Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
AU2001070314A1Inactive Publication Date: 2002-01-21FSI INTERNATIONAL INC
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Patent Information
- Application Number
- AU2001070314
- Authority / Receiving Office
- AU · AU
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2001-07-11
- Filing Date
- 2001-07-11
- Publication Date
- 2002-01-21
- Estimated Expiration
- Not applicable · inactive patent
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