Combined semiconductor refrigeration refrigerator

A semiconductor, combined technology, applied in refrigerators, refrigeration and liquefaction, household refrigerators, etc., can solve the problems of affecting the efficiency and effect of refrigeration conduction, complex structure of refrigeration devices, and difficult expansion of fixed space, etc., and achieve light weight. , Simple structure, low cost effect

CN106524631AInactive Publication Date: 2017-03-22ZHEJIANG GEMCORE TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2017-03-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

A combined type semiconductor refrigeration refrigerator comprises a refrigerator body and a refrigeration temperature-difference power generation module. The refrigeration temperature-difference power generation module is arranged on the box body. A cold conduction structure is fixedly arranged on the surface of the cold end of a semiconductor refrigeration piece in the refrigeration temperature-difference power generation module. Cooling fins of a heat sink in the refrigeration temperature-difference power generation module are exposed out of the box body. The combined semiconductor refrigeration refrigerator has the beneficial effects of being efficient in refrigeration, simple in structure, small in number of mechanical components, free of noise, high in reliability, small in mounting size, low in weight, low in cost and the like and is suitable for mass industrial production
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Description

technical field

[0001] The invention relates to a refrigerating device, in particular to a refrigerator which adopts semi-conductor refrigerating sheets to refrigerate, and simultaneously recovers the heat generated by the refrigerating sheets to generate electricity, and can be stacked and used in combination. Background technique

[0002] With the improvement and development of the performance of existing semiconductor refrigeration chips, their application fields are also expanding. Compared with traditional refrigeration equipment, it can overcome the shortcomings of mechanical compression refrigeration methods. For example, there is a risk of leakage of refrigeration media (such as Freon), which is not environmentally friendly. , high power consumption, thermal pollution and noise. The semiconductor refrigeration chip utilizes the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple formed by two different semiconductor materia...

Examples

Embodiment Construction

[0032] Such as figure 1 , 2 , 3, and 4 are schematic diagrams of a preferred embodiment of the present invention. In this embodiment, the main heat sink 1, the second thermoelectric power generation chip 2, the thermal insulation material 5, the third vapor chamber 6, the first thermoelectric power generation chip 7, the second vapor chamber 8, the first vapor chamber 9, and the semiconductor refrigeration sheet 10. Composed of cold guide plate 11, box body 12, liner 13, positioning recess 14, handle 15, positioning bump 16, driving power 17, interface 18, box door 19, handle 20, modulator 21, etc. A complete semiconductor refrigeration refrigerator structure.

[0033] In this embodiment, a refrigeration thermoelectric power generation module is included, which is mainly composed of a radiator 1, a second thermoelectric power generation chip 2, a thermal insulation material 5, a second vapor chamber 6, a second thermoelectric power generation chip 7, and a second vapor chamb...