Cooling system and laser

Abstract

A cooling system (100) and a laser. The cooling system (100) comprises a housing (110), a fan (120), a mounting base (130), a condenser (140) and a cooling assembly (150), wherein the housing (110) comprises a cooling air duct (111); the fan (120) is connected to the housing (110), and is configured to provide an airflow into the cooling air duct (111) and enable the airflow in the cooling air duct (111) to flow from an inlet to an outlet of the cooling air duct (111); the mounting base (130) is connected to the housing (110) and located in the cooling air channel (111), and a first cooling flow channel (131) is provided in the mounting base (130); the condenser (140) is connected to the housing (110) and located in the cooling air channel (111), and a second cooling flow channel (143) is provided in the condenser (140); and an outlet of the cooling assembly (150) is connected to an inlet of the first cooling channel (131) and an inlet of the second cooling channel (143), the cooling assembly (150) is configured to supply a cooling medium to the first cooling channel (131) and the second cooling channel (143), and the temperature of the cooling medium entering the first cooling channel (131) is greater than the temperature of the cooling medium entering the second cooling channel (143).

Description

Cooling system and laser

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on July 27, 2023, with application number 202311274322.0. The entire contents of the above application are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of laser technology, and in particular to a cooling system and a laser. Background Art

[0003] The core components of high-power fiber lasers are pump sources, ytterbium-doped optical fibers, and electrical controls. The photoelectric conversion efficiency and lifespan of the pump source directly determine the photoelectric conversion efficiency and lifespan of the fiber laser. To improve the photoelectric conversion efficiency and lifespan of the pump source, the pump source is usually cooled by a cooling system, and moisture in the air is removed to avoid condensed water flowing into the pump source when the cooling system cools the pump source, thereby affecting the service life of the pump source. SUMMARY OF THE INVENTION

[0004] In the prior art, the cooling system consumes a lot of power to condense the moisture in the air.

[0005] The embodiments of the present application provide a cooling system and a laser, which aim to solve the problem of high power consumption required by the cooling system to convert moisture in the air into condensed water.

[0006] An embodiment of the present application provides a cooling system, the cooling system comprising:

[0007] a housing including a cooling air duct;

[0008] a fan connected to the housing, the fan being configured to provide airflow into the cooling air duct so that the airflow in the cooling air duct flows from an inlet to an outlet of the cooling air duct;

[0009] A mounting seat connected to the housing and located in the cooling air duct, wherein a first cooling flow channel is provided in the mounting seat;

[0010] a condenser connected to the housing and located in the cooling air duct, wherein the condenser is provided with a second cooling flow channel;

[0011] A cooling component, wherein the outlet of the cooling component is connected to the inlet of the first cooling channel and the second cooling channel, and the cooling component is used to provide a cooling medium to the first cooling channel and the second cooling channel, and the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

[0012] In some embodiments, the cooling assembly includes a cooling medium supply component, a first cooling component, and a second cooling component, wherein an outlet of the cooling medium supply component is connected to an inlet of the first cooling channel and an inlet of the second cooling channel to provide the cooling medium to the first cooling channel and the second cooling channel;

[0013] The first cooling component is used to cool the cooling medium in the cooling medium supply component, and the second cooling component is used to cool the cooling medium between the cooling medium supply component and the inlet of the second cooling channel, so that the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

[0014] In some embodiments, the cooling medium supply component includes a first container, a second container, and a circulation pump disposed in the first container, the first container and the second container are used to contain the cooling medium, the outlet of the circulation pump is connected to the first cooling channel and the inlet of the second container, and the outlet of the second container is connected to the inlet of the second cooling channel;

[0015] The first cooling component includes a first heat exchanger disposed in the first container, and the first heat exchanger is used to cool the cooling medium in the first container; the second cooling component includes a second heat exchanger disposed in the second container, and the second heat exchanger is used to cool the cooling medium in the second container.

[0016] In some embodiments, the inlet of the first container is in communication with the outlet of the first cooling channel and the outlet of the second cooling channel.

[0017] In some embodiments, the mounting base and the condenser are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct; or,

[0018] The condenser and the mounting seat are sequentially distributed along a direction from the inlet to the outlet of the cooling air duct.

[0019] In some embodiments, the housing further includes a return air duct, the inlet of the return air duct is connected to the outlet of the cooling air duct, and the outlet of the return air duct is connected to the inlet of the cooling air duct to form a closed space.

[0020] In some embodiments, the fan is arranged at the entrance of the cooling air duct; the cooling air duct extends in the up and down directions, the fan is located above the mounting seat, and the condenser is located below the mounting seat; or, the fan is located above the condenser, and the mounting seat is located below the condenser.

[0021] In some embodiments, the return air duct is arranged along the circumference of the cooling air duct.

[0022] In some embodiments, the cooling air duct extends laterally.

[0023] An embodiment of the present application further provides a laser, the laser comprising a pump source and a cooling system, the cooling system comprising:

[0024] a housing including a cooling air duct;

[0025] a fan connected to the housing, the fan being configured to provide airflow into the cooling air duct so that the airflow in the cooling air duct flows from an inlet to an outlet of the cooling air duct;

[0026] A mounting seat connected to the housing and located in the cooling air duct, wherein a first cooling flow channel is provided in the mounting seat, and the pump source is mounted on the mounting seat;

[0027] a condenser connected to the housing and located in the cooling air duct, wherein the condenser is provided with a second cooling flow channel;

[0028] A cooling component, wherein the outlet of the cooling component is connected to the inlet of the first cooling channel and the second cooling channel, and the cooling component is used to provide a cooling medium to the first cooling channel and the second cooling channel, and the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

[0029] In some embodiments, the cooling assembly includes a cooling medium supply component, a first cooling component, and a second cooling component, wherein an outlet of the cooling medium supply component is connected to an inlet of the first cooling channel and an inlet of the second cooling channel to provide the cooling medium to the first cooling channel and the second cooling channel;

[0030] The first cooling component is used to cool the cooling medium in the cooling medium supply component, and the second cooling component is used to cool the cooling medium between the cooling medium supply component and the inlet of the second cooling channel, so that the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

[0031] In some embodiments, the cooling medium supply component includes a first container, a second container, and a circulation pump disposed in the first container, the first container and the second container are used to contain the cooling medium, the outlet of the circulation pump is connected to the first cooling channel and the inlet of the second container, and the outlet of the second container is connected to the inlet of the second cooling channel;

[0032] The first cooling component includes a first heat exchanger disposed in the first container, and the first heat exchanger is used to cool the cooling medium in the first container; the second cooling component includes a second heat exchanger disposed in the second container, and the second heat exchanger is used to cool the cooling medium in the second container.

[0033] In some embodiments, the inlet of the first container is in communication with the outlet of the first cooling channel and the outlet of the second cooling channel.

[0034] In some embodiments, the mounting base and the condenser are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct; or,

[0035] The condenser and the mounting seat are sequentially distributed along a direction from the inlet to the outlet of the cooling air duct.

[0036] In some embodiments, the housing further includes a return air duct, the inlet of the return air duct is connected to the outlet of the cooling air duct, and the outlet of the return air duct is connected to the inlet of the cooling air duct to form a closed space.

[0037] In some embodiments, the fan is arranged at the entrance of the cooling air duct; the cooling air duct extends in the up and down directions, the fan is located above the mounting seat, and the condenser is located below the mounting seat; or, the fan is located above the condenser, and the mounting seat is located below the condenser.

[0038] In some embodiments, the return air duct is arranged along the circumference of the cooling air duct.

[0039] In some embodiments, the cooling air duct extends laterally. Beneficial effects

[0040] The cooling system provided in the embodiment of the present application is achieved by arranging the mounting seat and the condenser in the cooling air duct of the shell, providing air flow into the cooling air duct through a fan, so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct, and providing cooling medium to the first cooling flow channel of the mounting seat and the second cooling flow channel of the condenser through the cooling component, and the temperature of the cooling medium entering the first cooling flow channel is greater than the temperature of the cooling medium entering the second cooling flow channel, so that while the mounting seat and the condenser are cooled, the temperature of the condenser is lower, which is more conducive to the formation of condensed water on the surface of the condenser, thereby achieving drying of the cooling air duct, and the power consumption of the cooling component is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0042] FIG1 is a schematic structural diagram of an embodiment of a cooling system provided in an embodiment of the present application.

[0043] Cooling system 100; housing 110; cooling air duct 111; return air duct 112; fan 120; mounting base 130; first cooling channel 131; condenser 140; fin 141; connecting pipe 142; second cooling channel 143; cooling assembly 150; cooling medium supply component 151; first container 152; second container 153; first heat exchanger 155; second heat exchanger 156; device to be cooled 200. Modes for Carrying Out the Invention

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0045] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0046] The embodiments of the present application provide a cooling system and a laser, which are described in detail below.

[0047] First, an embodiment of the present application provides a cooling system.

[0048] FIG1 is a schematic diagram of the structure of an embodiment of a cooling system provided by an embodiment of the present application. As shown in FIG1 , cooling system 100 includes a mounting base 130 and a cooling assembly 150. Mounting base 130 is used to mount a device 200 to be cooled. Device 200 to be cooled can be a laser pump source or other component requiring heat dissipation. Of course, cooling system 100 can also be used in devices other than lasers to cool and dissipate heat from devices 200 to be cooled in other devices.

[0049] The cooling assembly 150 is connected to the mounting base 130 to cool the mounting base 130 and, in turn, dissipate heat from the device 200 mounted on the mounting base 130. A first cooling channel 131 is provided within the mounting base 130. The outlet of the cooling assembly 150 communicates with the inlet of the first cooling channel 131. The cooling assembly 150 is configured to provide a cooling medium to the first cooling channel 131, which then exchanges heat with the mounting base 130 to cool the mounting base 130.

[0050] The cooling assembly 150 includes a cooling medium supply component 151 and a first cooling component. The outlet of the cooling medium supply component 151 is connected to the inlet of the first cooling channel 131 to provide cooling medium to the first cooling channel 131. The first cooling component is used to cool the cooling medium in the cooling medium supply component 151, thereby reducing the temperature of the cooling medium. This creates a large temperature difference between the cooling medium entering the first cooling channel 131 of the mounting base 130 and the mounting base 130, thereby improving the cooling and heat dissipation effect of the cooling medium on the mounting base 130.

[0051] Specifically, the cooling medium supply component 151 includes a first container 152 and a circulation pump (not shown) disposed within the first container 152. The first container 152 is used to contain the cooling medium, and the outlet of the circulation pump is connected to the first cooling channel 131 of the mounting base 130. The first cooling component includes a first heat exchanger 155 disposed within the first container 152. The first heat exchanger 155 is used to cool the cooling medium within the first container 152.

[0052] In this way, heat can be exchanged with the cooling medium in the first container 152 through the first heat exchanger 155, thereby reducing the temperature of the cooling medium in the first container 152. Then, the cooled cooling medium is pumped into the first cooling channel 131 of the mounting seat 130 through the first heat exchanger 155 to cool and dissipate heat for the mounting seat 130.

[0053] The cooling medium may be a low freezing point cooling medium to prevent the cooling medium from freezing due to excessively low temperatures. Specifically, the freezing point of the cooling medium may be less than 0°C, such as ethylene glycol-water, ethylene-glycol-water, propylene-glycol-water, and the like.

[0054] As shown in FIG1 , the inlet of the first container 152 is connected to the outlet of the first cooling channel 131 to achieve the circulation of the cooling medium.

[0055] In some embodiments, the cooling system 100 further includes a housing 110, a fan 120, and a condenser 140. The housing 110 includes a cooling duct 111. The fan 120 is connected to the housing 110 and is configured to provide airflow into the cooling duct 111, causing the airflow in the cooling duct 111 to flow from the inlet to the outlet of the cooling duct 111. The fan 120 can be positioned at the inlet of the cooling duct 111 and blow air into the cooling duct 111, causing the airflow in the cooling duct 111 to flow from the inlet to the outlet of the cooling duct 111. The fan 120 can also be positioned at the outlet of the cooling duct 111 and suck air into the cooling duct 111, causing the airflow in the cooling duct 111 to flow from the inlet to the outlet of the cooling duct 111.

[0056] The mounting base 130 and the condenser 140 are respectively connected to the shell 110 and are located in the cooling air duct 111. The cooling assembly 150 is connected to the condenser 140 to cool the condenser 140 so that the water vapor in the air in the cooling air duct 111 condenses on the surface of the condenser 140 to form condensed water, thereby achieving drying of the air in the cooling air duct 111.

[0057] Condenser 140 is provided with a second cooling channel 143. The outlet of cooling assembly 150 is connected to the inlet of second cooling channel 143 of condenser 140, thereby providing cooling medium to second cooling channel 143 of condenser 140. The cooling medium entering second cooling channel 143 is used to cool condenser 140, thereby lowering the temperature of condenser 140 and causing water vapor in the air within cooling duct 111 to condense on the surface of condenser 140 to form condensed water.

[0058] In some embodiments, the temperature of the cooling medium entering the first cooling channel 131 is greater than the temperature of the cooling medium entering the second cooling channel 143, so that the temperature of the condenser 140 is lower than the temperature of the mounting base 130, which is more conducive to the formation of condensed water on the surface of the condenser 140.

[0059] The cooling system 100 provided in the embodiment of the present application is configured such that the mounting seat 130 and the condenser 140 are disposed in the cooling duct 111 of the shell 110, and air flow is provided to the cooling duct 111 through the fan 120, so that the air flow in the cooling duct 111 flows from the inlet to the outlet of the cooling duct 111, and a cooling medium is provided to the first cooling channel 131 of the mounting seat 130 and the second cooling channel 143 of the condenser 140 through the cooling component 150, and the temperature of the cooling medium entering the first cooling channel 131 is greater than the temperature of the cooling medium entering the second cooling channel 143, so that while the mounting seat 130 and the condenser 140 are cooled, the temperature of the condenser 140 is lower, which is more conducive to the formation of condensed water on the surface of the condenser 140, thereby achieving drying of the cooling duct 111, and the power consumption of the cooling component 150 is lower.

[0060] As shown in FIG1 , the outlet of the cooling medium supply component 151 is in communication with the inlet of the first cooling channel 131 and the inlet of the second cooling channel 143 to supply cooling medium to the first cooling channel 131 and the second cooling channel 143. In some embodiments, the cooling assembly 150 further includes a second cooling component configured to cool the cooling medium within the cooling medium supply component 151, thereby ensuring that the cooling medium supplied by the cooling medium supply component 151 to the first cooling channel 131 of the mounting base 130 and the second cooling channel 143 of the condenser 140 has a lower temperature.

[0061] The second cooling component is used to cool the cooling medium between the inlet of the cooling medium supply component 151 and the second cooling channel 143, thereby further reducing the temperature of the cooling medium supplied by the cooling medium supply component 151 to the second cooling channel 143 of the condenser 140, so that the temperature of the cooling medium entering the first cooling channel 131 is greater than the temperature of the cooling medium entering the second cooling channel 143.

[0062] Specifically, the cooling medium supply component 151 further includes a second container 153 for containing cooling medium. The outlet of the circulating pump is connected to the first cooling channel 131 and the inlet of the second container 153. The outlet of the second container 153 is connected to the inlet of the second cooling channel 143. The second cooling component includes a second heat exchanger 156 disposed within the second container 153. The second heat exchanger 156 is used to cool the cooling medium within the second container 153.

[0063] Thus, the cooling medium in the first container 152 can be pumped into the second container 153 through a circulating pump, and then heat exchange is performed with the cooling medium through the second heat exchanger 156 in the second container 153 to further reduce the temperature of the cooling medium in the second container 153, and then the cooling medium in the second container 153 enters the second cooling channel 143 of the condenser 140, so that the temperature of the cooling medium entering the first cooling channel 131 is greater than the temperature of the cooling medium entering the second cooling channel 143.

[0064] As shown in FIG1 , the inlet of the first container 152 is connected to the outlet of the first cooling channel 131 and the outlet of the second cooling channel 143 , thereby realizing the recycling of the cooling medium.

[0065] In some embodiments, as shown in FIG1 , the mounting base 130 and the condenser 140 are sequentially arranged from the inlet to the outlet of the cooling air duct 111. It is understood that since the mounting base 130 needs to cool the device 200 to be cooled, the temperature of the mounting base 130 and the device 200 to be cooled is relatively high. The temperature of the air in the cooling air duct 111 is relatively high after passing through the mounting base 130 and the device 200 to be cooled. When the relatively high temperature air passes through the relatively low temperature condenser 140, the water vapor in the air can be quickly condensed to form condensed water.

[0066] Specifically, the fan 120 is disposed at the entrance of the cooling duct 111. The cooling duct 111 extends in the vertical direction. The fan 120 is located above the mounting base 130, and the condenser 140 is located below the mounting base 130. Thus, the fan 120, the mounting base 130, and the condenser 140 are sequentially arranged from the entrance to the exit of the cooling duct 111. The air outlet of the fan 120 faces downward, and the air blown out by the fan 120 first passes downward through the mounting base 130 and then through the condenser 140. This can prevent condensed water generated by the condenser 140 from dripping onto the device to be cooled 200 on the mounting base 130, thereby damaging the device to be cooled 200.

[0067] In other embodiments, the condenser 140 and the mounting base 130 may be sequentially arranged along the direction from the inlet to the outlet of the cooling air duct 111. Thus, the air in the cooling air duct 111 can first pass through the condenser 140, causing the water vapor in the air to condense into condensed water, thereby drying the air. The dried air can then flow through the mounting base 130 and the device to be cooled 200, thereby preventing the water vapor in the air from forming condensed water on the mounting base 130 and damaging the device to be cooled 200.

[0068] Specifically, fan 120 is installed at the entrance of cooling duct 111. Fan 120 is located above condenser 140, and mounting base 130 is located below condenser 140. Thus, fan 120, condenser 140, and mounting base 130 are arranged sequentially from the entrance to the exit of cooling duct 111. The air outlet of fan 120 faces downward, and the air blown out by fan 120 first passes downward through condenser 140 and then through mounting base 130.

[0069] In other embodiments, the cooling air duct 111 may be arranged horizontally. The mounting base 130 and the condenser 140 may be sequentially distributed along the direction from the inlet to the outlet of the cooling air duct 111, or the condenser 140 and the mounting base 130 may be sequentially distributed along the direction from the inlet to the outlet of the cooling air duct 111.

[0070] As shown in FIG1 , the housing 110 further includes a return air duct 112. The inlet of the return air duct 112 communicates with the outlet of the cooling air duct 111, and the outlet of the return air duct 112 communicates with the inlet of the cooling air duct 111, forming a closed space. By placing the mounting base 130 and the condenser 140 within the closed space of the housing 110, the condenser 140 can continuously condense water vapor within the closed space, preventing water vapor outside the housing 110 from entering the closed space, thereby achieving a high degree of dryness within the closed space of the housing 110.

[0071] In some embodiments, the return air duct 112 is disposed along the circumference of the cooling air duct 111 to increase the cross-sectional area of ​​the return air duct 112 and increase the air flow rate of the return air duct 112 .

[0072] In some embodiments, the cooling system 100 further includes a water pan (not shown) located below the condenser 140 for collecting condensed water generated on the surface of the condenser 140. The water pan is connected to the exterior of the housing 110 via a pipeline, thereby draining the condensed water collected by the water pan to the exterior of the housing 110.

[0073] In some embodiments, the pipes connected to the inlet or outlet of the first cooling channel 131 of the mounting base 130 are wrapped with thermal insulation cotton (not shown), and / or the pipes connected to the inlet or outlet of the second cooling channel 143 of the condenser 140 are wrapped with thermal insulation cotton (not shown). This prevents the formation of condensed water on the surfaces of the pipes connected to the inlet or outlet of the first cooling channel 131 of the mounting base 130 and / or the pipes connected to the inlet or outlet of the second cooling channel 143 of the condenser 140.

[0074] An embodiment of the present application also provides a laser, which includes a cooling system. The specific structure of the cooling system refers to the above embodiment. Since this laser adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0075] The laser includes a pump source and a cooling system. The cooling system is the cooling system in any one of the above embodiments. The pump source is the device to be cooled. The pump source is installed on a mounting seat of the cooling system.

[0076] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0077] The above is a detailed introduction to a cooling system and a laser provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0078] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0079] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

Claims

1. A cooling system, wherein: The cooling system comprises: A housing including a cooling air duct; a fan connected to the housing, the fan being used to provide airflow into the cooling air duct so that the airflow in the cooling air duct flows from the inlet to the outlet of the cooling air duct; A mounting seat connected to the shell and located in the cooling air duct, wherein a first cooling flow channel is provided in the mounting seat; A condenser connected to the shell and located in the cooling air duct, wherein a second cooling flow channel is provided in the condenser; A cooling component, wherein the outlet of the cooling component is connected to the inlet of the first cooling channel and the second cooling channel, and the cooling component is used to provide cooling medium to the first cooling channel and the second cooling channel, and the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

2. The cooling system according to claim 1, wherein: The cooling assembly comprises a cooling medium supply component, a first cooling component and a second cooling component, wherein an outlet of the cooling medium supply component is connected to an inlet of the first cooling channel and an inlet of the second cooling channel to provide the cooling medium to the first cooling channel and the second cooling channel; The first cooling component is used to cool the cooling medium in the cooling medium supply component, and the second cooling component is used to cool the cooling medium between the cooling medium supply component and the inlet of the second cooling channel, so that the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

3. The cooling system according to claim 2, wherein: The cooling medium supply component includes a first container, a second container and a circulation pump disposed in the first container, the first container and the second container are used to contain the cooling medium, the outlet of the circulation pump is communicated with the first cooling channel and the inlet of the second container, and the outlet of the second container is communicated with the inlet of the second cooling channel; The first cooling component includes a first heat exchanger disposed in the first container, and the first heat exchanger is used to cool the cooling medium in the first container; the second cooling component includes a second heat exchanger disposed in the second container, and the second heat exchanger is used to cool the cooling medium in the second container.

4. The cooling system according to claim 3, wherein: The inlet of the first container is in communication with the outlet of the first cooling channel and the outlet of the second cooling channel.

5. The cooling system according to any one of claims 1 to 4, wherein: The mounting seat and the condenser are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct; or, The condenser and the mounting seat are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct.

6. The cooling system according to claim 5, wherein: The housing further includes a return air duct, an inlet of the return air duct is communicated with an outlet of the cooling air duct, and an outlet of the return air duct is communicated with an inlet of the cooling air duct to form a closed space.

7. The cooling system of claim 6, wherein: The fan is arranged at the entrance of the cooling air duct; the cooling air duct extends in the up-down direction, the fan is located above the mounting seat, and the condenser is located below the mounting seat; or, the fan is located above the condenser, and the mounting seat is located below the condenser.

8. The cooling system of claim 6, wherein: The return air duct is arranged along the circumference of the cooling air duct.

9. The cooling system of claim 5, wherein: The cooling air duct extends laterally.

10. A laser, wherein: The laser comprises a pump source and a cooling system, wherein the cooling system comprises: A housing including a cooling air duct; a fan connected to the housing, the fan being used to provide airflow into the cooling air duct so that the airflow in the cooling air duct flows from the inlet to the outlet of the cooling air duct; A mounting seat connected to the housing and located in the cooling air channel, wherein a first cooling flow channel is provided in the mounting seat, and the pump source is mounted on the mounting seat; A condenser connected to the shell and located in the cooling air duct, wherein a second cooling flow channel is provided in the condenser; A cooling component, wherein the outlet of the cooling component is connected to the inlet of the first cooling channel and the second cooling channel, and the cooling component is used to provide cooling medium to the first cooling channel and the second cooling channel, and the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

11. The laser of claim 10, wherein: The cooling assembly comprises a cooling medium supply component, a first cooling component and a second cooling component, wherein an outlet of the cooling medium supply component is connected to an inlet of the first cooling channel and an inlet of the second cooling channel to provide the cooling medium to the first cooling channel and the second cooling channel; The first cooling component is used to cool the cooling medium in the cooling medium supply component, and the second cooling component is used to cool the cooling medium between the cooling medium supply component and the inlet of the second cooling channel, so that the temperature of the cooling medium entering the first cooling channel is greater than the temperature of the cooling medium entering the second cooling channel.

12. The laser of claim 11, wherein: The cooling medium supply component includes a first container, a second container and a circulation pump disposed in the first container, the first container and the second container are used to contain the cooling medium, the outlet of the circulation pump is communicated with the first cooling channel and the inlet of the second container, and the outlet of the second container is communicated with the inlet of the second cooling channel; The first cooling component includes a first heat exchanger disposed in the first container, and the first heat exchanger is used to cool the cooling medium in the first container; the second cooling component includes a second heat exchanger disposed in the second container, and the second heat exchanger is used to cool the cooling medium in the second container.

13. The laser of claim 12, wherein: The inlet of the first container is in communication with the outlet of the first cooling channel and the outlet of the second cooling channel.

14. A laser as claimed in any one of claims 10 to 13, wherein: The mounting seat and the condenser are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct; or, The condenser and the mounting seat are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct.

15. The laser of claim 14, wherein: The housing further includes a return air duct, an inlet of the return air duct is communicated with an outlet of the cooling air duct, and an outlet of the return air duct is communicated with an inlet of the cooling air duct to form a closed space.

16. The laser of claim 15, wherein: The fan is arranged at the entrance of the cooling air duct; the cooling air duct extends in the up-down direction, the fan is located above the mounting seat, and the condenser is located below the mounting seat; or, the fan is located above the condenser, and the mounting seat is located below the condenser.

17. The cooling system of claim 15, wherein: The return air duct is arranged along the circumference of the cooling air duct.

18. The cooling system of claim 14, wherein: The cooling air duct extends laterally.

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