Organic light-emitting display devices

Abstract

The present invention discloses an organic light-emitting display device. The organic light-emitting display device comprises: a substrate including a display area and a non-display area; a thin film transistor located on the substrate in the display area; a planarization layer covering the thin film transistor; a first electrode located on the planarization layer in the display area, the first electrode being connected to the thin film transistor; a pixel defining layer covering the first electrode, the pixel defining layer comprising a first opening, the first opening exposing a portion of the first electrode to define an emission area; a first light shielding layer located on the pixel defining layer, the first light shielding layer comprising a photochromic material, the color of the first light shielding layer being reversibly changeable when exposed to ultraviolet light; an organic light-emitting layer located on the first electrode; and a second electrode located on the organic light-emitting layer.

Description

Technical Field

[0001] Embodiments relate to a display device, and more particularly, to an organic light emitting display device including a light shielding layer and a method of manufacturing the organic light emitting display device. Background Art

[0002] An organic light emitting display device may have an organic light emitting element including a hole injection layer, an electron injection layer, and an organic light emitting layer formed between the hole injection layer and the electron injection layer. In an organic light emitting display device, light may be generated as an exciton (which is a combination of holes injected from the hole injection layer and electrons injected from the electron injection layer) drops from an excited state to a ground state. An organic light emitting display device may omit a separate light source for generating light, and thus the organic light emitting display device may have a relatively small thickness and light weight as well as relatively low power consumption. In addition, an organic light emitting display device may have a relatively wide viewing angle, a high contrast ratio, a high response speed, and the like. Summary of the invention

[0003] An embodiment relates to an organic light-emitting display device, which includes: a substrate including a display area and a non-display area; a thin film transistor located on the substrate in the display area; a planarization layer covering the thin film transistor; a first electrode located on the planarization layer in the display area, the first electrode being connected to the thin film transistor; a pixel defining layer covering the first electrode, the pixel defining layer including a first opening, the first opening exposing a portion of the first electrode to define an emission area; a first light-shielding layer located on the pixel defining layer, the first light-shielding layer including a photochromic material, the color of the first light-shielding layer being reversibly changeable when exposed to ultraviolet light; an organic light-emitting layer located on the first electrode; and a second electrode located on the organic light-emitting layer.

[0004] The pixel defining layer and the first light shielding layer may be located on the substrate in both the display area and the non-display area.

[0005] The photochromic material may include at least one of spiropyran, spironaphthooxazine dyes, diarylethene derivatives, dihydropyridines, furanyl fulgide derivatives, and azobenzene derivatives.

[0006] The first light shielding layer may become opaque when exposed to ultraviolet light.

[0007] The first light shielding layer may include a second opening corresponding to the first opening.

[0008] The organic light emitting display device may further include an encapsulation member on the second electrode.

[0009] The organic light emitting display device may further include a second light shielding layer between the planarization layer and the pixel defining layer. The color of the second light shielding layer may be reversibly changeable when exposed to ultraviolet light.

[0010] The second light-shielding layer may include the same material as the first light-shielding layer.

[0011] The second light shielding layer may become opaque when exposed to ultraviolet light.

[0012] The organic light emitting display device may further include a spacer between the pixel defining layer and the first light shielding layer. The spacer may include a second opening having a width greater than a width of the first opening.

[0013] The first light shielding layer may include a third opening corresponding to the second opening.

[0014] An embodiment also relates to a method for manufacturing an organic light-emitting display device, the method comprising: preparing a substrate including a display area and a non-display area; forming a thin film transistor on the substrate in the display area; forming a planarization layer covering the thin film transistor on the substrate; forming a first electrode connected to the thin film transistor on the planarization layer in the display area; forming a pixel defining layer covering the first electrode and including a first opening on the planarization layer, the first opening exposing a portion of the first electrode to define an emission area; forming a first light-shielding layer including a photochromic material on the pixel defining layer, the color of the first light-shielding layer being reversibly changeable when exposed to ultraviolet light; forming an organic light-emitting layer on the first electrode; and forming a second electrode on the organic light-emitting layer.

[0015] A pixel defining layer and a first light shielding layer may be formed over the substrate in both the display area and the non-display area.

[0016] Forming a pixel defining layer and forming a first light shielding layer may include: sequentially forming a preliminary pixel defining layer and a preliminary first light shielding layer covering the first electrode on the planarization layer, and simultaneously forming a first opening of the pixel defining layer and a second opening of the first light shielding layer corresponding to the first opening by photolithography.

[0017] The pixel defining layer may include: forming a preliminary pixel defining layer covering the first electrode on the planarization layer; and forming a first opening of the pixel defining layer by photolithography. The first light shielding layer may include: forming the first light shielding layer to include a second opening corresponding to the first opening.

[0018] The method may further include forming a second light shielding layer between the planarization layer and the pixel defining layer, the color of the second light shielding layer being reversibly changeable when exposed to ultraviolet light.

[0019] Forming a planarization layer and forming a second light shielding layer may include: sequentially forming a planarization layer and a second light shielding layer on a substrate to cover the thin film transistor; and forming a contact hole exposing a portion of the thin film transistor in the planarization layer and in the second light shielding layer by photolithography.

[0020] The method may further include forming an encapsulation member on the second electrode.

[0021] The method may further include forming a spacer between the pixel defining layer and the first light shielding layer, the spacer having a width smaller than a width of the pixel defining layer.

[0022] Forming a pixel defining layer, forming an insulator, and forming a first light-shielding layer may include: sequentially forming a preliminary pixel defining layer and a preliminary first light-shielding layer covering the first electrode on a planarization layer; and simultaneously forming a first opening of the pixel defining layer, a second opening of the insulator, and a third opening of the first light-shielding layer by photolithography, the second opening having a width greater than that of the first opening, and the third opening corresponds to the second opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:

[0024] Figure 1 A plan view of an organic light emitting display device according to an embodiment is illustrated.

[0025] Figure 2 A cross-sectional view of an organic light emitting display device according to an embodiment is illustrated.

[0026] Figure 3A and Figure 3B Illustration of manufacturing Figure 2 sectional views of various stages of an exemplary method of manufacturing an organic light emitting display device.

[0027] Figure 4A , Figure 4B and Figure 4C Illustration of manufacturing Figure 2 sectional views of stages of another exemplary method of manufacturing an organic light emitting display device in FIG.

[0028] Figure 5 A cross-sectional view of an organic light emitting display device according to an embodiment is illustrated.

[0029] Fig. 6A and Figure 6B Illustration of manufacturing Figure 5 A cross-sectional view of various stages of a method for producing an organic light emitting display device.

[0030] Figure 7 A cross-sectional view of an organic light emitting display device according to an embodiment is illustrated.

[0031] Fig. 8A and Figure 8B Illustration of manufacturing Figure 7 A cross-sectional view of various stages of a method for producing an organic light emitting display device. DETAILED DESCRIPTION

[0032] Example embodiments will now be described more fully below with reference to the accompanying drawings, however, these embodiments may be embodied in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, these embodiments are provided to make this disclosure thorough and complete and to fully convey exemplary implementations to those skilled in the art.

[0033] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as being "on" another layer or substrate, it may be directly on the other layer or substrate, or there may be intervening layers. In addition, it will be understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intervening layers. Throughout the text, the same reference numerals refer to the same elements.

[0034] The following will refer to Figure 1 A planar structure of an organic light emitting display device according to an embodiment is described.

[0035] Figure 1 A plan view of an organic light emitting display device according to an embodiment is illustrated.

[0036] refer to Figure 1 , the organic light-emitting display device 100 according to the embodiment may include a display area DA and a non-display area NDA. A plurality of pixels may be arranged in the display area DA. The display area DA may display an image. The non-display area NDA may be located at least on one side of the display area DA. A driving circuit for applying a signal to the display area DA to display an image may be arranged in the non-display area NDA.

[0037] The display area DA may include a plurality of emission areas EA and non-emission areas NEA. Each of the emission areas EA may correspond to one of the pixels. The emission areas EA may be arranged in a matrix form. Each of the emission areas EA may include an organic light emitting element to emit light. The non-emission area NEA may surround the emission area EA. Light is not emitted from the non-emission area NEA.

[0038] The following will refer to Figure 2 A cross-sectional structure of an organic light emitting display device according to an embodiment is described.

[0039] Figure 2 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment. Figure 2 Can be along Figure 1 A cross-sectional view taken along line II' and line II-II'.

[0040] refer to Figure 2 , the organic light emitting display device 100 according to the embodiment may include a substrate 110, a buffer layer 111, a thin film transistor TFT, a gate insulating layer 112, an insulating interlayer 113, a planarization layer 114, an organic light emitting element OLED, a peripheral electrode 155, a pixel defining layer 131, a first light shielding layer 141 and an encapsulation member 160. The thin film transistor TFT may include an active pattern 121, a gate electrode 122, a source electrode 123 and a drain electrode 124. The organic light emitting element OLED may include a first electrode 151, an organic light emitting layer 152 and a second electrode 153.

[0041] The substrate 110 may include a display area DA and a non-display area NDA. The substrate 110 may be formed of glass, quartz, plastic, or the like.

[0042] The buffer layer 111 may be disposed on the substrate 110. The buffer layer 111 may prevent impurities from penetrating through the substrate 110. In addition, the buffer layer 111 may provide a planarized upper surface over the substrate 110. In some embodiments, the buffer layer 111 may be omitted.

[0043] The thin film transistor TFT may be disposed on the buffer layer 111 in the display area DA. The thin film transistor TFT may apply current to the organic light emitting element OLED. In some embodiments, the organic light emitting display device 100 may include a thin film transistor having a top gate structure. In some embodiments, the organic light emitting display device 100 may include a thin film transistor having a bottom gate structure.

[0044] The active pattern 121 may be disposed on the buffer layer 111. The active pattern 121 may include amorphous silicon, polycrystalline silicon, etc. In some embodiments, the active pattern 121 may include an oxide semiconductor.

[0045] The gate insulating layer 112 may be disposed on the buffer layer 111 and may cover the active pattern 121. The gate insulating layer 112 may insulate the gate electrode 122 from the active pattern 121. The gate insulating layer 112 may include silicon nitride (SiN x ), silicon oxide (SiO x )wait.

[0046] The gate electrode 122 may be disposed on the gate insulating layer 112. The gate electrode 122 may overlap the active pattern 121. As an example, the gate electrode 122 may include gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (Mo), or titanium (Ti).

[0047] An insulating interlayer 113 covering the gate electrode 122 may be disposed on the gate insulating layer 112. The insulating interlayer 113 may insulate the source electrode 123 and the drain electrode 124 from the gate electrode 122. The insulating interlayer 113 may include silicon nitride (SiN x ), silicon oxide (SiO x )wait.

[0048] The source electrode 123 and the drain electrode 124 may be disposed on the insulating interlayer 113. The source electrode 123 and the drain electrode 124 may contact the active pattern 121. For example, the source electrode 123 and the drain electrode 124 may contact the active pattern 121 through contact holes formed in the gate insulating layer 112 and the insulating interlayer 113, respectively. The source electrode 123 and the drain electrode 124 may include Au, Ag, Cu, Ni, Pt, Pd, Al, Mo, or Ti. For example, the source electrode 123 and the drain electrode 124 may be formed as a multilayer structure such as Mo / Al / Mo or Ti / Al / Ti.

[0049] The planarization layer 114 may be arranged on the insulating interlayer 113 and may cover the thin film transistor TFT. The planarization layer 114 may provide a planarized surface on the insulating interlayer 113 and the thin film transistor TFT. The planarization layer 114 may include a photosensitive organic material. For example, the planarization layer 114 may be formed of a photoresist, a polyacrylate resin, a polyimide resin, a siloxane resin, an acrylic resin, an epoxy resin, etc.

[0050] The organic light emitting element OLED may be arranged on the planarization layer 114 in the display area DA. The organic light emitting element OLED may emit light based on a current applied from the thin film transistor TFT. It is illustrated that the organic light emitting display device 100 according to the embodiment includes an organic light emitting element having a front emission structure. However, in some embodiments, the organic light emitting display device 100 may include an organic light emitting element having a back emission structure or a double-sided emission structure.

[0051] The first electrode 151 may be arranged on the planarization layer 114 in the display area DA. The first electrode 151 may be patterned for each pixel. The first electrode 151 may contact the drain electrode 124. For example, the first electrode 151 may contact the drain electrode 124 through a contact hole CH formed in the planarization layer 114. The first electrode 151 may be a reflective electrode. The first electrode 151 may include a reflective layer and a transmissive layer, the reflective layer being formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), etc., and the transmissive layer being formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3) etc. For example, the first electrode 151 may be formed in a multi-layer structure such as ITO / Ag / ITO.

[0052] The peripheral electrode 155 may be disposed on the planarization layer 114 in the non-display area NDA. The peripheral electrode 155 may be connected to one end of the second electrode 153 and may apply a common voltage to the second electrode 153. The peripheral electrode 155 may include a material substantially the same as that of the first electrode 151.

[0053] The pixel defining layer 131 may be disposed on the planarization layer 114 and may cover the first electrode 151 and the peripheral electrode 155. The pixel defining layer 131 may include a first opening OP1, which defines the emission area EA by exposing a portion of the first electrode 151. The pixel defining layer 131 may include a photosensitive organic material. For example, the pixel defining layer 131 may be formed of a photoresist, a polyacrylate resin, a polyimide resin, a siloxane resin, an acrylic resin, an epoxy resin, etc.

[0054] If external light is incident on the pixel defining layer 131 and / or the planarization layer 114, outgassing may be generated in the pixel defining layer 131 and / or the planarization layer 114. If the outgassing is transferred to the organic light emitting element OLED, there is a possibility that the organic light emitting element OLED may be degraded.

[0055] In order to prevent external light from being incident on the pixel defining layer 131 and / or on the planarization layer 114, a first light shielding layer 141 may be disposed on the pixel defining layer 131. The color of the first light shielding layer 141 may be reversibly changed by exposure to ultraviolet light.

[0056] The first light shielding layer 141 may include a photochromic material. The photochromic material may include an organic material such as spiropyran, spironaphthooxazine dye, diarylethene derivative, dihydropyridine, furanyl fulgide derivative, or azobenzene derivative.

[0057] The organic molecular structure of the photochromic material can be changed according to whether the ultraviolet (UV) light is absorbed. The color of the photochromic material can be changed according to the change of the organic molecular structure. Therefore, the transmittance of the first light shielding layer 141 including the photochromic material can be changed according to whether the ultraviolet light is incident on the photochromic material. When the ultraviolet light is not incident on the photochromic material, the first light shielding layer 141 can be transparent. When the ultraviolet light is incident on the photochromic material, the first light shielding layer 141 can have a black color and can become opaque. The first light shielding layer 141 can become opaque due to exposure to ultraviolet light on the area where the ultraviolet light is incident, and the opaque first light shielding layer 141 can prevent ultraviolet light from being incident on the pixel defining layer 131 and / or the planarization layer 114. In other words, UV light incident on a portion of the first light shielding layer 141 can make the entire first light shielding layer 141 opaque.

[0058] The first light shielding layer 141 may include a second opening OP2. The second opening OP2 of the first light shielding layer 141 may correspond to the first opening OP1 of the pixel defining layer 131. For example, the width of the second opening OP2 of the first light shielding layer 141 may be substantially equal to the width of the first opening OP1 of the pixel defining layer 131. When the first light shielding layer 141 includes the second opening OP2, light emitted from the organic light emitting layer 152 may be prevented from being blocked by the first light shielding layer 141.

[0059] The pixel defining layer 131 and the first light shielding layer 141 may be located on the substrate 110 in both the display area DA and the non-display area NDA. When the first light shielding layer 141 is located in the non-display area NDA as well as the display area DA, visibility of the organic light emitting display device 100 in an outdoor environment may be further improved, and degassing from the pixel defining layer 131 disposed in the non-display area NDA may be prevented.

[0060] The organic light emitting layer 152 may be disposed on the first electrode 151 . The organic light emitting layer 152 may be disposed inside the first opening OP1 of the pixel defining layer 131 .

[0061] The second electrode 153 may be disposed on the organic light emitting layer 152. The second electrode 153 may be provided in common for a plurality of pixels. The second electrode 153 may be a transmissive electrode. For example, the second electrode 153 may be formed of a metal, a metal alloy, a metal nitride, a transparent metal oxide, a transparent conductive material, etc.

[0062] A hole injection layer (HIL) and / or a hole transport layer (HTL) may be further disposed between the first electrode 151 and the organic light emitting layer 152. An electron transport layer (ETL) and / or an electron injection layer (EIL) may be further disposed between the organic light emitting layer 152 and the second electrode 153.

[0063] The encapsulation member 160 may be disposed on the second electrode 153. The encapsulation member 160 may encapsulate the organic light emitting element OLED, thereby preventing oxygen, moisture, etc. from penetrating into the organic light emitting element OLED from the outside. The encapsulation member 160 may include at least one inorganic layer and at least one organic layer. For example, the encapsulation member 160 may include a first inorganic layer, a second inorganic layer, and an organic layer disposed between the first inorganic layer and the second inorganic layer.

[0064] The following will refer to Figure 2 , Figure 3A and Figure 3B An example of a method of manufacturing an organic light emitting display device according to an embodiment is described.

[0065] Figure 3A and Figure 3B Illustration of manufacturing Figure 2 sectional views of various stages of an exemplary method of manufacturing an organic light emitting display device.

[0066] refer to Figure 3A , a substrate 110 including a display area DA and a non-display area NDA may be prepared, and a thin film transistor TFT, a planarization layer 114 and a first electrode 151 may be sequentially formed on the substrate 110 .

[0067] A buffer layer 111 may be formed on the substrate 110, and an active pattern 121 may be formed on the buffer layer 111 in the display area DA. A gate insulating layer 112 covering the active pattern 121 may be formed on the buffer layer 111, and a gate electrode 122 overlapping the active pattern 121 may be formed on the gate insulating layer 112. An insulating interlayer 113 covering the gate electrode 122 may be formed on the gate insulating layer 112, and contact holes respectively exposing opposite ends of the active pattern 121 may be formed in the gate insulating layer 112 and the insulating interlayer 113. A source electrode 123 and a drain electrode 124 respectively filling the contact holes may be formed on the insulating interlayer 113.

[0068] A planarization layer 114 covering the source electrode 123 and the drain electrode 124 may be formed on the insulating interlayer 113, and a contact hole CH exposing the drain electrode 124 may be formed in the planarization layer 114. A first electrode 151 filling the contact hole CH may be formed on the planarization layer 114 in the display area DA, and a peripheral electrode 155 may be formed on the planarization layer 114 in the non-display area NDA. The first electrode 151 and the peripheral electrode 155 may be formed substantially simultaneously.

[0069] A preliminary pixel defining layer 131' covering the first electrode 151 and the peripheral electrode 155 may be formed on the planarization layer 114. The preliminary pixel defining layer 131' may be formed of a photosensitive organic material.

[0070] The preliminary first light shielding layer 141' may be formed on the preliminary pixel defining layer 131'. The preliminary first light shielding layer 141' may be formed of a light-sensitive photochromic organic material.

[0071] refer to Figure 3A and Figure 3B , openings may be formed in the preliminary pixel defining layer 131 ′ and the preliminary first light shielding layer 141 ′ by photolithography.

[0072] First, a mask 181 may be arranged on the preliminary first light shielding layer 141'. The mask 181 may include a light shielding portion 181a and a light transmitting portion 181b. For example, the light transmittance of the light shielding portion 181a may be substantially 0%, and the light transmittance of the light transmitting portion 181b may be substantially 100%. The mask 181 may be arranged so that the light transmitting portion 181b corresponds to the first opening OP1 of the pixel defining layer 131 and the second opening OP2 of the first light shielding layer 141.

[0073] Then, light may be irradiated from the top of the mask 181 toward the preliminary first light shielding layer 141' to form the first opening OP1 of the pixel defining layer 131 and the second opening OP2 of the first light shielding layer 141. The first opening OP1 and the second opening OP2 may be formed substantially simultaneously. The first opening OP1 and the second opening OP2 may be formed simultaneously through a single photolithography process, so that the time and cost of manufacturing the organic light emitting display device may be reduced.

[0074] refer to Figure 2 , the organic light emitting layer 152 and the second electrode 153 may be sequentially formed on the first electrode 151 .

[0075] The organic light emitting layer 152 may be formed on the first electrode 151. The organic light emitting layer 152 may be formed inside the first opening OP1 of the pixel defining layer 131. The organic light emitting layer 152 may be deposited by a printing process such as nozzle printing, inkjet printing, etc. The second electrode 153 may be formed on the organic light emitting layer 152. The second electrode 153 may cover the organic light emitting layer 152 and the first light shielding layer 141.

[0076] The encapsulation member 160 may be formed on the second electrode 153 .

[0077] The following will refer to Figure 4A , Figure 4B and Figure 4C Another example of a method of manufacturing an organic light emitting display device according to an embodiment is described. Figure 2 , Figure 3A and Figure 3B The method of manufacturing an organic light emitting display device is described in a manner substantially the same as or similar to the reference Figure 4A , Figure 4B and Figure 4C Descriptions of various aspects of the method of manufacturing an organic light emitting display device will not be repeated.

[0078] Figure 4A , Figure 4B and Figure 4C Illustration of manufacturing Figure 2 sectional views of stages of another exemplary method of manufacturing an organic light emitting display device in FIG.

[0079] refer to Figure 4A A preliminary pixel defining layer 131' covering the first electrode 151 and the peripheral electrode 155 may be formed on the planarization layer 114. The preliminary pixel defining layer 131' may be formed of a photosensitive organic material.

[0080] refer to Figure 4A and Figure 4B , an opening may be formed in the preliminary pixel defining layer 131 ′ by photolithography.

[0081] First, a mask 182 may be arranged on the preliminary pixel defining layer 131'. The mask 182 may include a light shielding portion 182a and a light transmitting portion 182b. For example, the light transmittance of the light shielding portion 182a may be substantially 0%, and the light transmittance of the light transmitting portion 182b may be substantially 100%. The mask 182 may be arranged so that the light transmitting portion 182b corresponds to the first opening OP1 of the pixel defining layer 131.

[0082] Then, light may be irradiated from the top of the mask 182 toward the preliminary pixel defining layer 131 ′ to form the first opening OP1 in the pixel defining layer 131 .

[0083] refer to Figure 4C , the first light shielding layer 141 may be formed on the pixel defining layer 131. The first light shielding layer 141 may be deposited by a printing process such as nozzle printing, inkjet printing, etc. The first light shielding layer 141 may be selectively deposited on the pixel defining layer 131 so that the first light shielding layer 141 includes a second opening OP2 corresponding to the first opening OP1.

[0084] The following will refer to Figure 5 A cross-sectional structure of an organic light emitting display device according to an embodiment is described.

[0085] Figure 5 A cross-sectional view of an organic light emitting display device according to an embodiment is shown. Figure 5 Can be along Figure 1 A cross-sectional view taken along line II' and line II-II'.

[0086] refer to Figure 5, the organic light emitting display device 200 according to the embodiment may include a substrate 210, a buffer layer 211, a thin film transistor TFT, a gate insulating layer 212, an insulating interlayer 213, a planarization layer 214, a second light shielding layer 242, an organic light emitting element OLED, a peripheral electrode 255, a pixel defining layer 231, a first light shielding layer 241 and an encapsulation member 260. The thin film transistor TFT may include an active pattern 221, a gate electrode 222, a source electrode 223 and a drain electrode 224. The organic light emitting element OLED may include a first electrode 251, an organic light emitting layer 252 and a second electrode 253.

[0087] According to Figure 2 The description of the organic light emitting display device 100 of the embodiment shown is substantially the same or similar to that of Figure 5 Description of the elements of the organic light emitting display device 200 of the illustrated embodiment will not be repeated.

[0088] The second light shielding layer 242 may be disposed between the planarization layer 214 and the pixel defining layer 231. The color of the second light shielding layer 242 may be reversibly changed by exposure to ultraviolet light.

[0089] The second light shielding layer 242 may include a photochromic material. The second light shielding layer 242 may include a material substantially the same as that of the first light shielding layer 241 .

[0090] The organic molecular structure of the photochromic material can be changed according to whether the ultraviolet light is absorbed. The color of the photochromic material can be changed according to the change of the organic molecular structure. Therefore, the transmittance of the second light shielding layer 242 including the photochromic material can be changed according to whether the ultraviolet light is incident thereon. When the ultraviolet light is not incident thereon, the second light shielding layer 242 can be transparent. When the ultraviolet light is incident thereon, the second light shielding layer 242 can have a black color and can be opaque. In other words, the second light shielding layer 242 can become opaque on the area where the ultraviolet light is incident due to exposure to the ultraviolet light, and the opaque second light shielding layer 242 can prevent the ultraviolet light from being incident on the planarization layer 214.

[0091] The following will refer to Fig. 6A and Figure 6B A method for manufacturing an organic light emitting display device according to an embodiment is described. Figure 2 , Figure 3A and Figure 3B The details of the method of manufacturing an organic light emitting display device are described in substantially the same or similar reference Fig. 6A and Figure 6B A detailed description of the method of manufacturing an organic light emitting display device will not be repeated.

[0092] Fig. 6A and Figure 6BIllustration depicting manufacturing Figure 5 A cross-sectional view of various stages of a method for producing an organic light emitting display device.

[0093] refer to Fig. 6A First, a planarization layer 214 covering the source electrode 223 and the drain electrode 224 may be formed on the insulating interlayer 213. The planarization layer 214 may be formed of a photosensitive organic material.

[0094] Then, a second light shielding layer 242 may be deposited on the planarization layer 214. The second light shielding layer 242 may be formed of a light-sensitive photochromic organic material.

[0095] refer to Fig. 6A and Figure 6B , the contact hole CH may be formed in the planarization layer 214 and the second light shielding layer 242 by photolithography.

[0096] First, a mask 283 may be arranged on the second light shielding layer 242. The mask 283 may include a light shielding portion 283a and a light transmitting portion 283b. For example, the light transmittance of the light shielding portion 283a may be substantially 0%, and the light transmittance of the light transmitting portion 283b may be substantially 100%. The mask 283 may be arranged so that the light transmitting portion 283b corresponds to the contact hole CH.

[0097] Then, light may be irradiated from the top of the mask 283 toward the second light shielding layer 242 to form a contact hole CH in the planarization layer 214 and the second light shielding layer 242. The contact hole CH may be formed in the planarization layer 214 and the second light shielding layer 242 through a single photolithography process, so that the time and cost of manufacturing the organic light emitting display device may be reduced.

[0098] The following will refer to Figure 7 A cross-sectional structure of an organic light emitting display device according to an embodiment is described.

[0099] Figure 7 A cross-sectional view of an organic light emitting display device according to an embodiment is shown. Figure 7 Can be along Figure 1 A cross-sectional view taken along line II' and line II-II'.

[0100] refer to Figure 7, the organic light emitting display device 300 according to the embodiment may include a substrate 310, a buffer layer 311, a thin film transistor TFT, a gate insulating layer 312, an insulating interlayer 313, a planarization layer 314, an organic light emitting element OLED, a peripheral electrode 355, a pixel defining layer 331, a spacer 332, a first light shielding layer 341 and an encapsulation member 360. The thin film transistor TFT may include an active pattern 321, a gate electrode 322, a source electrode 323 and a drain electrode 324. The organic light emitting element OLED may include a first electrode 351, an organic light emitting layer 352 and a second electrode 353.

[0101] According to Figure 2 The description of the organic light emitting display device 100 of the embodiment shown is substantially the same or similar to that of Figure 7 Descriptions of various aspects of the organic light emitting display device 300 of the illustrated embodiment will not be repeated.

[0102] The spacer 332 may be disposed between the pixel defining layer 331 and the first light shielding layer 341. The width of the spacer 332 may be smaller than the width of the pixel defining layer 331. The spacer 332 may be formed together with the pixel defining layer 331.

[0103] The spacer 332 may include a second opening OP2 . The width of the second opening OP2 of the spacer 332 may be greater than the width of the first opening OP1 of the pixel defining layer 331 .

[0104] The first light shielding layer 341 may include a third opening OP3. The third opening OP3 of the first light shielding layer 341 may correspond to the second opening OP2 of the spacer 332. For example, the width of the third opening OP3 of the first light shielding layer 341 may be substantially equal to the width of the second opening OP2 of the spacer 332. When the first light shielding layer 341 includes the third opening OP3, light emitted from the organic light emitting layer 352 may not be blocked by the first light shielding layer 341.

[0105] The following will refer to Fig. 8A and Figure 8B A method for manufacturing an organic light emitting display device according to an embodiment is described. Figure 2 , Figure 3A and Figure 3B The details of the method for manufacturing an organic light emitting display device are basically the same or similar to Fig. 8A and Figure 8B A detailed description of the illustrated method of manufacturing the organic light emitting display device will not be repeated.

[0106] Fig. 8A and Figure 8B Illustration depicting manufacturing Figure 7 A cross-sectional view of various stages of a method for producing an organic light emitting display device.

[0107] refer to Fig. 8A and Figure 8B , openings may be formed in the preliminary pixel defining layer 331 ′ and the preliminary first light shielding layer 341 ′ by photolithography.

[0108] First, a mask 381 may be arranged on the preliminary first light shielding layer 341'. The mask 381 may include a light shielding portion 381a, a light transmitting portion 381b, and a semi-transmissive portion 381c. For example, the transmittance of the light shielding portion 381a may be substantially 0%, the transmittance of the light transmitting portion 381b may be substantially 100%, and the transmittance of the semi-transmissive portion 381c may be from about 0% to about 100%. The mask 381 may be arranged so that the light transmitting portion 381b corresponds to the first opening OP1 of the pixel defining layer 331, and the light transmitting portion 381b and the semi-transmissive portion 381c correspond to the second opening OP2 of the spacer 332 and the third opening OP3 of the first light shielding layer 341.

[0109] Then, light can be irradiated from the top of the mask 381 toward the preliminary first light shielding layer 341' to form the first opening OP1 of the pixel defining layer 331, the second opening OP2 of the spacer 332, and the third opening OP3 of the first light shielding layer 341. The first opening OP1, the second opening OP2, and the third opening OP3 can be formed substantially at the same time. The first opening OP1, the second opening OP2, and the third opening OP3 can be formed simultaneously through a single photolithography process, so that the time and cost of manufacturing the organic light emitting display device can be reduced.

[0110] The organic light emitting display device according to the embodiment may be applied to a display device included in a computer, a notebook, a mobile phone, a smart phone, a smart tablet, a PMP, a PDA, an MP3 player, and the like.

[0111] By summarizing and reviewing, when the intensity of external light is strong, the external light may be reflected by the organic light-emitting display device, and the image displayed by the organic light-emitting display device may not be clearly observed. In order to prevent the reflection of external light, a polarizer, a black matrix, etc. may be arranged in the organic light-emitting display device. However, these components may increase the thickness of the organic light-emitting display device.

[0112] Furthermore, when external light is incident on the organic light emitting display device, outgassing may be discharged from the organic insulating layer of the organic light emitting display device due to a reaction promoted by the external light, and pixels of the organic light emitting display device may be degraded due to the influence of the outgassing.

[0113] Embodiments provide an organic light-emitting display device including a light-shielding layer. The light-shielding layer may be arranged on a pixel-defining layer and may include a photochromic material. The color of the light-shielding layer may be reversibly changed by exposure to ultraviolet light. Therefore, visibility in an outdoor environment may be improved, and external light causing degassing from the pixel-defining layer may be blocked.

[0114] The embodiment provides a method for manufacturing an organic light-emitting display device. In the method for manufacturing an organic light-emitting display device according to the embodiment, a pixel defining layer and a light shielding layer can be formed substantially at the same time. Therefore, the time and cost of manufacturing the organic light-emitting display device can be reduced.

[0115] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some cases, as will be apparent to one of ordinary skill in the art at the time of filing this application, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless expressly stated otherwise. Therefore, it should be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope set forth in the appended claims.

Claims

1. An organic light emitting display device, comprising: A substrate including a display area and a non-display area; a thin film transistor on the substrate in the display area; a planarization layer covering the thin film transistor; a first electrode located on the planarization layer in the display area, the first electrode being connected to the thin film transistor; a pixel defining layer covering the first electrode, the pixel defining layer comprising a first opening, the first opening exposing a portion of the first electrode to define an emission area; a first light shielding layer located on the pixel defining layer, the first light shielding layer comprising a photochromic material, the color of the first light shielding layer being reversibly changeable when exposed to ultraviolet light, and the first light shielding layer comprising a second opening corresponding to the first opening; an organic light-emitting layer located on the first electrode; as well as a second electrode located on the organic light emitting layer and the first light shielding layer, Wherein, the first light shielding layer becomes opaque when exposed to ultraviolet light.

2. The organic light emitting display device according to claim 1, wherein: The pixel defining layer and the first light shielding layer are located on the substrate in both the display area and the non-display area.

3. The organic light emitting display device according to claim 1, wherein: The photochromic material includes at least one of spiropyran, spironaphthooxazine dyes, diarylethene derivatives, dihydropyridines, furanyl fulgide derivatives and azobenzene derivatives.

4. The organic light emitting display device according to claim 1, further comprising: A second light shielding layer is located between the planarization layer and the pixel defining layer, and the color of the second light shielding layer can be reversibly changed when exposed to ultraviolet light.

5. The organic light emitting display device according to claim 4, wherein: The second light-shielding layer includes the same material as the first light-shielding layer.

6. The organic light emitting display device according to claim 4, wherein: The second light shielding layer becomes opaque when exposed to ultraviolet light.

7. The organic light emitting display device according to claim 1, further comprising: A spacer is located between the pixel defining layer and the first light shielding layer, the spacer includes a third opening, and the third opening has a width greater than a width of the first opening.

8. The organic light emitting display device according to claim 7, wherein: The second opening of the first light shielding layer corresponds to the third opening of the spacer.

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