Memory array and manufacturing method therefor, and memory and electronic device
By using a three-electrode structure and a dielectric layer design for the capacitor cell, the problem of low integration density of capacitor structures in memory is solved, achieving high integration density and high storage density of capacitors.
WO2025139090A9PCT designated stage Publication Date: 2026-05-28HUAWEI TECH CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-09-18
- Publication Date
- 2026-05-28
Smart Images

Figure CN2024119510_28052026_PF_FP_ABST
Abstract
The present application relates to the technical field of electronics. Provided are a memory array and a manufacturing method therefor, and a memory and an electronic device, which are used for solving the problem of a capacitor structure in a memory having a low density of integration. The memory array comprises: a substrate, and a capacitor unit arranged on the substrate. The capacitor unit comprises a first electrode, a second electrode and a third electrode, wherein the first electrode, the second electrode and the third electrode all extend in the thickness direction of the substrate, the first electrode is arranged around the second electrode, and the second electrode is arranged around the third electrode. The capacitor unit further comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer is arranged between the first electrode and the second electrode, and the second dielectric layer is arranged between the second electrode and the third electrode. The memory array is used for improving the density of integration of a capacitor structure.
Need to check novelty before this filing date? Find Prior Art