A strain-induced semi-solid forming device and process for a fine-grained bearing bush
A strain-induced, semi-solid technology, applied in the direction of swage forging presses, upsetting forging presses, metal extrusion dies, etc., can solve the problems of low welding strength, low strength, high cost, etc., and achieve improved strain distribution and device design Reasonable, good deformation effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2016-11-09
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of metal semi-solid forming, and in particular relates to a strain-induced semi-solid forming device and process of fine-grain structure bearing bushes. Background technique
[0002] Semi-solid metal forming is an emerging metal forming technology. Its spherical or nearly spherical semi-solid slurry has the advantages of good fluidity, low forming force and good performance of the formed parts. Therefore, it is applied to improve the overall The comprehensive performance of aluminum-based or copper-based bearing pads has practical application significance. The strain-induced melting activation method (SIMA) is a method for preparing semi-solid metal billets firstly proposed by Young et al. Dendrite structure, and then carry out a small amount of cold deformation on the thermally deformed blank to store a certain denaturation in the structure, then divide the deformed blank into target sizes, and finally hea...
Examples
Embodiment Construction
[0044] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0045] refer to figure 1 and figure 2 , a strain-induced semi-solid forming device for fine-grained bearing bushes, including three parts: pre-deformation device I, intermediate frequency heating and rotating device II, and semi-solid upsetting device III, wherein pre-deformation device I is fixedly installed on the intermediate frequency heating and rotating device Above II, the semi-solid upsetting device III is located at the left rear of the pre-deformation device I, and the semi-solid upsetting device III moves up and down in the intermediate frequency heating rotating device II.
[0046] refer to figure 1 , image 3 , Figure 7 and Figure 8 The pre-deformation device I includes a blank push rod 1-1 located at the top of the pre-deformation device I, the lower end surface of the blank push rod 1-1 is in contact with the upper end surface of the bearing pa...