Substrate processing device and nozzle

Abstract

The present invention provides a substrate processing device and a nozzle, which can confirm the liquid level position in the nozzle after stopping the spraying of the processing liquid. The substrate processing device of the embodiment includes a substrate holding part and a nozzle. The substrate holding part holds the substrate. The nozzle supplies the processing liquid to the substrate. In addition, the nozzle includes a piping part and an observation window. The piping part includes a horizontal part and a hanging part hanging from the horizontal part, and the processing liquid is sprayed from the top of the hanging part. The observation window is provided in the horizontal part of the piping part.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a nozzle. Background Art

[0002] Conventionally, there is known a substrate processing apparatus that processes a substrate such as a semiconductor wafer by supplying a processing liquid to the substrate from a nozzle disposed above the wafer (see, for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-118109 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In such a substrate processing apparatus, after stopping the discharge of the processing liquid, a process of retreating the liquid level of the processing liquid remaining in the nozzle (hereinafter referred to as "retreat process") is sometimes performed to prevent liquid droplets from the nozzle.

[0008] Here, the following situation is assumed: in order to confirm whether the retraction process is properly performed, it is desired to confirm the position of the liquid level in the nozzle after the retraction process. However, in the case where the nozzle is composed of an opaque material such as a metal material, such as the nozzle described in Patent Document 1, the situation in the nozzle cannot be visually recognized from the outside, and it is difficult to visually confirm the position of the liquid level in the nozzle.

[0009] An object of one aspect of the embodiment is to provide a substrate processing apparatus and a nozzle capable of confirming the position of a liquid surface in a nozzle after stopping discharge of a processing liquid.

[0010] Solutions for solving problems

[0011] A substrate processing device according to one embodiment of the present invention comprises a substrate holding portion and a nozzle. The substrate holding portion holds the substrate. The nozzle supplies a processing liquid to the substrate. In addition, the nozzle comprises a piping portion and an observation window. The piping portion comprises a horizontal portion and a hanging portion hanging from the horizontal portion, and the processing liquid is sprayed from the top of the hanging portion. The observation window is provided in the horizontal portion of the piping portion.

[0012] Effects of the Invention

[0013] According to one aspect of the embodiment, the position of the liquid surface in the nozzle can be confirmed after the discharge of the processing liquid is stopped. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a diagram showing a schematic configuration of a substrate processing system according to an embodiment.

[0015] Figure 2 It is a diagram showing a schematic structure of a processing unit.

[0016] Figure 3 is a schematic top view of the processing unit.

[0017] Figure 4 is a schematic cross-sectional view of the nozzle.

[0018] Figure 5 yes Figure 4 A schematic enlarged view of section H is shown.

[0019] Figure 6 This is a diagram of the H portion viewed from below.

[0020] Figure 7 yes Figure 5 The cross-sectional view taken along the line AA' is shown.

[0021] Figure 8 It is a schematic cross-sectional view showing the structure inside the nozzle arm.

[0022] Fig. 9 yes Figure 8 A cross-sectional view taken along line BB' is shown.

[0023] Description of Reference Numerals

[0024] 1. Substrate processing system; 2. Input and output station; 3. Processing station; 4. Control device; 16. Processing unit; 40. Processing fluid supply unit; 45. Nozzle arm; 46. Arm support unit; 60. Nozzle; 61. Piping unit; 61a. Horizontal part; 61b. Hanging part; 62. Observation window; 63. Lighting window; 611. First floor; 612. Second floor; 613. Third floor. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the substrate processing apparatus and the nozzle disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, the present invention is not limited to the embodiments described below.

[0026] In addition, the following description will take as an example a case where the treatment fluid is SPM which is a mixed liquid of sulfuric acid and hydrogen peroxide solution, but the treatment fluid is not limited to SPM.

[0027] Figure 1 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. In order to make the positional relationship clear, mutually orthogonal X-axis, Y-axis and Z-axis are defined below, and the positive direction of the Z-axis is set as the vertical upward direction.

[0028] like Figure 1As shown, the substrate processing system 1 includes an input / output station 2 and a processing station 3. The input / output station 2 and the processing station 3 are disposed adjacent to each other.

[0029] The import / export station 2 includes a carrier placement unit 11 and a conveyor unit 12. A plurality of carriers C are placed on the carrier placement unit 11. The plurality of carriers C store a plurality of substrates, in this embodiment, semiconductor wafers (hereinafter referred to as wafers W) in a horizontal state.

[0030] The conveying unit 12 is disposed adjacent to the carrier placement unit 11, and includes a substrate conveying device 13 and a delivery unit 14 inside the conveying unit 12. The substrate conveying device 13 includes a wafer holding mechanism for holding the wafer W. In addition, the substrate conveying device 13 is movable in the horizontal direction and the vertical direction and is rotatable around the vertical axis, and uses the wafer holding mechanism to convey the wafer W between the carrier C and the delivery unit 14.

[0031] The processing station 3 is provided adjacent to the conveyor 12. The processing station 3 includes a conveyor 15 and a plurality of processing units 16. The plurality of processing units 16 are provided in a manner arranged on both sides of the conveyor 15.

[0032] The conveying unit 15 has a substrate conveying device 17 therein. The substrate conveying device 17 has a wafer holding mechanism for holding the wafer W. In addition, the substrate conveying device 17 can move in the horizontal direction and the vertical direction and rotate around the vertical axis, and uses the wafer holding mechanism to convey the wafer W between the delivery unit 14 and the processing unit 16.

[0033] The processing unit 16 is used to perform a preset substrate processing on the wafer W conveyed by the substrate conveying device 17 .

[0034] In addition, the substrate processing system 1 includes a control device 4. The control device 4 is, for example, a computer, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores a program for controlling various processes performed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the program stored in the storage unit 19.

[0035] The program may be a program stored in a computer-readable storage medium or a program installed from the storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), and a memory card.

[0036] In the substrate processing system 1 configured as described above, first, the substrate conveyor 13 of the input / output station 2 takes out the wafer W from the carrier C placed on the carrier placement portion 11, and places the taken-out wafer W on the delivery portion 14. The substrate conveyor 17 of the processing station 3 takes out the wafer W placed on the delivery portion 14 from the delivery portion 14 and places it in the processing unit 16.

[0037] After the wafer W input into the processing unit 16 is processed by the processing unit 16, the wafer W is taken out from the processing unit 16 by the substrate conveyor 17 and placed on the delivery unit 14. Then, the processed wafer W placed on the delivery unit 14 is returned to the carrier C of the placement unit 11 by the substrate conveyor 13.

[0038] Next, refer to Figure 2 The schematic structure of the processing unit 16 will be described. Figure 2 It is a schematic plan view showing the structure of the processing unit 16 .

[0039] like Figure 2 As shown, the processing unit 16 includes a chamber 20 , a substrate holding mechanism 30 , a processing fluid supply unit 40 , and a recovery cup 50 .

[0040] The chamber 20 accommodates a substrate holding mechanism 30, a processing fluid supply unit 40, and a recovery cup 50. A FFU (Fan Filter Unit) 21 is provided on the top of the chamber 20. The FFU 21 forms a downflow in the chamber 20.

[0041] The substrate holding mechanism 30 includes a holding portion 31, a support portion 32, and a driving portion 33. The holding portion 31 holds the wafer W horizontally. The support portion 32 is a member extending in the vertical direction, and the base end portion is rotatably supported by the driving portion 33, and the holding portion 31 is horizontally supported at the top end portion. The driving portion 33 rotates the support portion 32 around the vertical axis. The substrate holding mechanism 30 uses the driving portion 33 to rotate the support portion 32, rotate the holding portion 31 supported by the support portion 32, and thereby rotate the wafer W held by the holding portion 31.

[0042] The process fluid supply unit 40 supplies the process fluid to the wafer W. The process fluid supply unit 40 is connected to a process fluid supply source 70 .

[0043] The recovery cup 50 is arranged to surround the holding part 31, and collects the processing liquid dispersed from the wafer W due to the rotation of the holding part 31. A drain port 51 is formed at the bottom of the recovery cup 50, and the processing liquid collected by the recovery cup 50 is discharged to the outside of the processing unit 16 from the drain port 51. In addition, an exhaust port 52 is formed at the bottom of the recovery cup 50 to discharge the gas supplied from the FFU 21 to the outside of the processing unit 16.

[0044] Figure 3 is a schematic top view of the processing unit 16. Figure 3 As shown, the processing unit 16 is provided with a substrate holding mechanism 30 , a processing fluid supply unit 40 , and a recovery cup 50 in the chamber 20 .

[0045] The processing fluid supply unit 40 includes a plurality of nozzles 60, a nozzle arm 45 that horizontally supports the base end of the nozzle 60 at the top end, and an arm support unit 46 that supports the nozzle arm 45 to be able to rise and fall and to rotate. The number of nozzles 60 is not limited to that shown in the figure.

[0046] A conductive pipe (not shown) penetrates the inside of the nozzle arm 45 and the arm support portion 46, and the nozzle 60 is connected to the conductive pipe (not shown) in the nozzle arm 45. The conductive pipe is connected to a processing fluid supply source 70 disposed outside the processing unit 16, and the processing liquid is supplied from the processing fluid supply source 70 to the nozzle 60 via the conductive pipe, and is ejected from the nozzle 60 toward the wafer W.

[0047] After the discharge of the processing liquid is stopped, the processing liquid remains in the nozzle 60 and may leak from the tip of the nozzle 60. Therefore, in order to prevent the droplets, the processing unit 16 performs a retreat process to retreat the liquid level of the processing liquid remaining in the nozzle 60.

[0048] Specifically, an on-off valve is provided on the downstream side of the processing fluid supply source 70 of the conductive pipe, and the on-off valve is connected to the discharge pipe. The processing fluid supply unit 40 opens the on-off valve after the substrate is processed to discharge the processing liquid remaining in the nozzle 60 from the discharge pipe by the weight of the processing liquid. Thus, the liquid level of the processing liquid in the nozzle 60 recedes, and droplets from the tip of the nozzle 60 can be prevented.

[0049] Here, if the processing liquid does not retreat enough, it may not be possible to completely prevent droplets. In addition, if the processing liquid retreats too much, it may delay the ejection timing of the processing liquid during the next substrate processing, or dry out the nozzle 60 and generate particles. Therefore, in order to prevent the above-mentioned situation, it is preferable to be able to confirm the liquid level position of the processing liquid.

[0050] However, in the prior art, the nozzle is constructed to include a metal layer, so the situation inside the nozzle cannot be visually recognized from the outside, and it is difficult to confirm the liquid level position in the nozzle after the retreat process by observation means, such as visually.

[0051] Therefore, in the processing unit 16 of the present embodiment, an observation window is provided in the nozzle 60 so that the liquid level position in the nozzle 60 can be visually confirmed from the outside of the nozzle 60 after the ejection of the processing liquid is stopped. By providing the observation window in the nozzle 60 in this way and observing, for example, visually confirming the liquid level position after the back-off processing, it is possible to easily confirm whether the back-off processing is performed appropriately.

[0052] Reference Figure 4 The specific structure of the nozzle 60 will be described. Figure 4 is a schematic cross-sectional view of the nozzle 60 .

[0053] like Figure 4 As shown, the nozzle 60 includes a piping portion 61 , an observation window 62 , a lighting window 63 , a mounting portion 64 , and a connecting portion 65 .

[0054] The pipe section 61 includes a horizontal portion 61a extending in the horizontal direction and a hanging portion 61b hanging from the horizontal portion 61a, and the processing liquid is sprayed from the top of the hanging portion 61b toward the wafer W. In addition, the horizontal portion 61a does not need to extend strictly in the horizontal direction, and may be slightly inclined due to, for example, installation tolerance. That is, the horizontal direction here includes a substantially horizontal direction.

[0055] The piping portion 61 has a three-layer structure including, in order from the inner side, a first layer 611 , a second layer 612 , and a third layer 613 .

[0056] The first layer 611 is a layer in direct contact with the treatment liquid, and is formed by a first member having chemical resistance in order to prevent corrosion caused by the treatment liquid. In this embodiment, PFA (polytetrafluoroethylene) resin can be used as the first member. PFA is a transparent resin member. In addition, the first member is not limited to PFA, and the first member can be a transparent or translucent member having chemical resistance.

[0057] The second layer 612 is formed by a second member having higher rigidity than the first member constituting the first layer 611 in order to supplement the insufficient rigidity of the first layer 611. In the present embodiment, as the second member, a PEEK (polyetheretherketone) resin (C-PEEK) having improved strength by mixing carbon is used. C-PEEK is an opaque resin member. In addition, the second member is not limited to C-PEEK, and the second member can be a member having higher rigidity than the first member. For example, the second member can also use a common PEEK resin instead of C-PEEK. In addition, the common PEEK resin is also opaque.

[0058] The third layer 613 is formed by a third member having chemical resistance. In this embodiment, the third member is made of the same PFA resin as the first member. In addition, the third member is not limited to the PFA resin, and the third member may be a transparent or translucent member having chemical resistance.

[0059] In this way, the first layer 611, the second layer 612, and the third layer 613 constituting the piping portion 61 of the present embodiment are all formed of resin members. Therefore, compared with the case where a piping portion in which a PFA resin coating is applied to a metal piping is used, for example, metal contamination caused by coating peeling can be prevented. In addition, compared with a nozzle containing metal, weight reduction can be achieved.

[0060] In addition, a space is formed between the first layer 611 and the second layer 612. The heat transfer from the first layer 611 to the second layer 612 can be suppressed by utilizing this space.

[0061] The observation window 62 is a window provided for observing, for example, visually checking the liquid level of the processing liquid from the outside after the discharge of the processing liquid is stopped.

[0062] The observation window 62 and the light window 63 are arranged in the horizontal portion 61a of the piping section 61. This is to correspond to the position of the liquid level of the treatment liquid after the back-off process. That is, the liquid level position in the nozzle 60 after the back-off process is set at the horizontal portion 61a of the piping section 61 so that liquid droplets are not generated due to its own weight. Therefore, in the processing unit 16 of the embodiment, the observation window 62 and the light window 63 are provided in the horizontal portion 61a of the piping section 61. Thereby, in particular, the liquid level position after the back-off process can be observed, for example, visually confirmed.

[0063] Furthermore, it is preferable that the observation window 62 and the lighting window 63 are provided in the region including the end portion on the drooping portion 61b side of the horizontal portion 61a. This is because if the treatment liquid is too much retreated during the retreat process, there is a possibility that the deviation of the ejection timing becomes large or particles are generated due to drying in the piping portion 61. Therefore, the liquid level position after the retreat process is set in the region including the end portion on the drooping portion 61b side of the horizontal portion 61a, and the observation window 62 and the lighting window 63 are provided corresponding to this region.

[0064] The area including the end of the drooping portion 61b in the horizontal portion 61a set at the liquid level position after the retreat process, in other words, refers to the area including the boundary between the horizontal portion 61a and the drooping portion 61b, that is, the position where the piping portion 61 starts to droop.

[0065] Here, refer to Figure 5 to Figure 7 The structures of the observation window 62 and the lighting window 63 will be described. Figure 5 yes Figure 4 A schematic enlarged view of section H is shown. Figure 6 This is a diagram of the H portion viewed from below. Figure 7 yes Figure 5 The sectional view along the line A-A' is shown. Figure 7 In the figure, the first layer 611 and the third layer 613 are omitted.

[0066] like Figure 5 As shown, the observation window 62 is an opening 621 formed in the second layer 612, and is configured to allow visual recognition of the interior of the piping portion 61 through the first layer 611. By providing the opening 621 in the second layer 612 in this way, the liquid level position after the retreat process can be observed, for example, visually confirmed through the first layer 611 formed of a transparent member.

[0067] like Figure 5 and Figure 6 As shown, the opening 621 extends along the longitudinal direction (here, the Y-axis direction) of the piping portion 61. This can suppress a decrease in the rigidity of the piping portion 61 and confirm the liquid level position after the retreat process in a wide range.

[0068] In addition, if Figure 7 As shown, the opening 621 has a shape in which the opening width gradually increases as it goes from the inside of the second layer 612 toward the outside. When visually recognizing the liquid level position of the processing liquid after the back treatment, the operator observes the observation window 62 from below to confirm the liquid level position. However, the substrate holding mechanism 30, the recovery cup 50, etc. are arranged inside the processing unit 16, so it is difficult to observe the observation window 62 from directly below. Therefore, by setting the opening 621 to the above-mentioned shape, even when the observation window 62 is observed from obliquely below, the inside of the piping part 61 can be visually recognized. As a result, the inside of the piping part 61 can be visually recognized through a window not shown in the figure provided in, for example, the chamber 20 of the processing unit 16, and the liquid level position of the processing liquid can be confirmed without releasing the sealed state of the chamber 20.

[0069] In addition, the opening 621 is covered by the third layer 613. Thus, the second layer 612 having conductivity can be prevented from being exposed to the outside. In addition, the third layer 613 is formed of a transparent member like the first layer 611, so even if the opening 621 is covered by the third layer 613, the inside of the piping portion 61 can be visually recognized.

[0070] Here, when the opening area of ​​the opening 621 as the observation window 62 is too large, the rigidity of the piping unit 61 is reduced, and it is difficult to stably supply the processing liquid. On the other hand, if the opening area of ​​the opening 621 is too small, light cannot be introduced sufficiently, and the visibility in the piping unit 61 is reduced, making it difficult to observe, for example, visually confirm the liquid level position after the backflow process.

[0071] Therefore, in the present embodiment, independently of the observation window 62 for observing, for example, visually observing, the inside of the piping portion 61 , a lighting window 63 for introducing light is provided at a position facing the observation window 62 .

[0072] By separately arranging the window for observing the inside of the piping portion 61, such as visual observation, and the window for lighting, the parts where the rigidity is reduced can be dispersed. Therefore, compared with the case where the opening area of ​​the opening portion 621 is increased to ensure visibility, the rigidity of the piping portion 61 can be maintained and the interior of the piping portion 61 can be visually identified well.

[0073] like Figure 5 and Figure 6 As shown, the light window 63 is a plurality of small holes 631 formed in the second layer 612. The plurality of small holes 631 are arranged at predetermined intervals along the length direction of the opening 621. By forming the light window 63 with a plurality of small holes 631, it is possible to suppress the reduction in the strength of the piping portion 61 while ensuring the amount of light. In addition, similar to the opening 621, the plurality of small holes 631 are covered by the third layer 613. Thus, it is possible to prevent the conductive second layer 612 from being exposed to the outside. In addition, the plurality of small holes 631 are arranged within a range visible from the observation window 62 (see Figure 6 ).

[0074] The observation window 62 is provided at the lower part of the piping part 61, and the light window 63 is provided at the upper part of the piping part 61. By arranging the observation window 62 and the light window 63 in the piping part 61 in the vertical direction, even when a plurality of nozzles 60 are arranged in parallel (see Figure 3 ), and the inside of the piping section 61 can be visually recognized without being blocked by other nozzles 60. In addition, here, considering that the space below the nozzle 60 is wider than the space above the nozzle 60, the observation window 62 is set at the lower part of the piping section 61, but it is not limited to this. The observation window 62 can also be set at the upper part of the piping section 61, and the light window 63 can be set at the lower part of the piping section 61. In addition, assuming that the processing fluid supply part 40 has a single nozzle 60, the observation window 62 and the light window 63 can also be set on the side of the piping section 61.

[0075] return Figure 4 , the structure of the top end portion of the piping portion 61 will be described. Figure 4As shown in FIG. 1 , the first layer 611 protrudes from the second layer 612 and the third layer 613 at the top end of the hanging portion 61b. In this way, the first layer 611 of the nozzle 60 of this embodiment is protrudingly provided, but the first layer 611 is not conductive, and there is no concern about leakage, etc. In addition, the first layer 611 is transparent or translucent, so that the liquid level position in the nozzle at the top end of the nozzle can be observed, for example, visually confirmed after stopping the ejection of the processing liquid.

[0076] In addition, the nozzle 60 includes a sealing member 66, which is provided at the top end of the hanging portion 61b on the outside of the first layer 611 protruding from the second layer 612 to seal the end surface of the second layer 612. In this way, the third layer 613 covers the peripheral surface of the second layer 612, and the sealing member 66 seals the end surface of the second layer 612, so that the conductive second layer 612 can be prevented from being exposed to the outside.

[0077] In addition, the third layer 613 protrudes from the second layer 612 at the tip of the hanging portion 61b to cover at least a portion of the sealing member 66. Thus, the sealing member 66 can be prevented from being displaced regardless of whether it is welded or not.

[0078] Next, refer to Figure 8 and Fig. 9 The internal structure of the nozzle arm 45 will be described. Figure 8 4 is a schematic cross-sectional view showing the structure inside the nozzle arm 45. Fig. 9 yes Figure 8 A cross-sectional view taken along line BB' is shown.

[0079] like Figure 8 As shown, the nozzle 60 is supported by the nozzle arm 45 by inserting the base end portion into the hollow portion of the nozzle arm 45 and fixing the mounting portion 64 provided at the base end portion to the hollow portion of the nozzle arm 45. The mounting portion 64 includes a main body 641 covering the base end portion of the second layer 612 and a pin 642 that penetrates the main body 641 and the second layer 612 to prevent the second layer 612 from rotating or dislocating. The main body 641 and the pin 642 are formed by a fourth member having conductivity. In this embodiment, a carbon PTFE (polytetrafluoroethylene) resin is used as the fourth member. Carbon PTFE is PTFE mixed with carbon and has a higher strength than ordinary PTFE.

[0080] The base end portion of the third layer 613 is fused to the main body 641 at the distal end surface of the main body 641. This prevents the second layer 612 having conductivity from being exposed.

[0081] The base end of the first layer 611 passes through the main body 641 of the mounting portion 64 and is connected to one end side of the connecting portion 65 provided at a position behind the mounting portion 64. The connecting portion 65 is connected to a connecting portion 69 provided at the top end of the conductive pipe 67 at the other end side. Specifically, an external thread is formed at the other end side of the connecting portion 65, and an internal thread is formed at the top end side of the connecting portion 69. And, by screwing the external thread of the connecting portion 65 and the internal thread of the connecting portion 69, the connecting portions 65 and 69 are connected to each other, and the piping portion 61 and the conductive pipe 67 are connected via the connecting portions 65 and 69.

[0082] The nozzle 60 can be removed from the nozzle arm 45 by rotating the connection portion 65 in the direction opposite to the screw connection direction to release the screw connection with the connection portion 69. In this way, the nozzle 60 can be replaced.

[0083] The connection portion 65 is formed of a fifth member having chemical resistance. In the present embodiment, PFA resin is used as the fifth member.

[0084] As described above, the piping section 61 of the nozzle 60 does not include the conductive piping 67. Therefore, when the inside of the piping section 61 is checked from the observation window 62, the black belt-shaped conductive member used to ensure the conductivity of the conductive piping 67 does not block the view. Therefore, compared with the case where the piping section 61 includes the conductive piping 67, the visibility of the inside of the piping section 61 can be improved.

[0085] In addition, a conducting member 68 for electrically connecting the nozzle 60 and the conductive pipe 67 is provided in the hollow portion of the nozzle arm 45. Figure 8 and Fig. 9 As shown in FIG. 1 , the conductive member 68 includes an extension portion 681, one end of which contacts the lower portion of the mounting portion 64 and the other end of which extends to the lower portion of the conductive pipe 67; and an externally embedded portion 682, which is erected from the extension portion 681 and externally embedded in the conductive pipe 67. Thus, a conductive path consisting of the second layer 612, the mounting portion 64, the conductive member 68, and the conductive pipe 67 is formed.

[0086] As described above, the substrate processing device of this embodiment includes a substrate holding portion and a nozzle. The substrate holding portion holds the substrate. The nozzle supplies a processing liquid to the substrate. In addition, the nozzle includes a piping portion and an observation window. The piping portion includes a horizontal portion and a hanging portion hanging from the horizontal portion, and the processing liquid is sprayed from the top of the hanging portion. The observation window is provided in the horizontal portion of the piping portion.

[0087] By providing the observation window 62 in the horizontal portion 61a of the piping section 61, it is possible to observe, for example, visually confirm the position of the liquid surface in the nozzle 60 after stopping the ejection of the processing liquid, especially after the retraction process. Therefore, it is possible to prevent the generation of droplets due to insufficient retraction and the generation of particles due to drying in the piping section 61 due to excessive retraction.

[0088] In addition, the piping portion 61 is constructed to include, from the inside, a first layer 611 formed by a transparent or translucent component and a second layer 612 formed by an opaque component, and the observation window 62 is an opening 621 formed in the second layer 612, which can visually identify the interior of the piping portion 61 through the first layer 611.

[0089] By providing the opening 621 in the second layer 612 in this manner, the position of the liquid surface after the retreat process can be observed, for example, visually confirmed, through the first layer 611 formed of a transparent or translucent member.

[0090] In addition, the piping portion 61 includes a lighting window 63 provided at a position opposite to the observation window 62. By separately providing a window for observing the inside of the piping portion 61, for example, visually observing, and a window for lighting, the portion where the rigidity is reduced can be dispersed, so that, compared with a case where the opening area of ​​the opening portion 621 is increased to ensure visibility, the rigidity of the piping portion 61 can be maintained while the inside of the piping portion 61 can be visually recognized well.

[0091] The lighting window 63 is a plurality of small holes formed in the second layer 612. By configuring the lighting window 63 with a plurality of small holes 631, it is possible to ensure the amount of lighting while suppressing a decrease in the rigidity of the piping portion 61, as compared with a case where the lighting window 63 is configured with, for example, a single opening.

[0092] In addition, the second layer 612 is formed of a conductive resin, the first layer 611 protrudes from the second layer 612 at the top end of the hanging portion 61b, and the piping portion 61 is configured to further include a third layer 613 formed of a transparent or translucent member on the outside of the second layer 612. In addition, the nozzle 60 is provided with a sealing member 66 that is provided on the outside of the first layer 611 protruding from the second layer 612 at the top end of the hanging portion 61b to seal the end surface of the second layer 612.

[0093] Since the peripheral surface of the second layer 612 is covered with the third layer 613 and the end surface of the second layer 612 is sealed with the sealing member 66 , it is possible to prevent the conductive second layer 612 from being exposed to the outside.

[0094] In addition, the third layer 613 protrudes from the second layer 612 at the tip of the hanging portion 61b to cover at least a portion of the sealing member 66. Thus, the sealing member 66 can be easily prevented from being displaced regardless of whether it is welded or not.

[0095] In addition, the first layer 611 protrudes from the second layer 612 at the base end of the horizontal portion 61a and is connected to the conductive pipe 67 via the connecting portion 65. In addition, the nozzle 60 includes: a nozzle arm 45 that supports the pipe portion 61 so as to be rotatable; a conductive mounting portion 64 that is provided outside the second layer 612 at the base end of the horizontal portion 61a and is used to mount the pipe portion 61 to the nozzle arm 45; and a conductive member 68 that contacts the mounting portion 64 and the conductive pipe 67 and electrically connects the second layer 612 and the conductive pipe 67 via the mounting portion 64. In this way, a conductive path can be ensured.

[0096] In addition, the observation window 62 is provided in the region including the end portion on the side of the hanging portion 61b in the horizontal portion 61a. From the viewpoint of preventing the generation of particles due to drying in the piping portion 61, it is preferred that the liquid level position after the retreat process is set in the region including the end portion on the side of the hanging portion 61b in the horizontal portion 61a. By providing the observation window 62 corresponding to this position, the liquid level position in the nozzle 60 after the retreat process can be appropriately observed, for example, visually confirmed.

[0097] In the above-mentioned embodiment, an example of the case where the second layer 612 is formed of a resin member is shown, but the second layer does not necessarily need to be formed of a resin member, and may be formed of, for example, metal. As already mentioned, even if the second layer is formed of metal, it is a structure that prevents the second layer from being exposed to the outside, so that problems such as corrosion do not occur.

[0098] In the above-described embodiment, an example is shown in which the hanging portion 61b has a shape that draws a curve and hangs down from the horizontal portion 61a, but the hanging portion 61b may hang down at a right angle from the horizontal portion 61a, for example.

[0099] In addition, in the present embodiment, the nozzle 60 is disposed above the wafer W, and the hanging portion 61b is disposed vertically downward, the observation window 62 is disposed at the lower part of the piping portion 61, and the lighting window 63 is disposed at the upper part of the piping portion 61. However, the nozzle 60 is not limited to being disposed above the wafer W, and it is also conceivable to be disposed below the wafer W. In this case, the nozzle 60 is disposed in a state where the hanging portion 61b is disposed vertically upward. Figure 4 As a reference, the observation window 62 and the lighting window 63 are respectively provided at the upper part and the lower part of the piping part 61. By having such a form, the liquid level position in the nozzle 60 can be confirmed in the same manner as in the present embodiment. In addition, in the above-mentioned embodiment, visual observation is used as the observation means. However, the observation means is not limited to visual observation, and can also be a sensor, such as an image sensor or a laser sensor that can observe the liquid level position in the nozzle.

[0100] Further effects and variations can be easily derived by those skilled in the art. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the concept of the invention defined by the claims and their equivalents.

Claims

1. A substrate processing device, characterized in that: The substrate processing device includes a substrate holding portion for holding a substrate and a nozzle for supplying a processing liquid to the substrate. The nozzle has: a piping portion having a horizontal portion and a hanging portion hanging down from the horizontal portion, the piping portion spraying the treatment liquid from a top end of the hanging portion; an observation window provided at a horizontal portion of the piping portion; as well as a lighting window, which is provided on the piping portion independently of the observation window, By providing the observation window in the nozzle, the position of the liquid level in the nozzle can be visually confirmed from the outside of the nozzle after the discharge of the processing liquid is stopped. The piping portion is configured to include, in order from the inner side, a first layer formed of a transparent or translucent member and a second layer formed of an opaque member. The observation window is an opening formed in the second layer, and enables visual inspection of the interior of the piping portion through the first layer.

2. The substrate processing device according to claim 1, characterized in that: The skylights are a plurality of small holes formed in the second layer.

3. The substrate processing device according to claim 1 or 2, characterized in that: The second layer is formed of a resin having conductivity.

4. The substrate processing device according to claim 1 or 2, characterized in that: The first layer protrudes from the second layer at a tip end portion of the hanging portion.

5. The substrate processing device according to claim 1 or 2, characterized in that: The second layer is formed of a conductive resin. The first layer protrudes from the second layer at the top end of the hanging portion, The piping portion is configured to further include a third layer formed of a transparent or translucent member outside the second layer. The nozzle includes a sealing member provided at a tip end portion of the hanging portion on an outer side of the first layer protruding from the second layer to seal an end surface of the second layer.

6. The substrate processing device according to claim 5, characterized in that: The third layer protrudes from the second layer at the tip end of the hanging portion to cover at least a portion of the sealing member.

7. The substrate processing apparatus according to claim 5, characterized in that: The first layer protrudes from the second layer at the base end of the horizontal portion and is connected to the conductive pipe. The nozzle has: a nozzle arm supporting the piping portion; a conductive mounting portion provided at the base end of the horizontal portion on the outside of the second layer and used for mounting the piping portion on the nozzle arm; A conductive member is in contact with the mounting portion and the conductive pipe, and electrically connects the second layer and the conductive pipe via the mounting portion.

8. The substrate processing apparatus according to any one of claims 1 to 2, 6 and 7, characterized in that: The observation window is provided in a region of the horizontal portion including an end portion on the hanging portion side.

9. A nozzle for supplying a processing liquid to a substrate, characterized in that: The nozzle has: a pipe portion having a horizontal portion and a hanging portion hanging down from the horizontal portion, and spraying the treatment liquid from a top end of the hanging portion; an observation window provided at a horizontal portion of the piping portion; as well as a lighting window, which is provided on the piping portion independently of the observation window, By providing the observation window in the nozzle, the position of the liquid level in the nozzle can be visually confirmed from the outside of the nozzle after the discharge of the processing liquid is stopped. The piping portion is configured to include, in order from the inner side, a first layer formed of a transparent or translucent member and a second layer formed of an opaque member. The observation window is an opening formed in the second layer, and enables visual inspection of the interior of the piping portion through the first layer.

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