Multilayer electronic component

Abstract

To realize a desired characteristic while suppressing the occurrence of a problem attributable to downsizing and inductor arrangement.SOLUTION: An electronic component 1 comprises a laminate 50, a first inductor L11, and a second inductor L21. The first inductor L11 includes a first conductor layer 661, a first columnar conductor T1a, and a second columnar conductor T1b. The second inductor L21 includes a second conductor layer 662, a third columnar conductor T2a, and a fourth columnar conductor T2b. At least a section of the first conductor layer 661 extends in a direction crossing a direction at an angle other than an odd multiple of 90°, in which direction the first columnar conductor T1a and the second columnar conductor T1b lie side by side. At least a section of the second conductor layer 662 extends in a direction crossing a direction at an angle other than an odd multiple of 90°, in which direction the third columnar conductor T2a and the fourth columnar conductor T2b lie side by side.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component including an inductor. [Background technology]

[0002] One of the electronic components used in communication devices is a bandpass filter, which uses, for example, an LC resonator made up of an inductor and a capacitor.

[0003] In recent years, there has been a market demand for miniaturization and space saving of small mobile communication devices, and there is also a demand for miniaturization of bandpass filters used in such communication devices. As a bandpass filter suitable for miniaturization, a laminate including a plurality of laminated dielectric layers and a plurality of laminated conductor layers is known.

[0004] A known inductor for use in a bandpass filter using a laminate is an inductor that is composed of a conductor layer and multiple through holes and is wound around an axis perpendicular to the stacking direction of the multiple dielectric layers.

[0005] Patent Document 1 discloses a multilayer filter device consisting of two or three stages of LC parallel resonators. A plurality of inductors (LC parallel resonant circuits) are provided inside the laminate of the multilayer filter device. Each of the plurality of inductors is composed of an inductor internal electrode and two inductor via electrodes provided inside the laminate. The inductor internal electrode and the two inductor via electrodes are formed in a loop shape inside the laminate. The plurality of inductors are arranged in the laminate such that their loop surfaces face each other. The inductor internal electrodes extend in the short-side direction of the laminate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2009 / 090917 Summary of the Invention [Problem to be solved by the invention]

[0007] In the multilayer filter device disclosed in Patent Document 1, if the laminate is miniaturized, the coupling between the multiple inductors may become too strong. On the other hand, in the multilayer filter device disclosed in Patent Document 1, if the multiple inductors are arranged so that their loop surfaces do not face each other, the coupling between the multiple inductors may become too weak. In this way, if the coupling between the multiple inductors becomes too strong or too weak, it may not be possible to achieve the desired characteristics.

[0008] The above problem is not limited to the coupling between multiple inductors, but also applies to the coupling between an inductor and any conductor, and is also not limited to bandpass filters, but applies to all multilayer electronic components including inductors.

[0009] The present invention has been made in consideration of these problems, and an object of the present invention is to provide a multilayer electronic component including an inductor that can achieve desired characteristics while suppressing problems caused by miniaturization and inductor placement. [Means for solving the problem]

[0010] A multilayer electronic component according to a first aspect of the present invention comprises: a laminate including a plurality of dielectric layers stacked together; a first inductor including a first conductor layer extending along a plane intersecting a stacking direction of a plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer; a second inductor including a second conductor layer extending along a plane intersecting the lamination direction, a third columnar conductor extending in a direction parallel to the lamination direction and connected to a portion near one end of the second conductor layer, and a fourth columnar conductor extending in a direction parallel to the lamination direction and connected to a portion near the other end of the second conductor layer; It is equipped with:

[0011] The laminate has a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other. The third side surface and the fourth side surface face opposite each other. The first inductor is disposed closer to the first side surface than the second side surface. The second inductor is disposed closer to the second side surface than the first side surface. At least a part of the first conductor layer extends in a direction intersecting the direction in which the first columnar conductor and the second columnar conductor are arranged at an angle excluding an odd multiple of 90°. At least a part of the second conductor layer extends in a direction intersecting the direction in which the third columnar conductor and the fourth columnar conductor are arranged at an angle excluding an odd multiple of 90°.

[0012] A multilayer electronic component according to a second aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a conductor layer extending along a plane intersecting the stacking direction of the plurality of dielectric layers, and an inductor including a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer. The conductor layer includes a first portion and a second portion that extend in a direction intersecting the arrangement direction of the first columnar conductor and the second columnar conductor, extend in different directions from each other, and have different lengths from each other. Effect of the Invention

[0013] In the multilayer electronic component according to the first aspect of the present invention, at least a portion of the first conductor layer of the first inductor and at least a portion of the second conductor layer of the second inductor each extend in the predetermined direction defined as above. In the multilayer electronic component according to the second aspect of the present invention, the first and second portions of the conductor layer of the inductor each extend in the predetermined direction defined as above. The multilayer electronic components according to the first and second aspects of the present invention have the advantage that it is possible to achieve desired characteristics while suppressing the occurrence of problems resulting from miniaturization and the arrangement of the inductors. [Brief description of the drawings]

[0014] [Figure 1] 1 is a circuit diagram showing a circuit configuration of a multilayer electronic component according to a first embodiment of the present invention. [Diagram 2] 1 is a perspective view showing the appearance of a multilayer electronic component according to a first embodiment of the present invention; [Diagram 3] FIG. 2 is an explanatory diagram showing a pattern-formed surface of the first to third dielectric layers in the laminate of the multilayer electronic component according to the first embodiment of the present invention. [Figure 4] FIG. 2 is an explanatory diagram showing pattern formation surfaces of fourth to sixteenth dielectric layers in a laminate of the multilayer electronic component according to the first embodiment of the present invention. [Diagram 5] 3 is an explanatory diagram showing a pattern-formed surface of a 17th dielectric layer in the laminate of the multilayer electronic component according to the first embodiment of the present invention. FIG. [Figure 6] 1 is a perspective view showing the inside of a laminate of a multilayer electronic component according to a first embodiment of the present invention. [Figure 7] 1 is a plan view showing a part of the inside of a laminate of a multilayer electronic component according to a first embodiment of the present invention. [Figure 8] FIG. 13 is an explanatory diagram showing pattern formation surfaces of 16th and 17th dielectric layers in a laminate of a multilayer electronic component of a comparative example. [Figure 9] FIG. 13 is a perspective view showing the inside of a laminate of a multilayer electronic component of a comparative example. [Figure 10]FIG. 13 is a characteristic diagram showing the pass attenuation characteristics of a model of an embodiment and a model of a comparative example. [Figure 11] 11 is a characteristic diagram showing an enlarged portion of the pass attenuation characteristic shown in FIG. 10. FIG. [Figure 12] FIG. 11 is a perspective view showing the inside of a laminate of a multilayer electronic component according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] [First embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a general configuration of a multilayer electronic component (hereinafter, simply referred to as electronic component) 1 according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a circuit diagram showing a circuit configuration of electronic component 1.

[0016] The electronic component 1 according to this embodiment includes a first signal terminal 2, a second signal terminal 3, a first high-pass filter 10, a second high-pass filter 20, and a low-pass filter 30. Each of the first and second signal terminals 2, 3 is a terminal for inputting or outputting a signal. That is, when a signal is input to the first signal terminal 2, the signal is output from the second signal terminal 3. When a signal is input to the second signal terminal 3, the signal is output from the first signal terminal 2.

[0017] The first high-pass filter 10, the second high-pass filter 20, and the low-pass filter 30 constitute a band-pass filter that selectively passes signals of frequencies within a predetermined pass band. The first high-pass filter 10, the low-pass filter 30, and the second high-pass filter 20 are connected in series from the first signal terminal 2 to the second signal terminal 3, in this order. In terms of the circuit configuration, the low-pass filter 30 is provided between the first high-pass filter 10 and the second high-pass filter 20. In this application, the expression "in terms of the circuit configuration" is used to refer to the arrangement on a circuit diagram, not the arrangement in a physical configuration.

[0018] Each of the first high-pass filter 10, the second high-pass filter 20, and the low-pass filter 30 is an LC filter configured using at least one inductor and at least one capacitor. In particular, in this embodiment, the first high-pass filter 10 includes a first inductor L11. The second high-pass filter 20 includes a second inductor L21. The low-pass filter 30 includes a third inductor L31 and a fourth inductor L32.

[0019] Next, an example of a circuit configuration of the electronic component 1 will be described with reference to Fig. 1. The first high-pass filter 10 includes a first inductor L11 and capacitors C11, C12, C13, and C14.

[0020] One end of the capacitor C11 is connected to the first signal terminal 2. One end of the capacitor C12 is connected to the other end of the capacitor C11. One end of the capacitor C13 is connected to one end of the capacitor C11. The other end of the capacitor C13 is connected to the other end of the capacitor C12.

[0021] One end of the first inductor L11 is connected to the connection point between the capacitors C11 and C12. The other end of the first inductor L11 is connected to the ground. The capacitor C14 is connected in parallel to the first inductor L11.

[0022] The second high-pass filter 20 includes a second inductor L21 and capacitors C21, C22, C23, and C24.

[0023] One end of the capacitor C21 is connected to the second signal terminal 3. One end of the capacitor C22 is connected to the other end of the capacitor C21. One end of the capacitor C23 is connected to one end of the capacitor C21. The other end of the capacitor C23 is connected to the other end of the capacitor C22.

[0024] One end of the second inductor L21 is connected to the connection point between the capacitors C21 and C22. The other end of the second inductor L21 is connected to the ground. The capacitor C24 is connected in parallel to the second inductor L21.

[0025] The low-pass filter 30 includes a third inductor L31, a fourth inductor L32, and capacitors C31, C32, C33, C34, and C35.

[0026] One end of the capacitor C31 is connected to the other end of the capacitor C12 of the first high-pass filter 10. One end of the capacitor C32 is connected to the other end of the capacitor C31. The other end of the capacitor C32 is connected to the other end of the capacitor C22 of the second high-pass filter 20.

[0027] One end of the third inductor L31 is connected to the connection point between the capacitor C12 and the capacitor C31. One end of the fourth inductor L32 is connected to the other end of the third inductor L31. The other end of the fourth inductor L32 is connected to the connection point between the capacitor C22 and the capacitor C32.

[0028] One end of the capacitor C33 is connected to the connection point between the capacitor C12 and the capacitor C31. One end of the capacitor C34 is connected to the connection point between the third inductor L31 and the fourth inductor L32 and the connection point between the capacitor C31 and the capacitor C32. One end of the capacitor C35 is connected to the connection point between the capacitor C22 and the capacitor C32. The other ends of the capacitors C33 to C35 are connected to ground.

[0029] Next, other configurations of the electronic component 1 will be described with reference to Fig. 2. Fig. 2 is a perspective view showing the external appearance of the electronic component 1.

[0030] The electronic component 1 further includes a laminate 50 including a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). The first signal terminal 2, the second signal terminal 3, the first high-pass filter 10, the second high-pass filter 20, and the low-pass filter 30 are integrated into the laminate 50.

[0031] The laminate 50 has a first surface 50A and a second surface 50B located at both ends in a stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions to each other, and the side surfaces 50E and 50F also face in opposite directions to each other. The side surfaces 50C to 50F may be perpendicular to the first surface 50A and the second surface 50B.

[0032] Here, the X direction, Y direction, and Z direction are defined as shown in FIG. 2. The X direction, Y direction, and Z direction are mutually perpendicular. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The expression "when viewed from the stacking direction T" means that the object is viewed from a position away in the Z direction or the -Z direction.

[0033] As shown in FIG. 2, the first surface 50A is located at the end of the laminate 50 in the -Z direction. The first surface 50A is also the bottom surface of the laminate 50. The second surface 50B is located at the end of the laminate 50 in the Z direction. The second surface 50B is also the top surface of the laminate 50. The side surface 50C is located at the end of the laminate 50 in the -X direction. The side surface 50D is located at the end of the laminate 50 in the X direction. The side surface 50E is located at the end of the laminate 50 in the -Y direction. The side surface 50F is located at the end of the laminate 50 in the Y direction.

[0034] Side 50C and side 50D are aligned in a direction parallel to the X direction. The direction parallel to the X direction corresponds to the "second direction" in the present invention. Side 50E and side 50F are aligned in a direction parallel to the Y direction. The direction parallel to the Y direction corresponds to the "first direction" in the present invention.

[0035] The electronic component 1 further includes a plurality of electrodes 111, 112, and 113 provided on the first surface 50A of the laminate 50. The electrode 111 extends in the Y direction near the side surface 50C. The electrode 112 extends in the Y direction near the side surface 50D. The electrode 113 is disposed between the electrodes 111 and 112.

[0036] The electrode 111 corresponds to the first signal terminal 2, and the electrode 112 corresponds to the second signal terminal 3. Therefore, the first and second signal terminals 2, 3 are provided on the first surface 50A of the laminate 50. The electrode 113 is connected to ground.

[0037] Next, an example of a plurality of dielectric layers and a plurality of conductors constituting a laminate 50 will be described with reference to Fig. 3(a) to Fig. 5. In this example, the laminate 50 includes 17 laminated dielectric layers. Hereinafter, the 17 dielectric layers are referred to as the 1st to 17th dielectric layers from the bottom up. The 1st to 17th dielectric layers are denoted by reference numerals 51 to 67.

[0038] In Figures 3(a) to 4(c), a plurality of circles represent a plurality of through holes. A plurality of through holes are formed in each of the dielectric layers 51 to 66. The plurality of through holes are formed by filling holes for the through holes with a conductive paste. Each of the plurality of through holes is connected to an electrode, a conductive layer, or another through hole.

[0039] 3(a) to 4(c), specific through holes among the multiple through holes are labeled with reference numerals. The connection relationship between each of the specific through holes and the conductor layers or other through holes is described with reference to the state in which the first to seventeenth dielectric layers 51 to 67 are stacked.

[0040] 3(a) shows the pattern-formed surface of the first dielectric layer 51. On the pattern-formed surface of the dielectric layer 51, electrodes 111 to 113 are formed.

[0041] Fig. 3(b) shows the pattern formation surface of the second dielectric layer 52. Conductor layers 521, 522, 523, 524, 525, 526, and 527 are formed on the pattern formation surface of the dielectric layer 52. The conductor layers 522 and 524 are connected to the conductor layer 527. In Fig. 3(b), the boundary between the conductor layer 522 and the conductor layer 527 and the boundary between the conductor layer 524 and the conductor layer 527 are indicated by dotted lines.

[0042] 3(c) shows the pattern formation surface of the third dielectric layer 53. On the pattern formation surface of the dielectric layer 53, conductor layers 531, 532, 533, 534, and 535 are formed.

[0043] 3(c), the through hole marked with the reference numeral 53T1a is connected to the conductor layer 531. In the following description, the through hole marked with the reference numeral 53T1a will be simply referred to as the through hole 53T1a. Also, through holes marked with reference numerals other than the through hole 53T1a will be referred to in the same manner as the through hole 53T1a.

[0044] The through-hole 53T2a shown in Fig. 3(c) is connected to the conductor layer 532. The through-holes 53T1b and 53T2b shown in Fig. 3(c) are connected to the conductor layer 535. The two through-holes 53T3a shown in Fig. 3(c) are connected to the conductor layer 533. The two through-holes 53T4a shown in Fig. 3(c) are connected to the conductor layer 534.

[0045] Fig. 4(a) shows the pattern formation surface of the fourth dielectric layer 54. Conductor layers 541, 542, 543, 544, and 545 are formed on the pattern formation surface of the dielectric layer 54. The conductor layers 543 and 544 are connected to the conductor layer 545. In Fig. 4(a), the boundary between the conductor layer 543 and the conductor layer 545 and the boundary between the conductor layer 544 and the conductor layer 545 are respectively indicated by dotted lines.

[0046] The through holes 53T1a, 53T1b, 53T2a, and 53T2b are connected to the through holes 54T1a, 54T1b, 54T2a, and 54T2b shown in FIG. 4(a), respectively. The two through holes 53T3a are connected to the two through holes 54T3a shown in FIG. 4(a). The two through holes 53T4a are connected to the two through holes 54T4a shown in FIG. 4(a). The two through holes 54T3b shown in FIG. 4(a) and the two through holes 54T4b shown in FIG. 4(a) are connected to the conductor layer 545.

[0047] FIG. 4(b) shows the pattern-formed surfaces of the fifth to fifteenth dielectric layers 55-65. The through holes 54T1a, 54T1b, 54T2a, and 54T2b are connected to the through holes 55T1a, 55T1b, 55T2a, and 55T2b formed in the dielectric layer 55, respectively. The two through holes 54T3a, the two through holes 54T3b, the two through holes 54T4a, and the two through holes 54T4b are connected to the two through holes 55T3a, the two through holes 55T3b, the two through holes 55T4a, and the two through holes 55T4b formed in the dielectric layer 55, respectively. In the dielectric layers 55-65, the through holes with the same reference numerals that are vertically adjacent to each other are connected to each other.

[0048] FIG. 4(c) shows the pattern-formed surface of the 16th dielectric layer 66. Conductor layers 661, 662, 663, and 664 for inductors are formed on the pattern-formed surface of the dielectric layer 66. The conductor layer 661 has a first end and a second end located at both ends of the conductor layer 661 in the longitudinal direction. The conductor layer 662 has a first end and a second end located at both ends of the conductor layer 662 in the longitudinal direction. The conductor layer 663 has a first end and a second end located at both ends of the conductor layer 663 in the longitudinal direction. The conductor layer 664 has a first end and a second end located at both ends of the conductor layer 664 in the longitudinal direction.

[0049] The through hole 55T1a formed in the dielectric layer 65 and the through hole 66T1a shown in FIG. 4(c) are connected to a portion near the first end of the conductor layer 661. The through hole 55T1b formed in the dielectric layer 65 and the through hole 66T1b shown in FIG. 4(c) are connected to a portion near the second end of the conductor layer 661. The through hole 55T2a formed in the dielectric layer 65 and the through hole 66T2a shown in FIG. 4(c) are connected to a portion near the first end of the conductor layer 662. The through hole 55T2b formed in the dielectric layer 65 and the through hole 66T2b shown in FIG. 4(c) are connected to a portion near the second end of the conductor layer 662.

[0050] The two through holes 55T3a formed in the dielectric layer 65 and the two through holes 66T3a shown in FIG. 4(c) are connected to a portion near the first end of the conductor layer 663. The two through holes 55T3b formed in the dielectric layer 65 and the two through holes 66T3b shown in FIG. 4(c) are connected to a portion near the second end of the conductor layer 663. The two through holes 55T4a formed in the dielectric layer 65 and the two through holes 66T4a shown in FIG. 4(c) are connected to a portion near the first end of the conductor layer 664. The two through holes 55T4b formed in the dielectric layer 65 and the two through holes 66T4b shown in FIG. 4(c) are connected to a portion near the second end of the conductor layer 664.

[0051] FIG. 5 shows the pattern-formed surface of the 17th dielectric layer 67. Conductor layers 671, 672, 673, and 674 for inductors are formed on the pattern-formed surface of the dielectric layer 67. The conductor layer 671 has a first end and a second end located at both ends of the conductor layer 671 in the longitudinal direction. The conductor layer 672 has a first end and a second end located at both ends of the conductor layer 672 in the longitudinal direction. The conductor layer 673 has a first end and a second end located at both ends of the conductor layer 673 in the longitudinal direction. The conductor layer 674 has a first end and a second end located at both ends of the conductor layer 674 in the longitudinal direction.

[0052] The through hole 66T1a is connected to a portion of the conductor layer 671 near the first end. The through hole 66T1b is connected to a portion of the conductor layer 671 near the second end. The through hole 66T2a is connected to a portion of the conductor layer 672 near the first end. The through hole 66T2b is connected to a portion of the conductor layer 672 near the second end.

[0053] The two through holes 66T3a are connected to a portion near a first end of the conductor layer 673. The two through holes 66T3b are connected to a portion near a second end of the conductor layer 673. The two through holes 66T4a are connected to a portion near a first end of the conductor layer 674. The two through holes 66T4b are connected to a portion near a second end of the conductor layer 674.

[0054] The laminate 50 is formed by stacking the first through seventeenth dielectric layers 51-67 such that the pattern-forming surface of the first dielectric layer 51 becomes the first side 50A of the laminate 50, and the surface opposite the pattern-forming surface of the seventeenth dielectric layer 67 becomes the second side 50B of the laminate 50.

[0055] Each of the multiple through holes shown in Figures 3(a) to 4(c) is connected to a conductor layer that overlaps with it in the stacking direction T when the 1st to 17th dielectric layers 51 to 67 are stacked, or to another through hole that overlaps with it in the stacking direction T. Furthermore, among the multiple through holes shown in Figures 3(a) to 4(c), a through hole located within an electrode or a conductor layer is connected to that electrode or that conductor layer.

[0056] Fig. 6 shows the inside of the laminate 50 formed by laminating the 1st to 17th dielectric layers 51 to 67. As shown in Fig. 6, inside the laminate 50, the multiple conductor layers and multiple through holes shown in Figs. 3(a) to 5 are laminated.

[0057] The following describes the correspondence between the components of the circuit of the electronic component 1 shown in Fig. 1 and the components inside the laminate 50 shown in Fig. 3(a) to Fig. 5. First, the first high-pass filter 10 will be described. The first inductor L11 is composed of inductor conductor layers 661 and 671 and through holes 53T1a, 53T1b, 54T1a, 54T1b, 55T1a, 55T1b, 66T1a, and 66T1b.

[0058] Capacitor C11 is composed of conductor layers 521 and 531 and a dielectric layer 52 between these conductor layers. Capacitor C12 is composed of conductor layers 531 and 541 and a dielectric layer 53 between these conductor layers. Capacitor C13 is composed of conductor layers 521 and 533 and a dielectric layer 52 between these conductor layers. Capacitor C14 is composed of conductor layers 522 and 531 and a dielectric layer 52 between these conductor layers.

[0059] Next, a description will be given of the components of the second high-pass filter 20. The second inductor L21 is composed of inductor conductor layers 662 and 672, and through holes 53T2a, 53T2b, 54T2a, 54T2b, 55T2a, 55T2b, 66T2a, and 66T2b.

[0060] Capacitor C21 is composed of conductor layers 523 and 532 and a dielectric layer 52 between these conductor layers. Capacitor C22 is composed of conductor layers 532 and 542 and a dielectric layer 53 between these conductor layers. Capacitor C23 is composed of conductor layers 523 and 534 and a dielectric layer 52 between these conductor layers. Capacitor C24 is composed of conductor layers 524 and 532 and a dielectric layer 52 between these conductor layers.

[0061] Next, components of the low-pass filter 30 will be described. The third inductor L31 is composed of inductor conductor layers 663 and 673 and through holes 53T3a, 54T3a, 54T3b, 55T3a, 55T3b, 66T3a, and 66T3b. The fourth inductor L32 is composed of inductor conductor layers 664 and 674 and through holes 53T4a, 54T4a, 54T4b, 55T4a, 55T4b, 66T4a, and 66T4b.

[0062] The capacitor C31 is composed of conductor layers 533 and 543 and a dielectric layer 53 between these conductor layers. The capacitor C32 is composed of conductor layers 534 and 544 and a dielectric layer 53 between these conductor layers.

[0063] Capacitor C33 is composed of conductor layers 525, 533, and 535 and a dielectric layer 52 between these conductor layers. Capacitor C34 is composed of conductor layers 535 and 545 and a dielectric layer 53 between these conductor layers. Capacitor C35 is composed of conductor layers 526, 534, and 535 and a dielectric layer 52 between these conductor layers.

[0064] Next, structural features of the electronic component 1 according to the present embodiment will be described with reference to Fig. 1 to Fig. 7. Fig. 7 is a plan view showing a part of the inside of the laminate 50. Note that Fig. 7 shows the inside of the laminate 50 as viewed from the second surface 50B side of the laminate 50.

[0065] First, the features of the first to fourth inductors L11, L21, L31, and L32 will be described. As shown in Fig. 7, the first inductor L11 of the first high-pass filter 10 is disposed at a position closer to a side surface 50C of the laminate 50 than to a side surface 50D of the laminate 50. The first inductor L11 is also disposed at a position closer to a side surface 50E of the laminate 50 than to a side surface 50F of the laminate 50.

[0066] 7, the second inductor L21 of the second high-pass filter 20 is disposed at a position closer to the side surface 50D than to the side surface 50C. Also, the second inductor L21 is disposed at a position closer to the side surface 50F than to the side surface 50E.

[0067] The first inductor L11 and the second inductor L21 are arranged in a direction from a first corner at the intersection of the side 50C and the side 50E toward a second corner at the intersection of the side 50D and the side 50F. As shown in FIG. 7, the third inductor L31 and the fourth inductor L32 of the low-pass filter 30 are arranged in a direction intersecting the direction in which the first inductor L11 and the second inductor L21 are arranged. In particular, in this embodiment, the third inductor L31 is arranged between the first inductor L11 and the side 50F, and is arranged between the second inductor L21 and the side 50C. The fourth inductor L32 is arranged between the first inductor L11 and the side 50D, and is arranged between the second inductor L21 and the side 50E.

[0068] The first inductor L11, the second inductor L21, the third inductor L31, and the fourth inductor L32 are all inductors wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting a plurality of through holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. Each of the first to fourth inductors L11, L21, L31, and L32 includes at least one conductor layer and a plurality of columnar conductors.

[0069] Each of the inductors L11, L21, L31, and L32 is also a rectangular or nearly rectangular winding. In a rectangular or nearly rectangular winding, the number of turns may be counted as 1 / 4 turns per side of the rectangle when the winding is considered as a rectangle. In this embodiment, the number of turns of each of the inductors L11, L21, L31, and L32 is 3 / 4 turns.

[0070] The first inductor L11 includes a conductor layer 661, a first columnar conductor T1a connected to a portion of the conductor layer 661 near a first end, and a second columnar conductor T1b connected to a portion of the conductor layer 661 near a second end. The first columnar conductor T1a is configured by connecting through holes 53T1a, 54T1a, and 55T1a in series. The second columnar conductor T1b is configured by connecting through holes 53T1b, 54T1b, and 55T1b in series. The first inductor L11 is wound around a first axis perpendicular to the stacking direction T so as to form a first opening surrounded by the conductor layer 661, the first columnar conductor T1a, and the second columnar conductor T1b.

[0071] The first inductor L11 further includes a conductor layer 671, and through holes 66T1a and 66T1b electrically connecting the conductor layer 661 and the conductor layer 671. Note that in FIG. 7, the conductor layer 671 and the through holes 66T1a and 66T1b of the first inductor L11 are omitted.

[0072] The second inductor L21 includes a conductor layer 662, a third columnar conductor T2a connected to a portion of the conductor layer 662 near a first end, and a fourth columnar conductor T2b connected to a portion of the conductor layer 662 near a second end. The third columnar conductor T2a is configured by connecting through holes 53T2a, 54T2a, and 55T2a in series. The fourth columnar conductor T2b is configured by connecting through holes 53T2b, 54T2b, and 55T2b in series. The second inductor L21 is wound around a second axis perpendicular to the stacking direction T so as to form a second opening surrounded by the conductor layer 662, the third columnar conductor T2a, and the fourth columnar conductor T2b.

[0073] The second inductor L21 further includes a conductor layer 672, and through holes 66T2a and 66T2b electrically connecting the conductor layer 662 and the conductor layer 672. Note that in FIG. 7, the conductor layer 672 and the through holes 66T2a and 66T2b of the second inductor L21 are omitted.

[0074] The third inductor L31 includes a conductor layer 663, two columnar conductors T3a each connected to a portion near a first end of the conductor layer 663, and two columnar conductors T3b each connected to a portion near a second end of the conductor layer 663. The two columnar conductors T3a are configured by connecting through holes 53T3a, 54T3a, and 55T3a in series. The two columnar conductors T3b are configured by connecting through holes 54T3b and 55T3b in series. The third inductor L31 is wound around a third axis perpendicular to the stacking direction T so that a third opening surrounded by the conductor layer 663, the two columnar conductors T3a, and the two columnar conductors T3b is formed.

[0075] The third inductor L31 further includes a conductor layer 673, and through holes 66T3a and 66T3b electrically connecting the conductor layer 663 and the conductor layer 673. Note that in FIG. 7, the conductor layer 673 and the through holes 66T3a and 66T3b of the third inductor L31 are omitted.

[0076] The fourth inductor L32 includes a conductor layer 664, two columnar conductors T4a each connected to a portion near a first end of the conductor layer 664, and two columnar conductors T4b each connected to a portion near a second end of the conductor layer 664. The two columnar conductors T4a are configured by connecting through holes 53T4a, 54T4a, and 55T4a in series. The two columnar conductors T4b are configured by connecting through holes 54T4b and 55T4b in series. The fourth inductor L32 is wound around a fourth axis perpendicular to the stacking direction T so that a fourth opening surrounded by the conductor layer 664, the two columnar conductors T4a, and the two columnar conductors T4b is formed.

[0077] The fourth inductor L32 further includes a conductor layer 674, and through holes 66T4a and 66T4b electrically connecting the conductor layer 664 and the conductor layer 674. Note that in FIG. 7, the conductor layer 674 and the through holes 66T4a and 66T4b of the fourth inductor L32 are omitted.

[0078] The first inductor L11 and the second inductor L21 are arranged such that the first opening and the second opening do not overlap and the first axis and the second axis do not overlap when viewed in a direction parallel to the Y direction. The third inductor L31 and the fourth inductor L32 are arranged such that the third opening and the fourth opening do not overlap and the third axis and the fourth axis do not overlap when viewed in a direction parallel to the Y direction.

[0079] Moreover, the first inductor L11 and the third inductor L31 are arranged such that the first opening and the third opening overlap when viewed in a direction parallel to the Y direction. The first inductor L11 and the third inductor L31 may be arranged such that the first axis and the third axis overlap when viewed in a direction parallel to the Y direction, or may be arranged such that the first axis and the third axis do not overlap. The first axis and the third axis may be parallel to each other, or may not be parallel to each other.

[0080] Moreover, the second inductor L21 and the fourth inductor L32 are arranged such that the second opening and the fourth opening overlap when viewed in a direction parallel to the Y direction. The second inductor L21 and the fourth inductor L32 may be arranged such that the second axis and the fourth axis overlap when viewed in a direction parallel to the Y direction, or may be arranged such that the second axis and the fourth axis do not overlap when viewed in a direction parallel to the Y direction. The second axis and the fourth axis may be parallel to each other, or may not be parallel to each other.

[0081] Next, features of the conductor layer 661 of the first inductor L11 and the conductor layer 662 of the second inductor L21 will be described with reference to Fig. 7. Each of the conductor layers 661, 662 extends along a plane intersecting the lamination direction T, i.e., along the pattern formation surface of the dielectric layer 66.

[0082] At least a part of the conductor layer 661 extends in a direction intersecting with the direction in which the first columnar conductor T1a and the second columnar conductor T1b are arranged (hereinafter referred to as the first arrangement direction) at an angle other than an odd multiple of 90°. That is, at least a part of the conductor layer 661 does not extend in the first arrangement direction and in a direction perpendicular to the first arrangement direction, but extends in a direction intersecting with the first arrangement direction. When "at least a part of the conductor layer 661" means "the entire conductor layer 661", the conductor layer 661 may include a plurality of parts extending in a direction intersecting with the first arrangement direction. When "at least a part of the conductor layer 661" means "a part of the conductor layer 661", the conductor layer 661 may further include at least one of a part extending in the first arrangement direction and a part extending in a direction perpendicular to the first arrangement direction.

[0083] Particularly in this embodiment, the conductor layer 661 includes, as "at least a part of the conductor layer 661", a first portion 661A including a first end of the conductor layer 661 and a second portion 661B including a second end of the conductor layer 661. The first portion 661A extends in one direction so as to approach the side surface 50F as it moves away from the first end of the conductor layer 661. The second portion 661B extends in one direction so as to approach the side surface 50F as it moves away from the second end of the conductor layer 661. In addition, the second portion 661B has a different length from the first portion 661A. Particularly in this embodiment, the second portion 661B is longer than the first portion 661A.

[0084] Conductive layer 661 further includes curved portion 661C extending in a curved manner. In this embodiment, first portion 661A is connected to one end of curved portion 661C, and second portion 661B is connected to the other end of curved portion 661C. In Fig. 7, the boundary between first portion 661A and curved portion 661C and the boundary between second portion 661B and curved portion 661C are indicated by dotted lines.

[0085] When viewed from the stacking direction T, the conductor layer 661 generally has a shape that protrudes in the direction from the side surface 50E toward the side surface 50F.

[0086] At least a part of the conductor layer 662 extends in a direction intersecting with the direction in which the third columnar conductor T3a and the fourth columnar conductor T4b are arranged (hereinafter referred to as the second arrangement direction) at an angle other than an odd multiple of 90°. That is, at least a part of the conductor layer 662 does not extend in the second arrangement direction and in a direction perpendicular to the second arrangement direction, but extends in a direction intersecting with the second arrangement direction. When "at least a part of the conductor layer 662" means "the entire conductor layer 662", the conductor layer 662 may include a plurality of parts extending in a direction intersecting with the second arrangement direction. When "at least a part of the conductor layer 662" means "a part of the conductor layer 662", the conductor layer 662 may further include at least one of a part extending in the second arrangement direction and a part extending in a direction perpendicular to the second arrangement direction.

[0087] Particularly in this embodiment, the conductor layer 662 includes, as "at least a part of the conductor layer 662", a third portion 662A including a first end of the conductor layer 662 and a fourth portion 662B including a second end of the conductor layer 662. The third portion 662A extends in one direction so as to approach the side surface 50E as it moves away from the first end of the conductor layer 662. The fourth portion 662B extends in one direction so as to approach the side surface 50E as it moves away from the second end of the conductor layer 662. The fourth portion 662B has a different length from the third portion 662A. Particularly in this embodiment, the fourth portion 662B is longer than the third portion 662A.

[0088] The conductor layer 662 further includes a curved portion 662C that extends in a curved manner. In this embodiment, the third portion 662A is connected to one end of the curved portion 662C, and the fourth portion 662B is connected to the other end of the curved portion 662C. In Fig. 7, the boundary between the third portion 662A and the curved portion 662C and the boundary between the fourth portion 662B and the curved portion 662C are indicated by dotted lines.

[0089] When viewed from the stacking direction T, the conductor layer 662 generally has a shape that protrudes in the direction from the side surface 50F toward the side surface 50C.

[0090] Each of the first portion 661A of the conductor layer 661 and the third portion 662A of the conductor layer 662 includes a straight portion that extends substantially linearly. The straight portion of the first portion 661A and the straight portion of the third portion 662A may be parallel or approximately parallel to each other.

[0091] Each of the second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 includes a straight portion that extends substantially linearly. The straight portion of the second portion 661B and the straight portion of the fourth portion 662B may be parallel or nearly parallel to each other. In the example shown in FIG. 7, the straight portion of the second portion 661B and the straight portion of the fourth portion 662B are parallel to each other.

[0092] In this embodiment, the distance from the second portion 661B to the fourth portion 662B is smaller than the distance from the first portion 661A to the third portion 662A. In addition, no other conductor exists between the portion of the second portion 661B closer to the fourth portion 662B and the portion of the fourth portion 662B closer to the second portion 661B. Therefore, the above-mentioned portion of the second portion 661B and the above-mentioned portion of the fourth portion 662B face each other. As a result, a part of the first inductor L11 and a part of the second inductor L21 also face each other.

[0093] When viewed from the stacking direction T, the conductor layers 661 and 662 are generally shaped to approach each other from the outer periphery (side surfaces 50E, 50F) of the laminate 50. In each of the conductor layers 661 and 662, the position where the distance between the conductor layers 661 and 662 in the direction parallel to the Y direction is smallest exists between the first end and the second end.

[0094] The shape of the conductor layer 671 is the same as or similar to the shape of the conductor layer 661. The arrangement of the conductor layer 671 is the same as or similar to the arrangement of the conductor layer 661, except for its position in the stacking direction T. The shape of the conductor layer 672 is the same as or similar to the shape of the conductor layer 662. The arrangement of the conductor layer 672 is the same as or similar to the arrangement of the conductor layer 662, except for its position in the stacking direction T. The above description of the conductor layers 661 and 662 also applies to the conductor layers 671 and 672 if the conductor layers 661 and 662 and the columnar conductors T1a, T1b, T2a, and T2b are replaced with the conductor layers 671 and 672 and the through holes 66T1a, 66T1b, 66T2a, and 66T2b, respectively.

[0095] Next, referring to FIG. 7, features related to the first and second columnar conductors T1a, T1b of the first inductor L11 and the third and fourth columnar conductors T2a, T2b of the second inductor L21 will be described. As shown in FIG. 7, the first columnar conductor T1a and the second columnar conductor T1b are arranged along the side surface 50E. The second columnar conductor T1b is arranged farther from the side surface 50E than the first columnar conductor T1a. Therefore, the direction in which the first columnar conductor T1a and the second columnar conductor T1b are arranged, i.e., the first arrangement direction, is inclined with respect to the side surface 50E. In addition, the first arrangement direction is inclined with respect to each of the X direction and the Y direction.

[0096] As shown in Fig. 7, the third columnar conductor T2a and the fourth columnar conductor T2b are arranged along the side surface 50F. The fourth columnar conductor T2b is arranged farther from the side surface 50F than the third columnar conductor T2a. Therefore, the direction in which the third columnar conductor T2a and the fourth columnar conductor T2b are arranged, i.e., the second arrangement direction, is inclined with respect to the side surface 50F. In addition, the second arrangement direction is inclined with respect to both the X direction and the Y direction.

[0097] The second columnar conductor T1b and the fourth columnar conductor T2b are disposed between the first columnar conductor T1a and the third columnar conductor T2a in a direction parallel to the X direction. The distance between the second columnar conductor T1b and the fourth columnar conductor T2b in a direction parallel to the Y direction is smaller than the distance between the first columnar conductor T1a and the third columnar conductor T2a in the direction parallel to the Y direction.

[0098] Next, the operation and effect of the electronic component 1 according to the present embodiment will be described. In the present embodiment, at least a part of the conductor layer 661 of the first inductor L11 extends in a direction intersecting the first arrangement direction (the direction in which the first columnar conductor T1a and the second columnar conductor T1b are aligned). In particular, in the present embodiment, each of the first portion 661A and the second portion 661B of the conductor layer 661 corresponds to the above-mentioned "at least a part of the conductor layer 661". As a result, according to the present embodiment, the conductor layer 661 can be made longer than when the conductor layer 661 extends in the first arrangement direction, and as a result, the inductance of the first inductor L11 can be increased.

[0099] Similarly, in this embodiment, at least a part of the conductor layer 662 of the second inductor L21 extends in a direction intersecting the second arrangement direction (the direction in which the third columnar conductor T2a and the fourth columnar conductor T2b are aligned). In particular, in this embodiment, each of the third portion 662A and the fourth portion 662B of the conductor layer 662 corresponds to the above-mentioned "at least a part of the conductor layer 662." As a result, according to this embodiment, like the conductor layer 661, the conductor layer 662 can be made longer, and as a result, the inductance of the second inductor L21 can be increased.

[0100] Furthermore, according to the present embodiment, the conductor layer 661 can adjust the coupling between the first inductor L11 and other conductors in the laminate 50, and the conductor layer 662 can adjust the coupling between the second inductor L21 and other conductors in the laminate 50. In particular, this embodiment can adjust the coupling between the first inductor L11 and the second inductor L21 by the conductor layers 661 and 662. This effect will be described in detail below.

[0101] In this embodiment, the first inductor L11 and the second inductor L21 are arranged such that the first opening and the second opening do not overlap and the first axis and the second axis do not overlap when viewed in a direction parallel to the Y direction. As a result, according to this embodiment, it is possible to prevent the coupling between the first inductor L11 and the second inductor L21 from becoming too strong as the laminate 50 is made smaller.

[0102] Furthermore, in this embodiment, by shaping the conductor layers 661, 662 so that they are close to each other, the coupling between the first inductor L11 and the second inductor L21 can be strengthened, and as a result, it is possible to prevent the coupling between the first inductor L11 and the second inductor L21 from becoming too weak due to the arrangement of the first inductor L11 and the second inductor L21.

[0103] In particular, in this embodiment, each of the second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 includes a straight line portion that extends substantially linearly. Here, a virtual straight line is assumed that intersects both the straight line portion of the second portion 661B and the straight line portion of the fourth portion 662B. In this embodiment, when viewed from one direction parallel to the virtual straight line, the second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 overlap each other. In addition, the straight line portion of the second portion 661B and the straight line portion of the fourth portion 662B are parallel or nearly parallel to each other. As a result, according to this embodiment, the coupling between the first inductor L11 and the second inductor L21 can be strengthened.

[0104] In this embodiment, the first and second inductors L11 and L21 are arranged in such a manner that the distance between the second columnar conductor T1b and the fourth columnar conductor T2b is small. Specifically, the distance between the second columnar conductor T1b and the fourth columnar conductor T2b in the direction parallel to the Y direction is smaller than the distance between the first columnar conductor T1a and the third columnar conductor T2a in the direction parallel to the Y direction. This also makes it possible to strengthen the coupling between the first inductor L11 and the second inductor L21 according to this embodiment.

[0105] As described above, according to the present embodiment, it is possible to realize desired characteristics while miniaturizing the laminate 50 and suppressing problems caused by the arrangement of the first and second inductors L11, L21.

[0106] Next, the effects of the present embodiment will be described in more detail in comparison with electronic component 101 of a comparative example. First, the configuration of electronic component 101 of the comparative example will be described in detail. The circuit configuration of electronic component 101 of the comparative example is the same as the circuit configuration of electronic component 1 according to the present embodiment shown in FIG. 1. Moreover, the physical configuration of electronic component 101 of the comparative example is the same as the physical configuration of electronic component 1, except for the points described below.

[0107] Similar to electronic component 1, comparative electronic component 101 includes laminate 50. However, laminate 50 of comparative electronic component 101 includes dielectric layers 166 and 167 instead of dielectric layers 66 and 67 in the present embodiment. Dielectric layer 166 is the 16th dielectric layer, and dielectric layer 167 is the 17th dielectric layer.

[0108] FIG. 8(a) shows the pattern-formed surface of the 16th dielectric layer 166. On the pattern-formed surface of the dielectric layer 66, conductor layers 1661, 1662, 1663, and 1664 for inductors are formed. The conductor layer 1661 has a first end and a second end located at both ends of the conductor layer 1661 in the longitudinal direction. The conductor layer 1662 has a first end and a second end located at both ends of the conductor layer 1662 in the longitudinal direction. The conductor layer 1663 has a first end and a second end located at both ends of the conductor layer 1663 in the longitudinal direction. The conductor layer 1664 has a first end and a second end located at both ends of the conductor layer 1664 in the longitudinal direction.

[0109] The through hole 55T1a (see FIG. 4(b)) formed in the dielectric layer 65 and the through hole 166T1a shown in FIG. 8(a) are connected to a portion near the first end of the conductor layer 1661. The through hole 55T1b (see FIG. 4(b)) formed in the dielectric layer 65 and the through hole 166T1b shown in FIG. 8(a) are connected to a portion near the second end of the conductor layer 1661. The through hole 55T2a (see FIG. 4(b)) formed in the dielectric layer 65 and the through hole 166T2a shown in FIG. 8(a) are connected to a portion near the first end of the conductor layer 1662. The through hole 55T2b (see FIG. 4(b)) formed in the dielectric layer 65 and the through hole 166T2b shown in FIG. 8(a) are connected to a portion near the second end of the conductor layer 1662.

[0110] The two through holes 55T3a (see FIG. 4(b)) formed in the dielectric layer 65 and the two through holes 166T3a shown in FIG. 8(a) are connected to a portion near the first end of the conductor layer 1663. The two through holes 55T3b (see FIG. 4(b)) formed in the dielectric layer 65 and the two through holes 166T3b shown in FIG. 8(a) are connected to a portion near the second end of the conductor layer 1663. The two through holes 55T4a (see FIG. 4(b)) formed in the dielectric layer 65 and the two through holes 166T4a shown in FIG. 8(a) are connected to a portion near the first end of the conductor layer 1664. The two through holes 55T4b (see FIG. 4(b)) formed in the dielectric layer 65 and the two through holes 166T4b shown in FIG. 8(a) are connected to a portion near the second end of the conductor layer 1664.

[0111] FIG. 8(b) shows the pattern-formed surface of the 17th dielectric layer 167. Conductor layers 1671, 1672, 1673, and 1674 for inductors are formed on the pattern-formed surface of the dielectric layer 167. The conductor layer 1671 has a first end and a second end located at both ends of the conductor layer 1671 in the longitudinal direction. The conductor layer 1672 has a first end and a second end located at both ends of the conductor layer 1672 in the longitudinal direction. The conductor layer 1673 has a first end and a second end located at both ends of the conductor layer 1673 in the longitudinal direction. The conductor layer 1674 has a first end and a second end located at both ends of the conductor layer 1674 in the longitudinal direction.

[0112] The through hole 166T1a is connected to a portion of the conductor layer 1671 near a first end. The through hole 166T1b is connected to a portion of the conductor layer 1671 near a second end. The through hole 166T2a is connected to a portion of the conductor layer 1672 near a first end. The through hole 166T2b is connected to a portion of the conductor layer 1672 near a second end.

[0113] The two through holes 166T3a are connected to a portion near a first end of the conductor layer 1673. The two through holes 166T3b are connected to a portion near a second end of the conductor layer 1673. The two through holes 166T4a are connected to a portion near a first end of the conductor layer 1674. The two through holes 166T4b are connected to a portion near a second end of the conductor layer 1674.

[0114] 9 shows the inside of the laminate 50 of the comparative electronic component 101. The arrangement of the first to fourth inductors L11, L21, L31, and L32 in the comparative electronic component 101 is substantially the same as the arrangement of the first to fourth inductors L11, L21, L31, and L32 in the electronic component 1.

[0115] In the electronic component 101 of the comparative example, the first inductor L11 is composed of inductor conductor layers 1661 and 1671, a first columnar conductor T1a, a second columnar conductor T1b, and through holes 166T1a and 166T1b. As shown in FIG. 8(b), the conductor layer 1661 includes a first portion including a first end of the conductor layer 1661 and extending in a direction parallel to the Y direction, a second portion including a second end of the conductor layer 1661 and extending in a direction parallel to the Y direction, and a third portion extending in a direction parallel to the X direction and connecting the first portion and the second portion. The conductor layer 1671 has the same shape as the conductor layer 1661.

[0116] In the electronic component 101 of the comparative example, the second inductor L21 is composed of the conductor layers 1662 and 1672 for the inductor, the third columnar conductor T2a, the fourth columnar conductor T2b, and the through holes 166T2a and 166T2b. As shown in Fig. 8(b), the conductor layer 1662 includes a fourth portion including a first end of the conductor layer 1662 and extending in a direction parallel to the Y direction, a fifth portion including a second end of the conductor layer 1662 and extending in a direction parallel to the Y direction, and a sixth portion extending in a direction parallel to the X direction and connecting the fourth portion and the fifth portion. The conductor layer 1672 has the same shape as the conductor layer 1662.

[0117] In electronic component 101 of the comparative example, third inductor L31 is composed of inductor conductor layers 1663 and 1673, two columnar conductors T3a, two columnar conductors T3b, and through holes 166T3a and 166T3b. The shapes of conductor layers 1663 and 1673 are the same as those of conductor layers 663 and 673 in the present embodiment, respectively.

[0118] In electronic component 101 of the comparative example, fourth inductor L32 is composed of inductor conductor layers 1664 and 1674, two columnar conductors T4a and T4b, and through holes 166T4a and 166T4b. The shapes of conductor layers 1664 and 1674 are the same as those of conductor layers 664 and 674 in the present embodiment, respectively.

[0119] Next, the pass attenuation characteristics of the model of the example and the model of the comparative example obtained by simulation will be described. The model of the example is a model of the electronic component 1 according to the present embodiment. The model of the comparative example is a model of the electronic component 101 of the comparative example.

[0120] Fig. 10 is a characteristic diagram showing the pass attenuation characteristics of the model of the embodiment and the model of the comparative example. Fig. 11 is a characteristic diagram showing an enlarged portion of Fig. 10. In Fig. 10 and Fig. 11, the horizontal axis indicates frequency and the vertical axis indicates attenuation. In Fig. 10 and Fig. 11, the curve marked with reference numeral 81 indicates the pass attenuation characteristics of the model of the embodiment, and the curve marked with reference numeral 82 indicates the pass attenuation characteristics of the model of the comparative example.

[0121] In Fig. 10 and Fig. 11, the frequency region where the absolute value of the attenuation is close to 0 is the passband of the bandpass filter. In the model of the embodiment, the distance (frequency difference) between two attenuation poles occurring in a frequency region lower than the passband is wider than in the model of the comparative example. As a result, the model of the embodiment realizes a characteristic in which the absolute value of the attenuation changes sharply in a frequency region lower than and close to the passband. This result is due to the fact that the coupling between the first inductor L11 and the second inductor L21 is stronger in the model of the embodiment than in the model of the comparative example. As can be seen from this result, it is possible to adjust the characteristics by adjusting the shape of the conductor layers included in each of the first and second inductors L11 and L21.

[0122] 1, the first inductor L11 is included in the first high-pass filter 10, and the second inductor L21 is included in the second high-pass filter 20. In terms of the circuit configuration, the low-pass filter 30 is provided between the first high-pass filter 10 and the second high-pass filter 20. As can be seen from the results of the simulation, according to this embodiment, it is possible to adjust the coupling between the first inductor L11 and the second inductor L21 included in the first high-pass filter 10 and the second high-pass filter 20, which are not adjacent to each other in terms of the circuit configuration.

[0123] [Second embodiment] Next, a second embodiment of the present invention will be described with reference to Fig. 12. Fig. 12 is a perspective view showing the inside of a laminate of an electronic component according to this embodiment.

[0124] The circuit configuration of electronic component 201 according to the present embodiment is the same as the circuit configuration of electronic component 1 according to the first embodiment. Moreover, the physical configuration of electronic component 101 according to the present embodiment is the same as the physical configuration of electronic component 1 according to the first embodiment, except for the points described below.

[0125] Like electronic component 1 according to the first embodiment, electronic component 201 according to the present embodiment includes laminate 50. However, laminate 50 of electronic component 101 according to the present embodiment includes a 16th dielectric layer in the present embodiment and a 17th dielectric layer in the present embodiment instead of dielectric layers 66 and 67 in the first embodiment.

[0126] In the present embodiment, conductor layers 661, 663, 664, and 1662 for inductors are formed on the pattern formation surface of the 16th dielectric layer. The shapes and arrangement of conductor layers 661, 663, and 664 are the same as those of conductor layers 661, 663, and 664 formed on the pattern formation surface of dielectric layer 66 in the first embodiment. The shape and arrangement of conductor layer 1662 are the same as those of conductor layer 1662 formed on the pattern formation surface of dielectric layer 166 of electronic component 101 of the comparative example described in the first embodiment.

[0127] The connection relationship between the conductor layers 661, 663, 664 and the columnar conductors T1a, T1b, T3a, T3b, T4a, T4b is the same as that of the electronic component 1 according to the first embodiment. The connection relationship between the conductor layer 1662 and the columnar conductors T2a, T2b is the same as that of the electronic component 101 of the comparative example.

[0128] In the present embodiment, conductor layers 671, 673, 674, and 1672 for inductors are formed on the pattern formation surface of the 17th dielectric layer. The shapes and arrangement of conductor layers 671, 673, and 674 are the same as those of conductor layers 671, 673, and 674 formed on the pattern formation surface of dielectric layer 67 in the first embodiment. The shape and arrangement of conductor layer 1672 are the same as those of conductor layer 1672 formed on the pattern formation surface of dielectric layer 167 of electronic component 101 of the comparative example described in the first embodiment.

[0129] In the 16th dielectric layer in this embodiment, a plurality of through holes are formed, which have the same connection relationship with the conductor layers 661, 663, 664, 671, 673, 674 as the through holes 66T1a, 66T1b, 66T3a, 66T3b, 66T4a, 66T4b shown in Fig. 4(c). In addition, in the 16th dielectric layer in this embodiment, two more through holes are formed, which have the same connection relationship with the conductor layers 1662, 1672 as the through holes 166T2a, 166T2b shown in Fig. 8(a).

[0130] The shapes and arrangement of the first, third and fourth inductors L11, L31 and L32 in this embodiment are the same as those of the first, third and fourth inductors L11, L31 and L32 in the electronic component 1 according to the first embodiment. The shape and arrangement of the second inductor L21 in this embodiment are the same as those of the second inductor L21 in the electronic component 101 of the comparative example.

[0131] Other configurations, operations, and effects of the present embodiment are similar to those of the first embodiment, except for the operations and effects related to the second inductor L21.

[0132] The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the multilayer electronic component of the present invention may be an electronic component other than a bandpass filter, such as a duplexer.

[0133] Furthermore, the electronic component 1 may include a first low-pass filter including an inductor corresponding to the third inductor L31 and a second low-pass filter including an inductor corresponding to the fourth inductor L32, instead of the low-pass filter 30. The first low-pass filter and the second low-pass filter may be directly or indirectly connected in series.

[0134] As described above, the multilayer electronic component according to the first aspect of the present invention comprises: a laminate including a plurality of dielectric layers stacked together; a first inductor including a first conductor layer extending along a plane intersecting a stacking direction of a plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer; a second inductor including a second conductor layer extending along a plane intersecting the lamination direction, a third columnar conductor extending in a direction parallel to the lamination direction and connected to a portion near one end of the second conductor layer, and a fourth columnar conductor extending in a direction parallel to the lamination direction and connected to a portion near the other end of the second conductor layer; It is equipped with:

[0135] The laminate has a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other. The third side surface and the fourth side surface face opposite each other. The first inductor is disposed closer to the first side surface than the second side surface. The second inductor is disposed closer to the second side surface than the first side surface. At least a part of the first conductor layer extends in a direction intersecting the direction in which the first columnar conductor and the second columnar conductor are arranged at an angle excluding an odd multiple of 90°. At least a part of the second conductor layer extends in a direction intersecting the direction in which the third columnar conductor and the fourth columnar conductor are arranged at an angle excluding an odd multiple of 90°.

[0136] In the multilayer electronic component according to the first aspect of the present invention, the first inductor may be disposed closer to the third side surface than to the fourth side surface, and the second inductor may be disposed closer to the fourth side surface than to the third side surface.

[0137] In the multilayer electronic component according to the first aspect of the present invention, the first conductor layer may include a first portion extending toward the second side surface as it moves away from one end of the first conductor layer, and a second portion extending toward the second side surface as it moves away from the other end of the first conductor layer. The second conductor layer may include a third portion extending toward the first side surface as it moves away from one end of the second conductor layer, and a fourth portion extending toward the first side surface as it moves away from the other end of the second conductor layer.

[0138] In the multilayer electronic component according to the first aspect of the present invention, each of the first conductor layer and the second conductor layer may include a straight portion extending linearly, and the straight portion of the first conductor layer and the straight portion of the second conductor layer may be parallel to each other.

[0139] In the multilayer electronic component according to the first aspect of the present invention, the first conductor layer may include a first portion extending in one direction and a second portion extending in a direction different from the first portion and having a length different from the first portion. The second conductor layer may include a third portion extending in one direction and a fourth portion extending in a direction different from the third portion and having a length different from the third portion. The distance from the second portion to the fourth portion may be smaller than the distance from the first portion to the third portion.

[0140] In the multilayer electronic component according to the first aspect of the present invention, each of the first conductor layer and the second conductor layer may include a curved portion that extends in a curved manner.

[0141] In the multilayer electronic component according to the first aspect of the present invention, when a direction perpendicular to the stacking direction and in which the first side surface and the second side surface are aligned is defined as a first direction, and a direction perpendicular to the stacking direction and in which the third side surface and the fourth side surface are aligned is defined as a second direction, the second columnar conductor and the fourth columnar conductor may be disposed between the first columnar conductor and the third columnar conductor in the second direction. The distance between the second columnar conductor and the fourth columnar conductor in the first direction may be smaller than the distance between the first columnar conductor and the third columnar conductor in the first direction.

[0142] The multilayer electronic component according to the first aspect of the present invention may further include a first high-pass filter, a second high-pass filter, and a low-pass filter provided between the first high-pass filter and the second high-pass filter in terms of the circuit configuration. The first high-pass filter may include a first inductor. The second high-pass filter may include a second inductor. The low-pass filter may include a third inductor and a fourth inductor, each of which includes a conductor layer extending along a plane and a pair of columnar conductors extending in a direction parallel to the lamination direction and connected to the conductor layer. The third inductor and the fourth inductor may be arranged in a direction intersecting the direction in which the first inductor and the second inductor are arranged.

[0143] A multilayer electronic component according to a second aspect of the present invention includes a laminate including a plurality of stacked dielectric layers, a conductor layer extending along a plane intersecting the stacking direction of the plurality of dielectric layers, and an inductor including a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer. The conductor layer includes a first portion and a second portion that extend in a direction intersecting the arrangement direction of the first columnar conductor and the second columnar conductor, extend in different directions from each other, and have different lengths from each other.

[0144] In the multilayer electronic component according to the second aspect of the present invention, the conductor layer may further include a curved portion extending in a curved manner and disposed between the first portion and the second portion in the longitudinal direction of the conductor layer.

[0145] In the multilayer electronic component according to the second aspect of the present invention, the laminate may have a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface may face in opposite directions. The third side surface and the fourth side surface may face in opposite directions. The inductor may be disposed closer to the first side surface than the second side surface. The first portion may include one end of the conductor layer and extend so as to approach the second side surface as it moves away from the one end. The second portion may include the other end of the conductor layer and extend so as to approach the second side surface as it moves away from the other end.

[0146] In the multilayer electronic component according to the second aspect of the present invention, the distance between the second columnar conductor and the first side surface may be larger than the distance between the first columnar conductor and the first side surface. [Explanation of symbols]

[0147] 1...laminated electronic component, 2...first signal terminal, 3...second signal terminal, 10...first high-pass filter, 20...second high-pass filter, 30...low-pass filter, 50...laminated body, 50A...first surface, 50B...second surface, 50C to 50F...side surfaces, 111 to 113...electrodes, C11 to C14, C21 to C24, C31 to C35...capacitors, L11...first inductor, L21...second inductor, L31...third inductor, L32...fourth inductor.

Claims

1. a laminate including a plurality of dielectric layers stacked together; a first inductor including: a first conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers; a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer; and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer; a second inductor including a second conductor layer extending along a plane intersecting the stacking direction, a third columnar conductor extending in a direction parallel to the stacking direction and connected to a portion of the second conductor layer in the vicinity of one end thereof, and a fourth columnar conductor extending in a direction parallel to the stacking direction and connected to a portion of the second conductor layer in the vicinity of the other end thereof; the laminate has a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface, the first side and the second side face opposite each other; the third side and the fourth side face opposite each other; the first inductor is disposed closer to the first side surface than to the second side surface; the second inductor is disposed closer to the second side surface than to the first side surface; at least a portion of the first conductor layer extends in a direction intersecting a direction in which the first columnar conductor and the second columnar conductor are arranged side by side at an angle other than an odd multiple of 90°; a first conductive layer extending in a direction intersecting the direction in which the third columnar conductor and the fourth columnar conductor are arranged at an angle other than an odd multiple of 90°;

2. the first inductor is disposed closer to the third side surface than to the fourth side surface; 2. The multilayer electronic component according to claim 1, wherein the second inductor is disposed closer to the fourth side surface than to the third side surface.

3. the first conductor layer includes a first portion extending toward the second side surface as it moves away from the one end of the first conductor layer, and a second portion extending toward the second side surface as it moves away from the other end of the first conductor layer, 2. The multilayer electronic component according to claim 1, wherein the second conductor layer includes a third portion extending so as to approach the first side surface with increasing distance from the one end of the second conductor layer, and a fourth portion extending so as to approach the first side surface with increasing distance from the other end of the second conductor layer.

4. each of the first conductor layer and the second conductor layer includes a straight portion extending linearly; 2. The multilayer electronic component according to claim 1, wherein the straight portion of the first conductor layer and the straight portion of the second conductor layer are parallel to each other.

5. the first conductor layer includes a first portion extending in one direction and a second portion extending in a direction different from the first portion and having a length different from that of the first portion; 2. The multilayer electronic component according to claim 1, wherein the second conductor layer includes a third portion extending in one direction, and a fourth portion extending in a different direction from the third portion and having a different length from the third portion.

6. 6. The multilayer electronic component according to claim 5, wherein the distance from the second portion to the fourth portion is smaller than the distance from the first portion to the third portion.

7. 2. The multilayer electronic component according to claim 1, wherein each of the first conductor layer and the second conductor layer includes a curved portion that extends in a curved manner.

8. a direction perpendicular to the stacking direction and in which the first side surface and the second side surface are aligned is defined as a first direction, and a direction perpendicular to the stacking direction and in which the third side surface and the fourth side surface are aligned is defined as a second direction, the second columnar conductor and the fourth columnar conductor are disposed between the first columnar conductor and the third columnar conductor in the second direction, 2. The multilayer electronic component according to claim 1, wherein a distance between the second columnar conductor and the fourth columnar conductor in the first direction is smaller than a distance between the first columnar conductor and the third columnar conductor in the first direction.

9. Further, a first high pass filter; A second high pass filter; and In terms of circuit configuration, a low-pass filter is provided between the first high-pass filter and the second high-pass filter, the first high-pass filter includes the first inductor; 9. The multilayer electronic component according to claim 1, wherein the second high-pass filter includes the second inductor.

10. the low-pass filter includes a third inductor and a fourth inductor, each of which includes a conductor layer extending along the plane and a pair of columnar conductors extending in a direction parallel to the stacking direction and connected to the conductor layer; 10. The multilayer electronic component according to claim 9, wherein the third inductor and the fourth inductor are arranged in a direction intersecting a direction in which the first inductor and the second inductor are arranged.

11. a laminate including a plurality of dielectric layers stacked together; an inductor including a conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer; the conductor layer includes a first portion and a second portion each extending in a direction intersecting a direction in which the first columnar conductor and the second columnar conductor are arranged, extending in different directions, and having different lengths.

12. 12. The multilayer electronic component according to claim 11, wherein the conductor layer further includes a curved portion extending in a curved manner and disposed between the first portion and the second portion in the longitudinal direction of the conductor layer.

13. the laminate has a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface, the first side and the second side face opposite each other; the third side and the fourth side face opposite each other; the inductor is disposed closer to the first side surface than to the second side surface; the first portion includes the one end of the conductor layer and extends toward the second side surface as it moves away from the one end, 12. The multilayer electronic component according to claim 11, wherein the second portion includes the other end of the conductor layer and extends so as to approach the second side surface with increasing distance from the other end.

14. the laminate has a first surface and a second surface located at both ends in the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface, the first side and the second side face opposite each other; the third side and the fourth side face opposite each other; 12. The multilayer electronic component according to claim 11, wherein a distance between the second columnar conductor and the first side surface is larger than a distance between the first columnar conductor and the first side surface.

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