Laser level

Abstract

To provide a laser marker capable of suppressing the temperature rise of a semiconductor laser due to heat generation of a semiconductor element that controls the luminous amount of the semiconductor laser.SOLUTION: A laser marker 1 includes an optical body, a semiconductor element Q1, a first housing 4, and a second housing 35. The optical body has a semiconductor laser 52 and an optical system. The semiconductor element Q1 controls the luminous amount of the semiconductor laser 52. The first housing 4 houses the optical body. The second housing 35 is another housing different from the first housing 4 for housing the semiconductor element Q1.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a laser level, and more particularly to a laser level including a semiconductor laser. [Background technology]

[0002] The laser marking device (laser marking instrument) described in Patent Document 1 includes a housing that houses a light source (semiconductor laser) and an optical unit (optical system). The optical unit generates and emits a front vertical line light, a horizontal line light, and a side vertical line light from the light beam emitted from the light source. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-025631 Summary of the Invention [Problem to be solved by the invention]

[0004] In the laser marking device of Patent Document 1, the housing that houses the light source also houses a semiconductor element that controls the light emission amount of the light source. Therefore, the heat generated by the semiconductor element causes the temperature inside the housing to rise, and this temperature rise inside the housing causes the temperature of the light source to rise further, which can cause the light source to become too hot. If the light source becomes too hot, it can cause a decrease in light emission efficiency and a shortened lifespan.

[0005] The present disclosure has been made in consideration of the above-mentioned circumstances, and its purpose is to provide a laser marking device that can suppress the temperature rise of a semiconductor laser due to heat generation from a semiconductor element that controls the light emission amount of the semiconductor laser. [Means for solving the problem]

[0006] A laser marker according to one aspect of the present disclosure comprises an optical body, a semiconductor element, a first housing, and a second housing. The optical body has a semiconductor laser and an optical system. The semiconductor element controls the amount of light emitted by the semiconductor laser. The first housing houses the optical body. The second housing is a housing separate from the first housing and houses the semiconductor element. The semiconductor element is a switching element that controls the current flowing through the semiconductor laser. [Effects of the Invention]

[0007] The laser marking device according to the present disclosure has the effect of suppressing the temperature rise of the semiconductor laser due to heat generation from the semiconductor element that controls the light emission amount of the semiconductor laser. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of the laser marking device of this embodiment with legs in an open position. [Figure 2] FIG. 2 is a perspective view of the laser marking device with legs closed. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a perspective view of the optical body of the laser marker. [Figure 5] FIG. 5 is a perspective view of the internal configuration of the optical body. [Figure 6] FIG. 6 is a partially exploded perspective view of a power supply-equipped leg of the laser marker. [Figure 7] FIG. 7 is an exploded perspective view of a power supply-equipped leg of the laser marking device. [Figure 8] FIG. 8 is a cross-sectional view taken along line VII-VII in FIG. [Figure 9] FIG. 9 is a circuit diagram showing an example of a light emitting circuit of the laser marking device. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a laser marking device according to an embodiment of the present disclosure will be described with reference to the drawings. The configuration described in the following embodiment is merely an example of the present disclosure. The present disclosure is not limited to the following embodiment, and various modifications can be made depending on the design, etc., as long as they do not deviate from the technical concept of the present disclosure.

[0010] (1) Overview First, an overview of the laser marking device 1 according to this embodiment will be described with reference to Figures 1 and 2. In the following description, the top, bottom, left, right, front and back of the laser marking device 1 will be basically defined as the top, bottom, left, right, front and back of the laser marking device 1 when the laser marking device 1 is installed on a horizontal installation surface (top, bottom, left, right, front and back in Figure 1).

[0011] As shown in FIG. 1, a laser marking device 1 has multiple (e.g., three) legs 3. With the legs 3 spread apart, the laser marking device 1 is placed on an installation surface, such as the ground or floor, at a work site (e.g., a housing construction site or an electrical work site). When installed on an installation surface at the work site, the laser marking device 1 emits three laser beams: a point beam L1, a horizontal line beam L2 that spreads horizontally in a fan-like shape, and a vertical line beam L3 that spreads vertically. The point beam L1 is emitted vertically upward, the horizontal line beam L2 is emitted horizontally forward, and the vertical line beam L3 is emitted vertically forward. These point beams L1, horizontal line beam L2, and vertical line beam L3 are used as reference points and reference lines to be marked on walls and ceilings during work at the work site (e.g., housing construction or electrical work). Hereinafter, the point beam L1, horizontal line beam L2, and vertical line beam L3 may be collectively referred to as laser beams L1-L3.

[0012] 2, the laser marking device 1 can be easily carried by closing the legs 3 to form a rod shape. When distinguishing between the legs 3, they will be referred to as legs 3a, 3b, and 3c.

[0013] (2) Configuration explanation As shown in Fig. 1, the laser marking device 1 includes a device main body 2 and a plurality of (for example, three) legs 3. The device main body 2 emits laser beams L to L3. The plurality of legs 3 are portions for supporting the device main body 2 on an installation surface.

[0014] As shown in FIGS. 1 and 3, the device body 2 includes a first housing 4, an optical body 5 (FIG. 3), a support member 6 (FIG. 3), and a detection mechanism 7 (FIG. 3).

[0015] The first housing 4 houses the optical body 5, the support member 6, and the detection mechanism 7, and is connected to the plurality of legs 3. The first housing 4 includes a body 8 and a base 9.

[0016] The body 8 houses the optical main body 5, the support member 6, and the detection mechanism 7. The body 8 is formed, for example, from a light-blocking resin. The body 8 is, for example, substantially cylindrical and includes a peripheral wall portion 81, an upper wall portion 82, and a bottom portion 83 (see FIG. 3). The peripheral wall portion 81 is tubular (for example, cylindrical). The upper wall portion 82 is provided on the peripheral wall portion 81 so as to close the upper opening of the peripheral wall portion 81, and is, for example, plate-shaped (for example, disk-shaped). The bottom portion 83 is provided on the peripheral wall portion 81 so as to close the lower opening of the peripheral wall portion 81, and is, for example, plate-shaped (for example, disk-shaped). The outer diameter of a lower portion 8d of the body 8 is smaller than the outer diameter of an upper portion 8u of the body 8 (i.e., the portion above the lower portion 8d). A base 9 is fixed to the lower portion 8d of the body 8.

[0017] The body 8 has three transmission windows (first to third transmission windows 8a to 8c) (see FIG. 1). The first transmission window 8a is a transmission window through which the point light L1 is emitted. The first transmission window 8a is, for example, a substantially circular transmission window, and is provided in the center of the upper wall portion 82 of the body 8. The second transmission window 8b is a transmission window through which the horizontal line light L2 is emitted. The second transmission window 8b is, for example, a horizontally elongated rectangular transmission window, and is provided in the peripheral wall portion 81 of the body 8. The third transmission window 8c is a transmission window through which the vertical line light L3 is emitted. The third transmission window 8c is, for example, a vertically elongated rectangular transmission window, and is provided across the upper wall portion 82 and the peripheral wall portion 81 of the body 8. The three transmission windows 8a to 8c are made of a transparent material (resin or glass).

[0018] The base 9 is a member fixed to the lower portion 8d of the body 8, and is a member to which the multiple legs 3 are rotatably connected (see FIG. 1). The base 9 is formed, for example, from a light-blocking resin. The base 9 is tubular (for example, cylindrical) with an open upper end and a bottom. The lower portion 8d of the body 8 is inserted into the upper opening of the base 9 and fixed, thereby fixing the base 9 to the body 8 (see FIG. 3).

[0019] 4 and 5, the optical body 5 generates and emits laser beams L1 to L3. The optical body 5 includes a case 51, a semiconductor laser 52, an optical system 53, a holder 54, and a vertical support portion 55.

[0020] The semiconductor laser 52 is, for example, a laser diode, and emits a laser beam L0, which is the source of the laser beams L1 to L3, to the optical system 53. The semiconductor laser 52 is mounted (placed) on a substrate .

[0021] The holder 54 positions and holds the semiconductor laser 52 below the optical system 53 (more specifically, below the vertical support portion 55).

[0022] The optical system 53 is disposed above the semiconductor laser 52 (more specifically, above the vertical support portion 55). As shown in FIG. 5, the optical system 53 generates laser beams L1 to L3 from the laser beam L0 emitted from the semiconductor laser 52. The optical system 53 includes a first beam splitter 53a, a second beam splitter 53b, a first output lens 53d, and a second output lens 53e. The first beam splitter 53a transmits a portion of the laser beam L0 emitted from the semiconductor laser 52 and causes it to enter the second beam splitter 53b, and reflects the remainder and causes it to enter the first output lens 53d. The first output lens 53d converts the laser beam L0 from the first beam splitter 53a into a horizontal line beam L2 and outputs the beam. The second beam splitter 53b transmits a portion of the laser beam L0 from the first beam splitter 53a and emits it vertically (upward) as point light L1, and reflects the remainder to make it incident on the second exit lens 53e. The second exit lens 53e converts the laser beam L0 from the second beam splitter 53b into vertical line light L3 and emits it.

[0023] As shown in Fig. 3, the vertical support portion 55 is supported by the support member 6 of the device body 2 so that the case 51 of the optical body 5 hangs down in the vertical direction, swingably about a first shaft portion 55a, and supports the case 51 so that the case 51 can swing down in the vertical direction, and the vertical support portion 55 swingably supports the case 51 about a second shaft portion 55b (see Fig. 4). This allows the optical body 5 to always hang down in the vertical direction regardless of the inclination of the device body 2. This allows the optical body 5 to always emit the laser beams L1 to L3 in the correct directions (vertically upward, forward horizontal, and forward vertical).

[0024] As shown in FIG. 5, the vertical support unit 55 is disposed, for example, between the holder 54 and the optical system 53. The vertical support unit 55 includes, for example, a rectangular parallelepiped base 55c, a pair of first shafts 55a, and a pair of second shafts 55b. The base 55c is, for example, substantially rectangular parallelepiped. The base 55c has a through-hole 55d that allows the laser light L0 from the semiconductor laser 52 to pass through in the vertical direction. The pair of first shafts 55a protrude in the front-rear direction from both front and rear side surfaces of the base 55c. The pair of first shafts 55a protrude to the outside of the case 51 through a pair of openings 51a (see FIG. 4) of the case 51 and are rotatably supported by a pair of bearings 6a of the support member 6 (see FIG. 3). The pair of second shafts 55b protrude in the left-right direction from both left and right side surfaces of the base 55c and are rotatably supported by a pair of bearings 51b of the case 51 (see FIG. 4). The axial direction (front-rear direction) of the first shaft portion 55a and the axial direction (left-right direction) of the second shaft portion 55b are perpendicular to each other.

[0025] As shown in Figures 4 and 5, the case 51 houses the semiconductor laser 52, the optical system 53, the holder 54, and the vertical support part 55. The case 51 is, for example, in the shape of a vertically long bar with an inclined upper surface 51u. The optical system 53 is disposed at the top of the case 51. The vertical support part 55 is disposed below the optical system 53 inside the case 51. The semiconductor laser 52 is disposed below the vertical support part 55 inside the case 51 via the holder 54.

[0026] The case 51 has three windows (first to third windows 51c to 51e). The first window 51c is a window through which the point light L1 is emitted, and is provided on the top surface 51u of the case 51. The second window 51d is a window through which the horizontal line light L2 is emitted, and is provided on the side surface 51s of the case 51. The side surface 51s is a side surface opposite to the inclined top surface 51u. The third window 51e is a window through which the vertical line light L3 is emitted, and is provided on the side surface 51s of the case 51.

[0027] As shown in FIG. 3 , the support member 6 is fixed to the inner circumferential surface of the body 8 and rotatably supports a pair of first shaft portions 55a of the vertical support portion 55. The support member 6 has an annular portion 6b with a central opening and a pair of bearings 6a. The annular portion 6b is fixed to the inner circumferential surface of the body 8. The pair of bearings 6a are components that rotatably support the pair of first shaft portions 55a of the optical body 5 and are fixed to the annular portion 6b. With the optical body 5 inserted into the central opening of the annular portion 6b and hanging down so as to be swingable, the pair of first shaft portions 55a of the optical body 5 are rotatably supported by the pair of bearings 6a. In this way, the support member 6 supports the optical body 5 so as to hang down so as to be swingable around the first shaft portions 55a.

[0028] As shown in FIG. 3 , the detection mechanism 7 detects whether the lower end 5d of the optical body 5 contacts the inner circumferential surface 8e of the body 8. The detection mechanism 7 has a first contact portion 71 and a second contact portion 72. The first contact portion 71 is a metal component (e.g., a cylindrical component) and is fixed to the lower end 5d of the optical body 5. The second contact portion 72 is a metal annular component (e.g., a cylindrical component with a bottom). The second contact portion 72 is disposed at the bottom of the body 8. In this arrangement, the second contact portion 72 is disposed so as to surround the outer periphery of the first contact portion 71 fixed to the lower end 5d of the optical body 5. As a result, when the lower end 5d of the optical body 5 contacts the inner circumferential surface 8e of the body 8, the first contact portion 71 and the second contact portion 72 are electrically connected to each other. In this embodiment, a predetermined detection circuit of the laser marking device 1 detects this electrical contact. When the predetermined detection circuit detects the electrical contact, it stops the semiconductor laser 52 in the optical body 5 from emitting light.

[0029] In other words, if the lower end 5d of the optical body 5 comes into contact with the inner circumferential surface 8e of the body 8, the optical body 5 will no longer be able to hang down accurately in the vertical direction. In this embodiment, in such a case, the light emission of the semiconductor laser 52 in the optical body 5 is stopped. For this reason, in this embodiment, the detection mechanism 7 is used to detect whether the lower end 5d of the optical body 5 has come into contact with the inner circumferential surface 8e of the body 8, and a predetermined detection circuit stops the light emission of the semiconductor laser 52 in the optical body 5 based on the detection result of the detection mechanism 7.

[0030] As shown in FIG. 1, the base 9 is a member fixed to the lower portion 8d of the body 8 (see FIG. 3), and is a member to which multiple legs 3 are rotatably connected. The base 9 is, for example, cylindrical with one end (upper end) open and the other end (lower end) having a bottom. The lower portion 8d of the body 8 is inserted into and fixed to the base 9, thereby fixing the base 9 to the lower portion 8d of the body 8 (see FIG. 3). Multiple legs 3 are rotatably connected to the lower peripheral edge of the bottom of the base 9. The multiple legs 3 are connected to the lower peripheral edge of the bottom of the base 9 so as to be rotatable around one end (upper end) between the direction of a center line M1 of the base 9 (i.e., the first housing 4) and the direction of an inclined line M2. The center line M1 is parallel to the center line M1 of the base 9 (i.e., the first housing 4). The direction of the inclined line M2 is the direction of the inclined line M2 that is inclined toward the outer periphery of the base 9 with respect to the center line M1 of the base 9.

[0031] As shown in FIG. 1, the multiple (e.g., three) legs 3 are members for supporting the device main body 2 on the installation surface. The multiple legs 3 are rotatably connected to the lower peripheral edge of the bottom of the base 9 as described above. This allows the multiple legs 3 to be in an open or closed state. When the multiple legs 3 are in an open state, the laser level 1 can be placed upright by placing one end (lower end) of each of the multiple legs 3 on the installation surface. When the multiple legs 3 are in a closed state, the multiple legs 3 are bundled together and extend along the center line M1 of the device main body 2, and the overall shape of the laser level 1 is a straight rod (see FIG. 2).

[0032] As shown in FIGS. 1 and 2, the multiple legs 3 are composed of multiple segments obtained by dividing a cylindrical body (e.g., a cylindrical body) in the circumferential direction into multiple segments (the same number as the number of legs). One of the multiple legs 3 (powered leg) 3a further has a power supply case 33. The power supply case 33 houses a power source (e.g., a dry cell) for emitting and controlling the semiconductor laser 52. The power supply case 33 of the powered leg 3a is fixed to the inner main surface of the segment. When the multiple legs 3 are closed, the power supply case 33 of the powered leg 3a is housed inside the cylindrical body composed of the multiple legs 3 (see FIG. 2).

[0033] (3) Details of the connection between the base 9 of the device body 2 and the legs 3 As shown in FIG. 2 , a lower peripheral edge 91 of the bottom of the base 9 is provided with a plurality of connecting recesses 92 that correspond one-to-one to the plurality of legs 3. The connecting recesses 92 are recessed from the lower peripheral edge 91 of the bottom of the base 9 toward the upper side of the base 9 and open on the outer peripheral surface of the base 9. The connecting recesses 92 are portions that rotatably connect with connecting protrusions 32 (described below) of the corresponding legs 3. In this embodiment, a rotation shaft 93 is disposed inside the connecting recess 92. The rotation shaft 93 is a rotation shaft that is parallel to a tangent to the outer peripheral contour (e.g., a circle) of the base 9 at the location of the connecting recess 92. As a result, the plurality of legs 3 are connected to the lower peripheral edge 91 of the base 9 so as to be rotatable around one end (the connecting protrusion 32) between the direction of the center line M1 of the base 9 (first housing 4) and the direction of the inclined line M2.

[0034] The multiple legs 3 are rotatably connected to multiple connecting recesses 92 provided on the lower peripheral edge 91 of the base 9. Each of the multiple legs 3 has a leg main body 31 and a connecting protrusion 32. The leg main body 31 has a shape that extends in one direction. More specifically, the leg main body 31 has substantially the same shape as one of multiple divided bodies obtained by equally dividing a tubular body (e.g., a cylindrical body) into multiple parts (the same number as the number of legs) in the circumferential direction. That is, the leg main body 31 has a side wall portion 31a and a bottom wall portion 31c. The side wall portion 31a is, for example, a rectangular plate-like shape and curves outward along the width direction. The bottom wall portion 31c is, for example, substantially fan-shaped and protrudes inward from the lower end of the side wall portion 31a. The connecting protrusions 32 protrude upward from the center of the upper surface of the side wall 31a, and are fitted into the corresponding connecting recesses 92, and are rotatably connected to the rotation shafts 93 in the connecting recesses 92. This allows the multiple legs 3 to be in the open and closed states, as described above.

[0035] (4) Details of powered leg 3a 6 and 7, the power supply-equipped leg 3a includes a leg body 31, a connecting protrusion 32, and a power supply case 33, as well as a power supply holder 34 and a second board 13 (described later). As described above, the leg body 31 includes a side wall 31a and a bottom wall 31c. An accommodating recess 31d is provided on the inner main surface 31t of the side wall 31a to accommodate the second board 13 (described later) (see FIG. 7).

[0036] In this embodiment, the leg body 31, the connecting protrusion 32, and the power supply case 33 constitute a housing (second housing) 35 of the powered leg 3a. That is, the powered leg 3a includes a power supply holder 34, a second substrate 13 (described later), and the second housing 35. In this embodiment, the second housing 35 constitutes one of the multiple legs 3 (powered leg 3a).

[0037] The power supply holder 34 is a member that detachably holds a power supply. The power supply is a power source for emitting light and controlling the semiconductor laser 52, and is, for example, a dry cell battery (e.g., a size AA battery). The power supply holder 34 has a base plate 34a and a pair of clamping plates 34b and 34c. The base plate 34a is, for example, a rectangular plate and is fixed to the inner main surface 31t of the side wall 31a so as to close the opening of the accommodating recess 31d. The pair of clamping plates 34b and 34c are used to hold the power supply vertically and protrude from the main surface of the base plate 34a opposite the accommodating recess 31d, leaving a predetermined gap (the length of the dry cell battery) between them in the vertical direction. Terminals for electrical contact with the positive or negative pole of the power supply are arranged on the opposing surfaces of the pair of clamping plates 34b and 34c. The power supply holder 34 holds a plurality of (for example, three) dry batteries as the power supply by sandwiching them in a stacked parallel state between a pair of clamping plates 34b, 34c.

[0038] The power supply case 33 is a substantially rectangular box-shaped case with one open surface (opening surface 33c). The power supply case 33 accommodates the power supply holder 34 inside the power supply case 33 and is fixed to the inner main surface 31t of the side wall 31a of the leg main body 31 so that the opening surface 33c of the power supply case 33 is closed by the inner main surface 31t of the side wall 31a of the leg main body 31.

[0039] The power supply case 33 is divided into two parts, an upper part and an lower part. That is, the power supply case 33 comprises an upper fixed case part 33a and a lower detachable cover part 33b. The fixed case part 33a is fixed to the inner main surface 31t of the side wall part 31a of the leg main body 31. The detachable cover part 33b is detachably attached to the inner main surface 31t of the side wall part 31a. In this power supply case 33, the power supply holder 34 inside the power supply case 33 can be exposed to the outside by removing the detachable cover part 33b from the leg main body 31. In this exposed state, the power supply (dry battery) held in the power supply holder 34 can be replaced. After battery replacement, the detachable cover part 33b is detachably attached to the inner main surface 31t of the side wall part 31a.

[0040] 8, when the legs 3 are closed, the leg bodies 31 of the legs 3 form a cylindrical body. The power supply case 33 is housed inside the cylindrical body.

[0041] (5) Lighting circuit As shown in FIG. 9, the laser marking device 1 includes a light emitting circuit 11, a first board 12, and a second board 13.

[0042] The light emitting circuit 11 is a circuit that causes a semiconductor laser 52 to emit laser light L0, and includes the semiconductor laser 52, a control unit 14, a first voltage source V1, and a second voltage source V2.

[0043] The first voltage source V1 is a voltage source that supplies power to the semiconductor laser 52. The second voltage source V2 is a voltage source that supplies power to the control unit 14. The first voltage source V1 and the second voltage source V2 are supplied by a power source (e.g., a dry cell) housed in the powered leg 3a.

[0044] The semiconductor laser 52 is electrically connected in the forward direction to an electric path 15 connected between a first voltage source V1 and a ground point E1.

[0045] The control unit 14 controls the light emission intensity of the semiconductor laser 52. More specifically, the control unit 14 controls the light emission intensity of the semiconductor laser 52 to a constant level by feedback control. The control unit 14 includes a light receiving element D1, a first switching element Q1, a second switching element Q2, resistors R1 to R4, and a capacitor C1. Hereinafter, the light receiving element D1, the first switching element Q1, the second switching element Q2, the resistors R1 to R4, and the capacitor C1 may be referred to as circuit components D1, R1 to R4, and C1.

[0046] The first switching element Q1 is a semiconductor element that controls the current flowing through the semiconductor laser 52 (i.e., the current flowing through the electrical path 15) to control the light emission amount of the semiconductor laser 52. The first switching element Q1 is, for example, an NPN bipolar transistor. The first switching element Q1 has a first main electrode (e.g., an emitter), a second main electrode (e.g., a collector), and a control electrode (e.g., a base). The first and second main electrodes of the first switching element Q1 are connected to a predetermined location on the electrical path 15 (e.g., between the semiconductor laser 52 and a ground point E1). The first switching element Q1 controls the current flowing through the electrical path 15 in accordance with the voltage value applied to its control electrode. The control electrode of the first switching element Q1 is connected to a branch point N1 of the electrical path 16 (described below). The branch point N1 is located between a resistor R2 and a capacitor C1 on the electrical path 16. The control electrode of the first switching element Q1 is also connected to the ground point E1 via a resistor R3. In the electric circuit 15, a resistor R1 is connected between the semiconductor laser 52 and the first switching element Q1.

[0047] The second switching element Q2 controls the voltage applied to the control electrode of the first switching element Q1 in response to the amount of light received by the light-receiving element D1. In other words, the second switching element Q2 controls the current flowing through the control electrode of the first switching element Q1 in response to the amount of light received by the light-receiving element D1. The second switching element Q2 is, for example, a PNP-type bipolar transistor. The second switching element Q2 has a first main electrode (e.g., an emitter), a second main electrode (e.g., a collector), and a control electrode (e.g., a base). The first and second main electrodes of the second switching element Q2 are connected to an electrical path 16 that connects a second voltage source V2 and a ground point E1. The second switching element Q2 controls the current flowing through the electrical path 16 in response to the voltage applied to its control electrode. A resistor R2 and a capacitor C1 are connected in series to the electrical path 16 between the second switching element Q2 and the ground point E1.

[0048] The light-receiving element D1 is, for example, a photodiode, and receives light leaking from the laser light L0 emitted by the semiconductor laser 52. This detects the amount of laser light emitted by the semiconductor laser 52. The light-receiving element D1 is connected between a branch point N2 of the electrical path 15 and the control electrode of the second switching element Q2. The branch point N2 is located on the electrical path 15 between the first voltage source V1 and the semiconductor laser 52. The cathode of the light-receiving element D1 is connected to the branch point N2, and the anode of the light-receiving element D1 is connected to the control electrode of the second switching element Q2 via a resistor R4.

[0049] In this light-emitting circuit 11, when the power supply is turned on, the first switching element Q1 is initially conductive. This causes current from the first voltage source V1 to flow to ground point E1 via the semiconductor laser 52 and the first switching element Q1. This causes the semiconductor laser 52 to emit laser light L0. In this emission state, as the amount of light emitted by the semiconductor laser 52 increases, the amount of light received by the light-receiving element D1 increases, increasing the current flowing through the light-receiving element D1. This increase causes the charge on the control electrode of the second switching element Q2 to discharge through the light-receiving element D1 to the electrical path 15. This reduces the voltage applied to the control electrode of the second switching element Q2, causing the second switching element Q2 to reduce the current flowing from the second voltage source V2 through the second switching element Q2, resistor R2, and resistor R3. This reduction reduces the voltage applied to the control voltage of the first switching element Q1, causing the first switching element Q1 to reduce the current flowing through the electrical path 15. This reduction reduces the light emission amount of semiconductor laser 52. As a result, the light emission amount of semiconductor laser 52 is maintained constant. Conversely, when the light emission amount of semiconductor laser 52 decreases, the voltage applied to the control voltage of second switching element Q2 increases, the voltage applied to the control voltage of first switching element Q1 increases, the current flowing through current path 15 increases, and the light emission amount of semiconductor laser 52 increases. As a result, the light emission amount of semiconductor laser 52 is maintained constant.

[0050] In this embodiment, the semiconductor laser 52 is mounted on the first substrate 12. Of the plurality of circuit components D1, R1 to R4, and C1 included in the control unit 14, at least the first switching element Q1 is mounted on the second substrate 13, and the remaining circuit components are mounted on the first substrate 12. That is, the semiconductor laser 52 and the plurality of circuit components D1, R1 to R4, and C1 of the control unit 14, except for at least the first switching element Q1, are mounted on the first substrate 12. In this embodiment, the semiconductor laser 52 and the light receiving element D1 are mounted on the first substrate 12. The first switching element Q1, the second switching element Q2, resistors R1 to R4, and a capacitor C1 are mounted on the second substrate 13.

[0051] The first substrate 12 is formed by the substrate 56 of the optical body 5 (a substrate on which the semiconductor laser 52 is mounted) and is housed in the first housing 4 of the device main body 2 (more specifically, in the body 8, and even more specifically, in the case 51 of the optical body 5). The second substrate 13 is housed in a second housing 35 separate from the first housing 4 housing the first substrate 12. In this embodiment, the second housing 35 is the housing of the powered leg 3a. The second housing 35 is a housing that houses a power supply for emitting light and controlling the semiconductor laser 52, in other words, a housing that supports the power supply. More specifically, the second substrate 13 is housed in the housing recess 31d of the second housing 35 of the powered leg 3a. The first substrate 12 and the second substrate 13 are connected to each other by wiring 17.

[0052] In this embodiment, as described above, the first switching element Q1 is mounted on the second substrate 13 housed in the second housing 35. That is, the first switching element Q1 is housed in a second housing 35 separate from the first housing 4 housing the semiconductor laser 52. This removes the first switching element Q1 (a semiconductor element that controls the light emission amount of the semiconductor laser 52), which is a heat source that thermally affects the semiconductor laser 52, from the first housing 4 housing the semiconductor laser 52. This prevents a temperature rise in the first housing 4 caused by the first switching element Q1, and as a result, prevents a temperature rise in the semiconductor laser 52 due to heat generated by the first switching element Q1. By suppressing a temperature rise in the semiconductor laser 52, it is possible to prevent a decrease in the light emission efficiency and a shortened lifespan of the semiconductor laser 52.

[0053] (6) Main Effects The laser marking device 1 according to this embodiment comprises an optical body 5, a semiconductor element (first switching element Q1), a first housing 4, and a second housing 35. The optical body 5 has a semiconductor laser 52 and an optical system 53. The semiconductor element controls the amount of light emitted by the semiconductor laser 52. The first housing 4 houses the optical body 5. The second housing 35 is a housing separate from the first housing 4 and houses the semiconductor element.

[0054] According to this configuration, the semiconductor element (first switching element Q1) that controls the light emission amount of the semiconductor laser 52 can be removed from the first housing 4 that houses the semiconductor laser 52. This makes it possible to suppress a temperature rise inside the first housing 4 due to the semiconductor element, and as a result, it is possible to suppress a temperature rise in the semiconductor laser 52 due to heat generation by the semiconductor element.

[0055] (7) Variations Modifications of the above embodiment will be described below. The following modifications can be implemented in combination.

[0056] (Variation 1) In the above embodiment, both the first switching element Q1 and the second switching element Q2 are housed in the second housing 35. However, of the first switching element Q1 and the second switching element Q2, it is sufficient that at least the first switching element Q1 is housed in the second housing 35, and the second switching element Q2 may be housed in the first housing 4. This is because the first switching element Q1 controls the current (a relatively large current) flowing through the semiconductor laser 52, and the second switching element Q2 controls the current (a relatively small current) flowing through the control electrode of the first switching element Q1. For this reason, the amount of heat generated by the second switching element Q2 is significantly smaller than the amount of heat generated by the first switching element Q1.

[0057] (Variation 2) In the above embodiment, first substrate 12 and second substrate 13 are connected to each other by wiring 17. However, first substrate 12 and second substrate 13 may be connected by a flexible substrate (FPC (Flexible printed circuits)) instead of wiring 17. A flexible substrate is a substrate in which wiring is printed on a flexible sheet-like insulating material (e.g., a plastic film).

[0058] (Variation 3) In the above embodiment, the semiconductor laser 52 and the first switching element Q1 are mounted on the substrates (first substrate 12 and second substrate 13), respectively. However, only one of the semiconductor laser 52 and the first switching element Q1 may be mounted on the substrate. In other words, either the semiconductor laser 52 or the first switching element Q1 may be mounted on the substrate.

[0059] (8) Mode As is clear from the above-described embodiment, the following aspects are possible.

[0060] The laser marker (1) of the first embodiment includes an optical body (5), a semiconductor element (Q1), a first housing (4), and a second housing (35). The optical body (5) has a semiconductor laser (52) and an optical system (53). The semiconductor element (Q1) controls the amount of light emitted by the semiconductor laser (52). The first housing (4) houses the optical body (5). The second housing (35) is a housing separate from the first housing (4) and houses the semiconductor element (Q1).

[0061] According to this configuration, the semiconductor element (Q1), which is a heat source that thermally affects the semiconductor laser (52), can be removed from the first housing (4) that houses the semiconductor laser (52). This makes it possible to suppress a temperature rise in the first housing (4) due to the semiconductor element (Q1), and as a result, it is possible to suppress a temperature rise in the semiconductor laser (52) due to heat generation by the semiconductor element (Q1).

[0062] In the laser marking device (1) of the second embodiment, the semiconductor element (Q1) in the first embodiment is a switching element that controls the current flowing through the semiconductor laser (52).

[0063] According to this configuration, the switching element that controls the current flowing through the semiconductor laser (52) as the semiconductor element (Q1) can be removed from the first housing (4).

[0064] The laser marking device (1) of the third aspect is the same as that of the first or second aspect, but includes a control unit (14) having a semiconductor element (Q1) that controls the amount of light emitted from the semiconductor laser (52). Of the control unit (14), at least the semiconductor element (Q1) is housed in the second housing (35), and the remaining circuit components are housed in the first housing (4).

[0065] According to this configuration, the circuit components of the control unit 14 that controls the light intensity of the semiconductor laser 52, other than the semiconductor element Q1, can be accommodated in either the first housing 4 or the second housing 35. This improves the degree of freedom in arranging the circuit components of the control unit 14.

[0066] The laser marking device (1) of the fourth aspect is the third aspect, further comprising a power supply that supplies power to the control unit (14). The power supply is housed in the second housing (35).

[0067] According to this configuration, the power source, which can be a heat source, can be removed from the first housing 4 that houses the semiconductor laser 52. This further suppresses the temperature rise of the semiconductor laser 52.

[0068] The laser marking device (1) of the fifth aspect is the third aspect, further comprising a power supply that supplies power to the control unit (14). The power supply is supported by the second housing (35).

[0069] According to this configuration, the power source, which can be a heat source, can be removed from the first housing 4 that houses the semiconductor laser 52. This further suppresses the temperature rise of the semiconductor laser 52.

[0070] In the sixth aspect of the laser marking device (1), in any one of the first to fifth aspects, the second housing (35) is connected to the first housing (4) so ​​as to be rotatable between the direction of the center line of the first housing (4) and the direction of an inclined line inclined toward the outer periphery of the first housing (4) with respect to the center line.

[0071] According to this configuration, the second housing (35) can be connected to the first housing (4) so ​​as to be rotatable between the center line direction and the inclined line direction of the first housing (4). This allows the angle of the legs (3) to be adjusted when the second housing (35) is used as the legs (3) of the laser marking device (1), and also allows for easy replacement of the power supply when the second housing (35) is used as the power supply case (33).

[0072] The laser marking device (1) of the seventh aspect is any one of the first to sixth aspects, further comprising a plurality of legs (3) connected to the first housing (4). The second housing (35) constitutes one leg (3a) of the plurality of legs (3).

[0073] According to this configuration, the second housing (35) can be used as the leg (3a) of the laser marking device (1).

[0074] The laser marking device (1) of the eighth aspect is any one of the first to seventh aspects, in which the semiconductor laser (52) or the semiconductor element (Q1) is disposed on a substrate.

[0075] With this configuration, one of the semiconductor laser (52) and the semiconductor element (Q1) is mounted on a substrate, and the other is not mounted on a substrate, thereby preventing heat from the semiconductor element (Q1) from being transferred to the semiconductor laser (52) via the substrate.

[0076] The laser marking device (1) of the ninth aspect is any one of the first to seventh aspects, in which the semiconductor laser (52) and the semiconductor element (Q1) are arranged on separate substrates (12, 13).

[0077] According to this configuration, the semiconductor laser (52) and the semiconductor element (Q1) can be arranged on separate substrates (12, 13), thereby preventing heat from the semiconductor element (Q1) from being transmitted to the semiconductor laser (52) via the substrates (12, 13).

[0078] In the laser marking device (1) of the tenth aspect, in the ninth aspect, the substrate (12) on which the semiconductor laser (52) is arranged and the substrate (13) on which the semiconductor element (Q1) is arranged are connected by a flexible substrate.

[0079] This configuration improves the degree of freedom in arranging the substrate 12 on which the semiconductor laser 52 is disposed and the substrate 13 on which the semiconductor element Q1 is disposed. [Explanation of symbols]

[0080] 1 Laser level 4. First cabinet 5 Optical body 3 legs 3a Powered legs (legs) 12 First board (board) 13 Second board (board) 14 Control Unit 35 Second cabinet 52 Semiconductor laser 53 Optical system Q1 First switching element (semiconductor element)

Claims

1. an optical body having a semiconductor laser and an optical system; a semiconductor element for controlling the amount of light emitted by the semiconductor laser; a first housing that houses the optical body; a second housing that is separate from the first housing and that houses the semiconductor element; the semiconductor element is a switching element that controls a current flowing through the semiconductor laser; Laser level.

2. A control unit for controlling an amount of light emitted from the semiconductor laser, the control unit having the semiconductor element; At least the semiconductor element of the control unit is housed in the second housing, and the remaining circuit components are housed in the first housing.

2. The laser marker according to claim 1.

3. Further comprising a power supply that supplies power to the control unit, The power supply is housed in the second housing.

3. The laser marker according to claim 2.

4. Further comprising a power supply that supplies power to the control unit, The power supply is supported by the second housing.

3. The laser marker according to claim 2.

5. The second housing is connected to the first housing so as to be rotatable between the direction of the center line of the first housing and the direction of an inclined line inclined toward the outer periphery of the first housing with respect to the center line. The laser marking device according to any one of claims 1 to 4.

6. Further comprising a plurality of legs connected to the first housing; The second housing constitutes one of the plurality of legs. The laser marking device according to any one of claims 1 to 4.

7. The semiconductor laser or the semiconductor element is disposed on a substrate. The laser marking device according to any one of claims 1 to 4.

8. The semiconductor laser and the semiconductor element are disposed on separate substrates. The laser marking device according to any one of claims 1 to 4.

9. The substrate on which the semiconductor laser is arranged and the substrate on which the semiconductor element is arranged are connected by a flexible substrate. The laser marker according to claim 8.

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