Substrate processing equipment

JP2026101556APending Publication Date: 2026-06-22KURABO INDUSTRIES LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KURABO INDUSTRIES LTD
Filing Date
2024-12-10
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

The challenge in single-wafer substrate processing equipment is accommodating multiple nozzles and probes within a small chamber volume, as their moving mechanisms require significant space, often making it impossible to integrate additional probes depending on the chamber layout.

Method used

The substrate processing apparatus integrates a supply unit and a probe for observing the processing status using a shared moving mechanism, allowing them to move together between the center and the outer edge of the substrate, thereby optimizing space utilization.

Benefits of technology

This integration facilitates easy accommodation of supply units and probes within a limited chamber volume, enabling efficient substrate processing and monitoring without the need for additional space, even with multiple units.

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Abstract

The present invention provides a substrate processing apparatus that includes a processing liquid supply unit and a probe for observing the substrate processing status within a chamber of limited volume. [Solution] A substrate processing apparatus 10 that processes a substrate W rotating in a chamber 11 by supplying a processing liquid to it, comprising: a first supply unit 20 for supplying a first processing liquid to the substrate; a first probe 41 for receiving light reflected or emitted from the substrate; a first moving means (first arm 23, first support column 24, first drive unit 25) that enables the first supply unit and the first probe to move together between the center and the outer edge of the substrate; a second supply unit 30 for supplying a second processing liquid to the substrate; a second probe 51 for receiving light reflected or emitted from the substrate; and a second moving means (second arm 33, second support column 34, second drive unit 35) that enables the second supply unit and the second probe to move together between the center and the outer edge of the substrate.
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Citation Information

Patent Citations

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  • Substrate processing method and substrate processing device

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  • Substrate processing method

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