Substrate treating apparatus and semiconductor manufacturing equipment including the same

The substrate processing apparatus with individual Load Locks and buffer chambers addresses the inefficiency in temperature adjustment of wafers, enhancing production efficiency and cleanliness in semiconductor manufacturing by maintaining high-temperature environments for rapid processing.

KR102993884B1Active Publication Date: 2026-07-21SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
KR1020210152771
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-11-09
Publication Date
2026-07-21
Estimated Expiration
2041-11-09

AI Technical Summary

Technical Problem

Conventional semiconductor manufacturing equipment requires a long time to adjust the temperature of wafers before processing due to a limited number of Load Locks (LLs) handling multiple Process Modules (PMs, affecting efficiency in dry cleaning processes.

Method used

A substrate processing apparatus with individual Load Locks (LLs) for each Process Module (PM) and a semiconductor manufacturing facility, incorporating a buffer chamber to heat and purge substrates before processing, maintaining a high-temperature environment to reduce temperature adjustment time.

Benefits of technology

Enhances efficiency by reducing wafer heating time and maintaining a favorable environment for processing, improving production per unit time (UPEH) and particle cleanliness (P/C) in dry cleaning processes.

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Abstract

The present invention provides a substrate processing device comprising individual LLs for each PM and a semiconductor manufacturing facility including the same. The semiconductor manufacturing facility includes: an index module that extracts and delivers a substrate loaded in a container using the first conveyor robot; a transfer module that relays a substrate delivered by the index module using the second conveyor robot using the second conveyor robot; a buffer chamber that heats the substrate relayed by the transfer module; and a process chamber that processes the substrate heated by the buffer chamber, wherein the buffer chamber heats the substrate while waiting before the substrate is introduced into the process chamber.
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Citation Information

Patent Citations

  • Process module, substrate processing apparatus and substrate transfer method

    KR1020110033777A

  • Photoresist coating and developing apparatus, substrate transfer method and interface apparatus

    KR1020110053174A

  • Substrate transfer mechanism with preheating features

    KR1020120083369A

  • Load lock interface and integrated post-processing module

    KR1020170054243A

  • Apparatus and Module treating substrate and Method for manufacturing the semiconductor device

    KR1020200081612A