Package structure and manufacturing method thereof

Abstract

A package structure includes a package substrate, first and second terminal structures disposed on a first side of the package structure. Each of the first terminal structures includes a first conductive core, a first conductive coating wrapping around the first conductive core, and a first conductive shell wrapping around the first conductive coating. Each of the second terminal structures includes a second conductive core, a second conductive coating wrapping around the second conductive core, and a second conductive shell wrapping around the second conductive coating. The second conductive coating includes a material different from a material of the first conductive coating.