mounting table 17 is provided with a recess 17b on which the substrate B is placed, for example, on an end surface 17a facing the container 11. The depth of the recess 17b is, for example, shallower than the thickness of the substrate B. As a result, when the substrate B is placed in the recess 17b of the mounting table 17, a part of the substrate B protrudes toward the container 11 beyond the end surface 17a of the mounting table 17. The mounting table 17 is made of a conductive material, for example, a metal.

[0027] The substrate B is, for example, a rectangular plate-shaped member that functions as a cathode. The surface of the substrate B facing the electrolyte membrane 11c is, for example, a film-forming surface on which a metal film is formed. The material of the substrate B is not particularly limited as long as the film-forming surface functions as a cathode. The substrate B may, for example, include an insulating substrate made of resin and a film-forming surface made of a metal such as copper formed on the surface of the insulating substrate, and a predetermined pattern may be formed by removing the film-forming surface by etching after the metal film is formed. The substrate B may also be a metal plate such as aluminum or copper.

[0028] The liquid circulation system 18 includes, for example, a tank 18a for storing the plating solution L, a liquid supply pipe 18b connecting the tank 18a to a supply flow path 11e of the container 11, and a liquid discharge pipe 18c connecting the tank 18a to a discharge flow path 11f of the container 11. The liquid circulation system 18 also includes, for example, a pressure regulating valve 18d provided in the liquid discharge pipe 18c.

[0029] A pump serving as the pressure boosting mechanism 13 is provided in the middle of the liquid supply pipe 18b. By driving the pressure boosting mechanism 13, the plating solution L is pumped from the tank 18a to the supply flow path 11e of the accommodation body 11 through the liquid supply pipe 18b, and the accommodation space 11a of the accommodation body 11 is filled with the plating solution L. Furthermore, the plating solution L is discharged from the accommodation space 11a of the accommodation body 11 through the discharge flow path 11f and returned to the tank 18a through the liquid discharge pipe 18c. The pressure regulating valve 18d adjusts the pressure of the plating solution L in the accommodation space 11a of the accommodation body 11 to a predetermined pressure.

[0030] Hereinafter, the configuration of the masking material 16 of this embodiment will be described in more detail with reference to Fig. 2 to Fig. 6. Fig. 2 is a schematic perspective view of a screen mask 16b showing one embodiment of the masking material 16 according to the present disclosure. Figs. 3 to 6 are schematic enlarged cross-sectional views of the screen mask 16b taken along lines III-III and VI-VI in Fig. 2, respectively. Note that in each of Figs. 2 to 6, the enlargement rate of the masking material 16 in the thickness direction is increased more than in reality in order to facilitate understanding of the configuration of the masking material 16 of this embodiment.

[0031] The screen mask 16b includes, for example, a mesh portion 161, a mask portion 162, a through portion 163, and a connection path 164. The mesh portion 161 is a mesh-like sheet in which a plurality of wires made of a material such as a metal, such as stainless steel, or a resin, such as polyester, are crossed with each other, and has a plurality of minute openings that allow the plating solution L to pass through.

[0032] The mask portion 162 is provided, for example, on the front and back of the mesh portion 161, and is sandwiched between the electrolyte membrane 11c covering the opening 11b of the housing 11 and the base material B, as shown in Fig. 1. The mask portion 162 may be made of an elastic material such as silicone rubber. The mask portion 162 is provided, for example, in the center of the mesh portion 161, which is located inside the periphery.

[0033] Also, the mask portion 162 is provided, for example, in a frame shape on the front and back of the mesh portion 161, all around the periphery of the mesh portion 161. In this case, the screen mask 16b is fixed to the surface of the frame 16a shown in FIG. 1 facing the electrolyte membrane 11c via the frame-shaped mask portion 162 provided on the periphery of the mesh portion 161. Note that the mask portion 162 does not have to be provided on the periphery of the mesh portion 161. In this case, the periphery of the mesh portion 161 is fixed to the surface of the frame 16a shown in FIG. 1 facing the electrolyte membrane 11c via an adhesive or the like.

[0034] The through-hole portion 163, for example, penetrates the mask portion 162 in accordance with a predetermined pattern of a metal film to be formed on the surface of the base material B, thereby exposing the mesh portion 161. As shown in Fig. 2, the through-hole portion 163 is formed, for example, in an elongated shape corresponding to the shape of the wiring pattern to be formed on the surface of the base material B.

[0035] The connection path 164 is provided, for example, in a part of the mask portion 162 sandwiched between the electrolyte membrane 11c covering the opening 11b of the container 11 and the mesh portion 161. The connection path 164 connects two adjacent through-portions 163 provided in the mask portion 162, or connects the through-portion 163 and a space S facing a region R in the base material B where a predetermined pattern is not formed, to allow the plating solution L to flow. In this embodiment, the region R in which a predetermined pattern is not formed is, for example, a region outside the mask portion 162 provided in the center of the mesh portion 161 and facing a peripheral portion of the mesh portion 161 exposed from the mask portion 162.

[0036] In this embodiment, the connection path 164 is a recessed groove provided on the surface of the mask portion 162 facing the electrolyte membrane 11c. The connection path 164 has, for example, a rectangular cross-sectional shape. The cross-sectional shape of the connection path 164 is not particularly limited, and any shape, such as a semicircular shape or a wedge shape, can be adopted.

[0037] 5, the width W of the connection path 164 is, for example, 100 μm or more and 500 μm or less. Note that the connection path 164 is not limited to a recessed groove as long as it connects two adjacent through-portions 163 or connects the through-portion 163 and a space S facing a region R of the base material B where a predetermined pattern is not formed, and allows the plating solution L to flow. The connection path 164 may be, for example, a through-hole provided in the mask portion 162.

[0038] The functions of the metal film forming apparatus 1 and the masking material 16 of this embodiment will be described below.

[0039] As described above, the metal film forming apparatus 1 of this embodiment includes the container 11, the moving mechanism 12, the pressure increasing mechanism 13, the anode 14, the power source 15, and the masking material 16. The container 11 contains the plating solution L with the opening 11b facing the substrate B covered with the electrolyte membrane 11c. The moving mechanism 12 moves at least one of the container 11 and the substrate B from a state in which the container 11 and the substrate B are separated from each other, and sandwiches the masking material 16 between the electrolyte membrane 11c and the substrate B. The pressure increasing mechanism 13 increases the pressure of the plating solution L contained in the container 11. The anode 14 is disposed facing the electrolyte membrane 11c inside the container 11. The power source 15 applies a voltage between the anode 14 and the substrate B. The masking material 16 is disposed between the electrolyte membrane 11c and the substrate B.

[0040] The masking material 16 of this embodiment is disposed between the electrolyte membrane 11c and the substrate B, and is used to form a metal coating of a predetermined pattern on the surface of the substrate B by electrolytic plating. The masking material 16 of this embodiment includes a mesh portion 161, a mask portion 162, a through portion 163, and a connection path 164. The mesh portion 161 passes through the plating solution L for electrolytic plating. The mask portion 162 is provided on the front and back of the mesh portion 161 and is sandwiched between the electrolyte membrane 11c and the substrate B. The through portion 163 penetrates the mask portion 162 according to the predetermined pattern of the metal coating to expose the mesh portion 161. The connection path 164 is provided in a part of the mask portion 162 sandwiched between the electrolyte membrane 11c and the mesh portion 161, and connects two adjacent through portions 163, or the through portion 163 and a space S facing a region R of the substrate B that does not form a predetermined pattern, to allow the plating solution L to flow.

[0041] 1, the metal film forming apparatus 1 of this embodiment sandwiches the masking material 16 between the electrolyte membrane 11c covering the opening 11b of the container 11 and the substrate B, contains the plating solution L in the container 11, and increases the pressure to a predetermined level by the pressure boosting mechanism 13. As a result, the electrolyte membrane 11c receives pressure from the plating solution L in the container 11 and bends along the uneven shape of the mask portion 162 and the through portion 163 of the masking material 16, as shown in FIGS.

[0042] Furthermore, the plating solution L passes through the electrolyte membrane 11c and the mesh portion 161 exposed in the through-hole portion 163 of the masking material 16, and fills the through-hole portion 163. Here, as shown by the dashed line in Fig. 6, the air A in the through-hole portion 163 present in the vicinity of the base material B passes through the mesh portion 161 and attempts to move toward the electrolyte membrane 11c. However, the electrolyte membrane 11c is subjected to the pressure of the plating solution L in the container 11, for example, and is deflected toward the inside of the opening of the through-hole portion 163, with a part of it coming into contact with the mesh portion 161.

[0043] Therefore, if the masking material 16 does not have the connection path 164, the space between the electrolyte membrane 11c and the mesh portion 161 in the through-hole portion 163 becomes narrow, and the air A near the base material B shown by the dashed lines in Figures 4 and 6 has no place to escape, which may result in air bubbles remaining on the surface of the base material B. In contrast, the masking material 16 of the present embodiment has the connection path 164, and thus can allow the plating solution L to flow between two adjacent through-hole portions 163, or between the through-hole portion 163 and the space S facing the region R of the base material B where the predetermined pattern is not formed.

[0044] As a result, air A near the base material B in the through-hole portion 163 shown by the dashed line in Figures 4 and 6 passes through the mesh portion 161 and moves to the gap between the mesh portion 161 and the electrolyte membrane 11c, and flows into the connection path 164 together with the plating solution L, as shown in Figures 3 and 5. Furthermore, the air A that has flowed into the connection path 164 moves together with the plating solution L to the adjacent through-hole portion 163 or to the space S facing the region R of the base material B where the predetermined pattern is not formed.

[0045] In this way, the air A near the substrate B in the through-hole portion 163 can be moved through the connection path 164 to a space between the mesh portion 161 of the adjacent through-hole portion 163 and the electrolyte membrane 11c, or to a space S facing a region R of the substrate B where a predetermined pattern is not formed. Therefore, according to the masking material 16 and the metal film forming apparatus 1 of the present embodiment, it is possible to prevent air bubbles from remaining on the surface of the substrate B in the through-hole portion 163, and to prevent damage to the metal film caused by air bubbles remaining on the surface of the substrate B.

[0046] In the masking material 16 of the present embodiment, the connection path 164 is a recessed groove provided on the surface of the mask portion 162 facing the electrolyte membrane 11c. With this configuration, it becomes possible to easily form the connection path 164 in the mask portion 162 of the masking material 16 by, for example, a general silk screen manufacturing technique using an emulsion.

[0047] In the masking material 16 of the present embodiment, the width W of the connection path 164 is 100 μm or more and 500 μm or less. With this configuration, for example, as shown in FIG. 5, a space for passing air A is secured between the mesh portion 161 and the electrolyte membrane 11c, and air bubbles can be more effectively prevented from remaining near the surface of the base material B.

[0048] The above describes in detail an embodiment of the mask and film forming apparatus according to the present disclosure using the drawings, but the specific configuration is not limited to this embodiment, and even if there are design changes and the like within the scope that does not deviate from the gist of the present disclosure, they are included in the present disclosure.

[0049] Below, examples of the masking material according to the present disclosure will be described.

[0050] [Example] A masking material was produced by forming a masking part with silicone rubber on the front and back of a mesh part made of LCP resin with a wire diameter of 20 μm and a mesh size of 420 mesh, and forming a through-hole and a groove-shaped connection path in the masking part. The thickness of the masking part was 20 μm for the part placed between the electrolyte membrane and the mesh part, and 30 μm for the part placed between the mesh part and the substrate.

[0051] Here, the masking materials of Examples 1 to 3, each having a connection path width of 100 μm, 250 μm, and 500 μm, and the masking material of Comparative Example having no connection path were produced. Next, a square copper (Cu) substrate with a thickness of 0.9 mm and a side length of 7.8 cm was prepared, and cathodic electrolytic degreasing of the substrate was performed at 55° C. for 1 minute using IC-200RM manufactured by JCU Corporation, and then the substrate was washed with pure water for 1 minute. Furthermore, the substrate was immersed in 10% diluted sulfuric acid at room temperature for 1 minute for acid cleaning, and then the substrate was washed with pure water for 1 minute.

[0052] Thereafter, a metal film having a thickness of 5 μm was formed on the surface of the substrate by solid-phase electrodeposition (SED) using an apparatus having the same configuration as the metal film forming apparatus described in the above embodiment. The film forming conditions were: film forming temperature: 42°C, plating solution: 1 mol / l copper sulfate + 0.2 mol / l sulfuric acid, anode: phosphorus-containing copper plate, anode-cathode electrode distance: 2 mm, pressure: 0.6 MPa, film forming area: 38 cm 2 / Board size 61.4cm 2 , current: 7ASD.

[0053] The number of missing (undeposited) portions of the metal coating formed using the masking materials of Examples 1 to 3 and the Comparative Example was counted, and the results are summarized in Table 1 below.

[0054] [Table 1]

[0055] The number of missing parts in the metal coating formed using the masking material of the comparative example having no connection path was 32. In contrast, the number of missing parts in the metal coating formed using the masking materials of Examples 1 to 3 having groove-shaped connection paths with widths of 100 μm, 250 μm, and 500 μm, respectively, was 1 to 8. That is, by using the masking materials of Examples 1 to 3, the number of missing parts was reduced to 1 / 4 to 1 / 32 compared to the case where the masking material of the comparative example was used. [Explanation of symbols]

[0056] 1 Metal coating deposition equipment 11 Containment Unit 11b opening 11c electrolyte membrane 12 Moving mechanism 13 Pressure booster mechanism 14 Anode 15 Power supply 16 Masking material 161 Mesh part 162 Mask part 163 Penetration part 164 Connection Road B Base material L Plating solution R area S space W width

Claims

1. A masking material for forming a metal film having a predetermined pattern on a surface of the substrate by electrolytic plating, the masking material being disposed between an electrolyte membrane and a substrate, A mesh portion through which the plating solution for the electrolytic plating passes; a mask portion provided on the front and back of the mesh portion and sandwiched between the electrolyte membrane and the base material; a through portion that penetrates the mask portion according to the predetermined pattern to expose the mesh portion; a connection path provided in a part of the mask portion sandwiched between the electrolyte membrane and the mesh portion, connecting two adjacent ones of the through-hole portions or connecting one of the through-holes and a space facing a region of the base material where the predetermined pattern is not formed, and allowing the plating solution to flow; A masking material comprising:

2. 2. The masking material according to claim 1, wherein the connection path is a groove provided on a surface of the mask portion facing the electrolyte membrane.

3. 3. The masking material according to claim 2, wherein the width of the connection path is 100 μm or more and 500 μm or less.

4. A film forming apparatus for forming a metal film comprising the masking material according to claim 1, a container that contains the plating solution with an opening facing the base material covered with the electrolyte membrane; a moving mechanism that moves at least one of the container and the base material from a state in which the container and the base material are spaced apart to sandwich the masking material between the electrolyte membrane and the base material; a pressure boosting mechanism for increasing the pressure of the plating solution contained in the container; an anode disposed inside the container facing the electrolyte membrane; A power source that applies a voltage between the anode and the substrate; the masking material being disposed between the electrolyte membrane and the substrate.

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