A cooling and heating module for pet living and a pet nest with the cooling and heating module

Abstract

The present invention relates to a pet living heating and cooling module, which comprises a metal plate, an energy storage component, a semiconductor cooling sheet and a heat dissipation component, wherein the energy storage component and the heat dissipation component are respectively arranged on the upper and lower surfaces of the semiconductor cooling sheet, the metal plate is arranged on the upper surface of the energy storage component, and a heat insulation space is also arranged between the energy storage component and the metal plate. The plate surface of the metal plate is heated or cooled more evenly. The present invention also relates to a pet nest with a heating and cooling module, which comprises a pet living heating and cooling module and an accessory mechanism, wherein the accessory mechanism comprises a shelf, and an embedding groove II is arranged on the shelf. The accessory mechanism can well place the heating and cooling module.

Description

Technical Field

[0001] The invention relates to a cooling and heating module for pet living and a pet nest with the cooling and heating module. Background Art

[0002] As people's living standards improve, more and more people keep pets. There is also a growing market for products made around pets, such as pet beds or pet houses.

[0003] In the prior art, semiconductor cooling sheets are used in pet products to improve the pet environment. A semiconductor cooling sheet is a cooling device composed of semiconductors. When current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends. Heat is transferred from one end to the other end, thereby generating a temperature difference to form a hot and cold end. And the hot and cold ends can be reversed by switching the direction of the current.

[0004] The Chinese patent document with authorization announcement number "CN2785349Y" discloses an "automatic constant temperature pet bed", and the Chinese patent document with authorization announcement number "CN2458867Y" discloses a "semiconductor hot and cold pet bed". The solutions of these two patent documents are to heat or cool the mattress through semiconductor refrigeration sheets. However, they have a common defect: the middle of the metal plate is overheated or overcooled. This is because the semiconductor refrigeration sheet and the energy storage aluminum block are heat-conducted, and the energy storage aluminum block is attached to the middle position below the metal plate. Therefore, the middle position of the metal plate will be heated or cooled faster than the peripheral position of the metal plate. This can easily harm pets, and in severe cases, burns or frostbite may occur. Summary of the invention

[0005] The object of the present invention is to provide a pet living heating and cooling module, which can make the heating or cooling of the metal plate more uniform.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] The present invention provides a heating and cooling module for pet living, which includes a metal plate, an energy storage component, a semiconductor refrigeration sheet and a heat dissipation component. The energy storage component and the heat dissipation component are respectively arranged on the upper and lower surfaces of the semiconductor refrigeration sheet, the metal plate is arranged on the upper surface of the energy storage component, and an insulating space is also arranged between the energy storage component and the metal plate.

[0008] Optimally, the heat-insulating space is a depression formed on the surface of the energy storage component or the metal plate.

[0009] Optimally, the heat-insulating space is located approximately at the horizontal center of the energy storage component.

[0010] Optimally, an embedding groove I is provided on the energy storage component, and the semiconductor refrigeration plate is tightly attached to the embedding groove I.

[0011] Optimally, a soft heat-conducting member is further provided between the energy storage member and the metal plate.

[0012] Furthermore, the soft heat-conducting component is thermally conductive silicone grease or high-purity gold, silver, copper, or aluminum.

[0013] Optimally, it further comprises a temperature controller, which comprises a temperature sensor arranged near the metal plate, and the wiring terminals of the semiconductor cooling sheet are connected to the temperature controller.

[0014] Optimally, it also includes a rectifier, which converts a high voltage power supply into a low voltage power supply, and the output end of the rectifier is connected to the semiconductor cooling plate.

[0015] Optimally, the heat dissipation assembly includes heat dissipation fins and a wind mechanism connected to the heat dissipation fins.

[0016] Optimally, the exposed lower surface of the energy storage component or the exposed lower surface of the metal plate is also provided with a heat insulation layer.

[0017] Optimally, a connecting piece for fixing the metal plate is welded on the metal plate.

[0018] Furthermore, before being welded to the surface of the metal plate, the welding surface of the connecting piece is integrally provided with solder protruding from the welding surface.

[0019] Furthermore, the thickness of the solder is 0.8-1.2 mm.

[0020] Furthermore, a through hole is provided on the energy storage component, and a diameter of the through hole is larger than a maximum outer diameter of the connecting component.

[0021] Optimally, it also includes a protective shell, which includes a first plug-in box and a second plug-in box that are detachably combined together, the first plug-in box and the second plug-in box respectively have a first plate and a second plate inserted into the gap between the energy storage component and the heat dissipation assembly, and a joint between the first plate and the second plate is formed with an embedding groove III for accommodating the semiconductor refrigeration plate.

[0022] Furthermore, the protective shell is provided with an air inlet and an air outlet.

[0023] Furthermore, the shape of the embedding groove III matches the shape of the semiconductor cooling plate.

[0024] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0025] In the pet living heating and cooling module of the present invention, since an insulating space is provided between the energy storage component and the metal plate, the heat generated by the semiconductor refrigeration sheet during heating will bypass the insulating space and be distributed to the edge of the energy storage component, and the metal plate portion corresponding to the insulating space (usually the middle portion) will not be heated too quickly, so that the temperature rises more evenly at different positions on the metal plate. Conversely, during cooling, the position on the metal plate corresponding to the insulating space will not be cooled too quickly, so that the temperature drops more evenly at different positions on the metal plate. It will not cause burns or frostbite to pets, and is safer and more reliable.

[0026] Another object of the present invention is to provide a pet bed with a cooling and heating module.

[0027] In order to achieve the above object, the technical solution adopted by the present invention is:

[0028] The present invention provides a pet bed with a cooling and heating module, which comprises:

[0029] A cooling and heating module, the cooling and heating module comprising a metal plate, an energy storage component, a semiconductor cooling sheet and a heat dissipation component, the energy storage component and the heat dissipation component are respectively arranged on the upper and lower surfaces of the semiconductor cooling sheet, the metal plate is arranged on the upper surface of the energy storage component, and a heat insulation space is also arranged between the energy storage component and the metal plate;

[0030] The accessory mechanism comprises a shelf, on which a sink for embedding the metal plate is arranged.

[0031] Optimally, the periphery of the sink matches the periphery of the metal plate.

[0032] Optimally, the shelf is also provided with an embedding groove II for embedding the energy storage component.

[0033] Furthermore, the periphery of the embedding groove II matches the periphery of the energy storage component.

[0034] Optimally, a mounting hole for fixing the metal plate is provided on the bottom surface of the sink.

[0035] Optimally, the accessory mechanism further includes a receiving box for storing electric wires.

[0036] Optimally, it also includes a nest frame, in which an insertion slot or a placement frame is provided, and the cooling and heating module and the accessory mechanism can be integrally inserted into the insertion slot or placed in the placement frame.

[0037] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0038] The pet bed with a cooling and heating module of the present invention, because it has the aforementioned cooling and heating module for pet living, can make the metal plate surface heat up or cool down more evenly, will not cause burns or frostbite to the pet, and is safer and more reliable. In addition, because the accessory mechanism of the present invention has a shelf, the metal plate can be placed on the shelf, and the embedded groove II on the shelf can allow the energy storage component, the semiconductor refrigeration sheet and the heat dissipation component to be embedded, so the cooling and heating module can be well placed, and a good cooling and heating environment can be provided for the pet through the cooling and heating module. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0040] Figure 1 Schematic diagram of the disassembly of the pet living cooling and heating module according to the present invention in Example 1;

[0041] Figure 2 middle Figure 1 AA cross-sectional view of the energy storage component;

[0042] Figure 3 yes Figure 1 Center section view of the pet living cooling and heating module (without insulation layer);

[0043] Figure 4 It is another technical solution, in which the heat insulation space is arranged on a metal plate;

[0044] Figure 5 is another technical solution, in which the heat insulation space is provided on both the metal plate and the energy storage member;

[0045] Figure 6 yes Figure 1 Schematic diagram of the structure of the lower surface of the middle metal plate;

[0046] Figure 7 yes Figure 6 Enlarged schematic diagram of the middle connecting piece;

[0047] Figure 8 yes Figure 7 Front view of the connector;

[0048] Fig. 9 This is a schematic diagram of the pet nest frame disassembly in Example 2;

[0049] Fig.10 yes Fig. 9 Schematic diagram of the nest frame structure combined together;

[0050] Fig.11is a schematic diagram of the structure of the attachment mechanism in Example 2;

[0051] Fig.12 is a schematic diagram of the combination of the attachment mechanism and the nest frame in Example 2;

[0052] Fig.13 This is a schematic diagram of the pet nest frame disassembly in Example 3;

[0053] Fig.14 Schematic diagram of the combination of the accessory mechanism and the nest frame of Example 3;

[0054] Fig.15 It is a partial schematic diagram of the embodiment 3 in which the accessory mechanism is not inserted into the nest frame;

[0055] Fig.16 is a partial schematic diagram of the accessory mechanism being inserted into the nest frame of Example 3;

[0056] Fig.17 is a schematic diagram of the attachment mechanism structure in Example 3;

[0057] Fig.18 is another angle view of the attachment mechanism in Example 3;

[0058] Fig.19 This is a schematic diagram of the protective shell installation;

[0059] Fig. 20 This is the disassembly diagram of the protective case;

[0060] Fig.21 This is a schematic diagram of the appearance after the protective shell is installed;

[0061] Fig. 22 yes Fig.21 Middle AA section view;

[0062] Fig.23 is Example 4, showing a cat pet bed;

[0063] The reference numerals are described as follows:

[0064] 100, cooling and heating module; 101, metal plate; 102, energy storage component; 103, semiconductor refrigeration sheet; 104, heat dissipation component; 105, heat insulation space; 106, embedded groove I; 107, soft heat conductive component; 108, heat dissipation fin; 109, wind mechanism; 1091, stabilizing plate; 1092, stabilizing groove; 110, heat insulation layer; 111, connecting piece; 112, solder; 113, through hole; 114, flange; 115, internal thread column; 116, protective shell; 1161, first plug-in box; 11611, first plate; 1162, second plug-in box; 11621, second plate; 11622, convex rib; 1163, embedded groove III; 1164, air inlet; 1165, air outlet;

[0065] 200, accessory mechanism; 201, shelf; 202, embedded groove II; 203, sink; 204, mounting hole; 205, storage box; 206, card slot; 207, handle;

[0066] 300, bed frame; 301, insertion slot; 302, placement frame; 303, bed board; 304, support board. DETAILED DESCRIPTION

[0067] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0068] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0069] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0070] Example 1

[0071] like Figure 1 as well as Figure 3 As shown, the pet daily living heating and cooling module 100 includes a metal plate 101, an energy storage component 102, a semiconductor cooling sheet 103 and a heat dissipation component 104 which are arranged in sequence from top to bottom.

[0072] The metal plate 101 is arranged at the top. The upper surface of the metal plate 101 is flat and can be used to lay a mattress. The energy storage member 102 is mainly used to transfer heat between the metal plate 101 and the upper surface of the semiconductor cooling sheet 103. The heat dissipation component 104 mainly takes away the hot air or cold air on the other surface of the semiconductor cooling sheet 103 to maintain the heating or cooling efficiency of the semiconductor cooling sheet 103.

[0073] Take the example of heating a metal plate.

[0074] After the semiconductor refrigeration sheet 103 is connected to the power supply and powered on, the upper surface of the semiconductor refrigeration sheet 103 heats up and generates heat, while the lower surface cools down and generates heat. The heat on the upper surface of the semiconductor refrigeration sheet 103 is transferred to the energy storage component 102 that is in direct contact with it. The energy storage component 102 is made of aluminum and can store and conduct heat. The energy storage component 102 conducts the heat on the upper surface of the semiconductor refrigeration sheet 103 to the metal plate 101. The metal plate 101 heats up and heats up, which can heat the mattress laid on the upper surface of the metal plate 101 and provide a sitting space with a suitable temperature for the pet. This is suitable for cold seasons. Conversely, the two wires connecting the semiconductor refrigeration sheet 103 to the power supply can be swapped to cool the upper surface of the semiconductor refrigeration sheet 103, thereby reducing the temperature of the metal plate 101, which is suitable for hot seasons.

[0075] The lower surface of the semiconductor cooling sheet 103 is closely attached with a heat dissipation fin 108, which is made of aluminum alloy. A wind mechanism 109 is installed on the lower surface of the heat dissipation fin 108 by screws. The wind mechanism 109 can be a small fan that can generate wind to take away the hot air and cold air generated by the lower surface of the semiconductor cooling sheet 103, so as to ensure better heating and cooling performance of the semiconductor cooling sheet 103.

[0076] like Figure 1 , the energy storage element 102 is a roughly rectangular aluminum plate. Figure 1 and Figure 2 The center of the upper surface of the energy storage element 102 is sunken downward to form a heat insulation space 105. The center of the lower surface of the energy storage element 102 is sunken upward to form an embedding groove I 106, which is used to position the semiconductor cooling plate 103.

[0077] like Figure 2 , the energy storage component 102 is made by stamping, which can ensure the flatness of the bottom surface of the embedding groove Ⅰ106. The semiconductor cooling sheet 103 is tightly attached to the bottom surface of the embedding groove Ⅰ106. If the bottom surface of the embedding groove Ⅰ106 is uneven, it is easy to cause the semiconductor cooling sheet 103 to crack and fail after a period of use. The energy storage component 102 is stamped, and the bottom surface in the embedding groove Ⅰ106 can have good flatness. The semiconductor cooling sheet 103 can be flat and tightly attached to the bottom surface of the embedding groove Ⅰ106, and it is not easy to cause stress cracks and failure in the semiconductor cooling sheet 103, which increases the service life of the pet living heating and cooling module. In addition, the stamping method is economical and can control production costs.

[0078] When the thickness of the energy storage element 102 is 4 mm to 10 mm, a good balance can be achieved between heat storage performance and lightness and thinness.

[0079] like Figure 3Due to the setting of the heat-insulating space 105, when the energy storage component 102 transfers heat to the metal plate 101, it is mainly the energy storage component 102 part around the heat-insulating space 105 that heats the metal plate 101. The heated air in the heat-insulating space 105 only has a slight heating effect on the metal plate 101.

[0080] like Figure 3 The semiconductor cooling sheet 103 is often arranged at the center of the lower surface of the energy storage component 102, so that the center of the energy storage component 102 will be heated faster. If the heat insulation space 105 is not provided, the center of the energy storage component 102 will quickly transfer heat to the center of the metal plate 101 above, causing the center of the metal plate 101 to overheat, while the peripheral position of the metal plate 101 is not heated, resulting in uneven temperature distribution on the surface of the metal plate 101. In severe cases, it may cause burns to the pet, and frostbite may occur when the metal plate 101 is cooled.

[0081] The heat-insulating space 105 is set at the horizontal center position of the energy storage component 102. The heat-insulating space 105 blocks the center position of the energy storage component 102 from heating the metal plate 101, so that the heat is transferred to the surrounding parts of the energy storage component 102 to heat the metal plate 101, so that the center position of the metal plate 101 will not be overheated, the plate surface temperature of the metal plate 101 is more uniform, and the center position will not be overheated or overcooled, thereby ensuring safety.

[0082] In this embodiment, the heat insulation space 105 is provided on the energy storage member 102 and is made by stamping, which has the advantage of being easy to process. Figure 4 and Figure 5 As shown, the heat-insulating space 105 may also be provided only on the metal plate 101 or on both the metal plate 101 and the energy storage component 102 .

[0083] like Figure 1 and Figure 3 In addition to the heat insulating space 105, a soft heat conductive member 107 is provided between the metal plate 101 and the energy storage member 102. The soft heat conductive member 107 can be thermal conductive silicone grease or high-purity gold, silver, copper, or aluminum. The function of the soft heat conductive member 107 is to make the heat conduction between the metal plate 101 and the energy storage member 102 faster. In this embodiment, the soft heat conductive member 107 is made of thermal conductive silicone grease. When the metal plate 101 and the energy storage member 102 are attached together, the thermal conductive silicone grease can be applied to the position of the metal plate 101 corresponding to the energy storage member 102, and then the energy storage member 102 can be attached to the surface of the metal plate 101, so the processing is very convenient.

[0084] The exposed lower surface of the energy storage component 102 or the exposed lower surface of the metal plate 101 is also provided with a heat insulation layer 110. The heat insulation layer 110 is heat insulation cotton, which is attached to the energy storage component 102 or the metal plate 101 by glue. The provision of the heat insulation layer 110 can reduce heat loss and reduce the energy consumption of the cooling and heating module.

[0085] like Figure 6 , shows the lower surface of the metal plate 101, and a plurality of connectors 111 are welded to the lower surface of the metal plate 101. The connectors 111 can be used for connection, such as fixing the cooling and heating module 100 to other components with bolts.

[0086] Figure 7 This is an enlarged view of the connecting member 111. Figure 8 yes Figure 7 Front view of the middle connector 111, the connector 111 includes an internal thread column 115 and a flange 114, and one side surface of the flange 114 is a welding surface 114a. Before welding, a solder 112 protruding from the welding surface is provided on the welding surface 114a. The solder 112 is a part of the connector 111, which is integrated with the thread column 115 and the flange 114, and is made of the same aluminum material as the other parts. The periphery of the solder 112 is a certain distance away from the periphery of the flange 114. Through electric melting spot welding, the solder 112 melts and adheres to the lower surface of the metal plate 101, so that the connector 111 is fixed on the metal plate 101. Since there is a certain amount of extrusion during spot welding, the solder 112 has a certain extension when it melts, but since the periphery of the solder 112 is a certain distance away from the periphery of the flange 114, the solder 112 will not exceed the periphery of the flange 114 when it extends. When the thickness of the solder 112 is set to 0.8-1.2 mm, a good welding effect is achieved, the welding is firm and the appearance is beautiful. In this embodiment, the solder 112 is a cylinder with a thickness of 1 mm and a diameter of 8 mm; the diameter of the flange 114 is 12 mm.

[0087] By welding, a flat metal plate 101 can be made first, and then the connector 111 can be welded on the metal plate 101. Compared with the method of opening a threaded hole or opening a through hole on the metal plate 101 and then setting a threaded bolt, the method of welding the connector 111 makes processing easier, can save costs, and has a more beautiful appearance.

[0088] like Figure 1 The energy storage component 102, the soft heat conductive component 107 and the heat insulating layer 110 are provided with corresponding holes for the connecting component 111 to pass through. The holes provided on the soft heat conductive component 107 and the heat insulating layer 110 are mainly for the connecting component 111 to pass through. The through hole 113 provided on the energy storage component 102 is mainly for the connecting component 111 to pass through and then fix the energy storage component 102 to the metal plate 101 by bolts.

[0089] like Figures 19 to 22As shown, there is a protective shell 116 wrapped around the periphery of the heat dissipation component 104. The protective shell 116 includes a first plug-in box 1161 and a second plug-in box 1162 that are detachably combined together. The first plug-in box 1161 and the second plug-in box 1162 respectively have a first plate 11611 and a second plate 11621 inserted into the gap between the energy storage component 102 and the heat dissipation component 104. The first plug-in box 1161 and the second plug-in box 1162 move toward each other on both sides of the heat dissipation component 104 so that the first plate 11611 and the second plate 11621 are inserted into the gap between the energy storage component 102 and the heat dissipation component 104. An embedding groove III 1163 for accommodating the semiconductor cooling sheet 103 is formed at the junction of the first plate 11611 and the second plate 11621. The semiconductor cooling sheet 103 is clamped in the embedding groove III 1163. And the shape of the embedding groove III 1163 matches the shape of the semiconductor cooling sheet 103.

[0090] The first plate 11611 and the second plate 11621 isolate the energy storage element 102 from the heat dissipation assembly 104 to reduce the heat generated by the energy storage element 102 being taken away by the heat dissipation assembly 104, thereby reducing energy consumption.

[0091] The protective shell 116 has an air inlet 1164 and an air outlet 1165. The air inlet 1164 is a sieve hole formed on the surface of the protective shell 116, and the air outlet 1165 is a circular hole formed on the surface of the protective shell 116, which is formed by splicing one side surface of the first plug-in box 1161 and the second plug-in box 1162. The air outlet 1165 is adjacent to the air outlet end of the wind mechanism 109.

[0092] like Fig. 20 and Fig. 22 The edge of the wind mechanism 109 is also provided with a stabilizing plate 1091, and a stabilizing groove 1092 is provided on the stabilizing plate 1091. The inner side of the second plug-in box 1162 is also provided with a convex rib 11622 that is engaged with the stabilizing groove 1092. When the first plug-in box 1161 and the second plug-in box 1162 are combined together, the convex rib 11622 and the stabilizing groove 1092 are engaged together, so that the first plug-in box 1161 and the second plug-in box 1162 are more stable and will not be misaligned due to the vibration of the wind mechanism 109. The first plug-in box 1161 and the second plug-in box 1162 are fastened by bolts, which are easy to disassemble and assemble.

[0093] In this embodiment, the protective shell 116 can surround the heat dissipation component 104 to protect the heat dissipation component 104 from damage, and can also isolate the heat dissipation component 104 from the energy storage component 102 to block heat transfer between the heat dissipation component 104 and the energy storage component 102, thereby reducing energy consumption.

[0094] In this embodiment, the heating and cooling module 100 further includes a rectifier (not shown), the semiconductor cooling sheet 103 is connected to the rectifier, and the rectifier converts 220V AC power into 12V DC power. The rectifier converts high voltage power into low voltage power, so that even if the pet bites the wires in the heating and cooling module 100, it will not cause an accident, and it is safer.

[0095] In this embodiment, the cooling and heating module 100 further includes a thermostat, and the wiring terminal of the semiconductor cooling sheet 103 is connected to the thermostat. The thermostat includes a temperature sensor, and the temperature sensor is arranged near the metal plate 101. A preset temperature can be set in the thermostat. When the temperature sensor detects that the temperature of the metal plate 101 is higher than the preset temperature, the thermostat cuts off the power supply. A positive and negative switching key can also be provided in the thermostat, which can switch the two wires of the semiconductor cooling sheet 103 between the positive and negative poles of the power supply, so that the semiconductor cooling sheet 103 switches between cooling and heating on the upper surface.

[0096] Example 2

[0097] like Fig.12 The pet bed shown is a pet bed (no heating and cooling module and mattress have been installed yet). It includes an accessory mechanism 200 and a bed frame 300. The accessory mechanism 200 is used to install the heating and cooling module, and the bed frame 300 is used to combine with the accessory mechanism 200 and the heating and cooling module to form a pet bed, that is, a pet bed in this example. The heating and cooling module can use the heating and cooling module 100 in Example 1.

[0098] like Fig.10 The nest frame 300 shown in the figure includes a placement frame 302 and four bed boards 303. Fig. 9 The placing frame 302 is a plate-shaped body with four sides surrounded and the middle hollowed out, and the placing frame 302 is fixed around the inner side of the bed board 303.

[0099] The attachment mechanism 200 can be placed in the placement frame 302. Fig.11 The accessory mechanism 200 shown in the figure comprises a shelf 201, on which a recess II 202 is provided, and the recess II 202 can accommodate the energy storage component 102, the semiconductor cooling sheet 103 and the heat dissipation component 104. The metal plate 101 is placed on the upper surface of the shelf 201. In this way, the heating and cooling module 100 can be placed in the accessory mechanism 200.

[0100] Preferably, the periphery of the embedding groove II 202 matches the periphery of the energy storage component 102 , so that the displacement of the cooling and heating module 100 is restricted when it is placed in the accessory mechanism 200 , and the cooling and heating module 100 is more stable.

[0101] Preferably, a sink 203 is also provided on the shelf 201, and the periphery of the sink 203 matches the periphery of the metal plate 101. In this way, the metal plate 101 is embedded in the sink 203, so that the heating and cooling module 100 is more firmly placed in the accessory mechanism 200. The periphery of the sink 203 surrounds the periphery of the metal plate 101, thereby protecting the metal plate 101. In this embodiment, the accessory mechanism 200 and the nest 300 are both made of wood materials, which are easy to process. The wooden shelf 201 can also better protect the lower surface and periphery of the metal plate 101, and will not wear the metal plate 101.

[0102] like Fig.11 The bottom surface of the sink 203 is provided with a mounting hole 204, through which the connector 111 in the heating and cooling module passes (see Figure 6 ), the cooling and heating module 100 and the accessory mechanism 200 can be fixed together with bolts.

[0103] like Fig.11 The accessory mechanism 200 further includes a receiving box 205, and a wire hole is provided between the receiving box 205 and the embedding groove II 202. The receiving box 205 is arranged below the shelf 201, and the receiving box 205 can accommodate components such as a thermostat and a rectifier, which facilitates management.

[0104] like Fig.11 The upper edge of the receiving box 205 is spaced a certain distance from the shelf 201 to form a slot 206, which can be used to hold the device. Fig.10 The edge of one side of the middle placement frame 302 makes it difficult for the accessory mechanism 200 to separate from the nest frame 300.

[0105] The method of assembling the attachment mechanism 200 and the nest frame 300 is: Fig.11 The middle attachment mechanism 200 is tilted so that the card slot 206 is aligned with Fig.10 The middle nest frame 300 has a long side, and the accessory mechanism 200 is pushed and gradually flattened so that the card slot 206 is gradually clamped into the long side of the placement frame 302. Finally, the accessory mechanism 200 is flattened, and the shelf 201 is set on the placement frame 302, forming a Fig.12 Place the cooling and heating module 100 in Fig.12 In the attachment mechanism 200, the metal plate 101 in the cooling and heating module 100 is embedded in the sink 203, and the energy storage component 102, the semiconductor cooling sheet 103 and the heat dissipation component 104 in the cooling and heating module 100 are stored in the embedding groove II 202. Then, a mattress is laid on the metal plate 101 to obtain a pet bed with adjustable temperature.

[0106] In this embodiment, a nest frame 300 is provided to make the pet's living more comfortable. In other technical solutions, the nest frame 300 may not be provided, for example, only the accessory mechanism 200 and the cooling and heating module 100 are provided. If the area of ​​the metal plate 101 is made large enough, the combination of the accessory mechanism 200 and the cooling and heating module 100 can be similar to a constant temperature movable board, on which the pet can play and frolic.

[0107] Example 3

[0108] like Fig.14 The pet nest shown is a pet room (without a roof, door, or heating and cooling module). The pet nest also includes a nest frame 300 and an accessory mechanism 200.

[0109] The nest frame 300 is composed of Fig.13 It is made up of multiple panels. Fig.13 An insertion groove 301 is provided at the bottom of the nest frame 300, and the insertion groove 301 extends to the bottom side of the pet nest.

[0110] like Fig.14 , Fig.15 as well as Fig.16 Two long strip-shaped support plates 304 are arranged in the nest frame 300. The support plates 304 are arranged near the insertion slot 301 and extend along the insertion path of the accessory mechanism 200. The accessory mechanism 200 can be moved into the bottom of the inner side of the pet nest through the introduction of the insertion slot 301 and the support of the two support plates 304. The accessory mechanism 200 can also be moved out from the bottom of the inner side of the pet nest through the insertion slot 301 and the support plates 304.

[0111] The support plate 304 is a preferred configuration, which can make the attachment mechanism 200 move in and out more smoothly. The upper surface of the support plate 304 can also be made into a smooth surface or a ball bearing can be arranged on the upper surface of the support plate 304 to more smoothly pull the attachment mechanism 200. In other technical solutions, the support plate 304 can also be omitted, for example, the attachment mechanism 200 can be moved by the support of the ground.

[0112] like Fig.17 and Fig.18 The accessory mechanism 200 shown is similar in structure to the accessory mechanism 200 in Embodiment 2, and similarities are not repeated herein.

[0113] The difference between the accessory mechanism 200 in this embodiment and the accessory mechanism 200 in Embodiment 2 is that the receiving box 205 is close to the lower surface of the shelf 201 to reduce the height of the accessory mechanism 200; and a foldable handle 207 is added to make it easy to pull out the accessory mechanism 200.

[0114] After the attachment mechanism 200 is completely inserted into the insertion slot 301, Fig.14When the heating and cooling module 100 is installed behind the attachment mechanism 200 ( Fig.14 In the case where the cooling and heating module 100 is not yet provided, the accessory mechanism 200 together with the cooling and heating module 100 can be moved in and out of the insertion slot 301. In this way, the accessory mechanism 200 and the cooling and heating module 100 can be inserted into the insertion slot 301 after being installed externally, which facilitates operation.

[0115] The accessory mechanism 200 only occupies part of the floor space in the pet nest, in this case about half of the floor space, and the rest of the floor space in the pet nest is a normal fixed plate. Such a configuration provides more options for the pet's activities. For example, after installing the heating and cooling module 100 on the accessory mechanism 200, a mattress is laid on the entire floor of the pet nest, and a heating area (or cooling area) (corresponding to the position of the accessory mechanism 200) and a normal temperature area (corresponding to the area of ​​the normal fixed plate) are formed on the floor area of ​​the pet nest at the same time, which is convenient for the pet to freely choose, making the pet nest more widely applicable.

[0116] Example 4

[0117] like Fig.23 The fourth embodiment shown is a pet bed for cats, which also includes a bed frame 300 and an accessory mechanism. The shelf 201 in the accessory mechanism is arranged at the bottom of the inner side of the bed frame 300, and the shelf 201 is also provided with an embedding groove II and a sink 203. The difference from the third embodiment is that the shelf 201 is round, which is suitable for the habits of cats.

[0118] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A cooling and heating module for pet living, characterized in that: It comprises a metal plate (101), an energy storage component (102), a semiconductor cooling sheet (103) and a heat dissipation component (104); the energy storage component (102) and the heat dissipation component (104) are respectively arranged on the upper and lower surfaces of the semiconductor cooling sheet (103); the energy storage component (102) is provided with an embedding groove I (106); the semiconductor cooling sheet (103) is tightly attached to the embedding groove I (106); the metal plate (101) is arranged on the upper surface of the energy storage component (102); a heat insulation space (105) is further provided between the energy storage component (102) and the metal plate (101); the heat insulation space (105) is a depression formed on the surface of the energy storage component (102) or the metal plate (101); the heat insulation space (105) is approximately located at the horizontal center of the energy storage component (102); and the heat insulation space (105) is surrounded by a heat insulation space (105). The energy storage component (102) is attached to the metal plate (101) and a soft heat-conducting component (107) is provided between the energy storage component (102) and the metal plate (101) except for the heat-insulating space (105). The soft heat-conducting component (107) is heat-conducting silicone grease. A heat-insulating layer (110) is provided on the exposed lower surface of the energy storage component (102) or the exposed lower surface of the metal plate (101). A connecting component (111) for fixing the metal plate (101) is welded to the metal plate (101). Before being welded to the surface of the metal plate (101), a solder (112) protruding from the welding surface is integrally provided on the welding surface of the connecting component (111). Corresponding holes are provided on the energy storage component (102), the soft heat-conducting component (107) and the heat-insulating layer (110) for the connecting component (111) to pass through.

2. The pet living cooling and heating module according to claim 1 is characterized in that: It also includes a temperature controller, which includes a temperature sensor arranged near the metal plate (101), and the wiring terminal of the semiconductor cooling sheet (103) is connected to the temperature controller.

3. The pet living cooling and heating module according to claim 1 is characterized in that: It also includes a rectifier, which converts a high-voltage power supply into a low-voltage power supply, and the output end of the rectifier is connected to the semiconductor cooling sheet (103).

4. The pet living cooling and heating module according to claim 1 is characterized in that: The heat dissipation component (104) comprises a heat dissipation fin (108) and a wind power mechanism (109) connected to the heat dissipation fin (108).

5. The pet living cooling and heating module according to claim 1 is characterized in that: The thickness of the solder (112) is 0.8-1.2 mm.

6. The pet living cooling and heating module according to claim 1, characterized in that: It also includes a protective shell (116), the protective shell (116) including a first plug-in box (1161) and a second plug-in box (1162) which are detachably combined together, the first plug-in box (1161) and the second plug-in box (1162) respectively having a first plate (11611) and a second plate (11621) inserted into the gap between the energy storage component (102) and the heat dissipation component (104), and a groove III (1163) for accommodating the semiconductor cooling plate (103) is formed at the joint of the first plate (11611) and the second plate (11621).

7. The pet living cooling and heating module according to claim 6, characterized in that: The protective shell (116) is provided with an air inlet (1164) and an air outlet (1165).

8. The pet living cooling and heating module according to claim 6, characterized in that: The shape of the embedding groove III (1163) matches the shape of the semiconductor cooling plate (103).

9. A pet bed with a cooling and heating module, characterized in that it include: The cooling and heating module (100) according to any one of claims 1 to 8; An accessory mechanism (200) comprises a shelf (201), and a sink (203) for inlaying the metal plate (101) is provided on the shelf (201).

10. The pet bed with a cooling and heating module according to claim 9, characterized in that: The periphery of the sink (203) matches the periphery of the metal plate (101).

11. The pet bed with a cooling and heating module according to claim 9, characterized in that: The shelf (201) is also provided with an embedding groove II (202) for embedding the energy storage component (102).

12. The pet bed with a cooling and heating module according to claim 11, characterized in that: The periphery of the embedding groove II (202) matches the periphery of the energy storage component (102).

13. The pet bed with a cooling and heating module according to claim 9, characterized in that: A mounting hole (204) for fixing the metal plate (101) is provided on the bottom surface of the sink (203).

14. The pet bed with a cooling and heating module according to claim 9, characterized in that: The accessory mechanism (200) further comprises a receiving box (205) for storing electric wires.

15. The pet bed with a cooling and heating module according to claim 9, characterized in that: It also comprises a nest frame (300), wherein the nest frame (300) is provided with an insertion slot (301) or a placement frame (302), and the cooling and heating module (100) and the accessory mechanism (200) can be integrally inserted into the insertion slot (301) or placed in the placement frame (302).

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