Method and apparatus for determining defects in scanning electron microscope images

Abstract

The present application relates to the semiconductor technical field and provides a method and apparatus for determining defects in scanning electron microscope images, the method including: determining a first graphic detector and a corresponding first detection position in the design layout of the first graphic detector based on a design layout; determining a second graphic detector and a corresponding second detection position in the design layout of the second graphic detector based on the design layout, the first graphic detector, and the corresponding first detection position of the first graphic detector; and detecting a scanning electron microscope image corresponding to the design layout based on the first graphic detector and the corresponding first detection position and the second graphic detector and the corresponding second detection position to determine defects present in the scanning electron microscope image. This allows the first graphic detector and the second graphic detector to be determined more comprehensively and reliably, thereby improving the accuracy and reliability of defect detection in scanning electron microscope images.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a method and apparatus for defect determination of scanning electron microscope images.

Background Art

[0002] In the production process of integrated circuits, since many processes are involved, there may be situations where the wafer is contaminated or the surface of the wafer is damaged in each process, and there may be certain defects on the wafer.

[0003] In related technologies, in an image such as a scanning electron microscope (SEM), defect detection based on a design layout can be performed. In the process of performing defect detection, usually, first, based on the design layout, it is necessary to generate a detector or a detection frame that can be used for corresponding defect detection from a graphic description rule (that is, a rule that can describe the graphics in the design layout). For complex graphics in the design layout, it is quite complicated to describe the graphics based on the graphic description rule, so various omissions and errors are also likely to occur. Usually, in order to avoid detection omissions, it is common to solve the problem by adjusting the graphic description rule. However, since the possibilities of actual graphic shapes are very numerous, and after solving the detection omission of one type of graphic by the graphic description rule, it is still unknown whether other detection omissions will occur, the accuracy of defect detection becomes low. Therefore, it is important to improve the accuracy of defect detection.

Summary of the Invention

[0004] This application provides a method and apparatus for defect determination of scanning electron microscope images.

[0005] According to a first aspect of this application, a method for determining defects in a scanning electron microscope image is provided, which includes: determining a first graphic detector and a corresponding first detection position of the first graphic detector in the design layout based on a design layout; determining a second graphic detector and a corresponding second detection position of the second graphic detector in the design layout based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector; and detecting a scanning electron microscope image corresponding to the design layout based on the first graphic detector and its corresponding first detection position, and the second graphic detector and its corresponding second detection position, to determine defects present in the scanning electron microscope image.

[0006] In some embodiments, determining a first graphic detector and the corresponding first detection position of the first graphic detector in the design layout based on the design layout includes traversing the design layout based on a preset graphic description rule to determine the type of each first graphic detector and the corresponding first detection position of each first graphic detector in the design layout.

[0007] In some embodiments, determining a second graphic detector and a corresponding second detection position for the second graphic detector in the design layout based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector includes determining, if any other graphic area other than the first graphic detector exists in any one of the graphic units in the design layout, as the second graphic detector, and determining the position of the second graphic detector in the design layout as the second detection position.

[0008] In some embodiments, detecting a scanning electron microscope image corresponding to the design layout based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, and determining defects present in the scanning electron microscope image, includes, when the design layout and the scanning electron microscope image are aligned, determining a third detection position corresponding to the first detection position and a fourth detection position corresponding to the second detection position in the scanning electron microscope image; performing detection at the third detection position based on the first graphic detector corresponding to the first detection position to obtain a first detection result; performing detection at the fourth detection position based on the second graphic detector corresponding to the second detection position to obtain a second detection result; and determining defects present in the scanning electron microscope image based on the first and second detection results.

[0009] In some embodiments, determining defects present in the scanning electron microscope image based on the first detection result and the second detection result includes determining the defect corresponding to the first detection result as the first defect if the degree of matching corresponding to the first detection result is greater than a first threshold, determining the defect corresponding to the second detection result as the second defect if the degree of matching corresponding to the second detection result is greater than a second threshold, and determining the first defect and the second defect as defects in the scanning electron microscope image.

[0010] In some embodiments, the method further includes determining a first region in the design layout that does not include a graphics unit; determining a second region in the scanning electron microscope image that corresponds to the first region; and detecting the second region based on a predetermined detection rule to determine defects present in the second region.

[0011] In some embodiments, detecting the second region based on the predetermined detection rules and determining defects present in the second region includes, if the first region is larger than the reference region, dividing the first region into a plurality of sub-regions; determining a target predetermined detection rule corresponding to each sub-region based on a pre-set relationship table; determining a target sub-region corresponding to each sub-region in the scanning electron microscope image; and detecting each target sub-region based on the target predetermined detection rules and determining defects present in each target sub-region.

[0012] According to a second aspect of this application, a scanning electron microscope image defect determination device is provided, comprising: a first determination module for determining a first graphic detector and a corresponding first detection position of the first graphic detector in the design layout based on a design layout; a second determination module for determining a second graphic detector and a corresponding second detection position of the second graphic detector in the design layout based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector; and a first detection module for detecting a scanning electron microscope image corresponding to the design layout and determining defects present in the scanning electron microscope image based on the first graphic detector and its corresponding first detection position, and the second graphic detector and its corresponding second detection position.

[0013] In some embodiments, the first determination module is configured to traverse the design layout based on a predefined graphic description rule to determine the type of each first graphic detector and the corresponding first detection position of each of the first graphic detectors in the design layout.

[0014] In some embodiments, the second determination module is configured to determine, specifically, if any other graphics region other than the first graphics detector exists in any one of the graphics units in the design layout, to determine the other graphics region as the second graphics detector, and to determine the position of the second graphics detector in the design layout as the second detection position.

[0015] In some embodiments, the first detection module includes: a first determination unit that determines a third detection position corresponding to a first detection position and a fourth detection position corresponding to a second detection position in the scanning electron microscope image when the design layout and the scanning electron microscope image are aligned; a first detection unit that performs detection at the third detection position and obtains a first detection result based on a first graphic detector corresponding to the first detection position; a second detection unit that performs detection at the fourth detection position and obtains a second detection result based on a second graphic detector corresponding to the second detection position; and a second determination unit that determines defects present in the scanning electron microscope image based on the first and second detection results.

[0016] In some embodiments, the second determination unit is configured to determine a defect corresponding to the first detection result as a first defect if the degree of matching corresponding to the first detection result is greater than a first threshold, and to determine a defect corresponding to the second detection result as a second defect if the degree of matching corresponding to the second detection result is greater than a second threshold, and to determine the first defect and the second defect as defects in the scanning electron microscope image.

[0017] In some embodiments, the apparatus further comprises: a third determination module for determining a first region in the design layout that does not include a graphics unit; a fourth determination module for determining a second region in the scanning electron microscope image that corresponds to the first region; and a second detection module for detecting the second region and determining defects present in the second region based on predetermined detection rules.

[0018] In some embodiments, the second detection module is configured to, specifically, if the first region is larger than the reference region, divide the first region into a plurality of subregions, determine a predetermined target detection rule corresponding to each subregion based on a pre-configured relationship table, determine a target subregion corresponding to each subregion in the scanning electron microscope image, detect each target subregion based on the predetermined target detection rule, and determine defects present in each target subregion.

[0019] According to a third aspect of this application, an electronic device is provided, the electronic device comprising a processor and a memory storing computer program instructions, wherein when the processor executes the computer program instructions, it realizes one of the above-described methods for determining defects in scanning electron microscope images.

[0020] According to a fourth aspect of this application, a computer-readable storage medium is provided, which stores computer program instructions, and is characterized in that when the computer program instructions are executed by a processor, one of the above-described methods for determining defects in scanning electron microscope images is realized.

[0021] As described above, the scanning electron microscope image defect determination method and apparatus according to this application have at least the following beneficial effects. First, based on the design layout, a first graphic detector and the corresponding first detection position in the design layout of the first graphic detector are determined. Then, based on the design layout, the first graphic detector, and the corresponding second detection position in the design layout of the second graphic detector are determined. Subsequently, based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, a scanning electron microscope image corresponding to the design layout is detected, and defects present in the scanning electron microscope image can be determined. This allows for the determination of a first graphic detector and its corresponding first detection position based on the design layout, followed by the determination of a second graphic detector and its corresponding second detection position, and then defect detection on the scanning electron microscope image. By fully considering each area of ​​the graphic unit in the design layout during the determination process of the first and second graphic detectors, the first and second graphic detectors can be determined more comprehensively and reliably. Furthermore, it is possible to effectively avoid missed detections during defect detection, thereby improving the accuracy and reliability of defect detection in scanning electron microscope images. [Brief explanation of the drawing]

[0022] To more clearly describe specific embodiments of this application or technical means in the prior art, the drawings that may be used in the description of specific embodiments or the prior art are briefly described below. Clearly, the drawings in the following description are some embodiments of this application, and those skilled in the art can obtain further drawings based on these drawings without any creative work.

[0023] [Figure 1] This is a flowchart of a method for determining defects in scanning electron microscope images according to an embodiment of this application. [Figure 2] It is a schematic diagram of a graphic unit and a graphic detector according to an embodiment of the present application. [Figure 3] It is a flowchart of a method for determining defects in a scanning electron microscope image according to an embodiment of the present application. [Figure 4] It is a structural diagram of a device for determining defects in a scanning electron microscope image according to an embodiment of the present application. [Figure 5] It is a structural diagram of an electronic device according to an embodiment of the present application.

Embodiments for Carrying Out the Invention

[0024] To make the above and other features and advantages of the present application clearer, the present application will be further described below with reference to the drawings. It should be understood that the specific examples provided in this specification are for the purpose of being interpreted by those skilled in the art, and are merely illustrative and not limiting.

[0025] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be clear to those skilled in the art that it is not necessary to employ the specific details to implement the present application. In other instances, well-known steps or operations are not described in detail in order to avoid obscuring the present application.

[0026] The method for determining defects in a scanning electron microscope image according to an embodiment of the present application may be executed by a device for determining defects in a scanning electron microscope image according to an embodiment of the present application, and the device may be arranged in an electronic device.

[0027] Referring to FIG. 1, the present application provides a method for determining defects in a scanning electron microscope image. The method includes the following steps.

[0028] In step 1​​​Here, a first graphic detector can be generated based on each graphic unit in the design layout, and then scanning electron microscope (SEM) images can be detected using this first graphic detector.

[0030] Furthermore, the first graphic detector may be of various types, including, for example, a break-type defect detector, a bridge-type defect detector, a critical dimension (CD) anomaly-type defect detector, etc., but this application does not limit it.

[0031] Herein, a disconnection-type defect detector may be used to detect defects formed by the disconnection of lines that should exist in the graphic in the design layout or lines in the graphic in the actual SEM image; a bridge-type defect detector may be used to detect defects formed by the connection of graphics that should be separated and spaced apart in the graphic in the design layout or between graphics in the actual SEM image; and a CD anomaly-type defect detector may be used to detect defects such as those where there is a large difference between the line width or spacing in the SEM image and the design line width or design spacing in the design layout, but this application is not limited thereto.

[0032] This allows the embodiments of the present application to determine a corresponding first graphic detector based on the characteristics of the graphic unit in the design layout, and then determine a first detection position of the first graphic detector in the design layout based on the position coordinates of the graphic region covered by the first graphic detector.

[0033] Optionally, based on pre-defined graphic description rules, the type of each first graphic detector and the corresponding first detection position of each first graphic detector in the design layout can be determined by traversing within the design layout.

[0034] Here, the graphic description rules may be pre-defined rules, or there may be multiple rules. Alternatively, defect features in a large number of scanning electron microscope images can be pre-analyzed to obtain defect rules, and then pre-defined graphic description rules can be formed. Or, defects in past scanning electron microscope images can be analyzed, and defect rules can be obtained through model training or the like to form pre-defined graphic description rules, but this application is not limited to this.

[0035] For example, based on pre-defined graphic description rules, the type of first graphic detector corresponding to each graphic unit in the design layout can be determined by traversing through the graphic units, and then the position of the first graphic detector in the design layout can be determined based on the position coordinates of the graphic area covered by the first graphic detector.

[0036] For example, if the pre-set graphic description rules are such that graphic description rule 1 is "disconnection type", graphic description rule 2 is "bridge type", and graphic description rule 3 is "CD anomaly type", then by traversing the design layout based on the pre-set graphic description rules and determining that graphic unit 1 matches graphic description rule 1, it is determined that the location of graphic unit 1 is a "disconnection type" defect graphic detector, and based on the position coordinates of the graphic area covered by the "disconnection type" defect graphic detector, the first detection position in the design layout of the first graphic detector can be determined, but this application is not limited to this.

[0037] Therefore, in the embodiments of this application, a traverse within the design layout can be performed based on a preset graphic description rule to determine a corresponding first graphic detector, which can detect a simple graphic that conforms to the graphic description rule.

[0038] In step 102, a second graphic detector and a corresponding second detection position in the design layout of the second graphic detector are determined based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector.

[0039] It should be understood that, after determining the design layout, the first graphic detector, and the first detection position corresponding to the first graphic detector, calculations can be performed on the first graphic detector in the design layout in order to determine the second graphic detector and the corresponding second detection position of the second graphic detector in the design layout.

[0040] Here, the arithmetic operation method may vary, for example, it may be a Boolean subtraction operation, or any other selectable operation, but this application is not limited thereto.

[0041] Furthermore, the second graphic detector may be a more complex detector than the first graphic detector, and may be a combination of multiple defects, making it impossible to describe with simple rules. It is necessary to process the design layout, the first graphic detector, and the first detection position, and then determine the second graphic detector and the corresponding second detection position from the design layout, but this application does not limit this.

[0042] For example, after determining the design layout, the first graphic detector, and the first detection position corresponding to the first graphic detector, a Boolean subtraction operation can be performed on each graphic unit and its corresponding first graphic detector within the design layout to determine the second graphic detector corresponding to each graphic unit, and the corresponding second detection position of the second graphic detector in the design layout.

[0043] Optionally, if any graphics unit in the design layout contains graphics regions other than the first graphics detector, the other graphics region may be determined as the second graphics detector, and then the position of the second graphics detector in the design layout may be determined as the second detection position.

[0044] It should be understood that, after the second graphic detector is determined, the second detection position in the design layout of the second graphic detector can be determined based on the position coordinates of the graphic region covered by the second graphic detector.

[0045] For example, if it is determined that one of the graphics units in the design layout has two first graphics detectors, such as the first graphics detector 1 and the first graphics detector 2 in Figure 2(a), as shown in Figure 2, then a Boolean subtraction operation is performed on the one of the graphics units and the two first graphics detectors to determine that the other graphics area in the one of the graphics units is the second graphics detector, and the hatched area in Figure 2(b) is the second graphics detector, and the corresponding position is the position of the second graphics detector. In this case, as shown in Figure 2(c), the one of the graphics units may correspond to three graphics detectors, that is, they may correspond to the first graphics detector 1, the first graphics detector 2, and the second graphics detector, respectively.

[0046] The above examples are merely illustrative and do not limit any one of the graphic units, the number and position of the first graphic detectors, or the number and position of the second graphic detectors in the embodiments of this application.

[0047] In step 103, a scanning electron microscope image corresponding to the design layout is detected based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, and defects present in the scanning electron microscope image are determined.

[0048] Here, after determining the first graphic detector and its corresponding first detection position, and the second graphic detector and its corresponding second detection position, a corresponding third position in the SEM image corresponding to the design layout can be determined based on the first detection position. Subsequently, a corresponding fourth position in the SEM image corresponding to the design layout can be determined based on the second detection position, and a first detection result can be obtained by detecting at the third position using the first detector, for example, to determine a specific, simple defect type, and a second detection result can be obtained by detecting at the fourth position using the second detector, for example, to determine whether or not a defect exists there. Subsequently, defects present in the SEM image can be identified based on the first and second detection results.

[0049] In other words, the first graphic detector can be used to detect defects that conform to the graphic rule description, and the second graphic detector can be used to detect complex graphics that cannot be detected by the first graphic detector. Therefore, even if there are gaps in the detection by the first graphic detector, after performing a Boolean operation on the design layout and the first graphic detector, all areas in the design layout other than the first detection location become second graphic detectors of each type, and are not affected by the rule description. As a result, when performing defect detection on an SEM image based on the first and second graphic detectors, it is possible to guarantee that there are no undetected locations in the entire SEM image, thereby improving the comprehensiveness and accuracy of defect detection.

[0050] Accordingly, in the embodiments of this application, SEM images can be detected by the first graphic detector and the second graphic detector, and in the process of determining the first graphic detector and the second graphic detector, each area of ​​the graphic unit in the design layout is taken into full consideration, so that the first graphic detector and the second graphic detector can be determined more comprehensively and reliably, and furthermore, when detecting SEM images using the first graphic detector and the second graphic detector, detection omissions can be effectively avoided, and the accuracy and reliability of defect detection in SEM images can be improved.

[0051] In the embodiments of this application, first, a first graphic detector and a corresponding first detection position in the design layout of the first graphic detector are determined based on the design layout; then, a second graphic detector and a corresponding second detection position in the design layout of the second graphic detector are determined based on the design layout, the first graphic detector, and the corresponding first detection position of the first graphic detector; and then, a scanning electron microscope image corresponding to the design layout is detected based on the first graphic detector and its corresponding first detection position, and the second graphic detector and its corresponding second detection position, and defects present in the scanning electron microscope image can be determined. This allows for the determination of a first graphic detector and its corresponding first detection position based on the design layout, followed by the determination of a second graphic detector and its corresponding second detection position, and then defect detection on the scanning electron microscope image. By fully considering each area of ​​the graphic unit in the design layout during the determination process of the first and second graphic detectors, the first and second graphic detectors are determined more comprehensively and reliably. Consequently, detection omissions can be effectively avoided during defect detection, improving the accuracy and reliability of defect detection in scanning electron microscope images.

[0052] As shown in Figure 3, the method for determining defects in scanning electron microscope images may include the following steps.

[0053] In step 301, the design layout is traversed based on pre-defined graphic description rules to determine the type of each first graphic detector and the corresponding first detection position of each first graphic detector in the design layout.

[0054] In step 302, a second graphic detector and a corresponding second detection position in the design layout of the second graphic detector are determined based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector.

[0055] In step 303, when the design layout and the scanning electron microscope image are aligned, a third detection position corresponding to the first detection position and a fourth detection position corresponding to the second detection position are determined in the scanning electron microscope image.

[0056] Here, there are various methods for aligning the design layout and the scanning electron microscope image. For example, the geometric centers of the design layout and the SEM image may be determined first, and then the two may be aligned. Alternatively, the geometric centers of the design layout and the SEM image may be determined first, and then the first central pattern unit closest to the geometric center in the design layout and the second central pattern unit closest to the geometric center in the SEM image may be determined, and the alignment of the design layout and the SEM image may be achieved by aligning the second central pattern unit with the first central pattern unit, but this application is not limited to this.

[0057] Accordingly, in the embodiments of this application, when the design layout and the SEM image are aligned, a third detection position corresponding to the first detection position in the SEM image can be determined based on the first detection position in the design layout of the first graphic detector, and a fourth detection position corresponding to the second detection position in the SEM image can be determined based on the second detection position in the design layout of the second graphic detector, but this application is not limited thereto.

[0058] For example, the corresponding coordinate position in the SEM image may be determined as the corresponding third detection position based on the coordinates of the first detection position in the design layout, and the corresponding coordinate position in the SEM image may be determined as the corresponding fourth detection position based on the coordinates of the second detection position in the design layout; however, this application is not limited to this.

[0059] Furthermore, step 302 may be performed before step 303, or step 303 may be performed before step 302, or step 302 and step 303 may be performed simultaneously, but this application does not limit this.

[0060] In step 304, detection is performed at the third detection position based on the first graphic detector corresponding to the first detection position, and the first detection result is obtained.

[0061] Here, after determining the third detection position based on the first detection position, the first graphic detector corresponding to the first detection position can be used to detect at the third detection position and obtain the first detection result. For example, if the first graphic detector is of the "disconnection type," the "disconnection type" detector can be used directly to detect at the third detection position and determine whether or not a "disconnection type" defect exists at the third detection position. If a "disconnection type" defect exists, the first detection result may be determined to indicate that a "disconnection type" defect exists at the third detection position. If it is determined that a "disconnection type" defect does not exist, the first detection result may be determined to indicate that a "disconnection type" defect does not exist at the third detection position.

[0062] In step 305, detection is performed at the fourth detection position based on the second graphic detector corresponding to the second detection position, and the second detection result is obtained.

[0063] Here, after determining the fourth detection position based on the second detection position, the second detection result can be obtained by using the second graphic detector corresponding to the second detection position to perform detection at the fourth detection position.

[0064] For example, if the second graphic detector is of the "complex" type, the "complex" detector can be directly used to detect at the fourth detection position and determine whether or not a "complex" defect exists at the fourth detection position, but this application does not limit this.

[0065] The first graphic detector may be a simple graphic detector capable of detecting a specific, simple defect type, and the second graphic detector may be a different detector from the first graphic detector, and the second graphic detector may have different graphic description rules from the first graphic detector and be capable of detecting any complex defect. For example, the second graphic detector may have general-purpose complex graphic description rules for detecting any complex graphic, thereby determining whether a complex type of defect is present, but this application is not limited to this.

[0066] As a result, in the embodiments of this application, the first graphic detector and the second graphic detector can detect all graphic units in the design layout, effectively avoiding detection omissions and improving the accuracy and reliability of defect detection.

[0067] Optionally, after determining a fourth detection position corresponding to a second detection position in the SEM image, calculations and detections may be performed on the graphic unit at the fourth detection position, for example, by performing grayscale value detection, graphic completeness calculation, etc., to determine whether or not a defect exists. Calculations and detections can be performed using any selectable method to determine whether or not a defect exists, but this application is not limited thereto.

[0068] In step 306, based on the first and second detection results, defects present in the scanning electron microscope image are determined.

[0069] Here, the first detection result and the second detection result can be identified as defects present in the SEM image. Alternatively, the first detection result and the corresponding third detection location, and the second detection result and the corresponding fourth detection location may be determined as defects and defect locations present in the SEM image, but this application is not limited to this.

[0070] Optionally, if the degree of matching corresponding to the first detection result is greater than the first threshold, the defect corresponding to the first detection result is determined to be the first defect; if the degree of matching corresponding to the second detection result is greater than the second threshold, the defect corresponding to the second detection result is determined to be the second defect; and both the first and second defects are determined to be defects in the scanning electron microscope image.

[0071] Here, the degree of matching can be used to indicate the accuracy of the detection result; a higher degree of matching indicates a more accurate detection result, and a lower degree of matching indicates a less accurate detection result, but this application is not limited to this.

[0072] Furthermore, the first and second thresholds may be preset values, and they may be equal or unequal, and may be adjusted according to the actual situation. For example, the first threshold may be set to a large value to improve the accuracy of simple defect detection, and the second threshold may be set to a relatively small value to ensure the comprehensiveness and completeness of complex defect detection. For example, the first threshold may be 0.9 and the second threshold may be 0.6. Alternatively, the second threshold may be set to a large value to further improve the accuracy of complex defect detection, for example, 0.85 or 0.9, but this application is not limited thereto.

[0073] For example, if the first threshold is 0.88 and the second threshold is 0.65, then in the first detection result, the defect type and matching degree are such that the matching degree for "disconnection type 1" is 0.93, the matching degree for "bridge type 1" is 0.6, the matching degree for "disconnection type 2" is 0.95, and the matching degree for "bridge type 2" is 0.96, respectively, allowing us to determine that the first defect is disconnection type 1, disconnection type 2, or bridge type 2. In the second detection result, the defect and matching degree are such that the matching degree for complex defect 1 is 0.75, the matching degree for complex defect 2 is 0.6, and the matching degree for complex defect 3 is 0.4, allowing us to determine that the second defect is complex defect 1.

[0074] Alternatively, in the second detection result, if the matching degree for "combination of disconnected wire type and disconnected wire type" is 0.7, the matching degree for "combination of bridge type and bridge type" is 0.68, and the matching degree for "combination of disconnected wire type and bridge type" is 0.55, the second defect may be determined to be a combination of disconnected wire type and disconnected wire type, a combination of bridge type and bridge type, etc., but this application does not limit this.

[0075] Optionally, a certain threshold range may be set, for example, a first threshold range and a second threshold range may be set, and the first and second threshold ranges may be adjusted based on indicators such as the accuracy, completeness, and comprehensiveness of defect detection, but this application is not limited thereto.

[0076] The above examples are merely illustrative and do not limit the methods for determining the first and second defects in the embodiments of this application.

[0077] After determining the first and second defects, the first and second defects may be determined as defects in the SEM image, or the first and second defects may be determined when determining defects in the scanning electron microscope image, or the positions corresponding to each defect in the first defect and the positions corresponding to each defect in the second defect may be determined, but it should be understood that this application is not limited thereto.

[0078] In the actual production process, there is a possibility of damaging (scratching) the wafer due to malfunctions, which may result in defects such as scratches. Therefore, in this application, it should be understood that the completeness and comprehensiveness of defect detection can be ensured by performing defect detection on areas that do not include the graphics unit.

[0079] Optionally, a first region that does not include a graphics unit may be determined in the design layout, then a second region corresponding to the first region may be determined in a scanning electron microscope image, and the second region may be detected based on a predetermined detection rule to determine defects present in the second region.

[0080] Here, a first region that does not include a graphics unit can be determined based on the position of the graphics unit in the design layout, and this region may be regular or irregular, but is not limited to this in this application.

[0081] Furthermore, there may be multiple types of predetermined detection rules. For example, the rules may include an acceptable range for grayscale values ​​and a requirement that pixel values ​​be a certain numerical value, but this application does not limit them.

[0082] For example, if the predetermined detection rule is such that the tolerance range for grayscale values ​​is [200, 255], and the grayscale value at a certain position 1 within the current second region is 0, and exceeds the tolerance range for grayscale values, it is determined that there may be a defect at that position. Subsequently, the image data at the second position in the SEM image can be analyzed to determine the presence of the defect, etc., but this application is not limited to this.

[0083] Optionally, the predetermined detection rule may be whether the tonal value is equal to the tonal mean corresponding to the second region, and if the tonal value is equal to the tonal mean corresponding to the second region, then no defect exists. For example, if the current tonal mean in the second region is 60, the tonal value at a certain position 6 in the second region is 40, and the tonal value at a certain position 7 in the second region is 80, then based on the predetermined detection rule, it can be determined that a defect or the like exists in the second region, but this application is not limited to this.

[0084] Optionally, the predetermined detection rule may be whether or not the deviation between the grayscale value and the average grayscale value corresponding to the second region is within a certain range, and if the deviation is within a certain range, then no defect exists.

[0085] For example, if the predetermined detection rule is that the deviation between the tone value and the tone mean is within 5, then if the current tone mean in the second region is 100, and the tone value at a certain position 2 in the second region is 50, and the error between that position and the tone mean of 100 exceeds a deviation of 5, then it can be determined that a defect exists in the second region. Alternatively, if the current tone mean in the second region is 80, and the tone value at a certain position 3 in the second region is 120, and the error between that position and the tone mean exceeds a deviation of 5, then it can be determined that a defect exists in the second region. Alternatively, if the current average tone value within the second region is 50, the tone value at a certain position 4 within the second region is 78, the tone value at a certain position 5 within the second region is 41, and the error between both and the average tone value exceeds a deviation of 5, it can be determined that defects or the like exist within the second region, but this application does not limit this. The blank area that does not include a graphic unit may be divided into an area close to the design layout area and an area far from the design layout area, and so on, in the embodiment of this application, the first region may be divided into a plurality of sub-regions, and the second region may be detected based on each sub-region, and defects that may exist in the second region may be determined.

[0086] Optionally, if the first region is larger than the reference region, the first region can be divided into multiple subregions. Then, based on a pre-configured relationship table, a predetermined target detection rule corresponding to each subregion can be determined. Furthermore, a target subregion corresponding to each subregion can be determined in the scanning electron microscope image. Based on the predetermined target detection rule, each target subregion can be detected, and defects present in each target subregion can be determined.

[0087] Here, the reference region may be a predetermined region. If the first region is smaller than the reference region, the first region is considered to be a region close to the design layout, and its region range is relatively small, so it is not considered necessary to divide it into sub-regions. If the first region is larger than the reference region, its region range is considered to be relatively large, and it is considered to include a region portion close to the design layout as well as a region portion far from the design layout. Therefore, the first region can be divided into multiple sub-regions. For example, the first region can be divided into sub-region 1 and sub-region 2 such that one is smaller than the reference region and the other is larger than the reference region. Alternatively, the first region can be divided equally according to its size to obtain multiple sub-regions, but this application does not limit this.

[0088] Furthermore, the pre-configured relationship table may include correspondences between each sub-region and a predetermined detection rule, for example, mapping relationships between three sub-regions and their corresponding predetermined detection rules, mapping relationships between four sub-regions and their corresponding predetermined detection rules, mapping relationships between ten sub-regions and their corresponding predetermined detection rules, etc., but this application is not limited to these.

[0089] For example, if we currently divide the first region into three subregions, we can traverse the relationship table to obtain the mapping relationship between the three subregions and the corresponding predetermined detection rules. For instance, if the distance between subregions 1, 2, and 3 and the design layout increases in order from closest to furthest, and the predetermined detection rule corresponding to subregion 1 has a tolerance range of [0, 100], the predetermined detection rule corresponding to subregion 2 has a tolerance range of [101, 200], and the predetermined detection rule corresponding to subregion 3 has a tolerance range of [201, 225], then we can determine that the target predetermined detection rule 1 for subregion 1 should satisfy a tone value of [0, 100], the target predetermined detection rule 2 for subregion 2 should satisfy a tone value of [101, 200], and the target predetermined detection rule 3 for subregion 3 should satisfy a tone value of [201, 225], but this application is not limited to this.

[0090] Subsequently, target subregions corresponding to each subregion can be determined in the SEM image. For example, if the design layout and the SEM image are aligned, target subregions corresponding to each subregion can be determined based on coordinate positions, etc., or target subregions corresponding to each subregion can be determined by any selectable method, but this application is not limited thereto.

[0091] It should be understood that after determining the target subregion corresponding to each subregion in the SEM image, the corresponding target subregion can be detected using the target-specific detection rule corresponding to each subregion, and it can be determined whether or not a defect exists in each target subregion.

[0092] For example, the target predetermined detection rule 1 for sub-region 1 is that the tonal value should satisfy [0, 100], the target predetermined detection rule 2 for sub-region 2 is that the tonal value should satisfy [101, 200], and the target predetermined detection rule 3 for sub-region 3 is that the tonal value should satisfy [201, 225]. In this case, the target sub-region 1 can be detected in the SEM image, and it can be determined whether or not the tonal value of the target sub-region 1 satisfies [0, 100]. If all values ​​are less than 100, it can be determined that there are no defects in the target sub-region 1. Subsequently, the tonal value of the target sub-region 2 in the SEM image can be detected according to the target predetermined detection rule 2, and the tonal value of the target sub-region 3 in the SEM image can be detected according to the target predetermined detection rule 2, and it can be determined whether or not there are defects in the target sub-regions 2 and 3.

[0093] The above examples are merely illustrative and do not limit the number of target sub-regions, the number of defects, or the method for determining defects present in each target sub-region in the embodiments of this application.

[0094] As a result, in the embodiments of this application, the first and second graphic detectors can not only enable detection based on contour extraction of graphic units, but also enable defect detection in blank areas that do not contain graphic units. By detecting singularities, more potential defects can be determined, thereby enabling defect detection across the entire image, ensuring the completeness and comprehensiveness of defect detection, and further improving the overall accuracy of defect detection.

[0095] In the embodiments of this application, first, the design layout is traversed based on a pre-set pattern description rule to determine the type of each first graphic detector and the corresponding first detection position of each first graphic detector in the design layout. Then, based on the design layout, the first graphic detector, and the first detection position corresponding to the first graphic detector, the second graphic detector and the corresponding second detection position of the second graphic detector in the design layout are determined. When the design layout and the scanning electron microscope image are aligned, the third detection position corresponding to the first detection position and the fourth detection position corresponding to the second detection position in the scanning electron microscope image are determined. Then, based on the first graphic detector corresponding to the first detection position, detection is performed at the third detection position to obtain a first detection result, and based on the second graphic detector corresponding to the second detection position, detection is performed at the fourth detection position to obtain a second detection result. Subsequently, based on the first and second detection results, defects present in the scanning electron microscope image can be determined. This allows for the determination of a first graphic detector and its corresponding first detection position based on the design layout, followed by the determination of a second graphic detector and its corresponding second detection position, and then defect detection on the SEM image. By fully considering each area of ​​the graphic unit in the design layout during the determination process of the first and second graphic detectors, the first and second graphic detectors are determined more comprehensively and reliably. Furthermore, it is possible to effectively avoid missed detections during defect detection, thereby improving the accuracy and reliability of defect detection in SEM images.

[0096] This application provides a device for determining defects in scanning electron microscope images. As shown in Figure 4, the device comprises a first determination module 410, a second determination module 420, and a first detection module 430.

[0097] Here, the first determination module 410 is configured to determine a first graphic detector and the corresponding first detection position of the first graphic detector in the design layout based on the design layout; the second determination module 420 is configured to determine a second graphic detector and the corresponding second detection position of the second graphic detector in the design layout based on the design layout, the first graphic detector, and the corresponding first detection position of the first graphic detector; and the first detection module 430 is configured to detect a scanning electron microscope image corresponding to the design layout and determine defects present in the scanning electron microscope image based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position.

[0098] In some embodiments, the first determination module 410 is specifically configured to traverse the design layout based on a pre-configured graphic description rule to determine the type of each first graphic detector and the corresponding first detection position of each of the first graphic detectors in the design layout.

[0099] In some embodiments, the second determination module 420 is configured to determine, specifically, if any other graphics region other than the first graphics detector exists in any one of the graphics units in the design layout, to determine the other graphics region as the second graphics detector, and to determine the position of the second graphics detector in the design layout as the second detection position.

[0100] In some embodiments, the first detection module 430 includes, when the design layout and the scanning electron microscope image are aligned, a first determination unit for determining a third detection position corresponding to a first detection position and a fourth detection position corresponding to a second detection position in the scanning electron microscope image; a first detection unit for detecting at the third detection position based on a first graphic detector corresponding to the first detection position to obtain a first detection result; a second detection unit for detecting at the fourth detection position based on a second graphic detector corresponding to the second detection position to obtain a second detection result; and a second determination unit for determining defects present in the scanning electron microscope image based on the first and second detection results.

[0101] In some embodiments, the second determination unit is configured to determine a defect corresponding to the first detection result as a first defect if the degree of matching corresponding to the first detection result is greater than a first threshold, and to determine a defect corresponding to the second detection result as a second defect if the degree of matching corresponding to the second detection result is greater than a second threshold, and to determine the first defect and the second defect as defects in the scanning electron microscope image.

[0102] In some embodiments, the apparatus further comprises: a third determination module for determining a first region in the design layout that does not include a graphics unit; a fourth determination module for determining a second region in the scanning electron microscope image that corresponds to the first region; and a second detection module for detecting the second region and determining defects present in the second region based on predetermined detection rules.

[0103] In some embodiments, the second detection module is configured to, specifically, if the first region is larger than the reference region, divide the first region into a plurality of subregions, determine a predetermined target detection rule corresponding to each subregion based on a pre-configured relationship table, determine a target subregion corresponding to each subregion in the scanning electron microscope image, detect each target subregion based on the predetermined target detection rule, and determine defects present in each target subregion.

[0104] The scanning electron microscope image defect determination device according to this application first determines a first graphic detector and a corresponding first detection position in the design layout of the first graphic detector based on the design layout, then determines a second graphic detector and a corresponding second detection position in the design layout of the second graphic detector based on the design layout, the first graphic detector, and the corresponding first detection position of the first graphic detector, and then detects a scanning electron microscope image corresponding to the design layout based on the first graphic detector and its corresponding first detection position, and the second graphic detector and its corresponding second detection position, thereby determining defects present in the scanning electron microscope image. This allows for the determination of a first graphic detector and its corresponding first detection position based on the design layout, followed by the determination of a second graphic detector and its corresponding second detection position, and then defect detection on the scanning electron microscope image. By fully considering each area of ​​the graphic unit in the design layout during the determination process of the first and second graphic detectors, the first and second graphic detectors can be determined more comprehensively and reliably, effectively avoiding missed detections during defect detection and improving the accuracy and reliability of defect detection in scanning electron microscope images.

[0105] The specific features, operations, and details described herein relating to the method of this application may also apply to the apparatus and system of this application, and vice versa. Furthermore, each step of the aforementioned method of this application may be performed by the corresponding component or unit of the apparatus or system of this application.

[0106] All or part of each module / unit of the apparatus of this application may be implemented by software, hardware, firmware, or a combination thereof. Each module / unit may be embedded in the processor of the electronic device in hardware or firmware form, or independently of the processor, or may be stored in the memory of the electronic device in software form and invoked by the processor to perform operations on each module / unit. Each module / unit may be implemented as an independent component or module, or two or more modules / units may be implemented as a single component or module.

[0107] As shown in Figure 5, this application provides an electronic device 500 including a processor 501 and a memory 502 in which computer program instructions are stored. When the processor 501 executes the computer program instructions, it implements each step of the scanning electron microscope image defect determination method described above. The electronic device 500 may be a server, a terminal, or any other electronic device having the necessary computing and / or processing capabilities.

[0108] In one embodiment, the electronic device 500 may include a processor, memory, network interface, communication interface, etc., connected via a system bus. The processor of the electronic device 500 is used to provide the necessary calculation, processing, and / or control capabilities. The memory of the electronic device 500 may include a non-volatile storage medium and internal memory. This non-volatile storage medium can store an operating system, computer programs, etc. The internal memory may provide an environment for executing the operating system and computer programs on the non-volatile storage medium. The network interface and communication interface of the electronic device 500 are used to connect and communicate with external devices via a network. Once the computer program is executed by the processor, the steps of the method of this application are performed.

[0109] This application provides a computer-readable storage medium in which computer program instructions are stored, and when the computer program instructions are executed by a processor, the above-described method for determining defects in scanning electron microscope images is realized.

[0110] As those skilled in the art will understand, the steps of the method of this application can be executed by a computer program instructing relevant hardware, such as electronic device 500 or a processor, the computer program may be stored in a non-temporary computer-readable storage medium, and the steps of this application are executed when the computer program is executed. In some cases, any reference to memory, storage or other medium in this specification may include non-volatile or volatile memory. Examples of non-volatile memory include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, magnetic tape, flexible disk, magneto-optical data storage device, optical data storage device, hard disk, solid-state disk, etc. Examples of volatile memory include RAM (Random Access Memory) and external cache memory.

[0111] The technical features described above can be combined in any way. While not all possible combinations of these features are described, any combination of these features should be considered encompassed by this specification, provided that it does not create a contradiction.

[0112] The above embodiments are merely for illustrating the technical concepts of this application and are not intended to limit them. While this application has been described in detail with reference to the above embodiments, those skilled in the art can modify the technical concepts described in the above embodiments or make equivalent substitutions to some or all of the technical features therein. It should be understood that such modifications or substitutions do not cause the essence of the corresponding technical concepts to deviate from the scope of the technical concepts of each embodiment of this application.

Claims

1. Based on the design layout, the first graphic detector and the corresponding first detection position of the first graphic detector in the design layout are determined, Based on the design layout, the first graphic detector, and the first detection position corresponding to the first graphic detector, the second graphic detector and the corresponding second detection position of the second graphic detector in the design layout are determined. The method includes detecting a scanning electron microscope image corresponding to the design layout based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, and determining defects present in the scanning electron microscope image. Based on the design layout, the first graphic detector, and the first detection position corresponding to the first graphic detector, determining the second graphic detector and the corresponding second detection position of the second graphic detector in the design layout is: If any one of the graphics units in the design layout has a graphics area other than the first graphics detector, the other graphics area is determined to be the second graphics detector. A method for determining defects in a scanning electron microscope image, characterized by comprising determining the position of the second graphic detector in the design layout as a second detection position.

2. Based on the design layout, determining the first graphic detector and the corresponding first detection position of the first graphic detector in the design layout is: A method for determining defects in a scanning electron microscope image according to claim 1, characterized in that it includes traversing the design layout based on a pre-set graphic description rule to determine the type of each of the first graphic detectors and the corresponding first detection position of each of the first graphic detectors in the design layout.

3. Based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, detecting a scanning electron microscope image corresponding to the design layout and determining defects present in the scanning electron microscope image is: When the design layout and the scanning electron microscope image are aligned, a third detection position corresponding to the first detection position and a fourth detection position corresponding to the second detection position are determined in the scanning electron microscope image. Based on the first graphic detector corresponding to the first detection position, detection is performed at the third detection position to obtain the first detection result. Based on the second graphic detector corresponding to the second detection position, detection is performed at the fourth detection position to obtain the second detection result. A method for determining defects in a scanning electron microscope image according to claim 1, characterized in that it includes determining defects present in the scanning electron microscope image based on the first detection result and the second detection result.

4. Based on the first detection result and the second detection result, determining the defects present in the scanning electron microscope image is: In accordance with the matching degree corresponding to the first detection result being greater than the first threshold, the defect corresponding to the first detection result is determined to be the first defect, In accordance with the fact that the degree of matching corresponding to the second detection result is greater than the second threshold, the defect corresponding to the second detection result is determined to be the second defect, The method for determining defects in a scanning electron microscope image according to claim 3, characterized in that it includes determining the first defect and the second defect as defects in the scanning electron microscope image.

5. In the aforementioned design layout, a first region that does not include a graphics unit is determined, In the scanning electron microscope image, a second region corresponding to the first region is determined, The method for determining defects in a scanning electron microscope image according to claim 1, further comprising detecting the second region based on a predetermined detection rule and determining defects present in the second region.

6. Detecting the second region and determining the defects present in the second region based on the predetermined detection rules is: If the first region is larger than the reference region, the first region is divided into multiple sub-regions, Based on a pre-configured relationship table, a predetermined target detection rule corresponding to each sub-region is determined, In the scanning electron microscope image, determine the target sub-region corresponding to each of the sub-regions, The method for determining defects in a scanning electron microscope image according to claim 5, comprising detecting each target sub-region based on a predetermined target detection rule and determining defects present in each target sub-region.

7. Based on the design layout, a first graphic detector and a first determination module for determining the corresponding first detection position of the first graphic detector in the design layout, A second determination module for determining a second graphic detector and a corresponding second detection position of the second graphic detector in the design layout, based on the design layout, the first graphic detector, and a first detection position corresponding to the first graphic detector. The system includes a first detection module for detecting a scanning electron microscope image corresponding to the design layout based on the first graphic detector and the corresponding first detection position, and the second graphic detector and the corresponding second detection position, and for determining defects present in the scanning electron microscope image. A defect determination device for scanning electron microscope images, characterized in that the second determination module is configured to determine, if any graphic area other than the first graphic detector exists in any one graphic unit in the design layout, as the other graphic area, and to determine the position of the second graphic detector in the design layout as the second detection position.

8. It comprises a processor and memory in which computer program instructions are stored. When the processor executes the computer program command, it realizes the method for determining defects in scanning electron microscope images according to any one of claims 1 to 6. An electronic device characterized by the following features.

9. A computer-readable storage medium in which computer program instructions are stored, When the computer program command is executed by the processor, the method for determining defects in scanning electron microscope images according to any one of claims 1 to 6 is realized. A computer-readable storage medium characterized by the following features.

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