Touch panel

Abstract

To provide a touch panel that can minimize damage to the appearance. [Solution] The touch panel 100 comprises an upper substrate 10 and a lower substrate 20 that are spaced apart and facing each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, and an FPC 40 that is located below the decorative area 2 and between the upper substrate 10 and the lower substrate 20, and has a plurality of wiring patterns 43 that are electrically connected to the plurality of connection terminals 21c to 24c, and has at least one of the following: a first dummy pattern 44 that is spaced apart from the plurality of wiring patterns 43 and is located between the plurality of wiring patterns 43 and has substantially the same thickness as the plurality of wiring patterns 43, or a second dummy pattern 27 that is spaced apart from the plurality of connection terminals 21c to 24c and is located between the plurality of connection terminals 21c to 24c and has substantially the same thickness as the plurality of connection terminals 21c to 24c.

Description

Technical Field

[0004] , , ,

[0001] The present invention relates to a touch panel.

Background Art

[0002] Conventionally, a touch panel having a decorative area that does not receive an input operation is known (see, for example, Patent Document 1). The decorative area is a non-operation area formed on the outer periphery of the touch panel, and is an area for hiding electrode wirings and the like inside the touch panel from the operator's line of sight. In addition, a structure of a touch panel in which an FPC (Flexible Printed Circuit) is connected to the outer peripheral portion is known (see Patent Documents 2 and 3). Further, a clip for sandwiching the upper and lower substrates of the touch panel is known (see Patent Document 4).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] When an FPC is sandwiched between a film substrate and a glass substrate of a touch panel and thermocompression bonding is performed from above the film substrate, the film substrate may be deformed, and traces of the wiring pattern of the FPC and connection terminals on the glass substrate may adhere to the film substrate. In particular, when the pressure bonding portion of the FPC must be arranged in the decorative area, the film at the position of the pressure bonding portion cannot be hidden by a housing or the like, so there is a problem that the appearance of the touch panel is impaired due to the pressure bonding marks.

[0005] The present invention aims to provide a touch panel that can suppress damage to its appearance. [Means for solving the problem]

[0006] To achieve the above objective, the touch panel disclosed in the specification is a touch panel having an operation area for receiving operation input and a decorative area that does not receive said operation input, comprising: a first substrate and a second substrate arranged opposite to each other at a distance from each other; a plurality of connection terminals provided on the surface of the second substrate facing the first substrate; and a wiring substrate located below the decorative area and between the first substrate and the second substrate, having a plurality of wiring patterns electrically connected to the plurality of connection terminals, wherein the touch panel comprises at least one of the following: a first dummy pattern spaced apart from the plurality of wiring patterns and arranged between the plurality of wiring patterns and having substantially the same thickness as the plurality of wiring patterns, or a second dummy pattern spaced apart from the plurality of connection terminals and arranged between the plurality of connection terminals and having substantially the same thickness as the plurality of connection terminals.

[0007] The touch panel disclosed in the specification is a touch panel having an operation area for receiving operation input and a decorative area that does not receive said operation input, comprising: a first substrate and a second substrate arranged opposite to each other at a distance from each other; a plurality of connection terminals provided on the surface of the second substrate facing the first substrate; and a wiring substrate located below the decorative area and between the first substrate and the second substrate, having a plurality of wiring patterns electrically connected to the plurality of connection terminals, wherein a conductive film is formed on the surface of the second substrate facing the first substrate, the plurality of connection terminals are formed below the decorative area and on the conductive film, the conductive film between the plurality of connection terminals is separated into a plurality of conductive films, and the plurality of wiring patterns are connected to the connection terminals via the plurality of conductive films.

[0008] The touch panel disclosed in the specification is a touch panel having an operation area for receiving operation input and a decorative area that does not receive said operation input, comprising: a first substrate and a second substrate arranged opposite to each other at a distance from each other; a plurality of connection terminals provided on the surface of the second substrate facing the first substrate; and a wiring substrate arranged below the decorative area and on the surface of the second substrate opposite to the first substrate, having a plurality of wiring patterns electrically connected to the plurality of connection terminals, wherein each of the plurality of connection terminals and the second substrate is provided with a through hole and a conductor inserted into the through hole, and each of the plurality of connection terminals is electrically connected to each of the plurality of wiring patterns via the conductor.

[0009] The touch panel disclosed in the specification is a touch panel having an operation area for receiving operation input and a decorative area that does not receive said operation input, comprising: a first substrate and a second substrate arranged opposite to each other at a distance from each other; a plurality of connection terminals provided on the surface of the second substrate facing the first substrate; a wiring board arranged below the decorative area and having a plurality of wiring patterns electrically connected to the plurality of connection terminals; and a conductor sandwiching the plurality of connection terminals, a part of the surface of the second substrate facing the first substrate, the end face of the second substrate, and a part of the surface of the second substrate opposite to the first substrate, wherein the wiring board is arranged on a part of the conductor.

[0010] The touch panel disclosed in the specification comprises a first substrate and a second substrate arranged opposite to each other at a distance from each other, a wiring board having a plurality of connection terminals provided on the surface of the first substrate facing the second substrate, and a plurality of wiring patterns electrically connected to the plurality of connection terminals, wherein the first substrate comprises a main body portion facing the second substrate and an extension portion extending from the main body portion, fixed to a housing, and covered by the housing, and the wiring board is arranged on the extension portion. [Effects of the Invention]

[0011] According to the present invention, it is possible to suppress damage to the appearance. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1(A) is an external view of the touch panel according to this embodiment, Figure 1(B) is a configuration diagram of the upper substrate included in the touch panel of Figure 1(A) viewed from above, Figure 1(C) is a configuration diagram of the lower substrate included in the touch panel of Figure 1(A), and Figure 1(D) is a transparent view of the touch panel of Figure 1(A) viewed from above. [Figure 2] Figure 2(A) is a cross-sectional view of the upper substrate along line AA in Figure 1(B), Figure 2(B) is a cross-sectional view of the lower substrate along line BB in Figure 1(C), and Figure 2(C) is a cross-sectional view of the touch panel along line CC in Figure 1(D). [Figure 3] Figure 3(A) shows the state in which the FPC is connected to the connection terminals, and Figure 3(B) is a diagram of the FPC's configuration. [Figure 4] Figure 4(A) is a diagram showing the configuration near the connection terminals of the lower circuit board, and Figure 4(B) is a cross-sectional view of the DD line in Figure 4(A). [Figure 5] Figure 5 is a diagram showing a modified configuration near the connection terminals of the lower substrate. [Figure 6] Figure 6(A) is a cross-sectional view of a modified touch panel along the CC line in Figure 1(D). Figure 6(B) is a cross-sectional view of a modified FPC, and Figure 6(C) is a plan view of the base film of the FPC. [Figure 7] Figure 7(A) is a diagram showing the configuration near the connection terminals of the lower circuit board, and Figure 7(B) is a cross-sectional view of the touch panel along the EE line in Figure 7(A). [Figure 8] Figure 8(A) is a diagram showing the configuration near the connection terminals of the lower circuit board, and Figure 8(B) is a cross-sectional view of the touch panel along the FF line in Figure 8(A). [Figure 9] Figure 9(A) is a diagram showing the configuration of the upper substrate included in the modified touch panel, Figure 9(B) is a diagram showing the configuration of the lower substrate included in the modified touch panel, and Figure 9(C) is a cross-sectional view of a part of the modified touch panel.

Best Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0014] (First Embodiment) FIG. 1(A) is an external view of a touch panel according to this embodiment, FIG. 1(B) is a configuration diagram seen through from above the upper substrate included in the touch panel of FIG. 1(A), FIG. 1(C) is a configuration diagram of the lower substrate included in the touch panel of FIG. 1(A), and FIG. 1(D) is a transmission view of the touch panel of FIG. 1(A) seen from above. FIG. 2(A) is a cross-sectional view of the upper substrate along line A-A of FIG. 1(B), FIG. 2(B) is a cross-sectional view of the lower substrate along line B-B of FIG. 1(C), and FIG. 2(C) is a cross-sectional view of the touch panel along line C-C of FIG. 1(D).

[0015] The touch panel 100 according to this embodiment is a resistive film type touch panel. The touch panel 100 is a 4-wire type touch panel, but it may also be a 5-wire type or 7-wire type touch panel. As shown in FIG. 1(A), the touch panel 100 includes a transparent operation area 1 in the center and an opaque decoration area 2 on the outer periphery of the operation area 1. The operation area 1 is an area for receiving input operations by a finger, a pen, or the like. The decoration area 2 is a non-operation area that does not receive input operations by a finger, a pen, or the like, and is an area for hiding electrical wiring patterns, spacers, and the like from the operator's view. The touch panel 100 is mounted on a smartphone, a tablet terminal, or the like.

[0016] As shown in FIG. 2(C), the touch panel 100 includes an upper substrate 10 (first substrate) and a lower substrate 20 (second substrate). An upper conductive film 13 is formed on a surface 10a of the upper substrate 10 facing the lower substrate 20, and a decorative layer 14 is formed at a position corresponding to the decorative region 2 of the upper conductive film 13. The upper conductive film 13 is made of indium tin oxide (ITO: Indium Tin Oxide) or the like. The upper substrate 10 is made of, for example, a PET film or the like. The decorative layer 14 is made of a conductive material containing a light-shielding material, for example, carbon-based ink. The decorative layer 14 is formed by inkjet printing or silk printing or the like.

[0017] As shown in FIGS. 1(B) and 2(A), a pair of electrodes 11 and 12 extending in the Y direction are formed on the decorative region 2 and the decorative layer 14.

[0018] As shown in FIGS. 1(C) and 1(D), a pair of electrodes 21a and 22a extending in the X direction face each other across the operation region 1 and are provided in the decorative region 2 of the lower substrate 20. Wires 21b to 24b and connection terminals 21c to 24c are provided in the decorative region 2 of the lower substrate 20. The connection terminals 21c to 24c are terminals for electrically connecting to the FPC 40 (wiring board). The electrodes 11 and 12, the electrodes 21a and 22a, the wires 21b to 24b, and the connection terminals 21c to 24c are made of a metal paste such as copper or silver and are formed on the upper conductive film 13 or the lower conductive film 26 by inkjet printing or silk printing or the like. The wire 21b electrically connects the electrode 21a to the connection terminal 21c, the wire 2'2b electrically connects the electrode 22a to the connection terminal 22c, the wire 23b is electrically connected to the connection terminal 23c, and the wire 24b is electrically connected to the connection terminal 24c. An end 23a of the wire 23b is electrically connected to the electrode 11 of the upper substrate 10 via a wire not shown, and an end 24a of the wire 24b is electrically connected to the electrode 12 of the upper substrate 10 via a wire not shown. In FIG. 1(D), the bonding position of the FPC 40 is indicated by a dashed-dotted line.

[0019] As shown in Figure 2(B), a lower conductive film 26 is formed on the surface 20a of the lower substrate 20 facing the upper substrate 10. The lower substrate 20 is made of glass or the like, and the lower conductive film 26 is made of indium tin oxide (ITO) or the like. Electrodes 21a, 22a, wiring 24b, and wiring 21b are formed on the lower conductive film 26 within the decorated area 2. The lower conductive film 26 between electrode 22a and wiring 24b, and between wiring 24b and wiring 21b is removed by etching patterns 25. Also, as shown by dotted lines in Figures 1(C) and 1(D), the lower conductive film 26 between electrode 12 and wiring 21b, between connection terminals 23c and 22c, between connection terminals 22c and 24c, between connection terminals 24c and 21c, the area surrounding wiring 23b, and the area surrounding wiring 24b is removed by etching patterns 25.

[0020] As shown in Figure 2(C), an adhesive layer 30 is provided between the decorative layer 14 and the lower conductive film 26 within the decorative region 2. The adhesive layer 30 is formed to cover the top and side surfaces of various electrodes and wiring. In Figure 2(C), the adhesive layer 30 is formed to cover the top and side surfaces of electrode 21a and part of the side and top surfaces of wiring 22b. The adhesive layer 30 is an acrylic or epoxy-based insulating adhesive, but it may also be a PET (polyethylene terephthalate) film with double-sided tape attached to its top and bottom surfaces, for example. The adhesive layer 30 also electrically insulates the decorative layer 14 from the lower conductive film 26.

[0021] An ACF (Anisotropic Conducting Film), described later, is placed between the FPC40 and a portion of the upper surface of the wiring 22b, and the FPC40 is heat-pressed using a crimping machine (not shown), thereby fixing the FPC40 to a portion of the upper surface of the wiring 22b.

[0022] A space 31 is formed between the upper conductive film 13 and the lower conductive film 26 within the operating area 1. A spacer (not shown) may be provided in the space 31.

[0023] Figure 3(A) shows the FPC40 connected to terminals 21c to 24c, and Figure 3(B) is a diagram of the FPC40's configuration.

[0024] As shown in Figure 3(A), the FPC 40 comprises a base film 41, a coverlay 42, and a wiring pattern 43 sandwiched between the base film 41 and the coverlay 42. The base film 41 is, for example, an insulating PET film or polyimide film. The coverlay 42 protects the wiring pattern 43 and is, for example, epoxy resin, urethane resin, PET film, or polyimide film. A portion of the wiring pattern 43, i.e., the adhesive surface 45 of the FPC 40, is exposed from the coverlay 42 so as to be connected to the connection terminals 21c to 24c via the ACF 48. The FPC 40 is fixed to the upper surface of the connection terminals 21c to 24c by heat-pressing the FPC 40 from the upper substrate 10 side using a crimping machine (not shown).

[0025] As shown in Figure 3(B), the FPC 40 has multiple wiring patterns 43 that are electrically connected to multiple connection terminals 21c to 24c, and multiple first dummy patterns 44 that are spaced apart from the multiple wiring patterns 43 and positioned between the multiple wiring patterns 43. The first dummy patterns 44 have approximately the same thickness as the wiring patterns 43. Approximately the same means that differences due to manufacturing tolerances are allowed.

[0026] The wiring pattern 43 is a metallic wiring pattern such as silver or copper. The first dummy pattern 44 is insulated from the wiring pattern 43. The first dummy pattern 44 is made of the same material as the wiring pattern 43 (e.g., silver or copper metal), or of a different insulating material than the wiring pattern 43 (e.g., PET film, polyimide film, or resin). If the first dummy pattern 44 is made of the same material as the wiring pattern 43, the first dummy pattern 44 and the wiring pattern 43 can be produced in the same process, thus simplifying the manufacturing process of the FPC 40. Note that the number of wiring patterns 43 and the number of first dummy patterns 44 are not limited to the example in Figure 3(B).

[0027] The width W1 of the wiring pattern 43 is approximately the same as the width W4 of the multiple connection terminals 21c to 24c (see Figure 4(B)). The width W2 of the first dummy pattern 44 is approximately the same as the width W5 of the second dummy pattern 27 (see Figure 4(B)), which will be described later. The spacing W3 between the two wiring patterns 43 is approximately the same as the spacing W6 of the two connection terminals (for example, connection terminals 23c and 22c) (see Figure 4(B)). In this way, by making the widths W1 and W4 approximately the same, the widths W2 and W5 approximately the same, and the spacing W3 and W6 approximately the same, the multiple wiring patterns 43 of the FPC 40 can be fixed to the connection terminals 21c to 24c without misalignment.

[0028] As shown in Figure 3(B), a first dummy pattern 44 having approximately the same thickness as the wiring pattern 43 is placed between the wiring patterns 43 to ensure the flatness of the FPC 40. Therefore, even when the FPC 40 is placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, deformation of the upper substrate 10 can be suppressed. This prevents damage to the appearance of the touch panel 100 due to pressure marks. In addition, since the first dummy pattern 44 is spaced apart from the wiring pattern 43, a short circuit between the first dummy pattern 44 and the wiring pattern 43 can be prevented.

[0029] If the distance between the first dummy pattern 44 and the adjacent wiring pattern 43 is less than 5% of the distance W3 between the two wiring patterns, a short circuit may occur. If the distance between the first dummy pattern 44 and the adjacent wiring pattern 43 is greater than 20% of the distance W3 between the two wiring patterns, the flatness of the FPC 40 may not be ensured by thermal compression bonding. For this reason, it is preferable that the distance between the first dummy pattern 44 and the adjacent wiring pattern 43 be between 5% and 20% of the distance W3 between the two wiring patterns 43, and more preferably between 10% and 15%. This prevents a short circuit between the first dummy pattern 44 and the wiring pattern 43 while ensuring the flatness of the FPC 40.

[0030] Figure 4(A) is a diagram showing the configuration around the connection terminals 21c to 24c of the lower substrate 20, and Figure 4(B) is a cross-sectional view of the DD line in Figure 4(A).

[0031] As shown in Figures 4(A) and (B), the surface 20a of the lower substrate 20 facing the upper substrate 10 has a plurality of connection terminals 21c to 24c that are electrically connected to a plurality of wiring patterns 43 of the FPC 40, and a plurality of second dummy patterns 27 that are spaced apart from the plurality of connection terminals 21c to 24c and positioned between the plurality of connection terminals 21c to 24c. The second dummy patterns 27 have approximately the same thickness as the plurality of connection terminals 21c to 24c. Approximately the same means that differences in manufacturing tolerances are allowed. The FPC 40 is connected on the plurality of second dummy patterns 27 and the plurality of connection terminals 21c to 24c.

[0032] The second dummy pattern 27 is made of the same material as the connection terminals 21c to 24c (for example, copper or silver metal paste), or it is made of a different insulating material (for example, PET film or resin) than the connection terminals 21c to 24c. If the second dummy pattern 27 is made of the same material as the connection terminals 21c to 24c, the second dummy pattern 27 and the connection terminals 21c to 24c can be produced in the same process, thus simplifying the manufacturing process of the lower substrate 20. Note that the number of connection terminals and the number of second dummy patterns 27 are not limited to the examples in Figures 4(A) and 4(B).

[0033] Furthermore, the lower conductive film 26 between connection terminals 23c and 22c, between connection terminals 22c and 24c, and between connection terminals 24c and 21c is removed by the etching pattern 25.

[0034] As shown in Figures 4(A) and (B), a second dummy pattern 27 having approximately the same thickness as the connection terminals 21c to 24c is placed between the connection terminals 21c to 24c to ensure the flatness of the adhesive surface of the lower substrate 20 to the FPC 40. Therefore, even when the FPC 40 is placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, deformation of the upper substrate 10 can be suppressed. This prevents damage to the appearance of the touch panel 100 due to pressure marks. In particular, by adopting the structure in Figure 3(B) and the structures in Figures 4(A) and (B), the flatness of both the adhesive surface of the FPC 40 and the adhesive surface of the lower substrate 20 is ensured, further suppressing deformation of the upper substrate 10 due to heat-pressing.

[0035] Furthermore, since the second dummy pattern 27 is spaced apart from the connection terminals 21c to 24c, a short circuit between the second dummy pattern 27 and the connection terminals 21c to 24c can be prevented.

[0036] If the distance between the second dummy pattern 27 and the adjacent connection terminals 21c to 24c is less than 5% of the distance W6 between the two connection terminals, a short circuit may occur. If the distance between the second dummy pattern 27 and the adjacent connection terminals 21c to 24c is greater than 20% of the distance W6 between the two connection terminals, the flatness of the adhesive surface of the lower substrate 20 may not be ensured by thermocompression bonding. For this reason, the distance between the second dummy pattern 27 and the adjacent connection terminals 21c to 24c is preferably 5% to 20% of the distance W6 between the two connection terminals, and more preferably 10% to 15%. This prevents short circuits between the second dummy pattern 27 and the connection terminals 21c to 24c while ensuring the flatness of the adhesive surface of the lower substrate 20.

[0037] Figure 5 is a diagram of a modified configuration near the connection terminals 21c to 24c of the lower substrate 20. In Figure 5, there are no multiple second dummy patterns 27 between the multiple connection terminals 21c to 24c. If there are no multiple second dummy patterns 27 between the connection terminals 21c to 24c, and the FPC 40 is physically connected to the connection terminals 21c to 24c, a part of the FPC 40 may fall between the connection terminals 21c to 24c, potentially creating a heat-sealed pressure mark on the upper substrate 10.

[0038] In Figure 5, a lower conductive film 26 is formed on the surface 20a of the lower substrate 20 facing the upper substrate 10, and a plurality of connection terminals 21c to 24c are formed on the lower conductive film 26. The lower conductive film 26 between the plurality of connection terminals 21c to 24c is separated into a plurality of lower conductive films 26a to 26d by an etching pattern 25, and the plurality of wiring patterns 43 of the FPC 40 are physically connected to the plurality of lower conductive films 26a to 26d, respectively.

[0039] Thus, the multiple wiring patterns 43 of the FPC 40 are not physically connected to the connection terminals 21c to 24c, but are electrically connected to the connection terminals 21c to 24c via the lower conductive films 26a to 26d separated by the etching pattern 25. Therefore, by connecting the FPC 40 to the flat lower conductive films 26a to 26d and electrically connecting it to the connection terminals 21c to 24c, it is easier to ensure the flatness of the FPC 40. In addition, it is possible to suppress damage to the appearance of the touch panel 100 due to crimp marks. If a first dummy pattern is provided between the wiring patterns in Figure 3(B) on the FPC 40 in Figure 5, it becomes even easier to ensure flatness.

[0040] Figure 6(A) is a cross-sectional view of a modified example of the touch panel along the CC line in Figure 1(D). Figure 6(B) is a cross-sectional view of a modified example of the FPC40, and Figure 6(C) is a plan view of the base film 41 of the FPC40.

[0041] As shown in Figure 6(A), the touch panel 100 may include a reinforcing member 51 between the surface 10a of the upper substrate 10 facing the lower substrate 20 and the FPC 40 to reinforce the rigidity of the upper substrate 10. The reinforcing member 51 is formed on either the surface of the decorative layer 14 of the upper substrate 10 facing the lower substrate 20, or on the surface 41a of the base film 41 opposite the wiring pattern 43 of the FPC 40. The reinforcing member 51 may be, for example, a metal film such as copper foil, a PET film, a polyimide film, or a resin.

[0042] For example, by providing the reinforcing member 51 on the lower substrate 20 side of the decorative layer 14 of the upper substrate 10, the rigidity of the upper substrate 10 can be increased, and deformation of the upper substrate 10 due to thermal compression bonding can be suppressed. This prevents the appearance of the touch panel 100 from being damaged by compression marks.

[0043] Furthermore, as shown in Figures 6(B) and (C), a reinforcing member 51 may be provided on the surface 41a of the base film 41 opposite to the wiring pattern 43 of the FPC 40. In this case as well, the rigidity of the upper substrate 10 can be increased and deformation of the upper substrate 10 due to thermocompression bonding can be suppressed.

[0044] Figure 7(A) is a diagram showing the configuration near the connection terminals 21c to 24c of the lower substrate 20, and Figure 7(B) is a cross-sectional view of the touch panel along the EE line in Figure 7(A). In the cross-sectional view of Figure 7(B), the upper conductive film 13 and the lower conductive film 26 are not shown.

[0045] As shown in Figures 7(A) and (B), a portion of the FPC 40 (the adhesive surface) is not located between the upper substrate 10 and the lower substrate 20, but is fixed below the decorative layer 14 and to the surface 20b of the lower substrate 20 opposite to the upper substrate 10. Each of the connection terminals 21c to 24c and the lower substrate 20 is provided with a through hole 52 and a conductor 53 inserted into the through hole 52. The conductor 53 is made of, for example, a copper or silver metal paste or a conductive resin. Each of the connection terminals 21c to 24c is electrically connected to the wiring pattern 43 of the FPC 40 via the conductor 53. The conductor 53 is connected to the wiring pattern 43 of the FPC 40 using a conductive adhesive.

[0046] In the cases of Figures 7(A) and (B), the FPC 40 is not placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, so the FPC 40 may or may not have the first dummy pattern 44.

[0047] According to the configuration shown in Figures 7(A) and (B), a portion of the FPC 40 (adhesive surface) is placed on the surface 20b of the lower substrate 20 opposite to the first substrate 10, and is not placed between the upper substrate 10 and the lower substrate 20 for thermal compression bonding. This suppresses deformation of the upper substrate 10 due to thermal compression bonding. As a result, damage to the appearance of the touch panel 100 due to compression marks can be suppressed.

[0048] Figure 8(A) is a diagram showing the configuration near the connection terminals 21c to 24c of the lower substrate 20, and Figure 8(B) is a cross-sectional view of the touch panel along the FF line in Figure 8(A). In the cross-sectional view of Figure 8(B), the upper conductive film 13 and the lower conductive film 26 are not shown.

[0049] As shown in Figures 8(A) and (B), the touch panel 100 may include a conductor 54 that sandwiches a plurality of connection terminals 21c to 24c, a part of the surface 20a of the lower substrate 20 facing the upper substrate 10, the end surface 20c of the lower substrate 20, and a part of the surface 20b of the lower substrate 20 opposite to the upper substrate 10. The conductor 54 is, for example, a conductive clip, a conductive resin, or a printed copper or silver metal paste.

[0050] The FPC 40 is positioned on a portion of the conductor 54 located on the side 20b of the lower substrate 20 opposite to the upper substrate 10. However, if the end face 20c of the lower substrate 20 has sufficient thickness to connect the FPC 40, the FPC 40 may also be positioned on a portion of the conductor 54 located on the end face 20c of the lower substrate 20.

[0051] In the cases of Figures 8(A) and (B), the FPC 40 is not placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, so the FPC 40 may or may not have the first dummy pattern 44.

[0052] According to the configuration shown in Figures 8(A) and (B), a portion of the FPC 40 (adhesive surface) is placed on a portion of the conductor 54 located on the surface 20b of the lower substrate 20 opposite to the first substrate 10. Since it is not placed between the upper substrate 10 and the lower substrate 20 and not heat-compressed, deformation of the upper substrate 10 due to heat compression can be suppressed. This prevents damage to the appearance of the touch panel 100 due to compression marks.

[0053] Figure 9(A) is a diagram showing the configuration of the upper substrate included in the modified touch panel, Figure 9(B) is a diagram showing the configuration of the lower substrate included in the modified touch panel, and Figure 9(C) is a cross-sectional view of a part of the modified touch panel.

[0054] The upper substrate 10 and lower substrate 20 of the modified touch panel 200 have the patterns of electrodes and wiring reversed compared to the upper substrate 10 and lower substrate 20 of the touch panel 100 in Figures 1(B) and 1(C). Therefore, the upper substrate 10 in Figure 9(A) has electrodes 21a, 22a, wiring 21b to 24b and connection terminals 21c to 24, while the lower substrate 20 in Figure 9(B) has electrodes 11 and 12.

[0055] As shown in Figure 9(A), the upper substrate 10 of the modified touch panel 200 comprises a main body 17A facing the lower substrate 20, and an extension 17B extending from the main body 17A, fixed to the housing 55 by adhesive or double-sided tape, and covered by the housing 55. Wirings 21b to 24b provided on the main body 17A are extended to the extension 17B, and connection terminals 21c to 24c are provided at the end of the extension 17B opposite the main body 17A. As shown in Figures 9(A) and 9(C), the FPC 40 is placed on the extension 17B, fixed with a conductive adhesive (not shown), and electrically connected to the connection terminals 21c to 24c. For example, electrodes 21a and 22a, wirings 21b to 24b, and connection terminals 21c to 24 are covered by the housing 55.

[0056] In the case of Figure 9(C), since the FPC 40 is not placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, the FPC 40 may or may not have the first dummy pattern 44.

[0057] According to the configuration shown in Figures 9(A) to (C), the FPC 40 is placed on the extension 17B of the upper substrate 10, and the FPC 40 is not placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, thus preventing deformation of the upper substrate 10 due to heat-pressing. This prevents damage to the appearance of the touch panel 200 due to pressure marks. Even if the bonding area between the FPC 40 and the extension 17B deforms, the bonding area between the FPC 40 and the extension 17B is covered by the housing 55, thus preventing damage to the appearance of the touch panel 200.

[0058] As described above, according to this embodiment, the touch panel 100 comprises an upper substrate 10 and a lower substrate 20 arranged opposite to each other at a distance from each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, and an FPC 40 having a plurality of wiring patterns 43 arranged below the decorative area 2 and between the upper substrate 10 and the lower substrate 20, and electrically connected to the plurality of connection terminals 21c to 24c, and having at least one of a first dummy pattern 44 which is spaced apart from the plurality of wiring patterns 43 and arranged between the plurality of wiring patterns 43 and has substantially the same thickness as the plurality of wiring patterns 43, or a second dummy pattern 27 which is spaced apart from the plurality of connection terminals 21c to 24c and arranged between the plurality of connection terminals 21c to 24c and has substantially the same thickness as the plurality of connection terminals 21c to 24c.

[0059] With this configuration, at least one of the following is placed between the wiring patterns 43: a first dummy pattern 44 having approximately the same thickness as the wiring patterns 43, or a second dummy pattern 27 having approximately the same thickness as the connection terminals 21c to 24c between the connection terminals 21c to 24c. This ensures the flatness of the FPC 40, so that even if the FPC 40 is placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, deformation of the upper substrate 10 can be suppressed. This prevents damage to the appearance of the touch panel 100 due to pressure marks.

[0060] The touch panel 100 comprises an upper substrate 10 and a lower substrate 20 arranged spaced apart and facing each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, and an FPC 40 having a plurality of wiring patterns 43 arranged below the decorative area 2 and between the upper substrate 10 and the lower substrate 20, which are electrically connected to the plurality of connection terminals 21c to 24c. A lower conductive film 26 is formed on the surface 20a of the lower substrate 20 facing the upper substrate 10, a plurality of connection terminals 21c to 24c are formed below the decorative area 14 and on the conductive film 26, the lower conductive film 26 between the plurality of connection terminals 21c to 24c is separated into a plurality of lower conductive films 26a to 26d, and the plurality of wiring patterns 43 are connected to the connection terminals 21c to 24c via the plurality of lower conductive films 26a to 26d.

[0061] With this configuration, the FPC 40 is connected to the flat lower conductive films 26a to 26d and electrically connected to the connection terminals 21c to 24c, making it easier to ensure the flatness of the FPC 40. In addition, it is possible to suppress damage to the appearance of the touch panel 100 due to crimp marks.

[0062] The touch panel 100 may also include an upper substrate 10 and a lower substrate 20 that are spaced apart and facing each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, and an FPC 40 having a plurality of wiring patterns 43 located below the decorative area 2 and on the surface 20b of the lower substrate 20 opposite to the upper substrate 10, and electrically connected to the plurality of connection terminals 21c to 24c. Each of the plurality of connection terminals 21c to 24c and the lower substrate 20 may include a through hole 52 and a conductor 53 inserted into the through hole 52, and each of the plurality of connection terminals 21c to 24c may be electrically connected to each of the plurality of wiring patterns 43 via the conductor 53.

[0063] With this configuration, a portion of the FPC 40 (the adhesive surface) is placed on the surface 20b of the lower substrate 20 opposite to the first substrate 10, and is not placed between the upper substrate 10 and the lower substrate 20 for thermal compression bonding. This suppresses deformation of the upper substrate 10 due to thermal compression bonding. As a result, damage to the appearance of the touch panel 100 due to compression marks can be suppressed.

[0064] The touch panel 100 may also include an upper substrate 10 and a lower substrate 20 that are spaced apart and facing each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, an FPC 40 positioned below the decorative area 2 and having a plurality of wiring patterns 43 electrically connected to the plurality of connection terminals 21c to 24c, and a conductor 54 sandwiching the plurality of connection terminals 21c to 24, a part of the surface 20a of the lower substrate 20 facing the upper substrate 10, the end face 20c of the lower substrate 20, and a part of the surface 20b of the lower substrate 20 opposite to the upper substrate 10. The FPC 40 may be positioned on a part of the conductor 54 located on the surface 20b of the lower substrate 20 opposite to the upper substrate 10.

[0065] With this configuration, a portion of the FPC 40 (adhesive surface) is placed on a portion of the conductor 54 located on the surface 20b of the lower substrate 20 opposite to the first substrate 10, and is not placed between the upper substrate 10 and the lower substrate 20 for thermal compression bonding. This suppresses deformation of the upper substrate 10 due to thermal compression bonding. As a result, damage to the appearance of the touch panel 100 due to compression marks can be suppressed.

[0066] The touch panel 200 also includes an upper substrate 10 and a lower substrate 20 that are spaced apart and facing each other, a plurality of connection terminals 21c to 24c provided on the surface 20a of the lower substrate 20 facing the upper substrate 10, and an FPC 40 having a plurality of wiring patterns 43 that are electrically connected to the plurality of connection terminals 21c to 24c. The upper substrate 10 includes a main body portion 17A that faces the lower substrate 20, and an extension portion 17B that extends from the main body portion 17A, is fixed to the housing 55, and is covered by the housing 55. The FPC 40 is located on the extension portion 17B.

[0067] With this configuration, the FPC 40 is placed on the extension 17B of the upper substrate 10, and the FPC 40 is not placed between the upper substrate 10 and the lower substrate 20 and heat-pressed, thus suppressing deformation of the upper substrate 10 due to heat-pressure bonding. This prevents damage to the appearance of the touch panel 200 due to pressure marks.

[0068] Furthermore, the present invention is not limited to the embodiments described above, and can be implemented in various modified forms without departing from its essence. [Explanation of symbols]

[0069] 1 Operating area, 2 Decorative area, 10 Upper substrate, 11, 12, 21a, 22a Electrodes, 17A Main body, 17B Extension, 20 Lower substrate, 21b~24b Wiring, 21c~24c Connection terminals, 26, 26a~26d Lower conductive film, 27 Second dummy pattern, 40 FPC, 43 Wiring pattern, 44 First dummy pattern, 100, 200 Touch panel

Claims

1. A touch panel having an operating area for accepting user input and a decorative area for not accepting such user input, A first substrate and a second substrate are arranged opposite each other at a distance from each other, A plurality of connection terminals provided on the surface of the second substrate facing the first substrate, A wiring board having multiple wiring patterns that are electrically connected to the multiple connection terminals, located below the decorative region and between the first substrate and the second substrate, Equipped with, A touch panel characterized by having at least one of the following: a first dummy pattern spaced apart from the plurality of wiring patterns and positioned between the plurality of wiring patterns and having substantially the same thickness as the plurality of wiring patterns; or a second dummy pattern spaced apart from the plurality of connection terminals and positioned between the plurality of connection terminals and having substantially the same thickness as the plurality of connection terminals.

2. A touch panel having an operating area for accepting user input and a decorative area for not accepting such user input, A first substrate and a second substrate are arranged opposite each other at a distance from each other, A plurality of connection terminals provided on the surface of the second substrate facing the first substrate, A wiring board having multiple wiring patterns that are electrically connected to the multiple connection terminals, located below the decorative region and between the first substrate and the second substrate, Equipped with, A touch panel characterized in that a conductive film is formed on the surface of the second substrate facing the first substrate, a plurality of connection terminals are formed below the decorative region and on the conductive film, the conductive film between the plurality of connection terminals is separated into a plurality of conductive films, and the plurality of wiring patterns are connected to the connection terminals via the plurality of conductive films.

3. The touch panel according to claim 1 or 2, characterized in that a reinforcing member is provided between the surface of the first substrate facing the second substrate and the wiring substrate.

4. A touch panel having an operating area for accepting user input and a decorative area for not accepting such user input, A first substrate and a second substrate are arranged opposite each other at a distance from each other, A plurality of connection terminals provided on the surface of the second substrate facing the first substrate, A wiring board is provided, which is located below the decorative region and on the side of the second substrate opposite to the first substrate, and has a plurality of wiring patterns that are electrically connected to the plurality of connection terminals. A touch panel characterized in that each of the plurality of connection terminals and the second substrate is provided with a through hole and a conductor inserted into the through hole, and each of the plurality of connection terminals is electrically connected to each of the plurality of wiring patterns via the conductor.

5. A touch panel having an operating area for accepting user input and a decorative area for not accepting such user input, A first substrate and a second substrate are arranged opposite each other at a distance from each other, A plurality of connection terminals provided on the surface of the second substrate facing the first substrate, A wiring board having multiple wiring patterns that are electrically connected to the multiple connection terminals and positioned below the decorative area, The facility comprises the plurality of connection terminals, a conductor sandwiching a portion of the surface of the second substrate facing the first substrate, the end face of the second substrate, and a portion of the surface of the second substrate opposite to the first substrate, The touch panel is characterized in that the wiring board is arranged on a part of the conductor.

6. A first substrate and a second substrate are arranged opposite each other at a distance from each other, Multiple connection terminals provided on the surface of the first substrate facing the second substrate, The wiring board comprises a plurality of wiring patterns electrically connected to the plurality of connection terminals, The first substrate comprises a main body portion facing the second substrate, and an extension portion extending from the main body portion, fixed to a housing, and covered by the housing. The touch panel is characterized in that the wiring board is arranged in the extension portion.

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