Shielded Interconnect Array

Abstract

A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include a receptacle connection including a conductive member having a flexible bend. In the illustrated example, a corresponding grounded conductive member having a flexible bend is positioned adjacent to other conductive members having a flexible bend to provide shielding.

Description

Background Art

[0001] Future roadmaps for high-end client and server products indicate that socket technology may require bandwidth exceeding 20 GHz and Scalable Link Interface (SLI) pitches down to 0.3 mm. Furthermore, for sockets such as test socket interconnect arrays, traditional spring-based Pogo pin technology is expensive and is expected to continue to rise in price as pitch decreases and performance increases. Solutions that meet future performance and cost requirements are needed. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 A shows an example of a portion of an interconnect socket according to some embodiments of the present disclosure.

[0003] Figure 1 B shows an example of connection according to some embodiments of the present disclosure.

[0004] 2A shows a side view of an example connection according to some embodiments of the present disclosure.

[0005] Figure 2B Another side view showing an example connection according to some embodiments of the present disclosure.

[0006] Figure 3 A flowchart is shown for a method according to some embodiments of the present disclosure.

[0007] Figure 4 A system-level diagram is illustrated according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0008] The following description and accompanying drawings sufficiently illustrate specific embodiments to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. Portions and features of some embodiments may be included in those of other embodiments, or replaced therewith. The embodiments set forth in the claims encompass all available equivalents of those claims.

[0009] Although the present disclosure uses elements of a semiconductor chip device and a method of manufacturing the same as an example, the present disclosure is not so limited. The examples of the present disclosure can be used in any technology in which the formation of solder balls in a solder resist layer is controlled.

[0010] Figure 1A shows an example of a portion of an interconnect socket 100 according to some embodiments of the present disclosure, the portion including a connection 104 having a formed conductive member conductive plate 150. The connection 104 may be included in an array of connections in the socket 100. The connection 104 may be connected to a device under test (DUT) 102 to test the DUT 102 by passing signals through the formed conductive member conductive plate 150. The DUT may include contacts 112 for sending and receiving signals. Although a device under test (used with a test fixture) is used as an example, other examples include sockets for other interconnect uses besides product testing. Although Figure 1 A shows only three exemplary formed conductors, but it is understood that connection 104 may include an array of more than three formed conductors.

[0011] Connection 104 can include a top portion having ball guides 120, a conductive layer 130, and a cover / reinforcement layer 140 connected to DUT 102. Ball guides 120 can provide a slot to guide contact 112 of DUT 102 to a conductive core 152 of a conductive plate 150 formed as a conductive member. Conductive layer 130 can be electrically connected to a common DUT ground. Active cover layer 132 can electrically connect dielectric material 154 to the common DUT ground near the first end. In one example, cover / reinforcement layer 140 is a base layer that provides support for upper layers.

[0012] The connector 104 may also include a bottom portion having a conductive plate 150, a printed circuit board (PCB) cover 160, contacts 170, and a PCB 172. Although a printed circuit board is used as an example circuit to which the connector is connected, the present invention is not so limited. The examples of sockets described in this disclosure may be used to connect any two circuit types or board types, or any combination thereof.

[0013] Conductive plate 150 can serve as a ground plane for the underlying components. PCB cover 160 can provide a server as a cover for PCB 172. PCB 172 can provide an interface to a tester (not shown). Contacts 170 can provide contact to PCB 172 for signal transmission along conductors (e.g., formed conductive member 194).

[0014] Extending between the top portion and the bottom portion is a series of conductors. The conductive member 180 formed can be implemented as an independent conductor to transmit a signal that is less susceptible to interference. For example, the conductive member 180 formed can be used to provide power and ground paths. The material of the conductive member 180 formed can provide electrical interconnection functionality, and the shape of the conductive member 180 formed can provide mechanical compliance with contact forces. In one example, the shape and material selection of the conductive member 180 formed provides a spring force that applies pressure to other electrical contacts and forms an electrical connection. In the example shown, a "C" shape is formed, however, the present invention is not so limited.

[0015] Conductive member 194, shielded by shielding member 192 and shielding member 196, can be implemented as a shielded conductor to transmit signals that are more susceptible to interference. For example, conductive member 194 can be implemented to transmit data signals and input / output (I / O) probes. The material of conductive member 194 can provide electrical interconnection functionality, and the shape of conductive member 194 can provide mechanical compliance with contact forces. Shielding member 192 and shielding member 196 can provide electromagnetic shielding for conductive member 194 to prevent electrical crosstalk between adjacent conductors. Shielding member 192 and shielding member 196 can each have a shape similar to that of conductive member 194, such that the gap (e.g., distance) between conductive member 194 and each of shielding member 192 and shielding member 196 remains consistent (e.g., shielding member 192, conductive member 194, and shielding member 196 follow parallel paths). Each end of both the formed shield member 192 and the formed shield member 196 may be coupled to a ground plane via the conductive plate 150 .

[0016] Figure 1 B depicts a schematic representation of the properties of formed shield member 192, formed conductive member 194, and formed shield member 196 within connection 104 according to some embodiments of the present disclosure. Formed shield member 192 and formed shield member 196 are coupled to ground at each end, and formed conductive member 194 has elastic mechanical properties that provide contact force when compressed. Air gaps between formed shield member 192 and formed conductive member 194 and between formed conductive member 194 and formed shield member 196 can provide a shielding effect because the air can act as a dielectric layer. In some examples, the electrical properties of formed conductive member 194 can be modified by changing the distance between formed conductive member 194 and each of formed shield member 192 and formed shield member 196.

[0017] In some examples, the material and shape of the formed conductive member 180 and the formed conductive member 194 can be the same. In some examples, one or more of the formed conductive member 180, the formed shielding member 192, the formed conductive member 194, and the formed shielding member 196 can have a rectangular cross-section. In other examples, one or more of the formed conductive member 180, the formed shielding member 192, the formed conductive member 194, and the formed shielding member 196 can have a different cross-section shape, such as square, circular, oval, cylindrical, H-shaped, semicircular, etc. Although Figure 1 A and 1B depict the formed conductive member 180, the formed shielding member 192, the formed conductive member 194, and the formed shielding member 196 having an S-shaped bend, but the formed conductive member 180, the formed shielding member 192, the formed conductive member 194, and the formed shielding member 196 can be implemented using other bending shapes, such as a J-shaped bend or a C-shaped bend.

[0018] FIG. 2A illustrates a block diagram of a portion of a socket interconnect array system 200 in an uncompressed state, according to some embodiments of the present disclosure. Figure 2B A block diagram of a portion of a socket interconnect array system 201 in a compressed state according to some embodiments of the present disclosure is illustrated. Figures 2A and 2B include connections 204 configured to couple to a DUT 202. In some examples, Figure 1 The connection 104 can realize the connection 204.

[0019] Referring now to Figures 2A and 2B, connection 204 may include a top portion having ball guides 220, a conductive layer 230, and a cover / reinforcement layer 240 connected to DUT 202. Ball guides 220 may provide slots to guide DUT 202's 212 contacting a conductive core 252 of a conductive plate 250 formed by a conductive member 230. Active cover layer 232 may electrically connect dielectric material 254 to the common DUT ground near the first end. Cover / reinforcement layer 240 is a base layer that provides support for the upper layers.

[0020] Connection 204 may also include a bottom portion having a conductive plate 250, a PCB cover 260, contacts 270, and a PCB 272. Conductive plate 250 may serve as a ground plane for the underlying portion. PCB cover 260 may provide a pad as a cover for PCB 272. PCB 272 may provide an interface to a tester (not shown). Contacts 270 may provide contact with PCB 272 for signal transmission along conductors (e.g., formed conductive member 294).

[0021] The shielding member 292, the conductive member 294, and the shielding member 296 can serve as interconnects extending between the top and bottom portions of the connection 204. The conductive member 294, shielded by the shielding member 292 and the shielding member 296, can be implemented as a shielded conductor to transmit signals that are more susceptible to interference. For example, the conductive member 294 can be implemented to transmit data signals and input / output (I / O) probes. The material of the conductive member 294 can provide electrical interconnection functionality, and the shape of the conductive member 294 can provide mechanical compliance to contact forces (e.g., via an S-shaped bend). That is, when the DUT 202 is mounted on the connection 204, the connection system 200 in an uncompressed state transitions to the connection system 201 in a compressed state. When this occurs, the conductive member 294 can compress at the bend in the conductive member 194 in a spring-like manner, causing the conductive member 294 to apply pressure between the contact 270 and the contact of the DUT 202. The shield members 292 and 296 may provide electromagnetic shielding for the conductive member 294 to prevent electrical crosstalk between adjacent conductors. Each end of the shield members 192 and 196 may be coupled to a ground plane via the conductive plate 250.

[0022] In some examples, one or more of the formed shield member 292, the formed conductive member 294, and the formed shield member 296 can have a rectangular cross-section. In other examples, one or more of the formed shield member 292, the formed conductive member 294, and the formed shield member 296 can have a cross-section with a different shape, such as rounded, oval, semi-circular, etc. Although Figures 2A and 2B depict the formed shield member 292, the formed conductive member 294, and the formed shield member 296 having an S-shaped bend, the formed shield member 292, the formed conductive member 294, and the formed shield member 296 can be implemented with other bend shapes, such as a J-shaped bend or a C-shaped bend.

[0023] Figure 3 A method 300 of forming a connection according to some embodiments of the present disclosure is illustrated. The method 300 may be performed by Figure 1 2A and 2B, or a combination thereof.

[0024] The method 300 may include inserting the formed conductive member between a first contact at a first end and a first socket near a second end at 310. The first socket is configured to mate with a device under test (eg, Figure 1A first contact member of the DUT 102 of FIG. 2A or the DUT 202 of FIG. 2A and 2B is aligned. The first conductive member formed may include Figure 1 The conductive member 194 formed in Figures 1A and 1B and / or the conductive member 294 formed in Figures 2A and 2B. The first conductive member formed may have an S-shaped bend. The first contact may include Figure 1 2A and 2B. The method 300 may further include compressing the formed conductive member and the formed shielding member to mount the device under test. In some examples, the formed conductive member may have one of a square, oval, or H-shaped cross-section.

[0025] The method 300 may include inserting the formed shielding member adjacent to the first side of the formed conductive member and between the first ground plane at the first end and the second ground plane at the second end at 320. The formed shielding member may include Figure 1 2A and 2B . The shield member may include an S-shaped bend. The shield member may protect the first side of the conductive member from electromagnetic waves. The method 300 may also include maintaining a constant horizontal gap between the shield member and the first side of the conductive member.

[0026] The method 300 may further include inserting a second formed shielding member adjacent to the second side of the formed conductive member and between the first ground plane at the first end and the second ground plane at the second end. The second formed shielding member may have an S-shaped bend. The second formed shielding member may include Figure 1 2A and 2B. In some examples, the horizontal gap extending between the first formed shield member and the formed conductive member is equal to the horizontal gap extending between the second formed shield member and the formed conductive member. In one example, the horizontal gap is in the compressed state ( Figure 2B ) and the uncompressed state (Figure 2A).

[0027] Method 300 may include inserting a second formed conductive member between a second contact at the first end and a second slot near the second end. The second slot is configured to align with a second contact of the device under test. The second formed conductive member may include Figure 1 A formed conductive member 180. The second formed conductive member may have an S-shaped bend.

[0028] The method 300 may further include forming a ball guide layer having slots for guiding contacts of the device under test into position during installation. The ball guide layer may include Figure 1 A or the ball guide 220 of Figures 2A and 2B. The method 300 may also include forming a conductive plate coupled to the ground node to form a first ground plane. The conductive plate may include Figure 1 A or the conductive plate 230 of Figures 2A and 2B. The shield member formed may contact the conductive plate. Method 300 may also include forming a reinforcement layer configured to provide structural support for the ball guide layer and the conductive plate. The reinforcement layer may include Figure 1 A or the cover / reinforcement layer 140 of Figures 2A and 2B.

[0029] The method 300 may further include forming a conductive plate coupled to the ground node to form a second ground plane. The conductive plate may include Figure 1 A or the conductive plate 250 of Figures 2A and 2B. The shielding member formed may contact the conductive plate. The method 300 may also include forming a printed circuit board to provide an interface between a tester and the formed conductive member for testing the device under test. The printed circuit board may include Figure 1 A or PCB 272 of Figures 2A and 2B. The method 300 may also include forming a contact to contact the formed conductive member and the printed circuit board. The contact may include Figure 1 A or 270 of FIG. 2A and 2B. The method 300 may further include forming a printed circuit board cover extending between the conductive plate and the printed circuit board to protect the printed circuit board. The printed circuit board cover may include Figure 1 A or PCB cover 260 of Figures 2A and 2B.

[0030] Figure 4 A system level diagram according to one embodiment of the present invention is shown. For example, Figure 4 Depicted are examples of electronic devices (eg, system 400) that may include outlets and connections as described in this disclosure, such as Figure 1 connection 104 of FIG. 2 , connection 204 of FIG. 3 , Figure 3 Connection 304, Figure 4 In one example, one or more components of the system 400 (as a DUT) can be tested using examples of the present invention.

[0031] include Figure 4To illustrate an example of a higher-level device application for the present invention. In one example, system 400 includes, but is not limited to, a desktop computer, a laptop computer, a netbook, a tablet computer, a notebook computer, a personal digital assistant (PDA), a server, a workstation, a cellular phone, a mobile computing device, a smartphone, an Internet appliance, or any other type of computing device. In some embodiments, system 400 is a system-on-a-chip (SOC) system.

[0032] In one embodiment, processor 410 has one or more processing cores 412 and 412N, where 412N represents the Nth processor core within processor 410, where N is a positive integer. In one embodiment, system 400 includes multiple processors, including 410 and 405, where processor 405 has logic similar to or identical to that of processor 410. In some embodiments, processing core 412 includes, but is not limited to, pre-fetch logic for fetching instructions, decode logic for decoding instructions, and execution logic for executing instructions. In some embodiments, processor 410 has cache memory 416 for caching instructions and / or data for system 400. Cache memory 416 can be organized into a hierarchical structure comprising one or more levels of cache memory.

[0033] In some embodiments, processor 410 includes a memory controller 414 that is operable to perform functions that enable processor 410 to access and communicate with memory 430, including volatile memory 432 and / or non-volatile memory 434. In some embodiments, processor 410 is coupled to memory 430 and chipset 420. Processor 410 may also be coupled to wireless antenna 478 to communicate with any device configured to transmit and / or receive wireless signals. In one embodiment, wireless antenna interface 478 operates in accordance with, but is not limited to, IEEE 802.11 standards and their related families, Home Premium AV (HPAV), Ultra-Wideband (UWB), Bluetooth, WiMax, or any other form of wireless communication protocol.

[0034] In some embodiments, the volatile memory 432 includes, but is not limited to, synchronous dynamic random access memory (SDRAM), dynamic random access memory (DRAM), RAMBUS dynamic random access memory (RDRAM), and / or any other type of random access memory device. The non-volatile memory 434 includes, but is not limited to, flash memory, phase change memory (PCM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), or any other type of non-volatile memory device.

[0035] Memory 430 stores information and instructions to be executed by processor 410. In one embodiment, memory 430 may also store temporary variables or other intermediate information while processor 410 is executing instructions. In the illustrated embodiment, chipset 420 is connected to processor 410 via point-to-point (PtP or PP) interfaces 417 and 422. Chipset 420 enables processor 410 to connect to other components in system 400. In some embodiments of the present invention, interfaces 417 and 422 operate in accordance with a PtP communication protocol such as Intel® QuickPath Interconnect (QPI). In other embodiments, a different interconnect may be used.

[0036] In some embodiments, chipset 420 is operable to communicate with processors 410, 405N, display device 440, and other devices 472, 476, 474, 460, 462, 464, 466, 477, etc. Chipset 420 may also be coupled to wireless antenna 478 to communicate with any device configured to transmit and / or receive wireless signals.

[0037] Chipset 420 is connected to display device 440 via interface 426. Display device 440 may be, for example, a liquid crystal display (LCD), a plasma display, a cathode ray tube (CRT) display, or any other form of visual display device. In some embodiments of the present invention, processor 410 and chipset 420 are combined into a single SOC. Furthermore, chipset 420 is connected to one or more buses 450 and 455 that interconnect various components 474, 460, 462, 464, and 466. Buses 450 and 455 may be interconnected via bus bridge 472. In one embodiment, chipset 420 is coupled to non-volatile memory 460, mass storage device(s) 462, keyboard / mouse 464, network interface 466, smart TV 476, consumer electronics 477, and the like via interfaces 424 and / or 404.

[0038] In one embodiment, mass storage device 462 includes, but is not limited to, a solid-state drive, a hard disk drive, a universal serial bus flash memory drive, or any other form of computer data storage medium. In one embodiment, network interface 466 is implemented using any type of well-known network interface standard, including, but not limited to, an Ethernet interface, a universal serial bus (USB) interface, a peripheral component interconnect (PCI) Express interface, a wireless interface, and / or any other suitable type of interface. In one embodiment, the wireless interface operates in accordance with, but is not limited to, IEEE 802.11 standards and their related series, Home Plug-in AV (HPAV), Ultra-Wideband (UWB), Bluetooth, WiMax, or any other form of wireless communication protocol.

[0039] Although it will Figure 4 The modules shown in FIG4 are depicted as separate blocks within system 400, but the functions performed by some of these blocks may be integrated within a single semiconductor circuit or may be implemented using two or more separate integrated circuits. For example, although cache memory 416 is depicted as a separate block within processor 410, cache memory 416 (or selected aspects of 416) may be incorporated into processor core 412.

[0040] To better illustrate the methods and apparatus disclosed herein, a non-limiting list of examples is provided here:

[0041] Example 1 includes an apparatus. The apparatus includes a socket connection comprising: a formed conductive member extending from a first contact at a first end to a first slot near a second end, wherein the first slot is configured to align with a first contact of a device, wherein the first formed conductive member has a flexible bend; and a formed shield member extending from a first ground plane at the first end to a second ground plane at the second end, wherein the formed shield member is adjacent to the formed conductive member along a first side to shield the first side of the formed conductive member from electromagnetic waves, wherein the formed shield member has a flexible bend.

[0042] Example 2 includes the apparatus of Example 1, wherein a horizontal gap extending between the formed shield member and the first side of the formed conductive member is constant from a first end to a second end of the formed shield member.

[0043] Example 3 includes the apparatus of any of Examples 1-2, wherein the formed conductive member and the formed shield member are adapted to be mechanically compressed in a vertical direction when the device is mounted on the socket connection.

[0044] Example 4 includes the apparatus of any of Examples 1-3, wherein the formed shielding member is a first formed shielding member, wherein the socket connection further comprises a second formed shielding member extending from a first ground plane at the first end to a second ground plane at the second end, wherein the formed shielding member is adjacent to the formed conductive member along a second side to shield the second side of the formed conductive member from electromagnetic waves, wherein the second formed shielding member has a flexible bend.

[0045] Example 5 includes the apparatus of any of Examples 1-4, wherein a horizontal gap extending between a first formed shield member and a formed conductive member is equal to a horizontal gap extending between a second formed shield member and a formed conductive member.

[0046] Example 6 includes the apparatus of any of Examples 1-5, wherein the conductive member is formed to have a rectangular cross-section.

[0047] Example 7 includes the apparatus of any of Examples 1-6, wherein the first shield member and the second shield member each have a rectangular cross-section.

[0048] Example 8 includes the apparatus of any of Examples 1-7, wherein the formed conductive member is a first formed conductive member, wherein the socket connection further comprises a second formed conductive member extending from a second contact at the first end to a second slot near the second end, wherein the second slot is configured to align with a second contact of the device, wherein the second formed conductive member comprises a flexible bend.

[0049] Example 9 includes the apparatus of any of Examples 1-8, wherein the socket connection near the first end of the formed conductive member further comprises: a ball guide layer having slots that guide contacts of the device into place during installation; a conductive plate coupled to the ground node to form a first ground plane, wherein the formed shield member contacts the conductive plate; and a reinforcement layer configured to provide structural support for the ball guide layer and the conductive plate.

[0050] Example 10 includes the apparatus of any of Examples 1-9, wherein the socket connection near the second end of the formed conductive member further includes: a conductive plate coupled to the ground node to form a second ground plane, wherein the formed shielding member contacts the conductive plate; a printed circuit board that provides an interface between a tester and the formed conductive member for testing the device; a contact that electrically contacts the formed conductive member and the printed circuit board; and a printed circuit board cover that extends between the conductive plate and the printed circuit board to protect the printed circuit board.

[0051] Example 11 includes a socket connection comprising: a formed conductive member having a shape for applying a contact force when in operation, the formed conductive member extending from a first contact to a first slot, wherein the first slot is configured to align with a first contact of the device; and a formed shield member having the same shape as the formed conductive member and mounted adjacent to a first side of the formed conductive member, the formed shield member extending from a first ground plane to a second ground plane.

[0052] Example 12 includes the socket connection of Example 11, wherein the formed shielding member is a first formed shielding member, and the socket connection further includes a second formed shielding member, the second formed shielding member having the same shape as the formed conductive member and being mounted adjacent to the second side of the formed conductive member, the second formed shielding member extending from the first ground plane to the second ground plane.

[0053] Example 13 includes the receptacle connection of any of Examples 11-12, wherein the conductive member is formed to have one of a C-shape or a J-shape.

[0054] Example 14 includes the receptacle connection of any of Examples 11-13, wherein the conductive member is formed to have a rectangular cross-sectional shape.

[0055] Example 15 includes the socket connection of any of Examples 11-14, wherein the socket connection further comprises: a first layer configured to provide structural support; and a conductive layer formed over the first layer, the conductive layer coupled to a ground node to form a first ground plane, wherein the shielding member formed contacts the conductive layer.

[0056] Example 16 includes the socket connection of any one of Examples 11-15, wherein the socket connection further comprises: a printed circuit board for providing an interface between a tester and the formed conductive member for testing the device; a printed circuit board cover formed over the printed circuit board to protect the printed circuit board; and a conductive layer formed over the printed circuit board cover, the conductive layer coupled to a ground node to form a second ground plane, wherein the formed shielding member contacts the conductive layer.

[0057] Example 17 includes a method comprising: inserting a formed conductive member between a first contact at a first end and a first slot near a second end, wherein the first slot is configured to align with a first contact of the device, wherein the first formed conductive member has a flexible bend; and inserting a formed shielding member adjacent to a first side of the formed conductive member and between a first ground plane at the first end and a second ground plane at the second end, wherein the formed shielding member has a flexible bend.

[0058] Example 18 includes the method of Example 17, further comprising maintaining a constant horizontal gap between the formed shield member and the first side of the formed conductive member.

[0059] Example 19 includes the method of any of Examples 17-18, further comprising compressing the formed conductive member and the formed shielding member to connect the devices.

[0060] Example 20 includes the method of any one of Examples 17-19, wherein the formed shielding member is a first formed shielding member, the method further comprising inserting a second formed shielding member adjacent to the second side of the formed conductive member and between the first ground plane at the first end and the second ground plane at the second end, wherein the second formed shielding member has a flexible bend.

[0061] Example 21 includes the method of any of Examples 17-20, wherein a horizontal gap extending between a first formed shield member and the formed conductive member is equal to a horizontal gap extending between a second formed shield member and the formed conductive member.

[0062] These examples are intended to provide non-limiting examples of the present subject matter - they are not intended to provide an exclusive or exhaustive explanation.The above detailed description is included to provide further information about the present apparatus and methods.

[0063] The above detailed description includes references to the accompanying drawings that form part of the detailed description. Each figure shows, by way of illustration, a specific embodiment in which the present disclosure may be practiced. These embodiments are also referred to herein as "examples." Such examples may include elements other than those shown or described. However, the inventors also contemplate examples in which only those elements shown or described are provided. Furthermore, the inventors also contemplate examples using any combination or arrangement of those elements shown or described (or one or more aspects thereof) with respect to a particular example (or one or more aspects thereof) or with respect to other examples shown or described herein (or one or more aspects thereof).

[0064] In this document, the terms "a" or "an" are used, as is common in patent documents, to include one or more than one, independent of any other instance or use of "at least one" or "one or more." In this document, the term "or" is used to refer to a non-exclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain English equivalents of the respective terms "comprising" and "wherein." Furthermore, in the following claims, the terms "including" and "comprising" are open-ended, that is, a system, apparatus, article, composition, formula, or process that includes elements in addition to those listed after such terms in a claim is still considered to fall within the scope of the claim. Furthermore, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels and are not intended to impose numerical requirements on their objects.

[0065] The foregoing description is intended to be illustrative, not restrictive. For example, the examples described above (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be employed, such as by one of ordinary skill in the art upon reviewing the foregoing description. The Abstract is provided to comply with 37 CFR §1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is provided with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Furthermore, in the foregoing Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that unclaimed disclosed features are essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments may be combined with each other in various combinations and permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A device comprising: A socket connection, comprising: a formed conductive member extending from a first contact at a first end to a first slot near a second end, wherein the first slot is configured to align with a first contact of the device, wherein the first formed conductive member has a flexible bend; and a formed shield member extending from a first ground plane at a first end to a second ground plane at a second end, wherein the formed shield member is adjacent to the formed conductive member along a first side to shield the first side of the formed conductive member from electromagnetic waves, wherein the formed shield member has a flexible bend, wherein the socket connection formed near the second end of the conductive member further comprises: a conductive plate coupled to the ground node to form a second ground plane, wherein the shield member is formed to contact the conductive plate; providing an interface between a tester and the formed conductive member for testing a printed circuit board of the device; Electrical contact is formed between the conductive member and the contact of the printed circuit board; and A printed circuit board cover extends between the conductive plate and the printed circuit board to protect the printed circuit board. 2 . The apparatus of claim 1 , wherein a horizontal gap extending between the formed shield member and the first side of the formed conductive member is constant from a first end to a second end of the formed shield member.

3. The apparatus of any one of claims 1-2, wherein the formed conductive member and the formed shielding member are adapted to be mechanically compressed in a vertical direction when the device is mounted on the socket connection.

4. The apparatus of any one of claims 1-2, wherein the formed shielding member is a first formed shielding member, wherein the socket connection further comprises a second formed shielding member extending from a first ground plane at the first end to a second ground plane at the second end, wherein the formed shielding member is adjacent to the formed conductive member along a second side to shield the second side of the formed conductive member from electromagnetic waves, wherein the second formed shielding member has a flexible bend.

5. The apparatus of claim 4, wherein a horizontal gap extending between a first formed shielding member and a formed conductive member is equal to a horizontal gap extending between a second formed shielding member and a formed conductive member. The device of claim 4 , wherein the conductive member is formed to have a rectangular cross-section.

7. The apparatus of claim 6, wherein the first shield member and the second shield member each have a rectangular cross-section.

8. The apparatus of claim 1 , wherein the formed conductive member is a first formed conductive member, wherein the socket connection further comprises a second formed conductive member extending from a second contact at the first end to a second slot near the second end, wherein the second slot is configured to align with a second contact of the device, wherein the second formed conductive member comprises a flexible bend.

9. The apparatus of claim 1 , wherein the receptacle connection formed adjacent the first end of the conductive member further comprises: a ball guide layer having slots that guide the device's contacts into position during installation; a conductive plate coupled to the ground node to form a first ground plane, wherein the shield member is formed to contact the conductive plate; and A reinforcement layer is configured to provide structural support to the ball guide layer and the conductive plate.

10. A socket connection comprising: a conductive member formed to have a shape that applies a contact force when in operation, the conductive member formed to extend from the first contact to the first slot, wherein the first slot is configured to align with the first contact of the device; as well as a formed shield member having the same shape as the formed conductive member and mounted adjacent to a first side of the formed conductive member, the formed shield member extending from the first ground plane to the second ground plane, Wherein the socket connection further comprises: a printed circuit board for providing an interface between a tester and the formed conductive member for testing the device; a printed circuit board cover formed on the printed circuit board to protect the printed circuit board; and A conductive layer is formed over the printed circuit board cover, the conductive layer being coupled to the ground node to form a second ground plane, wherein the shielding member is formed to contact the conductive layer.

11. The socket connection of claim 10 , wherein the formed shield member is a first formed shield member, the socket connection further comprising a second formed shield member having the same shape as the formed conductive member and mounted adjacent to a second side of the formed conductive member, the second formed shield member extending from the first ground plane to the second ground plane.

12. The socket connection of any one of claims 10-11, wherein the conductive member is formed to have one of a C-shape or a J-shape.

13. The socket connection of any one of claims 10-11, wherein the conductive member is formed to have a rectangular cross-sectional shape.

14. The socket connection of any one of claims 10-11, wherein the socket connection further comprises: a first layer configured to provide structural support; as well as A conductive layer is formed over the first layer, the conductive layer coupled to a ground node to form a first ground plane, wherein the shielding member is formed to contact the conductive layer.

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