Electronic components and manufacturing method thereof

Abstract

To provide an electronic component that can be easily detected by detection devices such as a laser sensor and a camera.SOLUTION: An electronic component includes a glass substrate having a main body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding portion provided on the first side surface of the main body portion, a colored insulating layer provided at least on the first side surface of the main body portion, and a penetrating conductor which is provided in the main body portion and penetrates the top surface and the bottom surface. The protruding portion extends along a first direction perpendicular to the top surface when viewed from a direction perpendicular to the first side surface, and at least a part of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is arranged to be adjacent to the protruding portion in a second direction perpendicular to the first direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to electronic components and methods for manufacturing the same. [Background technology]

[0002] A conventional electronic component is described in JP 2013-98350 A (Patent Document 1). This electronic component includes a glass body and a conductor provided inside the glass body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-98350 A Summary of the Invention [Problem to be solved by the invention]

[0004] Glass is widely used as an insulator and structure for electronic components due to its advantages such as insulating properties and physical and chemical stability. In particular, electronic components that have a structure in which a conductor is embedded inside a glass body, as in the past, are suitable as small inductor components for high-frequency signals, which require a non-magnetic structure.

[0005] On the other hand, when highly transparent glass is used as the glass, there are also problems due to its transparency. For example, many mounters in recent years have the function of detecting the side of electronic components using a laser sensor or a camera to detect the presence or absence of electronic components and the thickness of the electronic components. Transparent electronic components using glass have the problem that they are difficult to recognize with the mounter's laser sensor or camera. There is also the problem that appearance inspection using a camera is difficult.

[0006] Therefore, an object of the present disclosure is to provide an electronic component that can be easily detected by a detection device such as a laser sensor or a camera, and a manufacturing method thereof. [Means for solving the problem]

[0007] In order to solve the above problems, an electronic component according to one aspect of the present disclosure comprises: a glass substrate having a main body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protrusion provided on the first side surface of the main body; a colored insulating layer provided at least on the first side surface of the main body; a through conductor provided in the main body and passing through the top surface and the bottom surface; Equipped with The protrusion extends along a first direction perpendicular to the top surface when viewed from a direction perpendicular to the first side surface, At least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the protruding portion in a second direction perpendicular to the first direction.

[0008] Here, when viewed from a direction perpendicular to the first side surface, the extension direction of the protrusion does not only completely coincide with the first direction, but also only needs to substantially coincide with the first direction. For example, the inclination angle between the extension direction of the protrusion and the first direction may be 10° or less. The same applies to the extension direction of the colored insulating layer.

[0009] According to the above aspect, the colored insulating layer is provided at least on the first side surface of the main body portion of the glass substrate. Therefore, when detecting electronic components from the first side surface side of the main body portion using a detection device such as a laser sensor or a camera, the colored insulating layer with low transparency can be easily recognized, and the electronic components can be easily detected.

[0010] Furthermore, since the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side, when the detection device is scanned in the first direction to detect the electronic component, the colored insulating layer can be easily recognized and the electronic component can be easily detected.

[0011] Furthermore, since the colored insulating layer is provided at least on the first side surface of the main body of the glass substrate, the exposed area of ​​the main body can be reduced, improving the mechanical strength of the electronic component against external forces.

[0012] Preferably, in one embodiment of the electronic component, On the first side surface, the colored insulating layer is provided in the entire area where no protruding portion exists.

[0013] According to the embodiment, the plane area of ​​the colored insulating layer in the first aspect can be increased, which allows the electronic component to be more easily detected by a detection device and further improves the mechanical strength of the electronic component.

[0014] Preferably, in one embodiment of the electronic component, The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The colored insulating layer is provided continuously on the first side surface, the corner portion, and the second side surface.

[0015] According to the embodiment, the colored insulating layer is provided continuously on the first side surface, the corner portion, and the second side surface, so that cracks and chips can be suppressed at the corner portion where cracks and chips are likely to occur.

[0016] Preferably, in one embodiment of the electronic component, The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The corner portion has a curved surface.

[0017] According to the embodiment, since the corners have curved surfaces, cracks and chips at the corners can be further suppressed. Also, the volume of glass at the corners is smaller than when the corners are ridges, and the possibility of stray capacitance occurring at the corners can be reduced.

[0018] Preferably, in one embodiment of the electronic component, an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; Equipped with.

[0019] According to the embodiment, the protective layer covers the outer conductors, and therefore the outer conductors can be protected. Also, the protective layer covers at least one of the top and bottom surfaces of the body of the glass substrate, and therefore the body can be protected.

[0020] Preferably, in one embodiment of the electronic component, The colored insulating layer is provided at least in the center of the first side surface.

[0021] According to the above embodiment, when detecting electronic components from the first side surface of the main body portion of the glass substrate using a detection device such as a laser sensor or a camera, if the center of the first side surface is the detection target, the electronic components can be detected even more easily because the colored insulating layer is provided at least at the center of the first side surface.

[0022] Preferably, in one embodiment of the electronic component, The glass substrate has two protrusions on the first side that are aligned in the second direction, and at least a portion of the colored insulating layer is disposed between the two protrusions and adjacent to each of the two protrusions in the second direction.

[0023] According to the embodiment, the colored insulating layer is sandwiched between the two protruding portions, so that peeling of the colored insulating layer can be suppressed.

[0024] Preferably, in one embodiment of the electronic component, On the first side surface, the width of the colored insulating layer in the second direction is greater than the width of the protruding portion in the second direction.

[0025] Here, the width refers to the maximum width, specifically, the maximum value of the width in the second direction in the first direction.

[0026] According to the embodiment, in the first side face, the colored insulating layer can be made larger than the protruding portion, so that the electronic component can be more easily detected by a detection device, and the mechanical strength of the electronic component can be further improved.

[0027] Preferably, in one embodiment of the electronic component, When viewed from a direction perpendicular to the first side, the through conductor includes two adjacent through conductors in the second direction, the protrusion overlaps one of the two adjacent through conductors, and the colored insulating layer overlaps the area between the two adjacent through conductors.

[0028] According to the embodiment, a colored insulator with a relatively low dielectric constant is provided in the region of the first side surface near the space between two adjacent through conductors, thereby reducing the possibility of stray capacitance occurring near the two adjacent through conductors.

[0029] Preferably, in one embodiment of the electronic component, The protrusions are crystallized.

[0030] According to the embodiment, the transparency of the protrusion is less than the transparency of the main body, so that the electronic component can be detected more easily.

[0031] Preferably, in one embodiment of the method for manufacturing an electronic component, providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; irradiating a portion of the cut region of the first main surface with ultraviolet light and then crystallizing the portion of the cut region by heat treatment; a step of forming a through hole and a bridge portion by removing a part of the crystallized cutting region by etching to form a through hole penetrating the first main surface and the second main surface of the mother substrate, and a bridge portion extending from the first main surface to the second main surface of the mother substrate in a region of the cutting region other than the region where the through hole is provided; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the through hole and bringing the colored insulating layer into contact with the bridge portion; cutting the colored insulating layer and the bridge portion along the cutting region to divide the motherboard into a plurality of electronic components; Equipped with.

[0032] According to the above embodiment, a through hole is provided in a part of the cutting area, a colored insulating layer is embedded in the through hole, and the colored insulating layer is cut along the cutting area to divide the mother board, so that a part of the side of the electronic component after division can be covered with the colored insulating layer.

[0033] Furthermore, since the bridge portion is in contact with the colored insulating layer, the bridge portion is fixed to the colored insulating layer, which reduces the possibility of the bridge portion cracking or chipping when the colored insulating layer and the bridge portion are cut.

[0034] In addition, since the colored insulating layer is provided on the motherboard, this can be achieved easily and at low cost compared to applying a colored insulating layer to each component after dividing the motherboard, which increases the labor and cost required to apply a colored insulating layer to each of the divided components.

[0035] Preferably, in one embodiment of the method for manufacturing an electronic component, In the step of forming the through hole and the bridge portion, the through hole is formed in at least a region of the cut region that corresponds to a corner of the electronic component.

[0036] According to the embodiment, since the colored insulating layer can be provided at the corners of the electronic component, cracks and chips at the corners can be suppressed.

[0037] Preferably, in one embodiment of the method for manufacturing an electronic component, Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; Equipped with.

[0038] According to the embodiment, the protective layer covers the outer conductor, so that the outer conductor can be protected. Also, the protective layer covers at least one of the top surface and the bottom surface of the main body, so that the main body can be protected.

[0039] Preferably, in one embodiment of the method for manufacturing an electronic component, In the step of forming the protective layer, the protective layer is formed so as not to overlap the cutting region when viewed from a direction perpendicular to the first main surface of the mother substrate.

[0040] According to the embodiment, when the mother substrate is divided by, for example, dicing, it is possible to prevent the dicing blade from coming into contact with the protective layer, which in turn prevents the protective layer from peeling off from the mother substrate.

[0041] Preferably, in one embodiment of the method for manufacturing an electronic component, After the step of forming the through hole and the bridge portion, The method further includes a step of irradiating the bridge portion with ultraviolet light and then subjecting the bridge portion to a heat treatment to crystallize the bridge portion.

[0042] According to the embodiment, the bridge portion is crystallized and the motherboard is divided by cutting the bridge portion, so that crystallized protrusions can be provided on the side surfaces of the divided electronic components. Also, because the bridge portion is crystallized, cracking and chipping of the bridge portion can be suppressed when the motherboard is divided. Effect of the Invention

[0043] According to an electronic component and a method for manufacturing the same which are one aspect of the present disclosure, detection can be easily performed using a detection device such as a laser sensor or a camera. [Brief description of the drawings]

[0044] [Figure 1] 1 is a perspective view showing an inductor component as an electronic component according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the inductor component. [Diagram 3] 2 is a side view of the inductor component as viewed from a first side surface side. FIG. [Figure 4A] 1 is a top view of a coil of an inductor component as viewed from the top surface side. [Figure 4B] 1 is a bottom view of a coil of the inductor component as viewed from the bottom side. FIG. [Figure 5A] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5B] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5C] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5D] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5E] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5F] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5G] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5H] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5I] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5J] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5K] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 6] 11 is a side view of an inductor component as an electronic component according to a second embodiment, viewed from a first side surface side. FIG. [Figure 7] 1 is a bottom view of a coil of the inductor component as viewed from the bottom side. FIG. [Figure 8] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 9] 13 is a bottom view of a coil of an inductor component as an electronic component according to a third embodiment, viewed from the bottom side. FIG. [Figure 10] 13 is a side view of an inductor component as an electronic component in accordance with a fourth embodiment, viewed from a first side surface side. FIG. [Figure 11] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 12] 13 is a side view of an inductor component as an electronic component in accordance with a fifth embodiment, viewed from a first side surface side. FIG. [Figure 13] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 14] FIG. 13 is a cross-sectional view showing a capacitor component as an electronic component in accordance with a sixth embodiment. [Figure 15] 2 is a side view of the capacitor component as viewed from a first side surface side. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0045] Hereinafter, an electronic component and a method for manufacturing the same according to one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or ratios.

[0046] First Embodiment (composition) In the first embodiment, an inductor component is described as an example of an electronic component according to the present disclosure. FIG. 1 is a perspective view of the inductor component as viewed from the top surface side. FIG. 2 is an exploded perspective view of the inductor component as viewed from the top surface side. FIG. 3 is a side view of the inductor component as viewed from a first side surface side. FIG. 4A is a top view of the coil of the inductor component as viewed from the top surface side, and FIG. 4B is a bottom view of the coil of the inductor component as viewed from the bottom surface side. Note that in FIG. 3, hatching is applied to positions where colored insulating layers are present for convenience.

[0047] The inductor component 1 is a surface-mount type inductor component used in, for example, a high-frequency signal transmission circuit. As shown in Figures 1, 2, 3, 4A, and 4B, the inductor component 1 includes a glass substrate 10, a coil 110 provided on the glass substrate 10, a first protective layer 15 provided on the top surface of the glass substrate 10 and covering a part of the coil 110, a second protective layer 16 provided on the bottom surface of the glass substrate 10 and covering a part of the coil 110, a colored insulating layer 30 provided on the side surface of the glass substrate 10, and a first terminal electrode 121 and a second terminal electrode 122 provided on the second protective layer 16 and electrically connected to the coil 110.

[0048] The glass substrate 10 has a main body 100 and a protruding portion 101 provided on the main body 100. The main body 100 has high transparency. The main body 100 is a rectangular parallelepiped having a length, a width, and a height. The main body 100 has a first side surface 100s1 and a third side surface 100s3 at both ends in the width direction, a second side surface 100s2 and a fourth side surface 100s4 at both ends in the length direction, and a bottom surface 100b and a top surface 100t at both ends in the height direction. That is, the outer surface of the main body 100 includes the first side surface 100s1 and the second side surface 100s2, the third side surface 100s3 and the fourth side surface 100s4, the bottom surface 100b, and the top surface 100t. The bottom surface 100b is a surface that faces the mounting board when the inductor component 1 is mounted on the mounting board.

[0049] As shown in the drawings, for the sake of convenience, the length direction (longitudinal direction) of the main body 100, which is a direction from the fourth side surface 100s4 to the second side surface 100s2, is referred to as the X direction. The width direction of the main body 100, which is a direction from the third side surface 100s3 to the first side surface 100s1, is referred to as the Y direction. The height direction of the main body 100, which is a direction from the bottom surface 100b to the top surface 100t, is referred to as the Z direction. The X direction, Y direction, and Z direction are mutually orthogonal, and when arranged in the order of X, Y, Z, they form a left-handed system.

[0050] In this specification, the outer surface of the main body 100 does not simply mean a surface facing the outer periphery of the main body 100, but a surface that is a boundary between the outside and inside of the main body 100. In addition, "above the outer surface (top surface, bottom surface, side surface) of the main body 100" does not mean an absolute direction such as vertically upward as determined by the direction of gravity, but refers to a direction toward the outside of the outside and inside with the outer surface as a boundary, based on the outer surface. Therefore, "above the outer surface" is a relative direction determined by the orientation of the outer surface. In addition, "above" with respect to a certain element includes not only an upper side away from the element, that is, an upper position via another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).

[0051] The glass substrate 10 has insulating properties. The glass substrate 10 is preferably a photosensitive glass substrate such as Foturan II (registered trademark of Schott AG). In particular, the glass substrate 10 is preferably a glass substrate made of cerium oxide (ceria: CeO 2 In this case, cerium oxide acts as a sensitizer, making photolithographic processing easier.

[0052] However, the glass substrate 10 may be a glass plate that does not have photosensitivity because it can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc. Also, the glass substrate 10 may be formed by sintering a glass paste, or may be formed by a known method such as a float method.

[0053] The protrusions 101 are portions of the glass substrate 10 that protrude from a portion of a side surface of the main body portion 100. Specifically, the protrusions 101 protrude outward from the main body portion 100 from a portion of the first side surface 100s1, a portion of the second side surface 100s2, a portion of the third side surface 100s3, and a portion of the fourth side surface 100s4.

[0054] The protrusion 101 extends along the Z direction (corresponding to an example of the "first direction" described in the claims) perpendicular to the top surface 100t when viewed from a direction perpendicular to the first side surface 100s1. The protrusion 101 is provided on each of both ends of the first side surface 100s1 in the X direction. That is, on the first side surface 100s1, two protrusions 101 are provided on each of both ends in the X direction.

[0055] Similarly, the protrusion 101 extends along the Z direction perpendicular to the top surface 100t when viewed from a direction perpendicular to the second side surface 100s2. The protrusion 101 is provided at each of both ends of the second side surface 100s2 in the Y direction. Also, the protrusion 101 extends along the Z direction perpendicular to the top surface 100t when viewed from a direction perpendicular to the third side surface 100s3. The protrusion 101 is provided at each of both ends of the third side surface 100s3 in the X direction. Also, the protrusion 101 extends along the Z direction perpendicular to the top surface 100t when viewed from a direction perpendicular to the fourth side surface 100s4. The protrusion 101 is provided at each of both ends of the fourth side surface 100s4 in the Y direction.

[0056] The protrusion 101 may be provided on at least one of the first side surface 100s1 to the fourth side surface s4. In this case, the at least one side surface corresponds to an example of the "first side surface" described in the claims. In this embodiment, the number of protrusions 101 on one side surface, for example, the first side surface 100s1, is two, but the number of protrusions 101 may be one or three or more.

[0057] In addition, in one side surface, for example the first side surface 100s1, the protrusion 101 extends continuously across both the upper and lower ends in the Z direction, but may be partially present in the Z direction (vertical direction). In other words, the length of the protrusion 101 in the Z direction may be shorter than the length of both the upper and lower ends of the first side surface 100s1.

[0058] In addition, when viewed from a direction perpendicular to one side surface, for example, the first side surface 100s1, the extension direction of the protrusion 101 completely coincides with the Z direction, but it is sufficient if they substantially coincide with each other. For example, the inclination angle between the extension direction of the protrusion 101 and the Z direction may be 10° or less.

[0059] Furthermore, in one side surface, for example, the first side surface 100s1, the protrusions 101 are provided at both ends of the first side surface 100s1 in the X direction, but they do not have to be provided at both ends. For example, when viewed from a direction perpendicular to the first side surface 100s1, the protrusions 101 may be provided away from the second side surface 100s2 and the fourth side surface 100s4. In other words, the protrusions 101 may be provided closer to the center of the first side surface 100s1 than both ends in the X direction.

[0060] Furthermore, the main body 100 is a rectangular parallelepiped, but may be a cylinder, in which case the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. The protrusion 101 is provided on a part of the circumferential surface of the cylinder.

[0061] The coil 110 is wound in a spiral shape along an axis AX. The axis AX of the coil 110 is disposed parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface conductors 11b, a plurality of top surface conductors 11t, a plurality of first through conductors 13, and a plurality of second through conductors 14. The bottom surface conductor 11b and the top surface conductor 11t correspond to an example of an "external surface conductor" as defined in the claims.

[0062] The multiple bottom conductors 11b are disposed above the bottom surface 100b. The multiple bottom conductors 11b are arranged along the axis AX in contact with the bottom surface 100b. The multiple top conductors 11t are disposed above the top surface 100t. The multiple top conductors 11t are arranged along the axis AX in contact with the top surface 100t.

[0063] The multiple first penetrating conductors 13 are provided in the main body 100 and penetrate the bottom surface 100b and the top surface 100t. The multiple first penetrating conductors 13 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along the axis AX.

[0064] The second through conductors 14 are provided in the main body 100 and penetrate the bottom surface 100b and the top surface 100t. The second through conductors 14 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along the axis AX. The second through conductors 14 are provided on the opposite side of the axis AX to the first through conductor 13. The bottom surface conductor 11b, the first through conductor 13, the top surface conductor 11t, and the second through conductor 14 are electrically connected in this order to form at least a part of the spiral coil 110.

[0065] The top conductor 11t extends in the Y direction at a slight incline toward the X direction. All the top conductors 11t are arranged in parallel along the X direction. The bottom conductor 11b has a shape that extends in the Y direction. All the bottom conductors 11b are arranged in parallel along the X direction.

[0066] The first through conductor 13 is disposed on the third side surface 100s3 side with respect to the axis AX in the through hole of the main body 100, and the second through conductor 14 is disposed on the first side surface 100s1 side with respect to the axis AX in the through hole of the main body 100. The first through conductor 13 and the second through conductor 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. All the first through conductors 13 and all the second through conductors 14 are each disposed in parallel along the X direction.

[0067] The bottom conductor 11b and the top conductor 11t are made of a conductive material such as copper, silver, gold, or an alloy thereof. The bottom conductor 11b and the top conductor 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste. The first through conductor 13 and the second through conductor 14 are made of the same material as the bottom conductor 11b and the top conductor 11t.

[0068] The bottom conductor 11b and the top conductor 11t are preferably formed by a semi-additive method, which allows the bottom conductor 11b and the top conductor 11t to be formed with low electrical resistance, high precision, and high aspect ratio. The first penetrating conductor 13 and the second penetrating conductor 14 can be formed in through holes formed in advance in the main body 100 using the materials and manufacturing methods exemplified for the bottom conductor 11b and the top conductor 11t.

[0069] The first protective layer 15 is disposed above the top surface 100t so as to cover the top surface conductor 11t. The first protective layer 15 contacts the top surface 100t, the top surface conductor 11t, and the colored insulating layer 30. By covering the top surface conductor 11t, the first protective layer 15 protects the top surface conductor 11t from external forces and prevents damage to the top surface conductor 11t. In addition, since the first protective layer 15 covers the top surface 100t of the main body 100, it is possible to protect the main body 100. In addition, since the first protective layer 15 contacts the colored insulating layer 30, the colored insulating layer 30 is fixed to the first protective layer 15, and peeling of the colored insulating layer 30 can be suppressed when dividing into individual inductor components 1.

[0070] The second protective layer 16 is disposed above the bottom surface 100b so as to cover the bottom surface conductor 11b. The second protective layer 16 contacts the bottom surface 100b, the bottom surface conductor 11b, and the colored insulating layer 30. By covering the bottom surface conductor 11b, the second protective layer 16 protects the bottom surface conductor 11b from external forces and prevents damage to the bottom surface conductor 11b. In addition, the second protective layer 16 covers the bottom surface 100b of the main body 100, and therefore can protect the main body 100. In addition, the second protective layer 16 contacts the colored insulating layer 30, and therefore the colored insulating layer 30 is fixed to the second protective layer 16, and peeling of the colored insulating layer 30 can be suppressed when the inductor component 1 is divided into individual components.

[0071] The first protective layer 15 and the second protective layer 16 have insulating properties and are made of a resin such as epoxy or polyimide.

[0072] The first terminal electrode 121 is disposed above the bottom surface 100b and connected to a first end of the coil 110. The second terminal electrode 122 is disposed above the bottom surface 100b and connected to a second end of the coil 110. The first terminal electrode 121 is provided on the second protective layer 16 on the fourth side surface 100s4 side with respect to the center of the glass substrate 10 in the X direction. The second terminal electrode 122 is provided on the second protective layer 16 on the second side surface 100s2 side with respect to the center of the glass substrate 10 in the X direction.

[0073] The first terminal electrode 121 is connected to the bottom conductor 11b through a first via conductor 121v embedded in the second protective layer 16. The second terminal electrode 122 is connected to the bottom conductor 11b through a second via conductor 122v embedded in the second protective layer 16.

[0074] The first terminal electrode 121 has an underlayer and a plating layer covering the underlayer. The underlayer includes a conductive material such as Ag or Cu. The plating layer includes a conductive material such as Ni, Sn, Pd, or Au. Similarly, the second terminal electrode 122 has an underlayer and a plating layer covering the underlayer. Note that the first terminal electrode 121 and the second terminal electrode 122 may be made of a single layer of conductive material.

[0075] The colored insulating layer 30 is provided on each of a part of the first side surface 100s1, a part of the second side surface 100s2, a part of the third side surface 100s3, and a part of the fourth side surface 100s4 of the main body portion 100. Specifically, the colored insulating layer 30 is provided on each of an area of ​​the first side surface 100s1 where the protrusion 101 is not provided, an area of ​​the second side surface 100s2 where the protrusion 101 is not provided, an area of ​​the third side surface 100s3 where the protrusion 101 is not provided, and an area of ​​the fourth side surface 100s4 where the protrusion 101 is not provided.

[0076] More specifically, the colored insulating layer 30 extends along the Z direction (corresponding to an example of the "first direction" in the claims) perpendicular to the top surface 100t when viewed from a direction perpendicular to the first side surface 100s1, and is disposed adjacent to the protruding portion 101 in the X direction (corresponding to an example of the "second direction" in the claims) perpendicular to the Z direction. In other words, the colored insulating layer 30 is in contact with the protruding portion 101 along the Z direction.

[0077] Similarly, the colored insulating layer 30 extends along the Z direction orthogonal to the top surface 100t when viewed from a direction orthogonal to the second side surface 100s2, and is disposed adjacent to the protruding portion 101 in the Y direction orthogonal to the Z direction. The colored insulating layer 30 extends along the Z direction orthogonal to the top surface 100t when viewed from a direction orthogonal to the third side surface 100s3, and is disposed adjacent to the protruding portion 101 in the X direction orthogonal to the Z direction. The colored insulating layer 30 extends along the Z direction orthogonal to the top surface 100t when viewed from a direction orthogonal to the fourth side surface 100s4, and is disposed adjacent to the protruding portion 101 in the Y direction orthogonal to the Z direction.

[0078] The colored insulating layer 30 has insulating properties and is made of a resin such as epoxy or polyimide. The colored insulating layer 30 is colored, for example, green or blue, and the transparency of the colored insulating layer 30 is lower than the transparency of the main body portion 100.

[0079] The colored insulating layer 30 may be provided on at least one of the first side surface 100s1 to the fourth side surface s4. In this case, the at least one side surface corresponds to an example of the "first side surface" described in the claims. That is, at least a part of the colored insulating layer 30 extends along a first direction perpendicular to the top surface 100t when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the protruding portion 101 in a second direction perpendicular to the first direction. Also, on one side surface, for example the first side surface 100s1, the colored insulating layer 30 may be divided into a plurality of regions.

[0080] Furthermore, on one side surface, for example the first side surface 100s1, the colored insulating layer 30 extends continuously across both the top and bottom ends in the Z direction, but may be partially present in the Z direction (vertical direction). In other words, the length of the colored insulating layer 30 in the Z direction may be shorter than the length of both the top and bottom ends of the first side surface 100s1.

[0081] Also, when viewed from a direction perpendicular to one side surface, for example the first side surface 100s1, the extending direction of the colored insulating layer 30 completely coincides with the Z direction, but it is sufficient if they substantially coincide with each other. For example, the inclination angle between the extending direction of the colored insulating layer 30 and the Z direction may be 10° or less.

[0082] Also, on one side surface, for example the first side surface 100s1, the colored insulating layer 30 is in contact with both of the two protruding portions 101 along the Z direction, but may be in contact with only one of the protruding portions 101 along the Z direction. In other words, the colored insulating layer 30 may be provided in a part of an area of ​​the first side surface 100s1 where the protruding portion 101 is not provided. In this case, for example, in an area between the protruding portion 101 on the side not in contact with the colored insulating layer 30 and the colored insulating layer 30, the main body portion 100 may be exposed to the outside.

[0083] The main body 100 is a rectangular parallelepiped, but may be a cylinder, in which case the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. The colored insulating layer 30 is provided on a part of the circumferential surface of the cylinder.

[0084] According to the above configuration, the colored insulating layer 30 is provided on the first side surface 100s1 of the main body portion 100 of the glass substrate 10. Therefore, when detecting an electronic component from the first side surface 100s1 of the main body portion 100 using a detection device such as a laser sensor or a camera, the colored insulating layer 30, which has low transparency, can be easily recognized, and the inductor component 1 can be easily detected.

[0085] Furthermore, since the colored insulating layer 30 extends along the Z direction when viewed from a direction perpendicular to the first side surface 100s1, when the detection device is scanned in the Z direction to detect the inductor component 1, the colored insulating layer 30 can be easily recognized, and the inductor component 1 can be easily detected.

[0086] Furthermore, since the colored insulating layer 30 is provided on the first side surface 100s1 of the main body portion 100 of the glass substrate 10, the exposed area of ​​the main body portion 100 can be reduced, improving the mechanical strength of the inductor component 1 against external forces.

[0087] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same effects as those of the first side surface 100s1 described above.

[0088] Preferably, on the first side surface 100s1, the colored insulating layer 30 is provided in the entire region where no protruding portion 101 is present. With this configuration, the planar area of ​​the colored insulating layer 30 can be increased on the first side surface 100s1. This allows the inductor component 1 to be more easily detected by a detection device, and also improves the mechanical strength of the inductor component 1. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0089] Preferably, at least one of the first protective layer 15 and the second protective layer 16 is colored, similar to the colored insulating layer 30. With this, when the inductor component 1 is detected from the top surface 100t side or the bottom surface 100b side of the main body 100 by a detection device such as a laser sensor or a camera, the protective layers 15 and 16 can be easily recognized, and the inductor component 1 can be easily detected.

[0090] 3, the colored insulating layer 30 is preferably provided at least in the center of the first side surface 100s1. With this configuration, when detecting the inductor component 1 from the first side surface 100s1 side of the main body 100 using a detection device such as a laser sensor or a camera, the inductor component 1 can be detected more easily when the center of the first side surface 100s1 is the detection target. Note that the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0091] 3, the glass substrate 10 preferably has two protrusions 101 aligned in the X direction on the first side surface 100s1, and at least a portion of the colored insulating layer 30 is disposed between the two protrusions 101 and adjacent to each of the two protrusions 101 in the X direction. In this manner, the two protrusions 101 sandwich the colored insulating layer 30 on the first side surface 100s1, so that peeling of the colored insulating layer 30 can be suppressed. Note that when three or more protrusions 101 are aligned in the X direction on the first side surface 100s1, at least a portion of the colored insulating layer 30 may be disposed between the two protrusions 101 and adjacent to each of the two protrusions 101 in the X direction in at least one pair of adjacent two protrusions 101. Moreover, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0092] Preferably, on the first side surface 100s1, the width in the X direction of the colored insulating layer 30 is greater than the width in the X direction of the protruding portion 101. Here, the width refers to the maximum width, specifically, the maximum value of the width in the second direction (X direction) in the first direction (Z direction). Specifically, as shown in Fig. 3, the width W1 in the X direction of the colored insulating layer 30 is greater than the sum of the width W2 in the X direction of the protruding portion 101 located on the reverse X direction side and the width W3 in the X direction of the protruding portion 101 located on the forward X direction side.

[0093] According to the above configuration, the colored insulating layer 30 can be made larger than the protruding portion 101 on the first side surface 100s1, which makes it easier to detect the inductor component 1 with a detection device and improves the mechanical strength of the inductor component 1. The second side surface 100s2, the third side surface 100s3 and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0094] (Manufacturing Method of Inductor Component 1) As shown in FIG. 5A, a mother substrate 200 made of photosensitive glass and including a first main surface 200a and a second main surface 200b is prepared. The first main surface 200a corresponds to the top surface 11t, and the second main surface 200b corresponds to the bottom surface 100b. For example, Foturan II can be used as the mother substrate 200. The mother substrate 200 generally contains an oxide of silicon, lithium, aluminum, cerium, or the like, making it compatible with high-precision photolithography.

[0095] The through conductor forming region 201 of the first main surface 201a is irradiated with ultraviolet light, and the mother substrate 200 is crystallized by a subsequent heat treatment (e.g., baking) to form a crystallized portion extending from the first main surface 200a to the second main surface 200b. The through conductor forming region 201 is a region in which a through conductor is formed, and is shown by hatching in FIG. 5A. Specifically, the mother substrate 200 is irradiated with ultraviolet light having a wavelength of about 310 nm. By the irradiation of the ultraviolet light, for example, metal ions such as cerium ions in the photosensitive glass are oxidized by light energy and emit electrons. Here, the processing depth finally obtained in the mother substrate 200 can be controlled by adjusting the irradiation amount of the ultraviolet light according to the thickness of the mother substrate 200.

[0096] As an exposure device used for the above-mentioned irradiation with ultraviolet light, a contact aligner or a stepper capable of obtaining ultraviolet light with a wavelength of about 310 nm can be used. Alternatively, a laser irradiation device including a femtosecond laser can be used as a light source. When a femtosecond laser is used, it is possible to emit electrons from the metal oxide only at the focused portion by concentrating the laser light inside the mother substrate 200. In other words, it is possible to expose only the inside of the mother substrate 200 without exposing the surface of the laser light irradiated portion.

[0097] As shown in FIG. 5B, in the through conductor formation region 201, the crystallized portion is removed by etching to form a first through hole 202 extending in the Z direction and penetrating the first main surface 200a and the second main surface 200b. For example, an aqueous hydrofluoric acid solution is used for the etching. The concentration of the aqueous hydrofluoric acid solution is preferably, for example, 5 to 10%. In the etching process, the entire mother substrate 200 is immersed in the aqueous hydrofluoric acid solution. As a result, only the crystalline phase in the substrate is etched, and the first through hole 202 is formed.

[0098] Then, a part of the cutting region 203 of the first main surface 201a is irradiated with ultraviolet light, and the mother substrate 200 is crystallized by a subsequent heat treatment (e.g., baking), to form a crystallized portion extending from the first main surface 200a to the second main surface 200b. Specifically, a region of the cutting region 203 excluding a region (a region dotted in FIG. 5B) in which a bridge portion described later is to be formed is irradiated with ultraviolet light, and then a heat treatment is performed to crystallize the portion irradiated with ultraviolet light. The cutting region 203 is a region in which a second through hole and a bridge portion described later are to be formed, and is indicated by oblique hatching in FIG. 5B. The cutting region 203 coincides with a cut line when the mother substrate 200 is divided into individual pieces.

[0099] As shown in FIG. 5C and FIG. 5D, in the cutting region 203, the crystallized portion is removed by etching to form a second through hole 204 penetrating the first main surface 200a and the second main surface 200b of the mother substrate 200, and a bridge portion 206 extending from the first main surface 200a to the second main surface 200b is formed in a region other than the region where the second through hole 204 is provided. That is, the bridge portion 206 is a remaining portion of the glass present in the cutting region 203 after etching. The second through hole 204 corresponds to an example of a "through hole" described in the claims. The bridge portion 206 is a portion that connects the individual inductor components to be manufactured, and is cut when dividing into individual inductor components to become a protruding portion of the inductor component. FIG. 5D is a cross-sectional view taken along the line AA in FIG. 5C. The portion of the mother substrate 200 other than the bridge portion 206 corresponds to the main body portion 100 in FIG. 2.

[0100] Alternatively, the through conductor formation region 201 and a part of the cutting region 203 may be crystallized at the same time, and the crystallized portion may be etched at the same time. This allows the first through hole 202 and the second through hole 204 to be formed at the same time.

[0101] As shown in FIG. 5E, the through conductors 13 and 14 are formed to penetrate the first main surface 200a and the second main surface 200b of the mother substrate 200. Specifically, the first through conductor 13 and the second through conductor 14 are formed in the first through hole 202 by, for example, a semi-additive method. At this time, a protective film 205 is formed on the first main surface 200a of the mother substrate 200 so as to cover the second through hole 204 so as to prevent plating from adhering to the inside of the second through hole 204. In FIG. 5E, the protective film 205 is indicated by a two-dot chain line. The through conductors 13 and 14 may be formed from a single seed layer, or may be formed in separate steps.

[0102] 5F, the colored insulating layer 30 is embedded in the second through hole 204 and brought into contact with the bridge portion 206 (not shown). Specifically, the colored insulating layer 30 is formed in the second through hole 204 by, for example, spin coating. Note that the colored insulating layer 30 may be provided on the first main surface 200a while being provided in the second through hole 204, and then the colored insulating layer 30 on the first main surface 200a may be removed by polishing or the like.

[0103] 5G, a top conductor 11t electrically connected to the through conductors 13, 14 is formed on the first main surface 200a, and a bottom conductor 11b electrically connected to the through conductors 13, 14 is formed on the second main surface 200b. The top conductor 11t and the bottom conductor 11b are formed, for example, by a semi-additive method, similar to the through conductors 13, 14.

[0104] 5H, a first protective layer 15 is formed above the first main surface 200a so as to cover the top conductor 11t, and a second protective layer 16 is formed above the second main surface 200b so as to cover the bottom conductor 11b. Specifically, the first protective layer 15 and the second protective layer 16 are formed by laminating a resin film or by applying a paste-like resin and thermally curing it.

[0105] 5I, a via hole is formed in the second protective layer 16, a first via conductor 121v is formed in the via hole, and a first terminal electrode 121 connected to the first via conductor 121v is formed above the second protective layer 16. The first via conductor 121v and the first terminal electrode 121 may be formed simultaneously or separately. The first via conductor 121v and the first terminal electrode 121 are formed, for example, by a semi-additive method.

[0106] As shown in Fig. 5J, colored insulating layer 30 and bridge portion 206 (not shown) are cut along cutting region 203, and as shown in Fig. 5K, mother substrate 200 is divided to obtain a plurality of inductor components 1 shown in Fig. 1. Specifically, dicing blade 300 is moved along cutting region 203 while moving from first protective layer 15 toward second protective layer 16. Note that cutting may be performed with a laser instead of dicing blade 300.

[0107] The method for manufacturing the inductor component 1 described above includes the steps of preparing a motherboard 200 made of photosensitive glass and including a first main surface 200a and a second main surface 200b, a step of irradiating a part of the cut region 203 of the first main surface 200a with ultraviolet light and then crystallizing the part of the cut region 203 by a heat treatment; a step of forming a second through hole 204 and a bridge portion 206 by removing a part of the crystallized cutting region 203 by etching to form a second through hole 204 penetrating the first main surface 200a and the second main surface 200b of the mother substrate 200, and a bridge portion 206 extending from the first main surface 200a to the second main surface 200b of the mother substrate 200 in a region of the cutting region 203 other than the region where the second through hole 204 is provided; forming through conductors 13 and 14 penetrating the first main surface 200a and the second main surface 200b of the mother substrate 200; a step of embedding a colored insulating layer 30 in the second through hole 204 and bringing the colored insulating layer 30 into contact with the bridge portion 206; a step of cutting the colored insulating layer 30 and the bridge portion 206 along the cutting region 203 to divide the mother substrate 200 into a plurality of inductor components 1; Equipped with.

[0108] According to the above manufacturing method, since the bridge portion 206 is in contact with the colored insulating layer 30, the bridge portion 206 is fixed to the colored insulating layer 30, which reduces the possibility of the bridge portion 206 cracking or chipping when the colored insulating layer 30 and the bridge portion 206 are cut. As a result, the possibility of the protruding portion 101 of the inductor component 1 cracking or chipping can be reduced.

[0109] In addition, since the colored insulating layer 30 is provided in the state of the mother substrate 200, this can be achieved easily and at a lower cost than when the colored insulating layer 30 is applied to each of the individual components after dividing the mother substrate 200. In contrast, when the colored insulating layer 30 is applied to each of the divided individual components, the labor and cost of the work increases.

[0110] Preferably, the method for producing inductor component 1 further includes, before the step of dividing mother substrate 200 to obtain the plurality of inductor components 1, forming a top conductor 11t electrically connected to the through conductors 13 and 14 above the first main surface 200a; forming a first protective layer 15 above the first principal surface 200a so as to cover the top surface conductor 11t; Equipped with.

[0111] According to the above-mentioned preferable manufacturing method, the first protective layer 15 covers the top conductor 11t, and therefore the top conductor 11t can be protected. Also, the first protective layer 15 covers the top surface 100t of the main body 100, and therefore the main body 100 can be protected. Similarly, the method may further include a step of forming the bottom conductor 11b and the second protective layer 16 above the second main surface 200b of the mother substrate 200.

[0112] <Second embodiment> FIG. 6 is a side view of an inductor component as an electronic component according to a second embodiment, viewed from a first side surface. FIG. 7 is a bottom view of a coil of the inductor component, viewed from a bottom surface. FIG. 6 corresponds to FIG. 3, and FIG. 7 corresponds to FIG. 4B. Note that in FIG. 6, for convenience, the positions where the colored insulating layers are present are hatched. The second embodiment differs from the first embodiment in the position of the protruding portion. This different configuration will be described below. The other configurations are the same as those of the first embodiment, and description thereof will be omitted.

[0113] As shown in Figures 6 and 7, the main body 100 includes a second side 100s2 that connects the bottom surface 100b and the top surface 100t and is circumferentially adjacent to the first side 100s1 when viewed from a direction perpendicular to the bottom surface 100b (Z direction), and a first corner C1 between the first side 100s1 and the second side 100s2.

[0114] Similarly, the main body 100 includes a third side surface 100s3 that connects the bottom surface 100b and the top surface 100t and is adjacent to the second side surface 100s2 in the circumferential direction when viewed from a direction perpendicular to the bottom surface 100b, and a second corner portion C2 between the second side surface 100s2 and the third side surface 100s3. The main body 100 also includes a fourth side surface 100s4 that connects the bottom surface 100b and the top surface 100t and is adjacent to the third side surface 100s3 in the circumferential direction when viewed from a direction perpendicular to the bottom surface 100b, and a third corner portion C3 between the third side surface 100s3 and the fourth side surface 100s4. The main body 100 also includes a fourth corner portion C4 between the fourth side surface 100s4 and the first side surface 100s1. In this embodiment, each of the first to fourth corner portions C1 to C4 is a ridge line.

[0115] The colored insulating layer 30 is provided continuously on the first side surface 100s1, the first corner C1, and the second side surface 100s2. Similarly, the colored insulating layer 30 is provided continuously on the second side surface 100s2, the second corner C2, and the third side surface 100s3. The colored insulating layer 30 is also provided continuously on the third side surface 100s3, the third corner C3, and the fourth side surface 100s4. The colored insulating layer 30 is also provided continuously on the fourth side surface 100s4, the fourth corner C4, and the first side surface 100s1.

[0116] As shown in FIG. 6, on the first side surface 100s1, the protruding portion 101 located on the reverse X-direction side is adjacent in the X-direction to the colored insulating layer 30 provided at the fourth corner C4. The protruding portion 101 located on the forward X-direction side is adjacent in the X-direction to the colored insulating layer 30 provided at the first corner C1. The colored insulating layer 30 is also provided between the protruding portion 101 located on the reverse X-direction side and the protruding portion 101 located on the forward X-direction side. In short, on the first side surface 100s1, the colored insulating layer 30 and the protruding portion 101 are arranged in the X-direction in the following order: colored insulating layer 30, protruding portion 101, colored insulating layer 30, protruding portion 101, and colored insulating layer 30. The same is true for the second to fourth side surfaces 100s2 to 100s4.

[0117] According to the above configuration, the colored insulating layer 30 is provided continuously on the first side surface 100s1, the first corner portion C1, and the second side surface 100s2, so that cracks and chips can be suppressed at the first corner portion C1 where cracks and chips are likely to occur. Note that the second corner portion C2, the third corner portion C3, and the fourth corner portion C4 have the same effect as that of the first corner portion C1.

[0118] 6, the second penetrating conductor 14 preferably includes two second penetrating conductors 14aj adjacent in the X direction when viewed from a direction perpendicular to the first side surface 100s1 (Y direction). The protruding portion 101 overlaps one of the two adjacent second penetrating conductors 14aj, and the colored insulating layer 30 overlaps a region between the two adjacent second penetrating conductors 14aj.

[0119] According to the above configuration, the colored insulating layer 30 having a relatively low dielectric constant is provided in the region of the first side surface 100s1 in the vicinity between the two adjacent second penetrating conductors 14aj, so that the possibility of stray capacitance occurring in the vicinity of the two adjacent second penetrating conductors 14aj can be reduced. When the glass substrate 10 is, for example, the above-mentioned Foturan II, the dielectric constant of the glass substrate 10 is about 6.4. On the other hand, when the material of the colored insulating layer 30 is, for example, epoxy, the dielectric constant of the colored insulating layer 30 is about 3.0 to 5.0.

[0120] A method for manufacturing the inductor component 1A will now be described.

[0121] First, the mother substrate 200 is manufactured by the same manufacturing method as that shown in Fig. 5A and Fig. 5B in the first embodiment. After that, a part of the cutting region 203 of the mother substrate 200 is irradiated with ultraviolet light, and then heat-treated (e.g., baked) to crystallize it, and then etched to form at least second through holes 204 in the region R of the cutting region 203 that corresponds to the corner of the inductor component (electronic component) as shown in Fig. 8.

[0122] The region R corresponding to the corner of the inductor component is a region facing the corner of the main body of each component to be manufactured, a part of the first side surface of the main body that is continuous with the corner, and a part of the second side surface of the main body that is continuous with the corner, and is a region including the position of the corner of the component to be manufactured. Specifically, the region R corresponding to the corner of the inductor component is a region surrounded by the corner of the main body of each component to be manufactured, the side surface of the main body, and bridge portion 206. In FIG. 8, the region R corresponding to the corner of the inductor component is indicated by hatching.

[0123] In a later process, a colored insulating layer is embedded in second through holes 204 located in regions R corresponding to the corners of the inductor component, so that a colored insulating layer can be provided continuously on the corners of the main body of the manufactured component, a portion of the first side surface of the main body that is continuous with the corners, and a portion of the second side surface of the main body that is continuous with the corners. Then, inductor component 1A is manufactured using the same manufacturing method as shown in Figures 5E to 5K.

[0124] <Third embodiment> Fig. 9 is a bottom view of a coil of an inductor component as an electronic component according to a third embodiment, viewed from the bottom side. Fig. 9 corresponds to Fig. 7. The third embodiment differs from the second embodiment in the shape of the corners of the main body. This difference in configuration will be described below. The other configurations are the same as those of the second embodiment, and description thereof will be omitted.

[0125] 9, each of the first to fourth corners C1 to C4 has a curved surface. In this embodiment, the curved surface is a convex curved surface that convexly faces the outside of the main body 100. This configuration can further prevent cracks and chips from occurring at the first to fourth corners C1 to C4. Also, the volume of glass at the first to fourth corners C1 to C4 is smaller than when the first to fourth corners C1 to C4 are ridges, reducing the possibility of stray capacitance occurring at the first to fourth corners C1 to C4.

[0126] <Fourth embodiment> Fig. 10 is a side view of an inductor component as an electronic component according to a fourth embodiment, viewed from the first side surface. Fig. 10 corresponds to Fig. 6. In Fig. 10, for the sake of convenience, the positions where the colored insulating layers are present are hatched with diagonal lines, and the positions where the protrusions are present are hatched with dots. The fourth embodiment differs from the second embodiment in the configuration of the protrusions. This different configuration will be described below. The other configurations are the same as those of the second embodiment, and description thereof will be omitted.

[0127] As shown in FIG. 10, the protruding portion 101C is crystallized on the first side surface 100s1. The transparency of the crystallized protruding portion 101C is lower than that of the non-crystallized main body portion 100. With this configuration, the transparency of the protruding portion 101C as well as that of the colored insulating layer 30 is low, so that the inductor component 1C can be detected more easily. Furthermore, the mechanical strength of crystallized glass is higher than that of non-crystallized glass. Therefore, the mechanical strength of the inductor component 1C against external forces can be improved compared to a case where the protruding portion is not crystallized. The protruding portions may also be crystallized on the second to fourth side surfaces 100s2 to 100s4. This provides the same effect as that of the first side surface 100s1.

[0128] A method for manufacturing the inductor component 1C will now be described.

[0129] First, the inductor component 1C is manufactured by the same manufacturing method as that shown in Figures 5A and 5B of the first embodiment and Figure 8 of the second embodiment. Then, as shown in Figure 11, the bridge portion is irradiated with ultraviolet light, and then heat-treated (e.g., baked) to form a crystallized bridge portion 206C. Then, the inductor component 1C is manufactured by the same manufacturing method as that shown in Figures 5E to 5K. When the mother substrate 200 is divided, the crystallized bridge portion 206C is cut to form the protruding portion 101C of the inductor component 1C.

[0130] The above-described method for manufacturing inductor component 1C further includes, after the step of forming second through-hole 204 and the bridge portion, a step of irradiating the bridge portion with ultraviolet light and then subjecting it to a heat treatment to crystallize the bridge portion.

[0131] According to the above manufacturing method, the bridge portion is crystallized and mother substrate 200 is divided by cutting the bridge portion, so that after division, crystallized protrusion 101C can be provided on the side surface of inductor component 1. Furthermore, because the bridge portion is crystallized, cracking and chipping of the bridge portion can be suppressed when mother substrate 200 is divided.

[0132] <Fifth embodiment> Fig. 12 is a side view of an inductor component as an electronic component according to a fifth embodiment, viewed from the first side surface. Fig. 12 corresponds to Fig. 3. For convenience, Fig. 12 shows hatching at positions where colored insulating layers are present. The fourth embodiment differs from the first embodiment in the sizes of the first protective layer and the second protective layer. This difference in configuration will be described below. The other configurations are the same as those of the second embodiment, and description thereof will be omitted.

[0133] 12, the first protective layer 15D is provided inside the outer periphery of the top surface 100t of the main body 100 as viewed in the Z direction. That is, the size of the first protective layer 15D in the XY plane is smaller than the size of the first protective layer 15 in the XY plane of the inductor component 1 of the first embodiment. Similarly, the second protective layer 16D is provided inside the outer periphery of the bottom surface 100b of the main body 100 as viewed in the Z direction. That is, the size of the second protective layer 16D in the XY plane is smaller than the size of the second protective layer 16 in the XY plane of the inductor component 1 of the first embodiment.

[0134] According to the above configuration, in manufacturing the inductor component 1D, when the colored insulating layer 30 and the bridge portion are cut along the cutting region 203 as shown in FIG. 5J, the first protective layer 15D and the second protective layer 16D are provided inside the outer periphery of the top surface 100t and the outer periphery of the bottom surface 100b of the main body portion 100 as viewed from the Z direction, so that the dicing blade 300 does not contact the first protective layer 15D and the second protective layer 16D. Therefore, the first protective layer 15D and the second protective layer 16D can be prevented from peeling off from the glass substrate 10 (mother substrate 200) during cutting by the dicing blade 300. Note that, one of the first protective layer 15 and the second protective layer 16 may be provided inside the outer periphery of the top surface 100t or the outer periphery of the bottom surface 100b of the main body portion 100 as viewed from the Z direction.

[0135] A method for manufacturing the inductor component 1D will now be described.

[0136] First, the inductor component 1D is manufactured using the same manufacturing method as that shown in Fig. 5A to Fig. 5G of the first embodiment. Then, as shown in Fig. 13, a first protective layer 15 and a second protective layer 16 are formed on the inner side of the side surface of the main body of each component. Then, the inductor component 1D is manufactured using the same manufacturing method as that shown in Fig. 5I to Fig. 5K.

[0137] In the above-described manufacturing method for the inductor component 1D, in the process of forming the first protective layer 15 and the second protective layer 16, the first protective layer 15 and the second protective layer 16 are formed so as not to overlap the cutting area 203 when viewed from a direction perpendicular to the first main surface 200a of the mother substrate 200 (Z direction).

[0138] According to the above manufacturing method, when the mother substrate 200 is divided by, for example, dicing, it is possible to prevent a dicing blade from coming into contact with the first protective layer 15 and the second protective layer 16. As a result, it is possible to prevent the first protective layer 15 and the second protective layer 16 from peeling off the mother substrate 200.

[0139] Sixth Embodiment In the sixth embodiment, the electronic component according to the present invention will be described by taking a capacitor component as an example. Fig. 14 is a cross-sectional view of the capacitor component. Fig. 15 is a side view of the capacitor component as viewed from a first side surface. The capacitor component 2 is, for example, a surface mount type capacitor component used in a high frequency signal transmission circuit.

[0140] 14 and 15, the capacitor component 2 includes a glass substrate 10, a first plate electrode 21 and a second plate electrode 22 provided on the glass substrate 10, a first protective layer 15 provided on the glass substrate 10 and covering the first plate electrode 21 and the second plate electrode 22, a colored insulating layer 30 provided on the side surface of the glass substrate 10, and a first terminal electrode 221 and a second terminal electrode 222 provided on the glass substrate 10. The first plate electrode 21 and the second plate electrode 22 correspond to an example of an "external conductor" recited in the claims.

[0141] The material of the glass substrate 10 is the same as that of the glass substrate 10 in the first embodiment. That is, the glass substrate 10 has a main body 100 and a protruding portion 101. The material of the first protective layer 15 is the same as that of the first protective layer 15 in the first embodiment. The material of the colored insulating layer 30 is the same as that of the colored insulating layer 30 in the first embodiment. The material of the first flat plate electrode 21 and the second flat plate electrode 22 is the same as that of the top surface conductor 11t and the bottom surface conductor 11b in the first embodiment. The material of the first terminal electrode 221 and the second terminal electrode 222 is the same as that of the first terminal electrode 121 and the second terminal electrode 122 in the first embodiment.

[0142] The first plate electrode 21 and the second plate electrode 22 are provided on the top surface 100t of the glass substrate 10. The first plate electrode 21 is in contact with the top surface 100t of the glass substrate 10, and the second plate electrode 22 is located above the first plate electrode 21. A dielectric film 25 is provided between the first plate electrode 21 and the second plate electrode 22. The first plate electrode 21, the second plate electrode 22, and the dielectric film 25 constitute a capacitor element.

[0143] The first terminal electrode 221 and the second terminal electrode 222 are in contact with the bottom surface 100b of the glass substrate 10. The first terminal electrode 221 and the second terminal electrode 222 are spaced apart from each other.

[0144] The capacitor component 2 further has a first through conductor 23 and a second through conductor 24 that penetrate the glass substrate 10. The first through conductor 23 is connected between the first terminal electrode 221 and the first plate electrode 21. The second through conductor 24 is connected between the second terminal electrode 222 and the second plate electrode 22.

[0145] As in the first embodiment, the protruding portion 101 and the colored insulating layer 30 are provided on each of the first side surface 100s1 to the fourth side surface 100s4 of the main body portion 100. Note that the protruding portion 101 and the colored insulating layer 30 may each be provided on at least one of the first side surface 100s1 to the fourth side surface 100s4.

[0146] According to the above configuration, the colored insulating layer 30 is provided on the first side surface 100s1 of the main body portion 100. Therefore, when detecting the capacitor component 2 from the first side surface 100s1 of the main body portion 100 using a detection device such as a laser sensor or a camera, the colored insulating layer 30, which has low transparency, can be easily recognized, and the capacitor component 2 can be easily detected.

[0147] Furthermore, since the colored insulating layer 30 extends along the Z direction when viewed from a direction perpendicular to the first side surface 100s1, when the detection device is scanned in the Z direction to detect the capacitor component 2, the colored insulating layer 30 can be easily recognized, and the capacitor component 2 can be easily detected.

[0148] Furthermore, since the colored insulating layer 30 is provided on the first side surface 100s1 of the main body portion 100, the exposed area of ​​the main body portion 100 can be reduced, and the mechanical strength of the capacitor component 2 against external forces can be improved.

[0149] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as the first side surface 100s1. It is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above configuration.

[0150] The present disclosure is not limited to the above-described embodiments, and design changes are possible without departing from the scope of the present disclosure. For example, the features of the first to sixth embodiments may be combined in various ways. In the first to fifth embodiments, an inductor component is used as the electronic component, and in the sixth embodiment, a capacitor component is used as the electronic component. However, other electronic components such as resistor components may be used, or a composite component that combines these components may be used.

[0151] In the first to fifth embodiments, the main body has outer conductors (bottom conductor and top conductor) on the top and bottom, respectively, and protective layers (first protective layer and second protective layer) on the top and bottom so as to cover the outer conductors, but the main body may have outer conductors on at least one of the top and bottom, respectively, and a protective layer on at least one of the top and bottom so as to cover the outer conductors. Alternatively, the top and bottom may not have protective layers.

[0152] The present disclosure includes the following aspects. <1> a glass substrate having a main body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protrusion provided on the first side surface of the main body; a colored insulating layer provided at least on the first side surface of the main body; a through conductor provided in the main body and passing through the top surface and the bottom surface; Equipped with The protrusion extends along a first direction perpendicular to the top surface when viewed from a direction perpendicular to the first side surface, An electronic component, wherein at least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side and is positioned adjacent to the protrusion in a second direction perpendicular to the first direction. <2> In the first side surface, the colored insulating layer is provided in the entire area where the protrusion does not exist. <1> 2. An electronic component as described in claim 1. <3> The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The colored insulating layer is provided continuously on the first side surface, the corner portion, and the second side surface. <1> or <2> 2. An electronic component as described in claim 1. <4> The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The corner portion has a curved surface. <1> from <3> 13. An electronic component according to any one of the preceding claims. <5> an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; Equipped with <1> from <4> 13. An electronic component according to any one of the preceding claims. <6> The colored insulating layer is provided at least in the center of the first side surface. <1> from <5> 13. An electronic component according to any one of the preceding claims. <7> the glass substrate has two of the protruding portions aligned in the second direction on the first side surface, and at least a portion of the colored insulating layer is disposed between the two protruding portions and adjacent to each of the two protruding portions in the second direction; <1> from <6> 13. An electronic component according to any one of the preceding claims. <8> On the first side surface, the width of the colored insulating layer in the second direction is greater than the width of the protruding portion in the second direction. <1> from <7> 13. An electronic component according to any one of the preceding claims. <9> When viewed from a direction perpendicular to the first side surface, the through conductor includes two through conductors adjacent to each other in the second direction, the protruding portion overlaps one of the two adjacent through conductors, and the colored insulating layer overlaps a region between the two adjacent through conductors. <1> from <8> 13. An electronic component according to any one of the preceding claims. <10> The protrusion is crystallized. <1> from <9> 13. An electronic component according to any one of the preceding claims. <11> providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; irradiating a portion of the cut region of the first main surface with ultraviolet light and then crystallizing the portion of the cut region by heat treatment; a step of forming a through hole and a bridge portion by removing a part of the crystallized cutting region by etching to form a through hole penetrating the first main surface and the second main surface of the mother substrate, and a bridge portion extending from the first main surface to the second main surface of the mother substrate in a region of the cutting region other than the region where the through hole is provided; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the through hole and bringing the colored insulating layer into contact with the bridge portion; cutting the colored insulating layer and the bridge portion along the cutting region to divide the motherboard into a plurality of electronic components; A method for manufacturing an electronic component comprising the steps of: <12> In the step of forming the through hole and the bridge portion, the through hole is formed in at least a region of the cutting region corresponding to a corner of the electronic component. <11> A method for manufacturing an electronic component according to claim 1. <13> Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; Equipped with <11> or <12> A method for manufacturing an electronic component according to claim 1. <14> In the step of forming the protective layer, the protective layer is formed so as not to overlap the cutting region when viewed from a direction perpendicular to the first main surface of the mother substrate. <13> A method for manufacturing an electronic component according to claim 1. <15> After the step of forming the through hole and the bridge portion, The method further includes a step of irradiating the bridge portion with ultraviolet light and then performing a heat treatment to crystallize the bridge portion. <11> from <14> 13. A method for manufacturing an electronic component according to any one of the above. [Explanation of symbols]

[0153] 1,1A,1B,1C,1D Inductor components (electronic components) 2. Capacitor parts (electronic parts) 10 Glass substrate 11b Bottom conductor (outer conductor) 11t Top conductor (outer conductor) 13,23 First through conductor 14,24 Second through conductor 14aj Two adjacent through conductors 15,15D 1st protective layer 16,16D 2nd protective layer 21 First plate electrode (outer conductor) 22 Second plate electrode (outer conductor) 25 Dielectric Film 30 Colored Insulation Layer 100 Main body 100b bottom 100t Top 100s1~100s4 1st to 4th sides 101, 101C protrusion 110 Coil 121,221 1st terminal electrode 122,222 2nd terminal electrode 200 Motherboard 200a First main surface 200b 2nd principal surface 201 Through conductor forming area 202 First through hole 203 Cutting area 204 Second through hole 205 Protective film 206, 206C Bridge section 300 Dicing Blade AX axis C1~C4 Corners of the main body R Area corresponding to the corner of the inductor component W1 Width of colored insulation layer W2,W2 Width of protrusion

Claims

1. a glass substrate having a main body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protrusion provided on the first side surface of the main body; a colored insulating layer provided at least on the first side surface of the main body; a through conductor provided in the main body and passing through the top surface and the bottom surface; Equipped with The protrusion extends along a first direction perpendicular to the top surface when viewed from a direction perpendicular to the first side surface, At least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the protruding portion in a second direction perpendicular to the first direction, The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The corner portion has a convex curved surface that is convex toward an outside of the main body portion.

2. The electronic component according to claim 1 , wherein the colored insulating layer is provided in the entire area of ​​the first side surface where no protruding portion is present.

3. The main body further includes a second side surface that connects the bottom surface and the top surface and is adjacent to the first side surface in a circumferential direction when viewed from a direction perpendicular to the bottom surface, and a corner portion between the first side surface and the second side surface, The electronic component according to claim 1 , wherein the colored insulating layer is provided continuously on the first side surface, the corner portion, and the second side surface.

4. an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; The electronic component according to claim 1 or 2, comprising:

5. The electronic component according to claim 1 , wherein the colored insulating layer is provided at least in a center of the first side surface.

6. 3. The electronic component according to claim 1, wherein the glass substrate has two protrusions aligned in the second direction on the first side, and at least a portion of the colored insulating layer is disposed between the two protrusions and adjacent to each of the two protrusions in the second direction.

7. On the first side surface, the width of the colored insulating layer in the second direction is greater than the width of the protruding portion in the second direction. The electronic component according to claim 1 or 2.

8. When viewed from a direction perpendicular to the first side surface, the through conductor includes two through conductors adjacent to each other in the second direction, the protruding portion overlaps one of the two adjacent through conductors, and the colored insulating layer overlaps a region between the two adjacent through conductors. The electronic component according to claim 1 or 2.

9. A glass substrate having a main body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protrusion provided on the first side surface of the main body portion; a colored insulating layer provided at least on the first side surface of the main body; a through conductor provided in the main body and passing through the top surface and the bottom surface; Equipped with The protrusion extends along a first direction perpendicular to the top surface when viewed from a direction perpendicular to the first side surface, At least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the protruding portion in a second direction perpendicular to the first direction, The protrusion is crystallized.

10. providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; irradiating a portion of the cut region of the first main surface with ultraviolet light and then crystallizing the portion of the cut region by heat treatment; a step of forming a through hole and a bridge portion by removing a part of the crystallized cutting region by etching to form a through hole penetrating the first main surface and the second main surface of the mother substrate, and a bridge portion extending from the first main surface to the second main surface of the mother substrate in a region of the cutting region other than the region where the through hole is provided; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the through hole and bringing the colored insulating layer into contact with the bridge portion; cutting the colored insulating layer and the bridge portion along the cutting region to divide the motherboard into a plurality of electronic components; A method for manufacturing an electronic component comprising the steps of:

11. The method for manufacturing an electronic component according to claim 10 , wherein in the step of forming the through holes and the bridge portions, the through holes are formed in the cutting regions at least in regions corresponding to corners of the electronic component.

12. Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; The method for manufacturing an electronic component according to claim 10 or 11, comprising:

13. The method for manufacturing an electronic component according to claim 12 , wherein in the step of forming the protective layer, the protective layer is formed so as not to overlap the cutting region when viewed from a direction perpendicular to the first main surface of the mother substrate.

14. After the step of forming the through hole and the bridge portion, The method for manufacturing an electronic component according to claim 10 or 11, further comprising the step of irradiating the bridge portion with ultraviolet light and then subjecting the bridge portion to a heat treatment to crystallize the bridge portion.

Images