Placement head comprising a readjusting mechanism, and placement robot
An assembly head and gripping device technology, which is applied to electrical components, electrical components, etc., can solve the problems that the restoring force cannot be predetermined, the placing force cannot be predetermined, and the assembly process is adversely affected, so as to achieve weight and cost advantages, structure The effect of compactness and improved dynamics
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2009-02-11
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a mounting head for equipping a substrate with electrical components and an automatic mounting machine with the mounting head. Background technique
[0002] There are many examples in the field of technology where operations on components are required, such as the field of placement technology. The assembly technique is to equip the substrate with electrical components. The assembly process is carried out by the assembly head, which can move on the substrate to be assembled under the action of the two-dimensional positioning system. Wherein, the assembly head has one or more gripping devices, which are movable between a rest position and a working position in a direction perpendicular to the surface of the substrate. When carrying out the working process (ie picking or placing components), the gripping device is moved to the working position under the action of a suitable electric drive. During periods when the gripping devi...
Examples
Embodiment Construction
[0027] figure 1 Shown is an automatic assembly machine 1 for equipping substrates with electrical components. The substrate 2 to be assembled is transported by a conveying line 3 (for example a conveyor belt) to an assembly station, where it is equipped with electrical components, and then transported away from the assembly station. The assembly process is carried out by the assembly head 4 . The assembly head 4 is mounted on a positioning arm 5 and is movable on the positioning arm 5 in a direction (arrow x) parallel to the conveying direction (arrow x) of the substrate 2 . The positioning arm 5 is itself mounted on a support 6 straddling the conveying line 3 and is movable on the support 6 in a direction (arrow y) perpendicular to the conveying direction. The automatic assembly machine 1 also includes a control device 7 coupled with the positioning arm 5 and the assembly head 4 for controlling the moving process. A feeding device 8 is provided in the feeding area next to ...