Electronic control device and method for manufacturing an electronic control device

Abstract

To preferably perform soldering of an electronic component that is inserted into and mounted onto a circuit board.SOLUTION: An electronic control device is that an electronic component 2 is inserted into and mounted onto a front surface 6 of a circuit board 1. The circuit board 1 includes: a through hole 5 to which a lead terminal 4 of the electronic component 2 is penetrated; a first land 9 that is formed to the circumference of the through hole 5 on the front surface 6; and a second land 11 that is formed to the circumference of the through hole 5 on a back surface 7. A solder 14 for soldering the electronic component 2 to the circuit board 1 is coated to the first land 9 and the second land 11.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic control device and a method for manufacturing the electronic control device.

Background Art

[0002] For example, Patent Document 1 discloses a technique in which a paste material containing solder powder and a vehicle component is supplied to an area provided with electrodes on a substrate on which electronic components are mounted, and a paste material composed of a vehicle component not containing solder powder is supplied to an area adjacent to the area and not provided with electrodes. By doing so, during heat melting, diffusion of the paste material does not occur, and solder is supplied to the electrodes on the substrate without excess or deficiency.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, Patent Document 1 targets electronic components surface-mounted on a substrate. That is, there is room for further improvement in supplying solder without excess or deficiency when soldering electronic components inserted and mounted on a circuit board.

Means for Solving the Problems

[0005] The electronic control device of the present invention is one in which electronic components are inserted and mounted on a first surface of a circuit board. The circuit board has a through-hole through which lead terminals of the electronic components penetrate, a first land formed around the through-hole on the first surface, and a second land formed around the through-hole on a second surface opposite to the first surface. Solder for soldering the electronic components to the circuit board is applied to the first land and the second land. The second land described above has an annular inner land portion formed on the outer edge of the through-hole and a plurality of outer land portions located on the outer side of the inner land portion to which solder is applied. The lead terminal has a rectangular cross-section, and the outer land portions are formed at positions facing the corners of the lead terminal inserted into the through-hole. [Effects of the Invention]

[0006] According to the present invention, since solder for soldering electronic components is also applied to the second land, solder wetting of the second land is ensured, and the occurrence of so-called red eye can be suppressed. Furthermore, when soldering electronic components to the circuit board, the correct amount of solder can be supplied. [Brief explanation of the drawing]

[0007] [Figure 1] Cross-sectional view of the main part of the circuit board of the electronic control device according to the present invention. [Figure 2] A schematic diagram showing the inner and outer land sections of the second land. [Figure 3] A schematic diagram illustrating an example of a mask opening in the second land. [Figure 4] A schematic diagram illustrating an example of a mask opening in the second land. [Figure 5] An explanatory diagram showing the process of mounting components onto a circuit board of an electronic control device according to the present invention, arranged in chronological order. [Figure 6] A schematic diagram illustrating an example of a second land when the cross-sectional shape of the lead terminal is rectangular. [Figure 7] A schematic diagram illustrating an example of a second land when the cross-sectional shape of the lead terminal is circular. [Modes for carrying out the invention]

[0008] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

[0009] Figure 1 is a cross-sectional view of the main part of the circuit board 1 of the electronic control device according to the present invention. The electronic control device has a circuit board 1 on which electronic components 2 are inserted and mounted. The electronic components 2 are so-called through-hole components such as DIP or SIP. The electronic components 2 have a plurality of lead terminals 4 protruding from the main body 3. The lead terminals 4 are inserted into through-holes 5 formed through the circuit board 1. The electronic components 2 are fixed to the circuit board 1 by soldering the lead terminals 4.

[0010] The circuit board 1 has wiring patterns formed on both sides, and electronic components 2 are inserted and mounted on the first surface 6. Components can also be mounted on the second surface 7 of the circuit board 1. The circuit board 1 may also be a multilayer board composed of multiple wiring layers. In other words, the circuit board 1 may be a multilayer wiring board in which conductive layers and non-conductive layers are stacked.

[0011] Furthermore, both sides of the circuit board 1 are covered with a resist layer 8 made of an insulating material.

[0012] On the surface 6 of the circuit board 1, an annular first land 9 is formed around the outer edge (periphery) of the through-hole 5 into which the lead terminal 4 is inserted. The first land 9 is exposed by a surface-side resist layer opening 10 formed on the outer periphery side of the through-hole 5.

[0013] The surface-side resist layer opening 10 is slightly larger than the first land 9 and extends to a predetermined distance outside the outer circumference of the first land 9 in the radial direction. In other words, the surface-side resist layer opening 10 forms a continuous annular region on the outer circumference side of the first land 9 where the resist layer 8 does not exist. That is, the surface-side resist layer opening 10 is formed such that its inner circumference is located outside the outer circumference of the first land 9. The surface-side resist layer opening 10 is, for example, a circular opening.

[0014] Note that the surface-side resist layer opening 10 may be formed so as to entirely overlap with the first land 9. That is, the surface-side resist layer opening 10 may be formed, for example, to be smaller than the first land 9 and entirely located inside the first land 9.

[0015] On the back surface 7 of the circuit board 1, an annular second land 11 is formed on the outer peripheral edge (periphery) of the through hole 5 into which the lead terminal 4 is inserted. The second land 11 has an annular inner land portion 11a formed on the outer peripheral edge of the through hole 5 and a plurality of outer land portions 11b located on the outer peripheral side of the inner land portion 11a and connected to the inner land portion 11a.

[0016] FIG. 2 is an explanatory diagram schematically showing the inner land portion 11a and the outer land portion 11b of the second land 11. The outer land portion 11b has an overall arcuate curved shape and is located on the outer peripheral side of the inner land portion 11a. The outer land portion 11b in FIG. 2 has a shape obtained by removing a second sector from a first sector centered on the center of the through hole 5 in a plan view. The second sector is a sector centered on the center of the through hole 5 and having a shorter radius than the first sector in a plan view. The outer land portions 11b are provided at four locations at equal intervals intermittently in the circumferential direction of the inner land portion 11a. Note that the reference numeral 12 in FIG. 2 is a mask opening described later.

[0017] The second land 11 is exposed by a back surface-side resist layer opening 13 formed on the outer peripheral side of the through hole 5.

[0018] The back surface-side resist layer opening 13 is formed to be slightly larger than the second land 11 and to include a position a predetermined distance outside the outer periphery of the second land 11. That is, on the outer peripheral side of the second land 11, an annular continuous region where the resist layer 8 does not exist due to the back surface-side resist layer opening 13 is formed. In other words, the back surface-side resist layer opening 13 is formed such that its inner circumference is located outside the outer periphery of the second land 11. The back surface-side resist layer opening 13 is, for example, a circular opening.

[0019] In addition, the backside resist layer opening 13 may be formed so as to entirely overlap with the second land 11. That is, the backside resist layer opening 13 may be formed, for example, smaller than the second land 11 and entirely positioned inside the second land 11.

[0020] When soldering the electronic component 2 to the circuit board 1, cream状 (paste状) solder 14 is applied to the first land 9 on the surface 6 and the second land 11 on the back surface 7. The electronic component 2 is soldered to the circuit board 1 by the solder 14a applied to the first land 9 and the solder 14b applied to the second land 11.

[0021] The amount of solder 14a applied to the first land 9 is less than the amount when soldering the electronic component 2 with the solder applied to one side of the circuit board 1. That is, the application amount of the solder 14a applied to the first land 9 is less than the amount when soldering the electronic component 2 to the circuit board 1 without applying the solder 14b to the second land 11.

[0022] The solder 14 melts during reflow and flows into the through-hole 5 as indicated by the arrow in FIG. 1. That is, the solder 14 for soldering the inserted and mounted electronic component 2 to the circuit board 1 is the solder 14a on the surface 6 side and the solder 14b on the back surface 7 side.

[0023] The solder 14 is applied to the circuit board 1 using a jig such as a solder mask (not shown). The solder mask is a plate-shaped member having an opening (for example, mask opening 12) corresponding to the portion of the circuit board 1 where the solder is to be applied.

[0024] For example, cream状 (paste状) solder 14a is applied to the first land 9 so as to protrude beyond the outside of the first land 9. Note that cream状 (paste状) solder 14a may be applied to the first land 9 so as not to protrude beyond the outside of the first land 9.

[0025] On the second land 11, a creamy (paste-like) solder 14b is applied to the outer land portion 11b located on the outer periphery. In Figure 2, the dashed lines indicate the mask openings 12 that correspond to the solder 14b of the solder mask used when applying solder to the back surface 7.

[0026] In Figure 2, the mask opening 12 is formed to have the same shape as the outer land portion 11b. In the case of the mask opening 12 in Figure 2, a creamy (paste-like) solder 14b is applied to the second land 11 so as not to spill out onto the outside of the second land 11.

[0027] Furthermore, the mask opening 12 can also be set to extend beyond the range of the outer land portion 11b, as shown in Figure 3 or Figure 4.

[0028] In Figure 3, the mask opening 12 is similar in shape to the outer land portion 11b when viewed from above, and is formed to be slightly larger than the outer shape of the outer land portion 11b.

[0029] In Figure 3, a creamy (paste-like) solder 14b is applied to a portion of the inner land portion 11a and the outer land portion 11 of the second land 11. In Figure 3, the solder 14b is applied so as to extend beyond the outer edge of the outer land portion 11b. More specifically, in Figure 3, the solder 14b is applied so as to extend beyond the outer edge of a portion of the inner land portion 11a and the outer land portion 11b.

[0030] In Figure 4, the mask opening 12, in plan view, has a shape similar to the outer land portion 11b, with its inner circumference overlapping the inner land portion 11a, and the center of the inner circumference partially protruding outward from the inner land portion 11a toward the center of the through-hole 5.

[0031] In Figure 4, a creamy (paste-like) solder 14b is applied to a portion of the inner land portion 11a and the outer land portion 11b of the second land 11. In Figure 4, the solder 14b is applied so as to extend from the inner circumference side of the inner land portion 11a to the through-hole 5 side (outside).

[0032] Figure 5 is an explanatory diagram showing the process of mounting components to the front surface 6 and back surface 7 of circuit board 1 in chronological order. Figure 5 is arranged in alphabetical order from (a) to (h), with (a) being the initial state and (h) being the final state. After the components on the back surface 7 of circuit board 1 are mounted by soldering, the components on the front surface 6 are mounted by soldering. Electronic component 2 is soldered during the component mounting process on the front surface 6.

[0033] In Figure 5, reference numeral 21 denotes a surface-mount component that is surface-mounted on surface 6. Reference numeral 22 denotes a back-mount component that is surface-mounted on back 7. Reference numeral 23 denotes a land for soldering the surface-mount component 21. Reference numeral 24 denotes a land for soldering the back-mount component 22. Reference numeral 25 denotes solder for soldering the surface-mount component 21. Reference numeral 26 denotes solder for soldering the back-mount component 22.

[0034] In Figure 5, the circuit board 1 is formed such that the front-side resist layer opening 10 is smaller than the first land 9, and the entire opening is located inside the first land 9. Also, in Figure 5, the circuit board 1 is formed such that the back-side resist layer opening 13 is smaller than the second land 11, and the entire opening is located inside the second land 11.

[0035] Figure 5(a) shows the initial state of circuit board 1. Neither side of circuit board 1 has solder applied.

[0036] Figure 5(b) shows the state in which solder 14b and solder 26 have been applied to the back surface 7 of the circuit board 1. Solder 14b is applied to the outer periphery of the second land 11. The amount of solder 14b applied is set so that it does not enter the through-hole 5 at least during the first reflow (as shown in Figure 5(d), which will be described later).

[0037] Figure 5(c) shows the circuit board 1 with back-mount components 22 placed on the back surface 7.

[0038] Figure 5(d) shows the state after the solder 14b and solder 26 applied to the back surface 7 of the circuit board 1 have been reflowed and the back-mount components 22 have been soldered. The solder 14b and 27 applied to the back surface 7 of the circuit board 1 are melted when the circuit board 1 is brought into the reflow oven. The molten solder 14b solidifies on the second land 11 when the circuit board 1 is removed from the reflow oven. The molten solder 26 solders the back-mount components 22 to the circuit board 1.

[0039] When the solder 14b and solder 26 applied to the circuit board 1 are heated in a reflow oven, the flux volatilizes due to the heat, and the volume after reflow decreases compared to the volume before reflow.

[0040] Figure 5(e) shows the circuit board 1 in the state shown in Figure 5(d) but inverted. In other words, Figure 5(e) is essentially the same as Figure 5(d).

[0041] Figure 5(f) shows the state in which solder 14a and solder 25 have been applied to the surface 6 of the circuit board 1. Solder 14a is applied to the first land 9. In the example shown in Figure 5, solder 14a is applied so as to seal the opening on the surface 6 side of the through hole 5.

[0042] Figure 5(g) shows the state in which the electronic component 2 and surface mount components 21 are placed on the surface 6 of the circuit board 1.

[0043] Figure 5(h) shows the state after reflow soldering the solder 14a and solder 25 applied to the surface 6 of the circuit board 1, and soldering the electronic component 2 and surface mount component 21. The solder 14a and solder 25 applied to the surface 6 of the circuit board 1 are melted by heating the circuit board 1 in a reflow oven. The molten solder 14a solders the electronic component 2 to the circuit board 1. The molten solder 25 solders the surface mount component 21 to the circuit board 1.

[0044] At this time, the solder 14b on the second land 11 melts again when the circuit board 1 is brought into the reflow oven and heated, entering the through-holes 5 and spreading across the entire second land 11.

[0045] In other words, when soldering the electronic component 2, solder 14a from the surface 6 and solder 14b from the back surface 7 are supplied to the through-hole 5. This means that the electronic control device can supply the correct amount of solder 14 to the through-hole 5 from both the surface 6 and the back surface 7, thereby suppressing the occurrence of soldering defects in the electronic component 2 to the circuit board 1 due to insufficient or excessive solder.

[0046] Furthermore, when the circuit board 1 is removed from the reflow oven, the solder 14b on the second land 11 solidifies again, spreading across the entire second land 11.

[0047] When the solder 14a and solder 25 applied to the circuit board 1 are heated in a reflow oven, the flux volatilizes due to the heat, and the volume after reflow decreases compared to the volume before reflow. In addition, the solder 14a that has been applied over the resist layer 8 accumulates on the first land 9 after reflow.

[0048] When solder is applied only to the first land 9 on the surface 6 for soldering the electronic component 2, it is preferable to ensure that the solder applied to the first land 9 does not spread to the second land 11 during reflow and expose the copper foil portion of the second land 11.

[0049] Therefore, in order to ensure sufficient solder to be applied to the first land 9, it is necessary to increase the solder application area for the first land 9, which may hinder high-density mounting of the circuit board 1 and narrowing of the pitch of mounted components.

[0050] However, in the electronic control device of the above embodiment, solder 14 for soldering the electronic component 2 to be inserted and mounted on the surface 6 is applied to the first land 9 on the surface 6 side and the second land 11 on the back surface 7 side. Therefore, the electronic control device of the above embodiment can reduce the amount of solder 14a applied to the first land 9 compared to the case where solder for soldering the electronic component 2 is applied only to the first land 9.

[0051] In other words, the electronic control unit can relatively reduce (suppress) the opening area of ​​the solder mask used for soldering to the first land 9 of the solder mask when applying solder to the surface 6 of the circuit board 1, thereby enabling high-density mounting of the circuit board 1 and narrow pitch of mounted components.

[0052] Furthermore, since the electronic control unit also has solder 14b applied to the second land 11 on the back side 7 for soldering the electronic component 2, solder wetting of the second land 11 is ensured, and the occurrence of so-called red eye can be suppressed. In addition, the electronic control unit can supply the correct amount of solder when soldering the electronic component 2 to the circuit board 1.

[0053] The solder 14b applied to the second land 11 is applied at a position further away from the through-hole 5 in the through-hole radial direction than the solder 14a applied to the first land 9. In addition, solder 14b is applied to the outer circumference of the second land 11, but no solder is applied to the inner circumference.

[0054] Therefore, the electronic control unit can prevent the solder 14b applied to the second land 11 from flowing into the through-hole 5 during reflow of the solder applied to the back surface 7, and can reliably insert the lead terminals 4 of the electronic component 2 into the through-hole 5.

[0055] Although specific embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.

[0056] In the first embodiment described above, the number of outer land portions 11b is not limited to four, but may be three or fewer, or five or more. Also, the spacing and length of the outer land portions 11b along the circumferential direction of the inner land portion 11a may be non-uniform. Furthermore, the outer land portions 11b may be formed biased to one side of the second land 11 in a plan view, depending on the arrangement and pitch of the lead terminals 4 of the electronic component 2.

[0057] The second land 11 may be formed by widening the width of the inner land portion 11a and omitting the outer land portion 11b, so that it is a simple annular shape with a constant radial width around its entire circumference, and solder 14b is applied to the outer circumference.

[0058] Since solder that has spilled onto the resist layer 8 will collect on the land after reflow, the solder 14b applied to the second land 11 may be applied so as to spill over to the outside of the second land 11. This ensures even more reliable solder wetting.

[0059] In the case of an electronic control device where the cross-sectional shape of the lead terminal 4 of the electronic component 2 is rectangular, a rectangular outer land portion 11b may be formed at positions (4 locations) opposite to the corner portion 4a of the lead terminal 4 inserted into the through-hole 5, as shown in Figure 6.

[0060] In the example shown in Figure 6, the outer land portion 11b and the inner land portion 11a are connected via a narrow, linear connecting portion 31 that runs along the diameter direction of the through-hole. The connecting portion 31 is formed to be narrower than the outer land portion 11b. The connecting portion 31 is formed so that the corner portion 4a of the lead terminal 4 is located on its extension.

[0061] The solder 14b is applied to the inside of the outer land portion 11b and enters the through-hole 5 through the gap between the through-hole 5 and the corner portion 4a of the lead terminal 4 during reflow. Reference numeral 32 in Figure 6 indicates the solder 14b that has melted on the outer land portion 11b and entered the through-hole 5. In addition, the air in the through-hole 5 is discharged during reflow through the gap 33 between the through-hole 5 and the edge portion 4b of the lead terminal 4, as indicated by the arrow.

[0062] Therefore, by forming the outer land portion 11b as shown in Figure 6, the electronic control device can improve the flow of solder into the through-hole 5 when soldering the electronic component 2 to the circuit board 1, and can also suppress the generation of solder voids in the through-hole 5.

[0063] In the case of an electronic control device where the cross-sectional shape of the lead terminal 4 of the electronic component 2 is circular, a rectangular outer land portion 11b may be formed at a position (one location) where the lead terminal 4 inserted into the through-hole 5 is close to the inner circumferential surface of the through-hole 5, as shown in Figure 7.

[0064] In some cases, the lead terminals 4 of electronic component 2 are tilted in a regular manner relative to the body 3 of electronic component 2. In this case, the position of the lead terminals 4 within the through-hole 5 will be biased in a certain direction.

[0065] In the example shown in Figure 7, the outer land portion 11b and the inner land portion 11a are connected via a narrow, linear connecting portion 31 that runs along the diameter direction of the through-hole. The connecting portion 31 is formed to be narrower than the outer land portion 11b. The connecting portion 31 is formed such that the portion where the gap between the through-hole 5 and the lead terminal 4 narrows is located on its extension.

[0066] The solder 14b is applied to the inside of the outer land portion 11b, and enters the through-hole 5 from a position where the lead terminal 4 is close to the inner surface of the through-hole 5 during reflow. Reference numeral 33 in Figure 7 indicates the solder 14b that has melted on the outer land portion 11b and entered the through-hole 5. In addition, the air in the through-hole 5 is discharged from the gap 35 between the inner surface of the through-hole 5 and the outer surface of the lead terminal 4 at a position where the lead terminal 4 is away from the inner surface of the through-hole 5 during reflow, as indicated by the arrow.

[0067] Therefore, by forming the outer land portion 11b as shown in Figure 7, the electronic control device can improve the flow of solder into the through-hole 5 when soldering the electronic component 2 to the circuit board 1, and can also suppress the generation of solder voids in the through-hole 5.

[0068] Furthermore, the shape of the outer land portion 11b is not limited to a rectangle as shown in Figures 6 and 7, but may also be, for example, elliptical or have an arc-shaped curve on both the outer and inner circumferences.

[0069] The above-described embodiments relate to an electronic control device and a method for manufacturing an electronic control device. [Explanation of Symbols]

[0070] 1...Circuit board, 2...Electronic component, 3...Main body, 4...Lead terminal, 4a...Corner, 4b...Edge, 5...Through hole, 6...Front surface, 7...Back surface, 8...Resist layer, 9...First land, 10...Front side resist layer opening, 11...Second land, 11a...Inner land area, 11b...Outer land area, 12...Mask opening, 13...Back side resist layer opening, 14...Solder, 14a...Solder, 14b...Solder

Claims

1. In an electronic control device in which a predetermined electronic component is inserted and mounted on the first surface of a circuit board, The circuit board has through-holes through which the lead terminals of the electronic components pass, a first land formed around the through-holes on the first surface, and a second land formed around the through-holes on the second surface opposite to the first surface. Solder is applied to the first land and the second land mentioned above for soldering the electronic components to the circuit board. The second land described above has an annular inner land portion formed on the outer edge of the through-hole, and a plurality of outer land portions located on the outer side of the inner land portion to which solder is applied. The above lead terminal has a rectangular cross-section. An electronic control device characterized in that the above-mentioned outer land portion is formed at a position opposite to the corner portion of the lead terminal inserted into the above-mentioned through-hole.

2. In an electronic control device in which a predetermined electronic component is inserted and mounted on the first surface of a circuit board, The circuit board has through-holes through which the lead terminals of the electronic components pass, a first land formed around the through-holes on the first surface, and a second land formed around the through-holes on the second surface opposite to the first surface. Solder is applied to the first land and the second land mentioned above for soldering the electronic components to the circuit board. The second land described above has an annular inner land portion formed on the outer edge of the through-hole, and an outer land portion located on the outer side of the inner land portion to which solder is applied. The above lead terminal has a circular cross-section. An electronic control device characterized in that the above-mentioned outer land portion is formed at a position opposite to the point where the gap between the lead terminal inserted into the through-hole and the inner circumferential surface of the through-hole narrows.

3. The solder applied to the first surface is applied after the solder applied to the second surface has been reflowed. The electronic control device according to claim 1 or 2, characterized in that the solder applied to the second land is applied at a position further away from the through-hole in the radial direction of the through-hole than the solder applied to the first land.

4. The electronic control device according to claim 1 or 2, characterized in that the second land described above has solder applied to its outer circumference and not to its inner circumference.

5. The electronic control device according to claim 1 or 2, characterized in that solder is applied to the second land so as to extend beyond the outside of the second land.

6. In a method for manufacturing an electronic control device in which a predetermined electronic component is inserted and mounted on the first surface of a circuit board, The circuit board has through-holes through which the lead terminals of the electronic components pass, a first land formed around the through-holes on the first surface, and a second land formed around the through-holes on the second surface opposite to the first surface. The second land described above has an annular inner land portion formed on the outer edge of the through-hole, and a plurality of outer land portions located on the outer side of the inner land portion to which solder is applied. The above lead terminal has a rectangular cross-section. The above-mentioned outer land portion is formed at a position opposite to the corner of the lead terminal inserted into the above-mentioned through-hole, Solder is applied to the second surface, the solder applied to the second surface is reflowed to solder the components to be mounted on the second surface, then solder is applied to the first surface, the solder applied to the first surface is reflowed to solder the components to be mounted on the first surface, A method for manufacturing an electronic control device, characterized in that the above-mentioned electronic component is soldered to the circuit board by solder applied to the second land and solder applied to the first land after reflow of the solder applied to the second land.

7. In a method for manufacturing an electronic control device in which a predetermined electronic component is inserted and mounted on the first surface of a circuit board, The circuit board has through-holes through which the lead terminals of the electronic components pass, a first land formed around the through-holes on the first surface, and a second land formed around the through-holes on the second surface opposite to the first surface. The second land described above has an annular inner land portion formed on the outer edge of the through-hole, and an outer land portion located on the outer side of the inner land portion to which solder is applied. The above lead terminal has a circular cross-section. The above-mentioned outer land portion is formed at a position opposite to the point where the gap between the lead terminal inserted into the through-hole and the inner circumferential surface of the through-hole narrows. Solder is applied to the second surface, the solder applied to the second surface is reflowed to solder the components to be mounted on the second surface, then solder is applied to the first surface, the solder applied to the first surface is reflowed to solder the components to be mounted on the first surface, A method for manufacturing an electronic control device, characterized in that the above-mentioned electronic component is soldered to the circuit board by solder applied to the second land and solder applied to the first land after reflow of the solder applied to the second land.

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