Bracket, manufacturing method of long creepage photoelectric coupler and long creepage photoelectric coupler

Abstract

The present invention discloses a bracket, a method for manufacturing a long creepage photoelectric coupler, and a long creepage photoelectric coupler. The bracket is used for manufacturing the long creepage photoelectric coupler, and includes a first sub-bracket and a second sub-bracket, wherein the first sub-bracket includes a plurality of columns of first frames, and both sides of each column of the first frames include a plurality of first pins arranged with equal spacing, and the first pins on the first side of each column of the first frames are staggered with the first pins on the second side; the second sub-bracket includes a plurality of columns of second frames, and both sides of each column of the second frames include a plurality of second pins arranged with equal spacing, and the second pins on the first side of each column of the second frames are staggered with the second pins on the second side, and the second pins on the same side of the second frame and the first frame correspond to the first pins. The embodiments provided by the present invention can realize the intensive production of long creepage photoelectric couplers, improve the output efficiency, and reduce the production cost.

Description

Technical Field

[0001] The invention relates to the technical field of long creepage photoelectric couplers, and in particular to a bracket, a manufacturing method of a long creepage photoelectric coupler, and a long creepage photoelectric coupler. Background Art

[0002] Optocouplers use light as a medium to transmit electrical signals. They are now widely used in electrical insulation, level conversion, inter-electrode coupling, drive circuits, switching circuits, choppers, multivibrators, signal isolation, inter-stage isolation, pulse amplification circuits, digital instruments, long-distance signal transmission, pulse amplification, solid-state relays (SSRs), instrumentation, communications equipment, and microcomputer interfaces. In unidirectional signal transmission, the input and output ends are completely electrically isolated. With the continuous changes in market demand, optocouplers have begun to gradually develop towards smaller sizes to meet the needs of lightweight and small-sized development of the entire machine. With its own lightweight and small design, long-climbing optocouplers have begun to gradually replace the original large-sized ordinary optocouplers, and have developed particularly rapidly in the field of fast power charging.

[0003] For manufacturers of long creepage optocouplers, the main research direction is how to reduce production costs and increase production efficiency while ensuring all performance indicators. High-density design and stable and feasible production have become the problems to be solved. Summary of the invention

[0004] In order to solve at least one of the above problems, the present invention provides a bracket in a first aspect for manufacturing a long creepage photoelectric coupler, wherein the bracket comprises a first sub-bracket and a second sub-bracket, wherein

[0005] The first sub-bracket comprises a plurality of columns of first frames, both sides of each column of the first frames comprise a plurality of first pins arranged with equal spacing, and the first pins on the first side of both sides of each column of the first frames are arranged alternately with the first pins on the second side;

[0006] The second sub-bracket includes a plurality of columns of second frames, and both sides of each column of the second frames include a plurality of second pins arranged with equal spacing, and the second pins on the first side of both sides of each column of the second frames are arranged alternately with the second pins on the second side, and the second pins on the same side of the second frame and the first frame correspond to the first pins.

[0007] The first sub-bracket and the second sub-bracket are overlapped, and the corresponding first pins and the second pins are overlapped.

[0008] Further, the number of first pins included in the first side of the first frame is the same as the number of first pins included in the second side.

[0009] Furthermore, the two columns of first frames at the edge of the first sub-bracket respectively include first pins facing one side of the center of the first sub-bracket.

[0010] Furthermore, the first side and the second side of each column of the first frame and the second frame respectively include third pins for support.

[0011] Furthermore, two adjacent first pins on each side of each column of the first frame form a first base island for carrying a light source chip;

[0012] Two adjacent second pins on each side of each column of the second frame form a second base island for carrying the light receptor chip.

[0013] The second aspect of the present invention provides a method for manufacturing a long creepage optoelectronic coupler using the bracket described in the first aspect, comprising:

[0014] S1: Paste the light source and the light receiver on the first base island and the second base island respectively, perform wire welding after pre-curing, weld the light source on the first sub-bracket, and weld the light receiver on the second sub-bracket;

[0015] S3: stacking the first sub-bracket and the second sub-bracket, and using resin glue to plastic-encapsulate the light source and the light receiver to form a plurality of long creepage photoelectric couplers;

[0016] S5: removing the resin glue from the first sub-bracket and the second sub-bracket and electroplating the first pin and the second pin;

[0017] S7: Cut the bracket to separate the plurality of long creepage optoelectronic couplers from the bracket.

[0018] Furthermore, the S3 further includes:

[0019] S31: using a first resin glue to encapsulate the light source and the light receiver to form an isolation medium serving as a light path for the light source and the light receiver;

[0020] S33: using a second resin glue to perform secondary plastic sealing on the light source and the light receiver to form a plurality of long creepage photoelectric couplers.

[0021] Furthermore, after S31 and before S33, the manufacturing method further includes:

[0022] S32: Cut off the third pins supporting the first side and the second side of each column of the first frame and the second frame.

[0023] Furthermore, after S1 and before S3, the manufacturing method further includes:

[0024] S2: using silica gel to solidify the light source on the first base island.

[0025] A third aspect of the present invention provides a long creepage photoelectric coupler, which is manufactured using the manufacturing method described in the second aspect.

[0026] The beneficial effects of the present invention are as follows:

[0027] In view of the current existing problems, the present invention develops a method for manufacturing a bracket and a long creepage optocoupler, and realizes high-density production of the bracket by alternating the arrangement of pins in odd columns and even columns, which can reduce production costs, effectively increase production efficiency and achieve stable production. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] Figure 1 A schematic diagram showing the structure of a bracket according to an embodiment of the present invention is shown;

[0030] Figure 2 A schematic diagram showing the structure of the first sub-bracket according to an embodiment of the present invention is shown;

[0031] Figure 3 A schematic diagram showing the structure of the second sub-bracket according to an embodiment of the present invention is shown;

[0032] Figure 4 A schematic diagram showing the structure of the bracket stacking according to an embodiment of the present invention;

[0033] Figure 5 A flow chart showing a manufacturing method according to an embodiment of the present invention;

[0034] Figure 6 A flow chart showing the resin encapsulation according to an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of the structure after white glue plastic sealing according to an embodiment of the present invention is shown;

[0036] Figure 8 A schematic structural diagram of cutting off the third pin according to an embodiment of the present invention is shown;

[0037] Fig. 9 A schematic diagram showing the structure after black glue plastic packaging according to an embodiment of the present invention is shown;

[0038] Fig.10 A schematic diagram showing the structure of the bracket after gold plating according to an embodiment of the present invention is shown;

[0039] Fig.11A schematic diagram of a long creepage optocoupler according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0040] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0041] like Figure 1 As shown, an embodiment of the present invention provides a bracket for making a long creepage optoelectronic coupler, wherein the bracket includes a first sub-bracket and a second sub-bracket, wherein the first sub-bracket includes a plurality of columns of first frames, both sides of each column of the first frames include a plurality of first pins arranged with equal spacing, and the first pins on the first side of both sides of each column of the first frames are staggered with the first pins on the second side; the second sub-bracket includes a plurality of columns of second frames, both sides of each column of the second frames include a plurality of second pins arranged with equal spacing, and the second pins on the first side of both sides of each column of the second frames are staggered with the second pins on the second side, and the second pins on the same side of the second frame and the first frame correspond to the first pins; the first sub-bracket and the second sub-bracket are overlapped, and the corresponding first pins and second pins are overlapped.

[0042] In a specific example, Figure 2 and Figure 3 As shown, the bracket includes a first sub-bracket 1 and a second sub-bracket 6, wherein the first sub-bracket 1 includes a plurality of columns of first frames 2, and both sides of each column of the first frames 2 include a plurality of first pins 3 arranged with equal spacing, such as Figure 2 As shown, the first pins 3 on the first side and the first pins 3 on the second side of each column of the first frames 2 are arranged alternately, that is, the positions of the first pins 3 on the two sides of each column of the first frames 2 are staggered.

[0043] The number of first pins on both sides of the first frame 2 may be the same or different. Considering the maximum use of material cost, in a preferred embodiment, the number of first pins 3 included on the first side of the first frame 2 is the same as the number of first pins 3 included on the second side. And the two adjacent first pins 3 on each side of each column of the first frame 2 form a first base island 5 for carrying a light source chip.

[0044] In a preferred embodiment, in view of making full use of the edge structure of the first sub-bracket, the two columns of first frames 2 at the edge of the first sub-bracket 1 respectively include first pins 3 facing the center side of the first sub-bracket 1, that is, the first column of first frames 2 at the edge position in the first sub-bracket 1 only include first pins facing the center side of the bracket, and the last column of first frames 2 only include first pins facing the center side of the bracket.

[0045] In a preferred embodiment, in order to ensure the support and stability of the first sub-bracket, each column of the first frame 2 further includes a third pin 4 .

[0046] Similarly, the second sub-bracket 6 includes a plurality of columns of second frames 7, and both sides of each column of second frames 7 include a plurality of second pins 8 arranged at equal intervals, and the second pins 8 on the first side and the second pins 8 on the second side of each column of second frames 7 are arranged alternately, and the second pins 8 on the same side of the second frame 7 and the first frame 2 correspond to the first pins 3. That is, the structure of the second frame corresponds to the first frame 2, the number of the second pins 8 is the same as the number of the first pins 3, and each column of second frames 7 also includes a third pin 4. And the adjacent two second pins 8 on each side of each column of second frames 7 form a second base island 9 for carrying the photoreceptor chip.

[0047] like Figure 4 As shown, the first sub-bracket 1 and the second sub-bracket 6 are overlapped, and the corresponding first pin 3 and the second pin 8 are overlapped, that is, the corresponding first base island 5 and the second base island 9 are overlapped to form a core structure of a long creepage optoelectronic coupler.

[0048] In this embodiment, the first frame 2 is set as a two-sided structure, and the first pins 3 on both sides are set as a staggered structure, and the first base islands 5 on both sides are set as a staggered structure; the second frame 7 is set as a two-sided structure, and the second pins 8 on both sides are set as a staggered structure, and the first base islands 5 on both sides are set as a staggered structure; when the first sub-bracket 1 and the second sub-bracket 6 are overlapped, the corresponding first base islands 5 and second base islands 9 are overlapped to form a long creepage optoelectronic coupler, and multiple long creepage optoelectronic couplers are formed on the bracket. The above-mentioned setting realizes the intensive production of long creepage optoelectronic couplers on the bracket, improves the output efficiency, and reduces the production cost.

[0049] like Figure 5 As mentioned above, one embodiment of the present invention further provides a method for manufacturing a long creepage optoelectronic coupler using the above-mentioned bracket, comprising:

[0050] S1: Paste the light source and the light receiver on the first base island and the second base island respectively, perform wire welding after pre-curing, weld the light source on the first sub-bracket, and weld the light receiver on the second sub-bracket.

[0051] In a preferred embodiment, in order to protect the relatively fragile light source chip, the manufacturing method further includes:

[0052] S2: using silica gel to solidify the light source on the first base island.

[0053] S3: Overlap the first sub-bracket and the second sub-bracket, and use resin glue to plastic-encapsulate the light source and the light receiver to form a plurality of long creepage photoelectric couplers, such as Figure 6 As shown, further comprising:

[0054] S31: using a first resin glue to encapsulate the light source and the light receiver to form an isolation medium as a light path for the light source and the light receiver; Figure 7 As shown, white resin is injected into the white glue plastic mold as a light path between the input end and the output end and as an isolation medium between the input end and the output end. Then, excess white glue is removed.

[0055] In a preferred embodiment, in order to release the stress generated by the white glue plastic sealing and ensure that the deformation of the frame caused by the stress generated in the black glue plastic sealing is greatly reduced, while maintaining the overall strength of the frame and ensuring that the product bracket can move normally in the glue removal and rib cutting mold, the method also includes:

[0056] S32: Cut off the third pins supporting the first side and the second side of each column of the first frame and the second frame. Figure 8 As shown, ① is the first pin and the second pin that have not been cut off, and ② is the third pin that has been cut off.

[0057] S33: Use a second resin glue to perform secondary plastic sealing on the light source and the light receiver to form a plurality of long creepage photoelectric couplers. Fig. 9 As shown, black resin is injected into the black plastic encapsulation mold to protect the internal structure of the long creepage optocoupler while blocking the influence of external ambient light on the internal optical path of the product, thereby ensuring the creepage distance of the product surface.

[0058] S5: Remove the resin glue from the first sub-bracket and the second sub-bracket and electroplate the first pin and the second pin. First, bake and cure the black glue and the white glue at the curing temperature for a specified time to ensure the completion of the resin cross-linking reaction and the stability of the packaging structure. Secondly, remove the black glue from the bracket after the black glue plastic sealing is cured to ensure that each pin position can be plated with tin in the subsequent electroplating. Finally, electroplate the first pin and the second pin to ensure the solderability of the long creepage optocoupler, such as Fig.10 shown.

[0059] S7: cutting the bracket to separate the plurality of long creepage optocouplers from the bracket and accurately punching the pins to ensure the molding size of the pins of the final product.

[0060] Corresponding to the manufacturing method provided in the above-mentioned embodiments, an embodiment of the present application also provides a long creepage optoelectronic coupler manufactured using the above-mentioned manufacturing method. Since the long creepage optoelectronic coupler provided in the embodiment of the present application corresponds to the manufacturing methods provided in the above-mentioned embodiments, the aforementioned implementation mode is also applicable to the long creepage optoelectronic coupler provided in this embodiment and will not be described in detail in this embodiment.

[0061] like Fig.11 As shown, one embodiment of the present invention provides a long creepage optocoupler, which is manufactured using the above-mentioned manufacturing method.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A bracket used for making a long creepage photoelectric coupler, characterized in that: The bracket includes a first sub-bracket and a second sub-bracket, wherein The first sub-bracket comprises a plurality of columns of first frames, and both sides of each column of the first frames comprise a plurality of first pins arranged with equal spacing, and the first pins on the first side of both sides of each column of the first frames are arranged alternately with the first pins on the second side; two adjacent first pins on each side of each column of the first frames form a first base island for carrying a light source chip; The second sub-bracket comprises a plurality of columns of second frames, and both sides of each column of the second frames comprise a plurality of second pins arranged with equal spacing, the second pins on the first side of both sides of each column of the second frames are arranged alternately with the second pins on the second side, and the second pins on the same side of the second frame and the first frame correspond to the first pins; two adjacent second pins on each side of each column of the second frames form a second base island for carrying a light receptor chip; The first sub-bracket and the second sub-bracket are overlapped, the corresponding first pin and the second pin are overlapped, and the corresponding first base island and the second base island are overlapped to form a long creepage photoelectric coupler; The number of first pins included in the first side of the first frame is the same as the number of first pins included in the second side.

2. The bracket according to claim 1, characterized in that: The two columns of first frames at the edge of the first sub-bracket respectively include first pins facing one side of the center of the first sub-bracket.

3. The bracket according to claim 1, characterized in that: The first side and the second side of each column of the first frame and the second frame respectively include third pins for support.

4. A method for manufacturing a long creepage photoelectric coupler using the bracket according to any one of claims 1 to 3, characterized in that: include: S1: Paste the light source and the light receiver on the first base island and the second base island respectively, perform wire welding after pre-curing, weld the light source on the first sub-bracket, and weld the light receiver on the second sub-bracket; S3: stacking the first sub-bracket and the second sub-bracket, and using resin glue to plastic-encapsulate the light source and the light receiver to form a plurality of long creepage photoelectric couplers; S5: removing the resin glue from the first sub-bracket and the second sub-bracket and electroplating the first pin and the second pin; S7: cutting the bracket to separate the plurality of long creepage optoelectronic couplers from the bracket.

5. The method according to claim 4, characterized in that: The S3 further comprises: S31: using a first resin glue to encapsulate the light source and the light receiver to form an isolation medium serving as a light path for the light source and the light receiver; S33: using a second resin glue to perform secondary plastic sealing on the light source and the light receiver to form a plurality of long creepage photoelectric couplers.

6. The method according to claim 5, characterized in that: After S31 and before S33, the manufacturing method further includes: S32: Cut off the third pins supporting the first side and the second side of each column of the first frame and the second frame.

7. The method according to any one of claims 4 to 6, characterized in that: After S1 and before S3, the manufacturing method further includes: S2: using silica gel to solidify the light source on the first base island.

8. A long creepage photoelectric coupler, characterized in that: The long creepage optocoupler is manufactured by the manufacturing method described in any one of claims 4 to 7.

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