Liquid-cooling heat dissipation apparatus for power device, and on-board charger

Abstract

The present invention provides a liquid-cooling heat dissipation apparatus for a power device, and an on-board charger. The liquid-cooling heat dissipation apparatus comprises a circuit board, a power device, and a heat dissipation assembly which are sequentially stacked. One side of the power device is connected to the circuit board by means of pins on the power device, and the other side of the power device is installed on a heat dissipation surface of the heat dissipation assembly. In the present invention, the power device is directly installed on the heat dissipation surface of the heat dissipation assembly, so that compared with the prior art, the present invention omits an intermediate heat transfer layer such as an aluminum substrate, reducing thermal contact resistance, thereby improving heat dissipation performance; additionally, the aluminum substrate is not used, so that no additional pressing strip is required to press the aluminum substrate, thereby reducing the complexity of installation, and reducing the installation space required for the power device.

Description

Liquid cooling heat dissipation device of power device and on-board charger TECHNICAL FIELD

[0001] The present application belongs to the improved field of facilitating cooling, and more particularly, to a liquid cooling heat dissipation device of power device and on-board charger. BACKGROUND

[0002] The power device is one of the key components in the on-board charger (OBC), which is used to realize the rectification of alternating current to direct current to charge the battery and the conversion of direct current output by the battery to alternating current for external electrical appliances, etc. The heat dissipation capacity of the power device directly determines the performance and efficiency of the OBC to a certain extent. With the continuous development of electric vehicle technology, the charging power is continuously improved, and higher requirements are put forward for the heat dissipation of the power device.

[0003] In the current common heat dissipation scheme of the power device, the power device is usually installed on an aluminum substrate, the aluminum substrate is installed on a cooling plate, and a pressing strip is used for pressing. The above heat dissipation scheme has two relatively obvious shortcomings: 1. The aluminum substrate usually has a three-layer structure: a circuit layer, an insulating layer, and a metal base layer. Compared with other layers in the heat dissipation path, the thermal conductivity of the insulating layer in the aluminum substrate is very low (usually about 3 W / (m*k)), and in order to achieve insulation, a certain thickness needs to be ensured, which will result in a large thermal resistance of the insulating layer, thereby increasing the total thermal resistance and affecting the performance of the power device. 2. The aluminum substrate scheme needs to additionally increase a pressing strip device to fix the aluminum substrate on the cooling plate, which makes the installation more complex and also makes the required installation space of the entire power device larger. SUMMARY

[0004] The purpose of the present application is to provide a liquid cooling heat dissipation device of power device and on-board charger to solve the problem of affecting the heat dissipation performance of the existing power device due to the use of aluminum substrate.

[0005] To achieve the above purpose, the technical solution adopted by the present application is:

[0006] Firstly, the present application provides a liquid cooling heat dissipation device of power device, which comprises a circuit board, a power device and a heat dissipation assembly which are sequentially stacked, the power device is connected with the circuit board through the pins on the power device on one side, and the power device is installed on the heat dissipation surface of the heat dissipation assembly on the other side.

[0007] Further, a thermal interface material or thermal silicone or solder is arranged between the power device and the heat dissipation surface.

[0008] Further, the heat dissipation assembly comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a shell and a cooling plate, the inlet and the outlet are arranged on the shell, the shell is provided with a liquid storage chamber connecting the inlet and the outlet, the cooling plate covers the opening of the liquid storage chamber, the first turbulence fin is arranged on the side of the cooling plate facing the liquid storage chamber, and the surface of the side of the cooling plate away from the liquid storage chamber is a heat dissipation surface connected with the power device.

[0009] Further, the heat dissipation assembly comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a shell and a cooling tube, the shell is provided with a receiving groove, the cooling tube is embedded in the receiving groove, the inlet and the outlet are arranged on the cooling tube, the cooling tube is hollow inside to form the cooling liquid flow channel, and the surface of the side of the cooling tube embedded in the shell is a heat dissipation surface connected with the power device.

[0010] Further, the heat dissipation assembly comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a shell and a first heat conduction component and a cover plate arranged on both sides of the shell, the shell is provided with a receiving groove, the first heat conduction component is embedded in the receiving groove, the inlet and the outlet are arranged at both ends of the shell, the cooling liquid flow channel is arranged on the other side of the shell, the second turbulence fin is arranged on the wall surface of the cooling liquid flow channel, the cover plate covers the opening of the cooling liquid flow channel, and the surface of the side of the first heat conduction component embedded in the shell is a heat dissipation surface connected with the power device.

[0011] Further, the liquid storage chamber is provided with a support plate.

[0012] Further, the shape of the first turbulence fin adopts any one of a tooth shape, a cylindrical shape and a rectangular shape.

[0013] Further, the cooling plate is further provided with a heat conduction fin on the side facing the liquid storage chamber.

[0014] Further, the cooling plate is further provided with a heat conduction fin on the side facing the liquid storage chamber.

[0015] Further, the cooling plate is further provided with a heat conduction fin on the side facing the liquid storage chamber.

[0016] Further, two heat conduction bosses are arranged on the heat dissipation surface at intervals, a heat conduction layer is arranged between the circuit board and the power device, and the heat conduction layer is installed on the two heat conduction bosses through fasteners at both ends.

[0017] Further, a first insulating layer is arranged between the circuit board and the heat-conducting layer.

[0018] Further, a second insulating layer is arranged between the power device and the heat-dissipating surface.

[0019] Then, the application also provides a vehicle-mounted charger comprising the liquid-cooled heat-dissipating device of any one of the power devices as described above.

[0020] Compared with the prior art, the liquid-cooled heat-dissipating device of the power device and the vehicle-mounted charger provided by the application have the following advantages:

[0021] 1. The power device is directly mounted on the heat-dissipating surface of the heat-dissipating assembly, thereby reducing the intermediate heat-conducting layers such as aluminum substrates, lowering the contact thermal resistance, improving the heat-dissipating performance, and eliminating the need for using an additional pressing strip to press the aluminum substrate, which not only reduces the complexity of the installation, but also reduces the installation space required by the power device.

[0022] 2. The cooling plate or the shell is provided with the turbulence fins, which effectively increase the contact area with the cooling liquid, increase the convective heat transfer coefficient, reduce the thermal resistance of the convective heat transfer, and significantly improve the heat-dissipating efficiency of the power device and the power density of the device.

[0023] 3. The upper and lower sides of the power device are provided with the heat-conducting layer and the heat-dissipating assembly, the heat generated by the power device is not only transmitted to the heat-dissipating assembly from the lower side, but also transmitted to the heat-dissipating assembly from the upper side through the heat-conducting layer, thereby forming a double-sided heat-dissipating structure and further improving the heat-dissipating efficiency of the power device.

[0024] 4. The insulating layer and the heat-conducting layer are arranged between the power device and the circuit board, the insulating layer can play an insulating role, and if the heat-conducting layer is made of a metal material with high thermal conductivity, the heat-conducting layer not only plays a heat-dissipating role, but also shields electromagnetic interference. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0026] Fig. 1 is an overall structure assembly drawing of the liquid-cooled heat-dissipating device of the power device provided by the embodiment one of the application;

[0027] Fig. 2 is an overall structure assembly drawing of the liquid-cooled heat-dissipating device of the power device provided by the embodiment one of the application after removing the circuit board;

[0028] Fig. 3 is an overall structure explosion schematic view of the liquid cooling heat dissipation device of the power device according to the embodiment one of the present application;

[0029] Fig. 4 is a structure schematic view of the shell according to the embodiment one of the present application;

[0030] Fig. 5 is a structure schematic view of the cooling plate provided with the tooth-shaped first spoiler fin according to the embodiment one of the present application;

[0031] Fig. 6 is a structure schematic view of the cooling plate provided with the cylindrical first spoiler fin according to the embodiment one of the present application;

[0032] Fig. 7 is a structure schematic view of the cooling plate provided with the rectangular first spoiler fin according to the embodiment one of the present application;

[0033] Fig. 8 is a structure schematic view of the cooling plate embedded with the heat conduction plate according to the embodiment one of the present application;

[0034] Fig. 9 is an explosion schematic view of the cooling plate embedded with the heat conduction plate according to the embodiment one of the present application;

[0035] Fig. 10 is a structure schematic view of the cooling plate embedded with the second heat conduction component according to the embodiment one of the present application;

[0036] Fig. 11 is an explosion schematic view of the cooling plate embedded with the second heat conduction component according to the embodiment one of the present application;

[0037] Fig. 12 is a structure schematic view two of the cylindrical first spoiler fin according to the embodiment one of the present application;

[0038] Fig. 13 is an overall structure explosion schematic view of the liquid cooling heat dissipation device of the power device according to the embodiment two of the present application;

[0039] Fig. 14 is a structure schematic view of the heat dissipation assembly according to the embodiment three of the present application;

[0040] Fig. 15 is an overall structure explosion schematic view of the liquid cooling heat dissipation device of the power device according to the embodiment three of the present application;

[0041] Fig. 16 is a structure schematic view of the heat dissipation assembly according to the embodiment four of the present application;

[0042] Fig. 17 is a side view and a sectional view of the heat dissipation assembly according to the embodiment four of the present application;

[0043] Fig. 18 is an overall structure explosion schematic view of the liquid cooling heat dissipation device according to the embodiment four of the present application;

[0044] In the figures, the main marks are as follows:

[0045] 01, circuit board; 02, second fastener; 03, first fastener; 04, first insulation layer; 05, heat conduction layer; 06, first connecting layer; 07, power device; 08, second connecting layer; 09, cooling plate; 10, shell;

[0046] 11, second insulation layer; 12, third connecting layer;

[0047] 13, tooth-shaped first turbulence fin; 14, cylindrical first turbulence fin; 15, rectangular first turbulence fin;

[0048] 16, heat conduction plate; 17, second heat conduction component;

[0049] 18, shell liquid inlet; 19, liquid storage chamber; 20, shell and cooling plate welding or sealing ring installation area; 21, shell liquid outlet;

[0050] 22, cooling pipe; 23, cooling pipe liquid inlet; 24, cooling pipe liquid outlet;

[0051] 25, first heat conduction component; 26, second turbulence fin; 27, cover plate;

[0052] 31, cylindrical heat conduction fin; 32, rectangular heat conduction fin;

[0053] 40, heat dissipation assembly, 41, heat conduction boss. DETAILED DESCRIPTION

[0054] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clearly understood, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application. EMBODIMENTS

[0055] Please refer to Fig. 1, Fig. 2 and Fig. 3, the embodiment provides a liquid cooling heat dissipation device of a power device, which comprises a circuit board 01, a power device 07 and a heat dissipation assembly 40 arranged in sequence. The power device 07 is connected with the circuit board 01 through the pins on one side of the power device 07, and the other side of the power device 07 is installed on the heat dissipation surface of the heat dissipation assembly 40. The heat dissipation assembly 40 has a liquid inlet, a liquid outlet and a cooling liquid flow channel connecting the liquid inlet and the liquid outlet. When the power device 07 works, the cooling liquid in the cooling liquid flow channel exchanges heat with the power device 07, and the heat generated by the power device 07 can be taken away by the cooling liquid flowing in the cooling liquid flow channel, realizing the liquid cooling heat dissipation of the power device 07. At the same time, the embodiment directly installs the power device 07 on the heat dissipation surface of the heat dissipation assembly 40, reduces the intermediate heat transfer level of the aluminum substrate and the like, reduces the contact thermal resistance, thereby improving the heat dissipation performance, on the other hand, since the application does not use the aluminum substrate, it is not necessary to use the additional pressing strip to press the aluminum substrate, not only reduces the complexity of the installation, but also reduces the installation space required by the power device.

[0056] It can be understood that the power device 07 is located between the circuit board 01 and the heat dissipation assembly 40, and the number of the power device 07 can be multiple, and the embodiment takes three power devices 07 as an example to expand the description. Of course, in other embodiments, the number of the power device 07 can be other values except three. The types of the plurality of power devices 07 can be different, and considering that the heat generated by different power devices 07 when working is different, the power device 07 with high heat power can be installed at a position close to the liquid inlet of the heat dissipation assembly 40, thereby ensuring the temperature uniformity of the power device 07 with high heat power.

[0057] As shown in Fig. 3, the three power devices 07 are arranged side by side, and a pair of pins is arranged on each power device 07, and the pins in each pair of pins are vertically arranged. The circuit board 01 is provided with three pairs of small holes, and the three pairs of small holes of the circuit board 01 correspond to the three pairs of pins of the three power devices 07 respectively. As shown in Fig. 1, after the device is assembled, the pins of the power device 07 are arranged in the small holes of the circuit board 01 corresponding to the pins, realizing the connection between the power device 07 and the circuit board 01.

[0058] As shown in Fig. 3 and Fig. 4, the heat dissipation assembly 40 comprises a shell 10 and a cooling plate 09. The left and right ends of the shell 10 are provided with a shell liquid inlet 18 and a shell liquid outlet 21, the shell liquid inlet 18 serving as the liquid inlet of the heat dissipation assembly 40, and the shell liquid outlet 21 serving as the liquid outlet of the heat dissipation assembly 40. At the same time, the shell 10 and the cooling plate 09 cooperate to form the cooling liquid flow channel of the heat dissipation assembly 40, and one side surface of the cooling plate 09 serves as the heat dissipation surface connected with the power device 07.

[0059] As shown in FIG. 3 and FIG. 4, the shell 10 is provided with a liquid storage chamber 19, which is in communication with the shell liquid inlet 18 and the shell liquid outlet 21 respectively. The liquid storage chamber 19 has an opening, and the cooling plate 09 is covered on the opening of the liquid storage chamber 19. At the same time, the shell 10 is provided with a welding or sealing ring mounting area for the cooling plate 09, and the cooling plate 09 is mounted and sealed with the shell 10 through the sealing ring or welding. In addition, the cooling plate 09 is provided with first turbulence fins, which extend into the liquid storage chamber 19. The flow path of the cooling liquid can be extended through the first turbulence fins, so that the cooling liquid can effectively take away more heat. It can be understood that the shell 10 and the cooling plate 09 cooperate to form a cooling liquid flow channel. Specifically, the first turbulence fins on the cooling plate 09 cooperate with the liquid storage chamber 19 of the shell 10 to form a liquid flow space, which is the cooling liquid flow channel.

[0060] In order to better improve the heat dissipation performance, the length of the first turbulence fin should be equal to the depth of the liquid storage chamber 19. In order to reduce the production cost, the length of the first turbulence fin should be designed to be short. Therefore, in order to balance the heat dissipation performance and the cost, when the length of the first turbulence fin is short, a support plate is further arranged in the liquid storage chamber 19, and the first turbulence fin abuts against the support plate.

[0061] In order to better improve the heat dissipation performance, the cooling plate 09 can be provided with heat conduction fins in addition to the first turbulence fins. The number of heat conduction fins is less than that of the first turbulence fins. The shape of the heat conduction fin can be the same as or different from that of the first turbulence fin. The size of the heat conduction fin is usually larger than that of the first turbulence fin. The heat conduction fin is arranged at the middle part of the cooling plate 09, and the rest of the space of the cooling plate 09 is filled with the first turbulence fins. On the one hand, the size of the heat conduction fin is larger, which effectively increases the contact area with the cooling liquid, and is beneficial to improve the heat dissipation efficiency of the power device 07. On the other hand, the heat conduction fin is hollow, and the fastener such as a bolt can be inserted into the heat conduction fin, so as to lock the power device 07 on the cooling plate 09. The latter will be described in more detail below.

[0062] In the embodiment, the shape of the first turbulence fin has multiple forms, including but not limited to tooth shape, cylindrical shape and rectangular shape. At the same time, the shape of the heat conduction fin also has multiple forms, including but not limited to cylindrical shape and rectangular shape.

[0063] As shown in FIG. 5, the cooling plate 09 is provided with tooth-shaped first turbulence fins 13 and cylindrical heat conduction fins 31. The number of the cylindrical heat conduction fins 31 is five, and the number of the tooth-shaped first turbulence fins 13 is much more than five. The cylindrical heat conduction fin 31 is hollow, and the tooth-shaped first turbulence fin 13 can be solid.

[0064] Through simulation and test, when the liquid cooling heat dissipation device of the power device adopts the cooling plate 09 provided with the tooth-shaped first turbulence fin 13, the highest temperature of the device in the temperature cloud picture is 138.85℃, the junction temperature of the device is lower than the allowable temperature, and the heat dissipation efficiency of the power device 07 can be effectively improved.

[0065] As shown in FIG. 6, the cooling plate 09 is provided with the cylindrical first turbulence fin 14 and the cylindrical heat conduction fin 31. The diameter of the cylindrical heat conduction fin 31 is greater than the diameter of the cylindrical first turbulence fin 14. The number of the cylindrical heat conduction fin 31 is five, and the number of the cylindrical first turbulence fin 14 is much greater than five. The cylindrical heat conduction fin 31 is hollow, and the cylindrical first turbulence fin 14 can be solid.

[0066] Through simulation and test, when the liquid cooling heat dissipation device of the power device adopts the cooling plate 09 provided with the cylindrical first turbulence fin 14, the highest temperature of the device in the temperature cloud picture is 139.36℃, the junction temperature of the device is lower than the allowable temperature, and the heat dissipation efficiency of the power device 07 can be effectively improved.

[0067] As shown in FIG. 7, the cooling plate 09 is provided with the rectangular first turbulence fin 15 and the rectangular heat conduction fin 32. The width of the rectangular heat conduction fin 32 is greater than the width of the rectangular first turbulence fin 15. The number of the rectangular heat conduction fin 32 is one, and the number of the rectangular first turbulence fin 15 is multiple. The rectangular heat conduction fin 32 is hollow, or the rectangular heat conduction fin 32 is solid and provided with five fastening holes. The rectangular first turbulence fin 15 can be solid.

[0068] Through simulation and test, when the liquid cooling heat dissipation device of the power device adopts the cooling plate 09 provided with the rectangular first turbulence fin 15, the highest temperature of the device in the temperature cloud picture is 134.60℃, the junction temperature of the device is lower than the allowable temperature, and the heat dissipation efficiency of the power device 07 can be effectively improved.

[0069] In the embodiment, the cooling plate 09 can also be provided with the heat conduction plate 16 or the second heat conduction component 17. The materials of the heat conduction plate 16 and the second heat conduction component 17 can be metal materials with good heat conduction performance, so as to better improve the heat dissipation efficiency of the power module. At the same time, the heat conduction plate 16 and the first turbulence fin are arranged on opposite sides of the cooling plate 09, and the second heat conduction component 17 and the first turbulence fin are also arranged on opposite sides of the cooling plate 09.

[0070] As shown in FIG. 3, FIG. 8 and FIG. 9, the heat-conducting plates 16 are rectangular in shape, the number of the heat-conducting plates 16 is three, and the cooling plate 09 is provided with three rectangular grooves, and the heat-conducting plates 16 are embedded in the corresponding rectangular grooves. The heat-conducting plates 16 correspond to the power devices 07 one by one, and when the number of the power devices 07 is three, the number of the heat-conducting plates 16 is also three. In the embodiment, the geometric center of the power device 07 is preferably aligned with the geometric center of the heat-conducting plate 16. In other embodiments, the number of the heat-conducting plates 16 can be a number other than three, and meanwhile, the number of the heat-conducting plates 16 is consistent with the number of the power devices 07. In addition, the present application does not limit the size of the surface area of the heat-conducting plates 16, nor does it limit whether the geometric center of the power device 07 is aligned with the geometric center of the heat-conducting plate 16.

[0071] As shown in FIG. 10 and FIG. 11, the second heat-conducting components 17 are S-shaped in shape, the number of the second heat-conducting components 17 is two, and the two second heat-conducting components 17 are symmetrically arranged. The cooling plate 09 is provided with two curved grooves, and the second heat-conducting components 17 are embedded in the corresponding curved grooves. In addition, the second heat-conducting components 17 are preferably solid structures.

[0072] In the embodiment, the heat-conducting layer 05 is further arranged between the power device 07 and the circuit board 01, which better improves the heat dissipation efficiency of the power module.

[0073] As shown in FIG. 3, the heat-conducting layer 05 is located on the side of the power device 07 close to the circuit board 01, and the cooling plate 09 is provided with two heat-conducting bosses 41 at intervals. The heat-conducting layer 05 is installed on the two heat-conducting bosses 41 of the cooling plate 09 through fasteners at both ends. When the power device 07 is working, the heat generated by the power device 07 is not only directly transmitted to the cooling plate 09 below, but also transmitted to the heat-conducting bosses 41 and the cooling plate 09 in turn through the heat-conducting layer 05 above, forming a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0074] In the embodiment, the first insulating layer 04 is further arranged between the circuit board 01 and the heat-conducting layer 05, which can play an insulating role. The heat-conducting layer 05 is usually made of high-thermal-conductivity materials, and the heat-conducting layer 05 can be made of metal materials or non-metal materials. If the heat-conducting layer 05 is a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0075] As shown in FIG. 3, the first insulating layer 04 is located on the heat-conducting layer 05, and the size and shape of the first insulating layer 04 are consistent with the size and shape of the heat-conducting layer 05.

[0076] In the embodiment, there are various connection modes between the power device 07 and the cooling plate 09, including but not limited to the use of thermal interface material (TIM), thermal silicone and solder.

[0077] For example, a thermal interface material is coated between the power device 07 and the cooling plate 09, and is connected through fasteners. The thermal interface material can reduce the interface thermal resistance.

[0078] For example, a thermal silicon gel is coated between the power device 07 and the cooling plate 09. The thermal silicon gel not only fills the gap between the cooling plate 09 and the power device 07, but also reduces the contact thermal resistance and the connection.

[0079] For example, solder is used to solder the power device 07 and the cooling plate 09. The solder can reduce the contact thermal resistance and the installation.

[0080] When the foregoing connection methods are used, the power device 07 is directly installed on the heat dissipation surface of the cooling plate 09. Unlike the prior art that is installed on an aluminum shell (the thermal conductivity of the aluminum material is 121 W / (m*k)), the cooling plate 09 can use a material with a higher thermal conductivity, such as a 6-series aluminum, copper, or the like, and is formed by forging or machining. At the same time, compared with the traditional heat dissipation scheme, the intermediate heat transfer level such as the aluminum substrate is reduced, and the total thermal resistance is significantly reduced.

[0081] In the embodiment, the connection between the power device 07 and the thermal conductive layer 05 also has various methods, including but not limited to the use of a TIM material, a thermal silicon gel, and solder. That is, the connection between the power device 07 and the thermal conductive layer 05 can be the same as the connection between the power device 07 and the cooling plate 09, which will not be described in detail here.

[0082] For ease of understanding, the overall structure of the liquid cooling heat dissipation device of the power device provided in the embodiment is further described as follows:

[0083] As shown in FIG. 3, the liquid cooling heat dissipation device of the power device includes, from top to bottom, a circuit board 01, a first fastener 03, a second fastener 02, a first insulating layer 04, a thermal conductive layer 05, a first connection layer 06, a power device 07, a second connection layer 08, a cooling plate 09, and a shell 10.

[0084] It should be noted that the power device 07 shown in FIG. 3 is an inner insulation device. The circuit board 01 can be, but is not limited to, a printed circuit board (PCB), and the circuit board 01 is provided with small holes for the pins on the power device 07 to pass through. Now taking the example of the first connecting layer 06 being a TIM material and the second connecting layer 08 being thermal silicone as an example for description. Of course, in other examples, the second connecting layer 08 can also be a TIM material or solder. At the same time, considering that the first connecting layer 06 is a TIM material, since the TIM material does not have adhesion, the power device 07 and the heat conduction layer 05 also need to be fixed together by fasteners. For this, the first connecting layer 06 is provided with notches at both ends for the fasteners to be clamped, the power device 07 is provided with recesses at both ends for the fasteners to be clamped, the cooling plate 09 is provided with hollow heat conduction fins on the side away from the power device 07, and the cooling plate 09 is provided with through holes on the side facing the power device 07 for communicating the inside of the heat conduction fins, so that the fasteners can pass through the heat conduction fins. The notches of the first connecting layer 06, the recesses of the power device 07, and the heat conduction fins of the cooling plate 09 are correspondingly arranged.

[0085] It should also be noted that the cooling plate 09 is provided with two heat conduction bosses 41 on the side facing the power device 07. The heat conduction boss 41, the first insulation layer 04, and the heat conduction layer 05 are all provided with first threaded holes for the first fastener 03 to pass through. In addition, the first insulation layer 04 and the heat conduction layer 05 are both provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0086] It should also be noted that the left and right ends of the shell 10 are provided with a shell liquid inlet 18 and a shell liquid outlet 21, and the shell 10 is provided with a liquid storage chamber 19 communicating with the shell liquid inlet 18 and the shell liquid outlet 21. The liquid storage chamber 19 is open, and a support plate is arranged in the liquid storage chamber 19.

[0087] It should also be noted that the cooling plate 09 is provided with a first turbulence fin on the side away from the power device 07. As shown in FIGS. 5-7, the shape of the first turbulence fin can be tooth-shaped, cylindrical, or rectangular.

[0088] In assembly, the first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07 are sequentially connected by using the first fastener 03, and the first fastener 03 penetrates into the heat-conducting fin of the cooling plate 09. The first insulating layer 04, the heat-conducting layer 05 and the power device 07 are sequentially connected by using the second fastener 02, and the second fastener 02 penetrates into the heat-conducting boss 41 of the cooling plate 09. The cooling plate 09 is arranged at the opening of the liquid storage chamber 19 of the shell 10, and the cooling plate 09 is sealingly connected with the shell 10 by welding or arranging a sealing ring, etc. The first turbulence fin and the heat-conducting fin on the cooling plate 09 abut against the support plate in the liquid storage chamber 19. The pins of the power device 07 correspondingly penetrate into the small holes of the circuit board 01.

[0089] It can be understood that the heat-dissipating assembly 40 in the device is composed of the cooling plate 09 and the shell 10, and the shell 10 with the liquid storage chamber 19 and the cooling plate 09 provided with the first turbulence fin and the heat-conducting fin cooperatively form the cooling liquid flow channel. In the embodiment, the cooling liquid can be but is not limited to water.

[0090] It can also be understood that in the device, the upper side of the power device 07 is connected with the heat-conducting layer 05 through the first connecting layer 06, and the first connecting layer 06 is made of TIM material. The TIM material fills the gap between the power device 07 and the heat-conducting layer 05 and is connected by the first fastener 03, and the TIM material can reduce the contact thermal resistance. Meanwhile, the lower side of the power device 07 is connected with the cooling plate 09 through the second connecting layer 08, and the second connecting layer 08 is made of thermal silicone which fills the gap between the power device 07 and the cooling plate 09. The thermal silicone can not only reduce the contact thermal resistance but also has the function of connection. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. If the gap between the power device 07 and the cooling plate 09 is filled with TIM material, the TIM material can reduce the contact thermal resistance. If the power device 07 and the cooling plate 09 are welded by solder, the solder can not only have the function of connection and fixation but also reduce the contact thermal resistance. When the power device 07 works, the heat generated by the power device 07 can be transferred from the lower side of the device to the cooling plate 09, and the heat generated by the power device 07 can also be transferred from the upper side of the device to the heat-conducting boss 41 through the heat-conducting layer 05 and then to the cooling plate 09, thereby forming two heat transfer paths, so as to greatly improve the heat dissipation efficiency of the power device 07.

[0091] It can also be understood that the device, the cooling plate 09 below is provided with a first spoiler fin, the first spoiler fin has a variety of shapes, by setting the first spoiler fin, effectively increase the contact area with the cooling liquid, increase the convective heat transfer coefficient, at the same time due to the first spoiler fin spoiler effect, cooling liquid in the first spoiler fin will produce strong turbulence, reduce the thermal resistance of convective heat transfer, thereby significantly improve the heat dissipation efficiency of power device 07, improve the power density of the device.

[0092] It can also be understood that the device, the power device 07 on the side and between the heat conduction layer 05 and the circuit board 01 is provided with a first insulating layer 04, the first insulating layer 04 can play the role of insulation. The heat conduction layer 05 is usually made of high thermal conductivity material, the heat conduction layer 05 layer can be selected from metal materials or non-metallic materials, if the heat conduction layer 05 is a metal material, the heat conduction layer 05 not only plays a role in heat dissipation, but also can shield electromagnetic interference. Embodiment

[0093] The difference between the present embodiment and the foregoing embodiment one is that: the liquid cooling heat dissipation device of power device provided in embodiment one, the power device 07 shown in figure 3 is an internal insulation device, that is, the power device 07 is internally provided with an insulation structure, the power device 07 shown in figure 13 is an external insulation device, that is, the power device 07 is not provided with an insulation structure inside. For this, in the present embodiment, on the basis of the liquid cooling heat dissipation device of power device provided in embodiment one, a second insulating layer 11 and a third connecting layer 12 are added, that is, a second insulating layer 11 is further provided between the power device 07 and the cooling plate 09, and the second insulating layer 11 is connected with the cooling plate 09 through the third connecting layer 12. Among them, the second insulating layer 11 can adopt a copper clad ceramic carrier board (Direct Copper Bonding, DCB), and the third connecting layer 12 can adopt any one of TIM material, thermal silicone and solder. In addition, the other structures in the device are the same as those in embodiment one, which will not be described here.

[0094] For the sake of understanding, the overall structure of the liquid cooling heat dissipation device of power device provided in the present embodiment is further described as follows:

[0095] As shown in figure 13, the liquid cooling heat dissipation device of power device includes circuit board 01, first fastener 03, second fastener 02, first insulating layer 04, heat conduction layer 05, first connecting layer 06, power device 07, second connecting layer 08, second insulating layer 11, third connecting layer 12, cooling plate 09 and shell 10, which are sequentially stacked from top to bottom.

[0096] It should be noted that the circuit board 01 can be, but is not limited to, a printed circuit board 01 (PCB), and the circuit board 01 is provided with a small hole for the pins on the power device 07 to pass through. Now taking the first connecting layer 06 as TIM material, the second connecting layer 08 and the third connecting layer 12 are all described as taking thermal silicone as an example. Of course, in other examples, the second connecting layer 08 and the third connecting layer 12 can also use TIM material or solder. At the same time, considering that the first connecting layer 06 uses TIM material, since the TIM material does not have adhesion, it is also necessary to fix the power device 07 and the heat conduction layer 05 together through fasteners. For this, the first connecting layer 06 is provided with notches at both ends for the fasteners to be clamped, and the power device 07 is provided with recesses at both ends for the fasteners to be clamped, as shown in Figures 5 to 7, the cooling plate 09 is provided with hollow heat conduction fins on the side away from the power device 07, and the cooling plate 09 is provided with a through hole for communicating the inside of the heat conduction fins on the side facing the power device 07, so that the fastener can pass through the heat conduction fins, and the notches of the first connecting layer 06, the recesses of the power device 07 and the heat conduction fins of the cooling plate 09 are correspondingly arranged.

[0097] It should also be noted that the cooling plate 09 is provided with two heat conduction bosses 41 on the side facing the power device 07. The heat conduction boss 41, the first insulating layer 04 and the heat conduction layer 05 are all provided with first threaded holes for the first fastener 03 to pass through, and the first insulating layer 04 and the heat conduction layer 05 are both provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0098] It should also be noted that the left and right ends of the shell 10 are provided with a shell liquid inlet 18 and a shell liquid outlet 21, and the shell 10 is provided with a liquid storage chamber 19 communicating with the shell liquid inlet 18 and the shell liquid outlet 21, and the liquid storage chamber 19 is open, and a support plate is arranged in the liquid storage chamber 19.

[0099] It should also be noted that the cooling plate 09 is provided with a first turbulence fin on the side away from the power device 07, as shown in Figures 5 to 7, and the shape of the first turbulence fin can be tooth-shaped, cylindrical or rectangular.

[0100] When assembled, the power device 07 is mounted on the second insulating layer 11, and the power device 07 is connected with the second insulating layer 11 through the second connecting layer 08. The power device 07 and the second insulating layer 11 subassembly is further mounted on the cooling plate 09, and the second insulating layer 11 is connected with the cooling plate 09 through the third connecting layer 12. The first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07 are sequentially connected using the first fastener 03, and the first fastener 03 penetrates into the heat-conducting fin of the cooling plate 09. The first insulating layer 04, the heat-conducting layer 05 and the power device 07 are sequentially connected using the second fastener 02, and the second fastener 02 penetrates into the heat-conducting boss 41 of the cooling plate 09. The cooling plate 09 is covered at the opening of the liquid storage chamber 19 of the shell 10, and the cooling plate 09 is sealingly connected with the shell 10 by welding or setting a sealing ring, etc., and the first turbulence fin and the heat-conducting fin on the cooling plate 09 abut against the support plate in the liquid storage chamber 19. The pins of the power device 07 correspondingly penetrate into the small holes of the circuit board 01.

[0101] It can be understood that the heat dissipation assembly 40 in the device is composed of the cooling plate 09 and the shell 10, and the shell 10 with the liquid storage chamber 19 and the cooling plate 09 provided with the first turbulence fin and the heat-conducting fin cooperatively form the cooling liquid flow channel. In the embodiment, the cooling liquid can be but is not limited to water.

[0102] It can also be understood that in the device, the upper side of the power device 07 is connected with the heat conduction layer 05 through the first connecting layer 06, and the first connecting layer 06 adopts TIM material. The TIM material fills the gap between the power device 07 and the heat conduction layer 05 and is connected through the first fastener 03. The TIM material can reduce the contact thermal resistance. At the same time, the lower side of the power device 07 is connected with the cooling plate 09 through the second connecting layer 08, the second insulating layer 11 and the third connecting layer 12 in sequence. Now, the second connecting layer 08 and the third connecting layer 12 are taken as examples to be described, which adopt heat silicone. The heat silicone fills the gap between the power device 07 and the second insulating layer 11 and the gap between the second insulating layer 11 and the cooling plate 09. The heat silicone can not only reduce the contact thermal resistance, but also can play a connecting role. Of course, in other examples, the second connecting layer 08 and the third connecting layer 12 can also adopt TIM material or solder. If the TIM material fills the gap between the power device 07 and the second insulating layer 11 and the gap between the second insulating layer 11 and the cooling plate 09, the TIM material can reduce the contact thermal resistance. If the solder is used to weld the power device 07 and the second insulating layer 11 and the second insulating layer 11 and the cooling plate 09, the solder can not only play a connecting and fixing role, but also can reduce the contact thermal resistance. When the power device 07 works, the heat generated by the power device 07 can be transmitted from the lower side of the device to the cooling plate 09 through the second insulating layer 11, and at the same time, the heat generated by the power device 07 can also be transmitted from the upper side of the device to the heat conduction layer 05, then to the heat conduction boss 41, and then to the cooling plate 09, thereby forming two heat transmission paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0103] It can also be understood that in the device, the first turbulence fin is arranged below the cooling plate 09. The first turbulence fin has various shapes. By arranging the first turbulence fin, the contact area with the cooling liquid is effectively increased, the convective heat transfer coefficient is increased, and at the same time, due to the turbulence effect of the first turbulence fin, the cooling liquid will generate strong turbulence when passing through the first turbulence fin, the thermal resistance of the convective heat transfer is reduced, thereby significantly improving the heat dissipation efficiency of the power device 07 and improving the power density of the device.

[0104] It can also be understood that in the device, the first insulating layer 04 is arranged on the upper side of the power device 07 and between the heat conduction layer 05 and the circuit board 01, and the second insulating layer 11 is arranged on the lower side of the power device 07 and between the power device 07 and the cooling plate 09. The first insulating layer 04 and the second insulating layer 11 can play an insulating role. The heat conduction layer 05 on the upper side of the power device 07 is usually made of high thermal conductivity material. The heat conduction layer 05 can be selected from metal materials or non-metal materials. If the heat conduction layer 05 is a metal material, the heat conduction layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference. Embodiment

[0105] Please refer to Fig. 14 and Fig. 15, the embodiment provides a liquid cooling heat dissipation device of power device.

[0106] The device comprises circuit board 01, power device 07 and heat dissipation assembly 40 arranged in sequence. The power device 07 is connected with the circuit board 01 through the pins on one side of the power device 07, and the other side of the power device 07 is installed on the heat dissipation surface of the heat dissipation assembly 40. The heat dissipation assembly 40 has a liquid inlet, a liquid outlet and a cooling liquid flow channel connecting the liquid inlet and the liquid outlet. When the power device 07 works, the cooling liquid in the cooling liquid flow channel exchanges heat with the power device 07, and the heat generated by the power device 07 can be taken away by the cooling liquid flowing in the cooling liquid flow channel, realizing the liquid cooling heat dissipation of the power device 07. At the same time, the embodiment directly installs the power device 07 on the heat dissipation surface of the heat dissipation assembly 40, reduces the intermediate heat transfer level of the aluminum substrate and the like, reduces the contact thermal resistance, and improves the heat dissipation performance.

[0107] It can be understood that the power device 07 is located between the circuit board 01 and the heat dissipation assembly 40, and the number of power devices 07 can be multiple, and the embodiment takes three power devices 07 as an example to expand the description. Of course, in other embodiments, the number of power devices 07 can be other values except three. The types of multiple power devices 07 can be different, and considering that the heat generated by different power devices 07 when working is different, the power device 07 with high heat power is installed at a position close to the liquid inlet of the heat dissipation assembly 40, so as to ensure the temperature uniformity of the power device 07 with high heat power.

[0108] As shown in Fig. 15, the three power devices 07 are arranged side by side, and a pair of pins is arranged on each power device 07, and the pins in each pair of pins are vertically arranged. The circuit board 01 is provided with three pairs of small holes, and the three pairs of small holes of the circuit board 01 correspond to the three pairs of pins of the three power devices 07 respectively. After the device is assembled, the pins of the power device 07 are arranged in the small holes of the circuit board 01 corresponding to the pins, realizing the connection between the power device 07 and the circuit board 01.

[0109] As shown in Fig. 15 and Fig. 16, the heat dissipation assembly 40 comprises a shell 10 and a cooling pipe 22. The shell 10 is provided with a receiving groove, and the cooling pipe 22 is embedded in the receiving groove. The cooling pipe 22 is hollow inside to form the cooling liquid flow channel of the heat dissipation assembly 40, and the cooling pipe 22 is provided with a cooling pipe liquid inlet 23 and a cooling pipe liquid outlet 24 at both ends, the cooling pipe liquid inlet 23 serving as the liquid inlet of the heat dissipation assembly 40, and the cooling pipe liquid outlet 24 serving as the liquid outlet of the heat dissipation assembly 40. One side surface of the shell 10 in which the cooling pipe 22 is embedded is a heat dissipation surface connected with the power device 07. The embodiment does not use a cooling plate, but uses the shell 10 in which the cooling pipe 22 is embedded, and installs the power device 07 on the shell 10, so as to improve the heat dissipation efficiency of the power device 07.

[0110] In the embodiment, the cooling pipe 22 and the receiving groove are both in a multi-bend shape. The depth of the receiving groove is equal to the diameter of the cooling pipe 22, that is, when the cooling pipe 22 is embedded in the receiving groove, the surface of the cooling pipe 22 capable of abutting against the power device 07 is flush with the surface of the housing 10 capable of abutting against the power device 07, so as to ensure that the surface of the housing 10 in which the cooling pipe 22 is embedded (i.e., the heat dissipation surface connected with the power device 07) is a horizontal surface.

[0111] In the embodiment, the material of the cooling pipe 22 can be a metal material with good heat conduction performance.

[0112] In the embodiment, a heat conduction layer 05 is further arranged between the power device 07 and the circuit board 01, so as to better improve the heat dissipation efficiency of the power module.

[0113] As shown in FIG. 15, the heat conduction layer 05 is arranged on the side of the power device 07 close to the circuit board 01, and two heat conduction bosses 41 are arranged on the housing 10 in a spaced manner. The heat conduction layer 05 is installed on the two heat conduction bosses 41 of the housing 10 through fasteners. When the power device 07 works, the heat generated by the power device 07 is not only directly transmitted to the cooling pipe 22 below the power device 07, but also transmitted to the heat conduction bosses 41 and the cooling pipe 22 in sequence through the heat conduction layer 05 above the power device 07, so as to form a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0114] In the embodiment, a first insulating layer 04 is further arranged between the circuit board 01 and the heat conduction layer 05, and the first insulating layer 04 can play an insulating role. The heat conduction layer 05 is usually made of a material with high heat conductivity, and the heat conduction layer 05 can be made of a metal material or a non-metal material. If the heat conduction layer 05 is made of a metal material, the heat conduction layer 05 not only plays a heat dissipation role, but also shields electromagnetic interference.

[0115] As shown in FIG. 15, the first insulating layer 04 is arranged on the heat conduction layer 05, and the size and shape of the first insulating layer 04 are consistent with the size and shape of the heat conduction layer 05.

[0116] In the embodiment, there are various connection modes between the power device 07 and the housing 10 in which the cooling pipe 22 is embedded, including but not limited to a thermal interface material (TIM), thermal silicone and solder.

[0117] For example, the TIM is coated between the power device 07 and the housing 10 in which the cooling pipe 22 is embedded, and the power device 07 and the housing 10 in which the cooling pipe 22 is embedded are connected through fasteners. The TIM can play a role in reducing the interfacial thermal resistance.

[0118] For example, hot silicon glue is coated between the power device 07 and the shell 10 in which the cooling pipe 22 is embedded. The hot silicon glue not only fills the gap between the power device 07 and the shell 10 in which the cooling pipe 22 is embedded, but also reduces the contact thermal resistance and serves as a connector.

[0119] For another example, solder is used to connect the power device 07 and the shell 10 in which the cooling pipe 22 is embedded. The solder reduces the contact thermal resistance and serves as a connector.

[0120] The power device 07 and the heat conduction layer 05 can be connected in various ways, including but not limited to TIM material, hot silicon glue, and solder. That is, the power device 07 and the heat conduction layer 05 can be connected in the same way as the power device 07 and the shell 10 in which the cooling pipe 22 is embedded. Details are not described here.

[0121] For ease of understanding, the overall structure of the liquid cooling heat dissipation device of the power device provided in the embodiment is further described as follows:

[0122] As shown in FIG. 15, the liquid cooling heat dissipation device of the power device includes, from top to bottom, the circuit board 01, the first fastener 03, the second fastener 02, the first insulation layer 04, the heat conduction layer 05, the first connecting layer 06, the power device 07, the second connecting layer 08, the cooling pipe 22, and the shell 10.

[0123] It should be noted that the power device 07 shown in FIG. 15 is an inner insulation device. The circuit board 01 can be, but is not limited to, a printed circuit board (PCB), and the circuit board 01 is provided with a small hole for the pins on the power device 07 to pass through. Now, the first connecting layer 06 is described by taking the example of using TIM material, and the second connecting layer 08 is described by taking the example of using hot silicon glue. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. Meanwhile, considering that the first connecting layer 06 uses TIM material, which has no adhesion, the power device 07 and the heat conduction layer 05 need to be fixed together by a fastener. For this purpose, the first connecting layer 06 is provided with notches at both ends for the fastener to be clamped, the power device 07 is provided with recesses at both ends for the fastener to be clamped, and the shell 10 is provided with fastening holes for the fastener to pass through. The notches of the first connecting layer 06, the recesses of the power device 07, and the fastening holes of the shell 10 are correspondingly arranged.

[0124] It should be noted that the housing 10 is provided with two heat-conducting bosses 41 at intervals. The heat-conducting boss 41, the first insulating layer 04 and the heat-conducting layer 05 are all provided with first threaded holes for the first fastener 03 to pass through. In addition, the first insulating layer 04 and the heat-conducting layer 05 are both provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0125] It should be noted that the housing 10 is provided with cooling pipe liquid inlet 23 and cooling pipe liquid outlet 24 at both ends, and the housing 10 is provided with a receiving groove for receiving the cooling pipe 22.

[0126] During assembly, the cooling pipe 22 is embedded in the receiving groove of the housing 10, the first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07 are connected in sequence by using the first fastener 03, and the first fastener 03 is inserted into the fastening hole of the housing 10. In addition, the first insulating layer 04, the heat-conducting layer 05 and the power device 07 are connected in sequence by using the second fastener 02, and the second fastener 02 is inserted into the heat-conducting boss 41 of the housing 10. The pins of the power device 07 correspond to the small holes of the circuit board 01.

[0127] It can be understood that the heat dissipation assembly 40 in the device is composed of the cooling pipe 22 and the housing 10, and the cooling pipe 22 has a cooling pipe liquid inlet 23, a cooling pipe liquid outlet 24 and a cooling liquid flow channel communicating with the cooling pipe liquid inlet 23 and the cooling pipe liquid outlet 24. In this embodiment, the cooling liquid can be but not limited to water.

[0128] It can also be understood that in the device, the upper side of the power device 07 is connected with the heat conduction layer 05 through the first connecting layer 06, and the first connecting layer 06 adopts TIM material. The TIM material is used to fill the gap between the power device 07 and the heat conduction layer 05, and is connected through the first fastener 03. The TIM material can reduce the contact thermal resistance. At the same time, the lower side of the power device 07 is connected with the shell 10 in which the cooling pipe 22 is embedded through the second connecting layer 08, and the second connecting layer 08 adopts thermal silicone. The gap between the power device 07 and the shell 10 in which the cooling pipe 22 is embedded is filled by using thermal silicone, which not only reduces the contact thermal resistance, but also has the effect of connection. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. If the gap between the power device 07 and the shell 10 in which the cooling pipe 22 is embedded is filled with TIM material, the contact resistance can be reduced. If the power device 07 and the shell 10 in which the cooling pipe 22 is embedded are soldered, not only the connection and fixation can be achieved, but also the contact thermal resistance can be reduced. When the power device 07 works, the heat generated by the power device 07 can be transmitted from the lower side of the device to the cooling pipe 22, and at the same time, the heat generated by the power device 07 can also be transmitted from the upper side of the device to the heat conduction layer 05, and then to the heat conduction boss 41, and then to the cooling pipe 22, thereby forming two heat transmission paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0129] It can also be understood that in the device, the first insulating layer 04 is arranged on the upper side of the power device 07 and between the heat conduction layer 05 and the circuit board 01, and the first insulating layer 04 can have the effect of insulation. The heat conduction layer 05 is usually made of high thermal conductivity material. The heat conduction layer 05 can be made of metal material or non-metal material. If the heat conduction layer 05 is made of metal material, the heat conduction layer 05 not only has the effect of heat dissipation, but also can shield electromagnetic interference. Embodiment

[0130] The difference between the present embodiment and embodiment three is that the shell 10 in which the first heat conduction component 25 is embedded is used to replace the shell 10 in which the cooling pipe 22 is embedded on the basis of the liquid cooling heat dissipation device for power device provided in embodiment three.

[0131] As shown in FIG. 16 and FIG. 17, the heat dissipation assembly 40 includes the shell 10, the first heat conduction component 25 and the cover plate 27 arranged on both sides of the shell 10. The shell 10 is provided with a receiving groove, and the first heat conduction component 25 is embedded in the receiving groove. The shell inlet 18 and the shell outlet 21 are arranged at both ends of the shell 10, and the cooling liquid flow channel is arranged on the other side of the shell 10. The cover plate 27 is arranged at the opening of the cooling liquid flow channel. The surface of the shell 10 in which the first heat conduction component 25 is embedded is the heat dissipation surface connected with the power device 07.

[0132] As shown in Fig. 17, the wall surface of the cooling liquid flow channel is provided with second turbulence fins 26. The second turbulence fins 26 can extend the flow path of the cooling liquid, effectively increase the contact area with the cooling liquid, increase the convective heat transfer coefficient, and due to the turbulence effect of the second turbulence fins 26, the cooling liquid will generate strong turbulence when passing through the second turbulence fins 26, thereby reducing the thermal resistance of the convective heat transfer, and significantly improving the heat dissipation efficiency of the power device 07 and the power density of the device. The shape of the second turbulence fins 26 is not limited in this embodiment, and can be any one of a tooth shape, a cylindrical shape, and a rectangular shape.

[0133] In this embodiment, the first heat conduction member 25 and the receiving groove are both in a multi-channel curved shape. The depth of the receiving groove is equal to the diameter of the first heat conduction member 25, that is, when the first heat conduction member 25 is embedded in the receiving groove, the surface of the first heat conduction member 25 that can abut against the power device 07 is flush with the surface of the housing 10 that can abut against the power device 07, thereby ensuring that the side surface of the housing 10 in which the first heat conduction member 25 is embedded (i.e., the heat dissipation surface connected to the power device 07) is a horizontal surface.

[0134] In this embodiment, the material of the first heat conduction member 25 can be a metal material with good heat conduction performance. In addition, the first heat conduction member 25 is preferably a solid structure.

[0135] In this embodiment, a heat conduction layer 05 is further provided between the power device 07 and the circuit board 01, which further improves the heat dissipation efficiency of the power module.

[0136] As shown in Fig. 18, the heat conduction layer 05 is located on the side of the power device 07 close to the circuit board 01, and two heat conduction bosses 41 are provided on the housing 10 at intervals. The heat conduction layer 05 is installed on the two heat conduction bosses 41 of the housing 10 through fasteners at both ends. When the power device 07 is working, the heat generated by the power device 07 is not only directly transmitted to the first heat conduction member 25 and the housing 10 below, but also transmitted to the heat conduction bosses 41, the first heat conduction member 25, and the housing 10 in turn through the heat conduction layer 05 above, forming a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0137] In this embodiment, a first insulating layer 04 is further provided between the circuit board 01 and the heat conduction layer 05, which can play an insulating role. The heat conduction layer 05 is usually made of a material with high thermal conductivity, and can be made of a metal material or a non-metal material. If the heat conduction layer 05 is a metal material, it not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0138] As shown in Fig. 18, the first insulating layer 04 is located on the heat conduction layer 05, and the size and shape of the first insulating layer 04 are consistent with those of the heat conduction layer 05.

[0139] In the embodiment, the connection between the power device 07 and the shell 10 embedded with the first heat conduction component 25 can be achieved in various ways, including but not limited to the use of thermal interface material (TIM), thermal silicone and solder.

[0140] For example, the TIM is coated between the power device 07 and the shell 10 embedded with the first heat conduction component 25, and the power device 07 and the shell 10 embedded with the first heat conduction component 25 are connected through the fastener, and the TIM can reduce the interface thermal resistance.

[0141] For another example, the thermal silicone is coated between the power device 07 and the shell 10 embedded with the first heat conduction component 25, and the thermal silicone can not only fill the gap between the power device 07 and the shell 10 embedded with the first heat conduction component 25, but also reduce the contact thermal resistance and the connection.

[0142] For another example, the thermal silicone is coated between the power device 07 and the shell 10 embedded with the first heat conduction component 25, and the thermal silicone can not only fill the gap between the power device 07 and the shell 10 embedded with the first heat conduction component 25, but also reduce the contact thermal resistance and the connection.

[0143] The connection between the power device 07 and the heat conduction layer 05 can also be achieved in various ways, including but not limited to the use of TIM material, thermal silicone and solder. That is, the connection between the power device 07 and the heat conduction layer 05 can be the same as the connection between the power device 07 and the shell 10 embedded with the first heat conduction component 25, which will not be described in detail here.

[0144] For the convenience of understanding, the overall structure of the liquid cooling heat dissipation device of the power device provided in the embodiment will be further described as follows:

[0145] As shown in FIG. 18, the liquid cooling heat dissipation device of the power device includes the circuit board 01, the first fastener 03, the second fastener 02, the first insulation layer 04, the heat conduction layer 05, the first connection layer 06, the power device 07, the second connection layer 08, the first heat conduction component 25 and the shell 10 which are sequentially stacked from top to bottom.

[0146] It should be noted that the power device 07 shown in FIG. 18 is an inner insulation device. The circuit board 01 can be, but is not limited to, a printed circuit board (PCB), and the circuit board 01 is provided with small holes for the pins on the power device 07 to pass through. Now taking the example of the first connecting layer 06 being a TIM material and the second connecting layer 08 being thermal silicone as an example for description. Of course, in other examples, the second connecting layer 08 can also be a TIM material or solder. At the same time, considering that when the first connecting layer 06 is a TIM material, since the TIM material does not have adhesion, the power device 07 and the heat conduction layer 05 also need to be fixed together by fasteners. For this, the first connecting layer 06 is provided with notches at both ends for the fasteners to be clamped, the power device 07 is provided with recesses at both ends for the fasteners to be clamped, and the shell 10 is provided with fastening holes for the fasteners to pass through. The notches of the first connecting layer 06, the recesses of the power device 07, and the fastening holes of the shell 10 are correspondingly arranged.

[0147] It should also be noted that the shell 10 is provided with two heat conduction bosses 41 at intervals. The heat conduction boss 41, the first insulation layer 04, and the heat conduction layer 05 are all provided with first threaded holes for the first fastener 03 to pass through. In addition, the first insulation layer 04 and the heat conduction layer 05 are both provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0148] It should also be noted that the left and right ends of the shell 10 are provided with a shell liquid inlet 18 and a shell liquid outlet 21, and the shell 10 is provided with a receiving groove for receiving the first heat conduction component 25. The shell 10 is provided with a cooling liquid flow channel inside, and the cooling liquid flow channel has an opening. The cooling liquid flow channel wall is provided with a second turbulence fin 26.

[0149] When assembling, the first heat conduction component 25 is embedded in the receiving groove of the shell 10, and the cover plate 27 is provided at the opening of the cooling liquid flow channel. The cover plate 27 is sealingly connected to the shell 10 by welding or using a sealing ring and the like. The first fastener 03 is used to sequentially connect the first insulation layer 04, the heat conduction layer 05, the first connecting layer 06, and the power device 07, and the first fastener 03 passes through the fastening hole of the shell 10. The second fastener 02 is also used to sequentially connect the first insulation layer 04, the heat conduction layer 05, and the power device 07, and the second fastener 02 passes through the heat conduction boss 41 of the shell 10. The pins of the power device 07 correspondingly pass through the small holes of the circuit board 01.

[0150] It can be understood that the heat dissipation assembly 40 in the device is composed of the first heat conduction component 25, the shell 10 and the cover plate 27, the shell 10 has a shell liquid inlet 18, a shell liquid outlet 21 and a cooling liquid flow channel communicating with the shell liquid inlet 18 and the shell liquid outlet 21. In this embodiment, the cooling liquid can be but is not limited to water.

[0151] It can also be understood that in the device, the upper side of the power device 07 is connected with the heat conduction layer 05 through the first connecting layer 06, and the first connecting layer 06 adopts a TIM material. The TIM material is used to fill the gap between the power device 07 and the heat conduction layer 05, and is connected through the first fastener 03. The TIM material can reduce the contact thermal resistance. Meanwhile, the lower side of the power device 07 is connected with the shell 10 in which the first heat conduction component 25 is embedded through the second connecting layer 08, and the second connecting layer 08 adopts a heat-conducting glue. The heat-conducting glue is used to fill the gap between the power device 07 and the shell 10 in which the first heat conduction component 25 is embedded. The heat-conducting glue can not only reduce the contact thermal resistance but also play a connecting role. Of course, in other examples, the second connecting layer 08 can also be a TIM material or solder. If the TIM material is used to fill the gap between the power device 07 and the shell 10 in which the first heat conduction component 25 is embedded, the contact resistance can be reduced. If the solder is used to weld the power device 07 and the shell 10 in which the first heat conduction component 25 is embedded, not only the connecting and fixing effects can be achieved, but also the contact thermal resistance can be reduced. When the power device 07 works, the heat generated by the power device 07 can be transmitted from the lower side of the device to the shell 10 in which the first heat conduction component 25 is embedded. Meanwhile, the heat generated by the power device 07 can also be transmitted from the upper side of the device to the heat conduction boss 41 through the heat conduction layer 05, and then to the shell 10 in which the first heat conduction component 25 is embedded, so as to form two heat transmission paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0152] It can also be understood that in the device, the first insulating layer 04 is arranged between the upper side of the power device 07 and the circuit board 01 and can play an insulating role. The heat conduction layer 05 is usually made of a material with high thermal conductivity. The heat conduction layer 05 can be made of a metal material or a non-metal material. If the heat conduction layer 05 is a metal material, the heat conduction layer 05 not only plays a heat dissipation role but also can shield electromagnetic interference. Embodiment

[0153] The embodiment provides a vehicle-mounted charger, which comprises any one of the liquid cooling heat dissipation devices of the power devices provided in the embodiments one to four.

[0154] The power device is one of the key components in the vehicle charger, which is used to realize the rectification of alternating current to direct current to charge the battery and convert the direct current output by the battery to alternating current to use for external electrical appliances, etc. The heat dissipation capacity of the power device directly determines the performance and efficiency of the OBC to a certain extent. By using the liquid cooling heat dissipation device of any one of the power devices provided in embodiments 1 to 4, the heat dissipation efficiency of the power device is significantly improved, which can meet the higher requirements proposed by the industry for the heat dissipation of the power device.

[0155] It should be noted that for the liquid cooling heat dissipation device of any one of the power devices in the foregoing embodiments 1 to 4, different water cooling plate design schemes, fin design schemes and shell design schemes can be used in combination without conflict, and are not limited to the above four embodiments.

[0156] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid cooling heat sink for a power device, characterized by, The application relates to a power device (07) and a heat dissipation assembly (40), wherein the power device (07) is connected with a circuit board (01) through pins on one side of the power device (07), and the other side of the power device (07) is mounted on a heat dissipation surface of the heat dissipation assembly (40).

2. The liquid cooling heat sink for power devices as claimed in claim 1, wherein, A thermal interface material or thermal silicone or solder is arranged between the power device (07) and the heat dissipation surface.

3. The liquid cooling heat sink for power devices of claim 1, wherein, The heat dissipation assembly (40) comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a housing (10) and a cooling plate (09) cooperatively forming the cooling liquid flow channel, the inlet and the outlet are arranged on the housing (10), the housing (10) is provided with a liquid storage chamber (19) connecting the inlet and the outlet, the cooling plate (09) is arranged on an opening of the liquid storage chamber (19), the cooling plate (09) is provided with first turbulence fins on a side facing the liquid storage chamber (19), and a surface of the cooling plate (09) away from the liquid storage chamber (19) is the heat dissipation surface connected with the power device (07).

4. The liquid cooling heat sink for power devices of claim 1, wherein, The heat dissipation assembly (40) comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a housing (10) and a cooling pipe (22), the housing (10) is provided with a receiving groove, the cooling pipe (22) is embedded in the receiving groove, the inlet and the outlet are arranged on the cooling pipe (22), the cooling pipe (22) is hollow to form the cooling liquid flow channel, and a surface of the housing (10) embedding the cooling pipe (22) is the heat dissipation surface connected with the power device (07).

5. The liquid cooling heat sink for power devices of claim 1, wherein, The heat dissipation assembly (40) comprises an inlet, an outlet, a cooling liquid flow channel connecting the inlet and the outlet, a housing (10) and first heat conduction components (25) and cover plates (27) arranged on two sides of the housing (10), the housing (10) is provided with a receiving groove, the first heat conduction components (25) are embedded in the receiving groove, the inlet and the outlet are arranged at two ends of the housing (10), the cooling liquid flow channel is arranged on the other side of the housing (10), the cooling liquid flow channel is provided with second turbulence fins (26) on a wall surface, the cover plates (27) are arranged on openings of the cooling liquid flow channel, and a surface of the housing (10) embedding the first heat conduction components (25) is the heat dissipation surface connected with the power device (07).

6. The liquid cooling heat sink for power devices as recited in claim 3, wherein, The liquid storage chamber (19) is provided with a support plate.

7. The liquid cooling heat sink for power devices as claimed in claim 6, wherein, The first turbulence fins adopt any one of a tooth shape, a cylindrical shape and a rectangular shape.

8. The liquid cooling heat sink for power devices as claimed in claim 3, wherein, The cooling plate (09) is further provided with heat conduction fins on a side facing the liquid storage chamber (19).

9. The liquid cooling heat sink for power devices of claim 3, wherein, The cooling plate (09) is embedded with a heat conduction plate (16) on a side away from the liquid storage chamber (19).

10. The liquid cooling heat sink for power devices of claim 3, wherein, The cooling plate (09) is embedded with a second heat conduction component (17) on a side away from the liquid storage chamber (19).

11. The liquid cooling heat sink for power devices of claim 1, wherein, Two heat-conducting bosses (41) are arranged on the heat-dissipating surface at intervals, a heat-conducting layer (05) is arranged between the circuit board (01) and the power device (07), and the heat-conducting layer (05) is installed on the two heat-conducting bosses (41) through fasteners at both ends.

12. The liquid cooling heat sink for power devices of claim 11, wherein, A first insulating layer (04) is arranged between the circuit board (01) and the heat-conducting layer (05).

13. The liquid cooling heat sink for power devices of claim 1, wherein, A second insulating layer (11) is arranged between the power device (07) and the heat-dissipating surface.

14. An on-board charger, comprising: A liquid-cooled heat-dissipating device comprising the power device according to any one of claims 1-13.

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