Camera module

Abstract

The present invention relates to a camera module. The camera module comprises: a circuit board; a photosensitive chip connected to the circuit board, the photosensitive chip comprises a photosensitive surface, and the photosensitive surface comprises a photosensitive area; a package body packaged on the circuit board; a bracket mounted on the package body; the bracket comprises a bracket body and an extension structure, the side of the bracket body away from the package body is flush with the extension structure, and the end of the extension structure away from the bracket body is located at a positive projection on the photosensitive surface and is spaced from the photosensitive area. The above-mentioned camera module is a three-section structure of a package body + bracket + lens, and the optical axis alignment of the camera module is easy to control, and a camera module with higher imaging quality can be obtained.

Description

Technical Field

[0001] The present invention relates to the field of camera technology, and in particular to a camera module. Background Art

[0002] like Figure 1 As shown, the conventional camera module 10 includes a circuit board 11, a photosensitive chip 12 disposed on the circuit board 11, a package body 13 encapsulated on the circuit board 11 and extending to the photosensitive chip 12, electronic components 14 and conductive wires 15 located in the package body 13, and a filter 16 and a lens, wherein the lens includes a frame 17 and a lens (not shown) disposed in the frame 17. A step portion for arranging the filter 16 is provided on the surface of the package body 13 away from the circuit board 11, and the surface of the package body 13 away from the circuit board 11 is also used to connect the frame 17. As the carrier of the filter 16 and the lens, the package body 13 needs to have a certain strength, which requires that the package body 13 has certain dimensions in the three directions of XYZ, and the optical axis 10a of the camera module 10 is parallel to the Z axis. The greater the height of the package body 13 in the Z axis direction, the greater the difficulty in controlling the central axis of the light hole of the package body 13 to coincide with the optical axis 10a when the package body 13 is formed by a mold, and it is not easy to obtain a camera module with higher imaging quality. Summary of the invention

[0003] Based on this, it is necessary to provide a camera module that can achieve higher imaging quality.

[0004] A camera module, comprising:

[0005] Circuit board;

[0006] A photosensitive chip connected to the circuit board, wherein the photosensitive chip comprises a photosensitive surface, and the photosensitive surface comprises a photosensitive area;

[0007] A packaging body, packaged on the circuit board;

[0008] A bracket is mounted on an end of the package body away from the circuit board; and

[0009] Among them, the bracket includes a bracket body and an extension structure arranged on the inner wall of the bracket body, the side of the bracket body away from the packaging body is flush with the side of the extension structure away from the packaging body, and the end of the extension structure away from the bracket body is located at the positive projection on the photosensitive surface and is spaced apart from the photosensitive area.

[0010] In the above-mentioned camera module, the bracket can be used to carry the lens assembly, that is, the above-mentioned camera module is a three-section structure of a package body + bracket + lens, and part of the package body is replaced by the bracket. When forming the package body, a package body with a relatively small height can be formed. The smaller the height of the package body in the Z-axis direction, the easier it is to control the optical axis alignment of the camera module, and a camera module with higher imaging quality can be obtained. The side of the bracket body away from the package body is flush with the side of the extension structure away from the package body, which makes it easier to set the frame on the bracket body and the extension structure at the same time. The end of the extension structure away from the bracket body is located on the photosensitive surface. The projection and the photosensitive area are spaced apart, which can avoid the extension structure blocking the light in the photosensitive area, so that the camera module has better imaging quality.

[0011] In one embodiment, the distance between the orthographic projection of the end of the extension structure away from the bracket body on the photosensitive surface and the photosensitive area is 100 to 500 μm. In this way, the extension structure can be prevented from blocking the light of the photosensitive area, and the extension structure can be ensured to have a larger size to have a larger connection area with the filter, so that the filter and the bracket are firmly connected.

[0012] In one embodiment, the distance between the orthographic projection of the end of the extension structure away from the bracket body on the photosensitive surface and the photosensitive area is 200-400 μm. In this way, the extension structure can be prevented from blocking the light of the photosensitive area, and the extension structure can be ensured to have a larger size to have a larger connection area with the filter, so that the filter and the bracket are firmly connected.

[0013] In one embodiment, the length of the extension structure is 200-1500 μm. In this way, it can be ensured that the filter and the extension structure have a large overlap area, so that the filter and the extension structure are firmly connected, and it can also avoid that the camera module is too large in size in the XY plane due to the length of the extension structure being too large.

[0014] In one embodiment, the length of the extension structure is 700-900 μm. In this way, it can be ensured that the filter and the extension structure have a large overlap area, so that the filter and the extension structure are firmly connected, and it can also avoid that the camera module is too large in the XY plane due to the length of the extension structure being too large.

[0015] In one embodiment, the extension structure includes a first side surface close to the package body, and the height between the photosensitive surface and the first side surface is 150-1500 μm. In this way, the light can be prevented from being blocked by the bracket, thereby improving the imaging quality of the camera module.

[0016] In one embodiment, the height between the photosensitive surface and the first side surface is 500-1000 μm. In this way, the light can be prevented from being blocked by the bracket, thereby improving the imaging quality of the camera module.

[0017] In one embodiment, the package body includes a bearing end face away from the circuit board, and the extension structure includes a first side face close to the package body; the camera module also includes a filter, the filter is located in the support body, and the filter is connected to at least one of the inner wall of the support body, the bearing end face, and the first side face of the extension structure. In this way, the filter is sandwiched between the bearing end face of the package body and the first side face of the extension structure. In this way, when the camera module is used in a harsh environment, for example, in an environment with high vibration intensity, the extension structure can prevent the detached filter from moving to the lens assembly.

[0018] In one embodiment, the camera module further includes a lens assembly, the lens assembly includes a frame and a lens disposed in the frame, and the frame is connected to the support body and the extension structure at the same time. In this way, the frame and the support can be firmly connected.

[0019] In one embodiment, the photosensitive surface includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the package encapsulates at least part of the structure of the non-photosensitive area of ​​the photosensitive chip. In this way, the connection between the photosensitive chip and the circuit board can be strengthened. Moreover, when the package extends into the non-photosensitive area of ​​the photosensitive chip, the size of the package in the XY plane can be reduced without changing the bearing strength of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a camera module in the prior art;

[0021] Figure 2 It is a structural schematic diagram of a camera module according to one embodiment of the present invention;

[0022] Figure 3 for Figure 2 A schematic diagram of the structure of the camera module after removing the lens assembly;

[0023] Figure 4 for Figure 3 A schematic diagram of the structure of the side wall of the light-through hole of the package body;

[0024] Figure 5 for Figure 3 A schematic diagram of the structure in which the package, the bracket and the filter are in a separated state;

[0025] Figure 6 for Figure 3An enlarged view of the right side of the camera module in FIG.

[0026] Figure 7 for Figure 3 Magnified view of the right side of the bracket. DETAILED DESCRIPTION

[0027] The camera module is further described below in conjunction with the accompanying drawings and specific embodiments.

[0028] like Figure 2 and Figure 3 As shown, a camera module 20 of an embodiment includes a circuit board 100, a photosensitive chip 200, a package 300, a bracket 400, a lens assembly 500 and a filter 600. The camera module 20 is usually in a rectangular parallelepiped shape, a cylindrical shape, etc. The camera module 20 has a certain length in the X-axis direction, a certain width in the Y-axis direction, and a certain height in the Z-axis direction. The camera module 20 has an optical axis 20a, and the optical axis 20a is parallel to the Z-axis.

[0029] The photosensitive chip 200 is connected to the circuit board 100. The package body 300 is packaged on the circuit board 100. The bracket 400 is installed on the end of the package body 300 away from the circuit board 100. The lens assembly 500 is arranged on the end of the bracket 400 away from the circuit board 100. Among them, the lens assembly 500 includes a frame 510 and a lens 520 arranged in the frame 510. The above-mentioned camera module 20 is a three-section structure of a package body 300+bracket 400+lens assembly 500. Compared with the traditional two-section structure of a package body+lens, part of the package body is replaced by the bracket. When forming the package body 300, a package body 300 with a relatively small height can be formed. The smaller the height of the package body 300 in the Z-axis direction, the easier it is to control the alignment of the optical axis 20a of the camera module, and a camera module 20 with higher imaging quality can be obtained.

[0030] like Figure 2 and Figure 3As shown, in this embodiment, a light hole 310 is opened on the package body 300. The photosensitive chip 200 includes a photosensitive surface 210 close to the bracket 400, and the photosensitive surface 210 includes a photosensitive area 212 and a non-photosensitive area 214 surrounding the photosensitive area 212. The dotted line a indicates the junction between the photosensitive area 212 and the non-photosensitive area 214. The package body 300 encapsulates at least part of the structure of the non-photosensitive area 214 of the photosensitive chip 200, so that the connection between the photosensitive chip 200 and the circuit board 100 can be strengthened. Moreover, when the package body 300 extends into the non-photosensitive area 214 of the photosensitive chip 200, the size of the package body 300 in the XY plane can be reduced without changing the bearing strength of the package body 300. It is understandable that in other embodiments, the photosensitive chip 200 may also be accommodated in the light-through hole 310 of the package body 300 and spaced apart from the inner wall of the light-through hole 310 , that is, the package body 300 does not cover the non-photosensitive area 214 of the photosensitive chip 200 .

[0031] exist Figure 2 and Figure 3 In the embodiment, part of the non-photosensitive area 214 is embedded in the package body 300, and part of the non-photosensitive area 214 is not embedded in the package body 300 and is exposed. When the package body 300 is formed, if the material forming the package body 300 leaks, the non-photosensitive area 214 exposed outside can receive the material forming the package body 300, thereby preventing the material forming the package body 300 from flowing to the photosensitive area 212, that is, the non-photosensitive area 214 exposed outside has a protective effect on the photosensitive area 212.

[0032] Further, if Figure 3 and Figure 4 As shown, in this embodiment, the bottom of the light hole 310 is a concave surface 312 formed by being recessed toward the outer wall 330 of the package body 300, which facilitates the demolding of the injection molding mold of the package body 300, avoids damage to the package body 300, and ultimately improves the imaging quality of the camera module 20.

[0033] Furthermore, in this embodiment, a chamfer 314 is provided at the top of the light hole 310. When bonding the bracket 400 and the package body 300, excess adhesive can flow inward to the chamfer 314. The chamfer 314 has a greater resistance to the flow of the adhesive relative to the vertical surface, which can reduce the flow speed of the adhesive, so that the adhesive is deposited on the chamfer 314. Furthermore, the chamfer 314 has a larger surface area relative to the vertical surface and can carry more adhesive. In this way, the adhesive can be effectively prevented from flowing to the photosensitive area 212 of the photosensitive chip 200.

[0034] Furthermore, in this embodiment, the sidewall of the light hole 310 further includes a vertical surface 316 connecting the concave surface 312 and the rounded corner 314, and the vertical surface 316 is perpendicular to the photosensitive chip 200. In other embodiments, the sidewall of the light hole 310 connecting the concave surface 312 and the rounded corner 314 may also be an inclined surface.

[0035] like Figure 3 and Figure 5 As shown, the package body 300 includes a bearing end face 320 away from the circuit board 100. The bracket 400 includes a bracket body 410 and an extension structure 420 provided on the inner wall of the bracket body 410, and the extension structure 420 includes a first side face 422 close to the package body 300 and a second side face 424 opposite to the first side face 422. The filter 600 is sandwiched between the bearing end face 320 of the package body 300 and the first side face 422 of the extension structure 420. In this way, when the camera module 20 is used in a harsh environment, for example, in an environment with high vibration intensity, the extension structure 420 can prevent the detached filter 600 from moving to the lens assembly 500.

[0036] The optical filter 600 is sandwiched between the bearing end surface 320 of the package body 300 and the first side surface 422 of the extension structure 420, and the optical filter 600 can be connected to at least one of the inner wall of the support body 410, the bearing end surface 320 and the first side surface 422. For example, the optical filter 600 can be connected to the inner wall of the support body 410, the optical filter 600 can also be connected to any one of the bearing end surface 320 and the first side surface 422, and the optical filter 600 can also be connected to both the bearing end surface 320 and the first side surface 422.

[0037] Specifically, in this embodiment, the filter 600 has a first surface 610 and a second surface 620 that are arranged opposite to each other, and the first surface 610 and the second surface 620 are connected to the bearing end surface 320 and the first side surface 422, respectively. The first surface 610 of the filter 600 is connected to the bearing end surface 320, and the second surface 620 is connected to the first side surface 422. Compared with the connection between the filter 600 and the bearing end surface 320 and the first side surface 422, the connection area is doubled, which ensures the connection firmness of the filter 600, so that the above-mentioned camera module 20 can be used in harsh environments. Moreover, under the condition that the connection area remains unchanged, the size of the camera module 20 on the XY plane can be compressed, thereby obtaining a camera module 20 with a smaller size.

[0038] Since the filter 600 is sandwiched between the extension structure 420 and the package body 300, the bracket body 410 and the end of the extension structure 420 away from the package body 300 can both be used to carry the lens assembly 500, that is, the lens assembly 500 can be arranged not only on the bracket body 410, but also on the extension structure 420. In this way, the connection area between the lens assembly 500 and the bracket 400 can be increased, so that the frame 510 and the bracket 400 are firmly connected.

[0039] In such Figure 1 In the conventional camera module 10 shown, the lens frame 17 and the filter 16 are both arranged on the package body 13. The lens frame 17 and the filter 16 are arranged at intervals on the XY plane and are not directly opposite (overlapping) in the Z-axis direction, resulting in a larger size of the camera module 10 in the XY plane. In this embodiment, the lens assembly 500 can be arranged not only on the bracket body 410, but also on the extension structure 420, so that the lens frame 510 and the filter 600 can overlap in the Z-axis direction. Please refer to Figure 2 Under the premise of ensuring that the frame 510 and the bracket 400 have a certain connection area (equivalent to the traditional connection area), the Figure 2 Part of the mirror frame 510, part of the bracket body 410, and part of the circuit board 100 and part of the packaging body 300 corresponding to the part of the bracket body 410 in the dotted box c are omitted, thereby reducing the size of the camera module 20 in the X-axis direction and the Y-axis direction, and obtaining a smaller camera module 20.

[0040] like Figure 2 As shown, further, in this embodiment, the side of the support body 410 away from the package body 300 is flush with the side of the extension structure 420 away from the package body 300. In this way, it is more convenient to set the frame 510 on the support body 410 and the extension structure 420 at the same time.

[0041] Further, if Figure 3 As shown, in this embodiment, the camera module 20 further includes a first adhesive layer 700 and a second adhesive layer 800. The first adhesive layer 700 is disposed between the first surface 610 of the optical filter 600 and the bearing end surface 320, and the second adhesive layer 800 is disposed between the second surface 620 of the optical filter 600 and the first side surface 422 of the extension structure 420. During assembly, the optical filter 600 can be firstly bonded to the extension structure 420 of the bracket 400, and the thickness of the first adhesive layer 700 can be adjusted so that the optical filter 600 is flush with one end of the bracket body 410 close to the package body 300, which is very convenient for subsequently bonding the bracket 400 to the package body 300 and bonding the optical filter 600 to the package body 300.

[0042] Further, if Figure 3 and Figure 6As shown, in this embodiment, the filter 600 is spaced from the inner wall of the bracket body 410, that is, there is a gap L1 between the filter 600 and the inner wall of the bracket body 410. This can prevent the filter 600 from being crushed due to extrusion when installing the filter 600, and when the filter 600 is bonded to the bracket 400, and when the bracket 400 is bonded to the package body 300, the gap L1 between the filter 600 and the inner wall of the bracket body 410 can be used to accommodate excess adhesive. Further, in this embodiment, the spacing (gap L1) between the filter 600 and the inner wall of the bracket body 410 is 50 to 1500 μm. Preferably, the spacing (gap L1) between the filter 600 and the inner wall of the bracket body 410 is 100 to 500 μm. Specifically, in this embodiment, the spacing between the filter 600 and the inner wall of the bracket body 410 is 100 μm. In this way, the filter 600 can be effectively prevented from being broken due to squeezing, and the gap L1 can be prevented from being too large, thereby compressing the overlapping area between the filter 600 and the extension structure 420 so that the filter 600 and the extension structure 420 are firmly connected.

[0043] Further, if Figure 6 As shown, in this embodiment, the orthographic projection of one end 426 of the extension structure 420 away from the bracket body 410 on the photosensitive surface 210 is located in the non-photosensitive area 214, that is, the orthographic projection of one end of the extension structure 420 away from the bracket body 410 on the photosensitive surface 210 is spaced from the photosensitive area 214. In this way, the extension structure 420 can be prevented from blocking the light of the photosensitive area 212, so that the camera module 20 has better imaging quality.

[0044] Further, in the present embodiment, the distance L2 between the orthographic projection of one end 426 of the extension structure 420 away from the bracket body 410 on the photosensitive surface 210 and the photosensitive area 212 is 100 to 500 μm. In this way, it is possible to prevent the extension structure 420 from blocking the light of the photosensitive area 212, and ensure that the extension structure 420 has a larger size to have a larger connection area with the filter 600, so that the filter 600 is firmly connected to the bracket 400. Preferably, the distance L2 between the orthographic projection of one end 426 of the extension structure 420 away from the bracket body 410 on the photosensitive surface 210 and the photosensitive area 212 is 200 to 400 μm. Specifically, in the present embodiment, the distance L2 between the orthographic projection of one end 426 of the extension structure 420 away from the bracket body 410 on the photosensitive surface 210 and the photosensitive area 212 is 300 μm.

[0045] Further, if Figure 6As shown, in this embodiment, the height H between the photosensitive surface 210 and the first side surface 422 of the extension structure 420 is 150-1500 μm. Further, in this embodiment, the height H between the photosensitive surface 210 and the first side surface 422 of the extension structure 420 is 500-1000 μm. In this way, the light can be prevented from being blocked by the bracket 400, thereby improving the imaging quality of the camera module 20.

[0046] Further, if Figure 7 As shown, in the present embodiment, in the direction from the support body 410 to the extension structure 420, the length L3 of the extension structure 420 is 200 to 1500 μm. Further, in the present embodiment, in the direction from the support body 410 to the extension structure 420, the length L3 of the extension structure 420 is 500 to 900 μm. Specifically, in the present embodiment, in the direction from the support body 410 to the extension structure 420, the length L3 of the extension structure 420 is 800 μm. In this way, it can be ensured that the filter 600 and the extension structure 420 have a large overlap area, so that the filter 600 and the extension structure 420 are firmly connected, and it can also avoid the camera module 20 being larger in size in the XY plane due to the length of the extension structure 420 being too large.

[0047] Further, if Figure 7 As shown, in this embodiment, the extension structure 420 further includes a vertical surface 427 away from the bracket body 410 and an inclined surface 428 connecting the vertical surface 427 and the first side surface 422. The included angle γ between the vertical surface 427 and the inclined surface 428 is greater than 90°. Preferably, the included angle γ between the vertical surface 427 and the inclined surface 428 is 135°. Therefore, when bonding the lens assembly 500 and the bracket 400, the excess adhesive flows along the vertical surface 427 and the inclined surface 428, thereby preventing the excess adhesive from dripping onto the photosensitive chip 200.

[0048] Further, if Figure 6 and Figure 7 As shown, in this embodiment, a first groove 412 is formed on the outer wall of one end of the bracket body 410 close to the package body 300, and the first groove 412 is missing on the side close to the package body 300. When bonding the bracket 400 and the package body 300, the first groove 412 can contain excess adhesive to avoid or reduce the adhesive from flowing to the outer wall of the package body 300.

[0049] Furthermore, in this embodiment, a second groove 414 is formed on the outer wall of the end of the bracket body 410 away from the package body 300, and the second groove 414 is missing on the side away from the package body 300. When bonding the lens assembly 500 and the bracket 400, the second groove 414 can contain excess adhesive to avoid or reduce the adhesive from flowing to the outer wall of the bracket 400.

[0050] Further, if Figure 2 and Figure 3 As shown, in this embodiment, the camera module 20 also includes a third adhesive layer arranged between the bracket body 410 and the packaging body 300, and a fourth adhesive layer arranged between the frame 510 and the bracket body 410 and the extension structure 420.

[0051] In the camera module 20, the lens assembly 500 needs to be arranged on the photosensitive path (optical axis 20a) of the photosensitive chip 200. In this embodiment, the lens assembly 500 is arranged on the photosensitive path of the photosensitive chip 200 through the package body 300 and the bracket 400. First, a relatively small package body 300 is formed by a manufacturing process. When the package body 300 is formed, the center line of the light hole 310 of the package body 300 is aligned with the optical axis 20a. Then, the bracket 400 provided with the filter 600 is arranged on the package body 300. Specifically, the end face of the bracket body 410 close to the package body 300 or the bearing end face 320 is coated with an adhesive, and the alignment of the center line of the bracket 400 and the optical axis 20a is adjusted by adjusting the thickness of the adhesive. Finally, the end face of the bracket body 410 away from the package body 300 or the connecting end face of the lens assembly 500 is coated with an adhesive, and the alignment of the center line of the lens assembly 500 and the optical axis 20a is adjusted by adjusting the thickness of the adhesive. Segmented control can reduce the control difficulty of each segment, thereby reducing the process requirements for manufacturing the camera module 20.

[0052] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Circuit board; A photosensitive chip connected to the circuit board, wherein the photosensitive chip comprises a photosensitive surface, and the photosensitive surface comprises a photosensitive area; A packaging body, packaged in the circuit board and comprising a load-bearing end surface away from the circuit board; A bracket, mounted on an end of the package body away from the circuit board, the bracket comprising a bracket body and an extension structure provided on an inner wall of the bracket body, a side of the bracket body away from the package body is flush with a side of the extension structure away from the package body, an end of the extension structure away from the bracket body is located at a positive projection on the photosensitive surface and is spaced from the photosensitive area, and the extension structure comprises a first side surface close to the package body; A filter is located in the support body, and the filter is connected to at least one of the inner wall of the support body, the bearing end surface, and the first side surface of the extension structure; A lens assembly, comprising a frame and a lens disposed in the frame, wherein the frame is connected to the support body and the extension structure at the same time; A third adhesive layer is provided between the bracket body and the packaging body, and the alignment between the center line of the bracket and the optical axis of the camera module is adjusted by adjusting the thickness of the third adhesive layer; The fourth adhesive layer is provided between the frame, the support body and the extension structure, and the alignment between the center line of the lens assembly and the optical axis of the camera module is adjusted by adjusting the thickness of the fourth adhesive layer.

2. The camera module according to claim 1, characterized in that: The distance between the orthographic projection of one end of the extending structure away from the bracket body on the photosensitive surface and the photosensitive area is 100-500 μm.

3. The camera module according to claim 2, characterized in that: The distance between the orthographic projection of one end of the extending structure away from the bracket body on the photosensitive surface and the photosensitive area is 200-400 μm.

4. The camera module according to claim 1, characterized in that: The length of the extension structure is 200-1500 μm.

5. The camera module according to claim 4, characterized in that: The length of the extension structure is 500-900 μm.

6. The camera module according to claim 1, characterized in that: The extension structure includes a first side surface close to the package body, and a height between the photosensitive surface and the first side surface is 150-1500 μm.

7. The camera module according to claim 6, characterized in that: The height between the photosensitive surface and the first side surface is 500-1000 μm.

8. The camera module according to claim 1, characterized in that: The photosensitive surface includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the packaging body encapsulates at least a partial structure of the non-photosensitive area of ​​the photosensitive chip.

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