Cooling structure of a cooler through which fluid can flow

Abstract

The present invention relates to a cooling structure (1) for a cooler (100) through which fluid can flow, the cooling structure (1) being formed from a U-shaped profile (10) that is periodically repeated in a repeating direction (501), the U-shaped profile (10) including corrugated legs (15), the corrugated legs (15) extending in a longitudinal direction (502) of the cooling structure (1) and formed according to a trigonometric function (13).

Description

[Technical Field]

[0001] The present invention relates to a cooling structure of a fluid-permeable cooler for cooling a power electronic device, a method for manufacturing such a cooling structure, and a fluid-permeable cooler.Furthermore, the present invention relates to a power electronics device including such a cooler and a power electronic device. [Background technology]

[0002] Power semiconductors in power electronics devices are known to carry high currents. The resulting conduction losses, along with switching losses, result in significant heat loss, which must be dissipated over a very small area. Here, the maximum allowable semiconductor temperature is crucial in terms of failure, and therefore minimizing the thermal resistance between the semiconductor and the coolant is crucial. For efficient cooling, power boards are attached to coolers through which fluid can flow. These coolers are made of aluminum, AlSiC, or copper alloys. Pins or fins are arranged inside the coolers to increase the heat transfer surface and enhance heat transfer. To achieve low thermal resistance between the power board, especially AMB / DBC power boards (AMB: active metal brazing, DBC: direct copper bonding), and the cooler, the power board is bonded to the cooler by a soft brazing process and, optionally, by a sintering process. For this purpose, these coolers are sometimes surface-coated with a material suitable for the soft brazing or sintering process. In automotive engineering, aluminum coolers, but also AlSiC or copper coolers, are often known, which consist of several parts joined together in particular by a hard brazing process. Summary of the Invention

[0003] The cooling structure of a fluid-permeable cooler according to the present invention has the advantage that, when the cooling structure is used in such a cooler and a fluid is flowing through the cooler, a good balance is achieved between the achievement of heat transfer performance from the cooling structure to the fluid used as a coolant and the pressure drop caused by the cooling structure. This is achieved by the cooling structure of the fluid-permeable cooler formed from a periodically repeated U-shaped profile in a repeating direction, including corrugated legs. The corrugated legs extend in the longitudinal direction of the cooling structure and are formed according to a trigonometric function. In other words, each corrugated leg has the shape of a trigonometric function. Because the corrugated legs are part of the repeated U-shaped profile, advantageously, all corrugated legs of the cooling structure have the same shape. The repetition of the U-shaped profile in a repeating direction advantageously results in an integral, continuous profile, which may be specifically referred to as a corrugated profile within the scope of the present invention. The corrugated legs of the cooling structure induce turbulence in the fluid used as a coolant, which results in increased heat dissipation while keeping the pressure drop caused by the corrugated shape of the legs within an acceptable range. The cooling structure according to the present invention is therefore particularly suitable for use in fluid-permeable coolers, especially high performance coolers, for power electronics applications.

[0004] The dependent claims show preferred developments of the invention. Preferably, the U-shaped profile is repeated an integer or non-integer number of times. An integer number of repetitions of the U-shaped profile means that the cooling structure corresponds to an integer multiple of the periodically repeated U-shaped profile. A non-integer number of repetitions, on the other hand, means that the cooling structure is not an integer multiple of the periodically repeated U-shaped profile. The number of repetitions of the U-shaped profile advantageously depends on the width of the power electronics device to be cooled by the fluid-permeable cooler surrounded by the cooling structure. For example, the U-shaped profile may be repeated five times in the repeat direction. Here, the cooling structure has five repeat units of the U-shaped profile, or in other words, five U-shaped profiles connected to each other to create a single, continuous wave profile.

[0005] Preferably, the cooling structure has a width direction and a height direction in addition to the length direction. The repeating direction preferably corresponds to the width direction. The length direction may preferably be perpendicular to the repeating direction or may be inclined. The height direction is perpendicular to the width direction and the length direction. Preferably, the length direction is parallel to a line connecting the geometric centroid of the cross section of the U-shaped profile at the first end of the cooling structure and the geometric centroid of the cross section of the U-shaped profile at the second end of the cooling structure.

[0006] Preferably, the repeat direction is parallel to the Y axis of the spatially fixed coordinate system, and the height direction is parallel to the Z axis of the spatially fixed coordinate system. The longitudinal direction may preferably be parallel to the X axis of the spatially fixed coordinate system, or may be inclined relative to the X axis. The X axis, Y axis, and Z axis of the spatially fixed coordinate system are perpendicular to each other. In other words, the spatially fixed coordinate system is a Cartesian coordinate system in three-dimensional space.

[0007] The longitudinal direction may preferably be the direction in which the cooling structure has its longest dimension. The longitudinal direction of the cooling structure preferably corresponds to the extension direction of the repeated U-shaped profile. The trigonometric function may for example be a sine function.Within the scope of the present invention, the legs may also be referred to as side walls.

[0008] Preferably, the height of the periodically repeating U-shaped profile is between 3.7 mm and 4.5 mm, particularly preferably 4 mm. The height of the U-shaped profile corresponds to the dimension of the U-shaped profile in a height direction perpendicular to the repeat direction. Advantageously, the height of the U-shaped profile corresponds to the height of the cooling structure. This means in particular that the cooling structure has a constant height.

[0009] Preferably, the period of the periodically repeated U-shaped profile is 2 mm to 3.1 mm, particularly preferably 2.8 mm. It should be understood that the period of the periodically repeated U-shaped profile is a dimension in the repeating direction. Furthermore, it should be understood that the period between the first end (side end) and the second end (side end) of the cooling structure is constant in the repeating direction. In other words, this particularly means that the periodically repeated U-shaped profile is regularly repeated.

[0010] Preferably, the period of the trigonometric function is between 5.1 mm and 6 mm, particularly preferably 5.5 mm. It should be understood that the period of the trigonometric function is the longitudinal dimension. Preferably, the amplitude of the trigonometric function is 0.25 mm to 0.8 mm, and particularly preferably 0.4 mm. The amplitude of the trigonometric function corresponds to the maximum distance of the trigonometric function from a reference position of the trigonometric function that is located midway between the maximum function value and the minimum function value of the trigonometric function.

[0011] Preferably, the material thickness of the periodically repeating U-shaped profile is 0.2 mm to 0.4 mm, particularly preferably 0.3 mm. In other words, the material thickness of the corrugated legs is preferably 0.2 mm to 0.4 mm, particularly preferably 0.3 mm. The periodically repeating profile advantageously has a constant material thickness.

[0012] Each of the value ranges presented above contributes to a good balance between the heat transfer performance achieved and the pressure drop induced. Particularly preferred values ​​of each parameter from the above parameters (height of the periodically repeated U-shaped profile, period of the periodically repeated U-shaped profile, period of the trigonometric function, amplitude of the trigonometric function, material thickness of the periodically repeated profile) realize for each parameter an optimal balance between the heat transfer performance achieved and the pressure drop induced.

[0013] According to a particularly preferred exemplary embodiment of the present invention, the height of the periodically repeating U-shaped profile is 4 mm, the period of the trigonometric function is 5.5 mm, the amplitude of the trigonometric function is 0.8 mm, and the material thickness of the periodically repeating U-shaped profile is 0.3 mm. This form of cooling structure has the advantage of an optimal balance between the heat transfer performance achieved and the pressure drop caused.

[0014] Within the scope of the present invention, a U-shaped profile can preferably refer to a part of a cooling structure including two (adjacent) legs, two first connection regions, and one second connection region. The second connection region connects the two legs to each other, and the first connection region connects each U-shaped profile to an adjacent U-shaped profile (a repeating unit of the U-shaped profile). The first and second connection regions are preferably parallel to a plane perpendicular to the height direction. In an assembled state of the cooling structure in a fluid-permeable cooler in which power electronic equipment is arranged, the first connection region is closer to the power electronic equipment than the second connection region.

[0015] The repeated U-shaped profile is preferably a rounded profile. This means in particular that the transition between the leg and the connection region (first or second connection region) is rounded. In other words, the leg transitions into the first or second connection region with a rounded radius. However, it is also possible for the repeated U-shaped profile to be a chamfered profile, i.e., a non-rounded profile, at the aforementioned points.

[0016] According to one aspect of the present invention, the cooling structure is formed such that all cross sections of the cooling structure have equal cross-sectional areas in a cross section containing a plane having a normal vector perpendicular to the repeating direction. Alternatively, the cooling structure is formed such that not all cross sections of the cooling structure have equal cross-sectional areas in a cross section containing a plane having a normal vector perpendicular to the repeating direction.

[0017] The cooling structure can be manufactured by stamping, roll forming, or extrusion processes. Within the scope of the present invention, cooling structures are preferably understood as structures that increase the surface, guide the flow and increase the heat transfer.

[0018] Within the scope of the present invention, the cooling structure can also be called a cooling fin structure, since the cooling fins are formed by the repeated U-shaped profile, and the cooling structure can also be called a turbulence generator, in particular, since it induces turbulence in the flowing fluid, as already mentioned above.

[0019] The flow direction of the cooler corresponds in particular to the main flow direction of the fluid used as coolant through the through openings formed through the cooling structure. Here, the main flow direction is in particular the direction in which the fluid mainly flows, i.e., the direction in which the velocity component of the fluid is greater than the velocity component of the fluid in a direction perpendicular to the main flow direction. The main flow direction may preferably correspond to the introduction direction of the fluid into the cooler through which the fluid can flow.

[0020] The cooling structure is preferably at least partly, in particular completely, made of and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). Advantageously, the cooling structure may be at least partly, in particular completely, made of or coated with aluminum.

[0021] The fluid-permeable cooler can also be used to cool components other than power electronics that are located on the cooler in the power electronics device, such as EMC filters, condensers, or bus bars.

[0022] The present invention further relates to a fluid-permeable cooler for cooling a power electronic device. The fluid-permeable cooler includes the aforementioned cooling structure, a first metal component, and a second metal component. The first metal component and the second metal component are connected to each other to define a cooling channel, and the cooling structure is disposed within the cooling channel. The cooling channel direction, i.e., the direction in which the cooling channel extends, is preferably parallel to or inclined relative to the longitudinal direction of the cooling structure, or parallel to the longitudinal axis of the aforementioned spatially fixed coordinate system.

[0023] The first metal part and the second metal part advantageously form a housing, which defines the cooling channel and in particular surrounds the cooling channel, which in particular corresponds to the interior space of the housing. Preferably, an inlet and an outlet for the fluid used as coolant are arranged directly on the housing.

[0024] The first metal part and the second metal part may be connected to each other preferably directly or indirectly. Direct connection particularly means that only a connection layer, particularly a connection brazing layer, exists between the first metal part and the second metal part. Indirect connection particularly means that at least one further metal part is provided between the first metal part and the second metal part, and the first metal part is connected to the second metal part via the at least one further metal part, a connection layer, particularly a connection brazing layer, between the first metal part and the at least one further metal part, and a connection layer, particularly a connection brazing layer, between the second metal part and the at least one further metal part.

[0025] The first metal part and / or the second metal part are preferably formed as sheet metal. A further aspect of the present invention relates to a power electronics device including the aforementioned fluid-permeable cooler for cooling a power electronics device and the power electronics device disposed in the fluid-permeable cooler, wherein heat generated by the power electronics device during operation can be efficiently dissipated by the fluid-permeable cooler.

[0026] The power electronic device may preferably include at least one power module having a power board, the at least one power module being fixed to / on a first metal part of the fluid-capable cooler by the power board.

[0027] The power substrate may preferably be made of copper and / or ceramic (AMB / DBC power substrate, AMB: active metal brazing, DBC: direct copper bonding). Due to the low thermal resistance between the power board and the cooler, in particular the first metal part, the power board can be joined to the cooler, in particular the first metal part, preferably by a soft brazing process and optionally by a sintering process, which means that the power module is preferably joined to the cooler or the first metal part, through which fluid can flow, by a layer produced by the soft brazing or sintering process (and therefore correspondingly a soft brazing layer or a sintering layer).

[0028] The power module preferably includes one or more power semiconductors, which generate heat during operation of the power module, and this heat can be dissipated by a cooler.

[0029] Furthermore, the present invention relates to a method for manufacturing a cooling structure for a cooler that is capable of passing fluid through it, in particular a cooling structure as described above formed from a U-shaped profile that is periodically repeated in a repeating direction, the U-shaped profile including corrugated legs that extend in the longitudinal direction of the cooling structure and are formed according to a trigonometric function. The method comprises the step of extruding the repeated U-shaped profile along the trigonometric function in an extrusion direction, the extrusion direction being perpendicular to the repeating direction, or tangential to the trigonometric function, or lying between these two orientations. The expression "between these two orientations" in particular means that the extrusion direction is between the respective tangent of the trigonometric function and the perpendicular to the repeating direction.

[0030] The expression that the U-shaped profile is extruded along a trigonometric function preferably means that the geometric centre of gravity of the U-shaped profile moves along / on the drawing of the geometric function.

[0031] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. [Brief explanation of the drawings]

[0032] [Figure 1] 1 is a schematic simplified cross-sectional view of a power electronics device according to the present invention comprising a power electronics device and a cooler according to the present invention including a cooling structure according to a first exemplary embodiment of the present invention; [Figure 2] 1 is a schematic simplified perspective view of a cooling structure according to a first exemplary embodiment of the present invention; [Figure 3] 1 is a simplified diagram for explaining a manufacturing method according to the present invention for a cooling structure according to a first exemplary embodiment, in which the cooling structure is shown in plan view. [Figure 4] FIG. 10 is a simplified diagram for explaining a method for manufacturing a cooling structure according to a second exemplary embodiment, in which the cooling structure is shown in a plan view. [Figure 5]3 is a schematic simplified cross-sectional view of a power electronics device according to the present invention, comprising a power electronics device and a cooler according to a third exemplary embodiment including the cooling structure from FIG. 2; DETAILED DESCRIPTION OF THE INVENTION

[0033] 1 to 3, a power electronics device 1000 according to the present invention will be described. The power electronics device 1000 includes a power electronic device 200 and a cooler 100 having a cooling structure 1 according to a first exemplary embodiment of the present invention.

[0034] 1, the power electronics device 200 includes a power module 210, which may also be called a power electronics assembly. The power module 210 comprises a circuit board 204, conductor tracks 203, 205, and power semiconductors 201. The conductor tracks 203, 205 are formed in particular as copper conductor tracks, and the circuit board 204 is preferably formed from ceramic.

[0035] The power semiconductor 201 is attached to the conductor track 203 by means of a layer 202, whereby the layer 202 is formed in particular as a brazing layer or a sintered layer. The conductor tracks 203, 205 together with the circuit board 204 form a power board 208. The power board 208 is joined to the cooler 100, in particular to the first metal part 101 of the housing 110 of the cooler 100, by means of a layer 206 produced by a soft brazing or sintering process (and thus correspondingly a soft brazing or sintering layer).

[0036] The housing 110 of the cooler 100 further comprises a second metal part 102, which is connected to the first metal part 101 by a layer (connection layer) 103 specifically formed as a hard brazing layer. Both the first metal part 101 and the second metal part 102 are preferably aluminum parts.

[0037] 1 further shows that the first metal part 101 is an upper part of the housing 110, and the second metal part 102 is a lower part of the housing 110. The first metal part 101 faces the power module 210, and the second metal part 102 faces the opposite side of the power module 210. Furthermore, in this exemplary embodiment, the first metal part 101 is formed in a plate shape, and the second metal part 102 has a plate-shaped region and a region with a trapezoidal cross section. However, it is also possible for the first metal part 101 and the second metal part 102 to have other shapes. The second metal part 102 can advantageously be manufactured by deep drawing.

[0038] Between the layer 206 and the cooler 100, in particular the first metal part 101, there is advantageously an intervening layer 107, which is firmly connected to the first metal part 101 and allows wetting of the layer 206. The intervening layer 107 is an optional feature of the power electronic device 1000 and can in particular be considered a separate part or can be considered part of the housing 110 of the cooler 100.

[0039] The first metal part 101 and the second metal part 102, which when joined together form the housing 110 of the cooler 100, define an interior space that serves as the cooling channel 111 of the cooler 100.

[0040] A cooling structure 1 is arranged within the cooling channel 111 and serves as a structure for increasing the surface, guiding the flow of a fluid used as a coolant and enhancing heat transfer. The cooling structure 1 is advantageously joined to the first metal part 101 and the second metal part 102 by a layer 103.

[0041] 1 and 2 , the cooling structure 1 is formed from U-shaped profiles 10 that are periodically repeated in a repeat direction 501. The repeat direction 501 is perpendicular to the flow direction 500 and corresponds in particular to the width direction of the cooler 100. The flow direction 500 corresponds to the main flow direction of a fluid used as a coolant as it flows through the cooling channels 111, in particular through openings 14 ( FIG. 1 ) formed by the repeated U-shaped profiles 10. The flow direction 500 also corresponds to the cooling channel direction, which is the direction in which the cooling channels 11 essentially extend. In this exemplary embodiment, the U-shaped profile 10 is repeated six times, and the cooling structure 1 is provided with six repeat units 19 of the U-shaped profile 10, or in other words, six interconnected U-shaped profiles.

[0042] 2 also shows a longitudinal direction 502 and a height direction 503 in addition to the repeat direction 501. In this exemplary embodiment, the longitudinal direction 502 is inclined (i.e., not perpendicular) to the repeat direction 501. The height direction 503 is perpendicular to the repeat direction 501 and the longitudinal direction 502. As is clear from FIG. 3 , the longitudinal direction 502 is in particular a direction parallel to a line 509 connecting a geometric centroid 508 of the cross section of the U-shaped profile 10 at the first end 11 of the cooling structure 1 and a geometric centroid 510 of the cross section of the U-shaped profile 10 at the second end 12 of the cooling structure 1.

[0043] 2 also shows a spatially fixed Cartesian three-dimensional coordinate system: the repeat direction 501 is parallel to the Y-axis 601 of the coordinate system, and the height direction 503 is parallel to the Z-axis of the coordinate system 603. The longitudinal direction 502 is inclined with respect to the X-axis 602 of the coordinate system.

[0044] 1 and 2, the repeated U-shaped profile 10 has corrugated legs 15, a first connection region 16, and a second connection region 17. The first connection region 16 connects two adjacent corrugated legs 15 of adjacent repeating units 19 of the U-shaped profile 10 to each other at an upper region of the corrugated legs 15, and the second connection region 17 connects adjacent legs 15 of the same repeating unit 19 of the U-shaped profile 10 to each other at a lower region of the legs 15. The first connection region 16 is closer to the power electronic device 200 than the second connection region 17. In particular, the corrugated legs 15 of each repeating unit 19 are connected to each other by the second connection region 16. Furthermore, by the corresponding first connection regions 16 of the two repeating units 19, each repeating unit 19 of the U-shaped profile 10 is connected to an adjacent repeating unit of the U-shaped profile 10, and in particular, the corrugated leg 15 of each repeating unit 19 of the U-shaped profile 10 is connected to the corresponding corrugated leg 15 of the adjacent repeating unit 19 of the U-shaped profile 10.

[0045] In this exemplary embodiment, the repeated profile 10 is rounded, meaning that each leg 15 transitions into a corresponding first connection region 16 and a corresponding second connection region 17 with a rounded radius.

[0046] In order to achieve a good balance between the heat transfer between the fluid used as a coolant and the cooling structure 1 and the pressure drop caused by the cooling structure 1, the cooling structure 1 is formed as follows.

[0047] The height 401 of the repeated U-shaped profile 10 or cooling structure 1 is 3.7 mm to 4.5 mm, and particularly preferably 4 mm. The period 402 of the periodically repeated U-shaped profile 10 is 2 mm to 3.1 mm, and particularly preferably 2.8 mm. The period 403 of the trigonometric function 13 is 5.1 mm to 6 mm, and particularly preferably 5.5 mm. Furthermore, the amplitude 404 of the trigonometric function 13 is 0.25 mm to 0.8 mm, and particularly preferably 0.4 mm. Furthermore, the material thickness 405 of the periodically repeated U-shaped profile or cooling structure 1 is 0.2 mm to 0.4 mm, and particularly preferably 0.3 mm.

[0048] It should be noted that the length of the cooling structure 1 is preferably adapted to the length of the power module 10 . In order to assist the heat dissipation from the power module 210 by the fluid used as coolant, the cooling structure 1 is at least partially, in particular completely, made of and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). Advantageously, the cooling structure 1 may be at least partially, in particular completely, made of or coated with aluminum.

[0049] FIG. 3 shows a simplified diagram illustrating a method for manufacturing the cooling structure 1 according to the first exemplary embodiment. In particular, the trigonometric functions 13 are shown diagrammatically in Figure 3. Furthermore, rectangles are drawn which respectively represent one area of ​​the cooling structure 1 as seen from above.

[0050] According to this manufacturing method, the repeating U-shaped profile 10 may be extruded along a trigonometric function 13 in an extrusion direction 504 that is tangential to the trigonometric function 13. Note that the extrusion direction 504 does not have a fixed orientation, but always runs tangential to the trigonometric function 13.

[0051] Thus, in this exemplary embodiment, the cooling structure 1 is formed as an extruded part whose longitudinal direction 502 is inclined (at an angle other than 90 degrees) relative to the repeat direction 501 . According to this manufacturing method, the cooling structure 1 is formed so that in a cross section including a plane having a normal vector perpendicular to the repeat direction 501, not all cross sections of the cooling structure 1 have the same cross-sectional area.

[0052] The cooling structure 1 according to the present invention, and therefore also the cooler 100 and the power electronic device 1000, is characterized by a good relationship between the thermal performance and the induced pressure loss in the cooling channel 111 due to the above-described form of the repeated U-shaped profile 10.

[0053] FIG. 4 is a simplified diagram illustrating a method for manufacturing the cooling structure 1 according to the second exemplary embodiment. As in Figure 3, the trigonometric functions 13 are also shown diagrammatically in Figure 4. Furthermore, rectangles are drawn that represent each one of the regions of the cooling structure 1 as seen from above.

[0054] To manufacture the cooling structure 1 according to the second embodiment, the repeating U-shaped profile 10 can be extruded along a trigonometric function 13 in an extrusion direction 504 which, unlike the method for manufacturing the cooling structure 1 according to the first exemplary embodiment, is not tangential to the trigonometric function 13 but perpendicular to the repeat direction 501, or in other words parallel to the cooling channel direction. Here, the extrusion direction 504 is (always) parallel to the longitudinal direction 502.

[0055] According to this manufacturing method, the cooling structure 1 is formed so that all cross sections of the cooling structure 1 have the same cross-sectional area in a cross section including a plane having a normal vector perpendicular to the repeat direction 501 .

[0056] FIG. 5 shows a power electronics device 1000 according to a third exemplary embodiment of the present invention. The power electronics device 1000 according to the third exemplary embodiment differs from the first exemplary embodiment in that the first metal part 101 as the upper part, and therefore facing the power module 210, has a plate-shaped region and a region with a trapezoidal cross section, and the second metal part 102 as the lower part, and therefore facing the power module 210, is plate-shaped.

[0057] This configuration of the housing 110 can be advantageous when there is a shortage of space in the immediate vicinity of the power module 210 . It should be noted that the housing 110 of the cooler 100 according to the third exemplary embodiment can also be combined with the cooling structure 1 according to the manufacturing method according to the second exemplary embodiment.

[0058] In the exemplary embodiment described above, the power electronic device 200 includes only one power module 210. However, it is also possible for the power electronic device 200 to comprise two or more power modules 210. For this purpose, a corresponding number of cooling structures 1 can be arranged in the cooling channel 111 of the cooler 100, each cooling structure 1 being assigned to one of the power modules 210.

Claims

1. A cooling structure (1) for a cooler (100) through which fluid can flow, the cooling structure (1) being formed from a U-shaped profile that is periodically repeated in a repeating direction (501), the U-shaped profile including corrugated legs (15), the corrugated legs (15) extending in a longitudinal direction (502) of the cooling structure (1) and formed according to a trigonometric function (13).

2. The cooling structure (1) according to claim 1, wherein the height (401) of said periodically repeated U-shaped profile (10) is between 3.7 mm and 4.5 mm, preferably 4 mm.

3. The cooling structure (1) according to claim 1 or 2, wherein the period (402) of the periodically repeated U-shaped profile (10) is between 2 mm and 3.1 mm, preferably 2.8 mm.

4. The cooling structure (1) according to any one of claims 1 to 3, wherein the period (403) of the trigonometric function (13) is between 5.1 mm and 6 mm, preferably 5.5 mm.

5. The cooling structure (1) according to any one of claims 1 to 4, wherein the amplitude (404) of the trigonometric function (13) is between 0.25 mm and 0.8 mm, preferably 0.4 mm.

6. The cooling structure (1) according to any one of claims 1 to 5, wherein the material thickness of said periodically repeated U-shaped profile (10) is between 0.2 mm and 0.4 mm, preferably 0.3 mm.

7. 7. The cooling structure (1) according to any one of claims 1 to 6, wherein the cooling structure (1) is formed such that, in a cross section including a plane having a normal vector perpendicular to the repeating direction (501), all cross sections of the cooling structure (1) have an equal cross-sectional area, or such that, in a cross section including a plane having a normal vector perpendicular to the repeating direction (501), not all cross sections of the cooling structure (1) have an equal cross-sectional area.

8. A fluid-permeable cooler (100) for cooling a power electronic device (200), comprising: A cooling structure (1) according to any one of claims 1 to 7; a first metal part (101); and a second metal part (102), wherein the first metal part (101) and the second metal part (102) are connected to each other to define a cooling channel (111), and the cooling structure (1) is disposed within the cooling channel (111). Cooler (100).

9. A fluid-permeable cooler (100) according to claim 8 for cooling a power electronic device; a power electronics device (200) disposed in the fluid-permeable cooler (100); A power electronic device (1000) comprising:

10. 1. A method for manufacturing a cooling structure (1) of a cooler (100) through which fluid can flow, wherein the cooling structure (1) is formed from a U-shaped profile (10) that is periodically repeated in a repeating direction, the U-shaped profile (10) including corrugated legs (15), the corrugated legs (15) extending in a longitudinal direction of the cooling structure (1) and formed according to a trigonometric function (13), the repeated U-shaped profile (10) being extruded along the trigonometric function (13) in an extrusion direction that is perpendicular to the repeating direction (501), or tangential to the trigonometric function (13), or lying between these two orientations.

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