Method for manufacturing light-emitting device

Abstract

To provide a method for manufacturing a light-emitting device that has excellent luminous efficacy, prevents a variation in light-emitting characteristics, and has excellent long-term reliability.SOLUTION: In a step of forming a first insulating film 3 on a first end face 20a of a light-emitting element precursor 20, a light-emitting device 1 has a laminate and the first insulating film. The laminate has a plurality of semiconductor layers, and includes the first end face 20a, a second end face 20b facing the first end face 20a, and a pair of side faces 20c connecting the first end face 20a and the second end face 20b to each other. The first insulating film is located from the first end face 20a up to at least one of the pair of side faces 20c.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to light-emitting devices. [Background technology]

[0002] Conventionally, various light emitting elements such as semiconductor lasers and light emitting diodes have been proposed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2005-203588 Summary of the Invention

[0004] The light-emitting element of the present disclosure comprises a laminate having a plurality of semiconductor layers, the laminate including a first end face, a second end face opposing the first end face, and a pair of side faces connecting the first end face and the second end face, and a first insulating film positioned across from the first end face to at least one of the pair of side faces. [Brief description of the drawings]

[0005] [Figure 1] FIG. 1 is a perspective view showing a light-emitting device according to an embodiment of the present disclosure. [Diagram 2] 2 is a side view showing the light emitting element of FIG. 1. [Diagram 3] FIG. 13 is a side view illustrating a modified example of the light-emitting element according to the embodiment of the present disclosure. [Figure 4] 2 is a side view showing a state in which the light emitting element in FIG. 1 is mounted on a supporting base. [Diagram 5] 5 is a cross-sectional view taken along the cutting line VV in FIG. 4. [Figure 6] 11 is a side view showing a state in which a light-emitting element according to another embodiment of the present disclosure is mounted on a supporting base. [Figure 7] FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. [Figure 8]4A to 4C are cross-sectional views illustrating a mask formation step in the manufacturing method of the light-emitting element. [Figure 9] 4A to 4C are cross-sectional views illustrating an element layer forming step in the method for manufacturing a light-emitting element. [Figure 10] 4A to 4C are cross-sectional views illustrating an element layer forming step in the method for manufacturing a light-emitting element. [Figure 11] 4A to 4C are cross-sectional views illustrating an element layer forming step in the method for manufacturing a light-emitting element. [Figure 12] 4A to 4C are cross-sectional views illustrating an element layer forming step in the method for manufacturing a light-emitting element. [Figure 13] 4A to 4C are cross-sectional views illustrating an element layer separation step in the method for manufacturing a light-emitting element. [Figure 14] 4A to 4C are cross-sectional views illustrating an element layer separation step in the method for manufacturing a light-emitting element. [Figure 15] 4A to 4C are cross-sectional views illustrating an element layer separation step in the method for manufacturing a light-emitting element. [Figure 16] FIG. 4 is a front view illustrating an insulating film forming step in the method for manufacturing the light-emitting element. [Figure 17] FIG. 1 is a cross-sectional view of an example of a semiconductor laser element. [Figure 18] FIG. 2 is a side view of an example of a semiconductor laser element. [Figure 19] 4 is a flowchart showing an example of a method for manufacturing a semiconductor laser device. [Figure 20] 1 is a block diagram showing a configuration of a manufacturing apparatus for a semiconductor laser device; [Figure 21] FIG. 11 is a cross-sectional view of another example of a semiconductor laser element. [Figure 22] FIG. 11 is a side view of another example of the semiconductor laser element. [Figure 23] FIG. 1 is a perspective view of an example of a semiconductor laser element. [Figure 24] FIG. 1 is a perspective view of an example of a semiconductor laser element. [Diagram 25] FIG. 25 is a side view of the semiconductor laser device of FIG. 24. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] Hereinafter, the light-emitting device according to the embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is a perspective view showing the light-emitting device according to the embodiment of the present disclosure, FIG. 2 is a side view showing the light-emitting device of FIG. 1, and FIG. 3 is a side view showing the light-emitting device of the embodiment of the present disclosure. FIG. 4 is a side view showing the state in which the light-emitting device of FIG. 1 is mounted on a support base, and FIG. 5 is a cross-sectional view cut along the cutting line VV of FIG. 4. The side view shown in FIG. 3 corresponds to the side view shown in FIG. 2. In FIG. 4, the first insulating film and the second insulating film are hatched. The drawings are schematic, and the dimensional ratios and the like on the drawings do not necessarily correspond to the actual ones. In this specification, names such as "upper surface" and "lower surface" are merely names described for convenience of explanation, and do not specify the orientation of the light-emitting device during operation.

[0007] The light emitting element 1 of this embodiment includes a laminate 2 and a first insulating film 3.

[0008] The laminate 2 includes a first end face 2a, a second end face 2b facing the first end face 2a, and a pair of side faces 2c connecting the first end face 2a and the second end face 2b. The first end face 2a and the second end face 2b are cavity faces (cavity end faces) of the light-emitting element 1. The laminate 2 further includes a first main surface 2d and a second main surface 2e connected to the first end face 2a, the second end face 2b, and the pair of side faces 2c.

[0009] The laminate 2 has a substantially rectangular parallelepiped shape, for example, as shown in Figures 1 and 2. The laminate 2 includes a plurality of semiconductor layers. The plurality of semiconductor layers are stacked in a direction perpendicular to the longitudinal direction of the laminate 2 (hereinafter also referred to as the stacking direction).

[0010] The multiple semiconductor layers include, for example, an n-type semiconductor layer 21, an active layer 22, and a p-type semiconductor layer 23. The n-type semiconductor layer 21, the active layer 22, and the p-type semiconductor layer 23 are exposed to a first end face 2a, a second end face 2b, and a pair of side faces 2c of the laminate 2. The n-type semiconductor layer 21 includes a first main surface 2d of the laminate 2, and the p-type semiconductor layer 23 includes a second main surface 2e of the laminate 2. In other words, the first main surface 2d corresponds to one main surface 21a of the n-type semiconductor layer 21, and the second main surface 2e corresponds to one main surface 23a of the p-type semiconductor layer 23.

[0011] The laminate 2 may have a length in the longitudinal direction of, for example, 50 to 1500 μm. The laminate 2 may have a thickness in the stacking direction of, for example, 5 μm or more, or 10 μm or more.

[0012] The n-type semiconductor layer 21, the active layer 22, and the p-type semiconductor layer 23 are made of a GaN-based semiconductor such as gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or aluminum indium gallium nitride (AlInGaN). x Ga y In z N(0≦x≦1; 0≦y≦1; 0≦z≦1; x+y+z=1).

[0013] The n-type semiconductor layer 21 is an n-type GaN-based semiconductor doped with n-type impurities. The p-type semiconductor layer 23 is a p-type GaN-based semiconductor doped with p-type impurities. The n-type impurities may be Si or the like. The p-type impurities may be Mg or the like.

[0014] The active layer 22 may have a multiple quantum well structure formed by alternately stacking barrier layers and well layers. The GaN-based semiconductor constituting the barrier layers and the GaN-based semiconductor constituting the well layers may have different compositions or composition ratios.

[0015] A first electrode (also referred to as an n-type electrode) 24 is disposed on the first main surface 2d of the laminate 2. The n-type electrode 24 is connected to the n-type semiconductor layer 21. A second electrode (also referred to as a p-type electrode) 25 is disposed on the second main surface 2e of the laminate 2. The p-type electrode 25 is connected to the p-type semiconductor layer 23. The n-type electrode 24 may have a single layer structure of Ti, Al, Au, or the like, or may have a multilayer structure combining these. The p-type electrode 25 may have a single layer structure of indium tin oxide (ITO), Ni, Au, or the like, or may have a multilayer structure combining these.

[0016] 1, the laminate 2 may have a ridge waveguide 26 provided in the p-type semiconductor layer 23. The ridge waveguide 26 may be formed over the entire longitudinal direction of the laminate 2. When the laminate 2 has the ridge waveguide 26, the p-type electrode 25 is disposed in a region of the lower surface of the p-type semiconductor layer 23 that overlaps with the ridge waveguide 26 when viewed in the stacking direction. In addition, an insulating layer 27 made of SiO2 or the like is disposed in a region of the lower surface of the p-type semiconductor layer 23 where the p-type electrode 25 is not disposed.

[0017] The first end face 2a and the second end face 2b are resonator faces of the laminate 2. In the light-emitting element 1, the first end face 2a may be a light emitting face and the second end face 2b may be a light reflecting face, or the first end face 2a may be a light reflecting face and the second end face 2b may be a light emitting face. At least one of the first end face 2a and the second end face 2b may be a cleavage face formed by cleaving the precursor of the laminate 2. In addition, at least one of the first end face 2a and the second end face 2b may have a crystal face having a crystal orientation of the (1-100) face. In other words, at least one of the first end face 2a and the second end face 2b may be a face obtained by cleaving the precursor of the laminate 2 on a face that is easy to cleave. This can simplify the manufacturing process of the light-emitting element 1. In addition, it can reduce the risk that the resonator face of the laminate 2 will be damaged by etching.

[0018] At least one of the first end face 2a and the second end face 2b may be an etched mirror surface formed by subjecting the precursor of the laminate 2 to gas phase etching such as inductively coupled plasma reactive ion etching, wet etching using a solution such as KOH, etc. This makes it possible to easily form the resonator facets even when it is not easy to cleave the precursor of the laminate 2.

[0019] The first insulating film 3 is located from the first end face 2a to at least one of the pair of side faces 2c. x S w O y N z The first insulating film 3 may be made of an insulating material represented by the formula (I). The first insulating film 3 may be a single layer film of Al2O3, AlN, or the like. The first insulating film 3 may be a single layer film of MgF2, MgO, Nb2O5, SiO2, Si3N4, TiO2, Ta2O5, Y2O3, ZnO, ZrO2, or the like, or a multilayer film combining these. The first insulating film 3 can be formed by using a sputtering method, an electron beam deposition method, or the like. The thicker the laminate 2 is, the more likely the first insulating film 3 is to wrap around from the first end face 2a to the pair of side faces 2c. The first insulating film 3 located on the first end face 2a and the first insulating film 3 located on at least one of the pair of side faces 2c may have the same film configuration or may have different film configurations.

[0020] Since the first insulating film 3 is located on the first end face 2a, the light emitting element 1 can reduce optical damage at the end face, and therefore is a highly reliable, high-output light emitting element. Furthermore, since the first insulating film 3 is located from the first end face 2a to at least one of the pair of side faces 2c, the light emitting element 1 can reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25. Therefore, the light emitting element 1 is less likely to fluctuate in its light emitting characteristics, and is a light emitting element with excellent long-term reliability.

[0021] 1 and 2, the light-emitting element 1 may include a second insulating film 4. The second insulating film 4 may be located from the second end face 2b to at least one of the pair of side faces 2c.

[0022] The second insulating film 4 may be a multi-layer film in which SiO2 and TiO2 are alternately laminated. x S w O y N z The second insulating film 4 may be a single layer film made of an insulating material represented by the formula (I). The second insulating film 4 may be a single layer film made of Al2O3 or AlN. The second insulating film 4 may be a single layer film made of MgF2, MgO, Nb2O5, SiO2, Si3N4, TiO2, Ta2O5, Y2O3, ZnO, ZrO2, or the like, or a multilayer film made by combining these. The second insulating film 4 can be formed by using a sputtering method, an electron beam deposition method, or the like. The second insulating film 4 located on the second end face 2b and the second insulating film 4 located on at least one of the pair of side faces 2c may have the same configuration or different configurations.

[0023] When the second insulating film 4 is located on the second end face 2b, the light emitting element 1 can reduce leakage of light from the second end face 2b, and therefore has excellent light emitting efficiency. Furthermore, when the second insulating film 4 is located from the second end face 2b to at least one of the pair of side faces 2c, the light emitting element 1 can effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25. Therefore, the light emitting element 1 has less fluctuation in light emitting characteristics and has excellent long-term reliability.

[0024] The material used for the second insulating film 4 may be different from the material used for the first insulating film 3. This makes it possible to set the reflectance of the first insulating film 3 and the reflectance of the second insulating film 4 independently of each other. As a result, it is possible to reduce optical damage at the end face and to reduce leakage of light from the second end face 2b, thereby making the light-emitting element 1 a high-output light-emitting element with excellent luminous efficiency.

[0025] The first main surface 2d of the laminate 2 may have a non-electrode region 2d1 where the n-type electrode 24 is not arranged, as shown in FIG. 1, for example. In this case, the first insulating film 3 may be located from the first end face 2a to the non-electrode region 2d1. The first insulating film 3 is located from the first end face 2a to the first main surface 2d where the n-type electrode 24 is arranged, so that the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25 can be effectively reduced. Note that the portion of the first insulating film 3 located on at least one of the pair of side faces 2c and the portion of the first insulating film 3 located in the non-electrode region 2d1 may have the same film configuration or different film configurations.

[0026] 1, an end portion 3a (end portion closer to the second end surface 2b) of a portion located on at least one of the pair of side surfaces 2c may be located closer to the second end surface 2b than an end portion 3b (end portion closer to the second end surface 2b) of a portion located in the non-electrode region 2d1. This makes it possible to reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25 while keeping the area of ​​the n-type electrode 24 covered by the first insulating film 3 small (i.e., while maintaining electrical continuity between the n-type electrode 24 and the p-type electrode 25).

[0027] 3, the first insulating film 3 or the second insulating film 4 may cover at least one of the pair of side surfaces 2c. In other words, one of the first insulating film 3 and the second insulating film 4 may cover the entirety of at least one of the pair of side surfaces 2c. This can effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25.

[0028] The first insulating film 3 and the second insulating film 4 may have a reflectance of the second insulating film 4 greater than that of the first insulating film 3. This can reduce optical damage at the end facet and reduce leakage of light from the second end facet 2b, making the light-emitting element 1 a high-output light-emitting element with excellent luminous efficiency. The reflectance of the first insulating film 3 may be, for example, 5 to 99%. The reflectance of the second insulating film 4 may be, for example, 90 to 100%.

[0029] The light emitting element 1 may be configured to include a support base (base) 5, as shown in, for example, FIGS. 4 and 5. The support base 5 may be used as a submount when mounting the light emitting element 1 in a semiconductor package such as a TO-CAN package. An n-type electrode pad (not shown) and a p-type electrode pad (not shown) are arranged on one main surface 5a of the support base 5. The n-type electrode 24 and the p-type electrode 25 are electrically connected to the n-type electrode pad and the p-type electrode pad, respectively. The n-type electrode 24 is connected to the n-type electrode pad via a first junction layer 51. The p-type electrode 25 is connected to the p-type electrode pad via a wiring electrode 52. An insulating layer 53 is arranged between the n-type semiconductor layer 21, the active layer 22, the p-type semiconductor layer 23, the first junction layer 51, and the wiring electrode 52. The insulating layer 53 electrically insulates the n-type semiconductor layer 21, the active layer 22, the p-type semiconductor layer 23, the first junction layer 51, and the wiring electrode 52.

[0030] At least one of the first insulating film 3 and the second insulating film 4 may be located on at least one of a pair of side surfaces 5c of the support base 5, as shown in Figures 4 and 5, for example. The first insulating film 3 and the second insulating film 4 may or may not be located on the other main surface 5b of the support base 5. The first insulating film 3 and the second insulating film 4 may or may not cover the insulating layer 27 and the wiring electrode 52 located on the insulating layer 27.

[0031] The first insulating film 3 or the second insulating film 4 may be located across both of the pair of side surfaces 2c, as shown in Figures 4 and 5. By having one of the first insulating film 3 and the second insulating film 4 located across both of the pair of side surfaces 2c, it is possible to effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25. As a result, the light-emitting element 1 can be a light-emitting element whose light-emitting characteristics are less likely to fluctuate and which has excellent long-term reliability.

[0032] The first insulating film 3 or the second insulating film 4 may be located from the first end face 2a or the second end face 2b to the p-type electrode 25, as shown in Figs. 4 and 5. The first insulating film 3 or the second insulating film 4 being in contact with the p-type electrode 25 can effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25. In the light-emitting element 1, the first insulating film 3 may be located from the first end face 2a to the p-type electrode 25, and the second insulating film 4 may be located from the second end face 2b to the p-type electrode 25. In this case, the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25 can be further effectively reduced.

[0033] For example, as shown in FIG. 4, on a pair of side surfaces 2c, the region where the second insulating film 4 is disposed may be larger than the region where the first insulating film 3 is disposed.

[0034] Furthermore, the thickness of the first insulating film 3 may be thinner than the thickness of the second insulating film 4. This makes it possible to more effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25.

[0035] 4, the first insulating film 3 and the second insulating film 4 may overlap on a pair of side surfaces 2c. This makes it possible to more effectively reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25. The first insulating film 3 and the second insulating film 4 may be configured such that a portion of the second insulating film 4 is located between the side surface 2c and the first insulating film 3.

[0036] Next, a light-emitting device according to another embodiment of the present disclosure will be described. Fig. 6 is a side view showing the light-emitting device according to another embodiment of the present disclosure, and Fig. 7 is a cross-sectional view taken along the line VII-VII in Fig. 6. In Fig. 6, the first insulating film and the second insulating film are hatched. The light-emitting device according to this embodiment is different from the light-emitting device according to the above embodiment in the shape of the laminate and the position of the first electrode, and otherwise has the same configuration. Therefore, the same reference symbols as those in the light-emitting device 1 are used for the similar configuration, and detailed description thereof will be omitted.

[0037] 6 and 7, the light-emitting element 1A of the present embodiment has a single-sided electrode structure in which both the n-type electrode 24 and the p-type electrode 25 are located on one side in the stacking direction (the up-down direction in Figs. 6 and 7). The stack 2 is removed from the p-type semiconductor layer 23 side until the n-type semiconductor layer 21 is exposed, and the n-type electrode 24 is disposed on the surface of the n-type semiconductor layer 21 exposed by the removal.

[0038] In the light emitting element 1A with a single-sided electrode structure, the surface of the n-type semiconductor layer 21 connected to the n-type electrode 24 and the surface of the p-type semiconductor layer 23 connected to the p-type electrode 25 can be the (0001) plane of a GaN-based semiconductor. This makes it possible to reduce the contact resistance between the n-type semiconductor layer 21 and the n-type electrode 24, and the contact resistance between the p-type semiconductor layer 23 and the p-type electrode 25. The light emitting element 1A makes it possible to reduce the power consumption of the light emitting element.

[0039] The light emitting element 1A includes a support base 5, as shown in, for example, FIGS. 6 and 7. The support base 5 may be used as a submount when mounting the light emitting element 1A in a semiconductor package such as a TO-CAN package. An n-type electrode pad (not shown) and a p-type electrode pad (not shown) are disposed on one main surface 5a of the support base 5. The n-type electrode 24 and the p-type electrode 25 are electrically connected to the n-type electrode pad and the p-type electrode pad, respectively. The n-type electrode 24 is connected to the n-type electrode pad via a third bonding layer 54. The p-type electrode 25 is connected to the p-type electrode pad via a fourth bonding layer 55.

[0040] The first insulating film 3 is located from the first end face 2a of the laminate 2 to at least one of the pair of side faces 2c, as shown in Figures 6 and 7, for example. This makes it possible to reduce optical damage to the end face of the light-emitting element 1A, making it a highly reliable, high-output light-emitting element. Furthermore, the second insulating film 4 is located from the second end face 2b of the laminate 2 to at least one of the pair of side faces 2c, as shown in Figures 6 and 7, for example. This makes it possible to reduce the risk of leakage current occurring between the n-type electrode 24 and the p-type electrode 25, making the light-emitting element 1A a light-emitting element with less fluctuation in light-emitting characteristics and excellent long-term reliability.

[0041] At least one of the first insulating film 3 and the second insulating film 4 may be located on at least one of a pair of side surfaces 5c of the support base 5, as shown in Figures 6 and 7, for example. The first insulating film 3 and the second insulating film 4 may or may not be disposed on the other main surface 5b of the support base 5. The first insulating film 3 and the second insulating film 4 may be in contact with at least one of the third bonding layer 54 and the fourth bonding layer 55.

[0042] Next, an example of a method for manufacturing the light-emitting element 1 will be described. The manufacturing method described below is a method for manufacturing the light-emitting element 1 using an epitaxial lateral overgrowth (ELO) method, and includes a substrate preparation step, a mask formation step, an element layer formation step, an element layer separation step, and a dielectric film formation step. Fig. 8 is a cross-sectional view illustrating the mask formation step in the method for manufacturing the light-emitting element, Figs. 9 to 12 are cross-sectional views illustrating the element layer formation step in the method for manufacturing the light-emitting element, Figs. 13 to 15 are cross-sectional views illustrating the element layer separation step in the method for manufacturing the light-emitting element, and Fig. 16 is a front view illustrating the insulating film formation step in the method for manufacturing the light-emitting element.

[0043] (Substrate preparation process) The substrate preparation step is a step of preparing a base substrate (hereinafter, also simply referred to as substrate) 10. The substrate 10 has one main surface 10a including the growth starting point of the semiconductor element layer. The surface layer of the substrate 10 including the one main surface 10a is composed of a nitride semiconductor. The substrate 10 is, for example, a gallium nitride (GaN) substrate cut out from a GaN single crystal ingot. The substrate 10 may be doped with n-type impurities or p-type impurities. The substrate 10 may be a substrate having a GaN-based semiconductor layer formed on the surface of a Si substrate, a sapphire substrate, a SiC substrate, or the like. The "GaN-based semiconductor" referred to here may be, for example, an Al x Ga y In z N(0≦x≦1; 0≦y≦1; 0≦z≦1; x+y+z=1).

[0044] (Mask formation process) The mask formation step is a step of forming a mask 11 for reducing the growth of a semiconductor element layer in a predetermined pattern on one main surface 10a of the substrate 10. The mask 11 is made of, for example, SiO2, SiN, Al2O3, or the like, and can be formed using photolithography and etching techniques.

[0045] 8, the mask 11 may have a striped pattern in which a plurality of band-shaped portions 11a extending in a first direction (depth direction in FIG. 8) are periodically arranged in a second direction (left-right direction in FIG. 8) intersecting the first direction. The semiconductor element layer grows from a region G (hereinafter also referred to as a growth region) not covered by the mask 11 on one main surface 10a. The pattern of the mask 11 may be a striped pattern or a lattice pattern in which a plurality of band-shaped portions are arranged to intersect with each other.

[0046] (Device layer formation process) The element layer formation step is a step of vapor-growth, using the ELO method, a semiconductor element layer (hereinafter also simply referred to as element layer) 12 made of a nitride semiconductor from the growth region G of the substrate 10 onto the strip portions 11a of the mask 11.

[0047] In the element layer formation process, a vapor phase epitaxy method such as the hydride vapor phase epitaxy (HVPE) method, which uses chlorides as Group III (Group 13 element) raw materials, the metal organic chemical vapor deposition (MOCVD) method, which uses organic metals as Group III raw materials, or the molecular beam epitaxy (MBE) method can be used.

[0048] When the element layer 12 is grown by the MOCVD method, first, the substrate 10 on which the mask 11 is patterned is inserted into a reaction chamber of an epitaxial device. Then, while supplying hydrogen gas, nitrogen gas, or a mixed gas of hydrogen and nitrogen, and a Group V source gas (containing a Group 15 element) such as ammonia, the substrate 10 is heated to a predetermined growth temperature (for example, 1050 to 1100° C.).

[0049] Subsequently, after the temperature of the substrate 10 has stabilized, in addition to the above-mentioned mixed gas and Group V source gas, a Group III (containing a Group 13 element) source such as trimethylgallium (TMG) is supplied to vapor-grow the element layer 12 from the growth region G. At this time, a source gas containing an n-type or p-type impurity is supplied and the doping amount is adjusted, whereby a nitride semiconductor layer of a desired conductivity type can be grown.

[0050] The growth of the element layer 12 is terminated before the element layers 12 growing from the adjacent growth regions G come into contact with or overlap with each other. This is because when the element layers 12 come into contact with each other, crystal defects such as cracks or threading dislocations are likely to occur at the contact portions. After the growth of the element layer 12 is terminated, the substrate 10 is removed from the vapor phase growth apparatus. In this way, the element layer 12 can be formed by stacking an n-type semiconductor layer 121, an active layer 122, and a p-type semiconductor layer 123 in this order from the substrate 10 side, as shown in FIG. 9, for example.

[0051] Next, as shown in FIG. 10, the p-type semiconductor layer 123 is partially removed from one main surface (upper surface) 123a to form a ridge waveguide 124. Then, as shown in FIG. 11, an insulating layer 125 made of SiO2 or the like is formed on the side surface of the ridge waveguide 124 and on the surface of the p-type semiconductor layer 123 in a region located to the side of the ridge waveguide 124. Furthermore, a p-type electrode 126 made of ITO, Ni, Au or the like is formed on the upper surface 123a of the p-type semiconductor layer 123. The ridge waveguide 124 can be formed by photolithography and etching. The insulating layer 125 can be formed by plasma enhanced chemical vapor deposition (PCVD) or the like. The p-type electrode 126 can be formed by sputtering, electron beam deposition or the like.

[0052] Next, scribe lines for cleavage are formed at two locations in a first direction (depth direction in FIG. 9) of the grown element layer 12, and then an external force is applied to the element layer 12 to break the element layer 12 along the scribe lines, thereby forming a first end facet and a second end facet. At least one of the first end facet and the second end facet may be an etched mirror surface. The first end facet and the second end facet may be formed at any time before starting the insulating film formation process.

[0053] Thereafter, etching is performed using an etchant that does not substantially attack the element layer 12 to remove the mask 11. As a result, as shown in FIG. 12, for example, a light-emitting element precursor 20 connected to the substrate 10 by a connection portion 20d located on one main surface 10a is obtained.

[0054] (Device layer separation process) The element layer separation step is a step of separating the light emitting element precursor 20 from the substrate 10 and forming the n-type electrode 127. In the element layer separation step, first, a support substrate 30 having an adhesive layer (not shown) disposed on one main surface (lower surface) 30a is prepared. The adhesive layer may be, for example, solder made of AuSn or the like. Then, the lower surface 30a of the support substrate 30 is made to face one main surface 10a of the substrate 10. Then, the support substrate 30 is pressed toward the substrate 10, and the adhesive layer is heated, so that the light emitting element precursor 20 is adhered to the adhesive layer, for example, as shown in FIG. 13. Then, an external force is applied so as to peel the light emitting element precursor 20 integrated with the support substrate 30 upward, the connection portion 20d is broken, and the light emitting element precursor 20 is lifted up from one main surface 10a of the substrate 10. This allows the light emitting element precursor 20 to be separated from the substrate 10, for example, as shown in FIG. 14.

[0055] 15, an n-type electrode 127 made of Ti, Al, Au, or the like is formed on one main surface (upper surface) 121a of the n-type semiconductor layer 121. The n-type electrode may be formed only on a part of the upper surface 121a so that the upper surface 121a has a non-electrode region (i.e., a region where the n-type electrode 127 is not disposed). The n-type electrode 127 can be formed by using a sputtering method, an electron beam evaporation method, or the like.

[0056] (Insulating film formation process) The insulating film forming step is a step of forming a first insulating film 3 on a first end face 20a of the light-emitting element precursor 20, as shown in FIG. 16, for example. The first insulating film 3 can be formed by sputtering, electron beam deposition, or the like using the above-mentioned material. At that time, the first insulating film 3 is also formed on at least one of a pair of side faces 20c connecting the first end face 20a and the second end face 20b of the light-emitting element precursor 20 by appropriately selecting sputtering conditions and deposition conditions. In addition, in the insulating film forming step, a second insulating film 4 may be formed on the second end face 20b of the light-emitting element precursor 20 that faces the first end face 20a.

[0057] In this manner, the light-emitting element 1 can be manufactured. The first end face 20a and the second end face 20b are the resonator faces of the light-emitting element 1. The support substrate 30 may be removed from the light-emitting element 1 after the insulating film forming step is completed, or may be used as a sub-mount when the light-emitting element 1 is mounted in a semiconductor package.

[0058] FIG. 17 is a cross-sectional view of an example of a semiconductor laser element. FIG. 18 is a side view of an example of a semiconductor laser element. As shown in FIG. 17 and FIG. 18, a semiconductor laser element 70 includes a base 5, a nitride semiconductor layer 38 located above the base 5 and including an optical resonator 39, a first light reflecting film 3r in contact with one (2a) of a pair of resonator end faces 2a and 2b of the optical resonator 39, and a first dielectric film (dielectric film) 3y made of the same material as the first light reflecting film 3r and in contact with a side face 38S along the resonator length direction of the nitride semiconductor layer 38. The first dielectric film 3y may be a light reflective laminated film. The base 5 may be a submount substrate (e.g., a Si substrate, a SiC substrate) (not a substrate for growing a nitride semiconductor). The resonator end face 2a may be an end face on the light reflecting side, and the resonator end face 2b may be an end face on the light emitting side.

[0059] The first light reflecting film 3r may be a dielectric film (dielectric film) made of a dielectric material containing at least one of Al2O3, AlN, MgF2, MgO, Nb2O5, SiO2, Si3N4, TiO2, Ta2O5, Y2O3, ZnO, and ZrO2. The nitride semiconductor layer 38 may be, for example, Al x Ga y In zN (0≦x≦1; 0≦y≦1; 0≦z≦1; x+y+z=1). The nitride semiconductor layer 38 may include an n-type semiconductor layer 21, an active layer 22, and a p-type semiconductor layer 23. The n-type semiconductor layer 21 and the p-type semiconductor layer 23 may each include an optical guide layer and a clad layer. A ridge may be provided in the p-type semiconductor layer 23. An insulating layer 27 may be provided so as to cover the side surface of the ridge. The first dielectric film 3y may be in contact with at least one side surface of the n-type semiconductor layer 21, the active layer 22, and the p-type semiconductor layer 23. The light generated by the recombination of the electrons from the n-type semiconductor layer 21 and the holes from the p-type semiconductor layer 23 in the active layer 22 is amplified by the optical resonator 39 and is emitted as laser light (for example, from the resonator end surface 2b). The formation of the first dielectric film 3y reduces the risk of side short circuit. In addition, it is possible to suppress side surface deterioration (for example, side surface deterioration of the active layer) of the nitride semiconductor layer 38. The cavity length (the distance between the cavity end faces) may be 200 μm or less.

[0060] The semiconductor laser element 70 may include a bonding layer M1 located on the base 5 and an electrode 25 (e.g., an anode) bonded to the bonding layer M1. The bonding layer M1 may be a solder layer containing a solder material such as Au or Sn. The nitride semiconductor layer 38 may be mounted on the base 5 having the bonding layer M1 on its surface. The first dielectric film 3y may be in contact with a side surface of the bonding layer M1. The first dielectric film 3y may be in contact with a side surface of the electrode 25 or with the insulating layer 27. The first dielectric film 3y may be in contact with a side surface 5c of the base 5. The first light reflecting film 3r and the first dielectric film 3y may be connected to each other to form the first insulating film 3.

[0061] The semiconductor laser element 70 may include (i) a second light reflecting film 4r in contact with the other (2b) of the pair of cavity end faces 2a and 2b, and (ii) a second dielectric film 4y made of the same material as the second light reflecting film 4r and in contact with a side surface 38S of the nitride semiconductor layer 38 along the cavity length direction. The second light reflecting film 4r and the second dielectric film 4y may be connected to form a second insulating film 4. When the cavity end face 2b is the light emission side, the first light reflecting film 3r may have a higher light reflectance than the second light reflecting film 4r, and the first dielectric film 3y may be thicker than the second dielectric film 4y. The area of ​​the first dielectric film 3y may be larger than the area of ​​the second dielectric film 4y.

[0062] The first light reflecting film 3r may cover the cavity end face 2a on the light reflecting side. The cavity end faces 2a and 2b may be the m-plane ({1-100} plane) of the nitride semiconductor layer 38. The semiconductor laser element 70 may include a third dielectric film 3z made of the same material as the first light reflecting film 3r and in contact with another side face 38C (the side face paired with the side face 38S) of the nitride semiconductor layer 38 along the cavity length direction. The third dielectric film 3z may be connected to the first light reflecting film 3r. The third dielectric film 3z may be in contact with a side face of the bonding layer M2 that is bonded to the electrode 24 (e.g., cathode). The third dielectric film 3z may be in contact with a side face of the electrode 24. The third dielectric film 3z may be in contact with a side face 5c of the base 5.

[0063] Fig. 19 is a flow chart showing an example of a method for manufacturing a semiconductor laser element. In Fig. 19, the steps include a step S10 of preparing a light emitter 60 including a nitride semiconductor layer 38 including an optical resonator 39 and electrodes 24 and 25, a step S20 of mounting the light emitter 60 above a base 5, and a step S30 of forming a first light reflecting film 3r in contact with one (2a) of a pair of resonator end faces 2a and 2b of the optical resonator 39 and a first dielectric film 3y made of the same material as the first light reflecting film 3r and in contact with a side face 38S of the nitride semiconductor layer 38 along the resonator length direction, on the mounted light emitter 60. A sputtering method, an electron beam deposition method, or the like can be applied to the step S30, but the first dielectric film 3y may be formed by the material (dielectric material) of the first light reflecting film 3r flowing around the side face 38S in the process of supplying the material of the first light reflecting film 3r to the resonator end face 2a. 17 and 18, in the process of supplying the material of the second light reflecting film 4r to the cavity end face 2b on the light emitting side, the material may flow around to the side face 38S to form the second dielectric film 4y. The first dielectric film 3y and the second dielectric film 4y may be in contact (overlapped). The second light reflecting film 4r and the second dielectric film 4y may be formed after the first light reflecting film 3r and the first dielectric film 3y are formed, or the first light reflecting film 3r and the first dielectric film 3y may be formed after the second light reflecting film 4r and the second dielectric film 4y are formed.

[0064] 20 is a flow chart showing an example of a manufacturing apparatus for a semiconductor laser element. The manufacturing apparatus 90 for a semiconductor laser element includes an apparatus A1 for preparing a light emitter 60 having a nitride semiconductor layer 38 including an optical resonator 39 and electrodes 24·25, an apparatus A2 for mounting the light emitter 60 above a substrate 5, an apparatus A3 for forming a first optical reflection film 3r in contact with one (2a) of a pair of resonator end faces 2a·2b of the optical resonator 39, a first dielectric film 3y made of the same material as the first optical reflection film 3r and in contact with a side surface 38S of the nitride semiconductor layer 38 along the resonator length direction, and a controller A4 for controlling the apparatuses A1·A2·A3.

[0065] FIG. 21 is a cross-sectional view of another example of a semiconductor laser element. FIG. 22 is a side view of an example of a semiconductor laser element. As shown in FIG. 21 and FIG. 22, a semiconductor laser element 70 includes a base 5, a nitride semiconductor layer 38 located above the base 5 and including an optical resonator 39, a first light reflecting film 3r in contact with one (2a) of a pair of resonator end faces 2a and 2b of the optical resonator 39, and a first dielectric film 3y made of the same material as the first light reflecting film 3r and in contact with a side face 38S of the nitride semiconductor layer 38 along the resonator length direction. The first dielectric film 3y may be in contact with at least one side face of the n-type semiconductor layer 21, the active layer 22, and the p-type semiconductor layer 23. By forming the first dielectric film 3y, the risk of side short circuit is reduced. Also, side deterioration of the nitride semiconductor layer 38 is suppressed. The resonator end face 2b may be an end face on the light emitting side.

[0066] The semiconductor laser element 70 includes a bonding layer M3 located on the base 5, and an electrode 24 (e.g., a cathode) bonded to the bonding layer M3. The bonding layer M3 may be a solder layer containing a solder material such as Au or Sn. The first dielectric film 3y may be in contact with a side surface of the bonding layer M3. The first dielectric film 3y may be in contact with a side surface of the electrode 24. The first dielectric film 3y may be in contact with a side surface 5c of the base 5. The first light reflecting film 3r and the first dielectric film 3y may be connected to form the first insulating film 3.

[0067] The semiconductor laser element 70 may include a second light reflecting film 4r in contact with the other (2b) of the pair of cavity end faces 2a and 2b, and a second dielectric film 4y made of the same material as the second light reflecting film 4r and in contact with a side surface 38S of the nitride semiconductor layer 38 along the cavity length direction. The second light reflecting film 4r and the second dielectric film 4y may be connected to form a second insulating film 4. When the cavity end face 2b is the light emission side, the first light reflecting film 3r may have a higher light reflectance than the second light reflecting film 4r, and the first dielectric film 3y may be thicker than the second dielectric film 4y. The area of ​​the first dielectric film 3y may be larger than the area of ​​the second dielectric film 4y.

[0068] The first light reflecting film 3r may cover the cavity end face 2a on the light emitting side. The semiconductor laser element 70 may include a fourth dielectric film 3f located on the opposite side of the nitride semiconductor layer 38 to the first dielectric film 3y, and the fourth dielectric film 3f may be made of the same material as the first light reflecting film 3r. The fourth dielectric film 3f may be connected to the first light reflecting film 3r. The electrode 25 (e.g., an anode) and the wiring electrode 52 may be electrically connected, and the fourth dielectric film 3f may cover the wiring electrode 52. The fourth dielectric film 3f may be in contact with the side surface 5c of the base 5.

[0069] Fig. 23 is a perspective view of an example of a semiconductor laser element. As shown in Fig. 23, in a semiconductor laser element 70, a plurality of light emitters 60 each including an optical resonator may be arranged above a base 5 in a direction (D2 direction) perpendicular to the resonator length direction (D1 direction). The semiconductor laser element 70 of Fig. 23 can be obtained by mounting the plurality of light emitters 60 above the base 5 using, for example, a transfer method, and then coating with a dielectric material.

[0070] FIG. 24 is a perspective view of an example of a semiconductor laser element. The semiconductor laser element 70 of FIG. 23 may be divided into individual pieces as shown in FIG. 24. FIG. 25 is a side view of the semiconductor laser element of FIG. 24. In the semiconductor laser element 70 shown in FIG. 24 and FIG. 25, the base 5 has a plurality of faces (5f, etc.) in addition to the face (upper face) 5j on the side where the light emitter 60 is mounted, and these faces may include the following faces. For example, the above faces may include (i) a face 5f on which a dielectric material DZ made of the same material as the first light reflecting film 3r is arranged and whose normal direction is parallel to the D1 direction, and (ii) a face 5c on which no dielectric material DZ is arranged and whose normal direction is perpendicular to the D1 direction. The dielectric material DZ provided on the face 5f can function as a protective film. On the other hand, the dielectric material DZ is not formed on the face 5c (side face), so that heat dissipation can be ensured. A configuration in which the dielectric material DZ is arranged on the face 5g facing the face 5f may also be used. The dielectric material DZ on the surface 5g located on the side of the resonator end face 2b (e.g., the laser emission surface) may be thinner than the dielectric material DZ on the surface 5f located on the side of the resonator end face 2a. The dielectric material DZ may not be arranged on the surface 5s (side surface) facing the surface 5c. The base 5 may include a SiC (silicon carbide) substrate having a higher thermal conductivity than a Si substrate.

[0071] The cutouts CA and CB may be provided in the upper part of the base 5 so as to face each other in the D1 direction. For example, a dielectric material DZ made of the same material as the first light reflecting film 3r may be arranged on at least one of the surfaces 5h (whose normal is parallel to the D1 direction), 5i (whose normal is parallel to the D2 direction), and 5k (whose normal is parallel to the D3 direction) formed in the rectangular parallelepiped cutout CA. In particular, the dielectric material DZ may be arranged on the surface of the surface 5h parallel to the cavity end face 2a. The light emitter 60 may be mounted so that the cavity end face 2b (light emission side) protrudes onto the cutout CB.

[0072] A dielectric material DZ made of the same material as the first light reflecting film 3r may be disposed on the upper surface 5j. The light emitter 60 may include an electrode 25 in contact with the nitride semiconductor layer 38, a conductive pad 5P electrically connected to the electrode 25 via a bonding layer M1 may be disposed on the upper surface 5j, and a dielectric material DZ made of the same material as the first light reflecting film 3r may be disposed on the conductive pad 5P.

[0073] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications, improvements, etc. are possible without departing from the gist of the present disclosure. [Explanation of symbols]

[0074] 1,1A Light emitting element 2. Laminate 2a 1st end surface 2b Second end face 2c side 2d 1st principal surface 2d1 Non-electrode area 2e Second main surface 21 n-type semiconductor layer 21a One main surface 22 Active layer 23 p-type semiconductor layer 23a One main surface 24 First electrode (n-type electrode, cathode) 25 Second electrode (p-type electrode, anode) 26 Ridge Waveguide 27 Insulating layer 3. First insulating film 3a,3b end 3r 1st light reflection film 3y 1st dielectric film 4. Second insulating film 4r 2nd light reflective film 4y Second dielectric film 5 Supporting base (base) 5a One main surface 5b Other main surface 5c side 51 1st bonding layer 52 Wiring electrode 53 Insulating layer 54 Third bonding layer 55 4th bonding layer 10. Underlying Substrate 10a One main surface 11. Mask 11a Belt 12 Semiconductor element layer 121 n-type semiconductor layer 121a One main surface (top surface) 122 Active layer 123 p-type semiconductor layer 123a One main surface (top surface) 124 Ridge Waveguide 125 Insulating layer 126 p-type electrode 127 n-type electrode 20 Light-emitting device precursor 20a 1st end face 20b 2nd end face 20c side 20d Connection 30 Support substrate 30a One main surface (bottom surface) M1~M3 bonding layer

Claims

1. a preparation step of preparing a semiconductor substrate including a substrate, a mask pattern having a strip-shaped mask located on the substrate and extending in a first direction, and an element layer including a nitride semiconductor grown from the substrate onto the mask; an end face forming step of forming, in the element layer, a first end face along a second direction intersecting the first direction and a second end face opposite to the first end face; a transfer step of transferring an element layer including the first end surface and the second end surface onto a support substrate; a first film forming step of forming an insulating film on the first end surface after the transfer step.

2. The method for manufacturing a light-emitting element according to claim 1 , further comprising a second film forming step of forming an insulating film on the second end surface after the transfer step.

3. The method for manufacturing a light-emitting element according to claim 1 , wherein in the first film formation step, an insulating film is formed on side surfaces intersecting with the first end surface and the second end surface.

4. The method for manufacturing a light-emitting element according to claim 1 , wherein in the first film-forming step, the insulating film is formed by a sputtering method or an electron beam deposition method.

5. 5. The method for manufacturing a light-emitting element according to claim 1, wherein the element layer is cleaved in the end face forming step.

6. 6. The method for manufacturing a light-emitting element according to claim 1, wherein in the first film formation step, the insulating film is formed on the first end face of each of a plurality of element layers.

7. The method for manufacturing a light-emitting element according to any one of claims 1 to 6, wherein in the first film formation step, the insulating film is formed on the first end face of each element layer while a plurality of element layers are arranged in the second direction.

8. 8. The method for manufacturing a light-emitting element according to claim 1, wherein at least one of the first end face and the second end face is an m-plane of the element layer.

9. The method for manufacturing a light-emitting element according to claim 2 , wherein the insulating film formed on the first end face is thicker than the insulating film formed on the second end face.

10. 10. The method for manufacturing a light-emitting element according to claim 1, wherein the end face forming step is a step of breaking the element layer.

11. the element layer includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer; The method for manufacturing a light-emitting element according to claim 3 , wherein the insulating film formed on the side surface contacts at least one side surface of the n-type semiconductor layer, the active layer, and the p-type semiconductor layer.

12. the element layer transferred to the support substrate includes a resonator; The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein a thickness direction of the element layer and a length direction of a cavity are perpendicular to each other.

13. the element layer transferred to the support substrate includes a resonator; 6. The method for manufacturing a light-emitting element according to claim 1, wherein the insulating film formed on the first end face covers an end face of the resonator.

14. the element layer transferred to the support substrate includes a resonator; 6. The method for manufacturing a light-emitting element according to claim 1, wherein the support substrate includes two cutout portions facing each other in a cavity length direction.

15. The method for manufacturing a light-emitting element according to claim 14 , wherein the insulating film is formed on the first end face in a state in which the element layer is disposed such that the second end face protrudes over one of the two cutout portions.

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