Semiconductor package and method of forming a package

Abstract

An apparatus for packaging semiconductor devices is provided. The apparatus includes a first mold, a second mold, and a support element. The first mold includes a plate. The second mold includes a carrier disposed corresponding to the plate. The carrier defines a hole that penetrates the carrier. The support element is engaged with the hole for supporting an article to be molded.

Description

Technical Field

[0001] This invention relates to apparatus and methods for packaging semiconductor devices. Background Technology

[0002] Mounting electronic components on both sides of a substrate increases substrate utilization, which reduces the total substrate area. In comparable two-sided molding techniques, the edges of the wafer to be molded are placed on a molding machine, and then molding material is applied to encapsulate the wafer. However, due to the large size and thin thickness of the wafer (e.g., a 12-inch wafer with a thickness of less than 300 micrometers (μm), wafer warping can occur, which can cause problems or even damage the wafer during the molding process. Summary of the Invention

[0003] In some aspects of some embodiments, an apparatus for packaging a semiconductor device includes a first mold, a second mold, and a support element. The first mold includes a plate. The second mold includes a carrier disposed corresponding to the plate. The carrier defines a hole penetrating the carrier. The support element engages with the hole to support an object to be molded.

[0004] In some aspects of some embodiments, an apparatus for packaging a semiconductor device includes a first mold, a second mold, and a support element. The first mold includes a plate and a first frame surrounding the plate. The second mold includes a carrier and a second frame surrounding the carrier. The support element is disposed on the carrier and extends from one side wall of the second frame to another side wall of the second frame to divide the carrier into two regions.

[0005] In some aspects of some embodiments, a method of molding an article includes: providing a molding apparatus comprising a top mold and a bottom mold, the bottom mold defining a cavity and including at least one support element on a bottom surface of the cavity; injecting molding material into the cavity; placing the article on the support element; and closing the top mold and the bottom mold such that the molding material covers the top surface and the bottom surface of the article. Attached Figure Description

[0006] Figure 1 A cross-sectional view illustrating a packaging device according to some embodiments of the present invention is provided.

[0007] Figure 2A A cross-sectional view illustrating a packaging device according to some embodiments of the present invention is provided.

[0008] Figure 2B A perspective view illustrating a packaging device according to some embodiments of the present invention.

[0009] Figure 2C A perspective view illustrating a support element according to some embodiments of the present invention.

[0010] Figure 3 A perspective view illustrating a packaging device according to some embodiments of the present invention.

[0011] Figure 4A , Figure 4B , Figure 4C and Figure 4D This describes a method for double-sided molding according to some embodiments of the present invention.

[0012] Figure 5A , Figure 5B , Figure 5C and Figure 5D This describes a method for double-sided molding according to some embodiments of the present invention.

[0013] Common element symbols are used throughout the drawings and detailed description to indicate the same or similar components. The invention is best understood from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation

[0014] Figure 1 A cross-sectional view of a packaging apparatus 1 according to some embodiments of the present invention is shown. The packaging apparatus 1 includes an upper mold 10 and a bottom mold 15.

[0015] The upper mold 10 includes a plate 11 and a frame 12 surrounding the plate 11. The plate 11 is movable vertically relative to the frame 12. For example, the plate 11 can move along... Figure 1 The direction of movement is indicated by arrow A shown in the diagram. In some embodiments, plate 11 may be connected to at least one elastic member 11f to control the movement of plate 11. In some embodiments, the surface 111 of plate 11 and the sidewall 123 of frame 12 define a space.

[0016] In some embodiments, a release membrane 13 is disposed on the surface 111 of the plate 11, the sidewall 123 of the frame 12, and the surface 121 of the frame 12. The release membrane 13 facilitates the release of the molding compound after the molding process.

[0017] The bottom mold 15 includes a plate (e.g., a carrier) 16 and a frame 17 surrounding the plate 16. The plate 16 is positioned corresponding to or aligned with the plate 11 of the upper mold 10. For example, surface 161 of the plate 16 faces surface 111 of the plate 11. The plate 16 is movable vertically relative to the frame 17. For example, the plate 16 can move along... Figure 1 The direction of movement is indicated by arrow B shown in the diagram. As another example, plate 16 can move toward plate 11. In some embodiments, plate 16 may be connected to at least one elastic member 16f to control the movement of plate 16.

[0018] Plate 16 defines at least one hole 16h penetrating plate 16. The hole 16h is formed from the top surface 161 of plate 16 to the bottom surface 162 of plate 16. A support element 18 engages with the hole 16h to support an object to be molded. In some embodiments, the support element 18 comprises three portions 18a, 18b, and 18c. Portion 18a is disposed within the hole 16h. Portion 18b is above the surface 161 of plate 16 and connected to portion 18a. Portion 18c is on portion 18b and connected to portion 18b. From a top or bottom view, the area of ​​portion 18b is larger than the area of ​​portion 18a or 18c. For example, portion 18b is wider than portion 18a or portion 18c. In some embodiments, the hole 16h may be connected to a vacuum device to secure the support element 18 by suction applied in the direction of arrow C. The diameter of part 18b is larger than the diameter of the hole 16h to prevent the support element 18 from falling into the hole 16h by suction. In addition, part 18b can prevent molding material from falling or flowing into the hole 16h during the molding process.

[0019] like Figure 1 As shown, the frame 17 has a stepped structure 17s. The stepped structure 17s has a first surface 17s1 and a second surface 17s2. The first surface 17s1 is lower than the second surface 17s2. In some embodiments, the height H1 of the support element 18 exposed from the plate 16 is substantially the same as the distance H2 from the surface 161 of the plate 16 to the surface 17s1 of the stepped structure 17s. In some embodiments, the distance H3 from the surface 17s1 to the surface 17s2 of the stepped structure 17s is substantially the same as the thickness of the object to be molded.

[0020] In some embodiments, the release membrane is disposed on the surface 161 of the plate 16, on the sidewalls 17s3 and 17s4 of the stepped structure 17s of the frame 17, and on the surfaces 17s1 and 17s2 of the stepped structure 17s of the frame 17. The release membrane 19 is disposed between a portion 18b of the support element 18 and the surface 161 of the plate 16. The release membrane 19 facilitates the release of molding compound after the molding process. The release membrane 19 is secured to the surface 161 of the plate 16 by the portion 18b of the support element 18, which is secured by suction provided by a vacuum device. This mitigates (e.g., avoids) the problem of molding material seepage due to wrinkles in the release membrane 19.

[0021] During the molding process, molding material is injected into the space defined by the surface 161 of plate 16, the sidewalls 17s3 and 17s4 of the stepped structure 17s of frame 17, and the surfaces 17s1 and 17s2 of the stepped structure 17s of frame 17. The molding material may comprise fillers containing epoxy resin, molding compounds (e.g., epoxy molding compounds or other molding compounds), polyimide, phenolic compounds or materials, materials containing silicone dispersed therein, or combinations thereof. The object to be molded (e.g., a wafer, substrate, carrier, etc., on which semiconductor devices or other components are mounted or attached) is placed on the support element 18 and the surface 17s1 of the stepped structure 17s of frame 17. Then, the upper mold 10 and the lower mold 15 move closer to each other.

[0022] In comparable two-sided molding techniques, the edges of the wafer to be molded are placed on the molding machine; however, due to the large size and thin thickness of the wafer (e.g., a 12-inch wafer with a thickness of less than 300 micrometers (μm), wafer warping can occur, which can cause problems or even damage the wafer during the molding process. According to some embodiments, since the object to be molded is simultaneously placed on the surface 17s1 of the stepped structure 17s of the support element 18 and the frame 17, the edges of the object can be supported by the surface 17s1 of the stepped structure of the frame, and the middle portion of the object can be supported by the support element 18. Therefore, warping or damage to the object to be molded can be mitigated or prevented.

[0023] Figure 2A A cross-sectional view illustrating a packaging device 2 according to some embodiments of the present invention is shown. The packaging device 2 is similar to... Figure 1 The packaging device 1 shown in the figure differs in that the support element 28 of the packaging device 2 is arranged across the frame 17, and the release membrane 19 is placed on the support element 28 and between the support element 28 and the plate 16.

[0024] Figure 2B A perspective view illustrating the packaging device 2 according to some embodiments of the present invention is shown. Figure 2B As shown, support element 28 extends from one side wall of frame 17 to the opposite side wall of frame 17. Support element 28 divides plate 16 into a first region 16A and a second region 16B. Figure 2A As shown, the height H4 of the support element 28 is essentially the same as the distance H2 from the surface 161 of the plate 16 to the surface 17s1 of the stepped structure 17s.

[0025] Figure 2CThe detailed structure of the support element 28 according to some embodiments of the present invention is described below. The support element 28 includes a plurality of protrusions 28b. The support element 28 includes a plurality of openings 28o between any two (e.g., adjacent protrusions 28b) to allow molding material to flow between a first region 16A and a second region 16B of the plate 16. Thus, when molding material is injected into the plate 16, the surface of the molding material at the first region 16A is substantially coplanar with the surface of the molding material at the second region 16B.

[0026] In some embodiments, each protrusion 28b defines a first hole h21 penetrating the protrusion 28b from a side surface 281 to an opposite side surface, a second hole h22 penetrating the protrusion 28b from a top surface 282 to an opposite bottom surface, and a third hole h23 penetrating the protrusion 28b from a side surface 283 corresponding to an opening 28o to an opposite side surface. The first hole h21, the second hole h22, and the third hole h23 are interconnected to each other. A release membrane 19 is disposed on a support element 28 to cover the holes h21, h22, and h23. The hole h22 on the bottom surface opposite the top surface 282 is connected to, as Figure 2A The plate 16 shown has a hole 16h (or is connected to or aligned with it), and holes h22 and 16h are connected together to a vacuum device (or are connected to or aligned with it) to secure or fix the release membrane 19 by suction.

[0027] According to some embodiments, the object to be molded is placed on the surface 17s1 of the stepped structure 17s of the support element 28 and the frame 17, and thus the edges of the object can be supported by the surface 17s1 of the stepped structure 17s of the frame 17, and the middle portion of the object can be supported by the support element 28. Therefore, warping or damage to the object to be molded can be mitigated or prevented.

[0028] Figure 3 This illustration shows a perspective view of a packaging device 3 according to some embodiments of the present invention. The packaging device 3 is similar to... Figure 2A-2B The packaging device 2 shown in the figure differs from the packaging device 3 in that it additionally includes a support element 38.

[0029] Support element 38 is disposed on plate 16 and spans or passes through support element 28. In some embodiments, support element 38 is positioned to extend substantially perpendicular to support element 28. Support elements 28 and 38 divide plate 16 into four regions 16A1, 16A2, 16B1, and 16B2. The height of support element 38 is substantially the same as the height of support element 28.

[0030] The structure of support element 38 is similar to that of support element 28. Support element 38 includes a plurality of protrusions, any one of which (e.g., two adjacent protrusions) is partially separated by an opening to allow molding material to flow in four regions 16A1, 16A2, 16B1, and 16B2 of plate 16. Therefore, when molding material is injected into plate 16, the surfaces of the molding material at the four regions 16A1, 16A2, 16B1, and 16B2 are substantially coplanar. In some embodiments, the protrusions of support element 38 include holes on the bottom surface of the protrusions connected to (or in communication with or aligned with) a vacuum device to secure or fix a release membrane disposed on support element 38 by suction.

[0031] Because the packaging device 3 includes an additional support element 38, the device is related to... Figure 2A-2B The packaging device 2 shown in the figure has improved capabilities compared to the one on which the molded object is supported.

[0032] Figure 4A , 4B 4C and 4D illustrate a method for double-sided molding of an article 40 according to some embodiments of the present invention.

[0033] refer to Figure 4A ,supply Figure 1 The packaging device 1 is shown in the figure. In other embodiments, the packaging device 1 may be replaced with... Figure 2A and 3 The encapsulation device 2 or 3 is shown in the diagram. Molding material 41 is injected into the space defined by the surface 161 of the plate 16, the sidewalls 17s3 and 17s4 of the stepped structure 17s of the frame 17, and the surfaces 17s1 and 17s2 of the stepped structure 17s of the frame 17. Molding material 41 may comprise fillers containing epoxy resin, molding compounds (e.g., epoxy molding compounds or other molding compounds), polyimide, phenolic compounds or materials, materials containing silicone dispersed therein, or combinations thereof.

[0034] refer to Figure 4B The object 40 to be molded is then placed on the surface 17s1 of the stepped structure 17s of the support element 18 and the frame 17. The object 40 defines at least one opening 40h penetrating the object 40. In some embodiments, the object 40 may be a wafer, substrate, carrier, or other object to be molded. The opening 40h is formed at a predetermined location on the object 40 that does not include electronic components or traces.

[0035] After the object 40 is placed on the surface 17s1 of the stepped structure 17s of the support element 18 and the frame 17, the molding material 41 flows from the bottom surface 402 of the object 40 to the opening 40h. In some embodiments, the molding material 41 may further flow from the opening 40h to the top surface 401 of the object 40.

[0036] refer to Figure 4C The upper mold 10 and the bottom mold 15 move close to each other, such that the lateral portions of the object 40 are secured in the stepped structure 17s, and the molding material 41 is then uniformly formed or disposed on the top surface 401 and the bottom surface 402 of the object 40. In some embodiments, before the upper mold 10 and the bottom mold 15 are moved close to each other, the top surface of the portion 18c of the support element 18 is lower than the first surface 17s1 of the frame 17 and supports the bendable middle portion of the object 40. After the upper mold 10 and the bottom mold 15 are closed, the plate 16 moves toward the plate 11 to force the molding material 41 to flow through the opening 40h to the top surface 401 of the object 40. In some embodiments, the plate 16 moves toward the plate 11 such that the top surface of the portion 18c of the support element 18 is substantially coplanar with the first surface 17s1 of the frame 17.

[0037] In some embodiments, the molding material 41 is in a liquid state before being introduced into the space defined by the surface 161 of the plate 16, the sidewalls 17s3, 17s4 of the stepped structure 17s of the frame 17, and the surfaces 17s1, 17s2 of the stepped structure 17s of the frame 17. In other embodiments, the molding material 41 is in a solid state (e.g., powder) before being introduced into the space defined by the surface 161 of the plate 16, the sidewalls 17s3, 17s4 of the stepped structure 17s of the frame 17, and the surfaces 17s1, 17s2 of the stepped structure 17s of the frame 17. After the upper mold 10 and the lower mold 15 are closed, heat is applied to the molding material 41 to change the molding material 41 from a solid state to a liquid state, allowing the molding material 41 to flow to the top surface 401 and the bottom surface 402 of the article 40. After the plate 16 is moved toward the plate 11, the molding material 41 is cured or hardened by providing heat to the molding material 41.

[0038] In some embodiments, the molding material 41 in a liquid state is applied to the top surface 401 of the object 40, rather than to the space defined by the surface 161 of the plate 16, the sidewalls 17s3 and 17s4 of the stepped structure 17s of the frame 17, and the surfaces 17s1 and 17s2 of the stepped structure 17s of the frame 17. The object 40 is then placed on the bottom mold 15 (e.g., on the support element 18 and the surface 17s1 of the stepped structure 17s of the frame 17), and the molding material 41 is introduced from the top surface 401 of the object 40 through the opening 40h to the bottom surface 402 of the object 40.

[0039] refer to Figure 4D After the molding material 41 has hardened or solidified, the object 40, the molding material 41, and the support element 18 are released.

[0040] According to some embodiments, both the top surface 401 and the bottom surface 402 of the object 40 can be molded simultaneously. For example, both sides of the object 40 can be molded in a single molding process, which can reduce manufacturing costs and time.

[0041] Figure 5A , 5B 5C and 5D illustrate a method for double-sided molding of an article 50 according to some embodiments of the present invention. Figures 5A-5D The operations shown are respectively similar to Figures 4A-4D The operation shown in the figure differs in that the object to be molded, 50, is different from the object 40.

[0042] like Figure 5B As shown, the width D51 of the object 50 is less than the distance D52 between the sidewalls 17s4 of the stepped structure 17s of the frame 17. The object 50 is placed on the surface 17s1 of the stepped structure 17s, which is a part of the support element 18 and the frame 17. In other words, a part of the surface 17s1 of the frame 17 does not support the object 50. After the object 50 is placed, a gap 50g is formed between the side surface 503 of the object 50 and the sidewall 17s3 of the frame 17, and thus the molding material 41 flows from the bottom surface 502 of the object 50 through the gap 50g to the top surface 501 of the object 50.

[0043] refer to Figure 5C The upper mold 10 and the bottom mold 15 move closer to each other, and the molding material 41 is then simultaneously and uniformly formed or placed on the top surface 501 and the bottom surface 502 of the object 50.

[0044] refer to Figure 5D After the molding material 41 has hardened or solidified, the object 50, the molding material 51, and the support element 18 are released.

[0045] According to some embodiments, both the top surface 501 and the bottom surface 502 of the object 50 can be molded simultaneously. For example, both sides of the object 50 can be molded in a single molding process, which can reduce manufacturing costs and time.

[0046] As used herein, the terms “approximately,” “basically,” “generally,” and “about” are used to describe and account for small variations. When used in conjunction with an event or situation, the terms can refer to a situation in which the event or situation has clearly occurred or is very close to occurring. For example, when used in conjunction with numerical values, the terms can refer to a range of variation less than or equal to ±10% of the value (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%). For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" the same. For example, "substantially" parallel might refer to a range of angular variation of less than or equal to ±10° relative to 0° (e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°). For example, “basically” vertical can refer to a range of angular variations of less than or equal to ±10° relative to 90° (e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°).

[0047] If the displacement between two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar.

[0048] Additionally, quantities, ratios, and other values ​​are sometimes presented in range format in this document. This range format is used for convenience and brevity and should be flexibly interpreted to include not only the values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within the range, as if each value and subrange were explicitly specified.

[0049] As used herein, the terms “conductivity,” “electricity,” and “conductivity” refer to the ability to conduct electric current. Conductive materials generally indicate those that exhibit very little or no resistance to the flow of electric current. A measure of conductivity is Siemens per meter (S / m). Typically, conductive materials are those with a conductivity greater than about 10. 4 S / m (e.g., at least 10) 5 S / m or at least 10 6 A material with conductivity of S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0050] In the description of some embodiments, a component provided "on" or "above" another component may cover the case where the preceding component is directly on the following component (e.g., in physical contact with the following component), and the case where one or more intermediate components are located between the preceding and following components.

[0051] Although the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of the invention. It will be readily understood by those skilled in the art that various changes may be made and equivalent components may be substituted within the embodiments without departing from the true spirit and scope of the invention as defined by the appended claims. The illustrations may not be drawn to scale. Artistic representations of the invention may differ from actual devices due to variables in the manufacturing process, etc. Other embodiments of the invention may exist that are not specifically described. The description and drawings should be considered illustrative rather than restrictive. Modifications may be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.

Claims

1. An apparatus for packaging semiconductor devices, comprising: a first mold (10) including a plate (11); a second mold (15) including a carrier (16) disposed corresponding to the plate and a first frame (17) surrounding the carrier, wherein the carrier has a first surface (161) facing the plate and defines at least one hole (16h) penetrating the carrier, wherein the first frame comprises a stepped structure; a support element (18) including a first portion (18a) disposed in the hole, a second portion (18b) located above the first surface and connected to the first portion, and a third portion (18c) located above and connected to the second portion, wherein a width of the second portion is greater than the first portion and the third portion, the support element for supporting an object to be molded (40); and a release film (19) disposed between the second portion and the first surface of the carrier, wherein the first portion passes through the release film.

2. The apparatus of claim 1, wherein the first mold further includes a second frame (12) surrounding the plate, and the plate is movable relative to the second frame.

3. The apparatus of claim 1, wherein the carrier is movable relative to the first frame.

4. The apparatus of claim 3, wherein the first frame and the carrier define a space for accommodating the object to be molded (40).

5. The apparatus of claim 3, wherein the stepped structure of the first frame is configured to place the object to be molded.

6. The apparatus of claim 1, wherein the hole is configured to apply a suction force to the support element.

7. The apparatus of claim 1, wherein the support element (18) is configured to connect the object to be molded (40) via a molding material (41) and to be removed from the apparatus together with the object to be molded.

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