A planar target binding device and method

Abstract

The present invention relates to a binding device and method for planar target materials, the device comprising a rack with a slide rail, a hot table, a sealing slide, a pneumatic lifting slider, an auxiliary plate, a temperature control box for controlling the temperature of the hot table, and a plurality of limit blocks that can be detachably mounted on a back plate. The binding method of the present invention is to preliminarily position the back plate, the indium plate and the target material on the auxiliary plate at room temperature, and then place them on the hot table for heating and binding. When the temperature rises, in a high temperature state, the operator only needs to open the sealing slide to check whether the target material binding position meets the requirements, and make adjustments if there are any non-compliance. Compared with the existing binding method that requires the target material to be moved at high temperature to fit the metal back plate, the operator of the present invention only needs to perform position accuracy inspection and fine-tuning at high temperature, which can avoid the operator from working at high temperature for a long time, thereby reducing the worker's operating intensity, improving the working environment, and improving the stability of the binding quality.

Description

Technical Field

[0001] The invention relates to a device and method for binding a planar target material. Background Art

[0002] When the magnetron sputtering coating target is in use, the target needs to be welded to the back plate. Indium is usually used as solder for brazing. The conventional operation is to heat the indium to above 160°C on a hot table to melt it, and the target is also heated to a similar temperature. Then the operator wears heat-resistant gloves and attaches the target weighing several kilograms to more than ten kilograms to the metal back plate at a high temperature above 160°C. The position and spacing between the targets are repeatedly adjusted, with an accuracy requirement of about 0.2mm. The staff needs to operate delicately for a long time near the high-temperature hot table. The working environment is harsh, the labor intensity is high, and it is easy to have inaccurate bonding positions, leading to rework. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a binding device and method for planar targets, which has a simple structure and can perform preliminary positioning of the targets at room temperature. The operator only needs to perform position accuracy inspection and fine-tuning at high temperature, which greatly reduces labor intensity and improves the working environment.

[0004] The technical solution to solve the above technical problems is: a binding device for a planar target material, comprising a rack with slide rails, a hot table, a sealing slide cover, a pneumatic lifting slider, an auxiliary plate, a temperature control box for controlling the temperature of the hot table and a plurality of limit blocks that can be detachably mounted on the back plate, the hot table and the temperature control box are fixed on the rack, two slide rails are respectively arranged on both sides of the rack, the hot table is located between the two slide rails, the sealing slide cover is a rectangular structure with openings on the lower end face and one side face, an exhaust port is arranged on the sealing slide cover, two sealing slide covers are arranged, and the two sealing slide covers are symmetrically placed at both ends of the rack, the pneumatic lifting slider comprises a slider, a cylinder mounted on the slider and a connecting plate connected to the cylinder piston rod, both sides of a sealing slide cover are connected to a plurality of pneumatic lifting sliders, that is, the slider of the pneumatic lifting slider is mounted on the slide rail of the rack, the connecting plate is connected to the upper end face of the sealing slide cover, and a plurality of fixing clips for clamping the back plate are mounted on the auxiliary plate.

[0005] The edge of the sealing sliding cover is provided with a flange, and the sealing sliding cover is also provided with a sliding handle.

[0006] The fixing clamp is composed of a support frame, a screw rod and a pressing block connected to the bottom end of the screw rod. The support frame is composed of a transverse rod and a longitudinal rod connected in one piece. The transverse rod is provided with a screw hole, and the screw rod is installed in the screw hole.

[0007] Another technical solution of the present invention is: a method for binding a planar target, the device used is the above-mentioned binding device for the planar target, comprising the following steps:

[0008] ⑴ First, fix the back panel in the middle of the auxiliary panel with a fixing clip to keep the back panel flat;

[0009] (2) On the back plate, in the area where the target material is expected to be bonded, lay a 0.5-2 mm thick indium plate, and place several copper wires with a diameter of 0.3-1 mm in between;

[0010] ⑶ Place the target material on the back plate according to the required position, place a spacer of a certain thickness between the target materials to control the distance, and fix multiple limit blocks on the periphery of the target material on the back plate through high-temperature double-sided tape to control the distance between the target material and the periphery of the back plate;

[0011] (4) Then the auxiliary plate and the target material to be bound fixed thereon are transferred to the hot stage; the sealing slide cover is moved to seal the target material to be bound. Before moving the sealing slide cover, the sealing slide cover is first lifted by the pneumatic lifting slider, and the slider of the pneumatic lifting slider slides on the slide rail, thereby driving the sealing slide cover to move. After the movement is completed, the sealing slide cover is lowered and closed by the pneumatic lifting slider;

[0012] ⑸ Raise the temperature of the hot plate to 130-150℃; use a vacuum pump to evacuate air through the exhaust port to achieve a certain vacuum inside the sealing slide cover, so that the air between the target and the back plate can be discharged to reduce the appearance of pores in the later welding; continue to raise the temperature to 170-200℃, and then break the vacuum through the exhaust port;

[0013] (6) Then open the sealing slide cover and check whether the target binding position meets the requirements. If there is any non-compliance, make adjustments. After determining the target position, re-cover the sealing slide cover and start cooling. After the temperature drops to room temperature, clean the excess solder around the target and the binding is complete.

[0014] Due to the adoption of the above technical solution, the present invention has the following beneficial effects:

[0015] 1. The present invention preliminarily positions the back plate, indium plate and target material on the auxiliary plate at room temperature, and then places them on a hot table for heating and binding. When the temperature rises, in a high temperature state, the operator only needs to open the sealing slide cover to check whether the target material binding position meets the requirements, and make adjustments if there are any non-compliance. Compared with the existing binding method that requires the target material to be moved and bonded to the metal back plate at high temperature, the operator of the present invention only needs to perform position accuracy inspection and fine-tuning at high temperature, which can avoid long-term high-temperature operation of the operator, thereby reducing the worker's operating intensity, improving the working environment, and improving the stability of the binding quality.

[0016] 2. The present invention has a simple structure and is easy to operate.

[0017] The technical features of a planar target binding device and method of the present invention are further described below in conjunction with the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 : Schematic diagram of the structure of the binding device for planar targets of the present invention (where the targets to be bound are placed).

[0019] Figure 2 : Schematic diagram of the structure of the frame, hot stage and temperature controller of the present invention.

[0020] Figure 3 : Schematic diagram of the sealing sliding cover structure of the present invention.

[0021] Figure 4 : Schematic diagram of the structure of the pneumatic lifting slider of the present invention.

[0022] Figure 5 : Schematic diagram of the auxiliary plate of the present invention and the target material to be bound fixed thereon.

[0023] Figure 6 : Figure 5 Enlarged view of part B.

[0024] In the figure: 1-hot stage, 2-temperature control box, 3-rack with slide rail, 3-1-slide rail, 4-sealed slide cover, 4-1-exhaust port, 4-2-slide handle, 4-3-flange, 5-pneumatic lifting slider, 5-1-slide block, 5-2-cylinder, 5-3-connecting plate, 5-4-air port I, 5-5-air port II, 6-auxiliary plate, 7-fixing clamp, 7-1-support frame, 7-2-screw, 7-3-pressing block, 8-limiting block.

[0025] A1-target, A2-back plate. DETAILED DESCRIPTION

[0026] Embodiment 1: A planar target binding device, such as Figure 1-Figure 6As shown, it includes a rack 3 with slide rails, a programmable temperature-controlled hot table 1, a sealing slide 4, a pneumatic lifting slider 5, an auxiliary plate 6, a temperature control box 2 for controlling the temperature of the hot table and a plurality of limit blocks 8 that can be detachably mounted on the back plate, the hot table 1 and the temperature control box 2 are fixed on the rack 3, two slide rails 3-1 are respectively arranged on both sides of the rack, the hot table 1 is located between the two slide rails, the sealing slide 4 is a rectangular parallelepiped structure with openings on the lower end face and one side face, an exhaust port 4-1 is arranged on the sealing slide, two sealing slides are arranged, and the two sealing slides are symmetrically placed at both ends of the rack, the pneumatic lifting slider 5 includes a slider 5-1, a cylinder 5-2 mounted on the slider and a connecting plate 5-3 connected to the cylinder piston rod, both sides of a sealing slide 4 are connected to a plurality of pneumatic lifting sliders 5, that is, the slider of the pneumatic lifting slider is mounted on the slide rail 3-1 of the rack 3, the connecting plate 5-3 is connected to the upper end face of the sealing slide 4, and a plurality of fixing clamps 7 for clamping the back plate are installed on the auxiliary plate.

[0027] In this embodiment, the sealing sliding cover is provided with a flange 4-3 at its edge to facilitate sliding and sealing. The sealing sliding cover is also provided with a sliding handle 4-2.

[0028] In this embodiment, the fixing clamp 7 is composed of a support frame 7-1, a screw rod 7-2 and a pressing block 7-3 connected to the bottom end of the screw rod. The support frame is composed of a transverse rod and a longitudinal rod connected in one piece. The transverse rod has a screw hole, and the screw rod is installed in the screw hole. As a change, fixing clamps of other structures can also be used as long as they can meet the use requirements.

[0029] Embodiment 2: A method for binding a planar target, using a device as described in Embodiment 1, comprising the following steps:

[0030] (1) First, fix the back panel A2 to the middle position of the auxiliary panel 6 with a fixing clip 7 to keep the back panel flat;

[0031] (2) On the back plate, in the area where the target material is expected to be bonded, lay a 0.5-2 mm thick indium plate, and place several copper wires with a diameter of 0.3-1 mm in between (adjusting the diameter of the copper wire can control the thickness of the indium solder after bonding);

[0032] ⑶ Place 8 pieces of target materials A1 on the back plate according to the required position, place a spacer of a certain thickness between the targets to control the spacing, and fix multiple limit blocks 8 on the periphery of the target materials on the back plate by high-temperature double-sided adhesive to control the distance between the target materials and the periphery of the back plate;

[0033] (4) Then the auxiliary plate 6 and the target material to be bound fixed thereon are transferred to the hot stage 1; the sealing slide cover 4 is moved to seal the target material to be bound. Before moving the sealing slide cover, the sealing slide cover is first lifted by the pneumatic lifting slider 5, and the slider 5-1 of the pneumatic lifting slider slides on the slide rail 3-1, thereby driving the sealing slide cover to move. After the movement is completed, the sealing slide cover is lowered and closed by the pneumatic lifting slider;

[0034] (5) Raise the temperature of the hot plate 1 to 130-150°C; use a vacuum pump to evacuate air through the exhaust port 4-1 to achieve a certain vacuum inside the sealing slide 4, so that the air between the target material and the back plate is discharged to reduce the occurrence of welding pores in the later stage; continue to raise the temperature to 170-200°C, and then break the vacuum through the exhaust port;

[0035] (6) Then open the sealing slide cover and check whether the target binding position meets the requirements. If there is any non-compliance, make adjustments. After determining the target position, re-cover the sealing slide cover and start cooling. After the temperature drops to room temperature, clean the excess solder around the target and the binding is complete.

[0036] During binding, in order to prevent the indium from flowing out of the back plate after melting, a silicone sealing strip can be used around the target material.

[0037] In Example 2, after the binding is completed, the limit block and the spacer need to be removed. When the limit block is used again, it is re-bonded with a new high-temperature double-sided tape. During the binding process, there is no specific requirement for the position of the copper wire. The main function of the steel wire is to form a space between the target material and the back plate for solder filling. It is used to control the thickness of the solder layer. The thickness of the solder layer is proportional to the diameter of the steel wire.

[0038] The structures of the heating stage and the temperature controller described in the present invention belong to the prior art and will not be described in detail here.

Claims

1. A method for binding a planar target, characterized in that: The device used is a binding device for a planar target material, comprising a frame with slide rails (3), a heat table (1), a sealing slide cover (4), a pneumatic lifting slider (5), an auxiliary plate (6), a temperature control box (2) for controlling the temperature of the heat table, and a plurality of limit blocks (8) that can be detachably mounted on a back plate, wherein the heat table and the temperature control box are fixed on the frame, two slide rails (3-1) are respectively arranged on both sides of the frame, and the heat table is located between the two slide rails, and the sealing slide cover is a rectangular parallelepiped structure with openings on the lower end face and one side face ... The sealing slide cover is provided with an exhaust port (4-1), two sealing slide covers are provided, and the two sealing slide covers are symmetrically placed at both ends of the frame, the pneumatic lifting slider comprises a slider (5-1), a cylinder (5-2) mounted on the slider, and a connecting plate (5-3) connected to the cylinder piston rod, and both sides of a sealing slide cover are connected to a plurality of pneumatic lifting sliders, that is, the sliders of the pneumatic lifting slider are mounted on the slide rails of the frame, the connecting plate is connected to the upper end surface of the sealing slide cover, and the auxiliary plate is mounted with a plurality of fixing clamps (7) for clamping the back plate; The following steps are involved: ⑴ First, fix the back plate (A2) to the middle position of the auxiliary plate (6) with a fixing clip (7) to keep the back plate flat; (2) On the back plate, in the area where the target material is expected to be bonded, lay a 0.5-2 mm thick indium plate, and place several copper wires with a diameter of 0.3-1 mm in between; ⑶ Place the target (A1) on the backing plate at the required position, place a spacer of a certain thickness between the targets to control the distance, and fix multiple limit blocks on the periphery of the target on the backing plate by high-temperature double-sided tape to control the distance between the target and the periphery of the backing plate; (4) then transferring the auxiliary plate (6) and the target material to be bound fixed thereon to the hot stage; moving the sealing slide cover (4) to seal the target material to be bound; before moving the sealing slide cover, firstly lifting the sealing slide cover by means of a pneumatic lifting slider, and then driving the sealing slide cover to move by means of a slider of the pneumatic lifting slider sliding on a slide rail; after the movement is completed, lowering the sealing slide cover by means of the pneumatic lifting slider to cover it tightly; (5) Raising the temperature of the hot plate (1) to 130-150°C; using a vacuum pump to evacuate air through the exhaust port to achieve a certain vacuum inside the sealing slide cover, so that the air between the target material and the back plate is exhausted to reduce the occurrence of pores in the later welding; after continuing to raise the temperature to 170-200°C, breaking the vacuum through the exhaust port; (6) Then open the sealing slide cover and check whether the target binding position meets the requirements. If there is any non-compliance, make adjustments. After determining the target position, re-cover the sealing slide cover and start cooling. After the temperature drops to room temperature, clean the excess solder around the target and the binding is complete.

2. A method for binding a planar target according to claim 1, characterized in that: The edge of the sealing sliding cover is provided with a flange (4-3), and the sealing sliding cover is also provided with a sliding handle (4-2).

3. A method for binding a planar target according to claim 1 or 2, characterized in that: The fixing clamp is composed of a support frame (7-1), a screw rod (7-2) and a pressing block (7-3) connected to the bottom end of the screw rod. The support frame is composed of a transverse rod and a longitudinal rod connected in one piece. The transverse rod is provided with a screw hole, and the screw rod is installed in the screw hole.

Images