A fully automatic IC burning machine

Abstract

A fully automatic IC burning machine includes a loading component, a positioning component, a burning component, a unloading component, and a turntable reciprocating robot component. The IC chip is loaded from the loading component, pre-positioned by the positioning component, and then enters the burning component to complete the burning. Finally, the unloading component unloads the IC chip. The turntable reciprocating robot component includes a turntable and three robots that rotate around the center of the turntable. Each robot performs a material picking and placing operation on the IC chip. The turntable rotates once and can complete three actions at the same time: the material of the loading component is sent to the positioning component, the material of the positioning component is sent to the burning component, and the material of the burning component is sent to the unloading component. Compared with the prior art, the present invention (1) adopts a positioning component to pre-position the IC chip before burning, thereby improving the later burning efficiency; (2) through the turntable reciprocating robot component, the steps involved in each burning cycle process can be performed simultaneously, which greatly improves the operation efficiency of the whole machine.

Description

Technical Field

[0001] The present invention relates to the field of burning technology, in particular to a fully automatic IC burning machine. The present invention is mainly used in the burning and curing procedures in IC chips, and is suitable for electronic chip industries such as mobile phones, tablet computers, game consoles, manipulators, and artificial intelligence. Background Art

[0002] The fully automatic IC burning machine for mobile phone IC chips currently on the market is mainly composed of the following parts: a loading feeder, a linear XYZ-axis motion manipulator, a fixedly arranged multi-station burning fixture, and a unloading and taping closing module. The actions can be roughly divided into the following steps: 1. Manually place the IC chip on the loading station of the loading feeder; 2. The cylinder of the loading feeder moves to push the material tape to move and send the IC chip to the loading and picking position of the loading feeder; 3. The linear XYZ-axis motion manipulator picks up the material from the loading and picking position of the loading feeder and moves and places it on the multi-station burning fixture for program burning; 4. After burning is completed, the linear XYZ-axis motion manipulator picks up the burned IC chip from the multi-station burning fixture and moves and places it on the tape of the unloading and taping closing module and rolls it up.

[0003] The machines currently on the market have the following defects: 1. Failure to use a pre-positioning fixture will cause inaccurate positioning and affect the burning efficiency;

[0004] 2. Each burning cycle involves many steps such as loading, burning, unloading and collecting. Waiting for each step to be completed before proceeding to the next step is inefficient;

[0005] 3. Each burning cycle needs to wait for the multi-station burning fixture to burn before taking the material. The length of the burning time directly affects the efficiency of the whole machine;

[0006] 4. The linear XYZ axis motion manipulator moves frequently, has a high failure rate, and affects efficiency. Summary of the invention

[0007] The object of the present invention is to provide a fully automatic IC burning machine to solve one or more defects mentioned in the background technology.

[0008] The present invention is achieved in that:

[0009] A fully automatic IC burning machine, comprising a feeding component, a positioning component, a burning component, a feeding component and a turntable reciprocating manipulator component, wherein the IC chip is fed from the feeding component, pre-positioned by the positioning component, and then enters the burning component to complete the burning procedure, and finally unloaded by the unloading component; wherein the turntable reciprocating manipulator component comprises a turntable and three manipulators rotating around the center of the turntable, each manipulator performs a material taking and placing operation on the IC chip; the material outlet of the feeding component, the material inlet and outlet of the positioning component, the material inlet and outlet of the burning component and the unloading component The feeding ports of the parts are evenly arranged along the center of the turntable in sequence; when in the initial position, the three manipulators correspond to the feeding port of the loading component, the feeding port of the positioning component, and the feeding port of the burning component, and the three manipulators take the materials at the same time; after the turntable rotates a fixed angle, the three manipulators correspond to the feeding port of the positioning component, the feeding port of the burning component, and the feeding port of the unloading component, and the three manipulators discharge the materials at the same time; after the turntable rotates in the opposite direction by a fixed angle, the three manipulators return to the initial position and wait for the next round of taking and discharging.

[0010] In order to more clearly explain the action process of the present invention, it is assumed that the manipulator only completes the material picking and placing process by moving up and down. In fact, the present invention does not limit the working mode of the manipulator. The action process of the present invention is as follows:

[0011] (1) When in the initial position, the three manipulators correspond to the discharge port of the loading component, the inlet and outlet of the positioning component, and the inlet and outlet of the burning component, respectively, that is, they are directly above the position. The three manipulators descend at the same time to pick up the materials. After picking up the materials, the three manipulators are lifted up again.

[0012] (2) After the turntable rotates a fixed angle, the three manipulators correspond to the positions of the inlet and outlet of the positioning component, the inlet and outlet of the burning component, and the inlet of the blanking component, that is, they are directly above the position. The three manipulators descend to discharge the materials, and after discharging the materials, the three manipulators are lifted up again; the IC chips complete the corresponding processes in the positioning component, the burning component, and the blanking component respectively.

[0013] (3) After the turntable rotates in the opposite direction at a fixed angle, the three manipulators return to their initial positions and wait for the next round of material picking and placing.

[0014] By adopting the technical solution of the present invention, the turntable rotates once to complete three actions at the same time: the material of the loading component is sent to the positioning component, the material of the positioning component is sent to the burning component, and the material of the burning component is sent to the unloading component. At the same time, the steps involved in each burning cycle process can be carried out synchronously without waiting, so the high-efficiency operation of the fully automatic IC burning machine can be achieved.

[0015] As a further improvement of the present invention, each rotation of the turntable is a 90° counterclockwise or clockwise rotation.

[0016] As a further improvement of the present invention, the burning component includes a rotation center and a plurality of burning stations evenly arranged along the rotation center. An IC chip carrier is provided above the burning station. Each IC chip carrier rotates along the rotation center. The IC chip falls into the IC chip carrier through the inlet and outlet of the burning component, rotates clockwise or counterclockwise along the rotation center for burning, and finally returns to the inlet and outlet of the burning component to complete the burning procedure.

[0017] The action process of this technical solution is: when the robot puts the IC chip to be burned into the inlet and outlet of the burning component, the IC chip carrier rotates an angle, and the IC chip to be burned continues to perform the burning procedure on the IC chip carrier, and another blank IC chip carrier rotates into the inlet and outlet of the burning component, waiting for the new IC chip to be put in, so that multiple IC chips can be burned at the same time; when the IC chip on the IC chip carrier is burned, the IC chip carrier rotates an angle, returns to the inlet and outlet of the burning component, is taken away by the robot, and the blank IC chip carrier continues to wait for the next IC chip to be burned. With this technical solution, multiple IC chips can be burned at the same time, improving the overall work efficiency.

[0018] As a further improvement of the present invention, each manipulator includes a swing arm arranged along the radial direction of the turntable, and a clamping claw or a suction nozzle is provided at the end of the swing arm; the angles between the swing arms of adjacent manipulators are 90°, 90° and 180° respectively. With this technical solution, the components of the present invention are compactly and reasonably distributed, and the process connection is smoother.

[0019] As a further improvement of the present invention, the discharge port of the loading component, the inlet and outlet of the positioning component, the inlet and outlet of the burning component, and the inlet of the unloading component are respectively located at the six o'clock, nine o'clock, twelve o'clock, and three o'clock directions of the turntable. With this technical solution, the components of the present invention are compactly and reasonably distributed, and the process connection is smoother.

[0020] As a further improvement of the present invention, the blanking component also includes a laser marking function module. After the IC chip completes the burning program, it enters the laser marking function module through the feeding port of the blanking component to complete the laser marking. With this technical solution, the present invention can perform laser marking on IC chips, the function is more complete, the semi-finished product processing link is reduced, and the overall processing time is shortened.

[0021] As a further improvement of the present invention, the blanking component also includes a tape sealing module. After the IC chip completes the burning process, it enters the tape sealing module through the feeding port of the blanking component for tape braiding and tape sealing. With this technical solution, the present invention can perform tape braiding and tape sealing on IC chips, including sealing the carrier tape with the IC chip with the cover tape, which has more complete functions, reduces the semi-finished product processing links, and shortens the overall processing time.

[0022] As a further improvement of the present invention, the material unloading assembly further includes a tape collection module. After the IC chip is completed with tape weaving and sealing, it enters the tape collection module to collect the finished tape that has been sealed. With this technical solution, the present invention can collect the IC chip, including accurately positioning the unloading position of the tape, collecting the finished tape that has been sealed, and the function is more perfect, reducing the semi-finished product processing links and shortening the overall processing time.

[0023] As a further improvement of the present invention, it also includes a frame for installing the feeding assembly, positioning assembly, burning assembly, unloading assembly and turntable reciprocating robot assembly, and a control module connected to the feeding assembly, positioning assembly, burning assembly, unloading assembly and turntable reciprocating robot assembly respectively. With this technical solution, the present invention completes the full automatic control of each assembly through the control module.

[0024] Compared with the prior art, the present invention has the following beneficial effects: (1) using a positioning component to pre-position the IC chip before burning, thereby improving the later burning efficiency;

[0025] (2) Through the turntable reciprocating robot assembly, the steps involved in each burning cycle can be carried out simultaneously without waiting one by one, thus improving the overall efficiency;

[0026] (3) The problem of burning multiple IC chips at the same time is solved by using a burning component with a rotation center and multiple burning stations. The burning time will not affect the efficiency of the whole machine.

[0027] (4) The turntable reciprocating manipulator assembly uses three rotating manipulators to complete the material picking and placing operations. It has a simple movement mode, low failure rate, and simple control program. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention is a schematic structural diagram of a fully automatic IC burning machine.

[0029] Figure 2 The present invention provides a flow chart of the steps involved in a fully automatic IC burning machine.

[0030] Description of the drawings: 1-loading assembly, 10-discharge port of loading assembly, 2-positioning assembly, 20-inlet and outlet of positioning assembly, 3-burning assembly, 30-inlet and outlet of burning assembly, 31-IC chip carrier, 4-unloading assembly, 40-inlet of unloading assembly, 5-turntable reciprocating robot assembly, 50-robot, 6-laser marking function module, 7-tape sealing module, 8-tape taking-up module, 9-frame. DETAILED DESCRIPTION

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0032] Example 1

[0033] like Figure 1 The fully automatic IC burning machine shown in the figure comprises a loading component 1, a positioning component 2, a burning component 3, a blanking component 4 and a turntable reciprocating manipulator component 5. The IC chip is loaded from the loading component 1, pre-positioned by the positioning component 2, enters the burning component 3 to complete the burning program, and finally is unloaded by the blanking component 4.

[0034] The turntable reciprocating robot assembly 5 includes a turntable and three robots 50 that rotate around the center of the turntable, and each robot 50 performs a material picking and placing operation on the IC chip.

[0035] The discharge port 10 of the loading assembly, the inlet and outlet port 20 of the positioning assembly, the inlet and outlet port 30 of the burning assembly, and the inlet port 40 of the unloading assembly are uniformly arranged in sequence along the center of the turntable.

[0036] When in the initial position, the three manipulators 50 correspond to the discharge port 10 of the loading component, the inlet and outlet port 20 of the positioning component, and the inlet and outlet port 30 of the burning component, respectively, and the three manipulators 50 take materials simultaneously; after the turntable rotates a fixed angle, the three manipulators 50 correspond to the inlet and outlet port 20 of the positioning component, the inlet and outlet port 30 of the burning component, and the inlet port 40 of the unloading component, respectively, and the three manipulators 50 discharge materials simultaneously; after the turntable rotates in the opposite direction by a fixed angle, the three manipulators 50 return to the initial position and wait for the next round of taking and discharging materials.

[0037] Preferably, the feeding component 1 is a feeding flyer; the positioning component 2 is provided with a positioning fixture to adjust and pre-position the IC chip.

[0038] Furthermore, each rotation of the turntable is 90° counterclockwise or clockwise.

[0039] Furthermore, each manipulator 50 includes a swing arm arranged radially along the turntable, and a clamp or a suction nozzle is provided at the end of the swing arm. Preferably, suction can be performed by a vacuum pump in combination with the suction nozzle, and the vacuum suction method is used, which is not easy to damage the IC chip.

[0040] Furthermore, the angles between the swing arms of adjacent manipulators 50 are 90°, 90° and 180° respectively. With this technical solution, the components of the present invention are compactly and reasonably distributed, and the process connection is smoother.

[0041] Furthermore, the discharge port 10 of the loading component, the inlet and outlet port 20 of the positioning component, the inlet and outlet port 30 of the burning component, and the inlet port 40 of the unloading component are respectively located at the six o'clock, nine o'clock, twelve o'clock, and three o'clock directions of the turntable. With this technical solution, the components of the present invention are compactly and reasonably distributed, and the process connection is smoother.

[0042] In order to more clearly illustrate the action process of the present invention, it is preferred that the manipulator completes the material picking and placing process only by up and down movement. In fact, the present invention does not limit the working mode of the manipulator, and assumes that the starting action of the turntable is a 90° clockwise rotation.

[0043] Based on the above preferred solution, Figure 2 As shown, the action process of the present invention is as follows:

[0044] (1) When in the initial position, the three manipulators 50 correspond to the positions of the discharge port 10 of the loading component, the inlet and outlet port 20 of the positioning component, and the inlet and outlet port 30 of the burning component, respectively, that is, they are directly above the position. The three manipulators 50 descend at the same time, and the suction nozzle completes the material removal. After the material is removed, the three manipulators are lifted up again.

[0045] (2) After the turntable rotates 90° clockwise, the three manipulators 50 correspond to the positions of the inlet and outlet ports 20 of the positioning component, the inlet and outlet ports 30 of the burning component, and the inlet port 40 of the blanking component, that is, they are directly above the positions. The three manipulators 50 descend, and the suction nozzles complete the discharge. After the discharge, the three manipulators are lifted up again; the IC chips complete the corresponding processes in the positioning component 2, the burning component 3, and the blanking component 4 respectively.

[0046] (3) After the turntable rotates 90° in the opposite direction, the three manipulators 50 return to their initial positions and wait for the next round of material picking and placing.

[0047] By adopting the technical solution of the present invention, the turntable rotates once to complete three actions at the same time: the material of the loading component 1 is sent to the positioning component 2, the material of the positioning component 2 is sent to the burning component 3, and the material of the burning component 3 is sent to the unloading component 4. At the same time, the steps involved in each burning cycle process can be carried out synchronously without waiting, so the high-efficiency operation of the fully automatic IC burning machine can be achieved.

[0048] The beneficial effects of this embodiment are:

[0049] (1) Using positioning component 2 to pre-position the IC chip before burning, so as to improve the later burning efficiency;

[0050] (2) Through the turntable reciprocating robot assembly 5, the steps involved in each burning cycle process can flow simultaneously without waiting one by one, thereby improving the overall efficiency;

[0051] (3) The turntable reciprocating manipulator assembly 5 uses three rotating manipulators 50 to complete the material picking and placing operations, with a simple movement mode, low failure rate and simple control program.

[0052] Example 2

[0053] On the basis of the embodiment 1, the burning component 3 can be further improved.

[0054] The burning component 3 includes a rotation center and a plurality of burning stations evenly arranged along the rotation center. An IC chip carrier 31 is arranged above the burning station. Each IC chip carrier 31 rotates along the rotation center. The IC chip falls into the IC chip carrier 31 through the inlet and outlet port 30 of the burning component, rotates clockwise or counterclockwise along the rotation center for burning, and finally returns to the inlet and outlet port 30 of the burning component to complete the burning procedure.

[0055] The action process of this technical solution is: when the robot 50 puts the IC chip to be burned into the inlet and outlet port 30 of the burning component, the IC chip carrier 31 rotates an angle, and the IC chip to be burned continues the burning procedure on the IC chip carrier 31, and another blank IC chip carrier 31 rotates into the inlet and outlet port 30 of the burning component, waiting for the new IC chip to be put in, so that multiple IC chips can be burned at the same time.

[0056] When the IC chip on the IC chip carrier 31 is burned, the IC chip carrier 31 rotates an angle and returns to the inlet and outlet 30 of the burning component, and is taken away by the robot 50. The blank IC chip carrier 31 continues to wait for the next IC chip to be burned. With this technical solution, multiple IC chips can be burned at the same time, which improves the overall work efficiency.

[0057] The technical solution of Example 2 is adopted, and the problem of simultaneous burning of multiple IC chips is solved through a burning component with a rotation center and multiple burning stations, so that the robot can pick up and put materials without waiting. The length of the burning time will not affect the efficiency of the whole machine, which greatly improves the operating efficiency of the whole machine.

[0058] Example 3

[0059] On the basis of Embodiment 1 or 2, it is preferred that the blanking component 4 is equipped with a laser marking function module 6, a tape sealing module 7 and a tape taking-up module 8.

[0060] Furthermore, the blanking component 4 also includes a laser marking function module 6. After the IC chip completes the burning process, it enters the laser marking function module 6 through the feeding port 40 of the blanking component to complete the laser marking. Figure 1 As shown, the laser marking function module 6 is preferably arranged above the IC chip.

[0061] Furthermore, the blanking assembly 4 further comprises a tape sealing module 7. After the IC chip has completed the burning process, it enters the tape sealing module 7 through the feeding port 40 of the blanking assembly for tape weaving and sealing, specifically including sealing the carrier tape with the IC chip with the cover tape. Figure 1 As shown, the tape sealing module 7 is preferably arranged behind the laser marking function module 6, and after the laser marking is completed, the tape is braided and sealed.

[0062] Furthermore, the material unloading component 4 also includes a tape collection module 8. After the IC chip is finished with tape weaving and sealing, it enters the tape collection module 8, accurately locates the tape unloading position, and collects the finished tape that has been sealed. Figure 1 As shown, the tape collecting module 8 is preferably arranged behind the tape sealing module 7 to make the process connection more compact.

[0063] Adopt the technical scheme of this embodiment 3, such as Figure 2 As shown, the present invention can perform laser marking, tape weaving, sealing and tape collection on IC chips, with more complete functions, reducing the semi-finished product processing links and shortening the overall processing time.

[0064] Example 4

[0065] On the basis of Example 3, it also includes a frame 9 for installing the feeding component 1, the positioning component 2, the burning component 3, the unloading component 4 and the turntable reciprocating robot component 5, and a control module respectively connected to the feeding component 1, the positioning component 2, the burning component 3, the unloading component 4 and the turntable reciprocating robot component 5. With this technical solution, the present invention finally realizes the full-automatic control of each component through the control module, and obtains the full-automatic IC burning machine of the present invention.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic IC burning machine, characterized in that: It includes a loading component, a positioning component, a burning component, a blanking component and a turntable reciprocating robot component. The IC chip is loaded from the loading component, pre-positioned by the positioning component, and then enters the burning component to complete the burning process, and finally unloaded by the blanking component; Among them, The turntable reciprocating manipulator assembly includes a turntable and three manipulators rotating around the center of the turntable, each manipulator performs a material pick-up and placement operation on the IC chip; the material outlet of the loading assembly, the material inlet and outlet of the positioning assembly, the material inlet and outlet of the burning assembly, and the material inlet of the unloading assembly are uniformly arranged along the center of the turntable in sequence; When in the initial position, the three manipulators correspond to the discharge port of the loading component, the inlet and outlet of the positioning component, and the inlet and outlet of the burning component, and the three manipulators take materials at the same time; after the turntable rotates a fixed angle, the three manipulators correspond to the inlet and outlet of the positioning component, the inlet and outlet of the burning component, and the inlet of the unloading component, and the three manipulators discharge materials at the same time; after the turntable rotates in the opposite direction by a fixed angle, the three manipulators return to the initial position and wait for the next round of taking and discharging materials; The burning assembly includes a rotation center and a plurality of burning stations evenly arranged along the rotation center. An IC chip carrier is arranged above the burning station. Each IC chip carrier rotates along the rotation center. The IC chip falls into the IC chip carrier through the inlet and outlet of the burning assembly, rotates clockwise or counterclockwise along the rotation center for burning, and finally returns to the inlet and outlet of the burning assembly to complete the burning procedure; each rotation action of the turntable is a counterclockwise or clockwise rotation of 90°; each manipulator includes a radially arranged turntable. A swing arm, the end of which is provided with a clamp or a suction nozzle; the angles between the swing arms of adjacent manipulators are 90°, 90° and 180° respectively; the discharge port of the loading component, the inlet and outlet of the positioning component, the inlet and outlet of the burning component, and the inlet of the unloading component are respectively located at the six o'clock, nine o'clock, twelve o'clock and three o'clock directions of the turntable; the unloading component also includes a laser marking function module, and after the IC chip completes the burning program, it enters the laser marking function module through the inlet of the unloading component to complete laser marking.

2. The fully automatic IC burning machine according to claim 1, characterized in that: The blanking component also includes a tape sealing module. After the IC chip completes the burning program, it enters the tape sealing module through the feeding port of the blanking component for tape weaving and sealing.

3. The fully automatic IC burning machine according to claim 2, characterized in that: The material unloading assembly also includes a tape receiving module. After the IC chip is taped and sealed, it enters the tape receiving module to receive the sealed finished material tape.

4. The fully automatic IC burning machine according to any one of claims 1 to 3, characterized in that: It also includes a frame for installing the loading assembly, positioning assembly, burning assembly, unloading assembly and turntable reciprocating robot assembly, and a control module respectively connected to the loading assembly, positioning assembly, burning assembly, unloading assembly and turntable reciprocating robot assembly.

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