Wafer processing apparatus and wafer holding device thereof

Abstract

This invention provides a wafer clamping device, including a support platform, a plurality of clamping assemblies, and a driving unit. The plurality of clamping assemblies are disposed on the support platform, and each clamping assembly includes a base, a first magnetic element, and an elastic element. The first magnetic element is disposed on the base, and the two ends of the elastic element abut against the base and the support platform, respectively. The driving unit includes a moving member and at least one second magnetic element disposed on the moving member. By moving the moving member relative to the support platform, at least one second magnetic element is moved closer to or further away from the first magnetic element of each clamping assembly, thereby driving the base of each clamping assembly to move to release the clamping of the wafer and compress the elastic element, or by using the elastic restoring force of the elastic element of each clamping assembly to drive the base to clamp the wafer.

Description

Technical Field

[0001] This invention relates to a wafer clamping technology, and more particularly to a wafer clamping device controlled by a combination of magnetic and elastic components, and a wafer processing equipment using the device. Prior Technology

[0002] Wafer clamping devices are mostly used in monolithic wafer processing equipment, such as wafer etching, wafer cleaning, or similar equipment. Conventional wafer clamping devices generally employ a combination of springs and cam drives. The cam drive moves to abut against the inclined surface of the clamp, thereby releasing the clamp from its gripping position on the wafer. Subsequently, the cam drive moves in the reverse direction, using the spring force to clamp the wafer back into place. However, the inclined surface is prone to wear after prolonged use, leading to problems such as uneven clamping or failure to clamp properly. Furthermore, conventional wafer clamping devices typically use linkage mechanisms with springs for actuation, but these linkage mechanisms can easily interfere with other structural components of the clamp during operation, causing delays in clamping action.

[0003] Therefore, how to design a wafer clamping device that can improve the aforementioned problems is a topic worthy of research. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer clamping device that combines magnetic and elastic components for control.

[0005] To achieve the above objectives, the wafer clamping device of the present invention includes a support platform, a plurality of clamping components, and a driving unit. The support platform includes a first side and a second side opposite to each other; the plurality of clamping components are disposed on the support platform, each clamping component including a base, a first magnetic element, and an elastic element. The base is movable relative to the support platform, the first magnetic element is disposed on the base, and the two ends of the elastic element respectively abut against the base and the support platform; the driving unit includes a moving element and at least one second magnetic element. The moving element is movable relative to the support platform, and at least one second magnetic element is disposed on the moving element. When the moving element approaches the second side of the support platform, the first magnetic element of each clamping component is driven by the at least one second magnetic element, thereby causing the base of each clamping component to release the wafer from clamping and compress the elastic element; and when the moving element moves away from the second side of the support platform, the elastic restoring force of the elastic element of each clamping component drives the base to clamp the wafer.

[0006] In one embodiment of the present invention, the support platform further includes a plurality of guide holes, each guide hole extending from a first side to a second side; and wherein the base includes a first component, a second component and a guide member, the first component being connected to the second component via the guide member, the guide member passing through the corresponding guide hole and moving linearly within the guide hole, the first component being located on the first side and the second component being located on the second side.

[0007] In one embodiment of the invention, the base further includes a third component located on the second side and adjustablely coupled to the second component, and a first magnetic element is disposed on the third component.

[0008] In one embodiment of the present invention, the support platform further includes a plurality of slides, each slide being disposed on a first side, and each guide hole extending from the bottom surface of the slide to a second side; and wherein the base further includes a slider, the slider being disposed on the first component and sliding linearly within the corresponding slide.

[0009] In one embodiment of the present invention, the carrying platform further includes a flow guide portion, which is disposed on the first side and forms a fluid channel with the surface of the first side.

[0010] In one embodiment of the present invention, the base further includes a clamping part and a supporting part, both of which are disposed on the first component.

[0011] In one embodiment of the present invention, the carrying platform further includes a plurality of receiving portions, the base of each clamping component further includes a corresponding receiving portion, and the two ends of the elastic member of each clamping component are respectively secured to one of the plurality of receiving portions and the corresponding receiving portion of the base.

[0012] In one embodiment of the present invention, the wafer clamping device further includes a plurality of quick-release components, each quick-release component being disposed on the second side such that a corresponding elastic element is clamped between the quick-release component and the support platform.

[0013] In one embodiment of the present invention, the first working surface of the first magnetic element and the second working surface of at least one second magnetic element have the same polarity, and the first magnetic element is closer to the central axis of the bearing platform than the at least one second magnetic element.

[0014] In one embodiment of the present invention, the first working surface of the first magnetic element and the second working surface of at least one second magnetic element have opposite polarities, and the first magnetic element is further away from the central axis of the bearing platform than the at least one second magnetic element.

[0015] In one embodiment of the present invention, the elastic element is a leaf spring.

[0016] The present invention further includes a wafer processing apparatus that applies the aforementioned wafer clamping device. Simple Explanation of the Diagram

[0017] Figure 1 is a schematic diagram of the wafer clamping device of the present invention. Figure 2 is a top view of the wafer clamping device of the present invention. Figure 3 is a top view of the support platform of the wafer clamping device of the present invention. Figure 4 is an exploded view of the clamping component of the wafer clamping device of the present invention. Figure 5 is a cross-sectional view along line segment A-A' in Figure 2. Figure 6 is a top view of the elastic element of the clamping component of the wafer clamping device of the present invention. Figure 7 is a schematic diagram of a wafer clamping device using the present invention clamping a wafer. Figure 8 is a schematic diagram of the wafer clamping device of the present invention releasing the wafer from clamping. Figure 9 is a schematic diagram of another embodiment of the wafer clamping device of the present invention for clamping a wafer. Figure 10 is a schematic diagram of releasing the wafer clamping device according to another embodiment of the present invention. Implementation

[0018] Since the various embodiments and examples are merely illustrative and not limiting, those skilled in the art, upon reading this specification, may devise other embodiments and examples without departing from the scope of the invention. The features and advantages of these embodiments will become more apparent from the following detailed description and the claims.

[0019] In this document, the terms "a" or "an" are used to describe the elements and components described herein. This is used for ease of explanation and to provide a general meaning regarding the scope of the invention. Therefore, unless it is clearly intended otherwise, this description should be understood to include one or at least one, and the singular includes the plural.

[0020] In this document, the terms "first" or "second" and similar ordinal numbers are primarily used to distinguish or refer to the same or similar elements or structures, and do not necessarily imply a spatial or temporal order of these elements or structures. It should be understood that, in certain situations or configurations, ordinal numbers can be used interchangeably without affecting the implementation of this invention.

[0021] In this document, the terms “comprising,” “having,” or any other similar terms are intended to cover non-exclusive inclusions. For example, an element or structure containing a plurality of elements is not limited to those listed herein, but may include other elements not expressly listed but which are generally inherent to the element or structure.

[0022] Please refer to Figures 1 and 2 together, where Figure 1 is a schematic diagram of the wafer clamping device 1 of the present invention, and Figure 2 is a top view of the wafer clamping device 1 of the present invention. As shown in Figures 1 and 2, the wafer clamping device 1 of the present invention is applied to a wafer processing equipment 1000, such as a wafer etching equipment, a wafer cleaning equipment, or other similar equipment. The wafer clamping device 1 of the present invention includes a support platform 10, a plurality of clamping components 20, and a driving unit 30. The support platform 10 includes a first side 11 and a second side 12 opposite to each other. The wafer is mainly fixed to the first side 11 of the support platform 10 to facilitate the execution of corresponding processing processes on the wafer.

[0023] Please refer to Figures 1 and 3 together, where Figure 3 is a top view of the support platform 10 of the wafer clamping device 1 of the present invention. As shown in Figures 1 and 3, in one embodiment of the present invention, the support platform 10 further includes a plurality of guide holes 13. Each guide hole 13 extends from the first side 11 to the second side 12, and each guide hole 13 is an elongated hole. The number and position of the plurality of guide holes 13 are adjusted according to the number and position of the plurality of clamping components 20.

[0024] In one embodiment of the present invention, the support platform 10 further includes a plurality of slides 14. Each slide 14 is disposed on a first side 11, and each guide hole 13 extends from the bottom surface of the corresponding slide 14 to a second side 12. The number and position of the plurality of slides 14 are adjusted according to the number and position of the plurality of clamping components 20.

[0025] In one embodiment of the present invention, the carrier platform 10 further includes a flow guide 15 to provide a flow guide effect for liquids such as solutions used in the wafer processing process. The flow guide 15 is disposed on the first side 11, and a liquid channel is formed between the flow guide 15 and the surface of the first side 11 (please refer to Figures 7 to 10 together). In addition, in conjunction with the design of the flow guide 15, a liquid discharge structure (not shown, such as a liquid discharge hole) can be added to the carrier platform 10 to accelerate the discharge of liquid from the carrier platform. In one embodiment of the present invention, the flow guide 15 partially shields each guide hole 13 and each groove 14, so that when a plurality of clamping components 20 are subsequently installed, the flow guide 15 can provide an auxiliary limiting effect for the plurality of clamping components 20, but the present invention is not limited thereto.

[0026] Please refer to Figures 1, 2, 4, and 5 together, where Figure 4 is an exploded view of the clamping assembly 20 of the wafer clamping device 1 of the present invention, and Figure 5 is a cross-sectional view along line segment A-A' in Figure 2. As shown in Figures 1, 2, 4, and 5, a plurality of clamping assemblies 20 are disposed on the support platform 10 to provide clamping or de-clamping functions for the wafer. Each clamping assembly 20 includes a base 21, a first magnetic element 22, and an elastic element 23. The base 21 moves along a straight line relative to the support platform 10. The first magnetic element 22 is disposed on the base 21 to serve as a power source for driving the base 21 to move. The two ends of the elastic element 23 abut against the base 21 and the support platform 10 respectively to serve as another power source for driving the base 21 to move. When the base 21 moves relative to the support platform 10, it will not only move the first magnetic element 22, but also cause the elastic element 23 to be compressed or relaxed as the distance between the base 21 and the support platform 10 changes.

[0027] In one embodiment of the present invention, the base 21 includes a first component 211, a second component 212, and a guide member 213, with the first component 211 connected to the second component 212 via the guide member 213. That is, the guide member 213 is sandwiched between the first component 211 and the second component 212. The first component 211 is located on a first side 11, and the second component 212 is located on a second side 12. The guide member 213 passes through a corresponding guide hole 13 and moves linearly along the guide hole 13. In one embodiment of the present invention, the first component 211, the second component 212, and the guide member 213 can be joined and fixed together by screws and corresponding openings, but the joining method of these components is not limited thereto; for example, these components can also be integrally molded into a single integrated part.

[0028] In one embodiment of the present invention, the base 21 further includes a third component 214. The third component 214 is disposed on the second component 212 for embedding and fixing the first magnetic element 22. The third component 214 is located on the second side 12. In one embodiment of the present invention, the third component 214 can be fixed to the second component 212 by means of screws and corresponding slots, and the third component 214 can adjust its engagement position relative to the second component 212 to change the magnetic actuation position or distance of the first magnetic element 22. However, the engagement method of the second component 212 and the third component 214 is not limited thereto. For example, the second component 212 and the third component 214 can also be integrally molded into a single integrated component.

[0029] In one embodiment of the present invention, the base 21 further includes a clamping portion 215. The clamping portion 215 is disposed on the first component 211 for clamping the wafer located on the first side 11. The clamping portion 215 is located on the first side 11.

[0030] In one embodiment of the present invention, the base 21 further includes a support portion 216. The support portion 216 is disposed on the first component 211 to support the wafer located on the first side 11. The support portion 216 is located on the first side 11.

[0031] In one embodiment of the present invention, the base 21 further includes a slider 217. The slider 217 is disposed on the first component 211 and is located in the corresponding groove 14, such that when the base 21 moves, the slider 217 slides linearly along the groove 14. The slider 217 is located on the first side 11.

[0032] In one embodiment of the present invention, a first magnetic element 22 is disposed on a third component 214. The first magnetic element 22 is a single magnet. The first magnetic element 22 includes a first working surface F1, and the first working surface F1 of the first magnetic element 22 is exposed on the second component 212. The polarity of the first working surface F1 of the first magnetic element 22 may be changed according to different designs or requirements.

[0033] Please refer to Figures 2, 4, 5, and 6, where Figure 6 is a top view showing the arrangement of the elastic element 23 of the clamping component 20 of the wafer clamping device 1 of the present invention. As shown in Figures 2, 4, 5, and 6, in one embodiment of the present invention, the support platform 10 further includes a plurality of receiving portions 16. Each receiving portion 16 is disposed on the second side 12. The number and position of the plurality of receiving portions 16 are adjusted according to the number and position of the plurality of clamping components 20. In one embodiment of the present invention, the base 21 of each clamping component 20 further includes a corresponding receiving portion 218. The corresponding receiving portion 218 is disposed on the second component 212, and the position of the corresponding receiving portion 218 corresponds to the position of one of the plurality of receiving portions 16 of the support platform 10. The corresponding receiving portion 218 is located on the second side 12.

[0034] Each clamping assembly 20 has its elastic element 23 with both ends abutting and secured to one of the plurality of receiving portions 16 of the support platform 10 and the corresponding receiving portion 218 of the base 21. When the base 21 is driven to approach the support platform 10, the elastic element 23 is gradually compressed and enters a compressed state; when the elastic element 23 is released from the compressed state, it generates an elastic restoring force to push the base 21 relative to the support platform 10, finally causing the elastic element 23 to relax. In one embodiment of the present invention, the elastic element 23 is a leaf spring, but the form of the elastic element 23 is not limited thereto.

[0035] In one embodiment of the present invention, the wafer clamping device 1 further includes a plurality of quick-release components 40. Each quick-release component 40 is disposed on the second side 12, such that the elastic element 23 of the corresponding clamping component 20 is clamped between the quick-release component 40 and the support platform 10. Each quick-release component 40 is used to support and fix the elastic element 23 of the corresponding clamping component 20. When the elastic element 23 of any clamping component 20 needs to be replaced, the user can quickly and conveniently replace the elastic element 23 by removing the corresponding quick-release component 40. The number and position of the plurality of quick-release components 40 are adjusted according to the number and position of the plurality of clamping components 20.

[0036] As shown in Figure 1, the driving unit 30 includes a movable member 31 and at least one second magnetic member 32. The movable member 31 moves linearly relative to the support platform 10 to approach or move away from the second side 12 of the support platform 10. At least one second magnetic member 32 is disposed on the movable member 31, such that the at least one second magnetic member 32 gradually approaches or moves away from the second side 12 of the support platform 10 as the movable member 31 moves. The placement position of the at least one second magnetic member 32 corresponds to the placement position of the first magnetic member 22 of each clamping assembly 20. In one embodiment of the present invention, the at least one second magnetic member 32 is a single magnetic ring, but the present invention is not limited thereto, and the at least one second magnetic member 32 may also be a plurality of magnets. Each second magnetic member 32 includes a second working surface F2 (please refer to Figures 7 to 10 together). The polarity of the second working surface F2 of the second magnetic member 32 may change according to different designs or requirements.

[0037] The operating principle of the wafer clamping device 1 of the present invention will be described below with reference to different embodiments. It should be noted that in the following description, only one of the plurality of clamping components 20 is presented in conjunction with the operation of other components; the other clamping components 20 also adopt the same operating principle. Please refer to Figures 2, 7 and 8, where Figure 7 is a schematic diagram of clamping a wafer using the wafer clamping device of the present invention, and Figure 8 is a schematic diagram of releasing the wafer using the wafer clamping device of the present invention. As shown in Figures 2, 7 and 8, in this embodiment, it is assumed that the wafer clamping device 1 of the present invention includes four clamping components 20, and these clamping components 20 are symmetrically arranged with respect to the central axis O of the support platform 10. The base 21 of each clamping component 20 can move along a straight line. The moving part 31 of the drive unit 30 moves linearly along the central axis O of the support platform 10; that is, the moving direction of the moving part 31 is perpendicular to the moving direction of the base 21 of each clamping component 20. The wafer clamping device 1 of the present invention clamps the wafer W by clamping part 215 of each clamping component 20 and supports the wafer W by supporting part 216 of each clamping component 20.

[0038] In one embodiment of the present invention, the first working surface F1 of the first magnetic element 22 and the second working surface F2 of at least one second magnetic element 32 of each clamping assembly 20 have opposite polarities. In terms of structural design, the first magnetic element 22 is closer to the central axis O of the bearing platform 10 than the at least one second magnetic element 32; that is, if the central axis O is taken as a reference (center), the first magnetic element 22 of each clamping assembly 20 is located in the inner circle, while the at least one second magnetic element 32 is located in the outer circle.

[0039] For example, in this embodiment, the first working surface F1 of the first magnetic element 22 of each clamping assembly 20 is the N pole (S pole), and the second working surface F2 of at least one second magnetic element 32 is the S pole (N pole). When the moving part 31 gradually approaches the second side 12 of the support platform 10, the second working surface F2 of at least one second magnetic element 32 will also gradually approach the first working surface F1 of the first magnetic element 22 of each clamping assembly 20, so that the second working surface F2 of at least one second magnetic element 32 and the working surface F1 of the first magnetic element 22 of each clamping assembly 20 are on the same horizontal plane. At this time, the first magnetic element 22 of each clamping assembly 20 will generate a magnetic attraction with the at least one second magnetic element 32, which will drive the base 21 of each clamping assembly 20 to move linearly in a direction away from the central axis O of the support platform 10, thereby releasing the clamping of the wafer W, and finally presenting the state shown in Figure 8. During the movement of the base 21 of each clamping component 20, the corresponding elastic element 23 will be gradually compressed.

[0040] Conversely, as the moving part 31 gradually moves away from the second side 12 of the support platform 10, the second working surface F2 of at least one second magnetic element 32 will also gradually move away from the first working surface F1 of the first magnetic element 22 of each clamping assembly 20, thereby causing the magnetic attraction between the first magnetic element 22 of each clamping assembly 20 and at least one second magnetic element 32 to disappear. At this time, the elastic element 23 of each clamping assembly 20, which is in a compressed state, will generate an elastic restoring force, so as to gradually drive the base 21 of each clamping assembly 20 to move linearly in a direction close to the central axis O of the support platform 10, thereby clamping the wafer W, and finally presenting the state shown in Figure 7.

[0041] Please refer to Figures 2, 9, and 10 together. Figure 9 is a schematic diagram of clamping a wafer using another embodiment of the wafer clamping device of the present invention, and Figure 10 is a schematic diagram of releasing the wafer clamping device of the present invention using another embodiment. As shown in Figures 2, 9, and 10, in this embodiment, in another embodiment of the present invention, the first working surface F1 of the first magnetic element 22 and the second working surface F2 of at least one second magnetic element 32 of each clamping assembly 20 have the same polarity. In terms of structural design, the first magnetic element 22 is farther away from the central axis O of the support platform 10 than the at least one second magnetic element 32; that is, if the central axis O is taken as the reference (center), the first magnetic element 22 of each clamping assembly 20 will be located in the outer circle, while the at least one second magnetic element 32 will be located in the inner circle.

[0042] For example, in this embodiment, the first working surface F1 of the first magnetic element 22 and the second working surface F2 of at least one second magnetic element 32 of each clamping assembly 20 are both N-pole or S-pole. As the moving member 31 gradually approaches the second side 12 of the support platform 10, the second working surface F2 of at least one second magnetic element 32 will also gradually approach the first working surface F1 of the first magnetic element 22 of each clamping assembly 20, eventually making the second working surface F2 of at least one second magnetic element 32 and the first working surface F1 of the first magnetic element 22 of each clamping assembly 20 on the same horizontal plane. At this time, the first magnetic element 22 of each clamping assembly 20 will generate a magnetic repulsion force with the at least one second magnetic element 32, which will drive the base 21 of each clamping assembly 20 to move linearly away from the central axis O of the support platform 10, thereby releasing the clamping of the wafer W, and finally presenting the state shown in Figure 9. During the movement of the base 21 of each clamping assembly 20, the corresponding elastic element 23 will be gradually compressed.

[0043] Conversely, as the moving part 31 gradually moves away from the second side 12 of the support platform 10, the second working surface F2 of at least one second magnetic element 32 will also gradually move away from the first working surface F1 of the first magnetic element 22 of each clamping assembly 20, thereby causing the magnetic repulsion between the first magnetic element 22 of each clamping assembly 20 and at least one second magnetic element 32 to disappear. At this time, the elastic element 23 of each clamping assembly 20, which is in a compressed state, will generate an elastic restoring force, so as to gradually drive the base 21 of each clamping assembly 20 to move linearly in a direction close to the central axis O of the support platform 10, thereby clamping the wafer W, and finally presenting the state shown in Figure 10.

[0044] Accordingly, the wafer clamping device 1 of the present invention can switch between different functions of clamping or releasing the wafer by changing the position of the moving part 31 of the driving unit 30 and coordinating the setting of related elastic and magnetic parts.

[0045] As shown in Figure 1, the present invention further includes a wafer processing apparatus 1000 employing the aforementioned wafer clamping device 1. The wafer processing apparatus 1000 of the present invention uses the wafer clamping device 1 to hold the wafer, facilitating the execution of corresponding processing procedures on the wafer. For example, when the wafer processing apparatus 1000 of the present invention is a wafer cleaning apparatus, the wafer is first held by a plurality of clamping components 20 of the wafer clamping device 1, and then cleaning liquid is sprayed onto the wafer and rotated based on the central axis O of the support platform 10, thereby achieving an effective cleaning effect. Furthermore, the design of the flow guide portion 15 of the support platform 10 of the wafer clamping device 1 further provides the effect of liquid flow and discharge.

[0046] In summary, the wafer clamping device of the present invention controls the clamping state of the wafer by combining magnetic and elastic components, reducing the possibility of structural wear or interference between related components, and improving problems such as jig drive irregularities, jig failure to clamp, or jig operation delays.

[0047] The above embodiments are merely illustrative in nature and are not intended to limit the embodiments of the subject matter of the application or its application or use. Furthermore, although at least one exemplary embodiment has been presented in the foregoing embodiments, it should be understood that numerous variations are possible with respect to the invention. It should also be understood that the embodiments described herein are not intended to limit the scope, use, or configuration of the claimed subject matter in any way. Rather, the foregoing embodiments will provide a simple guide for those skilled in the art to implement one or more of the embodiments. Moreover, various changes can be made to the function and arrangement of the elements without departing from the scope defined by the claims, and the claims include known equivalents and all foreseeable equivalents at the time of filing of this patent application.

[0048] 1000: Wafer Processing Equipment 1: Wafer clamping device 10: Supporting Platform 11: First side 12: Second side 13: Guide hole 14: Slide 15: Airflow guide 16: Compartment 20: Clamping assembly 21: Base 211: First component 212: Second component 213: Guide components 214: Third component 215: Clamping part 216: Support section 217: Slider 218: Corresponding receiving part 22: First magnetic component 23: Elastic component 30: Drive Unit 31: Moving parts 32: Second magnetic component 40: Quick-release parts F1: First Action Surface F2: Second Action Surface W: Wafer

Claims

1. A wafer clamping device for clamping a wafer, the wafer clamping device comprising: A support platform includes a first side and a second side opposite to each other; a plurality of clamping assemblies disposed on the support platform, each clamping assembly including a base, a first magnetic element and an elastic element, the base being movable relative to the support platform, the first magnetic element being disposed on the base, and the two ends of the elastic element abutting against the base and the support platform respectively; and a driving unit including a moving element and at least one second magnetic element, the moving element being movable relative to the support platform, and the at least one second magnetic element being disposed on the moving element; wherein when the moving element approaches the second side of the support platform, the first magnetic element of each clamping assembly is driven by the at least one second magnetic element to cause the base of each clamping assembly to release clamping the wafer and compress the elastic element; and wherein when the moving element moves away from the second side of the support platform, the elastic restoring force of the elastic element of each clamping assembly drives the base to clamp the wafer.

2. The wafer clamping device as claimed in claim 1, wherein the support platform further includes a plurality of guide holes, each of the guide holes extending from the first side to the second side; and wherein the base includes a first component, a second component and a guide member, the first component being connected to the second component via the guide member, the guide member passing through the corresponding guide hole and moving linearly within the guide hole, the first component being located on the first side and the second component being located on the second side.

3. The wafer clamping device as claimed in claim 2, wherein the base further includes a third component located on the second side and adjustablely coupled to the second component, and the first magnetic element is disposed on the third component.

4. The wafer clamping device as claimed in claim 3, wherein the support platform further includes a plurality of slides, each slide being disposed on the first side, and each guide hole extending from the bottom surface of the slide to the second side; and wherein the base further includes a slider disposed on the first component and sliding linearly within the corresponding slide.

5. The wafer clamping device as claimed in claim 3, wherein the carrier platform further includes a flow guide portion disposed on the first side and forming a fluid channel between the flow guide portion and the surface of the first side.

6. The wafer clamping device as claimed in claim 3, wherein the base further includes a clamping portion and a supporting portion, both of which are disposed on the first component.

7. The wafer clamping device as claimed in claim 3, wherein the support platform further includes a plurality of receiving portions, the base of each clamping component includes a corresponding receiving portion, and the two ends of the elastic member of each clamping component are respectively secured to one of the plurality of receiving portions and the corresponding receiving portion of the base.

8. The wafer clamping device as claimed in claim 3 further includes a plurality of quick-release members, each of which is disposed on the second side such that the corresponding elastic member is clamped between the quick-release member and the support platform.

9. The wafer clamping device as claimed in claim 1, wherein one working surface of the first magnetic element and a second working surface of the at least one second magnetic element have the same polarity, and the first magnetic element is further away from the central axis of the support platform than the at least one second magnetic element.

10. The wafer clamping device as claimed in claim 1, wherein one working surface of the first magnetic element and a second working surface of the at least one second magnetic element have opposite polarities, and the first magnetic element is closer to the central axis of the support platform than the at least one second magnetic element.

11. The wafer clamping device as claimed in claim 1, wherein the elastic element is a leaf spring.

12. A wafer processing apparatus having a wafer clamping device as described in any one of claims 1 to 11.

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