Coolant system, machining system, foreign matter removal method, and program

Abstract

A coolant system, a machining system, a foreign matter removal method, and a program are provided that can more effectively remove foreign matter by reducing stagnation of the coolant flow in a tank. [Solution] The coolant system includes a first tank for storing coolant, an adjusting device for adjusting the liquid level of the coolant in the first tank, an agitating device for agitating the coolant in the first tank, a foreign matter removing device for removing foreign matter from the coolant, and a control device for controlling the adjusting device to execute a first control mode. The first control mode includes using the adjusting device to lower the liquid level in the first tank, and agitating the coolant in the first tank with the agitating device while the liquid level in the first tank is lowered.

Description

[Technical Field]

[0001] The present invention relates to a coolant system, a machining system, a foreign matter removal method, and a program. [Background technology]

[0002] Foreign matter removal devices that remove foreign matter from liquids are known.

[0003] As a related technique, a coolant treatment device is disclosed in Patent Document 1. The coolant treatment device described in Patent Document 1 includes an inlet for allowing coolant to flow into a tank, a pump for sucking out the coolant in the tank, a flow rectifying member for rectifying the flow of the coolant, and a filter for separating impurities from the coolant. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6133528 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a coolant system, a processing system, a foreign matter removal method, and a program that can more effectively remove foreign matter by reducing stagnation of the coolant flow in a tank. [Means for solving the problem]

[0006] Embodiments of the present invention relate to a coolant system, a machining system, a foreign matter removal method, and a program, which are described below.

[0007] (1) a first tank for storing coolant; an adjusting device for adjusting the liquid level of the coolant in the first tank; an agitator that agitates the coolant in the first tank; a foreign matter removal device for removing foreign matter from the coolant; a control device that controls the adjustment device to execute a first control mode; Equipped with The first control mode is lowering the liquid level in the first tank using the regulator; agitating the coolant in the first tank by the agitator while the liquid level in the first tank is lowered; Contains Coolant system. (2) The first control mode includes collecting the foreign matter using the foreign matter removal device while stirring the coolant in the first tank with the stirring device. The coolant system according to (1) above. (3) Further comprising a second tank for storing the coolant; the regulating device includes a first pump that supplies the coolant from the first tank to the second tank; The first control mode includes lowering the liquid level by moving the coolant from the first tank to the second tank using the first pump. The coolant system according to (1) or (2) above. (4) The adjusting device includes a second pump that supplies the coolant from the second tank to the first tank, The second pump is capable of supplying the coolant from the second tank to a stirring nozzle disposed in the first tank. The coolant system according to (3) above. (5) the second tank has a buffer space for receiving the coolant when the first control mode is executed, The control device inhibits a second liquid level in the second tank from reaching the buffer space before the first control mode is executed. The coolant system according to (3) or (4) above. (6) The adjusting device includes a second pump that supplies the coolant from the second tank to the first tank, The second tank is a first reservoir chamber into which the coolant supplied by the first pump flows; a second reservoir chamber in which a coolant suction port of the second pump is disposed; Equipped with a first bottom of the first storage chamber and a second bottom of the second storage chamber are fluidly connected; The bottom surface of the second storage chamber is an inclined surface whose height decreases toward the bottom surface of the first storage chamber. The coolant system according to (3) above. (7) A discharge port for discharging the coolant is provided at the bottom of the second tank. A coolant system according to any one of (3) to (6) above. (8) The first control mode includes circulating the coolant between the first tank and the second tank while the liquid level is lowered. A coolant system according to any one of (3) to (7) above. (9) A memory is provided to store a target value of the liquid level of the first tank in the first control mode, The first control mode includes controlling the adjusting device so that the liquid level in the first tank is forcibly lowered to the target value. A coolant system according to any one of (1) to (8) above. (10) The control device the first control mode; a second control mode in which the liquid level in the first tank is increased; Normal driving mode is executable, The normal operation mode is maintaining the liquid level in the first tank at or above a first lower threshold and below a first upper threshold using the adjusting device; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through at least one circulation flow path; is a mode including The control device sequentially executes the normal operation mode, the first control mode, the second control mode, and the normal operation mode in this order. A coolant system according to any one of (1) to (9) above. (11) The control device starts the execution of the first control mode based on at least one of a request from a user, a pre-specified timing, and a usage amount of the processing machine. The coolant system according to (10) above. (12) The control device the first control mode; Normal driving mode is executable, The normal operation mode is maintaining the liquid level in the first tank at or above a first lower threshold and below a first upper threshold using the adjusting device; maintaining a second liquid level in the second tank at or above a second lower threshold and below a second upper threshold using the adjusting device; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through at least one circulation flow path; is a mode including The first control mode includes controlling the regulator so that the second liquid level in the second tank rises above the second upper threshold. The coolant system according to (3) or (4) above. (13) a processing machine; a coolant system for supplying coolant to the processing machine; Equipped with The processing machine is a workpiece support device that supports the workpiece; a machining head for holding a tool; a moving device that moves the machining head relative to the workpiece supporting device; a discharge device that discharges the coolant; Equipped with The coolant system comprises: a first tank for storing the coolant; an adjusting device for adjusting the liquid level of the coolant in the first tank; an agitator that agitates the coolant in the first tank; a foreign matter removal device for removing foreign matter from the coolant; a supply device for supplying the coolant to the processing machine; Control device and Equipped with the control device is capable of executing a first control mode by controlling the adjustment device; the control device is capable of executing a supply mode in which the coolant is supplied to the processing machine by controlling the supply device; The first control mode is lowering the liquid level in the first tank using the regulator; agitating the coolant in the first tank by the agitator while the liquid level in the first tank is lowered; Contains Processing system. (14) removing foreign matter from the coolant using a foreign matter remover while circulating the coolant through at least one circulation flow path exiting the first tank and returning to the first tank; lowering the liquid level of the coolant in the first tank; agitating the coolant in the first tank by an agitator while the liquid level of the coolant in the first tank is lowered; raising the liquid level of the coolant in the first tank; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through the at least one circulation flow path in a state where the liquid level of the coolant in the first tank is raised; Equipped with Foreign body removal method. (15) A program for causing a control device to execute the foreign matter removal method described in (14) above. [Effects of the Invention]

[0008] The present invention provides a coolant system, a processing system, a foreign matter removal method, and a program that can more effectively remove foreign matter by reducing stagnation of the coolant flow in the tank. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically illustrating a coolant system according to the first embodiment. [Figure 2] FIG. 2 is a diagram schematically illustrating a coolant system according to the first embodiment. [Figure 3] FIG. 3 is a diagram schematically illustrating a coolant system according to a first modified example of the first embodiment. [Figure 4] FIG. 4 is a diagram schematically illustrating a coolant system according to a first modified example of the first embodiment. [Figure 5] FIG. 5 is a diagram schematically illustrating a coolant system in a first modified example of the first embodiment. [Figure 6] FIG. 6 is a diagram schematically showing a coolant system in a second modified example of the first embodiment. [Figure 7] FIG. 7 is a diagram schematically illustrating a coolant system according to a second modified example of the first embodiment. [Figure 8] FIG. 8 is a diagram schematically illustrating a coolant system according to a second modified example of the first embodiment. [Figure 9]FIG. 9 is a diagram schematically illustrating a coolant system according to a second modified example of the first embodiment. [Figure 10] FIG. 10 is a diagram schematically illustrating a coolant system according to the second embodiment. [Figure 11] FIG. 11 is a diagram schematically illustrating a coolant system according to the second embodiment. [Figure 12] FIG. 12 is a diagram schematically illustrating a coolant system according to the second embodiment. [Figure 13] FIG. 13 is a diagram schematically illustrating a coolant system according to the second embodiment. [Figure 14] FIG. 14 is a diagram schematically illustrating a coolant system according to the second embodiment. [Figure 15] FIG. 15 is a diagram schematically illustrating a part of a coolant system according to the second embodiment. [Figure 16] FIG. 16 is a cross-sectional view taken along the line AA in FIG. [Figure 17] FIG. 17 is a diagram schematically illustrating a coolant system in a first modified example of the second embodiment. [Figure 18] FIG. 18 is a diagram schematically illustrating a coolant system according to a second modified example of the second embodiment. [Figure 19] FIG. 19 is a diagram schematically illustrating how the coolant system according to the second embodiment can supply coolant to a processing machine. [Figure 20] FIG. 20 is a diagram showing a schematic diagram of another coolant system capable of supplying coolant to a processing machine. [Figure 21] FIG. 21 is a schematic cross-sectional view for explaining an example of an agitation nozzle. [Figure 22] FIG. 22 is a diagram for explaining the first removal device. [Figure 23] FIG. 23 is a schematic perspective view showing an example of the arrangement of the first tank and the second tank. [Figure 24]FIG. 24 is a diagram showing a schematic diagram of a state in which a control device can control a plurality of control target devices. [Figure 25] FIG. 25 is a diagram schematically showing a state in which the normal operation mode is being executed. [Figure 26] FIG. 26 is a diagram schematically showing the state in which the normal operation mode is being executed. [Figure 27] FIG. 27 is a diagram schematically showing a state in which the first control mode is being executed. [Figure 28] FIG. 28 is a diagram schematically showing a state in which the first control mode is being executed. [Figure 29] FIG. 29 is a diagram schematically showing a state in which the second control mode is being executed. [Figure 30] FIG. 30 is a diagram schematically showing the state in which the normal operation mode is being executed. [Figure 31] FIG. 31 is a diagram schematically showing a state in which the first control mode is being executed. [Figure 32] FIG. 32 is a diagram schematically illustrating an example of an image displayed on a display. [Figure 33] FIG. 33 is a diagram schematically illustrating another example of an image displayed on the display. [Figure 34] FIG. 34 is a diagram schematically illustrating yet another example of an image displayed on the display. [Figure 35] FIG. 35 is a diagram schematically showing the backwash mode being executed. [Figure 36] FIG. 36 is a schematic perspective view showing a first example of the processing machine. [Figure 37] FIG. 37 is a schematic perspective view showing a second example of the processing machine. [Figure 38] FIG. 38 is a schematic perspective view showing a third example of the processing machine. [Figure 39] FIG. 39 is a diagram schematically illustrating an example in which a processing system includes a plurality of processing machines. [Figure 40] FIG. 40 is a flowchart showing an example of a foreign matter removal method according to an embodiment. [Figure 41] FIG. 41 is a flowchart showing an example of a foreign matter removal method according to an embodiment. [Figure 42] FIG. 42 is a diagram schematically illustrating an example of a nonvolatile storage medium on which a program is recorded. DETAILED DESCRIPTION OF THE INVENTION

[0010] The coolant system 1, machining system 100, foreign matter removal method, and program PM according to the embodiments will be described below with reference to the drawings. In the following description of the embodiments, parts and components having the same functions are denoted by the same reference numerals, and repeated description of parts and components denoted by the same reference numerals will be omitted.

[0011] (First embodiment) A coolant system 1A according to a first embodiment will be described with reference to Figures 1 to 9. Figures 1 and 2 are diagrams that schematically show the coolant system 1A according to the first embodiment. Figures 3 to 5 are diagrams that schematically show the coolant system 1A according to a first modified example of the first embodiment. Figures 6 to 9 are diagrams that schematically show the coolant system 1A according to a second modified example of the first embodiment.

[0012] As illustrated in FIG. 1, the coolant system 1A includes a first tank 2, an adjusting device 3, an agitating device 4, a foreign matter removing device 5, and a control device 9.

[0013] As illustrated in FIG. 1, the first tank 2 stores the coolant CL.

[0014] 1 and 2, the adjusting device 3 adjusts the liquid level LA of the coolant CL in the first tank 2. The adjusting device 3 may include a first pump 31 that extracts the coolant CL from the first tank 2. Alternatively, or additionally, as illustrated in FIG. 3, the adjusting device 3 may include a valve 32 provided on a discharge pipe 29 that discharges the coolant CL from the bottom of the first tank 2.

[0015] The agitator 4 agitates the coolant CL in the first tank 2. In the example shown in FIGS. 1 and 2, the agitator 4 includes an agitation nozzle 41 that discharges the coolant CL into the first tank 2. Alternatively, or additionally, as illustrated in FIG. 3, the agitator 4 may include a screw 43 that agitates the coolant CL in the first tank 2.

[0016] The foreign matter removal device 5 removes foreign matter from the coolant CL. The foreign matter removal device 5 includes, for example, a filter 5f. As illustrated in FIGS. 1 and 2, the foreign matter removal device 5 (more specifically, the filter 5f) may be disposed in a flow path F1 through which the coolant CL taken out from the first tank 2 flows. Alternatively, or additionally, the foreign matter removal device 5 (more specifically, the filter 5f) may be disposed in a flow path F2 that supplies the coolant CL to the first tank 2. Alternatively, or additionally, the foreign matter removal device 5 may be disposed within the first tank 2.

[0017] The control device 9 controls the adjustment device 3 (e.g., the first pump 31 and / or the valve 32). The control device 9 executes the first control mode M1 by controlling the adjustment device 3 (e.g., the first pump 31 and / or the valve 32).

[0018] As illustrated in Figures 1 and 2 (or as illustrated in Figures 3 and 4), the first control mode M1 includes lowering the liquid level LA of the coolant CL in the first tank 2 using an adjusting device 3 (e.g., a first pump 31 and / or a valve 32).

[0019] As illustrated in FIG. 2 or FIG. 4, the first control mode M1 includes stirring the coolant CL in the first tank 2 by the stirring device 4 (e.g., the stirring nozzle 41 and / or the screw 43) while the liquid level LA of the coolant CL in the first tank 2 is lowered.

[0020] The first control mode M1 may include the control device 9 controlling the adjusting device 3 (e.g., the first pump 31 and / or the valve 32) and the agitating device 4 (e.g., the agitating nozzle 41 and / or the screw 43) so that the coolant CL in the first tank 2 is agitated by the agitating device 4 (e.g., the agitating nozzle 41 and / or the screw 43) while the liquid level LA of the coolant CL in the first tank 2 is lowered. The control of the agitating device 4 by the control device 9 may be performed by the control device 9 controlling the operation of at least one pump (e.g., the first pump 31 in FIG. 2) that supplies the coolant CL to the agitating nozzle 41. Alternatively, or additionally, the control of the agitating device 4 by the control device 9 may be performed by the control device 9 controlling a motor 44 (see FIG. 4) that rotates the screw 43.

[0021] Alternatively, the agitator 4 (e.g., the agitator nozzle 41 and / or the screw 43) may not be under the control of the controller 9. For example, the agitator 4 (e.g., the agitator nozzle 41 and / or the screw 43) may be operated at all times.

[0022] 1 and 3, when the amount of liquid in the first tank 2 is large, a stagnation region RG1 where the agitation by the agitator 4 is insufficient tends to become large. In the example shown in FIGS. 1 and 3, the flow rate of the coolant CL in the stagnation region RG1 is relatively low. Foreign matter such as sludge D2 tends to accumulate in the stagnation region RG1.

[0023] In contrast, the coolant system 1A of the first embodiment can execute a first control mode M1 in which the coolant CL in the first tank 2 is agitated by the agitator 4 while the liquid level LA is lowered. By executing the first control mode M1, the flow of the coolant CL in the stagnation region RG1 is strengthened. More specifically, when the liquid amount in the first tank 2 is lower than the liquid level LA before the first control mode M1 is executed, the flow velocity of the coolant CL becomes relatively faster. As a result, the size of the stagnation region RG1, where agitation by the agitator 4 is insufficient, becomes smaller. Furthermore, the lowering of the liquid level LA changes the velocity distribution of the coolant CL in the first tank 2, and the position of the stagnation region RG1 changes. In this way, foreign matter such as sludge D2 that had accumulated in the stagnation region RG1 in the examples of FIGS. 1 and 3 is dispersed into the coolant CL. The dispersed foreign matter in the coolant CL is removed by the foreign matter removal device 5 (more specifically, the filter 5f).

[0024] As described above, in the first embodiment, stagnation of the flow of the coolant CL in the first tank 2 is reduced. As a result, foreign matter that has accumulated in the stagnation area RG1 is dispersed into the coolant CL. In this way, the foreign matter removal device 5 can effectively remove foreign matter from the coolant CL. Furthermore, because the foreign matter is effectively removed, the cleanliness of the coolant CL can be appropriately maintained.

[0025] Note that if the operation of the agitator 4 is strengthened, stagnation in the first tank 2 can be reduced. For example, stagnation in the first tank 2 can be reduced by increasing the flow rate of the coolant CL discharged from the agitator nozzle 41 or by increasing the rotation speed of the screw 43. However, if the operation of the agitator 4 is strengthened when the amount of liquid in the first tank 2 is large, the energy required to reduce stagnation increases.

[0026] In contrast, in the first embodiment, stagnation in the first tank 2 is reduced by lowering the liquid level LA and then stirring the coolant CL in the first tank 2. Therefore, stagnation can be reduced with relatively little energy without increasing the flow rate of the coolant CL discharged from the stirring nozzle 41 or increasing the rotation speed of the screw 43. In this way, the first embodiment provides a coolant system 1A that imposes a small burden on the environment. Note that in the first embodiment, lowering the liquid level LA and increasing the operation of the stirring device 4 may be used in combination to reduce stagnation in the first tank 2.

[0027] (Optional configuration) Next, optional additional configurations that can be employed in the coolant system 1A in the first embodiment or the coolant system 1B in the second embodiment described below will be described with reference to FIGS.

[0028] (First control mode M1) 2, 4, 7, or 8, the first control mode M1 includes collecting foreign matter using the foreign matter removal device 5 while stirring the coolant CL in the first tank 2 with the stirring device 4. In this case, the foreign matter can be collected using the foreign matter removal device 5 while dispersing the foreign matter in the coolant CL by lowering the liquid level LA in the first tank 2 and stirring the coolant CL in the first tank 2. This reduces the amount of foreign matter remaining in the first tank 2 without being removed by the foreign matter removal device 5, allowing for efficient collection of the foreign matter.

[0029] (2nd Tank 6) In the example shown in FIG. 1 or FIG. 3, the coolant system 1A includes a second tank 6 that stores the coolant CL.

[0030] 2 or 4, the second tank 6 functions as a buffer tank that receives the coolant CL discharged from the first tank 2 when the first control mode M1 is being executed. When the coolant system 1A includes the second tank 6, it is not necessary to discard the coolant CL discharged from the first tank 2 when the liquid level LA in the first tank 2 is lowered. In other words, after the first control mode M1 is executed, the coolant CL can be returned from the second tank 6 to the first tank 2. When the coolant CL in the second tank 6 is returned to the first tank 2, the environmental impact is reduced compared to when the coolant CL is discarded.

[0031] In the example described in Figures 1 and 2 (or in the example described in Figures 3 and 4), the first control mode M1 includes lowering the liquid level LA in the first tank 2 by using a regulating device 3 (e.g., a first pump 31 and / or a valve 32) to move coolant CL from the first tank 2 to the second tank 6.

[0032] 1 and 2, the adjustment device 3 includes a first pump 31 that supplies the coolant CL from the first tank 2 to the second tank 6. When the adjustment device 3 includes the first pump 31, the coolant CL can be efficiently moved from the first tank 2 to the second tank 6.

[0033] In the example shown in FIGS. 1 and 2, the first control mode M1 includes sending a control command from the control device 9 to the first pump 31 so that the liquid level LA in the first tank 2 decreases.

[0034] 3 or 6, the coolant system 1A may include a second pump 36 that supplies the coolant CL from the second tank 6 to the first tank 2. More specifically, the adjusting device 3 may include the second pump 36 that supplies the coolant CL from the second tank 6 to the first tank 2.

[0035] 7, the agitation device 4 may include an agitation nozzle 41 disposed in the first tank 2. The agitation nozzle 41 agitates the coolant CL in the first tank 2 by discharging the coolant CL into the first tank 2. As illustrated in FIG. 7, the second pump 36 may be capable of supplying the coolant CL from the second tank 6 to the agitation nozzle 41 disposed in the first tank 2.

[0036] (Foreign object removal device 5) 2, 4, or 8, the coolant system 1A includes a circulation flow path C that flows from the first tank 2 and returns to the first tank 2. The circulation flow path C takes in the coolant CL from the first tank 2 and returns the coolant CL to the first tank 2. In the example shown in FIG. 2, 4, or 8, the foreign matter removal device 5 (more specifically, the filter 5f) is disposed in the circulation flow path C.

[0037] When the foreign matter removal device 5 is disposed in the circulation flow path C, the coolant CL circulates through the circulation flow path C, and foreign matter is gradually removed from the coolant CL.

[0038] (Second embodiment) A coolant system 1B according to a second embodiment will be described with reference to FIGS. 10 to 35. FIGS. 10 to 14 are diagrams schematically illustrating the coolant system 1B according to the second embodiment. FIG. 15 is a diagram schematically illustrating a portion of the coolant system 1B according to the second embodiment. FIG. 16 is a cross-sectional view taken along the line AA in FIG. 15. FIG. 17 is a diagram schematically illustrating the coolant system 1B according to a first modified example of the second embodiment. FIG. 18 is a diagram schematically illustrating the coolant system 1B according to a second modified example of the second embodiment. FIG. 19 is a diagram schematically illustrating how the coolant system 1B according to the second embodiment can supply coolant CL to a processing machine 101. FIG. 20 is a diagram schematically illustrating how another coolant system 1 can supply coolant CL to a processing machine 101. FIG. 21 is a schematic cross-sectional view for illustrating an example of an agitation nozzle 41. FIG. 22 is a diagram for illustrating a first removal device 81. FIG. 23 is a schematic perspective view showing an example of the arrangement of the first tank 2 and the second tank 6. FIG. 24 is a diagram schematically showing a state in which the control device 9 can control a plurality of control target devices. FIGS. 25 and 26 are diagrams schematically showing a state in which the normal operation mode M0 is being executed. FIGS. 27 and 28 are diagrams schematically showing a state in which the first control mode M1 is being executed. FIG. 29 is a diagram schematically showing a state in which the second control mode M2 is being executed. FIG. 30 is a diagram schematically showing a state in which the normal operation mode M0 is being executed. FIG. 31 is a diagram schematically showing a state in which the first control mode M1 is being executed. FIG. 32 is a diagram schematically showing an example of an image displayed on the display 97. FIG. 33 is a diagram schematically showing another example of an image displayed on the display 97. FIG. 34 is a diagram schematically showing yet another example of an image displayed on the display 97. FIG. 35 is a diagram schematically showing a state in which the backwash mode M4 is being executed.

[0039] In the second embodiment, differences from the first embodiment will be mainly described. On the other hand, in the second embodiment, repeated descriptions of matters already described in the first embodiment will be omitted. Therefore, it goes without saying that matters already described in the first embodiment can be applied to the second embodiment even if they are not explicitly described in the second embodiment.

[0040] As illustrated in FIG. 11, the coolant system 1B in the second embodiment includes (1) a first tank 2 for storing coolant CL, (2) an adjustment device 3 for adjusting the liquid level LA of the coolant CL in the first tank 2, (3) an agitation device 4 for agitating the coolant CL in the first tank 2, (4) a foreign matter removal device 5 for removing foreign matter from the coolant CL, and (5) a control device 9 for executing a first control mode M1 by controlling the adjustment device 3.

[0041] As illustrated in Figures 11 and 12, the first control mode M1 includes (1) using the adjustment device 3 to lower the liquid level LA of the coolant CL in the first tank 2, and (2) while the liquid level LA of the coolant CL in the first tank 2 is lowered, using the stirring device 4 to stir the coolant CL in the first tank 2.

[0042] Therefore, the coolant system 1B in the second embodiment has the same effects as the coolant system 1A in the first embodiment.

[0043] (Optional configuration) Next, optional additional configurations that can be employed in the coolant system 1B of the second embodiment or the coolant system 1A of the first embodiment will be described with reference to FIGS.

[0044] (Foreign object removal device 5) 12, the coolant system 1B includes at least one circulation flow path C that flows out from the first tank 2 and returns to the first tank 2. The at least one circulation flow path C takes out the coolant CL from the first tank 2 and returns the coolant CL to the first tank 2. In the example shown in FIG. 12, the foreign matter removal device 5 (more specifically, a filter 5f) is disposed in the at least one circulation flow path C (more specifically, a second circulation flow path C2 described below).

[0045] 12, the at least one circulation flow path C includes a first circulation flow path C1. The first circulation flow path C1 is composed of a first flow path FP1, a second flow path FP2, and a second tank 6. More specifically, the first circulation flow path C1 is a flow path that exits the first tank 2, passes through the first flow path FP1, the second tank 6, and the second flow path FP2, and returns to the first tank 2.

[0046] The first flow path FP1 connects the first tank 2 and the second tank 6 and is a flow path that sends the coolant CL from the first tank 2 to the second tank 6. The second flow path FP2 connects the first tank 2 and the second tank 6 and is a flow path that sends the coolant CL from the second tank 6 to the first tank 2.

[0047] 12, at least one circulation flow path C includes a second circulation flow path C2. The second circulation flow path C2 is composed of a first flow path FP1, a second flow path FP2, a second tank 6, and a third flow path FP3 that exits the second tank 6 and returns to the second tank 6. More specifically, the second circulation flow path C2 is a flow path that exits the first tank 2, passes through the first flow path FP1, the second tank 6, the third flow path FP3, the second tank 6, and the second flow path FP2, and returns to the first tank 2.

[0048] 12, the foreign matter removal device 5 includes a cyclone filter 51. In the example shown in Fig. 12, the cyclone filter 51 is disposed in the second circulation flow path C2 (more specifically, the third flow path FP3). The cyclone filter 51 removes small foreign matter (e.g., sludge D2) from the coolant CL flowing through the second circulation flow path C2 (more specifically, the third flow path FP3).

[0049] Alternatively, or additionally, the cyclone filter 52 may be disposed in the first circulation flow path C1 (more specifically, the first flow path FP1), as illustrated in Fig. 17. Hereinafter, the cyclone filter 52 disposed in the first circulation flow path C1 will be referred to as the "second cyclone filter 52."

[0050] 12 or 17, the first control mode M1 is executed in a state in which the coolant CL is circulating through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2). In this case, while the first control mode M1 is being executed, foreign matter (e.g., sludge D2) can be removed from the coolant CL flowing through the at least one circulation flow path C.

[0051] The foreign matter removed by the foreign matter removal device 5 (e.g., the cyclone filter 51 and / or the second cyclone filter 52) is, for example, metal chips, metal particles, and metal powder generated by processing the workpiece. The foreign matter removed by the foreign matter removal device 5 may also include non-metallic particles (e.g., carbon particles).

[0052] (2nd Tank 6) In the example shown in FIG. 11, the coolant system 1B includes a second tank 6 that stores the coolant CL.

[0053] In the example shown in FIG. 11 , the second tank 6 functions as a buffer tank that receives the coolant CL discharged from the first tank 2 when the first control mode M1 is executed. When the coolant system 1B includes the second tank 6, it is not necessary to discard the coolant CL discharged from the first tank 2 when the liquid level LA in the first tank 2 is lowered. In other words, after the first control mode M1 is executed, the coolant CL can be returned from the second tank 6 to the first tank 2. When the coolant CL in the second tank 6 is returned to the first tank 2, the environmental impact is reduced compared to when the coolant CL is discarded.

[0054] In the example described in Figures 11 and 12, the first control mode M1 includes lowering the liquid level LA in the first tank 2 by using an adjustment device 3 (e.g., a first pump 31) to move coolant CL from the first tank 2 to the second tank 6.

[0055] 11 and 12, the adjustment device 3 includes a first pump 31 that supplies the coolant CL from the first tank 2 to the second tank 6. When the adjustment device 3 includes the first pump 31, the coolant CL can be efficiently moved from the first tank 2 to the second tank 6.

[0056] In the example shown in FIG. 10, the second tank 6 has a buffer space BS that receives the coolant CL when the first control mode M1 is executed. In the example shown in FIG. 10, the buffer space BS is a space located at a higher position than the position indicated by the symbol "TH2." The control device 9 may prevent the liquid level LB of the coolant CL in the second tank 6 from reaching the buffer space BS before the first control mode M1 is executed. In this case, a space that receives the coolant CL is reliably secured when the first control mode M1 is executed.

[0057] For example, before the first control mode M1 is executed, the control device 9 may prohibit the liquid level LB of the coolant CL in the second tank 6 from exceeding an upper limit threshold (TH2). Furthermore, when the first control mode M1 is executed, the control device 9 may control the adjusting device 3 (e.g., the first pump 31) so that the liquid level LB of the coolant CL in the second tank 6 exceeds the upper limit threshold (TH2) (see FIG. 12). In this specification, in order to distinguish between the liquid level LA in the first tank 2 and the liquid level LB in the second tank 6, the term "liquid level LB" in the latter can be read as "second liquid level LB."

[0058] 11 and 12, the first control mode M1 includes the control device 9 controlling the operation of the first pump 31. The first control mode M1 also includes lowering the liquid level LA in the first tank 2 by using the first pump 31 to supply coolant CL from the first tank 2 to the second tank 6.

[0059] 11 and 12 , the coolant system 1A may include a second pump 36 that supplies the coolant CL from the second tank 6 to the first tank 2. More specifically, the adjusting device 3 may include the second pump 36 that supplies the coolant CL from the second tank 6 to the first tank 2.

[0060] 15, the second tank 6 includes a first storage chamber 61 and a second storage chamber 62. As illustrated in FIGS. 15 and 16, the second tank 6 may include a partition 64 that separates the first storage chamber 61 and the second storage chamber 62.

[0061] 11, the coolant CL supplied from the first flow path FP1 flows into the first storage chamber 61. In the example shown in FIG. 11, the coolant CL supplied by the first pump 31 flows into the first storage chamber 61.

[0062] 11, the coolant CL can be supplied from the second storage chamber 62 to the first tank 2 via the second flow path FP2. In the example shown in FIG. 15, the coolant suction port 36p of the second pump 36 is disposed in the second storage chamber 62. The coolant suction port 36p of the second pump 36 may be disposed in an upper portion 62u of the second storage chamber 62.

[0063] 15, first bottom 61b of first storage chamber 61 and second bottom 62b of second storage chamber 62 are fluidly connected. In addition, bottom surface 621 of second storage chamber 62 is an inclined surface 621c that decreases in height toward bottom surface 611 of first storage chamber 61. In this case, foreign matter that settles on second bottom 62b of second storage chamber 62 can be collected on first bottom 61b of first storage chamber 61.

[0064] In the example shown in FIG. 15, the second tank 6 is provided with a discharge port 63 for discharging the coolant CL from the bottom of the second tank 6. In other words, the bottom of the second tank 6 is provided with the discharge port 63 for discharging the coolant CL. Foreign matter tends to settle at the bottom of the second tank 6. The discharge port 63 discharges the foreign matter that has settled at the bottom of the second tank 6 to the outside of the second tank 6. In the example shown in FIG. 15, the foreign matter is discharged from the discharge port 63, thereby preventing the accumulation of foreign matter at the bottom of the second tank 6.

[0065] 15, the above-mentioned discharge port 63 is formed in the first bottom portion 61b of the first storage chamber 61. In addition, the bottom surface 611 of the first storage chamber 61 is an inclined surface 611c that decreases in height toward the discharge port 63. In this case, foreign matter that settles on the first bottom portion 61b of the first storage chamber 61 can be collected in the discharge port 63.

[0066] In the example shown in FIG. 15, the coolant system 1B includes a pump (hereinafter referred to as a "fourth pump 69") that sends the coolant CL from the second tank 6 to the foreign matter removal device 5 (more specifically, the cyclone filter 51). In the example shown in FIG. 15, the fourth pump 69 sends the coolant CL taken out from the second tank 6 via the discharge port 63 to the foreign matter removal device 5 (more specifically, the cyclone filter 51). In the example shown in FIG. 15, the foreign matter collected at the discharge port 63 is sent to the cyclone filter 51 via the discharge port 63 and the third flow path FP3. Furthermore, the foreign matter is efficiently removed from the coolant CL using the cyclone filter 51.

[0067] 15, foreign matter removed from the coolant CL by the cyclone filter 51 is contained in the first container 68. Alternatively, as illustrated in FIG. 18, the coolant system 1B may include a magnetic separator 67 fluidly connected to the cyclone filter 51.

[0068] In the example shown in FIG. 18 , the cyclone filter 51 returns most of the coolant CL to the third flow path FP3. The cyclone filter 51 also sends the fluid containing foreign matter separated from the coolant to the magnetic separator 67. The fluid contains the coolant CL. In the example shown in FIG. 18 , magnetic substances that are attracted to a magnet are removed from the fluid containing foreign matter by the magnetic separator 67. As illustrated in FIG. 18 , the fluid that is not attracted to the magnet of the magnetic separator 67 may be returned to the second tank 6. Alternatively, the fluid that is not attracted to the magnet of the magnetic separator 67 may be returned to the first tank 2.

[0069] The second storage chamber 62 contains coolant CL with a higher level of cleanliness than the first storage chamber 61. In the example shown in FIG. 15 , the coolant suction port 36p of the second pump 36 is disposed in the second storage chamber 62. Therefore, the second pump 36 can supply the coolant CL with a higher level of cleanliness to the first tank 2. Furthermore, when the second pump 36 supplies the coolant to the stirring nozzle 41, the stirring nozzle 41 can stir the inside of the first tank 2 using the coolant with a higher level of cleanliness.

[0070] 19, the second pump 36 may be capable of supplying the coolant CL to the processing machine 101. In the example shown in FIG. 19, the coolant suction port of the second pump 36 is disposed in the second storage chamber 62, and therefore the second pump 36 can supply the coolant CL with high cleanliness to the processing machine 101.

[0071] 19, the coolant system 1B may include a third pump 71 that supplies coolant CL to the processing machine 101. In the example shown in FIG. 19, a coolant suction port 71p of the third pump 71 is disposed in the second tank 6 (more specifically, the second storage chamber 62). When the coolant suction port 71p of the third pump 71 is disposed in the second storage chamber 62, the third pump 71 can supply highly clean coolant CL to the processing machine 101.

[0072] 19, the third flow path FP3 discharges the coolant CL to a region closer to the coolant suction port 71p of the third pump 71 than to the coolant suction port 36p of the second pump 36. In this case, the highly clean coolant CL discharged from the third flow path FP3 is pumped up by the third pump 71.

[0073] (1st Tank 2) 10, the first tank 2 may have a shallower bottom than the second tank 6. More specifically, the height dimension H1 of the first tank 2 may be smaller than the height dimension H2 of the second tank 6. When the first tank 2 is a shallow tank, a stagnation region RG1 is less likely to occur in the first tank 2 while the first control mode M1 is being executed.

[0074] (First liquid level sensor 25, second liquid level sensor 65) 2, 4, 7, 11, 19, or 20, the coolant system 1 may include a first level sensor 25 that detects the level LA of the coolant CL in the first tank 2. The first level sensor 25 is disposed in the first tank 2. The first level sensor 25 transmits a first signal SA indicating the level LA of the coolant CL in the first tank 2 to the control device 9.

[0075] 12 or 19, the coolant system 1 may include a second level sensor 65 that detects the liquid level LB of the coolant CL in the second tank 6. The second level sensor 65 is disposed in the second tank 6. The second level sensor 65 transmits a second signal SB indicating the liquid level LB of the coolant CL in the second tank 6 to the control device 9.

[0076] The control device 9 executes the first control mode M1 based on the first signal SA and / or the second signal SB.

[0077] For example, when the first control mode M1 is executed, the control device 9 controls the adjustment device 3 (e.g., the first pump 31 and / or the second pump 36) based on the first signal SA so that the liquid level LA of the coolant CL in the first tank 2 drops to a first level LA1 (more specifically, the target value E1 described below).

[0078] Alternatively, or additionally, when the first control mode M1 is executed, the control device 9 may control the regulating device 3 (e.g., the first pump 31 and / or the second pump 36) based on the second signal SB so that the liquid level LB of the coolant CL in the second tank 6 rises to a third level LB1.

[0079] The control device 9 may execute a second control mode M2, which will be described later, based on the first signal SA and / or the second signal SB.

[0080] For example, when the second control mode M2 is executed, the control device 9 may control the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) based on the first signal SA so that the liquid level LA of the coolant CL in the first tank 2 rises to a second level LA2 (see FIG. 13) that is higher than the first level LA1.

[0081] Alternatively, or additionally, when the second control mode M2 is executed, the control device 9 may control the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) based on the second signal SB so that the liquid level LB of the coolant CL in the second tank 6 drops to a fourth level LB2 (see FIG. 13) lower than the third level LB1.

[0082] The control device 9 may execute a normal operation mode M0, which will be described later, based on the first signal SA and / or the second signal SB.

[0083] For example, when the normal operation mode M0 is executed, the control device 9 may control the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) based on the first signal SA so that the liquid level LA of the coolant CL in the first tank 2 is maintained within a first predetermined range.

[0084] For example, when the normal operation mode M0 is executed, the control device 9 may control the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) based on the second signal SB so that the liquid level LB of the coolant CL in the second tank 6 is maintained within a second predetermined range.

[0085] The normal operation mode M0, the first control mode M1, and the second control mode M2 will be described in detail later.

[0086] (Agitator 4) The agitator 4 agitates the coolant CL in the first tank 2.

[0087] 13, the agitator 4 may include an agitator nozzle 41 disposed in the first tank 2. The agitator nozzle 41 agitates the coolant CL in the first tank 2 by discharging the coolant CL into the first tank 2. As illustrated in FIG. 19, the agitator 4 may include a plurality of agitator nozzles 41 disposed in the first tank 2. Alternatively, or additionally, the agitator 4 may include a screw (see FIG. 3) that agitates the coolant CL in the first tank 2.

[0088] 13, the second pump 36 may be capable of supplying the coolant CL from the second tank 6 to an agitation nozzle 41 disposed in the first tank 2. In the example shown in FIG. 13, the second pump 36 has a function of adjusting the liquid level LA of the coolant CL in the first tank 2 (more specifically, a function of raising the liquid level LA of the coolant CL in the first tank 2) and a function of supplying the coolant CL as an agitation fluid to the agitation nozzle 41. Because the second pump 36 has two functions, the coolant system 1B may require a smaller number of pumps.

[0089] Alternatively, or additionally, as illustrated in FIG. 19, the coolant system 1B may include a pump P (i.e., a pump P other than the second pump 36) that supplies coolant CL from the first tank 2 to at least one stirring nozzle 41b.

[0090] 21 , the agitation nozzle 41 is disposed in the coolant CL in the first tank 2. The agitation nozzle 41 may be disposed near the bottom wall 2b of the first tank 2. When the first control mode M1 is executed, the liquid level LA of the coolant CL in the first tank 2 approaches the upper end 41u of the agitation nozzle 41. When the first control mode M1 is executed, the distance L1 between the liquid level LA of the coolant CL in the first tank 2 and the upper end 41u of the agitation nozzle 41 may be 50 cm or less, 40 cm or less, 30 cm or less, or 10 cm or less.

[0091] As illustrated in FIG. 21, the agitation nozzle 41 may discharge the coolant CL in a generally horizontal direction.

[0092] As illustrated in FIG. 21 , the agitator 4 (more specifically, the agitation nozzle 41) may include a flow amplification nozzle 411. In this specification, the flow rate of coolant CL supplied from the pump to the flow amplification nozzle 411 is defined as a supply flow rate, and the flow rate of coolant CL discharged from the flow amplification nozzle 411 is defined as a discharge flow rate. In this specification, the flow amplification nozzle 411 refers to a nozzle whose discharge flow rate is greater than its supply flow rate. In the example illustrated in FIG. 21 , the flow amplification nozzle 411 includes a base end 411a connected to a conduit through which the coolant CL supplied from the pump flows, a discharge port 411b from which the coolant CL is discharged, a side wall 411c, and a through-hole 411h formed in the side wall 411c. In the example illustrated in FIG. 21 , a negative pressure is generated in the space inside the side wall 411c due to the coolant CL flowing from the base end 411a toward the discharge port 411b. The negative pressure causes the coolant CL to be drawn from the outside of the side wall 411c to the inside of the side wall 411c through the through-hole 411h. The coolant CL drawn in through the through-hole 411h is then discharged from the discharge port 411b. In this way, the flow rate of the coolant CL discharged from the flow amplification nozzle 411 is amplified.

[0093] When the agitation nozzle 41 includes the flow rate amplifying nozzle 411, the coolant CL in the first tank 2 can be agitated with high energy efficiency.

[0094] (Dirty Fluid D) In this specification, the coolant used to cool the tool or workpiece is defined as “used coolant CL2.” In addition, in this specification, the fluid containing the used coolant CL2 and the sludge D2 generated from the workpiece is defined as “dirty fluid D.”

[0095] 19 or 20, the coolant system 1 includes a return flow path R1 through which the contaminated fluid D flows from the processing machine 101 toward the first tank 2. The return flow path R1 connects the processing machine 101 and the first tank 2.

[0096] 19 or 20, the used coolant CL2 is collected through the return passage R1 into the first tank 2. In other words, the first tank 2 receives the used coolant CL2 from the return passage R1.

[0097] 19 or 20, the weight of foreign matter contained per unit volume of the coolant CL in the first tank 2 is greater than that in the second tank 6. In other words, the first tank 2 functions as a dirty tank that stores coolant with a relatively high concentration of foreign matter, and the second tank 6 functions as a clean tank that stores coolant with a relatively low concentration of foreign matter.

[0098] (1st removal device 81) As illustrated in FIG. 19 or 20, the coolant system 1 may include a first removal device 81 that removes large foreign matter (more specifically, chips D1) from the contaminated fluid D containing the used coolant CL2.

[0099] 22, chips D1 are mixed in the contaminated fluid D flowing through the return passage R1. The contaminated fluid D may also contain oil.

[0100] As illustrated in FIG. 22, the first removal device 81 may include a chip conveyor 81a that removes large foreign objects (more specifically, chips D1) from the contaminated fluid D containing the used coolant CL2. The first removal device 81 may include a drum filter 81b that removes the chips D1. In the example illustrated in FIG. 22, the drum filter 81b is disposed inside the chip conveyor 81a. The chips D1 are removed by both the chip conveyor 81a and the drum filter 81b.

[0101] (Example of arrangement of first tank 2 and second tank 6) In the example shown in FIG. 23, the second tank 6 is disposed at a higher position than the first tank 2. The lower end of the second tank 6 may be located higher than the upper end of the first tank 2. The size of the second tank 6 in plan view may be smaller than the size of the first tank 2 in plan view. When the size of the second tank 6 in plan view is small, an increase in the installation area of the entire coolant system due to the addition of the second tank 6 is suppressed.

[0102] As illustrated in Fig. 23, a fourth pump 69 may be disposed in a region vertically below the second tank 6. The second tank 6 may be a movable tank. In the example illustrated in Fig. 23, the second tank 6 is supported by a plurality of casters 66. In the example illustrated in Fig. 23, the plurality of casters 66 support the second pump 36. The plurality of casters 66 may support the third pump 71 and / or the fourth pump 69. The plurality of casters 66 may support the inline filter 55, which will be described later.

[0103] 23, the first tank 2 and the second tank 6 are completely independent. Alternatively, part of the wall of the first tank 2 and part of the wall of the second tank 6 may be common to each other.

[0104] (Feeding device 7) 19 or 20, the coolant system 1 may include a supply device 7 that supplies coolant CL to the processing machine 101. In the example shown in FIG. 19 or 20, the control device 9 can execute a supply mode M3 that supplies coolant CL to the processing machine 101 by controlling the supply device 7.

[0105] 19, the supply device 7 includes a third pump 71 that supplies the coolant CL to the processing machine 101. In the example shown in FIG. 19, the third pump 71 supplies the coolant CL from the second tank 6 to the processing machine 101. Alternatively, as illustrated in FIG. 20, the third pump 71 may supply the coolant CL from the first tank 2 to the processing machine 101.

[0106] 19 , the above-mentioned second pump 36 may function as a pump that supplies the coolant CL from the second tank 6 to the processing machine 101. Alternatively, the above-mentioned first pump 31 may function as a pump that supplies the coolant CL from the first tank 2 to the processing machine 101.

[0107] 19 or 20, the coolant system 1 includes a supply line Q1 that sends coolant CL to the processing machine 101. In the example shown in FIG. 19, the supply line Q1 is a line that sends coolant CL from the second tank 6 to the processing machine 101. In the example shown in FIG. 19, the supply line Q1 connects the second tank 6 and the processing machine 101. In the example shown in FIG. 19, a circulation flow path that exits the first tank 2 and returns to the first tank 2 is formed by the first flow path FP1, the second tank 6, the supply line Q1, the processing machine 101, and the return flow path R1. In other words, at least one circulation flow path C of the coolant system 1 includes a third circulation flow path C3 that exits the first tank 2, passes through the first flow path FP1, the second tank 6, the supply line Q1, the processing machine 101, and the return flow path R1, and returns to the first tank 2.

[0108] 20, the supply line Q1 may be a line that sends coolant CL from the first tank 2 to the processing machine 101. In the example shown in FIG. 20, the supply line Q1 connects the first tank 2 and the processing machine 101. In the example shown in FIG. 20, the supply line Q1, the processing machine 101, and the return line R1 form a circulation line that exits the first tank 2 and returns to the first tank 2. In other words, at least one circulation line C of the coolant system 1 includes a circulation line that exits the first tank 2, passes through the supply line Q1, the processing machine 101, and the return line R1, and returns to the first tank 2.

[0109] 19, the supply line Q1 may include a first supply line Q1-1 that delivers coolant CL to a first discharge device 105a that delivers the coolant CL toward the workpiece. Alternatively, or additionally, the supply line Q1 may include a second supply line Q1-2 that delivers coolant CL to a second discharge device 105b that delivers the coolant CL into the tool. As illustrated in FIG. 19, a portion of the first supply line Q1-1 and a portion of the second supply line Q1-2 may be shared.

[0110] Alternatively, or additionally, the supply line Q1 may include a third supply line Q1-3 that delivers coolant CL to a third discharge device 105c that delivers coolant CL to a cover 108 that surrounds the machining area of the machining machine. If the machining machine 101 includes a fourth discharge device 105d that delivers coolant CL to a second portion of the cover 108 in addition to the third discharge device 105c that delivers coolant CL to a first portion of the cover 108, the supply line Q1 may include a fourth supply line Q1-4 that delivers coolant CL to the fourth discharge device 105d. As illustrated in FIG. 19 , a portion of the third supply line Q1-3 and a portion of the fourth supply line Q1-4 may be shared.

[0111] 19 or 20, the coolant system 1 includes at least one valve V1 disposed in a supply line Q1 that sends coolant CL to the processing machine 101. By controlling the at least one valve V1, the control device 9 can switch the state of the supply line Q1 between a supply state in which the coolant CL is supplied to the processing machine 101 and a supply stop state in which the supply of the coolant CL to the processing machine 101 is stopped.

[0112] As illustrated in FIG. 19, the coolant system 1 may include a first valve V1-1 disposed in the first supply line Q1-1. In the example illustrated in FIG. 19, the control device 9 can change the state of the first valve V1-1 between a closed state that closes the first supply line Q1-1 and an open state that opens the first supply line Q1-1. When the first valve V1-1 is in the closed state, the supply of coolant CL to the first discharge device 105a is prohibited, and when the first valve V1-1 is in the open state, the supply of coolant CL to the first discharge device 105a is permitted. In the example illustrated in FIG. 19, when the first valve V1-1 is in the open state, the third pump 71 can supply coolant CL to the processing machine 101 (more specifically, the first discharge device 105a).

[0113] As illustrated in FIG. 19, the coolant system 1 may include a second valve V1-2 disposed in the second supply line Q1-2. In the example illustrated in FIG. 19, the control device 9 can change the state of the second valve V1-2 between a closed state that closes the second supply line Q1-2 and an open state that opens the second supply line Q1-2. When the second valve V1-2 is in the closed state, the supply of coolant CL to the second discharge device 105b is prohibited, and when the second valve V1-2 is in the open state, the supply of coolant CL to the second discharge device 105b is permitted. In the example illustrated in FIG. 19, when the second valve V1-2 is in the open state, the third pump 71 can supply coolant CL to the processing machine 101 (more specifically, the second discharge device 105b).

[0114] As illustrated in FIG. 19, the coolant system 1 may include a third valve V1-3 disposed in the third supply line Q1-3. In the example illustrated in FIG. 19, the control device 9 can change the state of the third valve V1-3 between a closed state that closes the third supply line Q1-3 and an open state that opens the third supply line Q1-3. When the third valve V1-3 is in the closed state, the supply of coolant CL to the third discharge device 105c is prohibited, and when the third valve V1-3 is in the open state, the supply of coolant CL to the third discharge device 105c is permitted. In the example illustrated in FIG. 19, when the third valve V1-3 is in the open state, the second pump 36 can supply coolant CL to the processing machine 101 (more specifically, the third discharge device 105c).

[0115] As illustrated in FIG. 19, the coolant system 1 may include a fourth valve V1-4 disposed in the fourth supply line Q1-4. In the example illustrated in FIG. 19, the control device 9 can change the state of the fourth valve V1-4 between a closed state that closes the fourth supply line Q1-4 and an open state that opens the fourth supply line Q1-4. When the fourth valve V1-4 is in the closed state, the supply of coolant CL to the fourth discharge device 105d is prohibited, and when the fourth valve V1-4 is in the open state, the supply of coolant CL to the fourth discharge device 105d is permitted. In the example illustrated in FIG. 19, when the fourth valve V1-4 is in the open state, the second pump 36 can supply coolant CL to the processing machine 101 (more specifically, the fourth discharge device 105d).

[0116] As illustrated in FIG. 19, the coolant system 1 may include an auxiliary line Q2 that supplies the coolant CL from the second tank 6 to the first removal device 81 (more specifically, a drum filter 81b (see FIG. 22)). The coolant system 1 may also include a valve (hereinafter referred to as a "fifth valve V5") disposed in the auxiliary line Q2. In the example illustrated in FIG. 19, the control device 9 can change the state of the fifth valve V5 between a closed state that closes the auxiliary line Q2 and an open state that opens the auxiliary line Q2. When the fifth valve V5 is in the closed state, the supply of the coolant CL from the second tank 6 to the first removal device 81 is prohibited, and when the fifth valve V5 is in the open state, the supply of the coolant CL from the second tank 6 to the first removal device 81 is permitted. In the example shown in FIG. 19, when the fifth valve V5 is open, the second pump 36 can supply the coolant CL from the second tank 6 to the first removal device 81 (more specifically, the drum filter 81b (see FIG. 22)).

[0117] As illustrated in FIG. 19, the coolant system 1 may include a valve (hereinafter referred to as a "sixth valve V6") disposed in the second flow path FP2 connecting the first tank 2 and the second tank 6.

[0118] (Inline filter 55) 19, the supply device 7 may include an in-line filter 55 that removes foreign matter from the coolant CL flowing through the supply pipe Q1. When the supply device 7 includes the in-line filter 55, the coolant CL supplied to the processing machine 101 is further purified.

[0119] 19, the in-line filter 55 is arranged in the second supply line Q1-2. When the in-line filter 55 is arranged in the second supply line Q1-2, the coolant CL supplied to the inside of the tool is further purified.

[0120] (First pressure switch 83a) 19, the coolant system 1 may include a first pressure switch 83a disposed in the first flow path FP1. The first pressure switch 83a is capable of transmitting a signal to the control device 9. When the pressure of the coolant flowing through the first flow path FP1 exceeds a threshold, the first pressure switch 83a transmits a signal to the control device 9, and the control device 9, which receives the signal from the first pressure switch 83a, slows down the operation of the first pump 31 (more specifically, reduces the rotation speed of the first motor 31m that operates the first pump 31).

[0121] (Second pressure switch 83b) 19, the coolant system 1 may include a second pressure switch 83b disposed in the second flow path FP2. The second pressure switch 83b is capable of transmitting a signal to the control device 9. When the pressure of the coolant flowing through the second flow path FP2 exceeds a threshold, the second pressure switch 83b transmits a signal to the control device 9, and the control device 9, which receives the signal from the second pressure switch 83b, slows down the operation of the second pump 36 (more specifically, reduces the rotation speed of the second motor 36m that operates the second pump 36).

[0122] In the example shown in FIG. 19 , the second pump 36 can supply the coolant CL to the first tank 2 and can also supply the coolant CL to the processing machine 101. When the coolant CL is not supplied from the second pump 36 to the processing machine 101, the operation of the second pump 36 may become excessive. The second pressure switch 83b prevents the operation of the second pump 36 from becoming excessive. In the example shown in FIG. 19 , the second pump 36 can supply the coolant CL to the first tank 2 and can also supply the coolant CL to the first removal device 81. When the coolant CL is not supplied from the second pump 36 to the first removal device 81, the operation of the second pump 36 may become excessive. The second pressure switch 83b prevents the operation of the second pump 36 from becoming excessive.

[0123] (Control device 9) In the example shown in FIG. 24 , the control device 9 includes a hardware processor 90 (hereinafter simply referred to as "processor 90"), a memory 92, a communication circuit 94, an input device 96, and a display 97. The processor 90, the memory 92, the communication circuit 94, the input device 96, and the display 97 are connected to one another via a bus 98. In the example shown in FIG. 24 , the input device 96 includes a touch panel 96t on the display 97. In other words, the display 97 is a display with a touch panel 96t. The input device 96 may include a button, a switch, a lever, a pointing device, and / or a keyboard. The control device 9 may include one computer or multiple computers.

[0124] The memory 92 is a storage medium readable by the processor 90 of the control device 9. The memory 92 may be, for example, a non-volatile or volatile semiconductor memory such as RAM, ROM, or flash memory, a magnetic disk, or any other type of memory.

[0125] The memory 92 stores a program PM. The processor 90 of the control device 9 executes the program PM stored in the memory 92, causing the control device 9 to generate a first group of control commands. The communication circuit 94 also transmits the first group of control commands to controlled devices (e.g., pumps, valves, etc.). In this way, the processor 90 executes the program PM, allowing the control device 9 to control the controlled devices (e.g., pumps, valves, etc.).

[0126] The memory 92 may store a first upper limit threshold TH1 indicating an upper limit of the liquid level LA of the first tank 2. The memory 92 may store a first lower limit threshold TL1 indicating a lower limit of the liquid level LA of the first tank 2. The memory 92 may store a target value E1 of the liquid level LA of the first tank 2 in the first control mode M1. The target value E1 may be the same as the first lower limit threshold TL1. Alternatively, the target value E1 may be greater than the first lower limit threshold TL1 and less than the first upper limit threshold TH1. Alternatively, the target value E1 may be less than the first lower limit threshold TL1. It is preferable that the target value E1 be less than the average value of the first upper limit threshold TH1 and the first lower limit threshold TL1.

[0127] The memory 92 may store a second upper limit threshold TH2 indicating a first upper limit of the liquid level LB of the second tank 6. The memory 92 may store a third upper limit threshold TH3 indicating a second upper limit of the liquid level LB of the second tank 6. The memory 92 may store a second lower limit threshold TL2 indicating a lower limit of the liquid level LB of the second tank 6.

[0128] The control device 9 may inverter-control the first pump 31. For example, the control device 9 may adjust the rotation speed of the first motor 31m that operates the first pump 31 based on the first signal SA received from the first liquid level sensor 25 and / or the second signal SB received from the second liquid level sensor 65. Alternatively, or additionally, the control device 9 may adjust the rotation speed of the first motor 31m that operates the first pump 31 based on a signal received from the first pressure switch 83a.

[0129] The control device 9 may inverter-control the second pump 36. For example, the control device 9 may adjust the rotation speed of the second motor 36m that operates the second pump 36 based on the first signal SA received from the first liquid level sensor 25 and / or the second signal SB received from the second liquid level sensor 65. Alternatively, or additionally, the control device 9 may adjust the rotation speed of the second motor 36m that operates the second pump 36 based on a signal received from the second pressure switch 83b.

[0130] The control device 9 may inverter-control the third pump 71. For example, the control device 9 may adjust the rotation speed of the third motor 71m that operates the third pump 71 based on the machining program PG stored in the memory 92.

[0131] The fourth pump 69 may be driven constantly or may be controlled by the control device 9 .

[0132] The memory 92 may store a machining program PG. The processor 90 of the control device 9 may execute the machining program PG stored in the memory 92, causing the control device 9 to generate a second group of control commands for controlling the processing machine 101.

[0133] The control device 9 may control the moving device 104, which will be described later, the first rotating device 106, which will be described later, and / or the second rotating device 107, which will be described later. For example, the processor 90 of the control device 9 may execute the machining program PG stored in the memory 92, causing the control device 9 to send a movement command to the moving device 104. The moving device 104 that receives the movement command moves the machining head 103 (see, for example, FIG. 36) relative to the workpiece supporting device 102 (see, for example, FIG. 36). This relative movement causes a tool held by the machining head 103 to come into contact with the workpiece W supported by the workpiece supporting device 102.

[0134] For example, the processor 90 of the control device 9 may execute the machining program PG stored in the memory 92, causing the control device 9 to send a first rotation command to the first rotation device 106. The first rotation device 106, upon receiving the first rotation command, rotates the tool T about the longitudinal axis of the tool T. In this way, the workpiece W is milled by the tool T.

[0135] Alternatively, or additionally, the processor 90 of the control device 9 may execute the machining program PG stored in the memory 92, causing the control device 9 to transmit a second rotation command to the second rotation device 107 (see FIG. 37). The second rotation device 107 receiving the second rotation command rotates the workpiece. In this way, the workpiece W is turned by the tool T.

[0136] (Supply mode M3) 19 or 20, the control device 9 may be able to execute a supply mode M3. In the example shown in Fig. 19 or 20, the supply mode M3 includes the control device 9 changing the state of at least one valve V1 arranged in a supply line Q1 that delivers coolant CL to the processing machine 101 from a closed state to an open state, and the control device 9 controlling the operation of at least one pump (e.g., the second pump 36 and / or the third pump 71) included in the coolant system 1 so that the coolant CL is supplied from at least one of the first tank 2 and the second tank 6 to the supply line Q1.

[0137] 25, the supply mode M3 may include the control device 9 changing the state of a first valve V1-1 disposed in the first supply line Q1-1 from a closed state to an open state, and controlling the operation of at least one pump (e.g., the third pump 71) included in the coolant system 1 so that the coolant CL is supplied from the second tank 6 to the first discharge device 105a via the first supply line Q1-1. As illustrated in Fig. 25, the supply mode M3 may include the control device 9 changing the state of a second valve V1-2 disposed in the second supply line Q1-2 from a closed state to an open state, and controlling the operation of at least one pump (e.g., the third pump 71) included in the coolant system 1 so that the coolant CL is supplied from the second tank 6 to the second discharge device 105b via the second supply line Q1-2.

[0138] As illustrated in FIG. 26, the supply mode M3 may include the control device 9 changing the state of the third valve V1-3 arranged in the third supply line Q1-3 from a closed state to an open state, and the control device 9 controlling the operation of at least one pump (e.g., the second pump 36) of the coolant system 1 so that the coolant CL is supplied from the second tank 6 to the third discharge device 105c via the third supply line Q1-3.

[0139] (Normal driving mode M0) 1, 3, 6, 10, or 25, the control device 9 may be capable of executing a normal operation mode M0. The normal operation mode M0 is a mode in which the control device 9 maintains the liquid level LA in the first tank 2 at a level equal to or higher than a first lower threshold value TL1 and equal to or lower than a first upper threshold value TH1 using the adjustment device 3 (e.g., a plurality of pumps including the first pump 31 and the second pump 36), and removes foreign matter from the coolant CL using the foreign matter removal device 5 (e.g., a cyclone filter 51, etc.) while circulating the coolant CL through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2). The liquid level LA in the first tank 2 is maintained above the first lower threshold TL1 and below the first upper threshold TH1 by the control device 9 controlling (more specifically, inverter controlling) the adjustment device 3 (e.g., multiple pumps including the first pump 31 and the second pump 36) based on the first signal SA from the first liquid level sensor 25.

[0140] By executing the normal operation mode M0, foreign matter is gradually removed from the coolant CL. In the examples shown in Figures 1, 3, 6, 10, or 25, the normal operation mode M0 includes stirring the coolant CL in the first tank 2 by the stirring device 4 (e.g., the stirring nozzle 41, the screw 43).

[0141] As illustrated in FIG. 10 or FIG. 25, the normal operation mode M0 may include the control device 9 maintaining the liquid level LB in the second tank 6 at or above a second lower threshold TL2 and at or below a second upper threshold TH2 using the adjustment device 3 (e.g., a plurality of pumps including the first pump 31 and the second pump 36). The control device 9 maintains the liquid level LB in the second tank 6 at or above the second lower threshold TL2 and at or below the second upper threshold TH2 by controlling (more specifically, inverter-controlling) the adjustment device 3 (e.g., a plurality of pumps including the first pump 31 and the second pump 36) based on the second signal SB from the second liquid level sensor 65. In the normal operation mode M0, maintaining the liquid level LB in the second tank 6 at or below the second upper threshold TH2 ensures a buffer space BS in the second tank 6. The existence of the buffer space BS allows the second tank 6 to suitably receive the coolant CL discharged from the first tank 2 when the first control mode M1 is executed.

[0142] As illustrated in FIG. 10 or FIG. 25, the normal operation mode M0 may include the control device 9 controlling the operation of the first pump 31 (more specifically, the control device 9 inverter-controlling the first pump 31) so that coolant CL is supplied from the first tank 2 to the second tank 6.

[0143] As illustrated in FIG. 10 or FIG. 25, the normal operation mode M0 may include the control device 9 controlling the operation of the second pump 36 (more specifically, the control device 9 inverter-controlling the second pump 36) so that coolant CL is supplied from the second tank 6 to the first tank 2.

[0144] As illustrated in FIG. 25 or 26 , the control device 9 can execute the normal operation mode M0 and the supply mode M3 in parallel. In other words, while the normal operation mode M0 is being executed, the control device 9 can execute the supply mode M3 in which the coolant CL is supplied to the processing machine 101 using the supply device 7. As illustrated in FIG. 25 , executing the normal operation mode M0 and the supply mode M3 in parallel may include the control device 9 changing the first valve V1-1 disposed in the first supply line Q1-1 from a closed state to an open state while the normal operation mode M0 is being executed. As illustrated in FIG. 25 , executing the normal operation mode M0 and the supply mode M3 in parallel may include the control device 9 changing the second valve V1-2 disposed in the second supply line Q1-2 from a closed state to an open state while the normal operation mode M0 is being executed. As illustrated in FIG. 26, executing the normal operation mode M0 and the supply mode M3 in parallel may include the control device 9 changing the third valve V1-3 disposed in the third supply line Q1-3 from a closed state to an open state while the normal operation mode M0 is being executed.

[0145] 25, the control device 9 controls the operation of the third pump 71 while the normal operation mode M0 is being executed, so that the third pump 71 supplies coolant CL to the processing machine 101 (for example, the first discharge device 105a that discharges coolant CL onto the workpiece and / or the second discharge device 105b that discharges coolant CL into the inside of the tool). Also, in the example shown in FIG. 25, while the normal operation mode M0 is being executed, used coolant CL2 is returned to the first tank 2 from the processing machine 101 via the return flow path R1. In the example shown in FIG. 25, while the supply mode M3 is being executed, foreign matter is removed from the coolant CL by the inline filter 55 arranged in the supply line Q1.

[0146] 26, the control device 9 controls the operation of the second pump 36 while the normal operation mode M0 is being executed, so that the second pump 36 supplies the coolant CL to the processing machine 101 (for example, the third discharge device 105c that discharges the coolant CL onto the cover 108 of the processing machine 101). Also, in the example shown in FIG. 26, while the normal operation mode M0 is being executed, used coolant CL2 is returned from the processing machine 101 to the first tank 2 via the return flow path R1.

[0147] The normal operation mode M0 may include circulating the coolant CL through the second circulation flow path C2. In the example shown in Fig. 25 or 26, during execution of the normal operation mode M0, foreign matter is removed from the coolant CL by the cyclone filter 51 disposed in the second circulation flow path C2 (more specifically, the third flow path FP3).

[0148] (First control mode M1) The control device 9 controls the adjustment device 3 to execute the first control mode M1.

[0149] As illustrated in Figures 2, 4, 7, 11, or 27, the first control mode M1 includes lowering the liquid level LA of the coolant CL in the first tank 2 using the regulating device 3 (e.g., the first pump 31 and / or the valve 32).

[0150] As illustrated in Figures 2, 4, 5, 8, 12, or 28, the first control mode M1 includes stirring the coolant CL in the first tank 2 by the stirring device 4 (e.g., the stirring nozzle 41 and / or the screw 43) while the liquid level LA of the coolant CL in the first tank 2 is lowered.

[0151] The first control mode M1 may include the control device 9 controlling the adjusting device 3 (e.g., the first pump 31 and / or the valve 32) and the agitating device 4 (e.g., the agitating nozzle 41 and / or the screw 43) so that the coolant CL in the first tank 2 is agitated by the agitating device 4 (e.g., the agitating nozzle 41 and / or the screw 43) while the liquid level LA of the coolant CL in the first tank 2 is lowered. The control device 9 controlling the agitating device 4 may be performed by the control device 9 controlling the operation of at least one pump (e.g., the second pump 36 and / or a pump P other than the second pump 36 (see FIG. 28)) that supplies the coolant CL to the agitating nozzle 41. Alternatively, or additionally, the control device 9 controlling the agitating device 4 may be performed by the control device 9 controlling a motor 44 (see FIG. 4 or 5) that rotates the screw 43.

[0152] As illustrated in Figures 8, 12, or 28, the first control mode M1 may include the control device 9 controlling the operation of at least one pump (e.g., the second pump 36 and / or a pump P other than the second pump 36 (see Figure 28)) that supplies coolant CL to the agitation nozzle 41 so that the coolant CL is released from the agitation nozzle 41 into the first tank 2 when the liquid level LA in the first tank 2 is lowered.

[0153] Alternatively, the agitator 4 (e.g., the agitator nozzle 41 and / or the screw 43) may not be under the control of the controller 9. For example, the agitator 4 (e.g., the agitator nozzle 41 and / or the screw 43) may be operated at all times.

[0154] 2, 4, 7, 8, 11, 12, 17, 19, 20, 27, or 28, the first control mode M1 may include collecting foreign matter using the foreign matter removal device 5 while stirring the coolant CL in the first tank 2 with the stirring device 4. In this case, the foreign matter can be collected using the foreign matter removal device 5 while dispersing the foreign matter in the coolant CL by lowering the liquid level LA in the first tank 2 and stirring the coolant CL in the first tank 2. This reduces the amount of foreign matter remaining in the first tank 2 without being removed by the foreign matter removal device 5, allowing for efficient collection of the foreign matter.

[0155] 8, 12, or 28, the first control mode M1 may include removing foreign matter from the coolant CL using the foreign matter removal device 5 (e.g., cyclone filter 51, etc.) in a state where the liquid level LA in the first tank 2 is lowered. More specifically, in a state where the liquid level LA in the first tank 2 is lowered, the agitation of the coolant CL by the agitation device 4 and the removal of foreign matter by the foreign matter removal device 5 (e.g., cyclone filter 51, etc.) may be performed simultaneously.

[0156] 5, stirring of the coolant CL in the first tank 2 by the stirring device 4 while the liquid level LA in the first tank 2 is lowered may be performed when foreign matter is not being removed by the foreign matter removal device 5. In this case, when the liquid level LA in the first tank 2 is raised (or after the liquid level LA in the first tank 2 has been raised), foreign matter is removed from the coolant CL using the foreign matter removal device 5.

[0157] 2, 4, 8, 12, or 28, the first control mode M1 may include circulating the coolant CL between the first tank 2 and the second tank 6 while the liquid level LA in the first tank 2 is lowered. By circulating the coolant CL while the liquid level LA is lowered, the size of the stagnation region where stirring by the stirrer 4 becomes insufficient is further reduced.

[0158] As illustrated in Figures 8, 12, or 28, the first control mode M1 may include circulating coolant CL between the first tank 2 and the second tank 6 by driving the first pump 31 and the second pump 36 while the liquid level LA in the first tank 2 is lowered.

[0159] The first control mode M1 may include circulating the coolant CL through the second circulation flow path C2. In the example shown in Fig. 12 or 28, during execution of the first control mode M1, foreign matter is removed from the coolant CL by the cyclone filter 51 disposed in the second circulation flow path C2 (more specifically, the third flow path FP3).

[0160] The first control mode M1 may include a first process M1-1 (see Figure 7, Figure 11, or Figure 27) of lowering the liquid level LA in the first tank 2 using an adjustment device 3 (e.g., a first pump 31 and / or a valve 32), and a second process M1-2 (see Figure 8, Figure 12, or Figure 28) of stirring the coolant CL in the first tank 2 using an stirring device 4 while the liquid level LA in the first tank 2 is lowered.

[0161] The first process M1-1 (see FIG. 7, FIG. 11, or FIG. 27) may include the control device 9 strengthening the operation of the first pump 31 so as to increase the amount of coolant CL extracted from the first tank 2 per unit time. More specifically, the first process M1-1 may include the control device 9 increasing the rotation speed of the first motor 31m of the first pump 31 so as to increase the amount of coolant CL extracted from the first tank 2 per unit time.

[0162] In the first control mode M1 (more specifically, the first process M1-1), the liquid level LA in the first tank 2 may be lowered while both the first pump 31 and the second pump 36 are driven.

[0163] In this specification, the flow rate of the coolant CL supplied from the first tank 2 to the second tank 6 per unit time is defined as a first flow rate AM1, and the flow rate of the coolant CL supplied from the second tank 6 to the first tank 2 per unit time is defined as a second flow rate AM2. As illustrated in Figure 7, Figure 11, or Figure 27, the first process M1-1 may include the control device 9 driving both the first pump 31 and the second pump 36 so that the first flow rate AM1 is greater than the second flow rate AM2.

[0164] 7, 11, or 27, the first control mode M1 (more specifically, the first process M1-1) may include the control device 9 controlling the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) so that the liquid level LA in the first tank 2 is forcibly lowered to the target value E1 stored in the memory 92. More specifically, the first control mode M1 (more specifically, the first process M1-1) includes the control device 9 controlling the adjusting device 3 (e.g., the first pump 31 and / or the second pump 36) based on the first signal SA received from the first liquid level sensor 25 so that the liquid level LA in the first tank 2 is forcibly lowered to the target value E1 stored in the memory 92.

[0165] As illustrated in FIG. 7, FIG. 11, or FIG. 27, the first control mode M1 (more specifically, the first process M1-1) may include raising the liquid level LB in the second tank 6.

[0166] As illustrated in FIG. 11 or FIG. 27, the first control mode M1 (more specifically, the first process M1-1) may include changing the upper limit of the liquid level LB of the second tank 6 from the second upper limit threshold TH2 (more specifically, the second upper limit threshold TH2 stored in the memory 92) to a third upper limit threshold TH3 (more specifically, the third upper limit threshold TH3 stored in the memory 92) that is greater than the second upper limit threshold TH2. Raising the upper limit of the liquid level LB of the second tank 6 makes it possible to utilize the buffer space BS described above. In other words, during execution of the first control mode M1 (more specifically, the first process M1-1), the second tank 6 can receive the coolant CL discharged from the first tank 2 as long as the amount of coolant does not exceed the third upper limit threshold TH3.

[0167] As illustrated in Figure 11 or Figure 27, the first control mode M1 (more specifically, the first process M1-1) may include controlling the adjustment device 3 (e.g., controlling the operation of the first pump 31) so that the liquid level LB of the second tank 6 rises above the second upper limit threshold TH2.

[0168] The first process M1-1 and the stirring of the coolant CL in the first tank 2 by the stirring device 4 may be performed in parallel. The first process M1-1 and the circulating of the coolant CL through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2) may be performed in parallel.

[0169] 27 and 28, the control device 9 may execute the first control mode M1 (more specifically, the first process M1-1 and / or the second process M1-2) and the above-mentioned supply mode M3 in parallel. If the control device 9 can execute the first control mode M1 and the supply mode M3 in parallel, it is not necessary to interrupt the supply of coolant CL to the processing machine 101 in order to execute the first control mode M1.

[0170] As illustrated in FIG. 31, the control device 9 may execute the first control mode M1 (more specifically, the first process M1-1 and / or the second process M1-2) when the above-mentioned supply mode M3 is not executed.

[0171] 8, 12, 17, or 28, the second process M1-2 may be performed with both the first pump 31 and the second pump 36 driven. More specifically, the second process M1-2 may include, with the liquid level LA in the first tank 2 lowered, stirring the coolant CL in the first tank 2 with the stirring device 4, supplying the coolant CL from the first tank 2 to the second tank 6 with the first pump 31, supplying the coolant CL from the second tank 6 to the first tank 2 with the second pump 36, and removing foreign matter from the coolant CL with the foreign matter removal device 5 (e.g., cyclone filter 51, second cyclone filter 52, etc.).

[0172] 12 or 28, the second process M1-2 may be performed with the fourth pump 69 driven. The second process M1-2 may also include removing foreign matter from the coolant CL flowing through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2) using a foreign matter removal device 5 (e.g., a cyclone filter 51, etc.).

[0173] As illustrated in FIG. 12 or FIG. 28, during execution of the second process M1-2, the control device 9 may maintain the upper limit of the liquid level LB of the second tank 6 at the above-mentioned third upper limit threshold TH3.

[0174] The first control mode M1 may include continuously performing the second process M1-2 (in other words, a process of stirring the coolant CL in the first tank 2 by the stirring device 4 while the liquid level LA in the first tank 2 is lowered) for a predetermined period of time.

[0175] For example, the first control mode M1 may include continuously performing the second process M1-2 for one minute or more. The first control mode M1 may include continuously performing the second process M1-2 for a period ranging from one minute to 60 minutes, or from one minute to 30 minutes. The first control mode M1 may include continuously performing the second process M1-2 for a period ranging from two minutes to 30 minutes, or from two minutes to 15 minutes.

[0176] 12 or 28, the second process M1-2 may be performed in a state in which the liquid level LA in the first tank 2 is substantially maintained at the target value E1. Alternatively, in the second process M1-2, fluctuations in the liquid level LA in the first tank 2 may be permitted. For example, the liquid level LA in the first tank 2 may fluctuate due to the used coolant CL2 being returned to the first tank 2 from the processing machine 101 via the return flow path R1. If the liquid level LA in the first tank 2 exceeds a predetermined value due to the used coolant CL2 being returned to the first tank 2 during the execution of the second process M1-2, the control device 9 may perform the first process M1-1 again.

[0177] (Second control mode M2) In the examples described in Figures 9, 13, or 29, the control device 9 can execute a second control mode M2 that uses the adjustment device 3 (e.g., the first pump 31 and / or the second pump 36) to increase the liquid level LA in the first tank 2.

[0178] The second control mode M2 (see FIG. 9, FIG. 13, or FIG. 29) may include the control device 9 strengthening the operation of the second pump 36 so as to increase the amount of coolant CL extracted from the second tank 6 per unit time. More specifically, the second control mode M2 may include the control device 9 increasing the rotation speed of the second motor 36m of the second pump 36 so as to increase the amount of coolant CL extracted from the second tank 6 per unit time.

[0179] In the second control mode M2, the liquid level LA in the first tank 2 may be increased with both the first pump 31 and the second pump 36 being driven.

[0180] As illustrated in Figures 9, 13, or 29, the second control mode M2 may include the control device 9 driving both the first pump 31 and the second pump 36 so that the above-mentioned second flow rate AM2 is greater than the above-mentioned first flow rate AM1.

[0181] In this specification, a state in which the liquid level LA in the first tank 2 is lowered by executing the above-described first control mode M1 is defined as a first state J1. In this specification, a state in which the liquid level LA in the first tank 2 is raised by executing the above-described second control mode M2 is defined as a normal state J0. In the examples shown in FIG. 2, FIG. 4, FIG. 8, FIG. 12, or FIG. 28, the state of the first tank 2 is changed from the normal state J0 to the first state J1 (in other words, the liquid level lowered state) by executing the first control mode M1. On the other hand, the state of the first tank 2 is changed from the first state J1 (in other words, the liquid level lowered state) to the normal state J0 (see FIGS. 1, 3, 6, 14, and 30) by executing the second control mode M2.

[0182] 13 or 29, the second control mode M2 may include changing the upper limit of the liquid level LB of the second tank 6 from the above-mentioned third upper limit threshold TH3 to a second upper limit threshold TH2 that is smaller than the third upper limit threshold TH3. By lowering the upper limit of the liquid level LB of the second tank 6, the use of the above-mentioned buffer space BS is discontinued.

[0183] The second control mode M2 may include circulating the coolant CL through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2). In the example shown in FIG. 13 or FIG. 29, during execution of the second control mode M2, foreign matter is removed from the coolant CL by a cyclone filter 51 disposed in the second circulation flow path C2 (more specifically, the third flow path FP3). The second control mode M2 and stirring the coolant CL in the first tank 2 by the stirrer 4 may be executed in parallel.

[0184] 29, the control device 9 may execute the second control mode M2 and the above-described supply mode M3 in parallel. If the control device 9 can execute the second control mode M2 and the above-described supply mode M3 in parallel, it is not necessary to interrupt the supply of coolant CL to the processing machine 101 in order to execute the second control mode M2.

[0185] The control device 9 may execute the second control mode M2 when the above-mentioned supply mode M3 is not executed.

[0186] 14 or 30, the control device 9 executes the above-mentioned normal operation mode M0 after executing the second control mode M2 (more specifically, after the liquid level LB of the second tank 6 becomes lower than the second upper limit threshold TH2). Since the normal operation mode M0 has already been explained, a repeated explanation of the normal operation mode M0 will be omitted.

[0187] The control device 9 may sequentially execute the normal operation mode M0, the first control mode M1, the second control mode M2, and the normal operation mode M0 in this order.

[0188] Execution of the first control mode M1 may be started in response to the control device 9 receiving a request from the user while the normal operation mode M0 is being executed. In the example shown in FIG. 32, in response to the user selecting execution of the first control mode M1, the control device 9 switches the operation mode (i.e., the operation mode of the coolant system) from the normal operation mode M0 to the first control mode M1. More specifically, in response to the operation (i.e., the operation mode of the coolant system) being performed by operating (e.g., pressing or clicking) a first button BN1 (e.g., an EcoTank cleaning button) of the control device 9, the control device 9 switches the operation mode (i.e., the operation mode of the coolant system) from the normal operation mode M0 to the first control mode M1. After executing the first control mode M1, the control device 9 executes the second control mode M2 and the normal operation mode M0. This allows automatic execution of the normal operation mode, the first control mode M1, the second control mode M2, and the normal operation mode M0, simply by operating the first button BN1 (e.g., the EcoTank cleaning button) without having to select various modes. The first button BN1 may be a hard button or a soft button on the display 97.

[0189] Alternatively, or additionally, the control device 9 may start the execution of the first control mode M1 at a pre-specified timing. For example, the memory 92 (see FIG. 24) may store a designated timing DT1 indicating the timing at which the execution of the first control mode M1 starts. The designated timing DT1 may be specified in the form of a time or a countdown. The control device 9 switches the operation mode (i.e., the operation mode of the coolant system) from the normal operation mode M0 to the first control mode M1 based on the designated timing DT1 stored in the memory 92. After executing the first control mode M1, the control device 9 executes the second control mode M2 and the normal operation mode M0.

[0190] 33, the control device 9 may display on the display 97 an input field IN1 that accepts input of a designated timing DT1 that indicates the timing at which execution of the first control mode M1 begins. The control device 9 may display on the display 97 a selection field IN2 for selecting whether or not to execute the first control mode M1 at predetermined time intervals. If execution of the first control mode M1 at predetermined time intervals is selected, the control device 9 executes the first control mode M1 at predetermined time intervals. After execution of the first control mode M1, the control device 9 executes the second control mode M2 and the normal operation mode M0.

[0191] Alternatively, or additionally, the control device 9 may start the execution of the first control mode M1 based on the usage amount of the processing machine 101.

[0192] For example, the control device 9 derives a cumulative value DT2 of the volume removed from the workpiece by cutting by monitoring the execution of the machining program PG, and the memory 92 stores the cumulative value DT2 (see FIG. 24). As illustrated in FIG. 34, the display 97 may be capable of displaying the cumulative value DT2.

[0193] The control device 9 may start executing the first control mode M1 in response to the cumulative value DT2 of the volume removed from the workpiece by cutting exceeding a preset threshold value DT3 (more specifically, the threshold value DT3 stored in the memory 92). After executing the first control mode M1, the control device 9 executes the second control mode M2 and the normal operation mode M0. Furthermore, after executing the first control mode M1, the control device 9 resets the cumulative value DT2 (in other words, returns the cumulative value DT2 to zero).

[0194] 32 to 34, the control device 9 starts executing the first control mode M1 based on at least one of a user request, a pre-specified timing, and the usage amount of the processing machine. More specifically, the control device 9 switches the operation mode (i.e., the operation mode of the coolant system) from the normal operation mode M0 to the first control mode M1 based on at least one of a user request, a pre-specified timing, and the usage amount of the processing machine. The control device 9 can automatically switch to the first control mode M1 depending on the operating status of the coolant system.

[0195] (Backwash mode M4) In the example shown in FIG. 35, the control device 9 can execute a backwash mode M4 in which the first removal device 81 (more specifically, the drum filter 81b (see FIG. 22)) is cleaned using the coolant CL. In the example shown in FIG. 35, the backwash mode M4 includes using the second pump 36 to supply the coolant CL to the first removal device 81 (more specifically, the drum filter 81b).

[0196] In the example shown in Figure 35, the coolant suction port of the second pump 36 is located in the second storage chamber 62, so that the second pump 36 can supply highly clean coolant CL to the first removal device 81 (more specifically, the drum filter 81b).

[0197] The backwash mode M4 and the above-described normal operation mode M0 may be executed in parallel. The backwash mode M4 and the stirring of the coolant CL in the first tank 2 by the stirring device 4 may be executed in parallel. The backwash mode M4 and the circulating of the coolant CL through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2) may be executed in parallel.

[0198] (Coolant CL) The coolant CL is, for example, a water-soluble coolant liquid. The main component of the water-soluble coolant liquid is, for example, water. The water-soluble coolant liquid may contain a water-soluble oil (for example, a water-soluble cutting oil or a water-soluble grinding oil) and / or a surfactant.

[0199] (Third embodiment) A processing system 100 in the third embodiment will be described with reference to Figs. 1 to 39. Figs. 19, 20, 25 to 31, and 35 are diagrams that schematically show the processing system 100. Fig. 36 is a schematic perspective view that schematically shows a first example of the processing machine 101. Fig. 37 is a schematic perspective view that schematically shows a second example of the processing machine 101. Fig. 38 is a schematic perspective view that schematically shows a third example of the processing machine 101. Fig. 39 is a diagram that schematically shows an example in which the processing system 100 includes multiple processing machines (101, 110).

[0200] In the third embodiment, differences from the first and second embodiments will be mainly described. On the other hand, in the third embodiment, repeated descriptions of matters already described in the first or second embodiment will be omitted. Therefore, it goes without saying that matters already described in the first or second embodiment can be applied to the third embodiment, even if they are not explicitly described in the third embodiment. Conversely, matters described in the third embodiment can also be adopted in the first and second embodiments.

[0201] As illustrated in FIG. 19 or 20, a processing system 100 according to the third embodiment includes a processing machine 101 and a coolant system 1 that supplies coolant CL to the processing machine 101.

[0202] As illustrated in Figure 36, the processing machine 101 includes a work support device 102 that supports the workpiece W, a processing head 103 that holds the tool T, a moving device 104 that moves the processing head 103 relative to the work support device 102, and an ejection device 105 that ejects coolant CL.

[0203] The processing machine 101 may include a first rotation device 106 that rotates the tool T about the longitudinal axis of the tool T. Alternatively, or additionally, as illustrated in FIG. 37 , the processing machine 101 may include a second rotation device 107 that rotates the workpiece W.

[0204] As illustrated in Fig. 36, the processing machine 101 may be a machining center 101a. Alternatively, as illustrated in Fig. 37, the processing machine 101 may be a lathe 101b. Still alternatively, as illustrated in Fig. 38, the processing machine 101 may be a grinding machine 101c.

[0205] 19 or 20, the processing machine 101 may be provided with a cover 108 that encloses the processing area. The cover 108 may include a wall 108a and a door 108b that opens and closes an opening formed in the wall 108a.

[0206] As illustrated in Figure 19 or Figure 20, the coolant system 1 includes (1) a first tank 2 for storing coolant CL, (2) an adjustment device 3 for adjusting the liquid level of the coolant CL in the first tank 2, (3) an agitation device 4 for agitating the coolant CL in the first tank 2, (4) a foreign matter removal device 5 for removing foreign matter from the coolant CL, (5) a supply device 7 for supplying the coolant CL to the processing machine 101, and (6) a control device 9.

[0207] The coolant system 1 may be the coolant system 1A in the first embodiment, the coolant system 1B in the second embodiment, or another coolant system. The coolant system has already been described in the first or second embodiment, so repeated description of the coolant system will be omitted.

[0208] 2, 4, 7, 11, or 27, the control device 9 can execute the first control mode M1 by controlling the adjustment device 3. The first control mode M1 is a mode in which the adjustment device 3 is used to lower the liquid level LA in the first tank 2, and then the coolant CL in the first tank 2 is stirred by the stirring device 4. The first control mode M1 has already been described in the first or second embodiment, so a repeated description of the first control mode M1 will be omitted.

[0209] 19, 20, 25 to 30, the control device 9 can execute a supply mode M3 in which coolant CL is supplied to the processing machine 101 by controlling the supply device 7. Since the supply mode M3 has already been described in the second embodiment, a repeated description of the supply mode M3 will be omitted.

[0210] The machining system 100 of the third embodiment achieves the same effects as the coolant system 1A of the first embodiment or the coolant system 1B of the second embodiment. In addition, in the third embodiment, the cleanliness of the coolant CL can be appropriately maintained, so that the processing machine 101 to which the coolant CL is supplied is also maintained in an appropriate state. For example, contamination of the processing machine 101 caused by foreign matter mixed in the coolant CL and tool wear caused by foreign matter mixed in the coolant CL are suppressed.

[0211] Furthermore, since the cleanliness of the coolant CL is maintained appropriately, the frequency of replacing the coolant CL can be reduced, thereby reducing the cost of replacing the coolant CL and the burden on the environment.

[0212] (Optional configuration) Next, optional additional configurations that can be employed in the processing system 100 in the third embodiment will be described with reference to FIGS.

[0213] (Discharge device 105) 36 or 37, the discharge device 105 may include a first discharge device 105a that discharges coolant liquid toward the workpiece W. As illustrated in FIG. 19, the coolant CL may be supplied to the first discharge device 105a from the second tank 6 (more specifically, the second storage chamber 62) via a first supply pipe Q1-1. Alternatively, as illustrated in FIG. 20, the coolant CL may be supplied to the first discharge device 105a from the first tank 2.

[0214] 36 or 38, the discharge device 105 may include a second discharge device 105b that discharges the coolant CL into the inside of the tool T. As illustrated in FIG. 19, the coolant CL may be supplied to the second discharge device 105b from the second tank 6 (more specifically, the second storage chamber 62) via a second supply pipe line Q1-2.

[0215] 19, the discharge device 105 may include a third discharge device 105c that discharges the coolant CL into a cover 108 (more specifically, a first portion of the cover 108) that surrounds the machining area of the processing machine 101. As illustrated in FIG. 19, the coolant CL may be supplied to the third discharge device 105c from the second tank 6 (more specifically, the second storage chamber 62) via a third supply pipe line Q1-3.

[0216] 19, the discharge device 105 may include a fourth discharge device 105d that discharges the coolant CL onto a second portion of a cover 108 that surrounds the machining area of the processing machine 101. As illustrated in Fig. 19, the coolant CL may be supplied to the fourth discharge device 105d from the second tank 6 (more specifically, the second storage chamber 62) via a fourth supply pipe Q1-4.

[0217] (Multiple processing machines 101) As illustrated in Fig. 39, the processing system 100 may include a second processing machine 110 in addition to the processing machine 101. In the example illustrated in Fig. 39, the coolant system 1 supplies coolant to multiple processing machines (101, 110).

[0218] In the example shown in Figure 39, the coolant system 1 has a return flow path R1 that returns used coolant CL2 from the processing machine 101 to the first tank 2, as well as a second return flow path R2 that returns used coolant CL2 from the second processing machine 110 to the first tank 2.

[0219] (Foreign object removal method) A foreign matter removal method according to an embodiment will be described with reference to Figures 1 to 41. Figures 40 and 41 are flowcharts showing an example of a foreign matter removal method according to an embodiment.

[0220] The foreign matter removal method in the embodiment may be performed using the coolant system 1A in the first embodiment, the coolant system 1B in the second embodiment, or another coolant system. The coolant system has already been described in the first embodiment or the second embodiment, so repeated description of the coolant system will be omitted.

[0221] The foreign matter removal method in the embodiment may be performed using the processing system 100 in the third embodiment, or may be performed using another processing system. The processing system has already been described in the third embodiment, so repeated description of the processing system will be omitted.

[0222] The foreign matter removal method in this embodiment includes the steps of: (1) removing foreign matter from the coolant CL using a foreign matter removal device 5 while circulating the coolant CL through at least one circulation flow path C that leaves the first tank 2 and returns to the first tank 2 (see, for example, Figure 25); (2) lowering the liquid level LA of the coolant CL in the first tank 2 (see, for example, Figure 27); (3) stirring the coolant CL in the first tank 2 using a stirring device 4 while the liquid level LA of the coolant CL in the first tank 2 is lowered (see, for example, Figure 28); (4) raising the liquid level LA of the coolant CL in the first tank 2 (see, for example, Figure 29); and (5) removing foreign matter from the coolant CL using the foreign matter removal device 5 while circulating the coolant CL through at least one circulation flow path C while the liquid level LA of the coolant CL in the first tank 2 is raised (see, for example, Figure 30).

[0223] In the foreign matter removal method according to the embodiment, the coolant CL in the first tank 2 is agitated while the liquid level LA is lowered, thereby reducing stagnation in the first tank 2. Furthermore, the reduction in stagnation can be achieved with relatively little energy. Furthermore, the lowering of the liquid level LA changes the velocity distribution of the coolant CL in the first tank 2, thereby shifting the position of the stagnation region RG1. Thus, foreign matter such as sludge D2 that has accumulated in the stagnation region RG1 disperses into the coolant CL. The foreign matter dispersed into the coolant CL is removed by the foreign matter removal device 5.

[0224] As described above, the foreign matter removal method according to the embodiment can effectively remove foreign matter from the coolant CL. Furthermore, since the foreign matter is effectively removed, the cleanliness of the coolant CL can be appropriately maintained.

[0225] (Optional configuration) Next, optional additional configurations that can be employed in the foreign matter removal method according to the embodiment will be described with reference to FIGS.

[0226] As illustrated in Figures 1, 3, 6, 10, or 25, in a first step ST1, foreign matter is removed from the coolant CL using a foreign matter removal device 5. The first step ST1 is a first removal process. The first removal process (first step ST1) includes removing foreign matter from the coolant CL using the foreign matter removal device 5 (e.g., a cyclone filter, an in-line filter, a drum filter, etc.) while circulating the coolant CL through at least one circulation flow path C that leaves the first tank 2 and returns to the first tank 2.

[0227] At least one circulation flow path C takes out the coolant CL from the first tank 2 and returns the coolant CL to the first tank 2. In the example shown in FIG. 10 or FIG. 25 , the first removal process (first step ST1) includes removing foreign matter from the coolant CL using a cyclone filter 51 arranged in the at least one circulation flow path C while circulating the coolant CL through the at least one circulation flow path C.

[0228] The first removal step (first step ST1) may include circulating the coolant CL between the first tank 2 and the second tank 6. In other words, as illustrated in FIG. 10 or FIG. 25, at least one circulation flow path C may include a first circulation flow path C1 that passes through the second tank 6. Furthermore, the first removal step (first step ST1) may include removing foreign matter from the coolant CL using a foreign matter removal device 5 (e.g., a cyclone filter, an in-line filter, a drum filter, or the like) while circulating the coolant CL through the first circulation flow path C1 that passes through the second tank 6.

[0229] 10 or 25, the at least one circulation flow path C may include a second circulation flow path C2 that passes through at least two flow paths (FP1, FP2) connecting the first tank 2 and the second tank 6 and a flow path (FP3) that leaves the second tank 6 and returns to the second tank 6. The first removal step (first step ST1) may include removing foreign matter from the coolant CL using a foreign matter removal device 5 (e.g., a cyclone filter, an in-line filter, a drum filter, etc.) while circulating the coolant CL through the second circulation flow path C2.

[0230] 25, at least one circulation flow path C may include a supply pipe Q1 that supplies coolant CL to the processing machine 101, a third circulation flow path C3 that passes through the processing machine 101 and a return flow path R1 that returns the coolant CL from the processing machine 101 to the first tank 2. Furthermore, the first removal process (first step ST1) may include removing foreign matter from the coolant CL using a foreign matter removal device 5 (for example, a cyclone filter, an in-line filter, a drum filter, or the like) while circulating the coolant CL through the third circulation flow path C3.

[0231] 10 or 25, the first removal process (first step ST1) may be performed in a state in which the liquid level LA in the first tank 2 is maintained at or above a first lower threshold TL1 and at or below a first upper threshold TH1. Maintaining the liquid level LA in the first tank 2 at or above the first lower threshold TL1 and at or below the first upper threshold TH1 may be performed by the control device 9 controlling (more specifically, inverter controlling) the adjustment device 3 (e.g., multiple pumps including the first pump 31 and the second pump 36) based on the first signal SA from the first liquid level sensor 25.

[0232] As illustrated in Figure 10 or Figure 25, the first removal process (first step ST1) may be performed in a state where the coolant CL in the first tank 2 is stirred using a stirring device 4 (e.g., a stirring nozzle 41, a screw 43).

[0233] 10 or 25, the first removal process (first step ST1) may be performed in a state in which the liquid level LB in the second tank 6 is maintained at or above a second lower threshold TL2 and at or below a second upper threshold TH2. Maintaining the liquid level LB in the second tank 6 at or above the second lower threshold TL2 and at or below the second upper threshold TH2 may be performed by the control device 9 controlling (more specifically, inverter controlling) the adjustment device 3 (e.g., a plurality of pumps including the first pump 31 and the second pump 36) based on the second signal SB from the second liquid level sensor 65. Maintaining the liquid level LB in the second tank 6 at or below the second upper threshold TH2 ensures a buffer space BS in the second tank 6.

[0234] As illustrated in FIG. 25 or 26 , the first removal process (first step ST1) may be performed in a state where coolant CL is being supplied from the first tank 2 or the second tank 6 to the processing machine 101. For example, the first removal process (first step ST1) may be performed in a state where coolant CL is being supplied from the first tank 2 or the second tank 6 to the workpiece W being machined by the tool T. Alternatively, or additionally, the first removal process (first step ST1) may be performed in a state where coolant CL is being supplied from the first tank 2 or the second tank 6 to the inside of the tool T. Alternatively, or additionally, the first removal process (first step ST1) may be performed in a state where coolant CL is being supplied from the first tank 2 or the second tank 6 to the cover 108 of the processing machine 101.

[0235] The first removal step (first step ST1) may include execution of the normal operation mode M0 by the control device 9. The normal operation mode M0 has already been described in the second embodiment, so a repeated description of the normal operation mode M0 will be omitted.

[0236] In the second step ST2, the liquid level LA of the coolant CL in the first tank 2 is lowered. The second step ST2 is a liquid level lowering step.

[0237] As illustrated in FIG. 41, the liquid level lowering step (second step ST2) may be started based on at least one of a request from a user, a pre-specified timing, and the usage amount of the processing machine 101.

[0238] For example, the liquid level lowering process (second step ST2) may be started in response to the control device 9 receiving a request from the user while foreign matter is being removed from the coolant CL using the foreign matter removal device 5 (more specifically, while the first step ST1 is being performed). In the example shown in Fig. 32, the liquid level lowering process (second step ST2) is started in response to the first button BN1 (e.g., EcoTank cleaning button) of the control device 9 being operated (e.g., pressed or clicked).

[0239] For example, the liquid level lowering process (second step ST2) may be started at a designated timing DT1 stored in the memory 92 of the control device 9. The foreign matter removal method in the embodiment may include a step of receiving, from a user, input of the designated timing DT1 indicating the timing at which the liquid level lowering process (second step ST2) is to be started (see FIG. 33). The designated timing DT1 may be in the form of a time or a countdown. The liquid level lowering process (second step ST2) may be started at predetermined time intervals. In other words, in the foreign matter removal method in the embodiment, the designated timing DT1 may be set to occur at predetermined time intervals (see selection box IN2 in FIG. 33).

[0240] For example, the liquid level lowering process (second step ST2) may be started based on the cumulative value DT2 of the volume removed by cutting from the workpiece W. More specifically, the liquid level lowering process (second step ST2) may be started in response to the cumulative value DT2 of the volume removed by cutting from the workpiece W exceeding a preset threshold value DT3 (more specifically, the threshold value DT3 stored in the memory 92).

[0241] As illustrated in Figures 7, 11, 27, or 41, the liquid level lowering process (second step ST2) may include lowering the liquid level LA in the first tank 2 to a predetermined target value E1 (more specifically, the target value E1 stored in the memory 92 of the control device 9).

[0242] As illustrated in Figures 7, 11, or 27, the liquid level lowering process (second step ST2) may include raising the liquid level LB in the second tank 6 by supplying coolant CL from the first tank 2 to the second tank 6.

[0243] As illustrated in FIG. 7, FIG. 11, or FIG. 27, the liquid level lowering step (second step ST2) may be performed in a state where both the first pump 31 and the second pump 36 are driven.

[0244] As illustrated in Figures 11, 27, or 41, the liquid level lowering process (second step ST2) may include changing the upper limit value of the liquid level LB in the second tank 6 from the second upper limit threshold TH2 (more specifically, the second upper limit threshold TH2 stored in memory 92) to a third upper limit threshold TH3 (more specifically, the third upper limit threshold TH3 stored in memory 92) that is greater than the second upper limit threshold TH2, and then raising the liquid level LB in the second tank 6 by supplying coolant CL from the first tank 2 to the second tank 6.

[0245] 11 or 27, the liquid level lowering step (second step ST2) may be performed in parallel with stirring the coolant CL in the first tank 2 by the stirring device 4 (e.g., stirring nozzle 41, screw 43). The liquid level lowering step (second step ST2) may be performed in parallel with circulating the coolant CL through at least one circulation flow path C (e.g., first circulation flow path C1 and / or second circulation flow path C2).

[0246] 27, the liquid level lowering process (second step ST2) may be performed in a state where the coolant CL is being supplied to the processing machine 101 from the first tank 2 or the second tank 6. Alternatively, as illustrated in Fig. 31, the liquid level lowering process (second step ST2) may be performed in a state where the supply of the coolant CL to the processing machine 101 is stopped.

[0247] 8, 12, or 28, in a third step ST3, the coolant CL in the first tank 2 is stirred by the stirring device 4 (e.g., the stirring nozzle 41, the screw 43) while the liquid level LA of the coolant CL in the first tank 2 is lowered. The third step ST3 is an energy-saving stirring step.

[0248] The energy-saving stirring step (third step ST3) may be performed in a state where both the first pump 31 and the second pump 36 are driven. The energy-saving stirring step (third step ST3) may be performed in a state where the fourth pump 69 is driven.

[0249] 8, 12, or 28, the energy-saving stirring step (third step ST3) may be performed in parallel with removing foreign matter from the coolant CL using a foreign matter removal device 5 (e.g., a cyclone filter 51, a second cyclone filter 52, etc.). The energy-saving stirring step (third step ST3) may be performed in parallel with circulating the coolant CL through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2).

[0250] 28, the energy-saving stirring process (third step ST3) may be performed in a state where coolant CL is being supplied to the processing machine 101 from the first tank 2 or the second tank 6. Alternatively, the energy-saving stirring process (third step ST3) may be performed in a state where the supply of coolant CL to the processing machine 101 is stopped.

[0251] As illustrated in FIG. 12 or FIG. 28, the energy-saving stirring step (third step ST3) may include maintaining the upper limit of the liquid level LB of the second tank 6 at the above-mentioned third upper limit threshold TH3.

[0252] The energy-saving stirring process (in other words, the process of stirring the coolant CL in the first tank 2 by the stirring device 4 while the liquid level LA of the coolant CL in the first tank 2 is low) is continuously performed for a predetermined time. This process may be performed continuously for one minute or more. This process may be performed continuously for a range of one minute to 60 minutes, or for a range of one minute to 30 minutes. This process may be performed continuously for a range of two minutes to 30 minutes, or for a range of two minutes to 15 minutes. This allows foreign matter such as sludge D2 that has accumulated in the stagnation region RG1 to be dispersed within the first tank 2 without accumulating due to the stirring of the coolant CL.

[0253] As illustrated in FIG. 12 or FIG. 28, the energy-saving stirring process (in other words, a process of stirring the coolant CL in the first tank 2 by the stirring device 4 while the liquid level LA of the coolant CL in the first tank 2 is lowered) may be performed while the liquid level LA in the first tank 2 is substantially maintained at the target value E1. Alternatively, fluctuations in the liquid level LA in the first tank 2 may be permitted during this process. For example, the liquid level LA in the first tank 2 may fluctuate due to the used coolant CL2 being returned to the first tank 2 from the processing machine 101 via the return flow path R1. As illustrated in FIG. 41, if the liquid level LA in the first tank 2 exceeds a predetermined value due to the used coolant CL2 being returned to the first tank 2 during the execution of the energy-saving stirring process, the liquid level lowering process described above may be performed again.

[0254] As illustrated in Figure 12 or Figure 28, the energy-saving stirring process (in other words, a process of stirring the coolant CL in the first tank 2 by the stirring device 4 when the liquid level LA of the coolant CL in the first tank 2 has dropped) may include collecting foreign matter using a foreign matter removal device 5 while stirring the coolant CL in the first tank 2 by the stirring device 4.

[0255] After the third step ST3 is performed, in a fourth step ST4, the liquid level LA of the coolant CL in the first tank 2 is raised. The fourth step ST4 is a liquid level raising step.

[0256] As illustrated in Figures 9, 13, or 29, the liquid level raising process (fourth step ST4) may include raising the liquid level LA in the first tank 2 by supplying coolant CL from the second tank 6 to the first tank 2.

[0257] As illustrated in FIG. 9, FIG. 13, or FIG. 29, the liquid level raising step (fourth step ST4) may be performed in a state where both the first pump 31 and the second pump 36 are driven.

[0258] As illustrated in Figures 13, 29, or 41, the liquid level rising process (fourth step ST4) may include changing the upper limit value of the liquid level LB of the second tank 6 from the third upper limit threshold TH3 (more specifically, the third upper limit threshold TH3 stored in memory 92) to a second upper limit threshold TH2 (more specifically, the second upper limit threshold TH2 stored in memory 92) that is smaller than the third upper limit threshold TH3, and then supplying coolant CL from the second tank 6 to the first tank 2.

[0259] 13 or 29, the liquid level raising step (fourth step ST4) may be performed in parallel with stirring the coolant CL in the first tank 2 by the stirring device 4 (e.g., stirring nozzle 41, screw 43). The liquid level raising step (fourth step ST4) may be performed in parallel with circulating the coolant CL through at least one circulation flow path C (e.g., first circulation flow path C1 and / or second circulation flow path C2).

[0260] 29, the liquid level raising step (fourth step ST4) may be performed in a state where the coolant CL is being supplied to the processing machine 101 from the first tank 2 or the second tank 6. Alternatively, the liquid level raising step (fourth step ST4) may be performed in a state where the supply of the coolant CL to the processing machine 101 is stopped.

[0261] After the liquid level raising step (fourth step ST4) is performed, the designated timing DT1 designated in a countdown format may be reset. After the liquid level raising step (fourth step ST4) is performed, the cumulative value DT2 of the removed volume removed from the workpiece by cutting may be reset.

[0262] After the fourth step ST4 is performed, the process returns to the first step ST1. More specifically, as illustrated in Fig. 14 or 30, in a state where the liquid level LA of the coolant CL in the first tank 2 is raised, the coolant CL is circulated through at least one circulation flow path C (e.g., the first circulation flow path C1 and / or the second circulation flow path C2), and foreign matter is removed from the coolant CL using a foreign matter removal device 5 (e.g., a cyclone filter, an in-line filter, a drum filter, etc.).

[0263] The first step ST1 to the fourth step ST4 may be repeatedly executed.

[0264] (Program PM) The program PM in the embodiment is a program for causing the control device 9 (for example, at least one computer) to execute the foreign matter removal method in the embodiment.

[0265] More specifically, the program PM in the embodiment includes: (1) a step of removing foreign matter from the coolant CL using the foreign matter removal device 5 while circulating the coolant CL through at least one circulation flow path C that flows out of the first tank 2 and returns to the first tank 2 (the above-described first removal step: first step ST1); (2) a step of lowering the liquid level LA of the coolant CL in the first tank 2 (the above-described liquid level lowering step: second step ST2); and (3) a step of stirring the coolant CL in the first tank 2 by the agitation device 4 while the liquid level LA of the coolant CL in the first tank 2 is lowered. The program causes the control device 9 to execute the following steps: (4) agitating the coolant CL in the first tank 2 (the above-described energy-saving agitation step: third step ST3), (4) a step of raising the liquid level LA of the coolant CL in the first tank 2 (the above-described liquid level raising step: fourth step ST4), and (5) a step of removing foreign matter from the coolant CL using the foreign matter removal device 5 while circulating the coolant CL through at least one circulation flow path C in a state in which the liquid level LA of the coolant CL in the first tank 2 has been raised (the above-described first removal step performed after the above-described liquid level raising step: first step ST1). The first removal step, the liquid level lowering step, the energy-saving agitation step, the liquid level raising step, and the first removal step performed after the liquid level raising step have already been described in the foreign matter removal method of the embodiment, and therefore repeated description of these steps will be omitted.

[0266] The memory 92 mentioned in the second embodiment may be a nonvolatile storage medium on which the above-mentioned program PM is recorded. The nonvolatile storage medium on which the above-mentioned program PM is recorded may be a portable storage medium 92M, as exemplified in FIG.

[0267] The program PM in the embodiment is executed by the control device 9, thereby achieving the same effects as the foreign matter removal method in the embodiment.

[0268] The present invention is not limited to the above-described embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical concept of the present invention. Furthermore, various techniques used in each embodiment or modification can be applied to other embodiments or modifications as long as no technical contradiction occurs. Furthermore, optional additional configurations in each embodiment or modification can be omitted as appropriate. [Explanation of symbols]

[0269] 1, 1A, 1B...coolant system, 2...first tank, 2b...bottom wall, 3...regulating device, 4...agitating device, 5...foreign matter removal device, 5f...filter, 6...second tank, 7...supply device, 9...control device, 25...first liquid level sensor, 29...discharge pipe, 31...first pump, 31m...first motor, 32...valve, 36...second pump, 36m...second motor, 36p...coolant suction port, 41, 41b...agitating nozzle, 41u...upper end, 43...screw, 44...motor, 51, 52...cyclone filter, 55...inline filter, 61...first storage chamber, 61b...first bottom, 62...second 2 storage chamber, 62b... second bottom, 62u... upper part, 63... discharge port, 64... partition, 65... second liquid level sensor, 66... caster, 67... magnetic separator, 68... first container, 69... fourth pump, 71... third pump, 71m... third motor, 71p... coolant suction port, 81... first removal device, 81a... chip conveyor, 81b... drum filter, 83a... first pressure switch, 83b... second pressure switch, 90... processor, 92... memory, 92M... storage medium, 94... communication circuit, 96... input device, 96t... touch panel, 97... display, 98... bus, 1 00... processing system, 101... processing machine, 101a... machining center, 101b... lathe, 101c... grinding device, 102... work support device, 103... processing head, 104... moving device, 105... discharge device, 105a... first discharge device, 105b... second discharge device, 105c... third discharge device, 105d... fourth discharge device, 106... first rotation device, 107... second rotation device, 108... cover, 108a... wall, 108b... door, 110... second processing machine, 411... flow rate amplification nozzle, 411a... base end portion, 411b... discharge port, 411c... side wall, 411h... through hole portion, 611... bottom surface, 611c...inclined surface, 621...bottom surface, 621c...inclined surface, AM1...first flow rate, AM2...second flow rate, BN1...first button, BS...buffer space, C...circulation flow path, C1...first circulation flow path, C2...second circulation flow path, C3...third circulation flow path, CL...coolant, CL2...used coolant, D...dirty fluid, D1...chips, D2...sludge, DT1...specified timing, DT2...accumulated value, DT3...threshold value, E1...target value, F1...flow path through which coolant taken out from first tank flows, F2...flow path that supplies coolant to first tank, FP1...first flow path, FP2...second flow path,FP3...Third flow path, IN1...Input field, IN2...Selection field, J0...Normal state, J1...First state, LA...Liquid level, LA1...First level, LA2...Second level, LB...Liquid level, LB1...Third level, LB2...Fourth level, M0...Normal operation mode, M1...First control mode, M1-1...First process, M1-2...Second process, M2...Second control mode, M3...Supply mode, M4...Backwash mode, P...Pump, PG...Processing program, PM...Program, Q1...Supply line, Q1-1...First supply line, Q1-2...Second supply line, Q1-3...Third supply line, Q1 -4...fourth supply line, Q2...auxiliary line, R1...return flow path, R2...second return flow path, RG1...stagnation area RG1, SA...first signal, SB...second signal, ST1...first step, ST2...second step, ST3...third step, ST4...fourth step, T...tool, TH1...first upper threshold, TH2...second upper threshold, TH3...third upper threshold, TL1...first lower threshold, TL2...second lower threshold, V1...valve, V1-1...first valve, V1-2...second valve, V1-3...third valve, V1-4...fourth valve, V5...fifth valve, V6...sixth valve, W...workpiece,

Claims

1. a first tank for storing coolant; an adjusting device for adjusting the liquid level of the coolant in the first tank; an agitator that agitates the coolant in the first tank; a foreign matter removal device for removing foreign matter from the coolant; a control device that controls the adjustment device to execute a first control mode; Equipped with The first control mode is lowering the liquid level in the first tank using the regulator; agitating the coolant in the first tank by the agitator while the liquid level in the first tank is lowered; Contains Coolant system.

2. The first control mode includes collecting the foreign matter using the foreign matter removal device while stirring the coolant in the first tank with the stirring device. The coolant system of claim 1 .

3. Further, a second tank for storing the coolant is provided. the regulating device includes a first pump that supplies the coolant from the first tank to the second tank; The first control mode includes lowering the liquid level by moving the coolant from the first tank to the second tank using the first pump. The coolant system of claim 1 .

4. the adjusting device includes a second pump that supplies the coolant from the second tank to the first tank; The second pump is capable of supplying the coolant from the second tank to a stirring nozzle disposed in the first tank. The coolant system of claim 3 .

5. the second tank has a buffer space for receiving the coolant when the first control mode is executed, The control device inhibits a second liquid level in the second tank from reaching the buffer space before the first control mode is executed.

5. The coolant system according to claim 3 or 4.

6. the adjusting device includes a second pump that supplies the coolant from the second tank to the first tank; The second tank is a first reservoir chamber into which the coolant supplied by the first pump flows; a second reservoir chamber in which a coolant suction port of the second pump is disposed; Equipped with a first bottom of the first storage chamber and a second bottom of the second storage chamber are fluidly connected; The bottom surface of the second storage chamber is an inclined surface whose height decreases toward the bottom surface of the first storage chamber. The coolant system of claim 3 .

7. The second tank has a bottom provided with a discharge port for discharging the coolant.

5. The coolant system according to claim 3 or 4.

8. The first control mode includes circulating the coolant between the first tank and the second tank while the liquid level is lowered.

5. The coolant system according to claim 3 or 4.

9. a memory that stores a target value of the liquid level of the first tank in the first control mode; The first control mode includes controlling the adjusting device so that the liquid level in the first tank is forcibly lowered to the target value. A coolant system according to any one of claims 1 to 4.

10. The control device the first control mode; a second control mode in which the liquid level in the first tank is increased; Normal driving mode is executable, The normal operation mode is maintaining the liquid level in the first tank at or above a first lower threshold and below a first upper threshold using the adjusting device; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through at least one circulation flow path; is a mode including The control device sequentially executes the normal operation mode, the first control mode, the second control mode, and the normal operation mode in this order. A coolant system according to any one of claims 1 to 4.

11. The control device starts the execution of the first control mode based on at least one of a request from a user, a pre-specified timing, and a usage amount of the processing machine. The coolant system of claim 10.

12. The control device the first control mode; Normal driving mode is executable, The normal operation mode is maintaining the liquid level in the first tank at or above a first lower threshold and below a first upper threshold using the adjusting device; maintaining a second liquid level in the second tank at or above a second lower threshold and below a second upper threshold using the adjusting device; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through at least one circulation flow path; is a mode including The first control mode includes controlling the regulator so that the second liquid level in the second tank rises above the second upper threshold.

5. The coolant system according to claim 3 or 4.

13. Processing machines and a coolant system for supplying coolant to the processing machine; Equipped with The processing machine is a workpiece support device that supports the workpiece; a machining head for holding a tool; a moving device that moves the machining head relative to the workpiece supporting device; a discharge device that discharges the coolant; Equipped with The coolant system comprises: a first tank for storing the coolant; an adjusting device for adjusting the liquid level of the coolant in the first tank; an agitator that agitates the coolant in the first tank; a foreign matter removal device for removing foreign matter from the coolant; a supply device for supplying the coolant to the processing machine; Control device and Equipped with the control device is capable of executing a first control mode by controlling the adjustment device; the control device is capable of executing a supply mode in which the coolant is supplied to the processing machine by controlling the supply device; The first control mode is lowering the liquid level in the first tank using the regulator; agitating the coolant in the first tank by the agitator while the liquid level in the first tank is lowered; Contains Processing system.

14. removing foreign matter from the coolant using a foreign matter remover while circulating the coolant through at least one circulation flow path that exits a first tank and returns to the first tank; lowering the liquid level of the coolant in the first tank; agitating the coolant in the first tank by an agitator while the liquid level of the coolant in the first tank is lowered; raising the liquid level of the coolant in the first tank; removing the foreign matter from the coolant using the foreign matter removal device while circulating the coolant through the at least one circulation flow path in a state where the liquid level of the coolant in the first tank is raised; Equipped with Foreign body removal method.

15. A program for causing a control device to execute the foreign matter removal method according to claim 14.

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