An LED light-emitting module for long-distance visible light communication and a preparation method thereof

Abstract

The present invention relates to the technical field of LED light sources, and in particular to an LED light-emitting module for long-distance visible light communication and a preparation method thereof, comprising an LED substrate, a plurality of LED chips and electrodes, and also comprising an optical bowl cup, a negative Fresnel small lens, a reflective cup and a positive Fresnel large lens, so as to realize a small illumination area of ​​the LED light-emitting module, concentrated light output, uniform light emission and high illumination, so that the visible light emitted by the LED light-emitting module can be transmitted over a long distance. The preparation method of the present invention adopts an LED substrate, a double optical lens, a heat dissipation structure of an LED flip chip and an interconnection packaging process, so as to realize reliable packaging of an LED light-emitting module with high heat dissipation, high power, small angle, high light efficiency and long-distance communication.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light sources, and in particular to an LED light emitting module for long-distance visible light communication and a preparation method thereof. Background Art

[0002] In recent years, outdoor visible light communication technology has received widespread attention. Outdoor visible light communication has a wide range of potential applications, such as in outdoor intelligent transportation and other fields.

[0003] However, compared with indoor visible light communication, outdoor visible light communication has problems such as no unified light signal, insufficient signal, insufficient optoelectronic power of visible light module and diffuse reflection of LED light source. In the field of outdoor visible light communication technology, especially in visible light relay information transmission and visible light emergency communication, the outdoor communication LED integrated light source in the prior art adopts surface light source to emit light, resulting in insufficient light power and large size, which cannot be treated as a general point light source. It is difficult to meet the requirements of high-power and very small luminous angle emission modules, so it cannot be used in long-distance visible light communication light source emission modules. Summary of the invention

[0004] To solve the above problems, the present invention provides an LED light-emitting module for long-distance visible light communication and a preparation method thereof, which has high light source power, small illumination area, and small light angle divergence, and can meet the requirements of long-distance visible light communication.

[0005] The technical solution adopted by the present invention is: an LED light-emitting module for long-distance visible light communication, including an LED substrate, a plurality of LED chips and electrodes, the plurality of LED chips and electrodes are respectively installed on the LED substrate, the plurality of LED chips are connected to the electrodes, and also includes an optical bowl cup, a negative Fresnel small lens, a reflective cup and a positive Fresnel large lens, a plurality of optical bowl cups are provided corresponding to the LED chips, a plurality of optical bowl cups are respectively covered on the plurality of LED chips, a plurality of negative Fresnel small lenses are provided corresponding to the optical bowl cups, the negative Fresnel small lens is covered on the optical bowl cup, the reflective cup covers the plurality of LED chips, the plurality of optical bowl cups and the plurality of negative Fresnel small lenses in the cup body, the bottom of the reflective cup is connected to the LED substrate, the positive Fresnel large lens is covered on the reflective cup and connected to the side of the reflective cup away from the LED substrate, the optical bowl cup, the negative Fresnel small lens and the LED chip are packaged on the LED substrate to form an LED light source, the reflective cup is used to recycle light, and the positive Fresnel large lens is used to adjust the light emission angle.

[0006] A further improvement to the above technical solution is that it also includes an optical support frame, which is connected to the LED substrate and fits tightly to the outer side of the reflective cup.

[0007] A further improvement to the above technical solution is that a limiting hole is provided on the LED substrate, and the LED chip is clamped on the LED substrate through the limiting hole.

[0008] A further improvement to the above technical solution is that a metal heat-conducting layer is provided on the side of the LED substrate where the LED chip is not mounted.

[0009] A further improvement to the above technical solution is that the LED substrate is an aluminum oxide ceramic substrate or an aluminum nitride ceramic substrate.

[0010] A further improvement to the above technical solution is that the LED chip is set as a flip chip, and a plurality of LED chips are distributed on the LED substrate in a topological structure.

[0011] A further improvement to the above technical solution is that the LED chip is set as a Flip Chip.

[0012] A method for preparing an LED light-emitting module for long-distance visible light communication, the method comprising the following steps:

[0013] Step 1: According to the requirements of the long-distance visible light communication LED light source, the LED substrate is optically designed, and the LED substrate is metallized to form a metal thermal conductive layer on the LED substrate;

[0014] Step 2: According to the optical design requirements of step 1, a limiting hole is opened on the LED substrate and an electrode is installed, the LED chip is encapsulated in the limiting hole, and an optical bowl cup is placed on the LED chip;

[0015] Step 3: Glue a negative Fresnel lens onto the optical bowl to form an LED light source;

[0016] Step 4: Cover the light source with a reflective cup, and connect a large positive Fresnel lens to the reflective cup to form a long-distance visible light communication LED light-emitting module.

[0017] A further improvement to the above technical solution is that the LED chip in step 2 adopts a Flip Chip wafer packaging process.

[0018] A further improvement to the above technical solution is that in step 2, the LED chip is a flip chip, which is distributed on the LED substrate using a topological structure, and the LED substrate, LED chip and optical bowl cup all use an MCOB packaging structure.

[0019] The beneficial effects of the present invention are as follows:

[0020] The invention discloses an LED light-emitting module for long-distance visible light communication. By arranging a plurality of LED chips, a small illumination area, concentrated light output, uniform light emission and high illumination are achieved. The light emitted by the light source is then recycled through a reflective cup. The reflective cup reflects as much light energy as possible back to the surface of the LED chip to achieve light recycling, increase the chip brightness by about 1 times, and further enhance the light intensity of the light source of the invention. A large positive Fresnel lens cooperates with the reflective cup to adjust the light emission angle, so that the light source divergence angle is not greater than 5 degrees, and effective visible light transmission and emission at different distances are achieved, forming an LED light-emitting module that can be transmitted over long distances and has high light source power, a small illumination area and a small divergence angle.

[0021] The present invention also discloses a method for preparing an LED light-emitting module for long-distance visible light communication, which adopts an LED substrate, a secondary optical lens, an LED flip chip heat dissipation structure and an interconnection packaging process to achieve reliable packaging of a high-heat dissipation, high-power, small-angle, high-light-efficiency, long-distance communication LED light-emitting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A top view of the present invention;

[0023] Figure 2 is a cross-sectional view of the present invention;

[0024] Figure 3 It is a schematic diagram of the optical circuit design of the present invention.

[0025] Explanation of the reference numerals: 1. LED chip, 2. LED substrate, 3. small negative Fresnel lens, 4. reflective cup, 5. optical support frame, 6. large positive Fresnel lens, 7. electrode, 8. metal heat conductive layer, 9. optical bowl cup, 10. limiting hole. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] See also Figures 1 to 3, an LED light-emitting module for long-distance visible light communication, including an LED substrate 2, a plurality of LED chips 1 and electrodes 7 respectively installed on the LED substrate 2, the electrodes 7 are electrically connected to the plurality of LED chips 1, and also includes an optical bowl cup 9, a negative Fresnel lens 3, a reflective cup 4 and a positive Fresnel lens 6, the optical bowl cup 9 is provided with a plurality of LED chips 1, the plurality of optical bowl cups 9 are respectively covered on the plurality of LED chips 1, the negative Fresnel lens 3 are respectively covered on the optical bowl cup 9, the reflective cup 4 covers the plurality of LED chips 1, the plurality of optical bowl cups 9 and the plurality of negative Fresnel lens 3 in the cup body, the bottom of the reflective cup 4 is connected to the LED substrate 2, the positive Fresnel lens 6 is covered on the reflective cup 4 and connected to the side of the reflective cup 4 away from the LED substrate 2, the optical bowl cup 9, the negative Fresnel lens 3 and the LED chip 1 are packaged on the LED substrate 2 to form LED light source, reflective cup 4 is used to recycle light, positive Fresnel large lens 6 is used to adjust the light emission angle, the present invention adopts the method of encapsulating optical bowl cup 9, negative Fresnel small lens 3 and LED chip 1 in LED substrate 2 to form LED light source, and by setting a plurality of LED chips 1, a small illumination area, concentrated light output, uniform light emission and high illumination are achieved, and then the light emitted by the light source is recycled through the reflective cup 4, and the reflective cup 4 reflects as much light energy as possible back to the surface of the LED chip 1 to achieve light recycling, increase the chip brightness by about 1 times, and further enhance the light intensity of the light source of the present invention, the positive Fresnel large lens 6 cooperates with the reflective cup 4 to adjust the light emission angle by zooming, so that the light source divergence angle is not greater than 5 degrees, and the transmission and emission of effective visible light at different distances are achieved, forming an LED light-emitting module with high light source power, small illumination area and small divergence angle that can be transmitted over a long distance.

[0028] It also includes an optical support frame 5, which is connected to the LED substrate 2 and is tightly fitted to the outer side of the reflective cup 4. This arrangement has a simple structure and can effectively ensure the connection stability of the present invention.

[0029] The LED substrate 2 is provided with a limiting hole 10, and the LED chip 1 is clamped on the LED substrate 2 through the limiting hole 10. Such a setting has a simple structure and is convenient for setting the LED chip 1 on the LED substrate 2 according to lighting requirements.

[0030] A metal heat-conducting layer 8 is provided on the side of the LED substrate 2 where the LED chip 1 is not mounted. Such a configuration can increase the heat-conducting performance of the light source of the present invention.

[0031] The LED substrate 2 is an alumina ceramic substrate or an aluminum nitride ceramic substrate. With this configuration, the substrate has high thermal conductivity, which can improve the thermal conductivity of the light source and reduce the heat island effect, further enhancing and ensuring the high-power light emission of the present invention.

[0032] The LED chip 1 is configured as a flip chip, and a plurality of LED chips 1 are distributed in a topological structure on the LED substrate 2. By topologically distributing a plurality of LED chips and packaging them with the optical bowl cup 9 using an MCOB structure, such a configuration can achieve a small illumination area, concentrated light output, uniform light emission, and high illumination.

[0033] The LED chip 1 is set as a Flip Chip. The use of the Flip Chip can reduce the external dimensions and the light-emitting area dimensions of the LED light source, which is conducive to further optimizing the design of the LED light source in combination with the optical cup and the large positive Fresnel lens 6 .

[0034] A method for preparing an LED light-emitting module for long-distance visible light communication, the method comprising the following steps:

[0035] Step 1: According to the requirements of the long-distance visible light communication LED light source, the LED substrate 2 is optically designed, and the LED substrate 2 is metallized to form a metal thermal conductive layer 8 on the LED substrate 2. This can enhance the thermal conductivity of the visible light communication LED light source and reduce the heat island effect of the package, thereby meeting the requirements of luminous uniformity and the requirements of the light distribution design on the geometric size and intensity of the light-emitting surface.

[0036] Step 2: According to the optical design requirements of step 1, a limiting hole 10 is opened on the LED substrate 2 and an electrode 7 is installed, the LED chip 1 is encapsulated in the limiting hole 10, and an optical bowl cup 9 is placed on the LED chip 1;

[0037] Step 3: Bond the negative Fresnel lens 3 to the optical bowl 9 to form an LED light source;

[0038] Step 4: Cover the light source with a reflective cup 4 and connect a positive Fresnel lens 6 to the reflective cup 4 to form a long-distance visible light communication LED light-emitting module.

[0039] In this embodiment, the LED chip 1 in step 2 is a Flip Chip, and the Flip Chip wafer packaging process is adopted, which can reduce the external dimensions and light-emitting area dimensions of the LED light source, and is beneficial to secondary optical design.

[0040] In this embodiment, in step 2, the LED chip 1 is a flip chip, which is distributed on the LED substrate 2 using a topological structure. The LED substrate 2, the LED chip 1 and the optical bowl cup 9 all use an MCOB packaging structure. Through the primary optical design of the optical bowl cup 9 and the negative Fresnel lens 3, an LED light source is formed with the LED packaging process, and the number of packaged chips is optimized and a multi-chip topological distribution is adopted to achieve a light source with a small illumination area, concentrated light output, uniform light emission and high illumination.

[0041] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An LED light-emitting module for long-distance visible light communication, comprising an LED substrate, a plurality of LED chips and electrodes, wherein the plurality of LED chips and electrodes are respectively mounted on the LED substrate, and the plurality of LED chips are connected to the electrodes, characterized in that: It also includes an optical bowl cup, a small negative Fresnel lens, a reflective cup and a large positive Fresnel lens. A number of optical bowl cups are provided corresponding to the LED chips, and a number of optical bowl cups are respectively covered on the number of LED chips. A number of small negative Fresnel lenses are provided corresponding to the optical bowl cup, and the small negative Fresnel lens is covered on the optical bowl cup. The reflective cup covers a number of LED chips, a number of optical bowl cups and a number of small negative Fresnel lenses in the cup body. The bottom of the reflective cup is connected to the LED substrate. The large positive Fresnel lens is covered on the reflective cup and connected to the side of the reflective cup away from the LED substrate. The optical bowl cup, the small negative Fresnel lens and the LED chip are packaged on the LED substrate to form an LED light source. The reflective cup is used to recycle light, and the large positive Fresnel lens is used to adjust the emission angle of light. A limiting hole is provided on the LED substrate, and the LED chip is clamped on the LED substrate through the limiting hole. A metal heat conductive layer is provided on the side of the LED substrate where the LED chip is not installed.

2. The LED light-emitting module for long-distance visible light communication according to claim 1, characterized in that: It also includes an optical support frame, which is connected to the LED substrate and is closely attached to the outer side of the reflective cup.

3. The LED light-emitting module for long-distance visible light communication according to claim 1, characterized in that: The LED substrate is an alumina ceramic substrate or an aluminum nitride ceramic substrate.

4. The LED light-emitting module for long-distance visible light communication according to claim 1, characterized in that: The LED chip is configured as a flip chip, and a plurality of LED chips are distributed on the LED substrate in a topological structure.

5. The LED light-emitting module for long-distance visible light communication according to claim 4, characterized in that: The LED chip is set to Flip Chip.

6. A method for preparing an LED light-emitting module for long-distance visible light communication according to any one of claims 1 to 5, characterized in that: The preparation method comprises the following steps: Step 1: According to the requirements of the long-distance visible light communication LED light source, the LED substrate is optically designed, and the LED substrate is metallized to form a metal thermal conductive layer on the LED substrate; Step 2: According to the optical design requirements of step 1, a limiting hole is opened on the LED substrate and an electrode is installed, the LED chip is encapsulated in the limiting hole, and an optical bowl cup is placed on the LED chip; Step 3: Glue a negative Fresnel lens onto the optical bowl to form an LED light source; Step 4: Cover the light source with a reflective cup, and connect a large positive Fresnel lens to the reflective cup to form a long-distance visible light communication LED light-emitting module.

7. The method for preparing a long-distance visible light communication LED light-emitting module according to claim 6, characterized in that: The LED chip in step 2 is packaged using the Flip Chip wafer packaging process.

8. The method for preparing a long-distance visible light communication LED light-emitting module according to claim 6, characterized in that: In step 2, the LED chip is a flip chip and is distributed on the LED substrate using a topological structure. The LED substrate, LED chip and optical bowl cup all use an MCOB packaging structure.

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