Scintillator panel and method for manufacturing scintillator panel

Abstract

This scintillator panel comprises: a support layer; a scintillator layer disposed on the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the scintillator layer; a release layer disposed on the adhesive layer and having releasability from the adhesive layer; and a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer, an outer edge portion of the adhesive layer, and an outer edge portion of the release layer. Through use of this scintillator panel, the scintillator layer can be attached to another member when the scintillator panel is used, and the moisture-proof properties of the scintillator layer can be sufficiently secured when the scintillator panel is not in use.

Description

Scintillator panel and method of manufacturing the same

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to scintillator panels and methods for manufacturing scintillator panels.

[0002] Patent Document 1 describes the following radiation conversion sheet as a conventional scintillator panel that converts radiation into light. In the radiation conversion sheet described in Patent Document 1, a wavelength conversion layer, an adhesive layer, and a release film are laminated in this order on a support, and the outer edges of the wavelength conversion layer, the adhesive layer, and the release film are each covered with an edge-attaching member. When using the radiation conversion sheet described in Patent Document 1, the release film is peeled off, and the radiation conversion sheet is attached to a solid-state detector via the adhesive layer.

[0003] JP 2013-217904 A

[0004] In some scintillator panels as described above, the scintillator layer contains a plurality of columnar crystals. In such cases, it is extremely important to ensure that the scintillator layer is moisture-proof when not in use.

[0005] The present disclosure aims to provide a scintillator panel that can be attached to another member when in use and that can ensure sufficient moisture resistance of the scintillator layer when not in use, and a method for manufacturing a scintillator panel.

[0006] A scintillator panel according to one aspect of the present disclosure is [1] "a scintillator panel comprising: a support layer; a scintillator layer disposed on the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the scintillator layer; a release layer disposed on the adhesive layer and having releasability relative to the adhesive layer; and a first moisture-proof layer integrally covering the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the outer edge of the release layer."

[0007] In the scintillator panel described in [1] above, the release layer is disposed on the adhesive layer and has releasability relative to the surface of the adhesive layer. This allows the scintillator panel to be attached to another component (e.g., a sensor panel) via the adhesive layer by peeling the release layer from the adhesive layer during use. Furthermore, in the scintillator panel, the first moisture-proof layer integrally covers the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the outer edge of the release layer. This prevents moisture from penetrating through the interface between the first moisture-proof layer and the outer edge of each layer, and through the interfaces between the layers, when the scintillator panel is not in use, thereby ensuring the moisture-proof properties of the scintillator layer containing multiple columnar crystals. As a result, the scintillator panel can be attached to another component during use, and the moisture-proof properties of the scintillator layer can be sufficiently ensured when not in use.

[0008] A scintillator panel according to one aspect of the present disclosure may be [2] "the scintillator panel according to the above [1], in which the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite the scintillator layer." According to the scintillator panel according to [2], the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite the scintillator layer, so that the support layer and the interface between the scintillator layer and the support layer are not exposed to the outside. This makes it possible to suppress moisture penetration through the support layer and the interface between the scintillator layer and the support layer, thereby further improving the moisture proofness of the scintillator layer.

[0009] A scintillator panel according to one aspect of the present disclosure may be [3] "the scintillator panel according to the above [1] or [2], in which the first moisture proof layer further integrally covers the surface of the release layer opposite the adhesive layer." According to the scintillator panel according to [2], the first moisture proof layer covers the surface of the release layer, and therefore, the moisture proofness of the first moisture proof layer, in addition to the moisture proofness of the release layer, can further improve the moisture proofness of the scintillator layer.

[0010] A scintillator panel according to one aspect of the present disclosure may be [4] "the scintillator panel according to the above [3], wherein the first moisture proof layer has a weakened portion in an outer edge region on the surface of the release layer opposite the adhesive layer, the weakened portion having a strength lower than that of a central region on the surface of the release layer opposite the adhesive layer." According to the scintillator panel according to [4], the first moisture proof layer has a weakened portion in an outer edge region on the surface of the release layer opposite the adhesive layer, which makes it easy to peel the release layer starting from this region.

[0011] A scintillator panel according to one aspect of the present disclosure may be [5] "the scintillator panel according to any one of [1] to [4] above, wherein the thickness of the first moisture-proof layer is 0.5 μm or more and 40 μm or less." The scintillator panel according to [5] can sufficiently ensure moisture-proof properties of the scintillator layer while preventing the scintillator panel from becoming thick.

[0012] A scintillator panel according to one aspect of the present disclosure may be [6] "the scintillator panel according to any one of [1] to [5] above, further comprising a second moisture-proof layer disposed between the scintillator layer and the adhesive layer." The scintillator panel according to [6] can more sufficiently ensure the moisture-proof properties of the scintillator layer.

[0013] A scintillator panel according to one aspect of the present disclosure may be [7] "the scintillator panel according to the above [6], in which the thickness of the second moisture barrier layer is smaller than the thickness of the first moisture barrier layer." According to the scintillator panel according to [7], scattering and attenuation of light emitted from the scintillator layer due to the presence of the second moisture barrier layer are suppressed, thereby suppressing a decrease in resolution due to the presence of the second moisture barrier layer.

[0014] A scintillator panel according to one aspect of the present disclosure may be [8] "the scintillator panel according to any one of [1] to [7] above, in which, when viewed in the thickness direction of the support layer, the outer edge of the support layer, the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the outer edge of the release layer are aligned." The scintillator panel according to [8] facilitates alignment of the scintillator panel with another member (e.g., a sensor panel) when the scintillator panel is attached to the other member.

[0015] A scintillator panel according to one aspect of the present disclosure may be [9] "the scintillator panel according to any one of the above [1] to [8], wherein the thickness of the release layer is 5 μm or more and 300 μm or less." According to the scintillator panel according to [9], the release layer can be prevented from becoming too thick while also being moisture-proof, thereby further improving the moisture-proof property of the scintillator layer.

[0016] A scintillator panel according to one aspect of the present disclosure may be

[10] "the scintillator panel according to any one of the above [1] to [9], wherein the support layer is flexible." According to the scintillator panel according to

[10] , the support layer is flexible, which makes it easy to place the scintillator panel on another member.

[0017] A manufacturing method of a scintillator panel according to one aspect of the present disclosure may be

[11] "a manufacturing method of a scintillator panel according to any one of the above [1] to

[10] , comprising: a first step of preparing a scintillator unit in which the scintillator layer, the adhesive layer, and the release layer are laminated in this order on the support layer; and a second step of integrally covering, with the first moisture-proof layer, the outer edge of the scintillator layer, the outer edge of the adhesive layer, the outer edge of the release layer, and a surface of the release layer opposite the adhesive layer." The manufacturing method of a scintillator panel according to

[11] can provide a scintillator panel that can be attached to another member when in use and that ensures sufficient moisture-proofing of the scintillator layer when not in use.

[0018] A manufacturing method for a scintillator panel according to one aspect of the present disclosure may be

[12] "the manufacturing method described in

[11] above, in which, in the first step, the scintillator unit of a predetermined size is prepared by cutting the support layer, the scintillator layer, the adhesive layer, and the release layer." According to the manufacturing method for a scintillator panel described in

[12] , for example, a large-area laminate composed of a support layer, a scintillator layer, an adhesive layer, and a release layer is produced, and then multiple smaller scintillator units of a predetermined size and shape can be obtained. Each of the multiple scintillator panels manufactured from the multiple scintillator units can be attached to another member when in use, and the moisture resistance of the scintillator layer can be sufficiently ensured when not in use.

[0019] According to the present disclosure, it is possible to provide a scintillator panel and a method for manufacturing a scintillator panel that can be attached to other components when in use and that can ensure sufficient moisture resistance of the scintillator layer when not in use.

[0020] FIG. 1 is a cross-sectional view of a scintillator panel of one embodiment. FIG. 2 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. 1. FIG. 3 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 1. FIG. 4 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 1. FIG. 5 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 1. FIG. 6 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 1. FIG. 7 is a diagram showing a method for manufacturing the radiation detector shown in FIG. 2. FIG. 8 is a cross-sectional view of a radiation detector of a modified example. FIG. 9 is a cross-sectional view of a scintillator panel of a modified example. FIG. 10 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. 9. FIG. 11 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 9. FIG. 12 is a diagram showing a method for manufacturing the scintillator panel shown in FIG. 9. FIG. 13 is a diagram showing a method for manufacturing the radiation detector shown in FIG. 10. FIG. 14 is a cross-sectional view of a scintillator panel of a modified example. FIG. 15 is a cross-sectional view of a scintillator panel of a modified example. FIG. 16 is a plan view of the scintillator panel shown in FIG. 15.

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted. [Configuration of scintillator panel]

[0022] As shown in FIG. 1 , the scintillator panel 1 includes a scintillator unit 2 and a first moisture-proof layer 3. The first moisture-proof layer 3 covers the scintillator unit 2. The scintillator unit 2 includes a support layer 4, a scintillator layer 5, an adhesive layer 6, a release layer 7, and a second moisture-proof layer 8. The scintillator layer 5 is disposed on the support layer 4. The adhesive layer 6 is disposed on the scintillator layer 5. The release layer 7 is disposed on the adhesive layer 6. In other words, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 are stacked on the support layer 4 in this order in the thickness direction of the support layer 4 (hereinafter referred to as "direction A"). In other words, the second moisture-proof layer 8 is disposed between the scintillator layer 5 and the adhesive layer 6. When viewed from direction A, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. That is, the outer edges 4a, 5a, 8a, 6a, and 7a are flush with each other.

[0023] The first moisture-proof layer 3 integrally covers the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, the surface 7b of the release layer 7, and the surface 4b of the support layer 4. The surface 7b of the release layer 7 is the surface of the release layer 7 opposite the adhesive layer 6. The surface 4b of the support layer 4 is the surface of the support layer 4 opposite the scintillator layer 5. That is, the first moisture-proof layer 3 integrally covers the scintillator unit 2 continuously and seamlessly. Therefore, in the scintillator panel 1, the interfaces between the first moisture-proof layer 3 and each layer are not exposed to the outside. The first moisture-proof layer 3 has the function of preventing moisture from penetrating into the scintillator unit 2 from the outside. In the scintillator panel 1, the thickness of the first moisture-proof layer 3 is uniform over the entire surface of the scintillator unit 2 and is 0.5 μm or more and 40 μm or less. The material of the first moisture-proof layer 3 is, for example, parylene (polyparaxylene).

[0024] The support layer 4 includes a first support layer 401 and a second support layer 402. The second support layer 402 is disposed on the first support layer 401, positioned on the scintillator layer 5 side of the first support layer 401. The outer edge of the first support layer 401 and the outer edge of the second support layer 402 form the outer edge 41 of the support layer 4. When viewed from direction A, the outer edge of the first support layer 401 and the outer edge of the second support layer 402 are aligned.

[0025] The first support layer 401 has the function of preventing moisture from entering the scintillator unit 2 from the outside and preventing light from entering the scintillator unit 2 from the outside. The material of the first support layer 401 is, for example, a composite material combining a resin material and a metal material. As an example, the material of the first support layer 401 is a composite material of PET (polyethylene terephthalate) and Al. The resin material contained in the first support layer 401 may be PEN (polyethylene naphthalate), PI (polyimide), PP (polypropylene), PE (polyethylene), PU (polyurethane), PMMA (polymethyl methacrylate), etc. The metal material contained in the first support layer 401 may be Cu, Ti, Fe, SUS (stainless steel), etc.

[0026] The second support layer 402 has a function of reflecting light emitted from the scintillator layer 5 in response to incidence of radiation (e.g., X-rays). The material of the second support layer 402 is, for example, a composite material in which a resin material and a white inorganic material are combined. As an example, the material of the second support layer 402 is a composite material of PET and a white inorganic material. In addition to PET, the resin material may be, for example, PEN, PI, PP, PE, PU, ​​PMMA, etc. The white inorganic material may be, for example, TiO ２ , ZnO, LAS (lithium aluminum silicate), etc.

[0027] The thickness of the first support layer 401 is, for example, 30 μm or more and 250 μm or less. The thickness of the second support layer 402 is, for example, 10 μm or more and 250 μm or less. The support layer 4 is flexible. The support layer 4 can be bent to have a radius of curvature of, for example, 30 mm or more and 120 mm or less.

[0028] The scintillator layer 5 is disposed on the surface of the second support layer 402 opposite to the first support layer 401. The scintillator layer 5 includes a plurality of columnar crystals 50. The columnar crystals 50 are aligned along a plane perpendicular to direction A. Each columnar crystal 50 extends in direction A and has a substantially uniform height (thickness) over the entire region. Each columnar crystal 50 includes a first end 50a on the side opposite to the support layer 4 and a second end 50b on the support layer 4 side. Each first end 50a tapers toward the side opposite to the support layer 4. Examples of the material for scintillator layer 5 include CsI:Tl (cesium iodide containing thallium as an activator), CsI:Na (cesium iodide containing sodium as an activator), CsI:Ce (cesium iodide containing cerium as an activator), CsI:Tl,Eu (cesium iodide containing thallium and europium as activators), etc. The thickness of scintillator layer 5 is, for example, 50 μm or more and 1000 μm or less (preferably, 100 μm or more and 300 μm or less when resolution is required, and 400 μm or more and 700 μm or less when sensitivity is required).

[0029] The second moisture-proof layer 8 covers the first end portions 50a. The second moisture-proof layer 8 has the function of preventing moisture from migrating from the adhesive layer 6 to the scintillator layer 5, even if the adhesive layer 6 absorbs moisture. The second moisture-proof layer 8 is made of, for example, parylene (polyparaxylene). The thickness of the second moisture-proof layer 8 is smaller than the thickness of the first moisture-proof layer 3. The thickness of the second moisture-proof layer 8 is, for example, half or less of the thickness of the first moisture-proof layer 3. Here, the thickness of the second moisture-proof layer 8 refers to, for example, the distance between the plane and the surface 8b of the second moisture-proof layer 8 opposite the scintillator layer 5 when the tips of the first end portions 50a are aligned along the plane. The thickness of the second moisture-proof layer 8 is, for example, 0.5 μm or more and 40 μm or less.

[0030] The adhesive layer 6 is disposed on the second moisture-proof layer 8. The adhesive layer 6 is in contact with the surface 8b of the second moisture-proof layer 8. The adhesive layer 6 functions as an adhesive layer for bonding the scintillator panel 1 to the sensor panel 11. The material of the adhesive layer 6 is an organic material having optical transparency, such as OCA (Optical Clear Adhesive). The thickness of the adhesive layer 6 is, for example, 0.5 μm or more and 50 μm or less.

[0031] The release layer 7 is in contact with the surface 6b of the adhesive layer 6 opposite the scintillator layer 5. The release layer 7 has releasability relative to the surface 6b of the adhesive layer 6. The release layer 7 is, for example, a release film and can be easily peeled off from the surface 6b. The release layer 7 is peeled off from the surface 6b of the adhesive layer 6 when the scintillator panel 1 is in use. The release layer 7 protects the adhesiveness of the adhesive layer 6 and prevents unwanted substances from adhering to the adhesive layer 6 when the scintillator panel 1 is not in use. The material of the release layer 7 is, for example, PET, PE, PP, etc. The surface of the release layer 7 facing the adhesive layer 6 may be coated with a silicone-based release agent. This allows the release layer 7 to be easily peeled off from the surface 6b of the adhesive layer 6. The first moisture-proof layer 3 has a peel trigger 32 (weak portion) in the outer edge region 3a of the release layer 7 on the surface 7b opposite the adhesive layer 6 to facilitate peeling by the user. The peel trigger 32 has a lower strength in the outer edge region 3a than in the central region 3b on the surface 7b side of the release layer 7. For example, in a scintillator panel 1 that is rectangular when viewed from direction A, the peel trigger 32 may be provided at at least one of the four corners on the surface 7b side of the first moisture barrier layer 3. As shown in FIG. 1 , the peel trigger 32 may be a notch provided at a corner of the first moisture barrier layer 3. Alternatively, the peel trigger 32 may be a notch provided around the entire periphery of the outer edge region 3a including the corner of the first moisture barrier layer 3, a notch provided in a direction parallel to the surface 7b of the release layer 7, or a notch provided in a direction parallel to the outer edge 7a of the release layer 7 in direction A (a direction perpendicular to the surface 7b). The thickness of the release layer 7 is 5 μm or more and 300 μm or less. [Configuration of the Radiation Detector]

[0032] As shown in FIG. 2 , the radiation detector 10 includes the scintillator panel 1 described above and a sensor panel 11. The sensor panel 11 has a light-receiving surface 11a. The scintillator panel 1 is disposed on the light-receiving surface 11a with the scintillator layer 5 positioned on the sensor panel 11 side with respect to the support layer 4. The scintillator panel 1 is adhered to the sensor panel 11 by an adhesive layer 6. A plurality of photoelectric conversion elements (not shown) are provided on the sensor panel 11 along the light-receiving surface 11a. Each photoelectric conversion element forms a pixel and outputs an electrical signal in response to incident light. In the radiation detector 10, light emitted from the scintillator layer 5 of the scintillator panel 1 in response to incident radiation is detected by the sensor panel 11. The radiation detector 10 is used as a radiation imaging device, for example, in a medical radiation image diagnostic device, a non-destructive testing device, etc.

[0033] The radiation detector 10 is manufactured by peeling the release layer 7 from the adhesive layer 6, removing the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7, and then attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6. When the scintillator panel 1 is adhered to the sensor panel 11, the edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side includes an inner portion 311. The inner portion 311 is a portion that is located between the sensor panel 11 and the adhesive layer 6, on the inner side of the outer edge 61 of the adhesive layer 6. The inner portion 311 may be a portion where the edge 31 is folded back on the inner side of the outer edge 61 of the adhesive layer 6. The inner portion 311 covers the surface 6b of the adhesive layer 6 and also covers the light-receiving surface 11a of the sensor panel 11, on the inner side of the outer edge 61 of the adhesive layer 6. In other words, the inner portion 311 is disposed at the outer edge 61 of the adhesive layer 6 between the surface 6 b of the adhesive layer 6 and the light receiving surface 11 a of the sensor panel 11 .

[0034] The width D1 of the inner portion 311 varies along the outer edge 6a of the adhesive layer 6. Here, the width D1 of the inner portion 311 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D1 is 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less. When the width D1 varies, the width D1 being 5 μm or more and 200 μm or less means that the maximum and minimum values ​​of the width D1 are within the range of 5 μm or more and 200 μm or less.

[0035] The radiation detector 10 further includes a sealing member 12. The sealing member 12 extends in a frame shape in a region of the surface of the sensor panel 11 that surrounds the light receiving surface 11a, and covers the side surfaces of the scintillator panel 1. The sealing member 12 has the function of preventing moisture from penetrating through the interface between the first moisture-proof layer 3 and the sensor panel 11. The material of the sealing member 12 is, for example, epoxy, silicone, fluorine, urethane, acrylic, etc. The material of the sealing member 12 may contain a filler material made of an inorganic material such as glass. [Method of Manufacturing Scintillator Panel]

[0036] A method for manufacturing the scintillator panel 1 described above will be described. First, as shown in FIG. 3A, a second support layer 402 bonded to a carrier substrate 13 is prepared. The carrier substrate 13 and the second support layer 402 may be bonded together using an adhesive or double-sided tape. The material of the carrier substrate 13 is, for example, a glass substrate. To improve smoothness and releasability, the surface of the carrier substrate 13 may be coated with a release agent. The thickness of the carrier substrate 13 is, for example, 0.1 mm or more and 1.5 mm or less. Next, as shown in FIG. 3B, a scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. In this embodiment, the scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. As a result, in the plurality of columnar crystals 50, the plurality of second end portions 50b are located on the second support layer 402 side, and the plurality of first end portions 50a are located on the opposite side of the second support layer 402. An example of a vapor phase deposition method other than the vapor deposition method is the sputtering method.

[0037] Next, as shown in (a) of FIG. 4, the carrier substrate 13, the second support layer 402, and the scintillator layer 5 are covered with the second moisture-proof layer 8. In the example of (a) of FIG. 4, the surface of the carrier substrate 13 opposite the second support layer 402, both ends of the carrier substrate 13, both ends of the second support layer 402, both ends of the scintillator layer 5, and the plurality of first end portions 50a of the scintillator layer 5 are integrally covered with the second moisture-proof layer 8. Next, as shown in (b) of FIG. 4, the carrier substrate 13 is removed from the second support layer 402. In the example of (b) of FIG. 4, the portions of the second moisture-proof layer 8 that covered the surface of the carrier substrate 13 and the portions that covered both ends of the carrier substrate 13 are removed together with the carrier substrate 13. As a result, the surface of the second support layer 402 opposite the scintillator layer 5 is exposed to the outside.

[0038] Next, as shown in FIG. 5A , a first support layer 401 is bonded to the surface of the second support layer 402 opposite the scintillator layer 5. An adhesive layer 6 is prepared with a release layer 7 bonded to its surface 6b, and the adhesive layer 6 is placed on the scintillator layer 5 via a second moisture-proof layer 8. In the example of FIG. 5A , a surface 6c of the adhesive layer 6 opposite the release layer 7 is bonded to a surface 8b of the second moisture-proof layer 8. Next, as shown in FIG. 5B , the first support layer 401, the second support layer 402, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 are cut to a predetermined size in direction A. For example, a laminate composed of the support layer 4, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the release layer 7 is cut from the state shown in FIG. 5A to obtain a plurality of scintillator units 2 having the same dimensions and shapes (e.g., rectangular). Alternatively, for example, a single scintillator unit 2 may be obtained by cutting the respective ends of the support layer 4, scintillator layer 5, second moisture-proof layer 8, adhesive layer 6, and release layer 7. As a result, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. These outer edges then constitute the outer edge of the scintillator unit 2. Note that a blade whose tip gradually decreases in thickness in direction A may be used as the cutting blade. When cut with such a blade, the outer edge of the scintillator unit 2 may gradually increase in direction A. The manufacturing steps described above in FIGS. 4A to 5B correspond to the first step of preparing the scintillator unit 2, and the cutting step described in FIG. 5B is included in the first step.

[0039] 6 , the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, the outer edge 81 of the second moisture-proof layer 8, and the surface 7b of the release layer 7 opposite to the adhesive layer 6 are covered integrally with the first moisture-proof layer 3 (second step of covering integrally with the first moisture-proof layer 3). As a result, the entire surface of the scintillator unit 2 is completely surrounded by the first moisture-proof layer 3. As a result, the interfaces between the layers of the scintillator unit 2 and the interfaces between the layers and the first moisture-proof layer 3 are covered by the first moisture-proof layer 3 and are not exposed to the outside. In this way, the scintillator panel 1 is manufactured. [Method of Manufacturing a Radiation Detector]

[0040] A method for manufacturing the radiation detector 10 described above will be described. First, as shown in FIG. 7A , the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 is removed together with the release layer 7 (a step of removing the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 together with the release layer 7). Because the release layer 7 has releasability with respect to the surface 6b of the adhesive layer 6, the release layer 7 is easily peeled off from the surface 6b. If a peeling trigger is provided at a corner of the release layer 7, the user may grasp the peeling trigger and peel off the release layer 7. When the release layer 7 is peeled off, the surface 6b is exposed to the outside.

[0041] As a result of the portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7 being removed together with the release layer 7, the portion of the first moisture-proof layer 3 that covered the outer edge 71 of the release layer 7 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. This protruding portion becomes the edge 31 of the first moisture-proof layer 3. At this time, burrs are formed on the edge 31. For example, the end surface 31a of the edge 31 has an irregular uneven shape (e.g., a sawtooth shape) when viewed from the thickness direction of the first moisture-proof layer 3.

[0042] 7(b), the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 (step of attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6). At this time, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 in a state in which the edge portion 31 of the first moisture-proof layer 3 protrudes from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. As a result, the edge portion 31 includes a portion that is folded inward relative to the outer edge portion 61 of the adhesive layer 6. This results in the edge portion 31 including an inner portion 311.

[0043] Finally, as shown in Fig. 2, the side surfaces of the scintillator panel 1 are covered with the sealing member 12. In this manner, the radiation detector 10 is manufactured.

[0044] In the scintillator panel 1, the release layer 7 is disposed on the scintillator layer 5 in the adhesive layer 6 and has releasability relative to the surface 6b of the adhesive layer 6. As a result, when using the scintillator panel 1, the release layer 7 having releasability can be peeled off from the adhesive layer 6, and the scintillator panel 1 can be attached to another member (e.g., a sensor panel 11) via the adhesive layer 6. Furthermore, in the scintillator panel 1, the first moisture-proof layer 3 integrally covers the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, and the outer edge 71 of the release layer 7. As a result, when the scintillator panel 1 is not in use, it is possible to prevent moisture from penetrating through the interface between the first moisture-proof layer 3 and the outer edge of each layer, and through the interface between each layer, thereby ensuring the moisture-proof properties of the scintillator layer 5 including the plurality of columnar crystals 50. In addition, the outer edge 61 of the adhesive layer 6 and the outer edge 71 of the release layer 7 are integrally covered by the first moisture-proof layer 3, which makes it possible to suppress deterioration of the adhesive layer 6 and the release layer 7 and unintentional peeling of the release layer 7 (for example, peeling of the release layer 7 from the outer edge 71 when the scintillator panel 1 is not in use). As described above, the scintillator panel 1 can be attached to another member when in use, and can ensure sufficient moisture-proof properties of the scintillator layer 5 when not in use.

[0045] The first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite to the scintillator layer 5. With this, the first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite to the scintillator layer 5, so that the support layer 4 and the interface between the scintillator layer 5 and the support layer 4 are not exposed to the outside. This makes it possible to suppress moisture penetration from the support layer 4 and the interface between the scintillator layer 5 and the support layer 4, and further improve the moisture-proof property of the scintillator layer 5.

[0046] The first moisture-proof layer 3 further integrally covers the surface 7b of the release layer 7 opposite to the adhesive layer 6. In this way, the first moisture-proof layer 3 covers up to the surface 7b of the release layer 7, and therefore the moisture-proof property of the first moisture-proof layer 3 in addition to the moisture-proof property of the release layer 7 can further improve the moisture-proof property of the scintillator layer 5.

[0047] The first moisture-proof layer 3 has a peel trigger 32 (weak portion) in an outer peripheral region 3a on the surface 7b of the release layer 7 opposite the adhesive layer 6, the peel trigger 32 having a strength weaker than that of the central region 3b of the surface 7b of the release layer 7 opposite the adhesive layer 6. Thus, the first moisture-proof layer 3 has the peel trigger 32 in the outer peripheral region 3a, which makes it easy to peel the release layer 7 starting from the outer peripheral region 3a.

[0048] The thickness of the first moisture-proof layer 3 is 0.5 μm or more and 40 μm or less. This makes it possible to prevent the thickness of the scintillator panel 1 from increasing, while ensuring sufficient moisture-proofness of the scintillator layer 5.

[0049] The scintillator panel 1 further includes a second moisture-proof layer 8 disposed between the scintillator layer 5 and the adhesive layer 6. This ensures more sufficient moisture-proof properties of the scintillator layer 5. Furthermore, because the adhesive layer 6 does not come into direct contact with the scintillator layer 5, damage to the tips of the first ends 50 a of the columnar crystals 50 can be prevented when the adhesive layer 6 and the release layer 7 are bonded together. In this case, because the second moisture-proof layer 8 is harder (has greater hardness) than the adhesive layer 6, the second moisture-proof layer 8 protects the tips of the first ends 50 a, while the cushioning properties of the adhesive layer 6 reduce the force applied to the tips of the first ends 50 a during bonding.

[0050] The thickness of the second moisture barrier layer 8 is smaller than the thickness of the first moisture barrier layer 3. This suppresses scattering and attenuation of light emitted from the scintillator layer due to the presence of the second moisture barrier layer 8, thereby suppressing a decrease in resolution due to the presence of the second moisture barrier layer 8.

[0051] When viewed in the thickness direction (direction A) of the support layer 4, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are all aligned. This makes it easy to align the scintillator panel 1 with another member (e.g., a sensor panel 11) when attaching the scintillator panel 1 to that other member. Furthermore, because the side surfaces of the scintillator panel 1 are flat, thickness variations are less likely to occur when the first moisture-proof layer 3 is formed, allowing for the formation of a first moisture-proof layer 3 with higher moisture resistance.

[0052] The thickness of the release layer 7 is 5 μm or more and 300 μm or less. This makes it possible to prevent the release layer 7 from becoming too thick while also providing the release layer 7 with moisture resistance, thereby further improving the moisture resistance of the scintillator layer 5.

[0053] The support layer 4 has flexibility. In this way, the flexibility of the support layer 4 makes it easy to arrange the scintillator panel 1 on another member.

[0054] The method for manufacturing scintillator panel 1 includes the steps of preparing scintillator unit 2 in which scintillator layer 5, adhesive layer 6, and release layer 7 are laminated in this order on support layer 4, and covering outer edge 51 of scintillator layer 5, outer edge 61 of adhesive layer 6, outer edge 71 of release layer 7, and surface 7b of release layer 7 integrally with first moisture-proof layer 3. According to the above manufacturing method, it is possible to obtain scintillator panel 1 that can be attached to another member when in use and that ensures sufficient moisture-proofing of scintillator layer 5 when not in use.

[0055] In the first step of the method for manufacturing a scintillator panel 1, the support layer 4, scintillator layer 5, adhesive layer 6, and release layer 7 are cut to a predetermined size to manufacture a plurality of scintillator units 2. According to the above manufacturing method, for example, a large-area laminate composed of a support layer, scintillator layer, adhesive layer, and release layer is produced, and then a plurality of smaller scintillator units 2 can be obtained in a predetermined size and shape. Each of the plurality of scintillator panels 1 manufactured from the plurality of scintillator units 2 can be attached to another member when in use, and the moisture resistance of the scintillator layer 5 can be sufficiently ensured when not in use. [Modification]

[0056] The present disclosure is not limited to the above-described embodiment. As shown in Fig. 8 , when the scintillator panel 1 is adhered to the sensor panel 11, the edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side may include an outer portion 312 instead of the inner portion 311. The outer portion 312 is a portion disposed on the sensor panel 11 outside the outer edge 61 of the adhesive layer 6. The outer portion 312 may be a portion in which the edge 31 is folded back outside the outer edge 61 of the adhesive layer 6. In the example of Fig. 8 , the outer portion 312 covers the light receiving surface 11a of the sensor panel 11 outside the outer edge 61 of the adhesive layer 6. The outer portion 312 is disposed in a region on the light receiving surface 11a of the sensor panel 11 between the outer edge 1a of the scintillator panel 1 and the outer edge 11b of the sensor panel 11.

[0057] The width D2 of the outer portion 312 varies along the outer edge 6a of the adhesive layer 6. Here, the width D2 of the outer portion 312 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D2 is 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less. When the width D2 varies, the width D2 being 5 μm or more and 200 μm or less means that the maximum and minimum values ​​of the width D2 are within the range of 5 μm or more and 200 μm or less.

[0058] In the manufacturing method for the radiation detector 10 including the outer portion 312, similar to the radiation detector 10 including the inner portion 311, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 in a state in which the edge portion 31 of the first moisture proof layer 3 protrudes from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. As a result, the edge portion 31 includes a portion that is folded back outward from the outer edge portion 61 of the adhesive layer 6. This results in the edge portion 31 including the outer portion 312.

[0059] The edge portion 31 may include the inner portion 311 or the outer portion 312, or may include both the inner portion 311 and the outer portion 312. In other words, the edge portion 31 may include at least one of the inner portion 311 and the outer portion 312.

[0060] 9 , the scintillator panel 1A does not necessarily have to include the second moisture proof layer 8. The scintillator panel 1A differs from the scintillator panel 1 in that the second moisture proof layer 8 is not disposed between the scintillator layer 5 and the adhesive layer 6. In the scintillator panel 1A, the adhesive layer 6 is in contact with and covers the first end portions 50 a. In the scintillator panel 1A, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, and the surface 7 b of the release layer 7 opposite to the adhesive layer 6 are integrally covered by the first moisture proof layer 3.

[0061] 10 , in a radiation detector 10A including a scintillator panel 1A, the distance between the plane including the multiple tips of the multiple first ends 50a and the sensor panel 11 is smaller than in the radiation detector 10. This reduces scattering and attenuation of light converted in the scintillator layer 5 in the radiation detector 10A, and makes it possible to suppress a decrease in resolution due to the presence of the second moisture-proof layer 8. Note that even in this case, it is sufficient that the edge portion 31 includes at least one of the inner portion 311 and the outer portion 312.

[0062] Next, a method for manufacturing the scintillator panel 1A will be described. First, as in the scintillator panel 1, as shown in FIGS. 3A and 3B, a scintillator layer 5 is formed on a second support layer 402 bonded to a carrier substrate 13. Next, as shown in FIG. 11A, the carrier substrate 13 is removed from the second support layer 402. Then, as shown in FIG. 11B, a first support layer 401 is bonded to the surface of the second support layer 402 opposite the scintillator layer 5. At the same time, the surface of the adhesive layer 6 opposite the release layer 7 is directly bonded to the plurality of first end portions 50a of the scintillator layer 5. Next, as shown in FIG. 12A, the first support layer 401, the second support layer 402, the scintillator layer 5, the adhesive layer 6, and the release layer 7 are cut to a predetermined size in direction A. For example, a laminate composed of a support layer 4, a scintillator layer 5, an adhesive layer 6, and a release layer 7 is cut from the state shown in FIG. 11B to obtain multiple scintillator units 2A of the same size and shape (e.g., rectangular). Alternatively, for example, a single scintillator unit 2A may be obtained by cutting the ends of each of the support layer 4, the scintillator layer 5, the adhesive layer 6, and the release layer 7. As a result, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. Next, as shown in FIG. 12B, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, and the surface 7b of the release layer 7 opposite the adhesive layer 6 are integrally covered with the first moisture-proof layer 3.

[0063] Next, a method for manufacturing the radiation detector 10A will be described. As with the radiation detector 10, as shown in (a) of Fig. 13 , the portion of the first moisture barrier layer 3 covering the surface 7b of the release layer 7 is removed together with the release layer 7. Next, as shown in (b) of Fig. 13 , the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6, with the edge portion 31 of the first moisture barrier layer 3 protruding from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. This results in the edge portion 31 including at least one of the inner portion 311 and the outer portion 312. Finally, as shown in Fig. 10 , the side surface of the scintillator panel 1A is covered with the sealing member 12.

[0064] The peel trigger included in the first moisture-proof layer 3 does not have to be a notch. As shown in FIG. 14 , the peel trigger 32A may be a portion where at least one of the four corners on the surface 7b of the first moisture-proof layer 3 has been rounded off. The peel trigger 32A may be a portion where a corner of the first moisture-proof layer 3 has been scraped off with a polishing member. The polishing member is, for example, a blade such as a hand lapper or a cutter. A hand lapper is a brush-like tool with a grinding stone at the tip. Alternatively, the peel trigger 32A may be a portion where a corner of the first moisture-proof layer 3 has been scraped off by laser processing. The peel trigger 32A may be provided around the entire periphery 3a of the first moisture-proof layer 3, including the corners.

[0065] The first moisture-proof layer 3 does not have to cover the surface 7b of the release layer 7 opposite the scintillator layer 5. As shown in FIG. 15 , the first moisture-proof layer 3 may integrally cover the surface 4b of the support layer 4 opposite the scintillator layer 5, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, and the outer edge 71 of the release layer 7. The end face 31a of the edge 31 on the sensor panel 11 side of the first moisture-proof layer 3 may be flush with the surface 7b. In this case, the surface 7b and the end face 31a are exposed to the outside. Furthermore, the peel trigger may not be included in the first moisture-proof layer 3, but may be a tape attached to the surface 7b as a peel trigger 72 for the release layer 7. 16 , the peeling trigger 72 may be attached to the surface 7b at at least one of the four corners of the first moisture-proof layer 3 so as to face the center of the surface 7b. The number of peeling triggers 72 is not limited to one, and there may be more than one. The peeling trigger 72 may be provided on at least one of the four sides of the first moisture-proof layer 3.

[0066] In the scintillator panel 1, the thickness of the first moisture-proof layer 3 may be less than 0.5 μm or more than 40 μm. The thickness of the first moisture-proof layer 3 may not be uniform across the entire surface of the scintillator unit 2, but may vary. The thickness of the release layer 7 may be less than 5 μm or more than 200 μm. The width D1 of the inner portion 311 and the width D2 of the outer portion 312 may each be less than 5 μm or more than 200 μm. The widths D1 and D2 may each be constant along the outer edge 6 a of the adhesive layer 6. Even when the widths D1 and D2 are constant, each of the widths D1 and D2 is preferably 5 μm or more and 200 μm or less, but may be less than 5 μm or more than 200 μm. The second support layer 402 may have the function of absorbing light emitted from the scintillator layer 5 in response to incident radiation (e.g., X-rays). In this case, for example, the material of the second support layer 402 is a composite material of PET and a black inorganic material, such as carbon black or iron oxide.

[0067] 1, 1A...scintillator panel, 2, 2A...scintillator unit, 3...first moisture-proof layer, 32...peeling trigger (weak part), 3a...outer edge region, 3b...central region, 4...support layer, 41...outer edge of support layer, 4a...outer edge of support layer, 4b...surface of support layer, 5...scintillator layer, 50...columnar crystals, 51...outer edge of scintillator layer, 5a...outer edge of scintillator layer, 6...adhesive layer, 61...outer edge of adhesive layer, 6a...outer edge of adhesive layer, 6b...surface of adhesive layer, 7...peeling layer, 71...outer edge of peeling layer, 7a...outer edge of peeling layer, 7b...surface of peeling layer, 8...second moisture-proof layer, A...direction.

Claims

1. A scintillator panel comprising: a support layer; a scintillator layer disposed on the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the scintillator layer; a release layer disposed on the adhesive layer and having releasability relative to the adhesive layer; and a first moisture-proof layer integrally covering the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the outer edge of the release layer.

2. The scintillator panel according to claim 1, wherein the first moisture-proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite to the scintillator layer.

3. A scintillator panel according to claim 1 or 2, wherein the first moisture-proof layer further integrally covers the surface of the release layer opposite the adhesive layer.

4. A scintillator panel as described in claim 3, wherein the first moisture-proof layer has a weak portion in the outer edge region of the surface side of the peeling layer opposite the adhesive layer that is weaker than the central region of the surface side of the peeling layer opposite the adhesive layer.

5. A scintillator panel according to any one of claims 1 to 4, wherein the thickness of the first moisture-proof layer is 0.5 μm or more and 40 μm or less.

6. The scintillator panel according to any one of claims 1 to 5, further comprising a second moisture-proof layer disposed between the scintillator layer and the adhesive layer.

7. The scintillator panel according to claim 6, wherein the thickness of the second moisture-proof layer is smaller than the thickness of the first moisture-proof layer.

8. A scintillator panel according to any one of claims 1 to 7, wherein when viewed in the thickness direction of the support layer, the outer edge of the support layer, the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the outer edge of the release layer are aligned.

9. The scintillator panel according to any one of claims 1 to 8, wherein the thickness of the release layer is 5 μm or more and 300 μm or less.

10. The scintillator panel according to any one of claims 1 to 9, wherein the support layer is flexible.

11. A method for manufacturing a scintillator panel as defined in any one of claims 1 to 10, comprising: a first step of preparing a scintillator unit in which the scintillator layer, the adhesive layer, and the release layer are laminated in this order on the support layer; and a second step of integrally covering the outer edge of the scintillator layer, the outer edge of the adhesive layer, the outer edge of the release layer, and the surface of the release layer opposite the adhesive layer with the first moisture-proof layer.

12. A method for manufacturing a scintillator panel as described in claim 11, wherein in the first step, the scintillator unit of a predetermined size is prepared by cutting the support layer, the scintillator layer, the adhesive layer, and the release layer.

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