Manufacturing method of multilayer electronic component

Abstract

To provide a manufacturing method of a multilayer electronic component capable of suppressing the occurrence of short circuits between internal electrodes, and deformation of a dielectric green sheet.SOLUTION: A manufacturing method of a multilayer electronic component comprises the steps of: arranging, at a first gap g1 on a first dielectric green sheet 211, first internal electrode patterns including a first main part 221a and a first convex part 221b that is thicker than the first main part, and applying a first dielectric paste 211' to the first gap to form a first sheet S1; forming a second sheet S2 in a similar manner; and alternately arranging the first and second sheets to form a laminated bar, and cutting the laminated bar, and forming external electrodes. Therein in the step of forming the laminated bar, the first sheet is arranged so that the first dielectric paste faces downward in a lamination direction, and the second sheet is arranged so that the second dielectric paste faces upward in the lamination direction.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a multilayer electronic component. [Background technology]

[0002] Multilayer ceramic capacitors (MLCCs), which are one type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) for electric vehicles, and circuits such as DC-DC converters to charge and discharge electricity.

[0003] As multilayer electronic components become smaller and have higher capacitance, the thickness of the dielectric layers and the internal electrodes tends to decrease and the number of layers tends to increase. As the number of layers of the dielectric layers and the internal electrodes increases, a step may be formed during the lamination process because a region extending from the capacitance forming portion to the external electrode for connection with the external electrode includes only the internal electrodes connected to the external electrodes of the same polarity, unlike a capacitance forming portion that includes all of the parts of the internal electrodes connected to the external electrodes of different polarities, and such a step may cause deformation of the internal electrodes and the dielectric layers during the compression process.

[0004] In the past, in order to improve the step of the internal electrodes, in the printing process of the internal electrodes, the internal electrode pattern connected to the external electrodes is formed in the thick part, and the end of the internal electrode pattern forming the margin part is formed in the thin part, and then the ceramic green sheets are arranged to form a material sheet, and the ceramic green sheets are sandwiched between the material sheets and laminated, but there was an attempt to eliminate the step by laminating the thick part of the included internal electrode and the concave part of the thin part of the adjacent internal electrode so that they overlap in the lamination direction and applying uniform pressure in the lamination direction. However, in this case, there is a risk of short circuiting between the internal electrodes, and an additional process of arranging a separate ceramic sheet is performed, which may cause problems such as different sheet peeling and lamination work conditions, complicated process steps, and increased costs. Summary of the Invention [Problem to be solved by the invention]

[0005] One of the various objectives of the present invention is to suppress a shape that causes a short circuit between internal electrodes when a first internal electrode pattern is arranged toward the bottom in the stacking direction and a second internal electrode pattern is arranged toward the top in the stacking direction in order to eliminate steps in the internal electrodes.

[0006] One of the various objects of the present invention is to arrange the first internal electrode pattern toward the lower part in the lamination direction and arrange the second internal electrode pattern toward the upper part in the lamination direction in order to eliminate the step of the internal electrode, and to suppress the phenomenon of deformation of the existing dielectric green sheet when a separate dielectric green sheet is further arranged on the first internal electrode pattern and the second internal electrode pattern.

[0007] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0008] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention includes the steps of: arranging a first internal electrode pattern including a first main portion and a first convex portion thicker than the first main portion on a first dielectric green sheet at a first interval, and applying a first dielectric paste on the first interval and on the first internal electrode pattern to form a first sheet; arranging a second internal electrode pattern including a second main portion and a second convex portion thicker than the second main portion on a second dielectric green sheet at a second interval, and applying a second dielectric paste on the second interval and on the second internal electrode pattern to form a second sheet; arranging the first sheet and the second sheet alternately to form a laminated bar; cutting the laminated bar to form a laminate; and forming external electrodes on the laminate, wherein the step of forming the laminated bar may be performed by arranging the first sheet such that the first dielectric paste faces a lower portion in a lamination direction, and arranging the second sheet such that the second dielectric paste faces an upper portion in a lamination direction. Effect of the Invention

[0009] One of the various advantages of the present invention is that by applying a dielectric paste onto the internal electrode pattern and the dielectric green sheet on which the internal electrode pattern is not arranged, a short circuit between the internal electrodes is prevented and deformation of the dielectric green sheet is prevented.

[0010] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing a multilayer electronic component according to an embodiment. [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. [Diagram 3] 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 4]1 is a diagram illustrating a process for forming a laminated bar according to an embodiment of the present invention; [Diagram 5] 1 is a diagram illustrating a process for forming a laminate according to an embodiment of the present invention; [Figure 6] 1 is a diagram illustrating a process for forming a laminated bar according to an embodiment of the present invention; [Figure 7] 1 is a diagram illustrating a process for forming a laminated bar according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0013] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0014] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0015] Multilayer Electronic Components Before describing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention, a multilayer electronic component according to an embodiment that can be manufactured by the method for manufacturing a multilayer electronic component according to an embodiment of the present invention will be described.

[0016] FIG. 1 is a perspective view showing a multilayer electronic component according to one embodiment, FIG. 2 is a cross-sectional view taken along line II' in FIG. 1, and FIG. 3 is a cross-sectional view taken along line II-II' in FIG.

[0017] The multilayer electronic component 100 may include a body 110 including a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 arranged alternately on either side of the dielectric layer, and external electrodes 130, 140 arranged on the body 110.

[0018] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 that are alternately laminated.

[0019] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0020] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and facing each other in the third direction.

[0021] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to see without the use of a scanning electron microscope (SEM).

[0022] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained, and specific components will be described together with the description of the dielectric green sheets 211 and 212 described below.

[0023] The average thickness d of the dielectric layer 111 is not particularly limited.

[0024] In order to achieve a smaller size and higher capacity of the multilayer electronic component 100, the average thickness d of the dielectric layers 111 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness d of the dielectric layers 111 may be 2 μm or more.

[0025] The average thickness d of the dielectric layer 111 may refer to the average thickness d of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122 .

[0026] The average thickness d of the dielectric layer 111 may be measured by scanning an image of a cross section of the body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the thickness of one dielectric layer may be measured at 30 equally spaced points in the length direction in the scanned image to obtain an average value. The 30 equally spaced points may be designated as the capacitance forming portion Ac. Furthermore, if such an average value measurement is extended to 10 dielectric layers to measure the average value, the average thickness of the dielectric layer may be further generalized.

[0027] The main body 110 may include a capacitance forming portion Ac disposed inside the main body 110 and including first internal electrodes 121 and second internal electrodes 122 arranged alternately with a dielectric layer 111 in between to form a capacitance, and cover portions 112, 113 formed at the upper and lower portions of the capacitance forming portion Ac in a first direction.

[0028] In addition, the capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may refer to a region where a plurality of first internal electrodes 121 and second internal electrodes 122 overlap in the first direction with the dielectric layer 111 sandwiched therebetween.

[0029] The cover parts 112, 113 may include an upper cover part 112 disposed on one side of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed on the other side of the capacitance forming part Ac in the first direction.

[0030] The cover parts 112, 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and may essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0031] The cover portions 112 , 113 do not include an internal electrode and may comprise the same material as the dielectric layer 111 .

[0032] The cover portions 112, 113 may comprise a ceramic material, for example, barium titanate (BaTiO 3 )-based ceramic materials.

[0033] There is no need to particularly limit the average thickness of the covers 112, 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness of the covers 112, 113 can be 20 μm or less.

[0034] Margin portions 114 and 115 may be disposed on one surface and the other surface of the capacitance generating portion Ac in the third direction.

[0035] The margin portions 114, 115 may refer to the regions between both ends of the first internal electrode 121 and the second internal electrode 122 and the boundary surface of the body 110 in a cross section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0036] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0037] There is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average thickness of the marginal portions 114, 115 may be 20 μm or less.

[0038] The average width of the margin portions 114, 115 may mean the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0039] The multiple internal electrodes 121, 122 can be arranged alternately with the dielectric layer 111 in between.

[0040] The plurality of internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately arranged to face each other across the dielectric layer 111 constituting the body 110, and may be connected to a third surface 3 and a fourth surface 4 of the body 110, respectively.

[0041] Specifically, one end of the first internal electrode 121 may be connected to the third surface 3 , and one end of the second internal electrode 122 may be connected to the fourth surface 4 .

[0042] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 130 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 140 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0043] That is, the first internal electrode 121 is not connected to the second external electrode 140 but is connected to the first external electrode 130, and the second internal electrode 122 is not connected to the first external electrode 130 but is connected to the second external electrode 140. Therefore, the first internal electrodes 121 may be formed at a certain distance apart on the fourth surface 4, and the second internal electrodes 122 may be formed at a certain distance apart on the third surface 3.

[0044] At this time, the first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0045] 2, it can be seen that the thickness of the region extending from the capacitance forming portion Ac to the external electrode is thicker than the thickness of the region including the capacitance forming portion Ac of the internal electrodes 121, 122. With this configuration, it is possible to improve the connectivity between the internal electrodes 121, 122 and the external electrodes 130, 140.

[0046] 2, the thick region of the first internal electrode 121 is arranged to face one side (downward) in the first direction, and the thick region of the second internal electrode 122 is arranged to face the other side (upward) in the second direction. This makes it possible to eliminate steps during the lamination and compression process of the multilayer electronic product.

[0047] The average thickness e1 of the internal electrode region included in the capacitance forming portion Ac is not particularly limited, but when the objective is to reduce the size and increase the capacity of the multilayer electronic component 100, the average thickness e1 of the internal electrode region included in the capacitance forming portion Ac can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness e1 of the internal electrode region included in the capacitance forming portion Ac can be 2 μm or more.

[0048] The ratio of the average thickness e2 of the internal electrode region not included in the capacitance forming portion to the average thickness e1 of the internal electrode region included in the capacitance forming portion Ac is not particularly limited, but if it is greater than or equal to 1.1 and less than or equal to 2.0, it is possible to prevent short circuits between the internal electrodes 121, 122 while improving the connectivity between the internal electrodes 121, 122 and the external electrodes 130, 140.

[0049] The average thickness e1 of the internal electrode region included in the capacitance forming portion Ac can be calculated by measuring the thickness of each of the internal electrodes extracted from an image obtained by scanning a cross section of the length and thickness direction (LT) cut at the center of the width direction of the body 110 using a scanning electron microscope (SEM) at a point where the center line of the length direction of the body and the center line of the thickness direction of the body are connected, and then measuring the average value by determining five points, two on the left and two on the right side of the reference point, at equal intervals based on the point where the center line of the length direction of the body and the center line of the thickness direction of the body. The five points are two layers of internal electrodes on the top and two layers on the bottom.

[0050] The average thickness e2 of the internal electrode region not included in the capacitance forming portion Ac can be calculated by measuring the thickness of each point and then measuring the average value, based on one layer of the internal electrode at the point where the center line of the length direction of the marginal region in the capacitance forming portion Ac meets the center line of the thickness direction of the marginal region in the length direction, for a total of five layers of internal electrodes, two layers on the top and two layers on the bottom, at equal intervals, two on the left and two on the right of the point where the center line of the length direction of the marginal region in the length direction meets the center line of the thickness direction of the marginal region in the length direction.

[0051] The external electrodes 130 and 140 are disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and the first external electrode 130 may be electrically connected to the first internal electrode 121, and the second external electrode 140 may be electrically connected to the second internal electrode 122.

[0052] The number and shape of the external electrodes 130 and 140 may vary depending on the shape of the internal electrodes 121 and 122 and other purposes.

[0053] Meanwhile, the external electrodes 130, 140 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0054] For example, the external electrodes 130 and 140 may include an electrode layer disposed on the surface of the body 110 and in direct contact with the internal electrodes 121 and 122, and a plating layer formed on the electrode layer.

[0055] More specifically, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0056] The conductive metal contained in the electrode layer may be any material having excellent electrical conductivity, but is not limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0057] The plating layer serves to improve mounting characteristics. The type of plating layer is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0058] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, and may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0059] Manufacturing method for multilayer electronic components FIG. 4 is a diagram illustrating a step of forming a laminate bar according to one embodiment of the present invention, FIG. 5 is a diagram illustrating a step of forming a laminate according to one embodiment of the present invention, FIG. 6 is a diagram illustrating a step of forming a laminate bar according to one embodiment, and FIG. 7 is a diagram illustrating a step of forming a laminate bar according to one embodiment.

[0060] Hereinafter, a method for producing a multilayer electronic component and various embodiments will be described in detail with reference to FIGS.

[0061] One example of a method for improving the capacitance per unit volume of a multilayer electronic component is to increase the number of layers by thinning the dielectric layers and the internal electrodes. As the number of layers increases, the difference between the number of layers of the internal electrodes in the capacitance forming portion and the number of layers of the internal electrodes in the margin portion in the length direction also increases, so that the step between the capacitance forming portion and the margin portion in the length direction may become deeper. Such a step between the capacitance forming portion and the margin portion in the length direction may cause deformation of the internal electrodes and the dielectric layers, which may increase the deviation in thickness between the internal electrodes and the dielectric layers. As a result, when a voltage is applied to the multilayer electronic component, the electric field is amplified in the portion where the dielectric layer is formed relatively thin, and the frequency of occurrence of a dielectric breakdown phenomenon may increase.

[0062] Conventionally, in order to improve the step of the internal electrode, the internal electrode pattern that is connected to the external electrode in the internal electrode printing process is formed as a thick portion, and the end of the internal electrode pattern that forms the margin portion is formed as a thin portion. These are arranged on ceramic green sheets to form material sheets, and the ceramic green sheets are sandwiched between the material sheets and stacked. However, there have been attempts to eliminate the step by stacking the material sheets so that the recesses of the thick and thin portions of adjacent material sheets overlap in the stacking direction, and applying uniform pressure in the stacking direction.

[0063] However, when the thick and thin portions of the internal electrodes are stacked facing each other, even if a separate ceramic sheet is sandwiched between them, the gap between the thick and thin portions is narrow, which may cause a short circuit between the internal electrodes, and an additional process of disposing the separate ceramic sheet is required, which may cause problems such as different conditions for peeling and stacking the sheets, making the process more complicated and increasing costs. Furthermore, if the organic components contained in the ceramic sheets sandwiched between the material sheets are the same, the organic components of the material sheets may melt, causing the material sheets to deform.

[0064] Therefore, an embodiment of the present invention aims to prevent damage between dielectric sheets while reducing the step during lamination.

[0065] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention includes the steps of: arranging a first internal electrode pattern 221 including a first main portion 221a and a first convex portion 221b thicker than the first main portion 221a at a first interval g1 on a first dielectric green sheet 211, and applying a first dielectric paste 211′ onto the first interval g1 and the first internal electrode pattern 221 to form a first sheet S1; arranging a second internal electrode pattern 222 including a second main portion 222a and a second convex portion 222b thicker than the second main portion 222a at a second interval g2 on a second dielectric green sheet 212, and applying a first dielectric paste 211′ onto the first interval g1 and the first internal electrode pattern 221 to form a first sheet S1; The method includes the steps of applying a second dielectric paste 212' on the gap g2 and the second internal electrode pattern 2220 to form a second sheet S2, alternately arranging the first sheet S1 and the second sheet S2 to form a laminate bar 10, cutting the laminate bar 10 to form a laminate 11, and forming external electrodes 130, 140 on the laminate 11, and the step of forming the laminate bar may be performed by arranging the first sheet S1 such that the first dielectric paste 211' faces the lower portion in the stacking direction and arranging the second sheet S2 such that the second dielectric paste 212' faces the upper portion in the stacking direction.

[0066] Forming the first sheet S1 The first sheet S1 can be formed by disposing a first internal electrode pattern 221 including a first main portion 221a and a first convex portion 221b thicker than the first main portion 221a on a first dielectric green sheet 211 with a first interval g1 therebetween, and applying a first dielectric paste 211' on the first interval g1 and the first internal electrode pattern 221.

[0067] The first dielectric green sheet 211 can be formed of a ceramic paste containing ceramic powder, an organic solvent, a dispersant, and a binder.

[0068] As the ceramic powder, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used as a raw material for forming the dielectric layer 111 of the multilayer electronic component 100. The barium titanate-based material can contain BaTiO 3 -based ceramic powder. As an example of the ceramic powder, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0069] The organic components such as the organic solvent, the dispersant, and the binder contained in the first dielectric green sheet 211 are not particularly limited, but can contain organic components based on toluene ethanol.

[0070] When the first dielectric green sheet 211 is fired, the dielectric layer 111 can be formed.

[0071] An example of a method for disposing the first internal electrode pattern 221 on the first dielectric green sheet 211 is to screen print or gravure print a conductive paste containing a conductive metal, glass and an organic material on the first dielectric green sheet 211, but is not limited to this. A thin film deposition method such as a sputtering method or a vacuum deposition method can be used to deposit the conductive metal on the first dielectric green sheet 211.

[0072] The first internal electrode pattern 221 may include a conductive metal. The conductive metal is not particularly limited, and any material having excellent electrical conductivity may be used. For example, the conductive metal may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0073] A first internal electrode pattern 221 may be disposed on the first dielectric green sheet 211. The first internal electrode pattern 221 may be a region where the first internal electrode 121 will be formed after firing.

[0074] Referring to FIG. 4, the first internal electrode pattern 221 is disposed on the dielectric green sheet 211, and may include a first main portion 221a and a first convex portion 221b that is thicker than the first main portion, and may be formed by being disposed at a first interval g1.

[0075] The first main portion 221a can form a region of the first internal electrode 121 that is included in the capacitance forming portion Ac after firing, and the first convex portion 221b can form a region extending from the region of the first internal electrode 121 that is included in the capacitance forming portion Ac to the first external electrode 130 after firing.

[0076] Meanwhile, according to one embodiment of the present invention, the thickness of the first convex portion 221b, which is the area connected to the first external electrode 130, is formed to be thicker than the first main portion 221a, thereby improving the electrical connectivity between the first internal electrode 121 and the first external electrode 130.

[0077] One example of a method for forming the first internal electrode pattern 221 so that the first convex portion 221b has a thickness greater than that of the first main portion 221a is to print a conductive paste once to the thickness of the first main portion 221a, and then to print further conductive paste in the area where the first convex portion 221b is to be formed. However, this is not limited to this, and when a vapor deposition method is used, a method can be used in which the vapor deposition time in the area where the first convex portion 221b is to be longer than the vapor deposition time in the area where the first main portion 221a is to be formed.

[0078] The first internal electrode patterns 221 may be arranged at a first interval g1. Specifically, the first internal electrode patterns 221 may be arranged at a first interval g1 in a direction perpendicular to a direction in which a first sheet S1 and a second sheet S2, which will be described later, are stacked. The first interval g1 may be formed in a plurality of places by arranging a plurality of the first internal electrode patterns 221 on the first dielectric green sheet 211, and the plurality of first intervals g1 may be formed at substantially the same interval.

[0079] Forming the second sheet S2 The second sheet S2 can be formed by arranging a second internal electrode pattern 222 including a second main portion 222a and a second convex portion 222b thicker than the second main portion 222a on the second dielectric green sheet 212 at a second interval g2, and applying a second dielectric paste 212' onto the second interval g2 and the second internal electrode pattern 2220.

[0080] The second dielectric green sheet 212 may be formed of a ceramic paste including ceramic powder, an organic solvent, a dispersant, and a binder.

[0081] The above ceramic powder can be a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc., as a raw material for forming the dielectric layer 111 of the multilayer electronic component 100. The above barium titanate-based material can contain BaTiO 3 -based ceramic powder. As an example of the above ceramic powder, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0082] The organic components such as the organic solvent, dispersant, and binder contained in the second dielectric green sheet 212 are not particularly limited, but can contain organic components based on toluene ethanol.

[0083] When the above second dielectric green sheet 212 is fired, a dielectric layer 111 can be formed in the same manner as the first dielectric green sheet 211.

[0084] As an example of a method for disposing the second internal electrode pattern 222 on the second dielectric green sheet 212, there is a method of screen printing or gravure printing a conductive paste containing a conductive metal, glass, and an organic substance on the second dielectric green sheet 212, but it is not limited thereto, and a thin film deposition method such as sputtering or vacuum evaporation can be used to deposit a conductive metal on the second dielectric green sheet 212.

[0085] The second internal electrode pattern 222 may include a conductive metal. The conductive metal is not particularly limited, and any material having excellent electrical conductivity may be used. For example, the conductive metal may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0086] A second internal electrode pattern 222 may be disposed on the second dielectric green sheet 212. The second internal electrode pattern 222 may be a region where the second internal electrode 122 will be formed after firing.

[0087] Referring to FIG. 4, the second internal electrode pattern 222 is disposed on the dielectric green sheet 212, and may include a second main portion 222a and a second convex portion 222b that is thicker than the second main portion, and may be formed by being disposed at a second interval g2.

[0088] The second main portion 222a can form a region of the second internal electrode 122 included in the capacitance forming portion Ac after firing, and the second convex portion 222b can form a region extending from the region of the second internal electrode 122 included in the capacitance forming portion Ac to the second external electrode 140 after firing.

[0089] Meanwhile, according to one embodiment of the present invention, the thickness of the second convex portion 222b, which is the area connected to the second external electrode 140, is formed to be thicker than the second main portion 222a, thereby improving the electrical connectivity between the second internal electrode 122 and the second external electrode 140.

[0090] One example of a method for forming the second internal electrode pattern 222 so that the second convex portion 222b has a thickness greater than that of the second main portion 222a is to print a conductive paste once to the thickness of the second main portion 222a, and then to print further conductive paste in the area where the second convex portion 222b is to be formed. However, this is not limited to this, and when a vapor deposition method is used, a method can be used in which the vapor deposition time in the area where the second convex portion 222b is to be longer than the vapor deposition time in the area where the second main portion 222a is to be formed.

[0091] The second internal electrode patterns 222 may be arranged at a second interval g2. Specifically, the second internal electrode patterns 222 may be arranged at a distance of the second interval g2 in a direction perpendicular to the direction in which the first sheet S1 and the second sheet S2 are stacked. The second interval g2 may be formed in a plurality of ways by arranging a plurality of the second internal electrode patterns 222 on the second dielectric green sheet 212, and the plurality of second intervals g2 may be formed at substantially the same intervals.

[0092] The positions of the first convex portion 221b and the second convex portion 222b may be determined relatively in relation to the first main part 221a and the second main part 222a. Specifically, the first convex portion 221b may be disposed between 1 / 4 and 3 / 4 points of the first internal electrode pattern 221 divided into 4 equal parts in the vertical direction of the stacking direction, and the second convex portion 222b may be disposed between 1 / 4 and 3 / 4 points of the second internal electrode pattern 222 divided into 4 equal parts in the vertical direction of the stacking direction.

[0093] There is no need to particularly limit the relationship between the thickness d1' of the first dielectric green sheet 211 and the second dielectric green sheet 212 and the thickness d2' of the first dielectric paste 211' and the second dielectric paste 212', but if the thickness d1' of the first dielectric green sheet 211 and the second dielectric green sheet 212 and the thickness d2' of the first dielectric paste 211' and the second dielectric paste 212' are substantially the same, deformation of the first sheet S1 and the second sheet S2 during the stacking and pressing process can be better suppressed.

[0094] On the other hand, when the step of forming the laminated bar is performed by further disposing a third dielectric green sheet 213 between the first sheet S1 and the second sheet S2, the thickness of the first dielectric paste 211' and the second dielectric paste 212' may be thinner than the first to third dielectric green sheets.

[0095] By adjusting the thickness e2' of the first convex portion 221b and the second convex portion 222b to be 1.1 times or more the thickness e1' of the first main portion 221a and the second main portion 222a, the step can be mitigated, and by adjusting it to be 2.0 times or less, deformation of the first dielectric green sheet 211 and the second dielectric green sheet 212 can be suppressed.

[0096] Forming the laminated bar 10 In one embodiment of the present invention, the method may include alternating first and second sheets S1, S2 to form a laminated bar 10.

[0097] In one embodiment, referring to FIG. 5, the laminated bar 10 can be formed by alternately arranging a first sheet S1 and a second sheet S2 and then compressing them.

[0098] The positions of the first convex portion 221b and the second convex portion 222b may be determined relatively in relation to the first interval g1 and the second interval g2. Specifically, the step of forming the laminated bar may be performed by arranging the first convex portion 221b to overlap the second interval g2 in the lamination direction, and arranging the second convex portion 222b to overlap the first interval g1. As a result, the thickness of each of the internal electrodes 121, 122 is reduced in a region where the first internal electrode 121 and the second internal electrode 122 overlap in the lamination direction, and the thickness of each of the internal electrodes 121, 122 is increased in a region where the first internal electrode 121 and the second internal electrode 122 do not overlap in the lamination direction, thereby improving the electrical connectivity between the internal electrodes 121, 122 and the external electrodes 130, 140 without reducing the capacity per unit volume of the multilayer electronic component.

[0099] The positions of the first convex portion 221b and the second convex portion 222b may also be determined relatively with respect to the first internal electrode pattern 221 and the second internal electrode pattern 222. Specifically, the step of forming the laminated bar may be performed such that the first convex portion 221b does not overlap the second internal electrode pattern 222 in the lamination direction, and the second convex portion 222b does not overlap the first internal electrode pattern 221 in the lamination direction. As a result, the thickness of each of the internal electrodes 121, 122 is reduced in a region where the first internal electrode 121 and the second internal electrode 122 overlap in the lamination direction, and the thickness of each of the internal electrodes 121, 122 is increased in a region where the first internal electrode 121 and the second internal electrode 122 do not overlap in the lamination direction, thereby improving the electrical connectivity between the internal electrodes 121, 122 and the external electrodes 130, 140 without reducing the capacity per unit volume of the multilayer electronic component.

[0100] Step of forming the laminate 11 In one embodiment of the present invention, after the step of forming the laminate bar 10, a step of cutting the laminate bar 10 to form a laminate 11 may be included.

[0101] 5, in one embodiment, the step of forming the laminate 11 may be performed by cutting the laminate bar 10 along a straight line (C1-C1 line) passing through the first convex portion 221b and the second interval g2 and a straight line (C1'-C1') passing through the second convex portion 222b and the first interval g1. Thus, one surface of the laminate 11 may contact the first convex portion 221b of the first internal electrode pattern 221, and the other surface of the laminate 11 may contact the second convex portion 222b of the second internal electrode pattern 222.

[0102] Step of forming external electrodes on the laminate 11 In one embodiment of the present invention, after the step of forming the laminate 11, a step of forming external electrodes 130, 140 on the laminate 11 may be included. An example of a method for forming the external electrodes 130, 140 includes a method of forming the external electrodes 130, 140 by transferring a sheet containing a conductive metal onto the laminate 11, or a method of sequentially forming a fired electrode and a conductive resin layer containing a conductive metal and a resin on the laminate 11.

[0103] According to an embodiment of the present invention, the step of forming the laminated bar 10 may be performed by arranging the first sheet S1 such that the first dielectric paste 211' faces the lower side in the lamination direction, and arranging the second sheet S2 such that the second dielectric paste 212' faces the upper side in the lamination direction. Here, the upper and lower sides in the lamination direction do not mean the upper and lower sides based on the ground, but may mean one side and the other side in the lamination direction of the first sheet S1 and the second sheet S2 according to Figs. 4 and 5.

[0104] In one embodiment of the present invention, when the first sheet S1 is positioned so that the first dielectric paste 211' faces the bottom in the stacking direction and the second sheet S2 is positioned so that the second dielectric paste 212' faces the top in the stacking direction to form a laminated bar 10, the adjacent first convex portions 221b are positioned so as to overlap the second gap g2, and the second convex portions 222b are positioned so as to overlap the first gap g1 in the stacking direction, thereby reducing the steps during the stacking process.

[0105] However, the first convex portion 221b and the second convex portion 222b are thicker than the first main portion 221a and the second main portion 222b, and the first internal electrode pattern 221 is stacked facing toward the upper portion in the stacking direction, and the second internal electrode pattern 222 is stacked facing toward the lower portion in the stacking direction. As a result, it is not possible to secure a sufficient gap between the internal electrodes after firing, and a short circuit may occur.

[0106] Therefore, when lamination is performed by additionally disposing a separate ceramic sheet between the internal electrode patterns 221 and 222 as in the conventional case, problems may occur in that the process steps become complicated and costs increase. Furthermore, when a separate ceramic sheet is added, since the organic components of the first sheet S1 and the second sheet S2 are the same as those of the first sheet S1 and the second sheet S2, the organic components of the first sheet S1 and the second sheet S2 may melt, causing deformation.

[0107] Therefore, in one embodiment of the present invention, the step of forming the first sheet S1 may further include a step of applying a first dielectric paste 211' on the first gap g1 and the first internal electrode pattern 221, and the step of forming the second sheet S2 may further include a step of applying a second dielectric paste 212' on the second gap g2 and the second internal electrode pattern 222 to form the second sheet S2.

[0108] That is, a manufacturing method of a multilayer electronic component according to an embodiment of the present invention may include the steps of: arranging a first internal electrode pattern 221 including a first main portion 221a and a first convex portion 221b thicker than the first main portion 221a on a first dielectric green sheet 211 with a first interval g1, and applying a first dielectric paste 211' on the first interval g1 and the first internal electrode pattern 221 to form a first sheet S1; and arranging a second internal electrode pattern 222 including a second main portion 222a and a second convex portion 222b thicker than the second main portion 222a on a second dielectric green sheet 212 with a second interval g2, and applying a second dielectric paste 212' on the second interval g2 and the second internal electrode pattern 222 to form a second sheet S2.

[0109] As a result, even if the stacking step is performed such that the first sheet S1 is arranged so that the first dielectric paste 211' faces the bottom in the stacking direction and the second sheet S2 is arranged so that the second dielectric paste 212' faces the top in the stacking direction, it is possible to suppress the phenomenon of deformation of the first sheet S1 and the second sheet S2, and it is possible to ensure a sufficient gap between the first internal electrode pattern 221 and the second internal electrode pattern 222, thereby preventing the occurrence of a short circuit.

[0110] In an embodiment, the first dielectric paste 211' and the second dielectric paste 212' may contain the same organic material as that contained in the first internal electrode pattern 221 and the second internal electrode pattern 222. This can further improve the effect of preventing the first dielectric paste 211' and the second dielectric paste 212' from dissolving the organic components of the first dielectric green sheet 211 and the second dielectric green sheet 212 during the lamination process, thereby causing deformation of the first dielectric green sheet 211 and the second dielectric green sheet 212. For this reason, it is preferable that the first dielectric paste 211' and the second dielectric paste 212' do not contain an organic component based on toluene ethanol that may be contained in the first dielectric green sheet 211 and the second dielectric green sheet 212.

[0111] An example of the same organic material contained in the first internal electrode pattern 221 and the second internal electrode pattern 222 contained in the first dielectric paste 211' and the second dielectric paste 212' includes dihydroterpinyl acetate (DHTA).

[0112] Referring to FIG. 5, the step of forming the laminated bar 10 may be performed such that the first dielectric paste 211' and the second dielectric paste 212' are in contact with each other, but is not limited thereto.

[0113] When the step of forming the laminated bar 10 is performed so that the first dielectric paste 211' and the second dielectric paste 212' are in contact with each other, the interfacial resistance between the internal electrodes 121, 122 and the dielectric layer 111 may deteriorate after firing, which may cause deterioration of the insulation resistance characteristics, such as a decrease in the BDV (Breakdown Voltage) value of the laminated electronic component.

[0114] 7 is performed by further disposing the third dielectric green sheet 213 between the first sheet S1 and the second sheet S2 as shown in FIG 6, thereby preventing deterioration of the insulation resistance of the multilayer electronic component 100. This effect can be further improved when the insulation resistance of the third dielectric green sheet 213 is higher than the insulation resistances of the first dielectric paste 211' and the second dielectric paste 212'.

[0115] The difference in insulation resistance between the third dielectric green sheet 213 and the first and second dielectric pastes 211' and 212' is due to the difference in composition, and the insulation resistance can be adjusted by the amount of the acceptor element.

[0116] After forming the laminate bar 10', it can be cut along the lines C1-C1 and C1'S-C1' as shown in Figure 7 to form the laminate 11', where the meanings of the lines C1-C1 and C1'-C1' are the same as those of the step of forming the laminate 11 described above.

[0117] In one embodiment, a third dielectric green sheet 213 is further disposed between the first sheet S1 and the second sheet S2, so that the first sheet S1 and the second sheet S2 can each be in contact with the third dielectric green sheet 213 without direct contact, as shown in FIG. 7.

[0118] Meanwhile, the method for manufacturing a multilayer electronic component according to an embodiment may include a firing step. The firing step may be performed between the step of forming the multilayer body 11 and the step of forming the external electrodes 130, 140, but is not limited thereto, and the step of firing the multilayer body 11 and the external electrodes 130, 140 may be performed after the step of forming the external electrodes 130, 140.

[0119] 4 to 7, in the step of stacking the first sheet S1 and the second sheet S2, cover sheets 312, 313 may be placed on the outermost first sheet S1 and second sheet S2, which may become the areas that form the cover portions 112, 113 of the multilayer electronic component 100 after firing.

[0120] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0121] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0122] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0123] 100 Multilayer electronic components 111 Dielectric layer 112, 113 Cover part 114, 115 Margin 121, 122 Internal electrode 130, 140 external electrode 211 First dielectric green sheet 212 Second dielectric green sheet 211' First dielectric paste 212' Second dielectric paste 213 3rd Dielectric Green Sheet 221 First internal electrode pattern 222 Second internal electrode pattern

Claims

1. disposing a first internal electrode pattern including a first main portion and a first protruding portion thicker than the first main portion at a first interval on a first dielectric green sheet, and applying a first dielectric paste to the first interval and on the first internal electrode pattern to form a first sheet; disposing a second internal electrode pattern including a second main portion and a second protruding portion thicker than the second main portion at a second interval on a second dielectric green sheet, and applying a second dielectric paste to the second interval and on the second internal electrode pattern to form a second sheet; interleaving the first and second sheets to form a laminated bar; cutting the laminate bar to form a laminate; forming an external electrode on the laminate; a step of forming the laminated bar by arranging the first sheet such that the first dielectric paste faces a lower portion in a lamination direction, and arranging the second sheet such that the second dielectric paste faces an upper portion in a lamination direction.

2. 2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the first convex portion and the second convex portion are arranged between a 1 / 4 point and a 3 / 4 point among points obtained by dividing the first internal electrode pattern and the second internal electrode pattern into four equal parts in a direction perpendicular to a stacking direction.

3. 2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the step of forming the laminated bar is performed by arranging the first convex portion so as to overlap the second interval in a stacking direction, and arranging the second convex portion so as to overlap the first interval in a stacking direction.

4. 2. The method of claim 1, wherein the forming of the laminated bar is performed such that the first convex portion does not overlap the second internal electrode pattern in a lamination direction and the second convex portion does not overlap the first internal electrode pattern in a lamination direction.

5. The method of claim 1 , wherein the forming of the laminated bar is performed such that the first dielectric paste and the second dielectric paste are in contact with each other.

6. The method for manufacturing a multilayer electronic component according to claim 1 , wherein the first dielectric paste and the second dielectric paste contain the same organic material as that contained in the first internal electrode pattern and the second internal electrode pattern.

7. 2. The method of claim 1, wherein the first dielectric paste, the second dielectric paste, the first internal electrode pattern, and the second internal electrode pattern contain dihydroterpinyl acetate (DHTA).

8. 2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the step of forming the laminate is performed by cutting the laminate bar along a straight line passing through the first convex portion and the second gap and a straight line passing through the second convex portion and the first gap.

9. 2 . The method of claim 1 , wherein the forming of the laminated bar is performed by further disposing a third dielectric green sheet between the first sheet and the second sheet.

10. 10. The method for producing a multilayer electronic component according to claim 9, wherein an insulation resistance of the third dielectric green sheet is greater than insulation resistances of the first dielectric paste and the second dielectric paste.

11. The method for producing a multilayer electronic component according to claim 1 , further comprising a step of firing the laminate between the step of forming the laminate and the step of forming the external electrodes.

12. The method for producing a multilayer electronic component according to claim 1 , further comprising the step of firing the laminate and the external electrodes after the step of forming the external electrodes.

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