Optical module

Abstract

An optical module (200), comprising an optical processing component (500). The optical processing component (500) comprises: a first beam processing assembly (510); a second beam processing assembly (520), the second beam processing assembly (520) being arranged above the first beam processing assembly (510); a lens assembly (530) arranged at the light exit side of the first beam processing assembly (510) and the second beam processing assembly (520); and a deflecting prism (540) arranged at the light exit side of the lens assembly (530), wherein the deflecting prism (540) is provided with reflective surfaces (5411, 5421, 5431, 5441, 5451) at the reflection side thereof, the reflective surfaces (5411, 5421, 5431, 5441, 5451) are located on an output optical path of at least one of the first beam processing assembly (510) and the second beam processing assembly (520), and the reflective surfaces (5411, 5421, 5431, 5441, 5451) are configured to reflect light signals output by the first beam processing assembly (510) and / or the second beam processing assembly (520).

Description

optical modules

[0001] This application claims the priority of application number 202410521981.8 filed with the China Patent Office on April 28, 2024; the priority of application number 202410315842.X filed with the China Patent Office on March 19, 2024; and the priority of application number 202420535848.3 filed with the China Patent Office on March 19, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, with the advancement of optical communication technology, the transmission rates of optical modules are constantly increasing. Some optical modules with higher transmission rates have higher integration densities than those with lower transmission rates. For example, multi-channel optical transceiver technology is used to transmit and receive multi-wavelength optical signals.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising:

[0006] A circuit board having a notch formed on the surface;

[0007] The carrier is embedded in the notch; the carrier includes a first carrier area, a third carrier area, and a second carrier area between the first carrier area and the third carrier area;

[0008] An optical processing component for processing optical signals including multiple wavelengths;

[0009] Light processing components include:

[0010] A first light beam processing component is disposed in the second carrying area; the second carrying area is located at a height such that the first light beam processing component matches the first light path;

[0011] A second light beam processing assembly is disposed above the first light beam processing assembly; the second carrying area is located at a height such that the second light beam processing assembly matches the second light path;

[0012] A lens assembly is provided on the light-exiting side of the first light beam processing assembly and the second light beam processing assembly;

[0013] A turning prism is arranged on the light-emitting side of the lens assembly. A reflecting surface is provided on the reflecting side of the turning prism. The reflecting surface is located in the output light path of at least one of the first light beam processing assembly and the second light beam processing assembly. The reflecting surface is configured to reflect the light signal output by the first light beam processing assembly and / or the second light beam processing assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0015] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0016] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0017] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0019] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0020] FIG6 is a schematic diagram of a partial structure of a light receiving component provided according to some embodiments of the present disclosure;

[0021] FIG7 is a partial schematic diagram 1 of a light receiving component provided according to some embodiments of the present disclosure;

[0022] FIG8 is a schematic diagram of a light spot arrangement according to some embodiments of the present disclosure;

[0023] FIG9 is a schematic diagram of another light spot arrangement according to some embodiments of the present disclosure;

[0024] FIG10 is a second partial schematic diagram of a light receiving component according to some embodiments of the present disclosure;

[0025] FIG11 is a third partial schematic diagram of a light receiving component according to some embodiments of the present disclosure;

[0026] FIG12 is a first structural diagram of a double-layer turning prism according to some embodiments of the present disclosure;

[0027] FIG13 is a second structural diagram of a double-layer turning prism provided according to some embodiments of the present disclosure;

[0028] FIG14 is a third structural diagram of a double-layer turning prism provided according to some embodiments of the present disclosure;

[0029] FIG15 is a diagram illustrating a double-layer turning prism in use according to some embodiments of the present disclosure;

[0030] FIG16 is a schematic structural diagram of another double-layer turning prism provided according to some embodiments of the present disclosure;

[0031] FIG17 is a cross-sectional view of another double-layer turning prism in use according to some embodiments of the present disclosure;

[0032] FIG18 is a schematic diagram of a double-layer turning prism in use according to some embodiments of the present disclosure;

[0033] FIG19 is a first distribution diagram of a lens assembly according to some embodiments of the present disclosure;

[0034] FIG20 is a second schematic diagram of the distribution of a lens assembly according to some embodiments of the present disclosure;

[0035] FIG21 is a top view of a light receiving component according to some embodiments of the present disclosure;

[0036] FIG22 is a cross-sectional view of a light receiving component according to some embodiments of the present disclosure;

[0037] FIG23 is a diagram showing the internal structure of an optical module according to some embodiments of the present disclosure;

[0038] FIG24 is an internal exploded view of an optical module according to some embodiments of the present disclosure;

[0039] FIG25 is a first optical path diagram of an optical module according to some embodiments of the present disclosure;

[0040] FIG26 is a second optical path diagram of an optical module provided according to some embodiments of the present disclosure;

[0041] FIG27 is a third optical path diagram of an optical module provided according to some embodiments of the present disclosure;

[0042] FIG28 is a fourth optical path diagram of an optical module according to some embodiments of the present disclosure;

[0043] FIG29 is a schematic diagram of an internal cross-section of an optical module according to some embodiments of the present disclosure;

[0044] FIG30 is a side view of an optical module according to some embodiments of the present disclosure;

[0045] FIG31 is an internal top view of an optical module according to some embodiments of the present disclosure;

[0046] FIG32 is a schematic diagram showing the relative positional relationship between a first fiber collimator and a second fiber collimator of an optical module according to some embodiments of the present disclosure;

[0047] FIG33 is a structural diagram 1 of a carrier provided according to an embodiment of the present disclosure;

[0048] FIG34 is a second structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0049] FIG35 is a third structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0050] FIG36 is a first schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0051] FIG37 is a second schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0052] FIG38 is an assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0053] Figure 39 is an assembly decomposition diagram between a carrier, a light emitting component, and a light receiving component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0054] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0055] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0056] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0057] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0058] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0059] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0060] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0061] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0062] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0063] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0064] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0065] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0066] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0067] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 . The outer contour of the housing is generally a square.

[0068] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0069] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates 2012 are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0070] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 204 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located on the side of the optical module 200. The opening 203 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 203 and is inserted into the electrical connector of the host computer 100; the opening 204 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the light emitting component 400 and the light receiving component 500 in the optical module 200.

[0071] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0072] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0073] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0074] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0075] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0076] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0077] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0078] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0079] In some examples, the optical emitting component 400 and the optical receiving component 500 may be collectively referred to as an optical processing component. The optical processing component may process optical signals including multiple wavelengths.

[0080] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0081] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0082] In some embodiments, the light emitting component 400 may include a cavity, in which electrical devices for generating emission light signals and optical devices for transmitting emission light signals are arranged; wherein the electrical devices include lasers, etc., and the optical devices include collimating lenses, etc.

[0083] In some embodiments, the optical receiving component 500 may include a cavity, in which optical devices for transmitting received optical signals and electrical devices for converting received optical signals are arranged; wherein the optical devices include a converging lens, etc., and the electrical devices include a photodetector, etc.

[0084] In some embodiments, the light emitting component 400 and the light receiving component 500 may share a cavity, such as a double-layer cavity, with one layer for the light emitting component 400 and the other layer for the light receiving component 500.

[0085] In some embodiments, the light emitting component 400 and the light receiving component 500 may not share a cavity, and the light emitting component 400 and the light receiving component 500 may be independent of each other, and the light emitting component 400 and the light receiving component 500 may be arranged on the same side of the circuit board 300. Of course, in the embodiment of the present disclosure, the light emitting component 400 and the light receiving component 500 may also be arranged on different sides of the circuit board 300.

[0086] Figure 5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 5, the optical module 200 includes a fiber optic adapter group 205 and a fiber optic connector group 206, and a fiber optic group 207 is arranged between the fiber optic adapter group 205 and the fiber optic connector group 206. The fiber optic adapter group 205 includes a plurality of fiber optic adapters, the fiber optic connector group 206 includes a plurality of fiber optic connectors (in some examples, it can also be called a fiber optic collimator), and the fiber optic group 207 includes a plurality of optical fibers, and the fiber optic adapters are connected to the corresponding fiber optic connectors through corresponding optical fibers. The fiber optic connector is fixedly connected to the optical receiving component 500, such as the fiber optic connector is connected to the side wall of the cavity in the optical receiving component 500. The fiber optic adapter is arranged at the optical port of the optical module, and the external optical fiber is connected to the fiber optic adapter. The received optical signal input through the external optical fiber is transmitted to the optical receiving component 500 in sequence through the fiber optic adapter, the optical fiber and the fiber optic connector.

[0087] In some examples, the optical fiber connector can be fixedly connected to the light emitting component 400, such as the optical fiber connector connected to the side wall of the cavity in the light emitting component 400. The optical signal emitted by the light emitting component 400 is transmitted outward through the optical fiber connector, optical fiber and optical fiber adapter.

[0088] In some embodiments, multiple fiber optic adapters in the fiber optic adapter group 205 are used to input received optical signals, so that multiple beams of received optical signals can be input into the optical module through external optical fibers.

[0089] In some embodiments, fiber optic adapter assembly 205 includes four fiber optic adapters, fiber optic connector assembly 206 includes four fiber optic connectors, and fiber optic assembly 207 includes four optical fibers, forming two fiber optic adapter-fiber-fiber connector sets. Two fiber optic adapter-fiber-fiber connector sets are used to transmit transmitted optical signals, while the other two fiber optic adapter-fiber-fiber connector sets are used to transmit received optical signals. Of course, in the disclosed embodiments, the number of fiber adapters in fiber optic adapter assembly 205, the number of fiber optic connectors in fiber optic connector assembly 206, and the number of optical fibers in fiber optic assembly 207 are not limited to these numbers.

[0090] In some embodiments, the optical fibers in the optical fiber group 207 are used to transmit optical signals of multiple wavelengths. For example, the optical fiber adapter, optical fiber, and optical fiber connector used to transmit and receive optical signals transmit optical signals of four wavelengths, where the wavelengths of the transmitted optical signals are arranged in four.

[0091] In some embodiments, the optical fiber adapters in the optical fiber adapter group 205 are arranged in one row or two rows, etc.; the optical fiber connectors in the optical fiber connector group 206 for connecting the light receiving component 500 are arranged vertically or horizontally.

[0092] FIG6 is a schematic diagram of a partial structure of an optical receiving component provided according to some embodiments of the present disclosure. As shown in FIG6 , in some examples of the embodiments of the present application, the optical processing component includes an optical receiving component 500 as an example for description. The optical receiving component 500 may include a first wavelength division multiplexing component (in some examples, it may be referred to as a first beam processing component) 510, a second wavelength division multiplexing component (in some examples, it may be referred to as a second beam processing component) 520, a lens component 530, a double-layer turning prism 540, and an optical receiving component 550, wherein the second wavelength division multiplexing component 520 is disposed above the first wavelength division multiplexing component 510.

[0093] In some examples, the first wavelength division multiplexing component 510 and the second wavelength division multiplexing component 520 may use a wavelength division multiplexing component (DeMUX). The DeMUX can split a beam of light containing received optical signals of multiple wavelengths into multiple beams according to the wavelengths, and then output them through different optical output ports of the DeMUX. Then, the first wavelength division multiplexing component 510 and the second wavelength division multiplexing component 520 can split the received optical signals input to the optical module according to the wavelengths of the optical signals. The lens component 530 is used to converge and transmit the received optical signals output by the first wavelength division multiplexing component 510 and the second wavelength division multiplexing component 520, and reduce the light spot of the received optical signals output by the first wavelength division multiplexing component 510 and the second wavelength division multiplexing component 520. The double-layer turning prism 540 is used to change the transmission direction of the received optical signal. The optical receiving component 550 includes multiple optical receiving chips, which are used to convert the received optical signals transmitted to the optical receiving chips into electrical signals.

[0094] In some embodiments, the second WDM demultiplexing assembly 520 may be directly fixed on the first WDM demultiplexing assembly 510 , for example, the second WDM demultiplexing assembly 520 is adhered to the top of the first WDM demultiplexing assembly 510 by glue.

[0095] In some embodiments, a support is provided on top of the first WDM demultiplexing assembly 510, the bottom of the support is connected to the first WDM demultiplexing assembly 510, and the top of the support is connected to the second WDM demultiplexing assembly 520. Of course, in the embodiment of the present disclosure, the second WDM demultiplexing assembly 520 is also suspended above the first WDM demultiplexing assembly 510.

[0096] In the optical receiving component 500 provided in the embodiment of the present disclosure, the first wavelength division multiplexing component 510 and the second wavelength division multiplexing component 520 are arranged vertically, so that the first optical path and the second optical path are arranged in layers in the upper and lower directions. For example, the multi-channel received optical signals are arranged in layers in the height direction of the optical module, which can fully utilize the space in the height direction of the optical module and facilitate the integration of multi-channel received optical signals in the optical module.

[0097] In some embodiments, the lens assembly 530 may include multiple lenses, each of which is correspondingly arranged on the output optical paths of the first wavelength division multiplexing assembly 510 and the second wavelength division multiplexing assembly 520. The multiple lenses are independently arranged, with gaps between adjacent lenses. The lenses are independent of each other, making it easier to connect the lenses through active coupling assembly, thereby ensuring the installation accuracy of the lenses. Of course, in some embodiments, the lens assembly 530 may be a single integral structure with a curved surface having a converging effect. Exemplarily, the lens assembly 530 includes multiple lenses; some of the lenses have relatively low optical axis heights to accommodate the light outlet position of the first wavelength division multiplexing assembly 510; while some of the lenses have relatively high optical axis heights to accommodate the light outlet position of the second wavelength division multiplexing assembly 520.

[0098] In some embodiments, the double-layer turning prism 540 may be a structure composed of multiple prisms, such as two prisms or three prisms. The multiple prisms are combined to form a first reflecting surface and a second reflecting surface on the reflecting side of the double-layer turning prism 540. The first reflecting surface and the second reflecting surface are located at different heights within the double-layer turning prism 540. The first reflecting surface and the second reflecting surface are used to reflect the received optical signals split and output by the first and second wavelength division multiplexing components 510 and 520, thereby causing the double-layer turning prism 540 to change the transmission direction of the received optical signals. Of course, in the disclosed embodiments, the double-layer turning prism 540 may be a single-piece structure.

[0099] In some embodiments, the reflective side of the double-layer turning prism 540 includes a first reflective surface and a second reflective surface. The first reflective surface is used to change the transmission direction of the received optical signal output by the first wavelength division multiplexing component 510, and the second reflective surface is used to change the transmission direction of the received optical signal output by the second wavelength division multiplexing component 520. Exemplarily, the second reflective surface is located above the first reflective surface, and a gap is defined in the first reflective surface to allow the received optical signal reflected by the second reflective surface to pass through the gap.

[0100] In some embodiments, the light receiving assembly 550 is located below the double-layered turning prism 540. For example, the light receiving assembly 550 is located below two reflective surfaces of the double-layered turning prism 540.

[0101] In some embodiments, the light receiving assembly 550 includes a substrate on which a plurality of light receiving chips are disposed.

[0102] In some embodiments, the light receiving assembly 550 includes a plurality of substrates, each of which is provided with a plurality of light receiving chips, and the plurality of substrates are arranged along the length direction and the width direction of the light module.

[0103] Figure 7 is a partial schematic diagram of an optical receiving component according to some embodiments of the present disclosure; solid arrows represent optical signals output by first WDM component 510, and dashed arrows represent optical signals output by second WDM component 520. As shown in Figure 7, second WDM component 520 is positioned above first WDM component 510. The optical signals output by first WDM component 510 and second WDM component 520 are located at different heights, enabling layered transmission of optical signals received within optical receiving component 500.

[0104] In some embodiments, the second WDM assembly 520 is stacked in an offset manner with the first WDM assembly 510, such that the central axis of the optical output port of the second WDM assembly 520 is staggered with the central axis of the optical output port of the first WDM assembly 510. This results in the optical spots of the optical signals output by the first WDM assembly 510 being staggered with the optical spots of the optical signals output by the second WDM assembly 520. Of course, in the embodiments of the present disclosure, the second WDM assembly 520 can be stacked in an upright position above the first WDM assembly 510.

[0105] In some embodiments, along the direction shown in FIG7 , the second WDM demultiplexing assembly 520 is offset to the right of the first WDM demultiplexing assembly 510. Of course, in the disclosed embodiment, the second WDM demultiplexing assembly 520 may be offset to the left of the first WDM demultiplexing assembly 510. Exemplarily, the offset spacing between the second WDM demultiplexing assembly 520 and the first WDM demultiplexing assembly 510 is half the spacing between adjacent optical ports.

[0106] In some embodiments, the received optical signal input to the first wavelength division multiplexing component 510 includes optical signals of four wavelengths. After passing through the first wavelength division multiplexing component 510, four optical signals of different wavelengths are output. That is, the first wavelength division multiplexing component 510 is used to split the optical signals of four wavelengths. Of course, in the embodiments of the present disclosure, the first wavelength division multiplexing component 510 is not limited to splitting the optical signals of four wavelengths.

[0107] In some embodiments, the received optical signal input to the second wavelength division multiplexing component 520 includes optical signals of four wavelengths. After passing through the second wavelength division multiplexing component 520, four optical signals of different wavelengths are output. In other words, the second wavelength division multiplexing component 520 is used to split the optical signals of four wavelengths. Of course, in the embodiments of the present disclosure, the second wavelength division multiplexing component 520 is not limited to splitting the optical signals of four wavelengths.

[0108] In some embodiments, the wavelength of the received optical signal input to the first wavelength division multiplexing component 510 is the same as the wavelength of the received optical signal input to the second wavelength division multiplexing component 520. Of course, in the embodiments of the present disclosure, the wavelength of the received optical signal input to the first wavelength division multiplexing component 510 and the wavelength of the received optical signal input to the second wavelength division multiplexing component 520 are not limited to being the same.

[0109] FIG8 is a schematic diagram of a light spot arrangement provided according to some embodiments of the present disclosure. FIG8 shows an arrangement of light spots for optical signals output by a first wavelength division multiplexing component 510 and a second wavelength division multiplexing component 520. The light spots indicated by solid lines are the light spots for optical signals output by the first wavelength division multiplexing component 510, and the light spots indicated by dashed lines are the light spots for optical signals output by the second wavelength division multiplexing component 520. As shown in FIG8 , the light spots for optical signals output by the first wavelength division multiplexing component 510 include light spots 511, 512, and 513, and the light spots for optical signals output by the second wavelength division multiplexing component 520 include light spots 521, 522, and 523. Light spot 521 is located above between light spots 511 and light spots 512, and light spot 512 is located below between light spots 521 and light spots 522, so that the light spots of the optical signals output by the first wavelength division multiplexing component 510 and the light spots of the optical signals output by the second wavelength division multiplexing component 520 are staggered, which helps to reduce optical signal crosstalk caused by overlapping light spots.

[0110] In some embodiments, the optical axis of light spot 521 is located directly above the central axis between light spot 511 and light spot 512. For example, the projection of the optical axis of light spot 521 in the direction of the line connecting the centers of light spot 511 and light spot 512 coincides with the central axis of light spot 511 and light spot 512. The optical axes of light spots 511, 512, 513, 521, 522, and 523 coincide with the central axes of the corresponding light outlets, so that the projection of the central axis of the light outlet corresponding to light spot 521 on the first wavelength division multiplexing assembly 510 coincides with the central axes of the light outlets corresponding to light spot 511 and light outlets corresponding to light spot 512. Of course, in the embodiment of the present disclosure, the optical axis of light spot 521 may not be located directly above the central axis between light spot 511 and light spot 512, such as slightly biased toward the optical axis of light spot 511 or slightly biased toward the optical axis of light spot 512, or light spot 521 may be located directly above light spot 511.

[0111] Figure 9 is a schematic diagram of another optical spot arrangement provided according to some embodiments of the present disclosure. As shown in Figure 9, when the width of DeMUX01 in Figure 9 is the same as the width of the combination of the first WDM component 510 and the second WDM component 520 in Figure 8, if DeMUX01 is configured to output eight optical signals, the optical spots output by DeMUX01 will overlap, causing crosstalk in the optical signals output by DeMUX01. In the embodiments of the present disclosure, by disposing the second WDM component 520 above the first WDM component 510, the received optical signals are transmitted in layers within the optical receiving component 500, fully utilizing the space in the height direction of the optical module and reducing optical signal crosstalk caused by overlapping optical spots.

[0112] Figure 10 is a second partial schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure, and Figure 11 is a third partial schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure; wherein, the thick solid arrows are optical signals input to the first wavelength division multiplexing component 510, and the thick dotted arrows are optical signals input to the second wavelength division multiplexing component 520.

[0113] As shown in Figure 10, the light input port of the first wavelength division multiplexing assembly 510 and the light input port of the second wavelength division multiplexing assembly 520 are located on different sides, and the output ends of the corresponding optical fiber connectors are optically coupled to the corresponding light input ports. For example, the light input port of the first wavelength division multiplexing assembly 510 may be located on the right side of the direction shown in Figure 10, and the light input port of the second wavelength division multiplexing assembly 520 may be located on the left side of the direction shown in Figure 10. Of course, in some embodiments of the present disclosure, the light input port of the first wavelength division multiplexing assembly 510 may be located on the left side of the direction shown in Figure 10, and the light input port of the second wavelength division multiplexing assembly 520 may be located on the right side of the direction shown in Figure 10.

[0114] As shown in Figure 11, the light input port of the first WDM component 510 and the light input port of the second WDM component 520 are located on the same side, and the output ends of the corresponding optical fiber connectors are optically coupled to the corresponding light input ports. For example, the light input port of the first WDM component 510 and the light input port of the second WDM component 520 may be located on the left side of the direction shown in Figure 11. Of course, in some embodiments, the light input port of the first WDM component 510 and the light input port of the second WDM component 520 may be located on the right side of the direction shown in Figure 11.

[0115] In some embodiments, the light input port of the first WDM component 510 is optically coupled to the first optical fiber connector, and a collimating lens may be provided between the first optical fiber connector and the light input port of the first WDM component 510. For example, the collimating lens may be provided at the light output end of the first optical fiber connector.

[0116] In some embodiments, when the heights of the first optical fiber connector and the first WDM assembly 510 are not aligned, a first displacement prism may be disposed between the first optical fiber connector and the first WDM assembly 510. The first displacement prism is used to adjust the position of the received optical signal so that the received optical signal output by the first optical fiber connector can be transmitted to the first WDM assembly 510.

[0117] In some embodiments, the light input port of the second WDM component 520 is optically coupled to the second optical fiber connector, and a collimating lens can be provided between the second optical fiber connector and the light input port of the second WDM component 520. For example, the collimating lens can be provided at the light output end of the second optical fiber connector.

[0118] In some embodiments, when the heights of the second optical fiber connector and the second WDM assembly 520 are not aligned, a second displacement prism may be disposed between the second optical fiber connector and the second WDM assembly 520. The second displacement prism is used to adjust the position of the received optical signal so that the received optical signal output by the second optical fiber connector can be transmitted to the second WDM assembly 520.

[0119] Figure 12 is a schematic diagram of the structure of a double-layer turning prism provided according to some embodiments of the present disclosure, and Figure 13 is a schematic diagram of the structure of a double-layer turning prism provided according to some embodiments of the present disclosure. As shown in Figures 12 and 13, the double-layer turning prism 540 includes a first prism 541, a second prism 542, a third prism 543, a fourth prism 544, and a fifth prism 545. The fifth prism 545 is located above the first prism 541, the second prism 542, the third prism 543, and the fourth prism 544. The first prism 541, the second prism 542, the third prism 543, and the fourth prism 544 are arranged in an array with spaces between adjacent prisms.

[0120] A reflecting surface 5411 is formed on the reflecting side of the first prism 541, a reflecting surface 5421 is formed on the reflecting side of the second prism 542, a reflecting surface 5431 is formed on the reflecting side of the third prism 543, and a reflecting surface 5441 is formed on the reflecting side of the fourth prism 544. The reflecting surface 5411, the reflecting surface 5421, the reflecting surface 5431 and the reflecting surface 5441 are respectively used to reflect the received optical signal to change the transmission direction of the received optical signal. Exemplarily, the inclination angle of the reflecting surface 5411, the inclination angle of the reflecting surface 5421, the inclination angle of the reflecting surface 5431 and the inclination angle of the reflecting surface 5441 are the same or similar, and the reflecting surface 5411, the reflecting surface 5421, the reflecting surface 5431 and the reflecting surface 5441 are arranged side by side, so that the reflecting surface 5411, the reflecting surface 5421, the reflecting surface 5431 and the reflecting surface 5441 form a first reflecting surface, which is used to correspond to the reflection of the received optical signal output after demultiplexing by the first wavelength division multiplexing component 510.

[0121] A second reflecting surface 5451 is formed on the reflecting side of the fifth prism 545 and is located above the reflecting surfaces 5411, 5421, 5431 and 5441. The second reflecting surface 5451 is used to reflect the received optical signal output by the second wavelength division multiplexing component 520 after demultiplexing.

[0122] In some embodiments, the inclination angle of the first reflective surface is the same as or similar to the inclination angle of the second reflective surface 5451 .

[0123] In some embodiments, the inclination angle of the first reflective surface is 42°-47°, such as 42°, 43°, 46° or 47°; the inclination angle of the second reflective surface 5451 is 42°-47°, such as 42°, 43°, 46° or 47°.

[0124] In some embodiments, the first prism 541 , the second prism 542 , the third prism 543 , and the fourth prism 544 may be connected to the bottom surface of the fifth prism 545 by glue.

[0125] In some embodiments, the double-layered turning prism 540 further includes a connecting plate, the top surface of which is connected to the fifth prism 545, and the bottom surface of which is connected to the first prism 541, the second prism 542, the third prism 543, and the fourth prism 544. The connecting plate facilitates the connection of the first prism 541, the second prism 542, the third prism 543, the fourth prism 544, and the fifth prism 545.

[0126] In some embodiments, the incident side of the first prism 541 , the incident side of the second prism 542 , the incident side of the third prism 543 , and the incident side of the fourth prism 544 are respectively flush with the incident side of the fifth prism 545 .

[0127] In some embodiments, the incident side of the first prism 541, the incident side of the second prism 542, the incident side of the third prism 543, and the incident side of the fourth prism 544 protrude from the incident side of the fifth prism 545, so as to use the incident side top of the first prism 541, the incident side top of the second prism 542, the incident side top of the third prism 543, and the incident side top of the fourth prism 544 to support part of the lenses in the lens assembly 530.

[0128] In some embodiments, the double-layer turning prism 540 includes an upper prism and a lower prism, wherein the upper prism is located above the lower prism. The upper prism has a second reflective surface on its reflective side, and the lower prism has a first reflective surface on its reflective side, the second reflective surface being located above the first reflective surface. A gap is provided on the first reflective surface.

[0129] Figure 14 is a third structural diagram of a dual-layer turning prism according to some embodiments of the present disclosure, and Figure 15 is a diagram of a dual-layer turning prism in use according to some embodiments of the present disclosure, wherein the solid arrows represent the optical signals output by the first wavelength division multiplexing component 510, and the dashed arrows represent the optical signals output by the second wavelength division multiplexing component 520. As shown in Figures 14 and 15, the optical signal reflected by the second reflective surface 5451 passes through the bottom of the fifth prism 545 and is transmitted to the space between the first prism 541 and the second prism 542, etc.

[0130] As shown in FIG15 , the optical receiving assembly 550 includes a substrate 551 on which are disposed optical receiving chips 552, 553, 554, and 555. The optical receiving assembly 550 is located below the double-layer turning prism 540, such that the optical receiving chips 552, 553, 554, and 555 are located below the first and second reflecting surfaces 5451. The distance from the first reflecting surface to the optical receiving chips 552, 554, and so on is shorter than the distance from the second reflecting surface 5451 to the optical receiving chips 553, 555, and so on.

[0131] In some embodiments, optical receiver chip 552 is located on a straight line projected from the center axis of one optical outlet of first wavelength division multiplexing assembly 510, optical receiver chip 553 is located on a straight line projected from the center axis of one optical outlet of second wavelength division multiplexing assembly 520, optical receiver chip 554 is located on a straight line projected from the center axis of another optical outlet of first wavelength division multiplexing assembly 510, and optical receiver chip 555 is located on a straight line projected from the center axis of another optical outlet of second wavelength division multiplexing assembly 520. Optical receiver chips 552, 553, 554, and 555 are arranged at equal intervals on substrate 551. Of course, in the disclosed embodiment, optical receiver chip 552 is slightly offset from the straight line projected from the center axis of the optical outlet.

[0132] In some embodiments, the four received optical signals output by the first wavelength division multiplexing component 510 after demultiplexing are correspondingly transmitted to the reflection surface 5411, the reflection surface 5421, the reflection surface 5431 and the top of the reflection surface 5441. The reflection surface 5411 reflects one received optical signal to the optical receiving chip 552, the reflection surface 5421 reflects one received optical signal to the optical receiving chip 554, and so on.

[0133] In some embodiments, the four received optical signals output by the second wavelength division multiplexing assembly 520 after demultiplexing are correspondingly transmitted to the second reflective surface 5451. The second reflective surface 5451 reflects one received optical signal, passes it through the gap between the first prism 541 and the second prism 542 to the optical receiving chip 553. The second reflective surface 5451 reflects one received optical signal, passes it through the gap between the second prism 542 and the third prism 543 to the optical receiving chip 555, etc. Adjacent optical receiving chips in the optical receiving assembly 550 receive received optical signals output by different wavelength division multiplexing assemblies.

[0134] In some embodiments, by adjusting the misalignment direction between the first WDM component 510 and the second WDM component 520 , the reflective surface 5411 can reflect one received optical signal to the optical receiving chip 553 , and the second reflective surface 5451 can reflect one received optical signal from the left side of the reflective surface 5411 to the optical receiving chip 552 .

[0135] Figure 16 is a schematic diagram of the structure of another double-layered turning prism provided according to some embodiments of the present disclosure, and Figure 17 is a cross-sectional view of another double-layered turning prism provided according to some embodiments of the present disclosure in use. As shown in Figures 16 and 17, the double-layered turning prism 540 includes an upper prism 546 and a lower prism 547, with the upper prism 546 positioned above the lower prism 547. A second reflecting surface 5461 is provided on the reflective side of the upper prism 546, and a first reflecting surface 5471 is provided on the reflective side of the lower prism 547, with the second reflecting surface 5461 positioned above the first reflecting surface 5471. A light receiving assembly 550 is provided below the first reflecting surface 5471 and the second reflecting surface 5461.

[0136] The received optical signal output by the first WDM assembly 510 is transmitted to the first reflective surface 5471, reflected by the first reflective surface 5471, and transmitted to the corresponding optical receiving chip in the optical receiving assembly 550. The received optical signal output by the second WDM assembly 520 is transmitted to the second reflective surface 5461, reflected by the second reflective surface 5461, transmitted to the bottom of the upper prism 546, refracted at the bottom of the upper prism 546, then transmitted to the lower prism 547, refracted at the first reflective surface 5471, and finally transmitted to the bottom of the lower prism 547 and transmitted through the bottom of the lower prism 547 to the corresponding optical receiving chip in the optical receiving assembly 550.

[0137] FIG18 is a schematic diagram of another double-layer turning prism in use according to some embodiments of the present disclosure. As shown in FIG18 , the double-layer turning prism 540 includes an upper prism 546 and a lower prism 547. The reflective side of the upper prism 546 is provided with a second reflective surface 5461, and the reflective side of the lower prism 547 is provided with a first reflective surface 5471. The second reflective surface 5461 is located above the first reflective surface 5471. A first light receiving component 550a is provided below the first reflective surface 5471, and a second light receiving component 550b is provided below the second reflective surface 5461. Exemplarily, the first light receiving component 550a and the second light receiving component 550b each include a plurality of light receiving chips. Of course, in the embodiment of the present disclosure, the number of light receiving chips in the first light receiving component 550a and the second light receiving component 550b is not limited to multiple.

[0138] The received optical signal output by the first wavelength division multiplexing component 510 is transmitted to the first reflective surface 5471, reflected by the first reflective surface 5471 and transmitted to the corresponding optical receiving chip in the first optical receiving component 550a. The received optical signal output by the second wavelength division multiplexing component 520 is transmitted to the second reflective surface 5461, reflected by the second reflective surface 5461 and transmitted to the corresponding optical receiving chip in the second optical receiving component 550b.

[0139] Figure 19 is a schematic diagram of a lens assembly according to some embodiments of the present disclosure, and Figure 20 is a schematic diagram of a lens assembly according to some embodiments of the present disclosure. As shown in Figures 19 and 20, lens assembly 530 includes a first lens group 531 and a second lens group 532, each of which includes multiple lenses.

[0140] In some embodiments, the optical axes of the lenses in the first lens group 531 are positioned at lower heights than the optical axes of the lenses in the second lens group 532. The lenses in the first lens group 531 are used to converge the four paths of received optical signals output after demultiplexing by the first wavelength division multiplexing assembly 510, and the lenses in the second lens group 532 are used to converge the four paths of received optical signals output after demultiplexing by the second wavelength division multiplexing assembly 520.

[0141] In some embodiments, the distance between the first lens group 531 and the light-emitting side of the first wavelength division multiplexing assembly 510 is smaller than the distance between the second lens group 532 and the light-emitting side of the second wavelength division multiplexing assembly 520. That is, the distance between the first lens group 531 and the first reflective surface is greater than the distance between the second lens group 532 and the second reflective surface 5451. Exemplarily, the bottom of the second lens group 532 is connected to the top of the light-incident side of the first prism 541, the second prism 542, etc., so that the first prism 541, the second prism 542, etc. support and connect the lenses in the second lens group 532.

[0142] In some embodiments, a first support platform is provided below the first lens group 531, and a second support platform is provided below the second lens group 532. The height of the first support platform is less than the height of the second support platform, so that the height position of the optical axis of the lens in the first lens group 531 is lower than the height position of the optical axis of the lens in the second lens group 532.

[0143] In some embodiments, the first lens group 531 may include a first lens 5311, a first lens 5312, a first lens 5313, and a first lens 5314, with the first lenses 5311, 5312, 5313, and 5314 arranged in a row. The optical axes of the first lens 5311, 5312, 5313, and 5314 are collinear with the central axes of the four light output ports of the first wavelength division multiplexing assembly 510. A space is provided between the first lens 5311 and the first lens 5312, a space is provided between the first lens 5312 and the first lens 5313, and a space is provided between the first lens 5313 and the first lens 5314. In the disclosed embodiments, the number of first lenses in the first lens group 531 is not limited to four.

[0144] In some embodiments, the second lens group 532 may include a second lens 5321, a second lens 5322, a second lens 5323, and a second lens 5324, with the second lenses 5321, 5322, 5323, and 5324 arranged in a row. The optical axes of the second lens 5321, 5322, 5323, and 5324 are collinear with the central axes of the four light output ports of the second wavelength division multiplexing assembly 520. A space is provided between the second lens 5321 and the second lens 5322, a space is provided between the second lens 5322 and the second lens 5323, and a space is provided between the second lens 5323 and the second lens 5324. In the disclosed embodiment, the number of second lenses in the second lens group 532 is not limited to four.

[0145] In some embodiments, the optical axis of the second lens 5321 is located above the space between the first lens 5311 and the first lens 5312, the optical axis of the second lens 5322 is located above the space between the first lens 5312 and the first lens 5313, the optical axis of the second lens 5323 is located above the space between the first lens 5313 and the first lens 5314, and the optical axis of the first lens 5312 is located below the space between the second lens 5321 and the second lens 5322.

[0146] Figure 21 is a top view of a light receiving component provided according to some embodiments of the present disclosure, and Figure 22 is a cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure. Figures 21 and 22 show the optical path structure of a light receiving component.

[0147] As shown in Figures 21 and 22, a beam of received optical signals including four wavelengths is input to the first wavelength division multiplexing component 510. According to the wavelength of the beam of received optical signals, the first wavelength division multiplexing component 510 splits and outputs four beams of received optical signals, and transmits them to the first lens group 531. The first lens in the first lens group 531 converges the corresponding four beams of received optical signals. The converged four beams of received optical signals are correspondingly transmitted to the first prism 541, the second prism 542, the third prism 543 and the fourth prism 544, and are reflected by the reflection surfaces of the first prism 541, the second prism 542, the third prism 543 and the fourth prism 544 and transmitted to the corresponding optical receiving chips in the optical receiving component 550.

[0148] As shown in Figures 21 and 22, a beam of received optical signals including four wavelengths is input to the second wavelength division multiplexing component 520. According to the wavelength of the beam of received optical signals, the second wavelength division multiplexing component 520 splits and outputs four beams of received optical signals, and transmits them to the second lens group 532. The second lens in the second lens group 532 converges the corresponding four beams of received optical signals. The converged four beams of received optical signals are correspondingly transmitted to the fifth prism 545, and are reflected by the second reflection surface 5451 of the fifth prism 545 and transmitted to the corresponding optical receiving chip in the optical receiving component 550.

[0149] In some embodiments, the optical path of the optical signal output by the first lens 5314 to the corresponding optical receiving chip is equal to or approximately equal to the focal length of the first lens 5314, and the optical path of the optical signal output by the second lens 5323 to the corresponding optical receiving chip is equal to or approximately equal to the focal length of the second lens 5323.

[0150] In some examples, the light processing component may include a light emitting component 400 .

[0151] In some examples of the embodiments of the present disclosure, it is described as a specific example that the light processing component may include a light emitting component 400 and a light receiving component 500 .

[0152] Figure 23 illustrates the internal structure of an optical module according to some embodiments of the present disclosure; Figure 24 illustrates an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure. As shown in Figures 23 and 24, the optical module may include a carrier 900. The surface of carrier 900 is used to support the light emitting component 400 and the light receiving component 500.

[0153] A notch 302 may be formed on the surface of the circuit board 300 . The carrier 900 is embedded in the notch 302 , thereby fixing the carrier 900 on the circuit board 300 .

[0154] In some embodiments, the light emitting component 400 may include a laser 401. The laser 401 may convert a received electrical signal into an optical signal.

[0155] The light emitting component 400 may include a TEC 402. The laser 401 is disposed on the surface of the TEC 402. The TEC 402 is used to adjust the operating temperature of the laser 401 so that the operating temperature is stable within a certain range.

[0156] The optical emitting component 400 may include an optical multiplexing assembly (in some examples, may be referred to as a first beam processing assembly) 403. The optical multiplexing assembly 403 may be disposed on a surface of the carrier 900. The optical multiplexing assembly 403 is disposed on the optical path of the light output from the laser 401. The optical multiplexing assembly 403 may combine the laser signals emitted by the various lasers 401 into a single optical signal.

[0157] The light emitting component 400 may include a first collimating lens 404. The first collimating lens 404 is disposed between the laser 401 and the optical multiplexing component 403.

[0158] The light emitting component 400 may include a first converging lens 405. The first converging lens 405 is provided on the light outgoing optical path (in some examples, may be referred to as the first optical path) of the optical multiplexing component 403.

[0159] The light emitting component 400 may include a first fiber collimator (in some examples, may be referred to as a fiber connector) 406 .

[0160] In the present disclosure, lasers 401 and a first collimating lens 404 are disposed on the surface of a TEC 402. Lasers 401 are arranged in an array. A predetermined number of lasers 401 can be positioned on the surface of a TEC 402. The optical signals emitted by each laser 401 are collimated by the first collimating lens 404 and then enter the optical multiplexing assembly 403 as parallel light. The optical multiplexing assembly 403 combines the optical signals emitted by each laser 401 into a single optical signal. The combined optical signal is then transmitted to the exterior of the optical module via a first converging lens 405 and a first fiber collimator 406.

[0161] In order to improve the high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300 to ensure that the bonding wire is short, thereby improving the high-frequency signal transmission performance.

[0162] In the present disclosure, when the surface of the laser 401 is flush with the surface of the circuit board 300, the height of the pigtail connected to the first fiber collimator 406 is aligned with the height of the circuit board 300. To prevent the pigtail connected to the first fiber collimator 406 from interfering with the surface of the circuit board 300 and being broken, a recessed portion 303 is formed on the surface of the circuit board 300 to allow the pigtail connected to the first fiber collimator 406 to pass through and avoid interference with the circuit board 300 and being broken.

[0163] In some embodiments, the light receiving component 500 may include a second fiber collimator 501 .

[0164] The light receiving part 500 may include a second collimating lens 502 .

[0165] The optical receiving component 500 may include an optical demultiplexing component (in some examples, may be referred to as a second beam processing component) 503. The external optical signal is transmitted to the optical demultiplexing component 503 via the second optical fiber collimator 501 and the second collimating lens 502. The optical demultiplexing component 503 decomposes the external optical signal into multiple optical signals.

[0166] The optical receiving component 500 may include a second converging lens 504. The second converging lens 504 is arranged in an array to receive the multiple optical signals output by the optical demultiplexing component 503. The light inlet of the second converging lens 504 faces the optical demultiplexing component 503.

[0167] The light receiving component 500 may include a refracting portion (in some examples, this may be referred to as a turning prism) 505. The light receiving direction of the light receiving chip is perpendicular to the surface of the circuit board 300, while the light transmission direction of the second fiber collimator 501 is parallel to the circuit board 300. To this end, the refracting portion 505 is provided on the transmission optical path between the second fiber collimator 501 and the light receiving chip. The refracting portion 505 has an optical path turning function, which can bend the optical path of the external optical signal transmitted by the second fiber collimator 501 downward, that is, turn the external optical signal toward the light receiving chip, so that the external optical signal is transmitted into the light receiving chip.

[0168] The light incident surface of the refracting portion 505 faces the optical demultiplexing component 503 , and the light emitting surface faces the light receiving chip.

[0169] Exemplarily, the refraction portion 505 has a reflective surface.

[0170] Exemplarily, the refractive portion 505 may be a turning prism.

[0171] The light receiving component 500 may include a light receiving chip 506. The light receiving chip 506 may convert a received optical signal into an electrical signal. The light receiving chips 506 may be arranged in an array.

[0172] The optical receiving component 500 may include a transimpedance amplifier 507. The transimpedance amplifier 507 may be electrically connected to the optical receiving chip 506. The transimpedance amplifier 507 is configured to amplify the electrical signal converted and generated by the optical receiving chip 506.

[0173] The light receiving component 500 may include a support portion 508. The support portion 508 is used to support the refracting portion 505. Because the light path of the light receiving component needs to be turned, a certain height difference is required in the light path of the light receiving component. The support portion 508 supports the refracting portion to a certain height, thereby generating a certain height difference in the light path and achieving the turning of the light path.

[0174] Exemplarily, the support portion 508 supports the deflecting portion upward to a certain height from the surface of the circuit board 300 .

[0175] The second converging lens 504 and the refraction portion 505 are disposed on the surface of the support portion 508 so that the optical paths of the second converging lens 504 and the refraction portion 505 are coaxial with the optical path of the optical demultiplexing assembly 503 .

[0176] In some embodiments, the optical receiving chip 506 and the transimpedance amplifier 507 may be connected by wire bonding to achieve electrical connection between the two.

[0177] Exemplarily, the surface of the light receiving chip 506 has a first connection pad and a photosensitive surface. Usually, the first connection pad and the photosensitive surface of the light receiving chip 506 are located on the same surface.

[0178] A second connection pad is provided on the surface of the transimpedance amplifier 507. A wire bond is formed between the first and second connection pads to electrically connect the optical receiver chip 506 to the transimpedance amplifier 507. At this point, the photosensitive surface of the optical receiver chip 506 and the first connection pad are both facing upward, with the photosensitive surface exposed to the air. To reduce light signal reflection into the air and allow more light signal to be absorbed into the photosensitive surface, the photosensitive surface is coated with an anti-reflection film. The refractive index of the anti-reflection film is greater than that of air, allowing more light signal to be transmitted into the photosensitive surface, thereby ensuring the received light power.

[0179] In some embodiments, the transimpedance amplifier 507 is disposed on the surface of the circuit board 300, and the first connection pad on the surface of the light receiving chip 506 is soldered to the second connection pad on the surface of the transimpedance amplifier 507, thereby electrically connecting the light receiving chip 506 and the transimpedance amplifier 507. That is, the light receiving chip 506 is attached upside down to the surface of the transimpedance amplifier 507, with the photosensitive surface of the light receiving chip 506 facing downward. To allow the light signal to be transmitted to the photosensitive surface, a lens is provided on the surface of the light receiving chip 506 exposed to air. An optical through hole can be formed between the lens and the photosensitive surface, through which the light signal is transmitted to the photosensitive surface, thereby achieving reception of the light signal.

[0180] By flip-chip bonding the optical receiver chip 506 to the transimpedance amplifier 507, parasitic effects caused by wire bonding can be avoided, improving signal transmission performance. Furthermore, since the photosensitive surface of the optical receiver chip 506 is not exposed to air, the optical signal is less likely to be reflected into the air, ensuring the received optical power.

[0181] As the transmission rate of optical modules continues to increase, the space reserved for optical engines becomes smaller. Therefore, in the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 can be stacked together to reduce the space occupied by the optical engine.

[0182] In some embodiments, because the space between the upper housing 201 and the circuit board 300 is larger than the space between the lower housing 202 and the circuit board 300, and a heat dissipation duct can be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100, the upper housing 201 has a better heat dissipation effect than the lower housing 202. Since the heat generated by the light emitting component is relatively large, it is necessary to conduct the heat generated to ensure the normal operation of the light emitting component. In view of this, the carrier 900 can be set in the space between the upper housing 201 and the circuit board 300. That is, the position relationship of the carrier 900 shown in Figure 24 is flipped 180° for setting. At this time, the heat generated by the laser 401 is transmitted to the outside through the TEC 402 and the upper housing 201 in sequence, and the heat dissipation path is better, thereby achieving better heat dissipation.

[0183] The surface of the circuit board 300 that is opposite to the upper housing 201 is referred to as the top surface of the circuit board 300. The surface of the carrier 900 used to support the light emitting component 400 and the light receiving component 500 is referred to as the top surface of the carrier 900. For better heat dissipation, the bottom surface of the carrier 900 can be arranged toward the upper housing 201, that is, the bottom surface of the carrier 900 and the top surface of the circuit board 300 can both be arranged toward the upper housing 201 to provide a better heat dissipation path. Since the DSP 304 also generates a large amount of heat, the DSP 304 can be arranged on the top surface of the circuit board 300 so that the heat generated by the DSP 304 can be dissipated to the outside of the optical module through the upper housing 201.

[0184] FIG25 is a first optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in FIG25 , the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked.

[0185] The surface of the laser 401 is flush with the surface of the circuit board 300 , so the light path of the laser 401 is close to being along the surface of the circuit board 300 , and the light path of the laser 401 is relatively low.

[0186] Since the optical path of the optical receiving component needs to be turned, the optical receiving chip 506 is arranged on the surface of the circuit board 300 or on the surface of the transimpedance amplifier 507. Therefore, the optical path at the end of the optical receiving component needs to have a certain height difference from the surface of the circuit board in order to turn the optical path and turn the optical signal to the surface of the optical receiving chip 506.

[0187] The optical path design requirements of the optical transmitter and receiver provide feasibility for stacking the optical demultiplexer assembly 503 and the optical multiplexer assembly 403. The height difference of the optical receiver end can be achieved by supporting the deflecting portion 505 to a certain height from the surface of the circuit board 300 by the support portion 508.

[0188] In the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked to set the optical path of the light emitting end and the optical path of the light receiving end on the same surface of the circuit board 300 .

[0189] The surface of the circuit board 300 along which the light output path of the laser 401 is located and the surface of the circuit board 300 at which the refractive portion 505 is supported to a certain height by the support portion 508 can be the same surface of the circuit board 300 .

[0190] The light path of the laser 401 is close to the surface of the circuit board 300 , and the light path between the optical demultiplexing component 503 and the refracting portion 505 is at a preset distance from the surface of the circuit board 300 .

[0191] Exemplarily, the optical path formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refractive portion 505 is at a certain distance from the surface of the circuit board 300, so that the light output path of the laser 401 and the optical path formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refractive portion 505 are in a relative upper and lower position relationship, and the optical paths present a certain height difference in the relative upper and lower positions, thereby avoiding optical path interference and crosstalk between the light emitting end and the light receiving end.

[0192] Figure 26 is a second optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 26 , the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked.

[0193] The optical multiplexing assembly 403 is disposed on a surface of the carrier 900 , and the optical demultiplexing assembly 503 is disposed on a surface of the optical multiplexing assembly 403 .

[0194] The light inlet of the optical demultiplexing assembly 503 and the light outlet of the optical multiplexing assembly 403 may be located on two sides of the same end of the carrier 900 to avoid optical path interference.

[0195] The light emitting surface of the optical demultiplexing component 503 faces the light incident surface of the refraction portion 505 , and the light incident surface of the optical multiplexing component 403 faces the light emitting surface of the laser 401 .

[0196] The light emitting surface of the optical demultiplexing component 503 may be oriented in the same direction as the light incident surface of the optical multiplexing component 403 . For example, both face the laser 401 .

[0197] In the present disclosure, the light input port of optical multiplexing assembly 403 faces the light output port of laser 401. The light output port of optical demultiplexing assembly 503 faces the light input port of refraction unit 505. The light input surface of optical multiplexing assembly 403 and the light output surface of optical demultiplexing assembly 503 are oriented in the same direction, both toward laser 401. In other words, laser 401 and refraction unit 505 are located on the same side of optical multiplexing assembly 403 or optical demultiplexing assembly 503.

[0198] In the present disclosure, in order to avoid optical path crosstalk between the optical receiving end and the optical transmitting end, a difference is set between the height of the light inlet of the refractive portion 505 and the height of the light outlet of the laser 401, so that the second optical path between the optical demultiplexing component 503 and the refractive portion 505 and the first optical path between the optical multiplexing component 403 and the laser 401 are separated by a certain distance in terms of relative vertical position relationship. This makes the optical path of the optical transmitting end and the optical path of the optical receiving end present a certain height difference in terms of relative vertical position relationship, thereby avoiding interference and crosstalk between the optical receiving optical path and the optical transmitting optical path.

[0199] By aligning the surface of the laser 401 with the surface of the circuit board 300, the optical path of the light emitting end is close to the surface of the circuit board 300. The support portion 508 supports the refracting portion 505 at a certain distance from the circuit board 300, providing a height difference for the optical path to turn, so that the optical path of the light receiving end is at a certain distance from the surface of the circuit board 300. This ensures that the optical paths of the light emitting end and the light receiving end are in a relative vertical positional relationship. By adjusting the height of the light inlet of the refracting portion 505 and the height of the light outlet of the laser 401, the optical paths of the light emitting end and the light receiving end do not interfere with each other in their relative vertical positional relationship.

[0200] In terms of the positional relationship shown in FIG26 , the optical demultiplexing assembly 503 is positioned above the optical multiplexing assembly 403. The optical path formed by the second fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refraction unit 505 is located above the optical path formed between the laser 401 and the optical multiplexing assembly 403.

[0201] The optical paths of the light emitting end and the light receiving end are in a relative upper and lower position relationship: the light output path of the laser 401 is relatively closer to the surface of the circuit board 300; the refraction portion 505 is at a certain distance from the surface of the circuit board 300 to facilitate the turning of the second optical path. At this time, the refraction portion 505 is above the surface of the circuit board 300.

[0202] The refracting portion 505 can be supported to a certain height by the supporting portion 508 to bend the second optical path of the optical signal. For example, the optical path of the optical signal is bent downward.

[0203] In the positional relationship shown in Figure 26, if the optical multiplexing assembly 403 is positioned above the optical demultiplexing assembly 503, then if the optical path height at the optical receiving end is maintained constant, the position of the laser 401 is passively raised. In this case, the surface of the laser 401 is not flush with the surface of the circuit board 300, resulting in a longer wire length between the laser 401 and the circuit board 300, which reduces high-frequency signal transmission performance. In the positional relationship shown in Figure 8, if the optical multiplexing assembly 403 is positioned above the optical demultiplexing assembly 503, then if the optical path height at the optical transmitting end is maintained constant, the optical demultiplexing assembly 503 is positioned lower. In this case, due to the certain thickness of the TEC 402, the TEC 402 will inevitably block the optical path at the optical receiving end, which is not conducive to signal transmission at the optical receiving end.

[0204] In the present disclosure, the transimpedance amplifier 507 is electrically connected to the DSP 304 through metal vias to transmit the electrical signal amplified by the transimpedance amplifier 507 to the DSP 304. Wire bonding is performed between the surface of the laser 401 and the surface of the circuit board 300, and then an electrical connection is achieved with the DSP 304 through metal vias on the surface of the circuit board 300 to transmit the electrical signal to the laser 401.

[0205] In the present disclosure, optical demultiplexing assembly 503 is stacked with optical multiplexing assembly 403. The light outlet of optical demultiplexing assembly 503 faces the deflecting portion 505, and the light inlet of optical multiplexing assembly 403 faces the laser 401. By adjusting the height difference between the light inlet of deflecting portion 505 and the light outlet of laser 401 to a predetermined value, the second optical path between optical demultiplexing assembly 503 and deflecting portion 505 and the first optical path between optical multiplexing assembly 403 and laser 401 are separated by a certain distance in terms of relative vertical position, thereby preventing interference and crosstalk between the light receiving path and the light transmitting path.

[0206] For example, the light inlet height of the refracting portion 505 can be adjusted by adjusting the thickness of the supporting portion 508 , thereby adjusting the light inlet height of the refracting portion 505 and the light outlet height of the laser 401 to a preset difference.

[0207] Figure 27 is a third optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 27, optical demultiplexing assembly 503 is stacked with optical multiplexing assembly 403. Optical multiplexing assembly 403 is disposed on the surface of carrier 900, and optical demultiplexing assembly 503 is disposed on the surface of optical multiplexing assembly 403.

[0208] The external optical signal is transmitted sequentially along the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refracting portion 505. The external optical signal is split into multiple optical beams by the optical demultiplexing assembly 503. The refracting portion 505 redirects each optical beam to the surface of the optical receiving chip 506.

[0209] The support portion 508 supports the refracting portion 505 to a certain height to facilitate the turning of the optical signal path. When the support portion 508 supports the refracting portion 505 to a certain height, the optical path of the light receiving end is also supported to a certain height to avoid crosstalk and interference with the optical path of the light transmitting end.

[0210] Exemplarily, the second fiber collimator 501 and the second collimating lens 502 are disposed on the surface of the carrier 900. The surface height of the carrier 900 ensures that the optical path heights of the second fiber collimator 501 and the second collimating lens 502 are coaxial with the optical path heights of the optical demultiplexing assembly 503, thereby achieving optical path matching. The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403. One surface of the support portion 508 is connected to the circuit board 300, and the other surface is connected to the refractive portion 505.

[0211] Figure 28 is a fourth schematic diagram of the optical path of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 28 , the optical signal emitted by laser 401 is collimated into parallel light by first collimating lens 404 and then enters optical multiplexing assembly 403 as parallel light. Optical multiplexing assembly 403 combines the individual optical signals into a single beam. The combined optical signal is then transmitted to the exterior of the optical module via first converging lens 405 and first fiber collimator 406.

[0212] The optical multiplexing assembly 403 is disposed on the surface of the carrier 900, and the surface of the laser 401 is flush with the surface of the circuit board 300, so that the optical path from the laser 401 to the optical multiplexing assembly 403 is close to the surface of the circuit board 300. The optical path from the laser 401 to the optical multiplexing assembly 403 is lower than the optical path between the second fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refraction unit 505. The term "lower" refers to the positional relationship shown in Figure 10.

[0213] In the present disclosure, the light input port of the optical demultiplexing assembly 503 and the light output port of the optical multiplexing assembly 403 are located on opposite sides of the same end of the carrier 900. The first fiber collimator 406 and the second fiber collimator 501 are then located on opposite sides of the same end of the carrier 900, thereby further preventing optical crosstalk between the light emitting end and the light receiving end.

[0214] Exemplarily, the transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical emission signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides of the same surface, thereby avoiding interference or crosstalk between the optical paths.

[0215] The lens disposed between the second fiber collimator 501 and the optical demultiplexing assembly 503 is a second collimating lens 502. Therefore, each optical signal beam outputted by the optical demultiplexing assembly 503 is collimated light. Each optical signal beam outputted by the optical demultiplexing assembly 503 is transmitted as parallel light to the deflecting portion 505. In this case, the divergence angle is small, making it less likely for the optical signal to crosstalk with the optical transmitter, thus preventing optical signal crosstalk.

[0216] The lens positioned between laser 401 and optical multiplexing assembly 403 is a first collimating lens 404. Therefore, each optical signal entering optical multiplexing assembly 403 is collimated light. The optical signal output from laser 401 is transmitted to optical multiplexing assembly 403 as parallel light. This reduces the divergence angle, making it less likely that the optical signal will crosstalk with the optical receiving end, thus preventing optical signal crosstalk.

[0217] Figure 29 is a schematic cross-sectional view of the interior of an optical module according to some embodiments of the present disclosure; Figure 30 is a schematic side view of an optical module according to some embodiments of the present disclosure. As shown in Figures 29 and 30, the optical demultiplexing assembly 503 and the optical multiplexing assembly 403 are stacked on top of each other. By adjusting the optical path to avoid optical signal crosstalk, a compact configuration of optical components is achieved, reducing the space occupied by the optical engine.

[0218] In the present disclosure, with respect to the upper and lower positional relationship shown in FIG30 , optical path crosstalk is avoided by setting the light output path of the laser 401 downward and then setting the light path of the light receiving end relatively upward.

[0219] If the surface of laser 401 is flush with the surface of circuit board 300, the optical path of laser 401 is close to the surface of circuit board 300, and the optical path of laser 401 is relatively low. However, since the optical path of the optical receiving component needs to be turned, and the optical receiving chip 506 is located on the surface of circuit board 300 or on the surface of transimpedance amplifier 507, the optical path at the optical receiving component end needs to have a certain height difference from the circuit board surface to turn the optical path and redirect the optical signal to the surface of optical receiving chip 506. This provides feasibility for stacking optical demultiplexing assembly 503 and optical multiplexing assembly 403.

[0220] In the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked up and down, and the optical paths of the optical transmitting end and the optical receiving end can be adjusted by adjusting the thickness of the optical demultiplexing component 503 and the optical multiplexing component 403 to achieve the purpose of non-interference of the optical paths.

[0221] Figure 31 is a top view of the interior of an optical module according to some embodiments of the present disclosure. As shown in Figure 31 , to avoid optical crosstalk and optical device interference, the light outlet of the optical multiplexing component 403 and the light inlet of the optical demultiplexing component 503 are located on both sides of the carrier 900 in the width direction.

[0222] Based on the principle of optical paths, the optical output port of optical multiplexing assembly 403 outputs a beam of optical signals, and the optical input port of optical demultiplexing assembly 503 inputs a beam of optical signals. When the optical output port of optical multiplexing assembly 403 and the optical input port of optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction, crosstalk between the optical signals output by the optical output port of optical multiplexing assembly 403 and the optical signals input by the optical input port of optical demultiplexing assembly 503 can be avoided.

[0223] The first optical fiber collimator 406 and the first converging lens 405 face the light outlet of the optical multiplexing component 403 .

[0224] The second fiber collimator 501 and the second collimating lens 502 face the light entrance of the optical demultiplexing component 503 .

[0225] The light output port of the optical multiplexing assembly 403 and the light input port of the optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction. Therefore, the first fiber collimator 406 and the second fiber collimator 501 are located on opposite sides of the same end of the carrier 900 in the width direction to prevent interference between the first fiber collimator 406 and the second fiber collimator 501. For example, the first fiber collimator 406 and the second fiber collimator 501 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0226] Accordingly, the first converging lens 405 and the second collimating lens 502 are located on opposite sides of the same end of the carrier 900 in the width direction, thereby preventing interference between the first converging lens 405 and the second collimating lens 502. For example, the first converging lens 405 and the second collimating lens 502 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0227] The transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical transmit signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides, thereby avoiding optical path crosstalk.

[0228] In some embodiments, the first fiber collimator 406 and the second fiber collimator 501 can also be located on different sides of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503. For example, if the position of the light emitting component remains unchanged and the first fiber collimator 406 is moved to the other side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503, the position of the laser 401 should also be changed accordingly. When an external fiber ribbon is positioned on one side of the second fiber collimator 501, an optical connection can be achieved between the first fiber collimator 406 and the external fiber ribbon through fiber winding.

[0229] In the present disclosure, the light output port of the optical multiplexing assembly 403 is positioned near the first converging lens 405, and the light output end face of the optical multiplexing assembly 403 is tilted toward the first converging lens 405. The light input port of the optical demultiplexing assembly 503 is positioned toward the second collimating lens 502, and the light input end face of the optical demultiplexing assembly 503 is tilted toward the second collimating lens 502. Because the first converging lens 405 and the second collimating lens 502 are located on different sides of the carrier 900 in the width direction, there is a certain misalignment between the tilt direction of the light output end face of the optical multiplexing assembly 403 and the tilt direction of the light input end face of the optical demultiplexing assembly 503.

[0230] In the present disclosure, since the optical demultiplexing component 503 needs to be disposed on the surface of the optical multiplexing component 403 , the size of the optical multiplexing component 403 may be larger than that of the optical demultiplexing component 503 to better fix the optical demultiplexing component 503 .

[0231] Figure 32 is a schematic diagram illustrating the relative positional relationship between a first fiber collimator and a second fiber collimator of an optical module according to some embodiments of the present disclosure. As shown in Figure 32 , with respect to the positional relationship presented in Figure 32 , the optical axis of the second fiber collimator 501 is positioned higher than the optical axis of the first fiber collimator 406, thereby positioning the optical path of the light receiving end higher than the optical path of the light transmitting end to avoid mutual interference.

[0232] The heights of the optical axes of the second fiber collimator 501 and the first fiber collimator 406 can be adjusted by adjusting the surface height of the supporting component 900 .

[0233] In some embodiments, to prevent the optical transmission signal from returning to the laser 401 along its original path, an isolator is integrated into the first fiber collimator 406. The isolator prevents the optical transmission signal from returning to the laser 401 along its original path, thereby ensuring the quality of the optical signal emitted by the laser 401. Because the first fiber collimator 406 is integrated with the isolator, its size is larger than that of the second fiber collimator 501.

[0234] Figure 33 is a structural diagram of a carrier according to an embodiment of the present disclosure. As shown in Figure 33, the surface of the carrier 900 is formed with supporting areas of varying surface heights for accommodating various optical devices. The varying surface heights of the supporting areas enable optical path matching.

[0235] A first carrying area 902 may be formed on a surface of the carrying member 900 .

[0236] The first carrying area 902 is used to carry the second optical fiber collimator 501 and the second collimating lens 502 respectively.

[0237] The surface of the first supporting area 902 is relatively high to ensure that the second fiber collimator 501 and second collimating lens 502 disposed thereon are at a relatively high height. For example, the first supporting area 902 may be in the form of a boss. To avoid interference with the optical path of the light transmitting end, the second fiber collimator 501 and second collimating lens 502 are disposed at a relatively high height. This also provides a height difference in the optical path of the light receiving end, facilitating optical path deflection during optical signal transmission.

[0238] A first stopper 903 is formed on one side of the first supporting area 902 to limit and secure the second fiber collimator 501. The first stopper 903 can be in the form of a barrier. The top surface of the first stopper 903 is higher than the top surface of the first supporting area 902. For example, the sidewalls of the second fiber collimator 501 rest against the sidewalls of the first stopper 903 to limit and secure the second fiber collimator 501.

[0239] The length of the first stopper 903 does not extend toward the second collimating lens 502. In other words, a notch 904 is formed on one side of the first stopper 903. Since the coupling of the second collimating lens 502 is active, such as by an active coupling device sucking the second collimating lens 502 for coupling, the notch 904 provides space for active coupling and facilitates observation of the coupling status of the second collimating lens 502.

[0240] The surface of the carrier 900 may form a second carrier area 905 .

[0241] The second supporting area 905 is used to support the TEC 402, the laser 401, and the first collimating lens 404. The laser 401 and the first collimating lens 404 are respectively provided on the surface of the TEC 402. The assembly consisting of the TEC 402, the laser 401, and the first collimating lens 404 is referred to as the light-emitting assembly. The second supporting area 905 is used to support the light-emitting assembly.

[0242] To improve high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300 to ensure shorter bonding wires, thereby improving high-frequency signal transmission performance. Because the TEC 402 has a certain height, the second supporting area 905 can be designed as a recessed area to ensure that the surface of the laser 401 is flush with the surface of the circuit board 300. The surface of the second supporting area 905 is relatively recessed.

[0243] A third carrying area 906 may be formed on the surface of the carrier 900 .

[0244] The third carrying area 906 is provided between the first carrying area 902 and the second carrying area 905 and is used to carry the optical multiplexing component 403 .

[0245] To secure the optical multiplexing assembly 403 to the surface of the third supporting area 906, the surface of the third supporting area 906 is formed with a first section 9061, a second section 9062, and a third section 9063. The first section 9061 is the glue dispensing area for securing the optical multiplexing assembly 403. The second section 9062 is a glue overflow groove to collect overflowing glue. The surface of the third section 9063 is used to support the optical multiplexing assembly 403.

[0246] Since the optical path height at the optical emission end is relatively low, the surface height of the third supporting area 906 is lower than the surface height of the first supporting area 902. The height difference between the third supporting area 906 and the first supporting area 902 forms a step, so that the optical multiplexing assembly 403 rests on the wall surface of the third supporting area 906.

[0247] A fourth carrying area 907 may be formed on the surface of the carrying member 900 .

[0248] The fourth carrying area 907 is used to carry the first converging lens 405. The fourth carrying area 907 is disposed on one side of the first carrying area 902 so that the first converging lens 405 and the second collimating lens 502 are located on both sides.

[0249] A fifth carrying area 908 may be formed on the surface of the carrier 900 .

[0250] The fifth carrying area 908 is used to carry the first optical fiber collimator 406. The fifth carrying area 908 is disposed on one side of the first carrying area 902 so that the first optical fiber collimator 406 and the second optical fiber collimator 501 are located on both sides.

[0251] The height of the first carrying area 902 is higher than that of the fourth carrying area 907 and the fifth carrying area 908 to avoid interference between the optical path of the light receiving end and the optical path of the light emitting end.

[0252] In the present disclosure, in order to coordinate the light receiving optical path and the light emitting optical path, in the carrier 900, the height of the third carrier area 906 and the thickness of the supporting part are such that there is a preset difference between the height of the light inlet of the refractive part 505 and the height of the light outlet of the laser 401, so that the optical path between the optical demultiplexing component 503 and the refractive part 505 and the optical path between the optical multiplexing component 403 and the laser 401 are in relative upper and lower positions.

[0253] The height of the first carrying area 902 enables the optical path of the second optical fiber collimator 501 to match that of the refraction portion 505 .

[0254] The height of the second carrying area 905 enables the optical paths of the optical multiplexing component 403 and the laser 401 to match, and enables the optical demultiplexing component on the surface of the optical multiplexing component 403 to match the optical path of the refraction portion 505 to match.

[0255] The height of the fourth carrying area 907 enables the optical paths of the first converging lens 405 and the optical multiplexing component 403 to match each other.

[0256] The height of the fifth carrying area 908 enables the optical path of the first optical fiber collimator 406 to match that of the optical multiplexing component 403 .

[0257] In the present disclosure, the optical path design is achieved by rationally designing the structure of the carrier 900 .

[0258] FIG34 is a second structural diagram of a carrier according to some embodiments of the present disclosure. As shown in FIG34 , the surface height of the fourth carrier area 907 is higher than the surface height of the fifth carrier area 908 to match the optical path height of the first converging lens 405 and the first fiber collimator 406.

[0259] A second stopper 909 is formed on one side of the third support area 906 to securely position the optical multiplexing assembly 403. The second stopper 909 can be in the form of a barrier. The top surface of the second stopper 909 is higher than the top surface of the third support area 906. For example, the optical multiplexing assembly 403 rests on the sidewall of the second stopper 909 to securely position the optical multiplexing assembly 403.

[0260] Likewise, the second limiting portion 909 does not extend toward the fourth supporting area 907 , so as to provide a coupling space for the active coupling of the first converging lens 405 and facilitate observation of the coupling state of the first converging lens 405 .

[0261] FIG35 is a third structural diagram of a carrier according to some embodiments of the present disclosure. As shown in FIG35 , an escape portion 910 is formed between the second carrier area 905 and the second limiting portion 909 .

[0262] The surface of the second supporting area 905 is provided with a TEC 402. The avoidance portion 910 is provided to avoid the positive and negative bonding wires of the TEC 402.

[0263] Figure 36 is a schematic diagram (I) of a connection between a circuit board and a carrier according to some embodiments of the present disclosure; Figure 37 is a schematic diagram (II) of a connection between a circuit board and a carrier according to some embodiments of the present disclosure. As shown in Figures 36-37, the edge of the carrier 900 supports the circuit board 300, thereby achieving a fixed connection between the carrier 900 and the circuit board 300.

[0264] Edge portions 901 are formed on four edges of the carrier 900 . The edge portions 901 are used to support the circuit board 300 .

[0265] In the width direction of the carrier 900 , there is still a certain space between the second carrying area 905 and the outermost edge of the carrier 900 to form an edge portion 901 to support the circuit board 300 .

[0266] In the width direction of the carrier 900 , there is still a certain space between the first supporting area 902 and the other outermost edge of the carrier 900 to form an edge portion 901 on the other side to support the circuit board 300 .

[0267] The carrier 900 also has a certain amount of blank space in the length direction to form edge portions 901 on both sides to support the circuit board 300 .

[0268] Figure 38 shows an assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure; Figure 39 shows an exploded view of the assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure. As shown in Figures 38 and 39, the carrier 900 is used to support the light emitting component 400 and the light receiving component 500.

[0269] The surface of the carrier 900 is formed with supporting areas with different surface heights to accommodate various optical devices. The surface heights of the supporting areas are different to achieve optical path matching between the various optical devices.

[0270] In the light emitting component 400, the light emitting components are disposed on the surface of the carrier 900. For example, the light emitting components are disposed on the surface of the second carrier area 905. The light emitting components include a TEC 402, a laser 401, and a first collimating lens 404.

[0271] The optical multiplexing component 403 is disposed on the surface of the third supporting area 906 .

[0272] The first converging lens 405 is disposed on the surface of the fourth supporting area 907 .

[0273] The first optical fiber collimator 406 is disposed on the surface of the fifth supporting area 908 .

[0274] In the optical receiving component 500 , the second optical fiber collimator 501 and the second collimating lens 502 are both disposed on the surface of the first carrying area 902 . The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403 .

[0275] The support portion 508 is disposed on the surface of the circuit board 300 . The second converging lens 504 and the refractive portion 505 are disposed on the surface of the support portion 508 .

[0276] In the present disclosure, the optical demultiplexing component and the optical multiplexing component are stacked, and there is a difference between the height of the light inlet of the refractive part and the height of the light outlet of the laser, so as to separate the optical path between the optical demultiplexing component and the refractive part and the optical path between the optical multiplexing component and the laser by a certain distance in terms of the relative upper and lower positions, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path. In the present disclosure, the space occupied by the light engine is reduced by stacking the optical demultiplexing component and the optical multiplexing component. The surface of the laser can be flush with the surface of the circuit board, and the height of the optical path at the end of the light emitting component is lower. The optical path at the end of the light receiving component just needs to have a certain height difference from the surface of the circuit board to turn the optical path. Therefore, it is feasible to stack the optical demultiplexing component and the optical multiplexing component. Among them, the height difference at the end of the light receiving component can be achieved by supporting the refractive part to a certain height by the support part. By rationally designing the setting height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path are set in a relative upper and lower position relationship, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components.

[0277] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: circuit boards; The surface is formed with notches; A carrier is embedded in the notch; the carrier includes a first carrier area, a third carrier area, and a second carrier area between the first carrier area and the third carrier area; An optical processing component for processing optical signals including multiple wavelengths; The light processing component includes: A first light beam processing component is disposed in the second carrying area; the second carrying area is located at a height such that the first light beam processing component matches the first light path; a second light beam processing assembly disposed above the first light beam processing assembly; the second carrying area being located at a height such that the second light beam processing assembly matches the second light path; a lens assembly, provided on the light-emitting side of the first light beam processing assembly and the second light beam processing assembly; A turning prism is arranged on the light-emitting side of the lens assembly. A reflecting surface is provided on the reflecting side of the turning prism. The reflecting surface is located on the output light path of at least one of the first light beam processing component and the second light beam processing component. The reflecting surface is configured to reflect the light signal output by the first light beam processing component and / or the second light beam processing component.

2. The optical module according to claim 1, wherein: The light processing component includes: An optical receiving component for receiving optical signals including multiple wavelengths; The optical module further includes: An optical fiber adapter group, comprising a plurality of optical fiber adapters, wherein the optical fiber adapters are arranged at the optical ports of the optical module; An optical fiber connector group, comprising a plurality of optical fiber connectors, wherein the optical fiber connectors are optically coupled to the light receiving component; An optical fiber assembly, comprising a plurality of optical fibers, one end of each optical fiber being connected to an optical fiber adapter, and the other end of each optical fiber being connected to an optical fiber connector; a first wavelength division multiplexing component, wherein the light input port of the first wavelength division multiplexing component is optically coupled to the optical fiber connector; the first wavelength division multiplexing component is configured as the first light beam processing component; a second wavelength division multiplexing component, wherein the light input port of the second wavelength division multiplexing component is optically coupled to the optical fiber connector, and the second wavelength division multiplexing component is disposed above the first wavelength division multiplexing component; and the second wavelength division multiplexing component is configured as the second light beam processing component; The turning prism comprises a double-layer turning prism, wherein the reflecting surface comprises a first reflecting surface and a second reflecting surface, wherein the first reflecting surface is located on the output optical path of the first wavelength division multiplexing component, and the second reflecting surface is located on the output optical path of the second wavelength division multiplexing component, wherein the first reflecting surface is used to reflect the optical signal output by the first wavelength division multiplexing component, and the second reflecting surface is used to reflect the optical signal output by the second wavelength division multiplexing component; The light receiving component is arranged below the double-layer turning prism, and is used to receive the light signals reflected by the first reflecting surface and the second reflecting surface.

3. The optical module according to claim 2, wherein: The second wavelength decomposition and demultiplexing components are stacked on top of the first wavelength decomposition and demultiplexing components in a staggered manner, so that the light output ports of the second wavelength decomposition and demultiplexing components are staggered with the light output ports of the first wavelength decomposition and demultiplexing components; The lens assembly includes a plurality of lenses, and the plurality of lenses are arranged in a staggered manner.

4. The optical module according to claim 2, wherein: The double-layer turning prism includes a first prism, a second prism, a third prism, a fourth prism and a fifth prism, wherein the first prism, the second prism, the third prism and the fourth prism are located below the fifth prism; The reflecting surface on the reflecting side of the first prism, the reflecting surface on the reflecting side of the second prism, the reflecting surface on the reflecting side of the third prism and the reflecting surface on the reflecting side of the fourth prism form the first reflecting surface; The reflective side of the fifth prism is provided with the second reflective surface.

5. The optical module according to claim 4, wherein: There is a gap between the first prism and the second prism, there is a gap between the second prism and the third prism, and there is a gap between the fourth prism and the fifth prism; the light signal reflected by the second reflecting surface is transmitted to the light receiving component.

6. The optical module according to claim 2, wherein: The lens assembly includes a first lens group and a second lens group; the first lens group includes a plurality of first lenses, which are correspondingly arranged on the light exit side of the first wavelength division multiplexing component; the second lens group includes a plurality of second lenses, which are correspondingly arranged on the light exit side of the second wavelength division multiplexing component.

7. The optical module according to claim 6, wherein: The light exit sides of the first wavelength division multiplexing component and the second wavelength division multiplexing component are aligned; the distance between the first lens group and the first wavelength division multiplexing component is smaller than the distance between the second lens group and the second wavelength division multiplexing component; The optical distance of the optical signal output by the first lens to the corresponding optical receiving chip is equal to the focal length of the first lens; The optical distance of the optical signal output by the second lens to the corresponding optical receiving chip is equal to the focal length of the second lens.

8. The optical module according to claim 6, wherein: The light receiving component further includes a first support platform and a second support platform, wherein the first support platform supports and connects the first lens group, and the second support platform supports and connects the second lens group.

9. The optical module according to claim 1, wherein: The optical processing component includes: a light emitting component including a laser and an optical multiplexing component, wherein the laser and the optical multiplexing component are respectively arranged on the surface of the carrier; the first light beam processing component includes the optical multiplexing component; The optical receiving component includes a supporting portion, a refractive index portion, an optical receiving chip and an optical demultiplexing component, wherein the optical demultiplexing component is configured as the second light beam processing component, and the refractive index portion is configured as the turning prism; wherein the refractive index portion is provided on the surface of the supporting portion, and is used to turn the optical signal output by the optical demultiplexing component toward the surface of the optical receiving chip; there is a preset difference between the height of the light inlet of the refractive index portion and the height of the light outlet of the laser, so that the first optical path between the optical demultiplexing component and the refractive index portion and the second optical path between the optical multiplexing component and the laser are in relative upper and lower positions.

10. The optical module according to claim 9, wherein: The surface of the laser is flush with the surface of the circuit board; There is a preset distance between the optical path between the optical demultiplexing component and the refraction portion and the surface of the circuit board.

11. The optical module according to claim 9, wherein: The light inlet of the optical demultiplexing component and the light outlet of the optical multiplexing component are located on both sides of the same end of the carrier; The light emitting surface of the optical demultiplexing component faces the light incident surface of the refraction portion, and the light incident surface of the optical multiplexing component faces the light emitting surface of the laser; The light emitting surface of the optical demultiplexing component is oriented in the same direction as the light incident surface of the optical multiplexing component.

12. The optical module according to claim 9, wherein: The light emitting component includes a first optical fiber collimator, and the light receiving component includes a second optical fiber collimator; The first optical fiber collimator and the second optical fiber collimator are located at the same end of the supporting component.

13. The optical module according to claim 9, wherein: The light emitting components respectively include the laser, the first collimating lens, the optical multiplexing component, the first converging lens and the first optical fiber collimator; The light receiving components include a second optical fiber collimator, a second collimating lens, the optical demultiplexing component, a second converging lens, the refraction part and the Optical receiver chip; The surfaces of the carriers are respectively formed with: A first carrying area, used for carrying the second optical fiber collimator and the second collimating lens respectively; a second carrying area, for carrying the laser and the first collimating lens respectively; the second carrying area is set as a recessed area so that the surface of the laser is flush with the surface of the circuit board; a third bearing area, provided between the first bearing area and the second bearing area, for bearing the optical multiplexing component; a fourth carrying area, for carrying the first converging lens; the fourth carrying area is provided on one side of the first carrying area, so that the first converging lens and the second collimating lens are located on both sides; a fifth carrying area, for carrying the first optical fiber collimator, wherein the fifth carrying area is provided on one side of the first carrying area so that the first optical fiber collimator and the second optical fiber collimator are located on both sides; The height of the first bearing area is higher than that of the third bearing area, the fourth bearing area, and the fifth bearing area.

14. The optical module according to claim 1, wherein: The light processing component includes: A light emitting component, comprising a laser, an optical multiplexing component and a first optical fiber collimator; the optical multiplexing component is configured as the first light beam processing component; The light receiving component includes a supporting portion, a refracting portion, a light receiving chip, an optical demultiplexing assembly, and a second optical fiber collimator, wherein the refracting portion is configured as the turning prism, and the optical demultiplexing assembly is configured as the second light beam processing assembly; wherein the supporting portion is provided on the surface of the circuit board and is used to support the refracting portion; The third supporting area is used to place the laser; the height of the third supporting area and the thickness of the supporting portion are such that there is a preset difference between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the optical path between the optical demultiplexing component and the refraction portion and the optical path between the optical multiplexing component and the laser are in relatively upper and lower positions; The first carrying area is used to arrange the second optical fiber collimator, and the height of the first carrying area enables the second optical fiber collimator to match the second optical path of the refractive part.

15. The optical module according to claim 14, wherein: The carrier comprises a fourth carrier area and a fifth carrier area provided on the light output path of the optical multiplexing component; The light emitting component includes a first converging lens; The fourth bearing area is used to set the first converging lens, and the height of the fourth bearing area makes the optical path of the first converging lens match that of the optical multiplexing component; The fifth carrying area is used to place the first optical fiber collimator. The height of the fifth carrying area enables the first optical fiber collimator to match the optical path of the optical multiplexing component.

16. The optical module according to claim 14, wherein: The first fiber collimator and the second fiber collimator are located on opposite sides of the same end of the carrier.

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