Physical quantity sensor, inertial measurement unit, electronic device, and moving body

Abstract

The present invention provides a physical quantity sensor, an inertial measurement unit, an electronic device, and a moving body. It is possible to reduce temperature hysteresis and the like of a physical quantity and improve detection accuracy. The physical quantity sensor is characterized by including: a container including a housing portion and a bottom plate constituting an inner bottom surface of the housing portion; a sensor element mounted on the inner bottom surface; a circuit element mounted on a surface of the sensor element opposite to the inner bottom surface side, the circuit element being electrically connected to the sensor element; and a GND pattern provided on the bottom plate, the GND pattern being provided so as to be separated from the inner bottom surface.

Description

Technical Field

[0001] The present invention relates to a physical quantity sensor, an inertial measurement unit, an electronic device, and a moving body. Background Art

[0002] In recent years, as an electronic device, a physical quantity sensor manufactured using silicon MEMS (Micro Electro Mechanical System) technology has been developed. As such a physical quantity sensor, for example, Patent Document 1 discloses a capacitance-type physical quantity sensor (mechanical quantity sensor) including an element having movable electrodes and fixed electrodes arranged to face each other in a comb shape, and detecting a physical quantity based on the capacitance generated between the two electrodes.

[0003] In addition, as a method of mounting a sensor on a package, for example, Patent Document 2 discloses a structure in which a semiconductor chip (microphone chip) is mounted on the bottom surface (inner bottom surface) of a recess of a semiconductor package.

[0004] However, in such a structure, there is a possibility that the characteristics deteriorate due to the influence of radiation noise from the periphery of the package.

[0005] In an electronic device, in order to reduce the influence of radiation noise, for example, Patent Document 3 discloses that radiation noise can be blocked by electrically connecting a metal lid covering the upper surface of a container and a metal GND plane arranged on the bottom surface (inner bottom surface) inside the container.

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-139505

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 2008-288492

[0008] Patent Document 3: Japanese Patent Application Laid-Open No. 2013-063712

[0009] However, through experiments, it has been found that when a silicon MEMS type physical quantity sensor element is mounted in the packages described in these patent documents, radiation noise from the outside of the package can be reduced, but due to the unevenness or deformation of the surface of the GND pattern caused by the difference in the linear expansion coefficients of the GND pattern formed on the inner bottom surface of the package and the bottom plate, deformation occurs in the physical quantity sensor element through propagation, resulting in deterioration of the temperature characteristics and generation of a new problem of temperature hysteresis. Summary of the Invention

[0010] The present invention is used to solve at least a part of the above problems and can be realized by the following means or application examples.

[0011] [Application Example 1] The physical quantity sensor of this application example is characterized by including: a container including a receiving portion and a bottom plate constituting the inner bottom surface of the receiving portion; a sensor element mounted on the inner bottom surface; a circuit element mounted on a surface of the sensor element opposite to the inner bottom surface side, the circuit element being electrically connected to the sensor element; and a GND pattern provided on the bottom plate, the GND pattern being provided so as to be separated from the inner bottom surface.

[0012] In the physical quantity sensor according to this application example, since the GND pattern is provided so as to be separated from the inner bottom surface, unevenness or deformation on the surface of the GND pattern caused by residual stress generated due to the difference in the linear expansion coefficients of the GND pattern and the bottom plate is alleviated by a part of the bottom plate existing between the GND pattern and the inner bottom surface. Therefore, it is not easily transmitted to the sensor element, and temperature hysteresis caused by residual stress can be reduced.

[0013] [Application Example 2] Preferably, in the physical quantity sensor described in the above application example, in a plan view observed from a direction in which the sensor element and the container overlap, the GND pattern is arranged to overlap with the sensor element.

[0014] According to this application example, since the GND pattern is arranged to overlap with the sensor element in a plan view, radiation noise from the outside of the container that affects the sensor element from the bottom plate side can be intercepted by the GND pattern. Therefore, the influence of radiation noise can be reduced.

[0015] [Application Example 3] Preferably, in the physical quantity sensor described in the above application example, the bottom plate is a laminated substrate in which a plurality of substrates are laminated.

[0016] According to this application example, a plurality of substrates can be provided between the GND pattern and the inner bottom surface. Therefore, unevenness or deformation on the surface of the GND pattern caused by residual stress is further alleviated and is not easily transmitted through the sensor element, and temperature hysteresis can be reduced. In addition, between the laminated substrates, a detour pattern of wiring (metal plating) can be provided. Therefore, a complex wiring pattern can be arranged without increasing the size of the container in a plan view.

[0017] [Application Example 4] Preferably, in the physical quantity sensor described in the above application example, the number of laminated layers of the laminated substrate is three.

[0018] According to this application example, since there are two substrates and between the substrates, a more complex wiring pattern can be arranged.

[0019] [Application Example 5] Preferably, in the physical quantity sensor described in the above application example, the container includes: the bottom plate; a ring-shaped substrate laminated on the bottom plate; and a lid having conductivity. The lid seals the opening of the recess formed by the bottom plate and the ring-shaped substrate so that the recess becomes a sealed space, and the recess is the accommodating portion.

[0020] According to this application example, by accommodating the sensor element, the sealed space provided between the flat bottom plate, the ring-shaped substrate, and the lid can be cut off from the atmosphere outside the container, and a high-performance physical quantity sensor can be provided.

[0021] [Application Example 6] Preferably, in the physical quantity sensor described in the above application example, the lid and the GND pattern are electrically connected via a conductive layer or a conductor. The conductive layer is formed at an arc-shaped cut provided on the side surface of the container, and the conductor is filled in a hole penetrating the ring-shaped substrate.

[0022] According to this application example, the lid having conductivity and the GND pattern are electrically connected via a conductive layer or a conductor. Therefore, the radiation noise from the outside of the container that affects the sensor element from the lid side or the bottom plate side of the container is cut off by the lid and the GND pattern, and thus the influence of the radiation noise can be further reduced.

[0023] [Application Example 7] Preferably, in the physical quantity sensor described in the above application example, the GND pattern is provided between any layers of the laminated substrate.

[0024] According to this application example, the GND pattern is provided between any layers of the laminated substrate. Therefore, at least one layer of the substrate is interposed between the GND pattern and the inner bottom surface, thereby alleviating the unevenness or deformation on the surface of the GND pattern caused by residual stress and making it difficult to propagate to the sensor element, and the temperature hysteresis can be reduced.

[0025] [Application Example 8] Preferably, in the physical quantity sensor described in the above application example, the GND pattern is provided on the outer surface of the bottom plate on the side opposite to the inner bottom surface side.

[0026] According to this application example, the GND pattern is provided on the outer surface of the bottom plate on the side opposite to the inner bottom surface side. Therefore, at least one layer of the substrate is interposed between the GND pattern and the inner bottom surface, thereby alleviating the unevenness or deformation on the surface of the GND pattern caused by residual stress and making it difficult to propagate to the sensor element, and the temperature hysteresis can be reduced.

[0027] [Application Example 9] Preferably, in the physical quantity sensor described in the above application example, the container includes: a lid having a recess; and the bottom plate that seals the opening of the recess so that the recess becomes a sealed space, and the inside of the recess becomes the accommodating portion.

[0028] According to this application example, the container is composed of a lid body having a recessed portion and a bottom plate that seals the opening of the recessed portion. Therefore, the inside of the recessed portion can be used as a receiving portion, and thus a sensor element can be received.

[0029] [Application Example 10] Preferably, in the physical quantity sensor described in the above application example, in the top view, the bottom plate includes a conductor filling a through hole penetrating the bottom plate at a position overlapping with the GND pattern, and the lid body and the GND pattern are electrically connected through the conductor.

[0030] According to this application example, the lid body and the GND pattern are electrically connected through a conductor filling a through hole penetrating the bottom plate. Therefore, the influence of radiation noise from the lid body side and the bottom plate side can be reduced.

[0031] [Application Example 11] Preferably, in the physical quantity sensor described in the above application example, the sensor element is adhered to the inner bottom surface using an adhesive material. In the top view, in a region overlapping with the adhesion region where the sensor element is adhered to the inner bottom surface by the adhesive material, the GND pattern is provided to be separated from the inner bottom surface.

[0032] According to this application example, the GND pattern is provided to be separated from the inner bottom surface in a region overlapping with the adhesion region where the sensor element is adhered to the inner bottom surface. Therefore, unevenness or deformation on the surface of the GND pattern caused by residual stress is alleviated and is not easily transmitted to the sensor element, and temperature hysteresis can be reduced.

[0033] [Application Example 12] Preferably, in the physical quantity sensor described in the above application example, among the plurality of wirings formed in the container, the width of the analog wiring is larger than the width of the signal wiring.

[0034] According to this application example, by making the width of the analog wiring larger than the width of the signal wiring, the impedance of the analog wiring is reduced, and the influence of radiation noise from outside the container can be reduced.

[0035] [Application Example 13] In the physical quantity sensor described in the above application example, when the width of the analog wiring is set to L1 and the width of the signal wiring is set to L2, L1 / L2≥2 is satisfied.

[0036] According to this application example, by setting the width of the analog wiring to be more than twice the width of the signal wiring, the influence of radiation noise from outside the container can be further reduced.

[0037] [Application Example 14] Preferably, in the physical quantity sensor described in the above application example, the sensor element is an acceleration sensor element.

[0038] According to this application example, it is possible to reduce the temperature hysteresis caused by the residual stress of the GND pattern and the base plate, so that a high-precision acceleration signal can be obtained.

[0039] [Application Example 15] Preferably, in the physical quantity sensor described in the above application example, an angular velocity sensor element mounted in the container is included.

[0040] According to this application example, a composite sensor can be easily formed. Therefore, in addition to acceleration data, angular velocity data can be obtained.

[0041] [Application Example 16] The inertial measurement unit of this application example includes the physical quantity sensor described in any of the above application examples, an angular velocity sensor, and a control unit that controls the physical quantity sensor and the angular velocity sensor.

[0042] According to this application example, by reducing the temperature hysteresis of the physical quantity sensor caused by the residual stress of the GND pattern and the base plate, a more reliable inertial measurement unit can be further provided.

[0043] [Application Example 17] The electronic device of this application example includes: the physical quantity sensor described in any of the above application examples, a control unit that controls according to the detection signal output from the physical quantity sensor, and a correction unit that corrects the detection signal.

[0044] According to this application example, by reducing the temperature hysteresis caused by the residual stress of the GND pattern and the base plate, a highly reliable electronic device with further improved control reliability can be provided.

[0045] [Application Example 18] The moving body of this application example includes: the physical quantity sensor described in any of the above application examples, and a posture control unit that performs posture control according to the detection signal output from the physical quantity sensor.

[0046] According to this application example, based on the high-precision signal output from the physical quantity sensor that reduces the temperature hysteresis caused by the residual stress of the GND pattern and the base plate, posture control is performed, and a moving body with high-precision posture control can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a perspective view showing a schematic configuration of the physical quantity sensor of the first embodiment.

[0048] Figure 2 is a schematic configuration of the physical quantity sensor shown Figure 1 A-A cross-sectional view.

[0049] Figure 3 is a top view showing a schematic configuration of the GND pattern provided on the substrate.

[0050] Figure 4 It is a top view showing a schematic configuration of an analog wiring and a signal wiring provided on a substrate.

[0051] Figure 5 It is a functional block diagram of a physical quantity sensor.

[0052] Figure 6 It is a top view showing an example of the arrangement of sensor elements used in a physical quantity sensor.

[0053] Figure 7 It is a cross-sectional view showing a schematic configuration of a sensor element.

[0054] Figure 8A It is a perspective view showing a schematic configuration of the sensor section (X-axis direction detection) of a sensor element.

[0055] Figure 8B It is a perspective view showing a schematic configuration of the sensor section (Y-axis direction detection) of a sensor element.

[0056] Figure 8C It is a perspective view showing a schematic configuration of the sensor section (Z-axis direction detection) of a sensor element.

[0057] Figure 9A It is a graph showing the temperature distribution for measuring the temperature hysteresis of a physical quantity sensor.

[0058] Figure 9B It is a graph showing the temperature hysteresis measurement results of a conventional physical quantity sensor.

[0059] Figure 9C It is a graph showing the temperature hysteresis measurement results of the physical quantity sensor of the present invention.

[0060] Figure 10 It is a top view showing a schematic configuration of Application Example 1 of an acceleration sensor element.

[0061] Figure 11 It is a top view showing a schematic configuration of Application Example 2 of an acceleration sensor element.

[0062] Figure 12 It is a top view showing a schematic configuration of the physical quantity sensor of the second embodiment.

[0063] Figure 13 It is a perspective view showing a schematic configuration of the physical quantity sensor of the third embodiment.

[0064] Figure 14 It is a cross-sectional view showing a schematic configuration of the physical quantity sensor of the fourth embodiment.

[0065] Figure 15 This is a top view showing the schematic configuration of the physical quantity sensor according to the fifth embodiment.

[0066] Figure 16A This is a top view showing an example of the angular velocity sensor element.

[0067] Figure 16B This is showing an example of the angular velocity sensor element Figure 16A cross-sectional view.

[0068] Figure 17 This is a top view showing the schematic configuration of the physical quantity sensor according to the sixth embodiment.

[0069] Figure 18 This is a cross-sectional view showing the schematic configuration of the physical quantity sensor according to the seventh embodiment.

[0070] Figure 19 This is an exploded perspective view showing the schematic configuration of the inertial measurement unit.

[0071] Figure 20 This is a perspective view showing an example of the arrangement of the inertial sensor elements of the inertial measurement unit.

[0072] Figure 21 This is a perspective view schematically showing the structure of a mobile personal computer as an example of an electronic device.

[0073] Figure 22 This is a perspective view schematically showing the structure of a smartphone (mobile phone) as an example of an electronic device.

[0074] Figure 23 This is a perspective view showing the structure of a digital still camera as an example of an electronic device.

[0075] Figure 24A This is a top view showing the structure of an activity meter as an example of an electronic device.

[0076] Figure 24B This is a functional block diagram explaining the function of an activity meter as an example of an electronic device.

[0077] Figure 25 This is a perspective view showing the structure of a car as an example of a moving body.

[0078] Explanation of reference numerals

[0079] 1, 1a, 1b, 1c, 1d, 1e, 1f ··· Physical quantity sensors; 5 ··· Structure; 7 ··· Encapsulation as a container; 10 ··· Liner bottom; 11 ··· First substrate as a bottom plate; 11a, 11b, 11c ··· Substrates; 11g ··· Through hole; 11h ··· Inner bottom surface; 11j ··· Upper surface; 11r ··· Outer bottom surface; 12 ··· Second substrate; 12g ··· Through hole; 13 ··· Third substrate; 13g ··· Through hole; 14 ··· Sealing member; 15 ··· Cover part as a lid; 16 ··· External terminal; 17 ··· Accommodation space; 17a ··· Concave part as an accommodation part; 17b ··· Opening; 18 ··· Resin bonding material; 19 ··· Internal terminal; 20 ··· Acceleration sensor element as a sensor element; 20r ··· Lower surface; 21x ··· X-axis sensor part; 21y ··· Y-axis sensor part; 21z ··· Z-axis sensor part; 22 ··· Substrate board; 28 ··· Arc-shaped cutout; 29 ··· Connection terminal; 30 ··· GND pattern; 32 ··· Conductor; 34a ··· Analog wiring; 34b ··· Signal wiring; 36 ··· Through hole; 40 ··· IC as a circuit element; 41 ··· Bonding material; 42, 43 ··· Leads; 45 ··· Signal processing part; 46 ··· Output part; 300 ··· Angular velocity sensor element; 1100 ··· Personal computer; 1200 ··· Smart phone (portable telephone); 1300 ··· Digital still camera; 1400 ··· Activity meter; 1500 ··· Automobile; 3000 ··· Inertial measurement unit. Detailed implementation mode

[0080] Next, based on the implementation modes shown in the drawings, the physical quantity sensor, inertial measurement unit, electronic device, and moving body related to the present invention will be described in detail. In addition, the implementation modes described below do not unduly limit the content of the present invention described in the claims. And, not all of the structures described in this implementation mode are necessarily constituent elements of the present invention.

[0081] <First implementation mode>

[0082] First, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 to describe the physical quantity sensor of the first implementation mode. Figure 1 is a perspective view showing the schematic configuration of the physical quantity sensor of the first implementation mode, Figure 2 is a schematic configuration of the physical quantity sensor Figure 1 A - A cross-sectional view. Figure 3 is a top view showing the schematic configuration of the GND pattern provided on the substrate,Figure 4 It is a top view showing a schematic configuration of an analog wiring and a signal wiring provided on a substrate.

[0083] In addition, as described later, Figures 6 to 8C , Figures 11 to 20 , as described in each drawing, three axes orthogonal to each other are described as the X-axis, the Y-axis, and the Z-axis. In addition, the direction parallel to the X-axis is called the "X-axis direction", the direction parallel to the Y-axis is called the "Y-axis direction", and the direction parallel to the Z-axis is called the "Z-axis direction". Further, the plane including the X-axis and the Y-axis along the direction in which three sensor units are arranged is called the "XY plane". In addition, the Z-axis direction is the direction along the stacking (arrangement) direction of the substrate board and the lid portion constituting the package, that is, the direction along the mounting direction of the sensor element and the substrate board is taken as the Z-axis direction. And for convenience of explanation, in the top view when viewed from the Z-axis direction, the surface on the +Z-axis direction side as the lid portion side is taken as the upper surface, and the surface on the opposite -Z-axis direction side is taken as the lower surface for explanation.

[0084] Figure 1 and Figure 2 The physical quantity sensor 1 shown can be used as a triaxial acceleration sensor that independently detects accelerations in the X-axis direction, the Y-axis direction, and the Z-axis direction. Such a physical quantity sensor 1 has a package 7 and a structure 5 accommodated in the package 7. In addition, the structure 5 includes an acceleration sensor element 20 as a sensor element, and an IC (Integrated Circuit) 40 as a circuit element disposed on the acceleration sensor element 20. The lower surface 20r of the acceleration sensor element 20 is mounted and bonded (joined) to the inner bottom surface 11h of the package 7 by a resin bonding material 18. In addition, the IC 40 is disposed on the acceleration sensor element 20, that is, mounted on the surface opposite to the inner bottom surface 11h side of the acceleration sensor element 20 via a bonding material 41, and is electrically connected to the acceleration sensor element 20 by a lead 43. In addition, the IC 40 is electrically connected to an internal terminal 19 provided in the package 7 by a lead 42.

[0085] [Package 7]

[0086] As Figure 1 and Figure 2As shown, the package 7, which is a container for housing the housing structure 5, has a quadrangular outer edge when viewed from above in the direction (+Z-axis direction) where the acceleration sensor element 20 and the package 7 overlap, and is configured to include a substrate bottom portion 10 composed of a first substrate 11, a second substrate 12, and a third substrate 13, and a lid portion 15 which is a conductive lid body connected to the third substrate 13 via a sealing member 14. In addition, the first substrate 11, the second substrate 12, and the third substrate 13 are laminated in this order to form the substrate bottom portion 10.

[0087] The first substrate 11 is in a flat plate shape, and the second substrate 12 and the third substrate 13 are annular substrates with the central portions removed. A sealing member 14 such as a sealing ring or a conductive low-melting glass is formed on the peripheral edge of the upper surface of the third substrate 13. In addition, the first substrate 11 corresponds to the bottom plate.

[0088] A plurality of internal terminals 19 are arranged on the upper surface of the second substrate 12, and a plurality of external terminals 16 are arranged on the outer bottom surface 11r of the package 7 which is the lower surface of the first substrate 11. In addition, each internal terminal 19 is electrically connected to the corresponding external terminal 16 via internal wirings (not shown) formed in the substrate bottom portion 10. In addition, a plurality of arc-shaped cutouts 28 are formed on the side surface of the package 7.

[0089] As Figure 2 shown, the first substrate 11 is a laminated substrate in which a plurality of substrates are laminated. In this embodiment, the number of laminated substrates of three substrates 11a, 11b, and 11c is three. In addition, between the laminated substrates 11a and 11b, a GND pattern 30 coated with a metal is provided on the upper surface 11j of the substrate 11a. In other words, the GND pattern 30 is provided on the first substrate 11 including the inner bottom surface 11h of the package 7 and is separately provided from the inner bottom surface 11h. The GND pattern 30 is provided so as to be separated from the inner bottom surface 11h with the substrates 11b and 11c interposed therebetween. Therefore, the surface of the GND pattern 30 does not come into contact with the acceleration sensor element 20. Therefore, unevenness or deformation on the surface of the GND pattern 30 due to residual stress caused by the difference in the linear expansion coefficients of the GND pattern 30 and the first substrate 11 can be less likely to be transmitted to the acceleration sensor element 20 arranged on the inner bottom surface 11h.

[0090] In addition, in the present embodiment, the GND pattern 30 is arranged between the substrates 11a and 11b, but it is not limited thereto, and it may also be arranged between the substrates 11b and 11c. That is to say, by arranging the GND pattern 30 between any layers of the laminated substrates, at least one of the substrates 11a, 11b, and 11c is interposed between the GND pattern 30 and the inner bottom surface 11h, and the unevenness or deformation on the surface of the GND pattern 30 caused by residual stress is alleviated and is less likely to be transmitted to the acceleration sensor element 20.

[0091] In addition, wirings (not shown) serving as detour patterns are provided between the substrate 11b and the substrate 11c and between the substrate 11c and the second base material 12. Thus, by providing the GND pattern 30 or wirings (detour patterns) between the stacked three substrates 11a, 11b, and 11c, a complex wiring pattern can be arranged without increasing the size of the package 7 when viewed from above in the +Z-axis direction. In addition, since there are two spaces between the substrates due to the stacking of the three substrates 11a, 11b, and 11c, a more complex wiring pattern can be arranged.

[0092] As Figure 3 shown, the GND pattern 30 provided on the upper surface 11j of the substrate 11a is arranged to coincide with the acceleration sensor element 20 when viewed from above in the direction (+Z-axis direction) in which the acceleration sensor element 20 and the package 7 coincide. Therefore, radiated noise (emission noise such as electromagnetic waves) from the outside of the package 7 that affects the acceleration sensor element 20 from the first base material 11 side of the package 7 is blocked, and the influence of the radiated noise on the acceleration sensor element 20 can be reduced.

[0093] The GND pattern 30 is electrically connected to the conductor 32 filled in the through-hole provided in the substrate 11a described later. In addition, the outer bottom surface 11r of the package 7 is electrically connected to the external terminal 16 that is in contact with the ground and is provided at the arc-shaped cutouts 28g and 28k.

[0094] As Figure 4 shown, a plurality of analog wirings 34a and a plurality of signal wirings 34b are provided on the upper surface (inner bottom surface 11h) of the substrate 11c. The width L1 of the analog wiring 34a is larger than the width L2 of the signal wiring 34b. By making the width L1 of the analog wiring 34a larger than the width L2 of the signal wiring 34b, the impedance of the analog wiring 34a including the VDD wiring is reduced, and the influence of the radiated noise from the outside of the package 7 can be reduced. In addition, the operation noise generated in a digital circuit or the like can be prevented from affecting the analog circuit through the substrates 11a, 11b, 11c, etc.

[0095] The simulation wiring 34a and the signal wiring 34b are electrically connected to a plurality of internal terminals 19 provided on the upper surface of the second base material 12 or a plurality of wirings of the base substrate 11b provided on the lower surface of the base substrate 11c via electrode layers (not shown) on the inner walls of a plurality of through holes 36 provided in the base substrate 11c. In addition, the simulation wiring 34a is electrically connected to the external terminals 16 in contact with and provided outside each of the arc-shaped cutouts 28h and 28i via an electrode layer (not shown) formed on the side surfaces of the arc-shaped cutouts 28h and 28i. The signal wiring 34b is electrically connected to the external terminals 16 in contact with and provided outside each of the arc-shaped cutouts 28a, 28c, and 28l via an electrode layer (not shown) formed on the side surfaces of the arc-shaped cutouts 28a, 28c, and 28l.

[0096] Furthermore, preferably, the width L1 of the simulation wiring 34a is such that L1 / L2≥2 with respect to the width L2 of the signal wiring 34b. By making the ratio of the wiring widths more than twice, the impedance is further reduced, and the influence of radiation noise from the outside of the package 7 can be further reduced.

[0097] Return Figure 2 , in the region where the first base material 11, the second base material 12, and the third base material 13 overlap, the package 7 is provided with a plurality of through holes 11g penetrating the first base material 11, through holes 12g penetrating the second base material 12 and communicating with the through holes 11g, and through holes 13g penetrating the third base material 13 and communicating with the through holes 12g. In the through holes 11g, the through holes 12g, and the through holes 13g, a conductor 32 such as copper or solder is filled to form a through electrode. Therefore, the lid portion 15 and the GND pattern 30 can be electrically connected via the conductor 32. Therefore, radiation noise from the outside of the package 7 that affects the acceleration sensor element 20 from the lid portion 15 side or the first base material 11 side of the package 7 can be cut off by the lid portion 15 and the GND pattern 30, and the influence of the radiation noise can be further reduced.

[0098] The package 7 forms a recessed portion 17a serving as a housing portion of the housing structure 5 by the annular second base material 12 and the third base material 13 from which the central portion has been removed. Moreover, the package 7 is provided with an opening portion 17b of the recessed portion 17a plugged by a lid portion 15 serving as a lid, that is, a housing space (internal space) 17 that is sealed to form a closed space (airtight space), and the housing structure 5 can be housed in the housing space 17. In this way, by housing the housing structure 5 composed of the acceleration sensor element 20 and the IC 40 in the housing space 17 provided between the package 7 and the lid portion 15, the housing structure 5 can be cut off from the atmosphere outside the package 7, and a compact and high-performance physical quantity sensor 1 can be formed. In addition, illustration of a part of the wiring pattern or electrode pads (terminal electrodes) formed on the substrate bottom portion 10 including the first base material 11 or the second base material 12 is omitted.

[0099] The constituent materials of the first substrate 11, the second substrate 12, and the third substrate 13 are preferably ceramics or the like. In addition, as the constituent materials of the first substrate 11, the second substrate 12, and the third substrate 13, in addition to ceramics, glass, resin, metal, etc. can be used. Further, the constituent material of the cover portion 15 can have conductivity, for example, a metal material such as Kovar or a material metallized on a glass material, a silicon material, a ceramic material, etc. can be used.

[0100] For example, the GND pattern 30, the analog wiring 34a, the signal wiring 34b, the internal terminal 19, and the external terminal 16 can be formed by a method such as screen printing and firing a metal wiring material such as tungsten (W) and molybdenum (Mo) at a specified position and then performing electroplating of nickel (Ni), gold (Au), etc. thereon.

[0101] [Structural body 5]

[0102] The structural body 5 includes an acceleration sensor element 20 and an IC 40 as a circuit element that is electrically connected to the acceleration sensor element 20 and bonded to the acceleration sensor element 20 by an adhesive material 41. In other words, the IC 40 is mounted on the surface opposite to the lower surface 20r of the surface of the first substrate 11 on the side of the constituent package 7 of the acceleration sensor element 20. Thus, by laminating the package 7, the acceleration sensor element 20, and the IC 40, the arrangement efficiency in the plan view direction can be improved, and the area of the physical quantity sensor 1 in the plan view can be reduced.

[0103] As Figure 2 shown, the structural body 5 is joined to the lower surface 20r of the acceleration sensor element 20 at the inner bottom surface 11h of the upper surface of the first substrate 11 constituting the bottom portion 10 as a bottom plate through a resin adhesive material 18 and is accommodated in the accommodation space 17 of the package 7. The accommodation space 17 of the package 7 is hermetically sealed with a low-pressure atmosphere lower than the atmospheric pressure or an inert gas atmosphere such as nitrogen, argon, or helium.

[0104] Next, Figure 5 the functional configuration of the physical quantity sensor will be described with reference to Figure 5 is a functional block diagram of the physical quantity sensor.

[0105] As Figure 5As shown, as the functional configuration of the physical quantity sensor 1, the acceleration sensor element 20 includes an X-axis sensor unit 21x, a Y-axis sensor unit 21y, and a Z-axis sensor unit 21z that can independently detect accelerations in the X-axis direction, Y-axis direction, and Z-axis direction respectively. The X-axis sensor unit 21x and the Y-axis sensor unit 21y detect accelerations in two axes (X-axis direction and Y-axis direction) in the X-Y plane direction, and the Z-axis sensor unit 21z detects the acceleration in the Z-axis direction orthogonal to the X-Y plane, and is transmitted to the IC 40 as a signal showing the change data of the capacitance. The IC 40 includes a signal processing unit 45 and an output unit 46. The IC 40 converts and processes the signal showing the change of capacitance transmitted from the acceleration sensor 20 through the signal processing unit 45 into a form easy for users to use, such as the bias method, and outputs it as acceleration data from the output unit 46.

[0106] The acceleration sensor element 20 and the IC 40 that make up the structural body 5 are electrically connected by the lead wire 43. In addition, the IC 40 is electrically connected to the internal terminal 19 provided inside the package 7 (the upper surface of the second base material 12) through the lead wire 42.

[0107] [Acceleration sensor element 20]

[0108] Next, refer to Figure 6 and Figure 7 to describe the sensor element used in the physical quantity sensor. Figure 6 is a top view showing a configuration example of the sensor element used in the physical quantity sensor, Figure 7 is a cross-sectional view showing the schematic configuration of the sensor element.

[0109] As Figure 6 and Figure 7 shown, the acceleration sensor element 20 as the sensor element has: a container 25 having a substrate 22 and a slit portion 23; an X-axis sensor unit 21x, a Y-axis sensor unit 21y, and a Z-axis sensor unit 21z as three sensor units accommodated in the container 25. In addition, for convenience of explanation, Figure 7 only the Z-axis sensor unit 21z is shown in

[0110] Recesses 211, 212, and 213 that open upward are formed in the substrate 22. Among these, the recess 211 functions as a clearance portion for preventing the X-axis sensor unit 21x disposed above it from contacting the substrate 22. Similarly, the recess 212 functions as a clearance portion for preventing the Y-axis sensor unit 21y disposed above it from contacting the substrate 22. In addition, the recess 213 functions as a clearance portion for preventing the Z-axis sensor unit 21z disposed above it from contacting the substrate 22.

[0111] In addition, recesses 211a, 211b, 211c, recesses 212a, 212b, 212c, and recesses 213a, 213b, 213c that open to the upper surface are formed on the substrate 22. Among these, recesses 211a, 211b, 211c are arranged around recess 211, and wirings 271, 272, 273 for the X-axis sensor section 21x are arranged in these recesses 211a, 211b, 211c. In addition, recesses 212a, 212b, 212c are arranged around recess 212, and wirings 281, 282, 283 for the Y-axis sensor section 21y are arranged in recesses 212a, 212b, 212c. In addition, recesses 213a, 213b, 213c are arranged around recess 213, and wirings 291, 292, 293 for the Z-axis sensor section 21z are arranged in recesses 213a, 213b, 213c. In addition, the ends of these wirings 271, 272, 273, 281, 282, 283, 291, 292, 293 are exposed to the outside of the container 25, and the exposed portions become connection terminals 29. Moreover, these connection terminals 29 are electrically connected to electrode pads (not shown) of the IC 40 via leads 43.

[0112] Such a substrate 22 is formed of, for example, a glass material (such as borosilicate glass like Pyrex (registered trademark) glass) containing alkali metal ions (mobile ions). Thereby, the X-axis sensor section 21x, Y-axis sensor section 21y, and Z-axis sensor section 21z formed of a silicon substrate can be firmly joined to the substrate 22 by anodic bonding. In addition, since the substrate 22 can be given translucency, the inside of the container 25 can be observed through the substrate 22. However, the constituent material of the substrate 22 is not limited to a glass material, and for example, a high-impedance silicon material can be used. In such a case, the joining to the X-axis sensor section 21x, Y-axis sensor section 21y, and Z-axis sensor section 21z can be performed via, for example, a resin-based adhesive material, glass glue, a metal layer, or the like.

[0113] Next, with reference to Figure 8A 、 Figure 8B and Figure 8C the sensor sections of the sensor element will be described in detail. Figure 8A is a perspective view showing a schematic configuration of the sensor section (X-axis direction detection) of the sensor element, Figure 8B is a perspective view showing a schematic configuration of the sensor section (Y-axis direction detection) of the sensor element, Figure 8C is a perspective view showing a schematic configuration of the sensor section (Z-axis direction detection) of the sensor element.

[0114] The X-axis sensor section 21x, which is one of the sensor sections, is a part that detects acceleration in the X-axis direction. As Figure 8AAs shown, such an X-axis sensor unit 21x has support parts 611 and 612, a movable part 62, connection parts 631 and 632, a plurality of first fixed electrode fingers 64, and a plurality of second fixed electrode fingers 65. In addition, the movable part 62 has a base part 621 and a plurality of movable electrode fingers 622 protruding from the base part 621 to both sides in the Y-axis direction. Such an X-axis sensor unit 21x is formed, for example, of a silicon substrate doped with impurities such as phosphorus and boron, and the silicon substrate has conductivity.

[0115] The support parts 611 and 612 are anodic-bonded to the upper surface 22f of the substrate 22, and the support part 611 is electrically connected to the wiring 271 via a conductive projection (not shown). Moreover, the movable part 62 is provided between these support parts 611 and 612. The movable part 62 is connected to the support parts 611 and 612 via the connection parts 631 and 632. The connection parts 631 and 632 can be elastically deformed in the X-axis direction like springs, and thus the movable part 62 can be displaced in the X-axis direction with respect to the support parts 611 and 612 as shown by the arrow a.

[0116] A plurality of first fixed electrode fingers 64 are arranged on one side in the X-axis direction of the movable electrode fingers 622, and are formed in a meshing comb-like arrangement at intervals with respect to the corresponding movable electrode fingers 622. Such a plurality of first fixed electrode fingers 64 are anodic-bonded to the upper surface of the recess 211 of the substrate 22 at their base ends, and are electrically connected to the wiring 272 via a conductive projection B12.

[0117] In contrast, a plurality of second fixed electrode fingers 65 are arranged on the other side in the X-axis direction of the movable electrode fingers 622, and are formed in a meshing comb-like arrangement at intervals with respect to the corresponding movable electrode fingers 622. Such a plurality of second fixed electrode fingers 65 are anodic-bonded to the upper surface 22f of the substrate 22 at their base ends, and are electrically connected to the wiring 273 via a conductive projection B13.

[0118] Using such an X-axis sensor unit 21x, the acceleration in the X-axis direction is detected as follows. That is, when an acceleration in the X-axis direction is applied, based on the magnitude of the acceleration, the movable part 62 elastically deforms the connection parts 631 and 632 and is displaced in the X-axis direction. Along with this displacement, the magnitudes of the electrostatic capacitance between the movable electrode fingers 622 and the first fixed electrode fingers 64 and the electrostatic capacitance between the movable electrode fingers 622 and the second fixed electrode fingers 65 change respectively. Then, based on the change in this electrostatic capacitance, the acceleration is obtained in the IC40.

[0119] A Y-axis sensor unit 21y, which is one of the sensor units, is a part that detects the acceleration in the Y-axis direction. Such a Y-axis sensor unit 21y is configured in the same manner as the X-axis sensor unit 21x except that it is arranged in a state rotated by 90° in a plan view. As Figure 8BAs shown, the Y-axis sensor unit 21y includes support portions 711 and 712, a movable portion 72, connection portions 731 and 732, a plurality of first fixed electrode fingers 74, and a plurality of second fixed electrode fingers 75. Additionally, the movable portion 72 has a base portion 721 and a plurality of movable electrode fingers 722 that protrude from the base portion 721 to both sides in the X-axis direction.

[0120] The support portions 711 and 712 are anodic-bonded to the upper surface 22f of the substrate 22, and the support portion 711 is electrically connected to the wiring 281 via a conductive projection (not shown). Moreover, the movable portion 72 is disposed between these support portions 711 and 712. The movable portion 72 is connected to the support portions 711 and 712 via the connection portions 731 and 732. The connection portions 731 and 732 can elastically deform in the Y-axis direction like a spring, so that the movable portion 72 can be displaced in the Y-axis direction with respect to the support portions 711 and 712 as shown by the arrow b.

[0121] The plurality of first fixed electrode fingers 74 are arranged on one side in the Y-axis direction of the movable electrode fingers 722, and are formed in a meshing comb-like arrangement at intervals with respect to the corresponding movable electrode fingers 722. The base ends of such a plurality of first fixed electrode fingers 74 are anodic-bonded to the upper surface of the recess 212 of the substrate 22, and are electrically connected to the wiring 282 via the conductive projection B22.

[0122] In contrast, the plurality of second fixed electrode fingers 75 are arranged on the other side in the Y-axis direction of the movable electrode fingers 722, and are formed in a meshing comb-like arrangement at intervals with respect to the corresponding movable electrode fingers 722. The base ends of such a plurality of second fixed electrode fingers 75 are anodic-bonded to the upper surface 22f of the substrate 22, and are electrically connected to the wiring 283 via the conductive projection B23.

[0123] Using such a Y-axis sensor unit 21y, the acceleration in the Y-axis direction is detected as follows. That is, when an acceleration in the Y-axis direction is applied, based on the magnitude of the acceleration, the movable portion 72 elastically deforms the connection portions 731 and 732 and is displaced in the Y-axis direction. Along with this displacement, the magnitudes of the electrostatic capacitance between the movable electrode fingers 722 and the first fixed electrode fingers 74 and the electrostatic capacitance between the movable electrode fingers 722 and the second fixed electrode fingers 75 change respectively. Moreover, based on the change in this electrostatic capacitance, the acceleration is obtained in the IC40.

[0124] The Z-axis sensor unit 21z, which is one of the sensor units, is a part that detects the acceleration in the Z-axis direction (vertical direction). As Figure 8CAs shown, such a Z-axis sensor unit 21z has a support part 811, a movable part 82, and a pair of connecting parts 831 and 832 that swingably connect the movable part 82 to the support part 811. Taking the connecting parts 831 and 832 as the axis J, the movable part 82 swings like a lever relative to the support part 811. Such a Z-axis sensor unit 21z is formed, for example, of a silicon substrate doped with impurities such as phosphorus and boron, and the silicon substrate has conductivity.

[0125] The support part 811 is anodic-bonded to the upper surface 22f of the substrate 22, and the support part 811 is electrically connected to the wiring 291 via a conductive projection (not shown). Moreover, the movable part 82 is provided on both sides of the support part 811 in the Y-axis direction. The movable part 82 has a first movable part 821 on the +Y direction side of the axis J and a second movable part 822 on the -Y direction side of the axis J and larger than the first movable part 821. The rotation moments of the first movable part 821 and the second movable part 822 when a vertical direction (Z-axis direction) acceleration is applied are different, and are designed to generate a specified inclination in the movable part 82 corresponding to the acceleration. Thus, when an acceleration in the Z-axis direction is generated, the movable part 82 swings like a lever around the axis J.

[0126] In addition, a first detection electrode 211g electrically connected to the wiring 292 is disposed at a position on the bottom surface of the recess 213 opposite to the first movable part 821, and a second detection electrode 211h electrically connected to the wiring 293 is disposed at a position opposite to the second movable part 822. Therefore, a capacitance is formed between the first movable part 821 and the first detection electrode 211g, and a capacitance is formed between the second movable part 822 and the second detection electrode 211h. In addition, an analog electrode 211i can be provided on the -Y axis side of the second detection electrode 211h at a position opposite to the second movable part 822. In addition, preferably, the first detection electrode 211g, the second detection electrode 211h, and the analog electrode 211i are formed of a transparent conductive material such as ITO.

[0127] Using such a Z-axis sensor unit 21z, the acceleration in the Z-axis direction is detected as follows. That is, if an acceleration in the Z-axis direction is applied, the movable part 82 swings like a lever around the axis J. Due to such a lever swing of the movable part 82, the separation distance between the first movable part 821 and the first detection electrode 211g and the distance between the second movable part 822 and the second detection electrode 221h change, and accordingly, the capacitance between them changes. Then, based on the change in this capacitance, the acceleration is obtained in the IC40.

[0128] As Figure 7As shown, the slit portion 23 has a recess 223 that opens downward, and the recess 223 is joined to the substrate 22 in such a manner as to form an internal space in the recesses 211, 212, and 213. In the present embodiment, such a slit portion 23 is formed of a silicon substrate. The slit portion 23 and the substrate 22 are hermetically joined using a glass frit 24. Further, a sealing hole 27 that penetrates to the outside from the recess 223 is provided in the slit portion 23. The sealing hole 27 is sealed using a molten metal 26, such as a molten gold-germanium alloy (AuGe), in a state where the internal space S2 is a nitrogen (N2) atmosphere.

[0129] [IC40]

[0130] As Figure 2 shown, the IC40 is disposed on the upper surface of the acceleration sensor element 20 via an adhesive material 41. In addition, as the adhesive material 41, there is no particular limitation as long as the IC40 can be fixed to the acceleration sensor element 20, and for example, solder, silver paste, resin-based adhesive materials (wafer bonding materials), etc. can be used.

[0131] The IC40 includes, for example: a drive circuit that drives the acceleration sensor element 20, a detection circuit (signal processing unit 45) that detects the acceleration in the respective axial directions of the X-axis, Y-axis, and Z-axis based on signals from the acceleration sensor element 20, an output circuit (output unit 46) that converts the signals from the detection circuit into a prescribed signal and outputs the signal, etc. In addition, the IC40 has a plurality of electrode pads (not shown) on the upper surface, and each electrode pad is electrically connected to the internal terminal 19 of the second base material 12 via a lead 42, and each electrode pad is electrically connected to the connection terminal 29 of the acceleration sensor element 20 via a lead 43. Thus, the acceleration sensor element 20 can be controlled.

[0132] Next, with reference to Figure 9A 、 Figure 9B and Figure 9C the temperature hysteresis and noise characteristics of the physical quantity sensor 1 of the above-described first embodiment will be described. Figure 9A is a graph showing the temperature distribution for measuring the temperature hysteresis of the physical quantity sensor, Figure 9B is a graph showing the temperature hysteresis measurement results of a physical quantity sensor having a conventional structure, Figure 9C is a graph showing the temperature hysteresis measurement results of the physical quantity sensor of the present invention.

[0133] [Temperature hysteresis]

[0134] By Figure 9AThe temperature distribution shown measures the so-called temperature hysteresis of the physical quantity sensor 1 of the present embodiment during heating and cooling, which shows the reproducibility (the presence or absence of the difference from the zero output value at the same temperature) of the output values (zero output values when unloaded) of each temperature. First, the physical quantity sensor 1 placed in the constant temperature bath is cooled from 30 °C to around -40 °C, and then heated to around 90 °C, and then cooled again to 30 °C. The results of measuring the output values of each temperature are shown in Figure 9B and Figure 9C . Figure 9B is the temperature hysteresis of the existing structure in which the acceleration sensor element 20 is disposed on the opposing inner bottom surface 11h via the resin bonding material 18 with the GND pattern 30, Figure 9C is the temperature hysteresis of the physical quantity sensor 1 (the structure in which the GND pattern 30 is separated from the inner bottom surface 11h) of the present embodiment.

[0135] The temperature hysteresis of the existing structure ( Figure 9B ) has a large difference in the output values when heating from around 30 °C to around 90 °C and when cooling from around 90 °C to around 30 °C. In contrast, the temperature hysteresis of the physical quantity sensor 1 of the structure of the present embodiment ( Figure 9C ) has a reduced difference in the output values during heating and cooling between around 30 °C and around 90 °C, reducing the temperature hysteresis. Therefore, by setting the GND pattern 30 to a structure separated from the inner bottom surface 11h of the package 7, the unevenness or deformation on the surface of the GND pattern 30 caused by the residual stress due to the difference in the linear expansion coefficients of the GND pattern 30 and the first substrate 11 is difficult to propagate to the acceleration sensor element 20 disposed on the inner bottom surface 11h. Therefore, a physical quantity sensor 1 with a smaller temperature hysteresis can be obtained.

[0136] [Noise characteristics]

[0137] Regarding the noise characteristics measured by mounting the physical quantity sensor 1 of the present embodiment on the inspection socket, it is clarified that the average value from 20 Hz to 50 Hz is the same as the value measured by mounting the physical quantity sensor 1 on the inspection socket and the value measured by mounting the physical quantity sensor 1 on the circuit board (substrate 315), and there is no deterioration of the noise. That is, it is not affected by the radiated noise generated from the circuit board (substrate 315). Since the GND pattern 30 is arranged to coincide with the acceleration sensor element 20 in plan view, it can be said that the radiated noise affecting the acceleration sensor element 20 from the first substrate 11 side is intercepted by the GND pattern 30. Therefore, a physical quantity sensor 1 that can reduce the influence of radiated noise from the outside of the package 7 can be obtained.

[0138] In the physical quantity sensor 1 according to the first embodiment described above, since the GND pattern 30 is separately provided with the substrate 11b and 11c interposed therebetween from the inner bottom surface 11h, the surface of the GND pattern 30 does not come into contact with the acceleration sensor element 20. Therefore, unevenness or deformation on the surface of the GND pattern 30 caused by residual stress due to the difference in the linear expansion coefficients of the GND pattern 30 and the first base material 11 is not easily transmitted to the acceleration sensor element 20 disposed on the inner bottom surface 11h, and the temperature hysteresis of the physical quantity sensor 1 can be reduced.

[0139] In addition, since the GND pattern 30 is arranged to overlap with the acceleration sensor element 20 in a plan view, external radiation noise from the package 7 that affects the acceleration sensor element 20 from the side of the first base material 11 can be intercepted by the GND pattern 30, and thus the influence of the radiation noise can be reduced.

[0140] The conductive cover portion 15 and the GND pattern 30 are provided in the first base material 11, the second base material 12, and the third base material 13, and are electrically connected by the conductor 32 filled in the through holes 11g, 12g, and 13g that communicate with each other. Therefore, external radiation noise from the cover portion 15 side or the first base material 11 side of the package 7 that affects the acceleration sensor element 20 can be intercepted by the cover portion 15 and the GND pattern 30, and the influence of the radiation noise can be further reduced.

[0141] By making the width L1 of the analog wiring 34a formed in the package 7 larger than the width L2 of the signal wiring 34b, or setting the width L1 of the analog wiring 34a to be twice or more the width L2 of the signal wiring 34b, the impedance of the analog wiring 34a is reduced, and the influence of external radiation noise from the package 7 can be reduced.

[0142] In addition, in the above-described first embodiment, in the acceleration sensor element 20 as the sensor element, an example in which the X-axis sensor portion 21x, the Y-axis sensor portion 21y, and the Z-axis sensor portion 21z as three sensor portions are accommodated in the container 25 has been described. However, the acceleration sensor element does not necessarily accommodate three sensor portions, and can be configured as an acceleration sensor element that can detect uniaxial or biaxial acceleration according to the application. Hereinafter, with reference to Figure 10 and Figure 11 , application example 1 and application example 2 of the acceleration sensor element will be described.

[0143] <Application Example 1>

[0144] First, with reference to Figure 10 , application example 1 of the acceleration sensor element will be described. Figure 10 is a plan view showing application example 1 of the sensor element.

[0145] As Figure 10 shown, the acceleration sensor element 201 of Application Example 1 has a sensor section 2x. The sensor section 2x is a part that detects acceleration in one axial direction. Such a sensor section 2x has the same structure as that of the X-axis sensor section 21x shown in Figure 6 and Figure 8A the description. Therefore, its detailed description is omitted. Moreover, the sensor section 2x is hermetically accommodated in a container 251 that has the same structure as that of the first embodiment and includes a substrate 221 and a slit section 231. In such an acceleration sensor element 201, acceleration in one axial direction can be detected.

[0146] In addition, in the acceleration sensor element 201, the sensor section 2x having the same structure as that of the X-axis sensor section 21x is used for the description, but it may also be configured such that any one of the sensor sections having the same structure as the Y-axis sensor section 21y or the Z-axis sensor section 21z is hermetically accommodated in the container 251.

[0147] <Application Example 2>

[0148] Next, with reference to Figure 11 , Application Example 2 of the acceleration sensor element will be described. Figure 11 is a top view showing Application Example 2 of the sensor element.

[0149] As Figure 11 shown, the acceleration sensor element 202 of Application Example 2 has two sensor sections 2x and 2y. The sensor section 2x is a part that detects acceleration in one axial direction (in this example, the X-axis direction). Such a sensor section 2x has the same structure as that of the X-axis sensor section 21x shown in Figure 6 and Figure 8A the description. In addition, the sensor section 2y is a part that detects acceleration in one axial direction (in this example, the Y-axis direction). Such a sensor section 2y has the same structure as that of the Y-axis sensor section 21y shown in Figure 6 and Figure 8B the description. Therefore, its detailed description is omitted. Moreover, the sensor section 2x and the sensor section 2y are hermetically accommodated in a container 252 that has the same structure as that of the first embodiment and includes a substrate 222 and a slit section 232. In such an acceleration sensor element 202, acceleration in two axial directions (in this example, the X-axis direction and the Y-axis direction) can be detected.

[0150] In addition, in Application Example 2, an example in which acceleration in two axial directions, the X-axis direction and the Y-axis direction, can be detected is shown, but it is not limited thereto, and it can also be set to be the same as that shown in Figure 6 and Figure 8CThe structure of the Z-axis sensor unit 21z of the described structure is the same as that of the sensor unit combination. For example, it can be configured to be able to detect the X-axis direction and the Z-axis direction or the Y-axis direction and the Z-axis direction.

[0151] In addition, as shown in Application Example 1 and Application Example 2, it can be configured as a physical quantity sensor that houses an acceleration sensor element 201 capable of detecting a single axis or an acceleration sensor element 202 capable of detecting two axes.

[0152] <Second Embodiment>

[0153] Next, refer to Figure 12 to describe the physical quantity sensor of the second embodiment. Figure 12 It is a top view showing the schematic configuration of the physical quantity sensor of the second embodiment. In addition, Figure 12 It is a top view observed from the outer bottom surface side, corresponding to the inside of the package. In the following description, the differences from the above-described first embodiment will be described, and the description of the same matters will be omitted.

[0154] Compared with the physical quantity sensor 1 of the first embodiment, the arrangement position of the GND pattern 30a of the physical quantity sensor 1a of the second embodiment is different. The GND pattern 30 of the physical quantity sensor 1 of the first embodiment is provided on the upper surface 11j of the substrate 11a, while the GND pattern 30a of the physical quantity sensor 1a of the second embodiment is provided on the outer bottom surface 11r of the substrate 11a.

[0155] As Figure 12 shown, the GND pattern 30a of the physical quantity sensor 1a of the present embodiment is provided on the outer bottom surface 11r of the substrate 11a and is arranged at a position that coincides with the acceleration sensor element 20 in a top view. In addition, the GND pattern 30a is electrically connected to the external terminal 16 that contacts the arc-shaped cutouts 28g and 28k through the connection portion 31.

[0156] According to the physical quantity sensor 1a of the second embodiment described above, similar to the first embodiment, the GND pattern 30a is separated from the inner bottom surface 11h of the package 7 with the substrates 11a, 11b, and 11c interposed therebetween. Therefore, the unevenness or deformation on the surface of the GND pattern 30a caused by the residual stress resulting from the difference in the linear expansion coefficients of the GND pattern 30a and the first base material 11 serving as the bottom plate is not easily transmitted to the acceleration sensor element 20, and the temperature hysteresis caused by the residual stress can be reduced. In addition, since the GND pattern 30a is arranged at a position that coincides with the acceleration sensor element 20 in a top view, the influence of radiation noise from the outside of the package 7 can be reduced, and high-precision acceleration data can be obtained.

[0157] <Third Embodiment>

[0158] Next, referring to Figure 13 the physical quantity sensor of the third embodiment will be described. Figure 13 FIG. is a perspective view showing a schematic configuration of the physical quantity sensor of the third embodiment. In the following description, the description will be centered on the differences from the above-described first embodiment, and the description of the same matters will be omitted.

[0159] Compared with the physical quantity sensor 1 of the first embodiment, the method of electrically connecting the lid portion 15 and the GND pattern 30 of the physical quantity sensor 1b of the third embodiment is different. In the physical quantity sensor 1 of the first embodiment, the lid portion 15 and the GND pattern 30 are provided in the first substrate 11, the second substrate 12, and the third substrate 13, and are electrically connected by the conductor 32 filled in the through holes 11g, 12g, and 13g that communicate with each other. In contrast, the lid portion 15 and the GND pattern 30 of the physical quantity sensor 1b of the third embodiment are electrically connected via a conductive layer 32b formed by metallization of a metal material or the like through an arc-shaped cutout 28k provided on the side surface of the package 7b.

[0160] As Figure 13 shown, in the physical quantity sensor 1b of the present embodiment, in order to electrically connect the lid portion 15 and the GND pattern 30, a conductive layer 32b formed by metallization of a metal material or the like through an arc-shaped cutout 28k provided on the side surface of the package 7b is provided. Therefore, the lid portion 15 and the GND pattern 30 can be at the same potential, and the influence of radiation noise from the lid portion 15 side and the first substrate 11 side can be reduced through the lid portion 15 and the GND pattern 30.

[0161] According to the physical quantity sensor 1b of the third embodiment described above, similarly to the first embodiment, since the GND pattern 30 is separately provided from the inner bottom surface 11h of the package 7, the temperature hysteresis caused by residual stress can be reduced. In addition, since the lid portion 15 and the GND pattern 30 are electrically connected via the conductive layer 32b formed in the arc-shaped cutout 28k, the influence of radiation noise from the outside of the package 7 can be reduced.

[0162] <Fourth Embodiment>

[0163] Next, referring to Figure 14 the physical quantity sensor of the fourth embodiment will be described. Figure 14 FIG. is a cross-sectional view showing a schematic configuration of the physical quantity sensor of the fourth embodiment. In the following description, the description will be centered on the differences from the above-described first embodiment, and the description of the same matters will be omitted.

[0164] Compared with the physical quantity sensor 1 of the first embodiment, the structure of the package 7c of the physical quantity sensor 1c of the fourth embodiment is different. The package 7 of the physical quantity sensor 1 of the first embodiment is composed of a base portion 10 having an accommodation space 17 and a flat lid portion 15. In contrast, the package 7c of the physical quantity sensor 1c of the fourth embodiment is composed of a flat plate-shaped first base material 11 and a lid portion 15c having an accommodation space 17c.

[0165] As Figure 14 shown, in the physical quantity sensor 1c of the present embodiment, a GND pattern 30 is disposed between the substrates 11a and 11b, and an acceleration sensor element 20 constituting a structure 5 is joined via a resin bonding material 18 to the upper surface (inner bottom surface 11h) of the substrate 11c. Further, an IC 40 is joined via a bonding material 41 to the upper surface of the acceleration sensor element 20. An electrode pad (not shown) of the IC 40 and an internal terminal 19 disposed on the upper surface of a pedestal 12c provided on the first base material 11 are electrically connected via a lead 42.

[0166] The lid portion 15c is made of a conductive material such as metal, has a recessed portion forming an accommodation space 17c as an accommodation portion on the first base material 11 side, and accommodates the structure 5 in the accommodation space 17c. The first base material 11 and the lid portion 15c are joined in a region where their respective outer edges are in contact by a joining member (not shown) such as solder or a conductive adhesive material. Therefore, the structure 5 can be cut off from the atmosphere outside the package 7c, and a compact and high-performance physical quantity sensor 1c can be obtained. Further, in the first base material 11, a through hole 11g penetrating the substrates 11a, 11b, and 11c is provided at a position overlapping the GND pattern 30 in a plan view, and a conductor 32 is filled in the through hole 11g. The lid portion 15c and the GND pattern 30 provided on the upper surface 11j of the substrate 11a are electrically connected via the conductor 32. Therefore, the lid portion 15c and the GND pattern 30 can be set to the same potential, and the influence of radiation noise from outside the package 7c can be reduced.

[0167] According to the physical quantity sensor 1c of the fourth embodiment described above, similarly to the first embodiment, since the GND pattern 30 is separately provided from the upper surface (inner bottom surface 11h) of the substrate 11c of the first base material 11, temperature hysteresis caused by residual stress can be reduced. Further, since the lid portion 15c and the GND pattern 30 are electrically connected via the conductor 32 filled in the through hole 11g, the influence of radiation noise from outside the package 7c can be reduced.

[0168] <Fifth Embodiment>

[0169] Next, Figure 15 a physical quantity sensor of the fifth embodiment will be described. Figure 15This is a top view showing the schematic configuration of the physical quantity sensor according to the fifth embodiment. For convenience of explanation, the lid portion is omitted in Figure 15 . In the following description, the description will be centered on the differences from the above-described first embodiment, and the description of the same matters will be omitted.

[0170] Compared with the physical quantity sensor 1 of the first embodiment, the configuration of the sensor element accommodated in the accommodation space 17 of the package 7 of the physical quantity sensor 1d of the fifth embodiment is different. In the accommodation space 17 of the package 7 of the physical quantity sensor 1 of the first embodiment, an acceleration sensor element 20 capable of detecting three axes and an IC 40 are accommodated. In contrast, the physical quantity sensor 1d of the fifth embodiment accommodates, in the accommodation space 17 of the same package 7 as that of the first embodiment, the acceleration sensor element 201 capable of detecting a single axis (X axis) of the above Application Example 1, the IC 40 that controls the acceleration sensor element 201, an angular velocity sensor element 300 capable of detecting a single axis (Z axis) described later, and the IC 40a that controls the angular velocity sensor element 300.

[0171] As Figure 15 shown, the physical quantity sensor 1d of the present embodiment accommodates an acceleration sensor element 201 capable of detecting a single axis and an angular sensor element 300 capable of detecting a single axis in the accommodation space 17 of the package 7, and can be used as a composite sensor including an acceleration sensor capable of detecting a single-axis acceleration and an angular velocity sensor capable of detecting a single-axis angular velocity.

[0172] The physical quantity sensor 1d includes an acceleration sensor element 201, an IC 40 disposed on the acceleration sensor element 201, an angular velocity sensor element 300, and an IC 40a disposed on the angular velocity sensor element 300 within the package 7. The electrode pad 41b provided on the upper surface of the IC 40 that controls the acceleration sensor element 201 is electrically connected to the internal terminal 19 provided on the package 7 via a lead 42 and is electrically connected to the connection terminal 29 provided on the acceleration sensor element 201 via a lead 43. In addition, the electrode pad 41a provided on the upper surface of the IC 40a that controls the angular velocity sensor element 300 is electrically connected to the internal terminal 19 provided in the package 7 via a lead 42 and is electrically connected to the connection terminal 380 provided on the angular velocity sensor element 300 via a lead 43. Thereby, the acceleration in the X axis and the angular velocity in the Z axis can be detected.

[0173] In addition, in the present embodiment, the physical quantity sensor 1d including the acceleration sensor element 201 that detects the X-axis uniaxially and the angular velocity sensor element 300 that detects the Z-axis uniaxially has been described as an example, but it is not limited thereto. It may also be a combination of a uniaxial acceleration sensor element that detects any one of the X-axis, Y-axis, and Z-axis as the detection axis and a uniaxial angular velocity sensor element that detects any one of the X-axis, Y-axis, and Z-axis as the detection axis.

[0174] In the physical quantity sensor 1d according to the fifth embodiment described above, the acceleration sensor element 201 and the angular velocity sensor element 300 are provided in the same package 7 as in the first embodiment. Therefore, it is possible to reduce the temperature hysteresis caused by residual stress or the influence of radiation noise from the outside of the package 7, and the physical quantity sensor 1d as a composite sensor capable of detecting uniaxial acceleration and uniaxial angular velocity can be obtained.

[0175] [Angular velocity sensor element 300]

[0176] Here, with reference to Figure 16A and Figure 16B , an example of the angular velocity sensor element will be described. Figure 16A is a top view showing an example of the angular velocity sensor element used in the physical quantity sensor. In addition, for convenience of explanation, the cover portion is omitted in Figure 16A . Figure 16B is a Figure 16A cross-sectional view showing an example of the angular velocity sensor element.

[0177] Figure 16A and Figure 16B show that the angular velocity sensor element 300 includes a gyro element 342 and a package 349 that houses the gyro element 342. Hereinafter, the gyro element 342 and the package 349 will be described in detail in turn.

[0178] Figure 16A shows the gyro element 342 viewed from the upper side (the cover portion 343 side). In addition, in the gyro element 342, a detection signal electrode, a detection signal wiring, a detection signal terminal, a detection ground electrode, a detection ground wiring, a detection ground terminal, a drive signal electrode, a drive signal wiring, a drive signal terminal, a drive ground electrode, a drive ground wiring, and a drive ground terminal are provided, but they are omitted from being shown in the same drawing.

[0179] The gyro element 342 is an "out-of-plane detection type" sensor that detects the angular velocity about the Z-axis. Although not shown, it is composed of a base material, a plurality of electrodes provided on the surface of the base material, wirings, and terminals. The gyro element 342 can be composed of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. Among them, it is preferably composed of quartz. Thereby, a gyro element 342 capable of exhibiting excellent vibration characteristics (frequency characteristics) is obtained.

[0180] Such a gyro element 342 has a vibrating body 344 in a double-T shape, a first support portion 351 and a second support portion 352 as support portions for supporting the vibrating body 344, a first connecting beam 371 and a second connecting beam 372 connecting the vibrating body 344 and the first support portion 351, and a third connecting beam 373 and a fourth connecting beam 374 connecting the vibrating body 344 and the second support portion 352.

[0181] The vibrating body 344 extends in the XY plane and has a thickness in the Z-axis direction. Such a vibrating body 344 has: a base portion 410 located at the center; a first detection vibrating arm 421 and a second detection vibrating arm 422 extending from the base portion 410 along the Y-axis direction to both sides; a first connecting arm 431 and a second connecting arm 432 extending from the base portion 410 along the X-axis direction to both sides; a first driving vibrating arm 441 and a third driving vibrating arm 442 extending from the front end portion of the first connecting arm 431 along the Y-axis direction to both sides; and a second driving vibrating arm 443 and a fourth driving vibrating arm 444 extending from the front end portion of the second connecting arm 432 along the Y-axis direction to both sides.

[0182] In addition, the first driving vibrating arm 441 and the third driving vibrating arm 442 can extend from the middle of the extending direction of the first connecting arm 431. Similarly, the second driving vibrating arm 443 and the fourth driving vibrating arm 444 can also extend from the middle of the extending direction of the second connecting arm 432. In addition, in this embodiment, it is described that the first connecting arm 431 and the second connecting arm 432 extend from the base portion 410, and the first driving vibrating arm 441, the third driving vibrating arm 442, the second driving vibrating arm 443, and the fourth driving vibrating arm 444 extend from the first connecting arm 431 and the second connecting arm 432. However, it can include the base portion 410, the first connecting arm 431, and the second connecting arm 432 as the base portion. That is, it can also be a configuration in which the first driving vibrating arm, the second driving vibrating arm, the third driving vibrating arm, and the fourth driving vibrating arm extend from the base portion.

[0183] The gyroscope element 342 configured as described above detects the angular velocity ω about the Z axis as described below. When an electric field is generated between a drive signal electrode (not shown) and a drive ground electrode (not shown) in a state where the angular velocity ω is not applied, each of the drive vibrating arms 441, 443, 442, 444 performs a bending vibration in the X-axis direction. In a state where this drive vibration is being performed, if an angular velocity is applied to the gyroscope element 342 about the Z axis, a vibration in the Y-axis direction is generated. That is, the Coriolis force in the Y-axis direction acts on the drive vibrating arms 441, 443, 442, 444 and the connecting arms 431, 432, and in response to this vibration, the detection vibration in the X-axis direction of the detection vibrating arms 421, 422 is excited. Further, a detection signal electrode (not shown) and a detection ground electrode (not shown) detect the deformation of the detection vibrating arms 421, 422 generated by this vibration, and the angular velocity can be obtained.

[0184] Describe a package 349 that houses the gyroscope element 342. The package 349 houses the gyroscope element 342. Further, in the package 349, in addition to the gyroscope element 342, an IC chip or the like that drives the gyroscope element 342 can be housed. Such a package 349 has a substantially rectangular shape in its plan view (under the XY plane).

[0185] The package 349 includes: a substrate 341 having a recess that is open at the upper surface; and a lid portion 343 that is joined to the substrate so as to block the opening of the recess. Further, the substrate 341 has a plate-like bottom plate 361 and a frame-like side wall 362 provided at the peripheral portion of the upper surface of the bottom plate 361. Such a package 349 has an accommodation space inside thereof, and the gyroscope element 342 is hermetically accommodated and provided in this accommodation space.

[0186] The gyroscope element 342 is fixed to the upper surface of the bottom plate 361 via a conductive fixing member 358 such as solder and a conductive adhesive material (an adhesive material in which conductive fillers such as silver metal particles are dispersed in a resin material) at a first support portion 351 and a second support portion 352. Since the first support portion 351 and the second support portion 352 are located at both ends of the gyroscope element 342 in the Y-axis direction, by fixing such portions to the bottom plate 361, the vibrating body 344 of the gyroscope element 342 can be stably fixed to the bottom plate 361 by supporting it at both ends.

[0187] In addition, the conductive fixing members 358 are respectively in correspondence with (in contact with) two detection signal terminals 364, two detection ground terminals 354, a drive signal terminal 384, and a drive ground terminal 394 provided on the first support portion 351 and the second support portion 352, and six of them are separately provided. Further, on the upper surface of the base plate 361, six connection pads 350 corresponding to the two detection signal terminals 364, the two detection ground terminals 354, the drive signal terminal 384, and the drive ground terminal 394 are provided, and each of these connection pads 350 is electrically connected to any one of the corresponding terminals via the conductive fixing members 358. Further, the connection pads 350 are electrically connected to the connection terminals 380 via internal wirings or through electrodes (not shown).

[0188] With the angular velocity sensor element 300 configured as described above, it is possible to effectively and highly accurately detect the angular velocity in a necessary single-axis direction.

[0189] <Sixth Embodiment>

[0190] Next, refer to Figure 17 to describe the physical quantity sensor of the sixth embodiment. Figure 17 FIG. is a plan view showing a schematic configuration of the physical quantity sensor of the sixth embodiment. In addition, for convenience of explanation, the cover portion is omitted in Figure 17 In addition, in the following description, the description will be centered around the differences from the above-described first embodiment, and the description of the same content will be omitted.

[0191] Compared with the physical quantity sensor 1 of the first embodiment, the structure of the sensor element accommodated in the accommodation space 17 of the package 7 of the physical quantity sensor 1e of the sixth embodiment is different. In the accommodation space 17 of the package 7 of the physical quantity sensor 1 of the first embodiment, an acceleration sensor element 20 capable of detecting three axes and an IC 40 are accommodated. In contrast, in the accommodation space 17 of the same package 7 as that of the first embodiment, the physical quantity sensor 1e of the sixth embodiment accommodates the acceleration sensor element 202 capable of detecting two axes (X-axis and Y-axis) of the above application example 2, the IC 40 for controlling the acceleration sensor element 202, the angular velocity sensor element 300 capable of detecting the aforementioned single axis (Z-axis), and the IC 40a for controlling the angular velocity sensor element 300.

[0192] As Figure 17 shown, the physical quantity sensor 1e of the present embodiment accommodates an acceleration sensor element 202 capable of detecting two axes and an angular velocity sensor element 300 capable of detecting a single axis in the accommodation space 17 of the package 7, and can be used as a composite sensor including an acceleration sensor capable of detecting two-axis acceleration and an angular velocity sensor capable of detecting single-axis angular velocity.

[0193] The physical quantity sensor 1e includes an acceleration sensor element 202, an IC 40 disposed on the acceleration sensor element 202, an angular velocity sensor element 300, and an IC 40a disposed on the angular velocity sensor element 300 within the package 7. The electrode pad 41b provided on the upper surface of the IC 40 that controls the acceleration sensor element 202 is electrically connected to the internal terminal 19 provided in the package 7 via a lead 42 and is electrically connected to the connection terminal 29 provided on the acceleration sensor element 202 via a lead 43. In addition, the electrode pad 41a provided on the upper surface of the IC 40a that controls the angular velocity sensor element 300 is electrically connected to the internal terminal 19 provided in the package 7 via a lead 42 and is electrically connected to the connection terminal 380 provided on the angular velocity sensor element 300 via a lead 43. Thus, the acceleration in the X and Y axes and the angular velocity in the Z axis can be detected.

[0194] In addition, in the present embodiment, the physical quantity sensor 1e including the acceleration sensor element 202 that detects the acceleration in the X and Y axes and the angular velocity sensor element 300 that detects the angular velocity in the Z axis is described as an example, but it is not limited thereto. It may also be a combination of an acceleration sensor element that detects any two axes of the X, Y, and Z axes and a single-axis angular velocity sensor element that detects any one axis of the X, Y, and Z axes.

[0195] According to the physical quantity sensor 1e of the sixth embodiment described above, since the acceleration sensor element 202 and the angular velocity sensor element 300 are provided in the same package 7 as in the first embodiment, the influence of temperature hysteresis caused by residual stress or radiation noise from the outside of the package 7 can be reduced, and the physical quantity sensor 1e as a composite sensor capable of detecting the acceleration in two axes and the angular velocity in a single axis can be obtained.

[0196] In addition, in the above-described embodiment, as an example of a physical quantity sensor, a composite sensor has been described. The physical quantity sensor 1d (fifth embodiment) includes an acceleration sensor element 201 capable of detecting acceleration in a single axis (X-axis) and an angular velocity sensor element 300 capable of detecting angular velocity in a single axis (Z-axis), or the physical quantity sensor 1e (sixth embodiment) includes an acceleration sensor element 202 capable of detecting acceleration in two axes (X-axis and Y-axis) and an angular velocity sensor element 300 capable of detecting angular velocity in a single axis (Z-axis). In addition, it may be a composite sensor that is a combination of a single-axis acceleration sensor element that detects acceleration in any one of the X-axis, Y-axis, and Z-axis as the detection axis, a two-axis angular velocity sensor element that detects angular velocity in any two of the X-axis, Y-axis, and Z-axis as the detection axis, and a three-axis angular velocity sensor element that detects angular velocity in the three axes of the X-axis, Y-axis, and Z-axis. It may also be a composite sensor that is a combination of a two-axis acceleration sensor element that detects acceleration in any two of the X-axis, Y-axis, and Z-axis as the detection axis, a two-axis angular velocity sensor element that detects angular velocity in any two of the X-axis, Y-axis, and Z-axis as the detection axis, and a three-axis angular velocity sensor element that detects angular velocity in the three axes of the X-axis, Y-axis, and Z-axis. It may also be a composite sensor that is a combination of a three-axis acceleration sensor element that detects acceleration in the three axes of the X-axis, Y-axis, and Z-axis as the detection axis, a single-axis angular velocity sensor element that detects angular velocity in any one of the X-axis, Y-axis, and Z-axis as the detection axis, a two-axis angular velocity sensor element that detects angular velocity in any two of the X-axis, Y-axis, and Z-axis as the detection axis, and a three-axis angular velocity sensor element that detects angular velocity in the three axes of the X-axis, Y-axis, and Z-axis.

[0197] <Seventh Embodiment>

[0198] Next, with reference to Figure 18 the physical quantity sensor of the seventh embodiment will be described. Figure 18 FIG. is a cross-sectional view showing a schematic configuration of the physical quantity sensor of the seventh embodiment. In the following description, the description will be centered on the differences from the first embodiment described above, and the description of the same matters will be omitted.

[0199] Compared with the physical quantity sensor 1 of the first embodiment, the structure of the GND pattern 30f of the physical quantity sensor 1f of the seventh embodiment is different. The GND pattern 30 of the physical quantity sensor 1 of the first embodiment is provided between the substrate 11a and the substrate 11b. In contrast, the GND pattern 30 of the physical quantity sensor 1f of the seventh embodiment is provided between the substrate 11a and the substrate 11b and on the inner bottom surface 11h which is the upper surface of the substrate 11c.

[0200] As Figure 18 shown, in the physical quantity sensor 1f of the present embodiment, the structure 5 is bonded (joined) to the inner bottom surface 11h of the package 7 from the connection terminal 29 side to the central portion of the structure 5 by the resin bonding material 18.

[0201] When viewed from above in the direction where the acceleration sensor element 20 and the package 7 overlap, the GND pattern 30f is composed of the GND pattern 30f1 and the GND pattern 30f2. In the area that overlaps with the bonding area of the resin bonding material 18 on the inner bottom surface 11h, the GND pattern 30f1 is provided between the substrate 11a and the substrate 11b. In the area that overlaps with the inner bottom surface 11h of the substrate 11c and does not overlap with the bonding area of the resin bonding material 18, the GND pattern 30f2 is provided on the inner bottom surface 11h which is the upper surface of the substrate 11c.

[0202] In addition, the GND pattern 30f1 and the GND pattern 30f2 are electrically connected by the conductor 32f filled in the through-hole 11f provided in the substrates 11b and 11c.

[0203] Therefore, in the area that overlaps with the bonding area of the resin bonding material 18, the GND pattern 30f1 is separately provided from the inner bottom surface 11h. Thus, the unevenness or deformation on the surface of the GND pattern 30f caused by the residual stress due to the difference in the linear expansion coefficients of the GND pattern 30f1 and the bottom plate 11 is not easily transmitted to the acceleration sensor element 20 disposed on the inner bottom surface 11h, and the temperature hysteresis of the physical quantity sensor 1f can be reduced.

[0204] In addition, the GND pattern 30f2 is provided in the area that does not overlap with the bonding area of the resin bonding material 18, and the radiation noise from the outside of the package 7 can be blocked by the GND pattern 30f1 and the GND pattern 30f2, and the influence of the radiation noise can be reduced.

[0205] According to the physical quantity sensor 1f of the seventh embodiment described above, similar to the first embodiment, since the GND pattern 30f is separately provided from the inner bottom surface 11h of the package 7, the unevenness or deformation on the surface of the GND pattern 30f caused by the residual stress is not easily transmitted to the acceleration sensor element 20, and the temperature hysteresis caused by the residual stress can be reduced. In addition, the GND pattern 30f is disposed at a position that overlaps with the acceleration sensor element 20 when viewed from above, so the influence of the radiation noise from the outside of the package 7 can be reduced, and high-precision acceleration data can be obtained.

[0206] [Inertial Measurement Unit]

[0207] Next, referring to Figure 19 and Figure 20 , the inertial measurement unit (IMU: Inertial Measurement Unit) will be described. Figure 19 is an exploded perspective view showing the schematic configuration of the inertial measurement unit, Figure 20This is a perspective view showing a configuration example of the inertial sensor element of the inertial measurement unit.

[0208] As Figure 19 shown, the inertial measurement unit 3000 is composed of a housing 301, a joining member 310, a sensor module 325 including an inertial sensor element, etc. In other words, it is configured such that the sensor module 325 is engaged (inserted) via the joining member 310 inside the housing 301. The sensor module 325 is composed of an inner housing 320 and a substrate 315. In addition, for ease of understanding, the parts are referred to as the housing and the inner housing, and they can also be referred to as the first housing and the second housing.

[0209] The housing 301 is a base formed by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc or stainless steel, resin, or a composite material of metal and resin can also be used. The outer shape of the housing 301 is, like the overall shape of the above-mentioned inertial measurement unit 3000, a cube with a substantially square top view shape, and screw holes 302 are respectively formed near the vertices at two positions in the diagonal direction of the square. In addition, it is not limited to the screw holes 302. For example, a structure capable of screwing with a notch (a structure in which a notch is formed at the corner of the housing 301 where the screw hole 302 is located) that can be screwed with a screw can be formed, or a flange (ear) can be formed on the side surface of the housing 301, and a structure in which the flange portion can be screwed can be formed. However, when screwing with the said cutout hole as the fixing part, if the notch of the cutout hole is larger than the diameter of the screw opening, there is a possibility that the screw may shift and tilt from the notch during screwing, and the fixing by screwing is likely to be skewed, or the cutout hole portion of the housing may be deformed and cut off due to the skewed screw. Therefore, when setting the cutout hole as the fixing part, it is preferable to set the cut of the cutout hole to be smaller than the diameter of the screw.

[0210] The outer shell 301 is in the shape of a box without a lid, which is rectangular in appearance. Its interior 303 (inner side) forms an inner space (container) surrounded by a bottom wall 305 and side walls 304. In other words, the outer shell 301 forms a box shape with the side opposite to the bottom wall 305 as the open face, and accommodates the sensor module 325 in such a way as to cover all of the opening of the open face (in a way that blocks the opening), and the sensor module 325 is in a state of being exposed from the opening (not shown). Here, the open face opposite to the bottom wall 305 is the same face as the upper surface 307 of the outer shell 301. In addition, the planar shape of the interior 303 of the outer shell 301 is a hexagon with the corners of two vertex parts of a square chamfered, and the two chamfered vertex parts correspond to the positions of the screw holes 302. Also, in the cross-sectional shape (thickness direction) of the interior 303, a first joint surface 306 is formed on the bottom wall part 305, which is a bottom wall one level higher than the central part at the edge of the interior 303, that is, the inner space. That is, the first joint surface 306 is a part of the bottom wall 305, and is a stepped part in a ring shape formed around the central part of the bottom wall 305 when viewed from above, and is a surface that is closer to the open face (the same face as the upper surface 307) than the bottom wall 305.

[0211] In addition, an example has been described where the outer shape of the outer shell 301 is a box without a lid, which is rectangular in appearance and approximately square when viewed from above, but it is not limited to this. The planar shape of the outer shape of the outer shell 301 can be, for example, a polygon such as a hexagon or an octagon, the corners of the vertex parts of the polygon can be chamfered, or the planar shape can have curved sides. Also, the planar shape of the interior 303 (inner side) of the outer shell 301 is not limited to the above-mentioned hexagon, and can be a square shape (quadrilateral) such as a square, or other polygon shapes such as an octagon. In addition, the outer shape and the planar shape of the interior 303 of the outer shell 301 can be similar shapes or not similar shapes.

[0212] The inner shell 320 is a component that supports the substrate 315, and is in a shape that is accommodated in the interior 303 of the outer shell 301. Specifically, when viewed from above, it is a hexagon with the corners of two vertex parts of a square chamfered, and an opening 321, which is a rectangular through hole, and a recess 331 are formed on the surface on the side of the support substrate 315. The two chamfered vertex parts correspond to the positions of the screw holes 302 of the outer shell 301. The height in the thickness direction (Z-axis direction) is lower than the height from the upper surface 307 of the outer shell 301 to the first joint surface 306. In the application example, the inner shell 320 is also formed by machining aluminum, but like the outer shell 301, other materials can be used.

[0213] On the inner surface of the inner housing 320 (the surface on the side of the outer housing 301), there are formed guide pins or support surfaces (both not shown) for determining the position of the substrate 315. The substrate 315 is set (positioned and mounted) on the guide pins or support surfaces and is joined to the inner surface of the inner housing 320. In addition, the details of the substrate 315 will be described later. The edge portion of the inner surface of the inner housing 320 forms a second joint surface 322 formed by an annular plane. The shape of the second joint surface 322 on the plane is substantially the same as that of the first joint surface 306 of the outer housing 301. When the inner housing 320 is set in the outer housing 301, the two surfaces face each other in a state where the joint member 310 is clamped. In addition, regarding the structures of the outer housing 301 and the inner housing 320, this is an embodiment and is not limited to this structure.

[0214] Reference Figure 20 , the structure of the substrate 315 on which the inertial sensor is mounted will be described. As Figure 20 shown, the substrate 315 is a multilayer substrate formed with a plurality of through holes and uses a glass epoxy substrate (glass epoxy substrate). In addition, it is not limited to the glass epoxy substrate, and it can also be a plurality of inertial sensors, or a rigid substrate capable of mounting electronic components, connectors, etc. For example, a composite substrate or a ceramic substrate can be used.

[0215] On the surface of the substrate 315 (the surface on the side of the inner housing 320), a connector 316, an angular velocity sensor 317z, a physical quantity sensor 1 as an acceleration sensor, etc. are mounted. The connector 316 is a plunger type (male) connector and has two rows of connection terminals arranged at equal intervals in the X-axis direction. Preferably, it is set to have a total of 20 connection terminals with 10 pins in one row, but the number of terminals can be appropriately changed according to the design pattern.

[0216] The angular velocity sensor 317z as an inertial sensor is a gyro sensor that detects the uniaxial angular velocity in the Z-axis direction. As a preferred example, a crystal is used as the oscillator, and a vibrating gyro sensor that detects the angular velocity from the applied Coriolis force during vibration is used. In addition, it is not limited to the vibrating gyro sensor, and it can also be a sensor capable of detecting the angular velocity. For example, as the vibrator, a sensor using ceramic or silicon can be used.

[0217] In addition, on the side surface of the substrate 315 in the X-axis direction, an angular velocity sensor 317x that detects the uniaxial angular velocity in the X-axis direction is mounted in such a way that the mounting surface (mounting surface) is orthogonal to the X-axis. Similarly, on the side surface of the substrate 315 in the Y-axis direction, an angular velocity sensor 317y that detects the uniaxial angular velocity in the Y-axis direction is mounted in such a way that the mounting surface (mounting surface) is orthogonal to the Y-axis.

[0218] In addition, the angular velocity sensors 317x, 317y, and 317z can use the above reference Figure 16A andFigure 16B The angular velocity sensor element 300 described. In addition, it is not limited to a structure using three angular velocity sensors for each axis, but may be a sensor capable of detecting the angular velocity of three axes. For example, like the physical quantity sensor 1 described later, a sensor device capable of detecting (detecting) the angular velocity of three axes with one device (package) can be used.

[0219] The same physical quantity sensor 1 as described in the first embodiment has, for example, a capacitive acceleration sensor element 20 (e.g., refer to Figure 5 ) that can detect (detect) the acceleration in three directions (three axes) of the X-axis, Y-axis, and Z-axis with one device, and is processed by MEMS technology on a silicon substrate, and uses a resin bonding material 18 (refer to Figure 2 ) to be bonded to the package 7 (refer to Figure 2 ). In addition, if necessary, it can be used as a physical quantity sensor for an acceleration sensor element 202 capable of detecting the acceleration in the X-axis and Y-axis directions, or an acceleration sensor element 201 capable of detecting the acceleration in a single-axis direction.

[0220] On the back surface (the surface on the side of the housing 301) of the substrate 315, a control IC 319 as a control unit for controlling the physical quantity sensor 1 and the three angular velocity sensors 317x, 317y, and 317z is mounted. The control IC 319 is an MCU (Micro Controller Unit), and has a storage unit including a non-volatile memory, an A / D converter, etc., and controls each part of the inertial measurement unit 3000. Programs for detecting the order and content of acceleration and angular velocity, programs for digitizing detection data and incorporating it into data packets, and attached data are stored in the storage unit. In addition, a plurality of electronic components are also mounted on the substrate 315.

[0221] According to such an inertial measurement unit 3000, since the physical quantity sensor 1 of the first embodiment in which the acceleration sensor element 20 is mounted on the package 7 (refer to Figure 2 ) is used, it is possible to reduce the temperature hysteresis of the output of acceleration data caused by heat treatment when installing the inertial measurement unit 3000, etc. Therefore, an inertial measurement unit 3000 with improved reliability can be provided.

[0222] [Electronic device]

[0223] Next, based on Figures 21 to 24B , the electronic device using the physical quantity sensors 1, 1a, 1b, 1c, 1d, 1e, and 1f will be described in detail. In addition, hereinafter, an example of using the physical quantity sensor 1 is shown.

[0224] First, refer to Figure 21, which describes a mobile personal computer as an example of an electronic device. Figure 21 is a perspective view schematically showing the structure of a mobile personal computer as an example of an electronic device.

[0225] In this figure, the personal computer 1100 is composed of a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1108. The display unit 1106 is supported by a hinge structure portion so as to be rotatable relative to the main body portion 1104. In such a personal computer 1100, a physical quantity sensor 1 that functions as an acceleration sensor is built in, and the control unit 1110 can perform control such as posture control based on the detection data of the physical quantity sensor 1. Further, in such a personal computer 1100, since it is provided with a temperature sensor (not shown) and a correction unit (not shown) that corrects the detection signal detected by the physical quantity sensor 1 for temperature, control such as posture control can be performed with higher accuracy.

[0226] Next, referring to Figure 22 , which describes a smart phone (mobile phone) as an example of an electronic device. Figure 22 is a perspective view schematically showing the structure of a smart phone (mobile phone) as an example of an electronic device.

[0227] In this figure, the above-described physical quantity sensor 1 is installed in the smart phone 1200. The detection signal (acceleration data) detected by the physical quantity sensor 1 is sent to the control unit 1201 of the smart phone 1200. The control unit 1201 is configured to include a CPU (Central Processing Unit), and recognizes the posture and movement of the smart phone 1200 from the received detection signal, changes the display image displayed on the display portion 1208, or emits a warning sound or an effect sound, and can drive a vibration motor to vibrate the main body. In other words, it performs motion detection of the smart phone 1200, and can change the display content from the measured posture or movement, or emit a sound or vibration, etc. In particular, in the case of executing a game application, a near-real sense of presence can be felt. Further, in such a smart phone 1200, since it is provided with a temperature sensor (not shown) and a correction unit (not shown) that corrects the detection signal detected by the physical quantity sensor 1 for temperature, control such as posture control can be performed with higher accuracy.

[0228] Next, referring to Figure 23 , which describes a digital still camera as an example of an electronic device. Figure 23 is a perspective view showing the structure of a digital still camera as an example of an electronic device. In addition, in this figure, the connection to an external device is also briefly shown.

[0229] On the back of the housing (main body) 1302 of the digital still camera 1300, there is a display unit 1310 which is structured to display according to the imaging signal generated by the CCD. The display unit 1310 functions as a viewfinder that displays the subject as an electronic image. In addition, on the front side (the back side in the figure) of the housing 1302, there is a light receiving unit 1304 including an optical lens (imaging optical system) and a CCD, etc.

[0230] If the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD imaging signal at that moment is transferred and stored in the memory 1308. In addition, in this digital still camera 1300, there are a video signal output terminal 1312 and input / output terminals 1314 for data communication on the side of the housing 1302. Also, as shown in the figure, as needed, a TV monitor 1430 is connected to the video signal output terminal 1312, and a personal computer 1440 is connected to the input / output terminals 1314 for data communication. And, it is structured such that through a prescribed operation, the imaging signal stored in the memory 1308 is output to the TV monitor 1430 or the personal computer 1440. In such a digital still camera 1300, a physical quantity sensor 1 that functions as an acceleration sensor is built in, and the control unit 1316 can perform control such as image stabilization according to the detection data of the physical quantity sensor 1. In addition, in such a digital still camera 1300, since it is equipped with a temperature sensor (not shown) and a correction unit (not shown) that corrects the detection signal detected by the physical quantity sensor 1 for temperature, control such as posture control can be performed with higher accuracy.

[0231] Such an electronic device is equipped with the physical quantity sensor 1, control units 1110, 1201, 1316, and a correction unit (not shown), and thus has excellent reliability.

[0232] In addition, the electronic device equipped with the physical quantity sensor 1, in addition to Figure 21 the personal computer, Figure 22 the smart phone (portable telephone), Figure 23In addition to digital still cameras, it can also be applied to, for example, tablet terminals, watches, inkjet ejection devices (e.g., inkjet printers), laptop personal computers, televisions, video cameras, video cassette recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game machines, word processors, workstations, videophones, anti-theft TV monitors, electronic telescopes, POS terminals, medical devices (e.g., electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish finders, various measuring devices, instrumentation (e.g., measuring instruments for vehicles, aircraft, ships), flight simulators, etc., seismographs, pedometers, inclinometers, vibration meters for measuring the vibration of hard disks, attitude control devices for flying bodies such as robots or drones, control devices used in inertial navigation for autonomous driving of cars, etc.

[0233] And, referring to Figure 24A and Figure 24B as an example of an electronic device, a watch-type activity meter (exercise amount meter) will be described. Figure 24A is a top view showing the structure of an activity meter as an example of an electronic device, Figure 24B is a functional block diagram explaining the functions of an activity meter as an example of an electronic device.

[0234] It is mounted on a part (detection object) such as the wrist through a watch band or the like, and the display unit with digital display can perform wireless communication. The physical quantity sensor 1 of the present invention described above is assembled in the watch-type activity meter 1400 as an acceleration sensor or an angular velocity sensor.

[0235] In the liquid crystal display (LCD) constituting the display unit, corresponding to various detection modes, for example, position information using GPS or geomagnetic sensors, exercise information such as exercise amount using movement amount or acceleration sensors or angular velocity sensors, biological information such as the number of pulses using pulse sensors, or time information such as the current time, etc. are displayed.

[0236] The activity meter 1400 can be widely applied to running watches, runner watches, runner watches corresponding to multiple sports such as triathlons or triathlons, outdoor watches, and watches equipped with a satellite positioning system, such as GPS watches equipped with GPS.

[0237] The activity meter 1400 is mounted on a given part (e.g., the wrist) of a user (installer) and can detect the position information or exercise information of the user. As Figure 24AAs shown, the activity meter 1400 includes: a device main body 1410, which is worn by a user and detects position information, motion information, etc.; and a first strap portion 1412 and a second strap portion 1414, which are attached to the device main body 1410 and are used to attach the device main body 1410 to the user. In addition, in the activity meter 1400, in addition to the user's position information or motion information, functions such as detecting biological information such as pulse information or obtaining time information can also be set, for example.

[0238] Next, refer to Figure 24B to describe the functions of the activity meter 1400.

[0239] As Figure 24B shown, the processing unit 1450 (processor) is composed of, for example, an MPU (Micro Processing Unit), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), etc. The processing unit 1450 performs various processes based on the programs stored in the storage unit 1474 and the signals input from the operation unit 1470. The processes of the processing unit 1450 include data processing of the output signals of the GPS sensor 1460, the geomagnetic sensor 1461, the pressure sensor 1462, the acceleration sensor 1463, the angular velocity sensor 1464, the pulse sensor 1465, the temperature sensor 1466, and the timekeeping unit 1472, display processing for causing the display unit 1476 to display an image, sound output processing for causing the sound output unit 1478 to output sound, communication processing for communicating with the user terminal 1490 via the communication unit 1480, power control processing for supplying power from the power supply 1482 to each part, etc.

[0240] In addition, the communication unit 1480 is configured to include, for example, a transceiver corresponding to a short-range wireless communication standard such as Bluetooth (registered trademark) (including BTLE: Bluetooth Low Energy), Wi-Fi (registered trademark) (Wireless Fidelity), Zigbee (registered trademark), NFC (Near field communication), ANT+ (registered trademark), etc., or the communication unit 1480 includes a connector corresponding to a communication bus standard such as USB (Universal Serial Bus).

[0241] The acceleration sensor 1463 of the physical quantity sensor 1 of the present invention detects accelerations in three mutually intersecting (orthogonal in an ideal case) axial directions, and outputs a signal (acceleration signal) corresponding to the magnitudes and directions of the detected three-axis accelerations.

[0242] The angular velocity sensor 1464 of the physical quantity sensor 1 of the present invention detects angular velocities in three mutually intersecting (orthogonal in an ideal case) axial directions, and outputs a signal (angular velocity signal) corresponding to the magnitudes and directions of the detected three-axis angular velocities.

[0243] The wristwatch-type activity meter 1400 has the following functions.

[0244] Distance: Measures the total distance from the start of measurement through a high-precision GPS function.

[0245] Pace: Displays the current walking pace based on the measured pace distance.

[0246] Average speed: Calculates and displays the average speed from the start of walking at an average speed until now.

[0247] Altitude: Measures and displays the altitude through the GPS function.

[0248] Stride: Measures and displays the stride even in a tunnel where GPS radio waves cannot reach, etc.

[0249] Step interval: Measures and displays the number of steps per minute.

[0250] Heart rate: Measures and displays the heart rate through a pulse sensor.

[0251] Gradient: Measures and displays the gradient of the ground during mountain training and on a footprint line.

[0252] Auto lap: Automatically measures the number of laps when running at a preset fixed distance or for a fixed time.

[0253] Calories burned during exercise: Displays the calories burned.

[0254] Steps: Displays the total number of steps from the start of exercise.

[0255] As a satellite positioning system, GPS (Global Positioning System) has been described, but other Global Navigation Satellite Systems (GNSS) can also be used. For example, one or more of the following satellite positioning systems can be used: EGNOS (European Geostationary-Satellite Navigation Overlay Service), QZSS (Quasi Zenith Satellite System), GLONASS (GLObal NAvigation Satellite System), GALILEO, and BeiDou (BeiDou Navigation Satellite System). In addition, as at least one of the satellite positioning systems, a geostationary satellite-based satellite navigation augmentation system (SBAS), such as WAAS (Wide Area Augmentation System) or EGNOS (European Geostationary Satellite Navigation Overlay Service), can be used.

[0256] [Moving body]

[0257] Next, for a moving body using physical quantity sensors 1, 1a, 1b, 1c, 1d, 1e, and 1f, an example using physical quantity sensor 1 as a representative example will be described in detail. Figure 25 in Figure 25 is a perspective view showing the structure of a car as an example of a moving body.

[0258] As shown in Figure 25As shown, a physical quantity sensor 1 is installed inside an automobile 1500. For example, the posture of a vehicle body 1501 can be detected by the physical quantity sensor 1. The detection signal of the physical quantity sensor 1 is supplied to a vehicle body posture control device 1502 serving as a posture control unit. The vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on this signal, and can control the softness and hardness of the suspension or control the brakes of each wheel 1503 according to the detection result. In addition, the physical quantity sensor 1 can be widely applied to electronic control units (ECUs) such as keyless entry systems, engine immobilizers, automotive navigation systems, automotive air conditioners, antilock brake systems (ABS), airbags, tire pressure monitoring systems (TPMS), engine control, control devices for inertial navigation in autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0259] In addition, the physical quantity sensor 1 applied to a moving body, in addition to the above examples, can be used, for example, in the posture control of a biped walking robot or a tram, the remote control of a radio-controlled aircraft, a radio-controlled helicopter, and a drone, or the posture control of an autonomous aircraft, the posture control of agricultural machinery (agricultural machines), or construction machinery (construction machines). As described above, to achieve the posture control of various moving bodies, the physical quantity sensor 1 and a posture control unit (not shown) are installed.

[0260] Such a moving body is provided with the physical quantity sensor 1 and a posture control unit (not shown), and thus has excellent reliability.

[0261] As described above, the physical quantity sensors 1, 1a, 1b, 1c, 1d, 1e, 1f, the inertial measurement system (3000), the electronic devices (1100, 1200, 1300, 1400), and the moving body (1500) have been described based on the illustrated embodiments. However, the present invention is not limited thereto, and the configuration of each part can also be replaced with any structure having the same function. In addition, any other constituent elements can be added to the present invention.

[0262] In addition, in the above-described embodiment, a configuration in which the acceleration sensor element has three sensor units has been described. However, the number of sensor units is not limited to this, and may be one or two, or four or more. Further, in the above-described embodiment, an acceleration sensor element is used as the sensor element of the physical quantity sensor. However, the sensor element of the physical quantity sensor is not limited to the acceleration sensor element, and for example, it may be a pressure sensor element or an angular velocity sensor element. Further, for example, it may be a composite sensor capable of simultaneously detecting different physical quantities such as acceleration and angular velocity.

Claims

1. A physical quantity sensor, characterized in that, Comprising: A container including a receiving portion and a bottom plate forming the inner bottom surface of the receiving portion; A sensor element mounted on the inner bottom surface; A circuit element mounted on a surface of the sensor element opposite to the inner bottom surface side, the circuit element being electrically connected to the sensor element; And A GND pattern provided on the bottom plate, Among a plurality of wirings formed on the inner bottom surface, the width of the analog wiring is larger than the width of the signal wiring, When the width of the analog wiring is set to L1 and the width of the signal wiring is set to L2, L1 / L2≥2 is satisfied, The container includes: The bottom plate; A ring-shaped substrate laminated on the bottom plate; and A lid having conductivity, the lid sealing an opening of the recessed portion such that the recessed portion formed by the bottom plate and the ring-shaped substrate becomes a sealed space, The recessed portion is the receiving portion, The lid and the GND pattern are electrically connected via a conductive layer or a conductor, the conductive layer is formed at an arc-shaped cut provided on a side surface of the container, and the conductor is filled in a hole penetrating the ring-shaped substrate, The sensor element is bonded to the inner bottom surface from one end side to the central portion using an adhesive material, In a plan view observed from a direction in which the sensor element and the container overlap, in a region overlapping with the bonding region where the sensor element is bonded to the inner bottom surface by the adhesive material, the GND pattern is provided so as to be separated from the inner bottom surface, and in a region not overlapping with the bonding region, the GND pattern is provided on the inner bottom surface.

2. The physical quantity sensor according to claim 1, wherein The bottom plate is a laminated substrate in which a plurality of substrates are laminated.

3. The physical quantity sensor according to claim 2, wherein The number of laminated layers of the laminated substrate is three.

4. The physical quantity sensor according to claim 3, wherein The GND pattern is provided between any layers of the laminated substrate.

5. The physical quantity sensor according to any one of claims 1 to 3, wherein The GND pattern is provided on an outer surface of the bottom plate on a side opposite to the inner bottom surface side.

6. The physical quantity sensor according to any one of claims 1 to 3, wherein The container includes: A lid having a recessed portion; and The bottom plate sealing an opening of the recessed portion such that the recessed portion becomes a sealed space, The inside of the recessed portion becomes the receiving portion.

7. The physical quantity sensor according to any one of claims 1 to 3, wherein The sensor element is an acceleration sensor element.

8. The physical quantity sensor according to any one of claims 1 to 3, wherein The physical quantity sensor includes an angular velocity sensor element mounted in the container.

9. An inertial measurement unit, characterized in that, Comprising: The physical quantity sensor according to claim 7; An angular velocity sensor; and A control unit controlling the physical quantity sensor and the angular velocity sensor.

10. An electronic device, characterized in that, Comprising: The physical quantity sensor according to any one of claims 1 to 7; A control unit that controls based on a detection signal output from the physical quantity sensor; and A correction unit that corrects the detection signal.

11. A moving body, characterized in that, Comprising: The physical quantity sensor according to any one of claims 1 to 7; and A posture control unit that performs posture control based on the detection signal output from the physical quantity sensor.

Images