Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate and printed circuit board

Abstract

The present disclosure provides a resin composition containing an inorganic filler material and exhibiting excellent formability. The resin composition comprises a thermosetting resin (A) and an inorganic filler material (B). The inorganic filler material (B) includes: a first filler material (B1); and a second filler material (B2) on the nanometer scale, with a smaller particle size than the first filler material (B1). The first filler material (B1) comprises an anhydrous magnesium carbonate filler (B1) and an alumina filler (B2). The proportion of the first filler material (B1) relative to the total solids content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler material (B2) relative to the solids content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.