Double-sided packaged LED vehicle lamp light source for vehicle lamps

Abstract

A double-sided packaged LED vehicle lamp light source for vehicle lamps, the double-sided packaged LED vehicle lamp light source comprising a thermally conductive insulating substrate (1). Copper foil trace covering layers (102) are symmetrically laid on two sides of the thermally conductive insulating substrate (1), and an LED chip (2) is mounted on one side of each copper foil trace covering layer (102). The outer side of each LED chip (2) is covered with a fluorescent ceramic film (3) and a silicone coating (4) in sequence from inside to outside. By means of using the thermally conductive insulating substrate (1) made of a ceramic material, there is no need to add an insulating layer, and the advantages of lower thermal resistance and a better thermal conduction effect are achieved; and by means of directly packaging the LED chips (2) on the thermally conductive insulating substrate (1) having a thickness of 0.4-0.5 mm, LED light-emitting points on two sides are closer; therefore, a light-emitting center of a filament is better simulated, the luminous efficiency is better than that of a surface-mount device approach, surface-mount device processes are reduced, and the precision is higher.

Description

A double-sided encapsulated LED automotive light source for vehicle lights Technical Field

[0001] This invention belongs to the field of automotive light source technology, and more specifically, relates to a double-sided encapsulated LED automotive light source for vehicle lights. Background Technology

[0002] Traditional automotive headlight bulbs use halogen lamps, with the filament located at the focal point of the headlight reflector. LEDs, as alternative light sources, often employ strip-shaped light sources to approximate the optical effect of halogen filaments. The strip-shaped light source's length must also be close to the filament's length to achieve a beam pattern that meets automotive standards. Since filaments emit light in a 360-degree arc, while LEDs are planar light sources, a single substrate with one LED mounted on each side is used to more closely mimic the filament's light-emitting effect.

[0003] Existing LED light source chips typically use copper substrates. However, due to the higher power of automotive light sources, copper substrates are generally used. But copper has high conductivity, requiring an insulating layer on the copper substrate before etching the pads and traces to accommodate the necessary pads and traces for the LED light source. This additional insulating layer increases thermal resistance, impacting heat dissipation. Therefore, this paper researches and improves upon existing structures and shortcomings, providing a double-sided packaged LED automotive light source for greater practical value. Technical issues

[0004] To solve the above-mentioned technical problems, the present invention provides a double-sided encapsulated LED automotive light source for vehicle lights, achieved by the following specific technical means:

[0005] A double-sided encapsulated LED automotive light source for vehicle lights includes a thermally conductive insulating substrate. Copper foil trace cover layers are symmetrically laid on both sides of the thermally conductive insulating substrate, and an LED chip is mounted on one side of each copper foil trace cover layer. The outer side of each LED chip is sequentially covered with a fluorescent ceramic film and a silicone coating from the inside out.

[0006] Furthermore, the thermally conductive insulating substrate is a ceramic substrate.

[0007] Furthermore, the fluorescent ceramic film is encapsulated inside a silicone coating, and the silicone coating is connected to the copper foil trace cover layer.

[0008] Furthermore, a thermally conductive silver plating layer is provided on the surface of the thermally conductive insulating substrate.

[0009] Furthermore, two sets of pads are provided at one end of the copper foil trace cover layer, which are the positive and negative electrodes, respectively.

[0010] Furthermore, the thickness of the thermally conductive insulating substrate is 0.4–0.5 mm.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. This invention uses a ceramic thermally conductive insulating substrate, eliminating the need for an additional insulating layer, and has the advantages of lower thermal resistance and better thermal conductivity;

[0013] 2. By directly encapsulating the LED chip on a thermally conductive insulating substrate with a thickness of 0.4 to 0.5 mm, the distance between the LED light-emitting points on both sides is closer, thus more closely simulating the light-emitting center of the filament. The light output efficiency is better than that of the surface mount method, and the surface mount process is reduced, resulting in higher precision. Attached Figure Description

[0014] Figure 1 is a schematic diagram of the insertion of the structure of the present invention.

[0015] Figure 2 is a schematic diagram of the overall assembly of the present invention.

[0016] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0017] 1. Thermally conductive insulating substrate; 2. LED chip; 3. Fluorescent ceramic film; 4. Silicone coating;

[0018] 101. Thermally conductive silver plating layer; 102. Copper foil trace cover layer; 103. Solder pad. Detailed Implementation

[0019] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0020] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Example:

[0022] As shown in Figures 1 and 2:

[0023] The present invention provides a double-sided encapsulated LED automotive light source for automotive lights, including a thermally conductive insulating substrate 1, wherein copper foil trace cover layers 102 are symmetrically laid on both sides of the thermally conductive insulating substrate 1, and an LED chip 2 is installed on one side of each copper foil trace cover layer 102; the outer side of the LED chip 2 is covered with a fluorescent ceramic film 3 and a silicone coating 4 in sequence from the inside to the outside.

[0024] Among them, the thermally conductive insulating substrate 1 is a ceramic substrate. Ceramic itself is insulating and has better thermal conductivity than copper, so it is a better light source carrier. Moreover, there is no need to add an additional insulating layer, and copper can be directly laid to make pads and circuits.

[0025] The fluorescent ceramic film 3 is encapsulated inside the silicone coating 4, and the silicone coating 4 is connected to the copper foil trace cover layer 102 to achieve stable encapsulation of the fluorescent ceramic film 3 and the LED chip 2.

[0026] The surface of the thermally conductive insulating substrate 1 is provided with a thermally conductive silver plating layer 101 to further improve the heat dissipation performance of the thermally conductive insulating substrate 1.

[0027] The copper foil trace cover layer 102 has two sets of pads 103 at one end, which are the positive and negative terminals respectively, so that it can be quickly connected to power during installation and use.

[0028] The thickness of the thermally conductive insulating substrate 1 is 0.4-0.5 mm. Compared with traditional surface-mount LED light source boards, this invention uses a ceramic substrate that combines insulation and better thermal conductivity. Traditional surface-mount light source boards, with a copper substrate of 1 mm thickness and the height of the LED package, result in a distance of more than 2 mm between the light-emitting points on both sides. In contrast, this invention directly packages the LED chip 2 onto the 0.5 mm thick thermally conductive insulating substrate 1, reducing the thickness of the surface-mount LED package. The distance between the light-emitting points on both sides can be reduced to within 1 mm, achieving a more realistic optical characteristic of the filament and a closer resemblance to the optical effect of the filament. The light pattern meets regulatory requirements, and for the same vehicle light fixture and power, the center brightness of this invention is higher.

[0029] The working principle of this embodiment is as follows: By using a ceramic thermally conductive insulating substrate 1, there is no need to add an insulating layer, resulting in lower thermal resistance and better thermal conductivity; by directly encapsulating the LED chip 2 on the thermally conductive insulating substrate 1 with a thickness of 0.4 to 0.5 mm, the distance between the LED light-emitting points on both sides is closer, thus simulating the light-emitting center of the filament more closely, resulting in better light output efficiency than the surface mount method, and reducing the surface mount process, thus achieving higher precision.

[0030] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A double-sided packaged LED vehicle lamp light source for a vehicle lamp, comprising a thermally conductive insulating substrate (1), characterized in that: Both sides of the heat-conducting insulating substrate (1) are symmetrically paved with copper foil wiring cover layers (102), one side of each of the copper foil wiring cover layers (102) is mounted with an LED chip (2); the outer side of the LED chip (2) is successively covered with a fluorescent ceramic film (3) and a silica gel coating (4) from inside to outside.

2. The double-sided packaged LED vehicle lamp light source for vehicle lamps according to claim 1, characterized in that: The heat-conducting insulating substrate (1) is a ceramic substrate.

3. The double-sided packaged LED vehicle lamp light source for vehicle lamps according to claim 1, characterized in that: The fluorescent ceramic film (3) is encapsulated inside the silica gel coating (4), and the silica gel coating (4) is connected with the copper foil wiring cover layer (102).

4. The double-sided packaged LED vehicle lamp light source for vehicle lamps of claim 2, wherein: The surface of the heat-conducting insulating substrate (1) is provided with a heat-conducting silver-plated layer (101).

5. The double-sided packaged LED vehicle lamp light source for vehicle lamps of claim 1, wherein: One end of each of the copper foil wiring cover layers (102) is provided with two groups of soldering pads (103), and the two groups of soldering pads (103) are positive and negative respectively.

6. The double-sided packaged LED vehicle lamp light source for vehicle lamps of claim 2, wherein: The thickness of the heat-conducting insulating substrate (1) is 0.4-0.5 mm.

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