Imaging assembly and manufacturing method thereof, molding die, camera module and intelligent terminal

Abstract

The application provides an imaging assembly, a manufacturing method thereof, a molding mold, a camera module and a smart terminal. According to one aspect of the application, the imaging assembly comprises a photosensitive element and a molding encapsulation part. The photosensitive element has a photosensitive region. The molding encapsulation part is formed around the photosensitive region and in contact with the photosensitive element, and the molding encapsulation part has an inclined inner side surface and a top surface higher than the photosensitive region. The height difference between the top surface of the molding encapsulation part and the photosensitive region of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of imaging assemblies and intelligent terminals. BACKGROUND

[0002] A conventional COB (Chip on Board) process camera module structure is assembled from a circuit board, a photosensitive chip, a lens seat, a motor drive, and a lens. Meanwhile, various electronic components are placed on the surface layer of the circuit board.

[0003] Currently, the photosensitive area of an existing photosensitive chip has an increased proportion, and the edge of the photosensitive area is increasingly close to the sidewall of a light window. Since the sidewall of the light window is very close to the photosensitive area, the intensity of external light reflected by the sidewall of the light window to the photosensitive area is increasingly high, and the stray light is increasingly strong, thereby affecting the imaging quality of the camera module. SUMMARY

[0004] The present application provides an imaging assembly, a manufacturing method thereof, a molding mold, a camera module, and an intelligent terminal.

[0005] According to an aspect of the present application, an imaging assembly is provided, including: a photosensitive element having a photosensitive area; and a molding encapsulation part formed around the photosensitive area and in contact with the photosensitive element, and the molding encapsulation part has an inclined inner side surface and a top surface higher than the photosensitive area, wherein the height difference between the top surface of the molding encapsulation part and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

[0006] According to an aspect of the present application, a method for manufacturing an imaging assembly is provided, including: mounting a photosensitive element on a circuit board to be manufactured into an imaging assembly; attaching a flexible film to the lower part of a molding mold, wherein the flexible film has a non-smooth surface facing away from the molding mold, the lower part of the molding mold includes a press head and a mold part located around the press head, and the edge of the press head has an inwardly inclined surface; placing the molding mold with the attached flexible film above the photosensitive element, and making the mold part face the height difference between the bottom surface of the photosensitive element and the top surface of the photosensitive element less than or equal to 0.7 mm; and molding a molding encapsulation part around the photosensitive element and between the bottom surface of the mold part facing the photosensitive element and the top surface of the photosensitive element, around the inwardly inclined surface of the edge of the press head, so that the inclined inner side surface adjacent to the molding encapsulation part formed by the inwardly inclined surface has a non-smooth surface corresponding to the non-smooth surface of the flexible film attached to the inwardly inclined surface.

[0007] According to an aspect of the present application, there is provided a molding die for manufacturing an imaging assembly, comprising: a plunger having an inwardly inclined surface at an edge thereof; and a module portion surrounding the plunger, wherein a working height difference between a bottom surface of the plunger and the module portion adjacent to the bottom surface of the plunger is less than or equal to 0.7 mm.

[0008] According to an aspect of the present application, there is provided a camera module, comprising the imaging assembly as described above.

[0009] According to an aspect of the present application, there is provided a smart terminal, comprising the camera module as described above.

[0010] According to an aspect of the present application, there is provided an imaging assembly, comprising: a photosensitive element having a photosensitive region; a molding encapsulation portion formed around the photosensitive region and in contact with the photosensitive element, and the molding encapsulation portion having an inclined inner side surface and a top surface higher than the photosensitive region; and a buffer structure between the photosensitive element and the inclined inner side surface of the molding encapsulation portion, wherein a height difference between the top surface of the molding encapsulation portion and a top portion of the buffer structure is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface of the molding encapsulation portion have different surface roughnesses.

[0011] According to an aspect of the present application, there is provided a method for manufacturing an imaging assembly, comprising: mounting a photosensitive element on a circuit board to be manufactured into an imaging assembly; attaching a buffer structure to the photosensitive element; attaching a flexible film to a lower portion of a molding die, wherein the flexible film has a non-smooth surface facing away from the molding die, and the lower portion of the molding die comprises a plunger having an inwardly inclined surface at an edge thereof and a module portion surrounding the plunger; placing the molding die with the flexible film attached thereon above the buffer structure, and making the module portion face a height difference between a bottom surface of the photosensitive element and a top portion of the buffer structure less than or equal to 0.7 mm; and molding an encapsulation portion around the photosensitive element and between the bottom surface of the photosensitive element facing the module portion and a top surface of the photosensitive element, around the inwardly inclined surface of the edge of the plunger, so that the molding encapsulation portion has a non-smooth surface adjacent to an inclined inner side surface formed by the inwardly inclined surface corresponding to the non-smooth surface of the flexible film attached to the inwardly inclined surface. BRIEF DESCRIPTION OF DRAWINGS

[0012] Exemplary embodiments are illustrated in reference to the accompanying drawings. The embodiments and drawings disclosed herein should be considered illustrative rather than restrictive, and are not intended to limit the scope of the application.

[0013] Figure 1 A method for manufacturing an imaging assembly according to an embodiment of the present application is shown;

[0014] Figure 2a A molding die for manufacturing an imaging assembly according to an embodiment of the present application is shown;Figure 1 A schematic diagram of step S110;

[0015] Figure 2b It shows Figure 1 A schematic diagram of step S120;

[0016] Figure 2c It shows Figure 1 A schematic diagram of step S130;

[0017] Figure 2d It shows Figure 1 A schematic diagram of step S140;

[0018] Figure 3a The physical meaning of formula (1) is shown;

[0019] Figure 3b It shows Figure 3a A variant;

[0020] Figure 4 A cross-sectional view of an imaging component according to one embodiment of this application is shown;

[0021] Figure 5a The meaning of each parameter in formula (2) is shown;

[0022] Figure 5b It shows Figure 5a A variant;

[0023] Figure 6 A cross-sectional view of a molding die for manufacturing an imaging assembly according to one embodiment of this application is shown;

[0024] Figure 7a The meaning of each parameter in formula (3) is shown;

[0025] Figure 7b It shows Figure 7a A variant;

[0026] Figure 8 A method for manufacturing an imaging component according to another embodiment of this application is shown;

[0027] Figure 9 A cross-sectional view of an imaging component according to another embodiment of this application is shown;

[0028] Figure 10 It shows that Figure 9 The buffer structure in the image is a filter element;

[0029] Figure 11 It shows Figure 9 The buffer structure in the case is a stepped adhesive and a filter element. DETAILED DESCRIPTION

[0030] For a better understanding of the present application, various aspects of the present application will be described in greater detail below with reference to the drawings. It is to be noted that these detailed descriptions are merely descriptive intended to illustrate and not to limit the scope of the present application in any manner. Throughout the specification, like drawing reference numerals refer to like elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0031] It should be noted that the terms first, second, etc. are used herein only to distinguish one element from another, and do not imply any limitation on the features. Thus, a first subject discussed below could also be termed a second subject without departing from the teachings of the present application.

[0032] In the drawings, the thicknesses of objects, sizes of the elements, and the like are exaggerated for ease of explanation. The drawings are merely schematic and are not intended to be drawn to scale.

[0033] It should also be understood that the terms "comprise", "comprising", "have", "having", "include", "including", "contain", "containing", and / or "contain", when used in this specification, indicate the presence of the stated features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, when describing the embodiments of the present application, the use of "may" indicates that one or more embodiments of the present application. Also, the term "exemplary" is intended to mean an example or an illustration.

[0034] As used herein, the terms "substantially", "approximately", and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in a measuring or computing process.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an overly literal or overly formal sense unless expressly so defined herein.

[0036] The terms such as up, down, left, right, front, back, and the like used in the present application refer to the relative positions shown in the drawings for the purpose of description, and are not intended to limit the present application. In actual operation, the actual posture of each component shown in the drawings can be adjusted as needed.

[0037] In the following description, only the components related to the improvements of the present application are described, and many existing components, such as connecting wires in the imaging assembly and common components, are omitted.

[0038] It should be noted that the features in different embodiments of the present application can be combined with each other without conflict, and the order of the steps in the method can be changed or performed simultaneously. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0039] Figure 1 A method for manufacturing an imaging assembly according to an embodiment of the present application is shown. As shown in Figure 1 The method 100 includes steps S110 to S140.

[0040] In step S110, a photosensitive element is mounted on a circuit board to be manufactured into an imaging assembly. Figure 2a A schematic diagram of this step S110 is shown. As shown in Figure 2a In step S110, the photosensitive element 220 is mounted on the circuit board 210. The circuit board 210 is part of the imaging assembly to be manufactured, and contains the required circuit in the imaging assembly. The photosensitive element 220 is a sensor in the imaging assembly to be manufactured, which can sense optical image information and convert it into a usable output signal.

[0041] Returning to Figure 1 In step S120, a flexible film is attached to the lower part of the molding mold. Figure 2b A schematic diagram of this step S120 is shown. As shown in Figure 2b In step S120, the flexible film 300 is attached to the lower part of the molding mold 400 for manufacturing the imaging assembly. The surface 310 of the flexible film 300 facing away from the molding mold 400 (i.e. the surface generally facing downward) is a non-smooth surface. The lower part of the molding mold 400 includes a press head 410 and a module portion 420 surrounding the press head 410, and the press head 410 has an inwardly inclined surface 411 at its edge. Since the film 300 is flexible, when it is attached to the lower part of the molding mold 400, the part of the flexible film 300 attached to the press head 410 is Figure 2bThe flexible film 300 (indicated by the hatched portion) is to be stretched to produce deformation. Since the surface 310 of the flexible film 300 facing away from the molding mold 400 is a non-smooth surface, the portion of the flexible film 300 attached to the press head 410 will have its Ra (surface roughness profile arithmetic mean deviation) reduced, i.e., the surface roughness will be reduced, due to being stretched.

[0042] Returning to Figure 1 In step S130, the molding mold with the flexible film attached is placed over the photosensitive element, and the height difference between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element is made to be less than or equal to 0.7 mm. Figure 2c A schematic diagram of this step S130 is shown. As Figure 2c indicated, in step S130, the molding mold 400 with the flexible film 300 attached is placed over the photosensitive element 220, and the height difference δH between the bottom surface 421 of the module portion 420 and the top surface 221 of the photosensitive element 220 is made to be less than or equal to 0.7 mm. In the present application, the size of δH can be adjusted by adjusting the height difference between the bottom surface 412 of the press head 410 and the bottom surface 421 of the module portion 420 (at the design stage of the molding mold 400 or at the operation stage of making the imaging assembly). Since the height difference between the bottom surface 412 and the bottom surface 421 is adjusted at the design stage or during operation so that δH is made to be less than or equal to 0.7 mm, the degree to which the flexible film 300 is stretched can be made to be small, and thus the surface roughness of the surface 310 of the flexible film 300 can be made to be reduced only slightly.

[0043] Returning to Figure 1 In step S140, a molding encapsulation portion is molded around the press head edge and between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, so that the molding encapsulation portion has a non-smooth surface on the inclined inner side surface formed adjacent to the inwardly inclined surface corresponding to the non-smooth surface of the flexible film attached to the inwardly inclined surface. Figure 2d A schematic diagram of this step S140 is shown. As Figure 2d indicated, in step S140, in order to make the imaging assembly, molding (e.g., molding using a material such as thermosetting resin) is performed around the photosensitive element 220 and between the bottom surface 421 of the module portion 420 facing the photosensitive element 220 and the top surface 221 of the photosensitive element 220, so that a molding encapsulation portion 230 is formed around the inwardly inclined surface 411. Thus, since the flexible film 300 is attached to the lower portion of the molding mold 400 and the generally downwardly facing surface 310 of the flexible film 300 is a non-smooth surface, the molding encapsulation portion 230 formed adjacent to the inclined inner side surface 231 formed by the inwardly inclined surface 411 has a non-smooth surface corresponding to the non-smooth surface 310 of the flexible film 300 attached to the inwardly inclined surface 411.

[0044] After step S140, a conventional process such as demolding can be performed to obtain the imaging assembly.

[0045] Thus, since the height difference between the bottom surface of the module portion facing the top surface of the photosensitive element is controlled to be less than or equal to 0.7 mm when the imaging assembly is manufactured, the flexible film is less stretched during the manufacturing process, i.e., the surface roughness of the lower surface of the flexible film is only slightly reduced, and thus the inclined inner side surface of the molded package portion in the manufactured imaging assembly has considerable surface roughness, so that reflection of light to the photosensitive region of the photosensitive element through the inclined inner side surface is inhibited, and the influence of stray light on the photosensitive element is effectively controlled.

[0046] According to one embodiment of the present application, referring to Figure 2d , the reflectivity of the inclined inner side surface 231 of the molded package portion 230 for visible light is less than or equal to 5%. As described above, since the inclined inner side surface of the molded package portion has considerable surface roughness due to the improvement of the manufacturing process, its reflectivity is reduced to a lower level, so that its reflection of light is reduced.

[0047] According to one embodiment of the present application, the value of Ra (arithmetic mean deviation of surface roughness profile) of the inclined inner side surface 231 of the molded package portion 230 is greater than or equal to 1 μm.

[0048] According to one embodiment of the present application, the value of Ra of the rough surface of the flexible film 300 attached to the rough surface of the module portion 420 is greater than the value of Ra of the rough surface of the flexible film 300 attached to the inwardly inclined surface 411. As described above, during the process of manufacturing the imaging assembly, the portion of the flexible film 300 attached to the plunger 410 will be deformed, while the portion attached to the module portion 420 will not or almost not be deformed. Therefore, the value of Ra of the rough surface of the flexible film 300 attached to the rough surface of the module portion 420 will be greater than the value of Ra of the rough surface of the flexible film 300 attached to the inwardly inclined surface 411.

[0049] According to one embodiment of the present application, the above step S130 comprises: directly abutting the plunger with the attached flexible film against the photosensitive region of the photosensitive element. Since the molded package portion of the imaging assembly will be formed around the photosensitive region of the photosensitive element, and during the process of molding, it is not desirable that the molding material flows onto the photosensitive region, the plunger with the attached flexible film can be directly abutted against the photosensitive region of the photosensitive element. Since the flexible film has certain stretchability due to its flexibility, when the plunger is abutted against the photosensitive region, it will play a good blocking role to prevent the molding material from entering the photosensitive region.

[0050] According to one embodiment of the present application, the inclined angle of the inwardly inclined surface 411 relative to the photosensitive region of the photosensitive element is 20-70 degrees.

[0051] According to one embodiment of this application, the stretching coefficient K is used to represent the degree of stretching of the flexible film during the fabrication of the imaging component. A larger K indicates a greater degree of stretching of the flexible film. K is expressed by the following formula:

[0052] K=1+2d(1 / sinα-1 / tanα) / (b1+2b2) (1)

[0053] Where d represents the height difference between the bottom surface of the module and the top surface of the photosensitive element, α represents the tilt angle of the inward tilting surface relative to the top surface of the photosensitive element, b1 represents the distance between the inward tilting surfaces of the pressure head, and b2 represents the length of the orthographic projection of the inward tilting surface onto the top surface of the photosensitive element.

[0054] Figure 3a The physical meaning of the above formula (1) is shown. For example... Figure 3a As shown, A1 represents the length of the flexible membrane attached to the pressure head before stretching, and A2 (not shown in the figure) is the length of this portion after being attached to the pressure head and stretched. It can be seen that A1 = b1 + 2b2, A2 = b1 + 2c. In this embodiment, the stretching coefficient K of the flexible membrane is limited to K = A2 / A1 = (b1 + 2c) / (b1 + 2b2). Through derivation, the above formula (1) can be obtained.

[0055] As described above, d (i.e., δH) ≤ 0.7 mm, 20° ≤ α ≤ 70°. However, due to design and / or process limitations, b1 + 2b2 ≥ 2.48 mm. Therefore, according to this embodiment, the tensile coefficient K of the flexible membrane is less than or equal to 1.4.

[0056] Since the value of K represents the degree of stretching of the flexible film during the manufacturing process of the imaging component, controlling the value of K within a certain range will prevent the flexible film from being overstretched, which would reduce the surface roughness of its non-smooth surface too much. This ensures that the inclined inner surface of the molded encapsulation part in the manufactured imaging component can still have considerable surface roughness, so as to suppress light reflection through the inclined inner surface to the photosensitive area of ​​the photosensitive element and effectively control the influence of stray light on the photosensitive element.

[0057] Figure 3b The above is shown Figure 3a A variant. According to, as... Figure 3b In the illustrated embodiment, K can be represented by the following formula:

[0058] K=1+(d1(1 / sinα1-1 / tanα1)+d2(1 / sinα2-1 / tanα2)) / (b1+b2+b3) (1')

[0059] like Figure 3bAs shown, d1 and d2 represent the height difference between the bottom surface of the module face and the top surface of the photosensitive element, α1 and α2 represent the tilt angle of the inward tilted surface relative to the top surface of the photosensitive element, b1 represents the distance between the inward tilted surfaces of the pressure head, and b2 and b3 represent the length of the orthographic projection of the inward tilted surface onto the top surface of the photosensitive element.

[0060] Figure 3b and Figure 3a The difference in the illustrated embodiment is that, Figure 3a The embodiment shown is Figure 3b The example shown illustrates the case where d1 = d2, α1 = α2, and b2 = b3.

[0061] According to one embodiment of this application, the flexible membrane has an anti-adhesion surface facing the molding die. This facilitates the separation of the molding die from the imaging component during demolding after molding.

[0062] According to one embodiment of this application, the flexible membrane is made of one or more materials selected from the following: ETFE, PTFE, PFA, FEP, and PS. These materials can all form an anti-adhesion surface and have properties such as good anti-fouling properties, high toughness, easy separation, and high temperature resistance, thereby facilitating the operation of the flexible membrane.

[0063] Figure 4 A cross-sectional view of an imaging component according to one embodiment of this application is shown. As described in method 100 above, an imaging component can be prepared as follows: Figure 4 The imaging component 200 is shown. (As shown) Figure 4 As shown, the imaging assembly 200 may include a circuit board 210, a photosensitive element 220, and a molded package 230. The photosensitive element 220 may have a photosensitive area 222. The molded package 230 is formed around the photosensitive area 222 and in contact with the photosensitive element 220. The molded package 230 has an inclined inner surface 231 and a top surface 232 that is higher than the photosensitive area 222. The height difference δH between the top surface 232 of the molded package 230 and the photosensitive area 222 of the photosensitive element 220 is less than or equal to 0.7 mm. The inclined inner surface 231 and the top surface 232 have different surface roughnesses.

[0064] Since the height difference between the bottom surface of the module portion facing the top surface of the photosensitive element is controlled to be less than or equal to 0.7 mm when the imaging assembly is manufactured, the height difference between the top surface of the molded package portion and the photosensitive region of the photosensitive element is less than or equal to 0.7 mm (the effect of the thickness of the flexible film on the other element sizes can be ignored in this application). Since the degree to which the flexible film is stretched is small during the molding process, i.e., the surface roughness of the lower surface of the flexible film is only slightly reduced, the inclined inner side surface of the molded package portion of the manufactured imaging assembly also has considerable surface roughness. Although the inclined inner side surface of the molded package portion has different surface roughness (and thus different reflectivity) from the top surface, since the inclined inner side surface still maintains considerable surface roughness, the light reflected through the inclined inner side surface to the photosensitive region of the photosensitive element can be inhibited, so as to effectively control the effect of stray light on the photosensitive element.

[0065] According to one embodiment of the present application, the reflectivity of the inclined inner side surface 231 of the molded package portion 230 for visible light is less than or equal to 5%.

[0066] According to one embodiment of the present application, the value of Ra of the inclined inner side surface 231 of the molded package portion 230 is greater than or equal to 1 μm.

[0067] According to one embodiment of the present application, the value of Ra of the top surface 232 of the molded package portion 230 is greater than the value of Ra of the inclined inner side surface 231.

[0068] According to one embodiment of the present application, the inclination angle of the inclined inner side surface 231 relative to the photosensitive region 222 is 20-70 degrees.

[0069] According to one embodiment of the present application, the size of the molded package portion 230 satisfies the following inequality:

[0070] 5d(1 / sinα-1 / tanα)≤(b1+2b2) (2)

[0071] Figure 5a The meanings of the parameters in the above formula (2) are shown. The same reference numerals are used for the corresponding or similar parameters in formula (2) and (1). As shown, Figure 5a d represents the height difference between the top surface of the molded package portion and the photosensitive region of the photosensitive element, α represents the inclination angle of the inclined inner side surface relative to the photosensitive region, b1 represents the distance between the opposite inclined inner side surfaces on the photosensitive region, and b2 represents the length of the orthogonal projection of the inclined inner side surface on the plane of the photosensitive region.

[0072] According to the above description in combination with formula (1), 1+2d(1 / sinα-1 / tanα) / (b1+2b2)≤1.4, so formula (2) can be derived.

[0073] Figure 5b A variant of the above embodiment is shown. According to the embodiment as shown in Figure 5a , the size of the molded package portion 230 satisfies the following inequality: Figure 5b

[0074] d1(1 / sinα1-1 / tanα1)+d2(1 / sinα2-1 / tanα2)≤0.4(b1+b2+b3) (2')

[0075] As shown in Figure 5b , d1 and d2 represent the height difference between the top surface of the molded package portion and the light receiving area of the light receiving element, α1 and α2 represent the inclination angle of the inclined inner side surface relative to the light receiving area, b1 represents the distance between the opposite inclined inner side surfaces on the light receiving area, and b2 and b3 represent the length of the normal projection of the inclined inner side surface on the plane of the light receiving area.

[0076] Figure 5b The difference between the embodiment as shown in Figure 5a and the embodiment as shown in Figure 5a is that Figure 5b the embodiment as shown in is the case where d1=d2, α1=α2 and b2=b3 in the embodiment as shown in

[0077] . Figure 6 A cross-sectional view of a molding die used for making an imaging assembly according to an embodiment of the present application is shown. The molding die can be used in the method 100 as shown in Figure 1 . As shown in Figure 6 , the molding die 400 can include a plunger 410 and a block portion 420. The plunger 410 has an inwardly inclined surface 411 at its edge, and the block portion 420 surrounds the plunger 410. The working height difference between the bottom surface 421 of the block portion 420 adjacent to the plunger 410 and the bottom surface 412 of the plunger 410 is less than or equal to 0.7 mm.

[0078] Thus, when the imaging assembly is made using the molding die as described above, since the working height difference between the bottom surface 421 of the block portion 420 adjacent to the plunger 410 and the bottom surface 412 of the plunger 410 is less than or equal to 0.7 mm, the flexible film is stretched to a lesser extent when it is attached to the molding die, i.e. the surface roughness of the lower surface of the flexible film is only slightly reduced, and therefore the inclined inner side surface of the molded package portion in the imaging assembly made has an appreciable surface roughness to inhibit light from being reflected to the light receiving area of the light receiving element through the inclined inner side surface, and the effect of stray light on the light receiving element is effectively controlled.

[0079] According to an embodiment of the present application, the inclination angle of the inwardly inclined surface 411 relative to the bottom surface 412 of the plunger 410 is 20-70 degrees.

[0080] According to one embodiment of this application, the dimensions of the molding die 400 satisfy the following inequality:

[0081] 5d(1 / sinα-1 / tanα)≤(b1+2b2) (3)

[0082] Figure 7a The meaning of each parameter in formula (3) above is shown. Parameters that are equivalent or similar to those in formulas (3) and (1) are represented by the same labels. For example... Figure 7a As shown, d represents the working height difference between the bottom surface of the module adjacent to the bottom surface of the pressure head and the bottom surface of the pressure head, α represents the inclination angle of the inwardly inclined surface relative to the bottom surface of the pressure head, b1 represents the distance between the inwardly inclined surfaces of the pressure head, and b2 represents the length of the orthographic projection of the inwardly inclined surface onto the plane of the bottom surface of the pressure head.

[0083] Based on the description of the above combined formula (1), we know that 1+2d(1 / sinα-1 / tanα) / (b1+2b2)≤1.4, and thus, formula (3) can be derived.

[0084] Figure 7b The above is shown Figure 7a A variant. According to, as... Figure 7b In the embodiment shown, the dimensions of the molding die 400 satisfy the following inequality:

[0085] d1(1 / sinα1-1 / tanα1)+d2(1 / sinα2-1 / tanα2)≤0.4(b1+b2+b3) (3')

[0086] like Figure 7b As shown, d1 and d2 represent the working height difference between the bottom surface of the module adjacent to the bottom surface of the pressure head and the bottom surface of the pressure head, α1 and α2 represent the inclination angle of the inwardly inclined surface relative to the bottom surface of the pressure head, b1 represents the distance between the inwardly inclined surfaces of the pressure head, and b2 and b3 represent the length of the orthographic projection of the inwardly inclined surface onto the plane of the bottom surface of the pressure head.

[0087] Figure 7b and Figure 7a The difference in the illustrated embodiment is that, Figure 7a The embodiment shown is Figure 7b The example shown illustrates the case where d1 = d2, α1 = α2, and b2 = b3.

[0088] According to one embodiment of this application, a camera module is provided, which may include the imaging components described above.

[0089] According to another embodiment of this application, a smart terminal is provided, which may include the above-described camera module.

[0090] Figure 8 A method for manufacturing an imaging assembly is shown according to another embodiment of the present application. As shown, the method 800 includes steps S810-S850. Figure 8

[0091] In step S810, a photosensitive element is mounted on a circuit board to be manufactured into an imaging assembly. This step is the same as or similar to step S110 described above, and thus will not be repeated here.

[0092] In step S820, a buffer structure is attached to the photosensitive element. The buffer structure can be used to protect the photosensitive element and / or other components such as connecting wires from impact.

[0093] In step S830, a flexible film is attached to a lower portion of a molding die, wherein the flexible film has a non-smooth surface facing away from the molding die, and the lower portion of the molding die includes a press head and a module portion surrounding the press head, and the edge of the press head has an inwardly inclined surface. This step is the same as or similar to step S120 described above, and thus will not be repeated here.

[0094] In step S840, the molding die with the flexible film attached is placed on the buffer structure, and the module portion faces a height difference between the bottom surface of the photosensitive element and the top portion of the buffer structure is less than or equal to 0.7 mm. This step is similar to step S130 described above, with the difference that, due to the introduction of the buffer structure in step S820, the molding die with the flexible film attached is placed on the buffer structure in this step S840, instead of being placed on the photosensitive element, and the module portion faces a height difference between the bottom surface of the photosensitive element and the top portion of the buffer structure is less than or equal to 0.7 mm.

[0095] In step S850, a molding encapsulation portion is molded around the press head edge inwardly inclined surface between the photosensitive element and the module portion facing the bottom surface of the photosensitive element and the top surface of the photosensitive element, such that the inclined inner side surface of the molding encapsulation portion adjacent to the inclined inner side surface formed by the inwardly inclined surface of the press head edge has a non-smooth surface corresponding to the non-smooth surface of the flexible film attached to the inwardly inclined surface. This step is the same as or similar to step S140 described above, and thus will not be repeated here.

[0096] After step S850, a conventional process such as demolding can be performed to obtain the imaging assembly.

[0097] According to one embodiment of the present application, the buffer structure is a step adhesive and / or a filter element.

[0098] According to one embodiment of the present application, the inclined inner side surface of the molding encapsulation portion has a reflectivity of less than or equal to 5% for visible light.

[0099] ​According to one embodiment of the present application, the Ra of the inclined inner side surface of the molded package portion is greater than or equal to 1 μm.

[0100] According to one embodiment of the present application, the Ra of the rough surface of the flexible film attached to the module portion is greater than the Ra of the rough surface of the flexible film attached to the inwardly inclined surface.

[0101] According to one embodiment of the present application, placing the molding die to which the flexible film is attached on the cushion structure includes directly abutting the indenter to which the flexible film is attached against the cushion structure.

[0102] According to one embodiment of the present application, the angle of inclination of the inwardly inclined surface with respect to the light receiving region is 20 to 70 degrees.

[0103] According to one embodiment of the present application, after the flexible film is attached to the lower portion of the molding die, the stretch coefficient K of the flexible film generated is less than or equal to 1.4, where

[0104] K = 1 + 2d (1 / sin α - 1 / tan α) / (bl + 2b2) (4)

[0105] where d denotes the height difference between the bottom surface of the module portion facing the light receiving element and the top of the cushion structure, α denotes the angle of inclination of the inwardly inclined surface with respect to the light receiving region, and bl denotes the distance between the inwardly inclined surfaces of the indenter, and b2 denotes the length of the orthogonal projection of the inwardly inclined surfaces on the plane of the light receiving region.

[0106] The above formula (4) differs from formula (1) only in that, in formula (4), d denotes the height difference between the bottom surface of the module portion facing the light receiving element and the top of the cushion structure, whereas in formula (1), d denotes the height difference between the bottom surface of the module portion facing the light receiving element and the top of the light receiving element.

[0107] According to one embodiment of the present application, after the flexible film is attached to the lower portion of the molding die, the stretch coefficient K of the flexible film generated is less than or equal to 1.4, where

[0108] K = 1 + (dl (1 / sin al - 1 / tan al) + d2 (1 / sin a2 - 1 / tan a2)) / (bl + b2 + b3) (4')

[0109] where dl and d2 denote the height difference between the bottom surface of the module portion facing the light receiving element and the top of the cushion structure, al and a2 denote the angle of inclination of the inwardly inclined surface with respect to the light receiving region, bl denotes the distance between the inwardly inclined surfaces of the indenter, and b2 and b3 denote the length of the orthogonal projection of the inwardly inclined surfaces on the plane of the light receiving region.

[0110] The difference between the above formula (4') and formula (4) is that the embodiment described by formula (4) is the same as the embodiment described by formula (4') where d1 = d2, α1 = α2 and b2 = b3.

[0111] According to one embodiment of this application, the flexible membrane has an anti-adhesion surface facing the molding die.

[0112] According to one embodiment of this application, the flexible membrane is made of one or more materials selected from the following: ETFE, PTFE, PFA, FEP, and PS.

[0113] Figure 9 A cross-sectional view of an imaging component according to another embodiment of this application is shown. As described in method 800 above, an imaging component can be prepared as follows: Figure 9 The imaging component 200' is shown. (As shown in the imager module 200'.) Figure 9 As shown, the imaging assembly 200' may include a circuit board 210, a photosensitive element 220, a molded package 230, and a buffer structure 240. The photosensitive element 220 may have a photosensitive area 222. The molded package 230 is formed around the photosensitive area 222 and in contact with the photosensitive element 220, and the molded package 230 has an inclined inner surface 231 and a top surface 232 higher than the photosensitive area 222. The buffer structure 240 is located between the photosensitive element 220 and the inclined inner surface 231. The height difference δH' between the top surface 232 of the molded package 230 and the top surface 241 of the buffer structure 240 is less than or equal to 0.7 mm, and the inclined inner surface 231 and the top surface 232 of the molded package 230 have different surface roughnesses.

[0114] According to one embodiment of this application, the buffer structure is a stepped adhesive and / or a filter element. Figure 9 The buffer structure shown is a stepped adhesive. Figure 10 It shows Figure 9 The buffer structure in the image is a filter element. Figure 11 It shows Figure 9 The buffer structure in the case is a stepped adhesive and a filter element.

[0115] According to one embodiment of this application, the reflectivity of the inclined inner surface of the molded package to visible light is less than or equal to 5%.

[0116] According to one embodiment of this application, the Ra value of the inclined inner surface of the molded encapsulation portion is greater than or equal to 1 μm.

[0117] According to one embodiment of this application, the Ra value of the top surface of the molded encapsulation portion is greater than the Ra value of the inclined inner surface.

[0118] According to one embodiment of this application, the tilt angle of the inclined inner surface relative to the photosensitive area is 20-70 degrees.

[0119] According to one embodiment of the present application, the size of the molded package portion satisfies the following inequality:

[0120] 5d(l / sin α - 1 / tan α) ≤ (b1 + 2b2) (5)

[0121] where d represents the height difference between the top surface of the molded package portion and the top of the buffer structure, α represents the inclination angle of the inclined inner side surface with respect to the light receiving region, b1 represents the distance between the opposite inclined inner side surfaces on the buffer structure, and b2 represents the length of the orthogonal projection of the inclined inner side surface on the plane of the light receiving region.

[0122] The above formula (5) differs from formula (2) only in that, in formula (5), d represents the height difference between the top surface of the molded package portion and the top of the buffer structure and b1 represents the distance between the opposite inclined inner side surfaces on the buffer structure, whereas in formula (2), d represents the height difference between the top surface of the molded package portion and the light receiving region of the light receiving element and b1 represents the distance between the opposite inclined inner side surfaces on the light receiving region.

[0123] According to one embodiment of the present application, the size of the molded package portion satisfies the following inequality:

[0124] d1(l / sin α1 - 1 / tan α1) + d2(l / sin α2 - 1 / tan α2) ≤ 0.4(b1 + b2 + b3) (5')

[0125] where d1 and d2 represent the height difference between the top surface of the molded package portion and the top of the buffer structure, α1 and α2 represent the inclination angle of the inclined inner side surface with respect to the light receiving region, b1 represents the distance between the opposite inclined inner side surfaces on the buffer structure, and b2 and b3 represent the length of the orthogonal projection of the inclined inner side surface on the plane of the light receiving region.

[0126] The above formula (5') differs from formula (5) in that the embodiment expressed by formula (5) is the case where d1 = d2, α1 = α2, and b2 = b3 in the embodiment expressed by formula (5').

[0127] Although the above description includes many specific arrangements and parameters, it should be noted that these specific arrangements and parameters are merely for illustrating one embodiment of the present application. This should not be considered as limiting the scope of the present application. Those skilled in the art can understand that various modifications, additions, and substitutions can be made without departing from the scope and spirit of the present application. Therefore, the scope of the present application should be interpreted based on the claims.

Claims

1. A method for manufacturing an imaging component, characterized in that, include: The photosensitive element is mounted on the circuit board of the imaging component to be manufactured; A flexible film is attached to the lower part of a molding die, wherein the flexible film has a rough surface facing away from the molding die, the lower part of the molding die includes a pressure head and a module portion located around the pressure head, the edge of the pressure head has an inwardly inclined surface, the inwardly inclined surface is inclined at an obtuse angle to the module portion adjacent to the bottom surface of the pressure head; A molding die with the flexible film attached is placed on the photosensitive element, and the height difference between the bottom surface of the module and the top surface of the photosensitive element is less than or equal to 0.7 mm; and A molded encapsulation portion is molded around the photosensitive element and between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, around the inwardly inclined surface of the pressure head edge, such that the molded encapsulation portion has an inclined inner surface adjacent to the inwardly inclined surface that corresponds to the non-smooth surface of the flexible film attached to the inwardly inclined surface.

2. The method as described in claim 1, characterized in that, The reflectivity of the inclined inner surface of the molded package to visible light is less than or equal to 5%.

3. The method as described in claim 1, characterized in that, The arithmetic mean deviation of the surface roughness profile of the inclined inner surface of the molded package is greater than or equal to 1 μm.

4. The method as described in claim 1, characterized in that, The arithmetic mean deviation of the surface roughness profile of the non-smooth surface of the flexible membrane attached to the module is greater than the arithmetic mean deviation of the surface roughness profile of the non-smooth surface of the flexible membrane attached to the inwardly inclined surface.

5. The method as described in claim 1, characterized in that, The step of placing the molding die with the flexible film attached onto the photosensitive element includes: placing the pressure head with the flexible film attached directly against the photosensitive area of ​​the photosensitive element.

6. The method as described in claim 5, characterized in that, The inwardly tilted surface has an inclination angle of 20-70 degrees relative to the photosensitive area.

7. The method as described in claim 1, characterized in that, After the flexible film is attached to the lower part of the molding die, the resulting flexible film has a tensile coefficient K that is less than or equal to 1.4, wherein... K = 1+2d(1 / sinα-1 / tanα) / (b1+2b2), Wherein, d represents the height difference between the bottom surface of the module face and the top surface of the photosensitive element, α represents the tilt angle of the inwardly tilted surface relative to the top surface of the photosensitive element, b1 represents the distance between the inwardly tilted surfaces of the pressure head, and b2 represents the length of the orthographic projection of the inwardly tilted surface onto the top surface of the photosensitive element.

8. The method as described in claim 1, characterized in that, After the flexible film is attached to the lower part of the molding die, the resulting flexible film has a tensile coefficient K that is less than or equal to 1.4, wherein... K = 1+ (d1(1 / sinα1-1 / tanα1)+ d2(1 / sinα2-1 / tanα2)) / ( b1+b2+b3), Wherein, d1 and d2 represent the height difference between the bottom surface of the module face and the top surface of the photosensitive element, α1 and α2 represent the tilt angle of the inwardly tilted surface relative to the top surface of the photosensitive element, b1 represents the distance between the inwardly tilted surfaces of the pressure head, and b2 and b3 represent the length of the orthographic projection of the inwardly tilted surface onto the top surface of the photosensitive element.

9. The method as described in claim 1, characterized in that, The flexible membrane has an anti-adhesion surface facing the molding die.

10. The method as described in claim 1, characterized in that, The flexible membrane is made of one or more materials selected from the following: ETFE, PTFE, PFA, FEP and PS.

11. A method for manufacturing an imaging component, characterized in that, include: The photosensitive element is mounted on the circuit board of the imaging component to be manufactured; The buffer structure is attached to the photosensitive element; A flexible film is attached to the lower part of a molding die, wherein the flexible film has a rough surface facing away from the molding die, the lower part of the molding die includes a pressure head and a module portion located around the pressure head, the edge of the pressure head has an inwardly inclined surface, the inwardly inclined surface is inclined at an obtuse angle to the module portion adjacent to the bottom surface of the pressure head; A molding die with the flexible film attached is placed on the buffer structure, and the height difference between the bottom surface of the module portion facing the photosensitive element and the top surface of the buffer structure is less than or equal to 0.7 mm; and A molded encapsulation portion is molded around the photosensitive element and between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, around the inwardly inclined surface of the pressure head edge, such that the molded encapsulation portion has an inclined inner surface adjacent to the inwardly inclined surface that corresponds to the non-smooth surface of the flexible film attached to the inwardly inclined surface.

12. The method as described in claim 11, characterized in that, The buffer structure is a stepped adhesive and / or a filter element.

13. The method as described in claim 11, characterized in that, The reflectivity of the inclined inner surface of the molded package to visible light is less than or equal to 5%.

14. The method as described in claim 12, characterized in that, The arithmetic mean deviation of the surface roughness profile of the inclined inner surface of the molded package is greater than or equal to 1 μm.

15. The method as described in claim 12, characterized in that, The arithmetic mean deviation of the surface roughness profile of the non-smooth surface of the flexible membrane attached to the module is greater than the arithmetic mean deviation of the surface roughness profile of the non-smooth surface of the flexible membrane attached to the inwardly inclined surface.

16. The method as described in claim 12, characterized in that, The step of placing the molding die with the flexible film attached onto the buffer structure includes: placing the pressure head with the flexible film attached directly against the buffer structure.

17. The method as described in claim 12, characterized in that, The inwardly tilted surface is tilted at an angle of 20-70 degrees relative to the photosensitive area of ​​the photosensitive element.

18. The method as described in claim 12, characterized in that, After the flexible film is attached to the lower part of the molding die, the resulting flexible film has a tensile coefficient K that is less than or equal to 1.4, wherein... K = 1+2d(1 / sinα-1 / tanα) / (b1+2b2), Wherein, d represents the height difference between the bottom surface of the module facet of the photosensitive element and the top surface of the buffer structure, α represents the tilt angle of the inwardly tilted surface relative to the photosensitive area of ​​the photosensitive element, b1 represents the distance between the inwardly tilted surfaces of the pressure head, and b2 represents the length of the orthographic projection of the inwardly tilted surface onto the plane of the photosensitive area.

19. The method as described in claim 12, characterized in that, After the flexible film is attached to the lower part of the molding die, the resulting flexible film has a tensile coefficient K that is less than or equal to 1.4, wherein... K = 1+ (d1(1 / sinα1-1 / tanα1)+ d2(1 / sinα2-1 / tanα2)) / ( b1+b2+b3), Wherein, d1 and d2 represent the height difference between the bottom surface of the module facet of the photosensitive element and the top surface of the buffer structure, α1 and α2 represent the tilt angle of the inwardly tilted surface relative to the photosensitive area of ​​the photosensitive element, b1 represents the distance between the inwardly tilted surfaces of the pressure head, and b2 and b3 represent the length of the orthographic projection of the inwardly tilted surface onto the plane of the photosensitive area.

20. The method as described in claim 12, characterized in that, The flexible membrane has an anti-adhesion surface facing the molding die.

21. The method as described in claim 12, characterized in that, The flexible membrane is made of one or more materials selected from the following: ETFE, PTFE, PFA, FEP and PS.

Images