A power module

Abstract

The present invention provides a power module, including: a plurality of power modules, first and second capacitor electrode conductive layers, filter capacitors, and absorption capacitors. The power module includes an insulating substrate, first and second bridge arm conductive layers arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, a first bridge arm electrode conductive layer arranged on the insulating substrate, a first electrode conductive strip arranged on the first bridge arm electrode conductive layer, a second electrode conductive strip arranged on the second bridge arm conductive layer, an output electrode conductive layer arranged on the insulating substrate, and an output electrode conductive strip arranged on the output electrode conductive layer; a plurality of first bridge arm power chips are electrically connected to the first bridge arm electrode conductive layer, the first bridge arm conductive layer is electrically connected to the output electrode conductive layer, and a plurality of second bridge arm power chips are electrically connected to the output electrode conductive layer.

Description

Technical Field

[0001] The present invention relates to the field of electronic power technology, and in particular to a power module. Background Art

[0002] A power module generally consists of multiple power modules. A power module is a power switch module that is packaged with power electronic power devices such as metal oxide semiconductors (power MOS tubes), insulated gate field effect transistors (IGBTs), and fast recovery diodes (FRDs) according to certain functional combinations. It is mainly used for power conversion in various occasions such as electric vehicles, wind power generation, and industrial frequency conversion.

[0003] The motor drive circuit of an electric vehicle usually includes three sets of power modules to provide three-phase AC power to the motor. During the operation of the motor, since the motor is an inductive load, the parasitic inductance of the existing power module generates waveform oscillation during the switching process of the power module, affecting the precise operation performance of the motor. Summary of the invention

[0004] The purpose of the present invention is to solve the above problems and provide a power module comprising a plurality of power modules, so as to change the wiring arrangement of the power modules and effectively reduce the parasitic inductance of the power modules.

[0005] The present invention provides a power module, comprising a plurality of power modules, a first capacitor electrode conductive layer, a second capacitor electrode conductive layer, a filter capacitor, and an absorption capacitor; each power module comprises an insulating substrate, a first bridge arm conductive layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, a second bridge arm conductive layer arranged on the insulating substrate, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, a first bridge arm electrode conductive layer arranged on the insulating substrate, a first electrode conductive strip arranged on the first bridge arm electrode conductive layer, a second electrode conductive strip arranged on the second bridge arm conductive layer, an output electrode conductive layer arranged on the insulating substrate 1, and an output electrode conductive strip arranged on the output electrode conductive layer; the plurality of first bridge arm power chips are electrically connected to the first bridge arm electrode conductive layer, respectively. The first bridge arm conductive layer is electrically connected to the output electrode conductive layer, and multiple second bridge arm power chips are respectively electrically connected to the output electrode conductive layer; wherein, the first electrode conductive strip is adjacent to the multiple first bridge arm power chips and extends along the arrangement path of the multiple first bridge arm power chips, and the second electrode conductive strip is adjacent to the multiple second bridge arm power chips and extends along the arrangement path of the multiple second bridge arm power chips; the first capacitor electrode conductive layer and the second capacitor electrode conductive layer are stacked, the filter capacitor is electrically connected between the first capacitor electrode conductive layer and the second capacitor electrode conductive layer, the absorption capacitor is electrically connected between the first capacitor electrode conductive layer and the second capacitor electrode conductive layer, the first capacitor electrode conductive layer is electrically connected to the first electrode conductive strip, and the second capacitor electrode conductive layer is electrically connected to the second electrode conductive strip.

[0006] Furthermore, the plurality of second bridge arm power chips are electrically connected to the first bridge arm conductive layer, and further electrically connected to the output electrode conductive layer.

[0007] Furthermore, the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged frame-shaped copper strips of equal height, the opening of the first electrode conductive strip faces the first bridge arm power chip, and the opening of the second electrode conductive strip faces the second bridge arm power chip.

[0008] Furthermore, an outer frame is fixedly provided on the periphery of the insulating substrate, and side through holes are opened on the sides of the outer frame at the positions of the first electrode conductive strip and the second electrode conductive strip. The side through holes correspond to the shapes of the first electrode conductive strip and the second electrode conductive strip, and the size of the side through holes is larger than the size of the first and second electrode conductive strips. The first and second electrode conductive strips are respectively arranged in the side through holes, and the top ends of the first and second electrode conductive strips are higher than the upper surface of the outer frame.

[0009] Furthermore, the power module also includes a gate lead-out plate, which is arranged between the first and second bridge arm power chips and the output electrode conductive layer, the output electrode conductive layer is frame-shaped, and the gate lead-out plate is located in the frame-shaped opening of the output electrode conductive layer.

[0010] Furthermore, the output electrode conductive strip is frame-shaped and matches the shape of the output electrode conductive layer. A front through hole is provided at the front end of the outer frame at the position of the output electrode conductive strip. The front through hole corresponds to the shape of the output electrode conductive strip. The size of the front through hole is larger than the size of the output electrode conductive strip. The output electrode conductive strip is arranged in the front through hole, and its top end is higher than the upper surface of the outer frame.

[0011] Furthermore, the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged straight copper strips of the same height.

[0012] Furthermore, the output electrode conductive strip includes two straight conductive strips, which are respectively arranged on two arms of the frame of the output electrode conductive layer. Two front through holes are opened at the front end of the outer frame at the position of the output electrode conductive strip. The front through holes are straight and their size is larger than that of the output electrode conductive strip. The output electrode conductive strip is arranged in the front through holes, and the top of the output electrode conductive strip is higher than the upper surface of the outer frame.

[0013] Furthermore, the output electrode conductive strip includes two annular cylindrical conductive strips, which are arranged on both sides of the frame of the output electrode conductive layer. Two circular through holes are opened at the front end of the outer frame at the position of the output electrode conductive strips. The size of the circular through holes is larger than the size of the output electrode conductive strips. The output electrode conductive strip is arranged in the circular through holes, and its top end is higher than the upper surface of the outer frame.

[0014] Furthermore, the upper ends of the first electrode conductive strip, the second electrode conductive strip and the output electrode conductive strip are at the same height.

[0015] Furthermore, the first bridge arm power chip and the second bridge arm power chip are both single-tube packaged chips, and the first and second bridge arm power chips are both formed with a gate, a source and a heat dissipation drain.

[0016] Furthermore, the first electrode conductive strip and / or the second electrode conductive strip are / is continuously extended.

[0017] Furthermore, the first electrode conductive strip and / or the second electrode conductive strip comprises at least one partition in the middle.

[0018] Furthermore, the output electrode conductive strip includes at least one partition in the middle.

[0019] Furthermore, the power module also includes a heat sink, and the plurality of power modules are arranged on the heat sink.

[0020] Furthermore, the power module also includes a capacitor plate, and the first capacitor electrode conductive layer and the second capacitor electrode conductive layer are both arranged on the capacitor plate.

[0021] Furthermore, the power module also includes a plurality of pressure plates, and the capacitor plate is fixed to the heat sink via the plurality of pressure plates.

[0022] The power module included in the power module described in the present invention is led out through a metal copper strip as a module electrode, either by welding or crimping, which is convenient for installation, and the module area of ​​the conductive strip is small, which can effectively reduce the parasitic inductance of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is an exploded schematic diagram of a preferred implementation manner of a power module provided by the present invention.

[0024] Figure 2 yes Figure 1 Schematic diagram of the structure of the capacitor plate of the medium power module.

[0025] Figure 3 yes Figure 1 Schematic diagram of the structure after the medium power module is installed.

[0026] Figure 4 yes Figure 1 A front view schematic diagram of a first embodiment of a medium power module.

[0027] Figure 5 yes Figure 4 Schematic diagram of a medium power module.

[0028] Figure 6 yes Figure 4 Schematic diagram of the mid-power module after installation in the outer frame.

[0029] Figure 7 yes Figure 6 Exploded view of a medium power module.

[0030] Figure 8 yes Figure 1 A three-dimensional schematic diagram of a second embodiment of a medium power module.

[0031] Fig. 9 yes Figure 8 Schematic diagram of the mid-power module after installation in the outer frame.

[0032] Fig.10 yes Fig. 9 Exploded view of a medium power module.

[0033] Fig.11 yes Figure 1 A schematic front view of a third embodiment of a medium power module.

[0034] Fig.12 yes Fig.11 A perspective view of a medium power module.

[0035] Fig.13 yes Figure 1 A three-dimensional schematic diagram of a fourth embodiment of a medium power module.

[0036] Fig.14 yes Figure 1 A front view schematic diagram of a fifth embodiment of a medium power module.

[0037] Fig.15 yes Fig.14 A perspective view of a medium power module.

[0038] Fig.16 yes Figure 1 A perspective view of a sixth embodiment of a medium power module. DETAILED DESCRIPTION

[0039] The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0040] Please continue to refer to Figure 1 , 2 As shown, a power module 200 provided by the present invention includes a plurality of power modules 100 (for a motor, a three-phase alternating current must pass through three power modules to form a three-phase bridge power module, so Figure 1-2 Only three power modules are shown in the figure, and other embodiments may also include other numbers of power modules), a first capacitor electrode conductive layer 15, a second capacitor electrode conductive layer 16, a filter capacitor 17, an absorption capacitor 18, a heat sink 14, a capacitor plate 18, and a pressure plate 19. Among them, the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are stacked, the filter capacitor 17 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, the absorption capacitor 18 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, the first capacitor electrode conductive layer 15 is electrically connected to the first electrode conductive strip 7, the second capacitor electrode conductive layer 16 is electrically connected to the second electrode conductive strip 70, and the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are both arranged on the capacitor plate 18.

[0041] The plurality of power modules 100 are arranged in parallel on the heat sink 14, and the capacitor plate 18 is fixed to the heat sink 14 through a plurality of pressing plates 19, so that the first capacitor electrode conductive layer 15 is electrically connected to the first electrode conductive strip 7 on the power module, and the second capacitor electrode conductive layer 15 is electrically connected to the second electrode conductive strip 70 on the power module. The number and position of the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 correspond to the number of positions of the first electrode conductive strip 7 and the second electrode conductive strip 70 on the power module.

[0042] Specifically, the pressing plate 19 is fastened by passing a plurality of screws through screw holes on the capacitor plate 18 and the heat sink 14 , and the three power modules of the three-phase power module are firmly fastened by four pressing plates 19 .

[0043] Please continue to see the attached Figure 3 , is the installed power module 200. It can be seen that the installed power module 200 has a compact structure and can minimize parasitic inductance.

[0044] Please continue to see Figure 4 and 5 The first preferred embodiment of the power module 100 included in the power module 200 includes an insulating substrate 1, a first bridge arm conductive layer 2 disposed on the insulating substrate 1, and a plurality of first bridge arm power chips 3 ( Figure 4 and Figure 5 Only five first bridge arm power chips are shown in the figure), a second bridge arm conductive layer 4 arranged on the insulating substrate 1, and a plurality of second bridge arm power chips 5 ( Figure 4 and Figure 5 Only five second bridge arm power chips are shown in the figure), a first bridge arm electrode conductive layer 6 arranged on the insulating substrate 1, a first electrode conductive strip 7 arranged on the first bridge arm electrode conductive layer 6, a second electrode conductive strip 70 arranged on the second bridge arm conductive layer 4, an output electrode conductive layer 8 arranged on the insulating substrate 1, and an output electrode conductive strip 9 arranged on the output electrode conductive layer 8. Among them, the plurality of first bridge arm power chips 3 are electrically connected to the first bridge arm electrode conductive layer 6 respectively, the first bridge arm conductive layer 2 is electrically connected to the output electrode conductive layer 8 (in this embodiment, the first bridge arm conductive layer 2 and the output electrode conductive layer 8 can be a whole, of course, in other embodiments, the first bridge arm conductive layer 2 and the output electrode conductive layer 8 can also be made separately), and the plurality of second bridge arm power chips 5 are electrically connected to the output electrode conductive layer 8 respectively; wherein the first electrode conductive strip 7 is arranged adjacent to the plurality of first bridge arm power chips 3 and extends along the arrangement path of the plurality of first bridge arm power chips 3, and the second electrode conductive strip 70 is arranged adjacent to the plurality of second bridge arm power chips 5 and extends along the arrangement path of the plurality of second bridge arm power chips 5.

[0045] During operation, the driving current flows from the second electrode conductive strip 70 to the second bridge arm conductive layer 4, and then flows to the drain and source of the second bridge arm power chip 5 in sequence, is transmitted to the first bridge arm conductive layer 2, and then flows to the output electrode conductive layer 8, and then is output through the output electrode conductive strip 9. The freewheeling current is input from the first electrode conductive strip 7, flows to the source and drain of the first bridge arm power chip 3 through the first bridge arm electrode conductive layer 6, and then flows to the first bridge arm conductive layer 2 and the output electrode conductive layer 8 in sequence, and finally is output through the output electrode conductive strip 9.

[0046] In this embodiment, the plurality of second bridge arm power chips 5 are electrically connected to the first bridge arm conductive layer 2 , and further electrically connected to the output electrode conductive layer 8 .

[0047] Please continue to refer to Figure 6 and Figure 7 As shown, the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically arranged frame-shaped copper strips of equal height, the opening of the first electrode conductive strip 7 faces the first bridge arm power chip 3, and the opening of the second electrode conductive strip 70 faces the second bridge arm power chip 5. An outer frame 10 is fixedly arranged on the periphery of the insulating substrate 1, and a side through hole 11 is opened at the side of the outer frame 10 at the position of the first electrode conductive strip 7 and the second electrode conductive strip 70. The side through hole 11 corresponds to the shape of the first electrode conductive strip 7 and the second electrode conductive strip 70, and the size of the side through hole 11 is larger than the size of the first and second electrode conductive strips. The first and second electrode conductive strips are respectively arranged in the side through holes 11, and the top ends of the first and second electrode conductive strips are higher than the upper surface of the outer frame 10.

[0048] The output electrode conductive strip 9 is frame-shaped and matches the shape of the output electrode conductive layer 8. A front through hole 13 is provided at the front end of the outer frame 10 at the position of the output electrode conductive strip 9. The front through hole 13 corresponds to the shape of the output electrode conductive strip 9. The size of the front through hole 13 is larger than the size of the output electrode conductive strip 9. The output electrode conductive strip 9 is arranged in the front through hole 13, and its top end is higher than the upper surface of the outer frame 10.

[0049] The power module 100 further includes a gate lead-out plate 12 , which is disposed between the first and second bridge arm power chips and the output electrode conductive layer 8 . The output electrode conductive layer 8 is frame-shaped, and the gate lead-out plate 12 is located in a frame-shaped opening of the output electrode conductive layer 8 .

[0050] Please continue to refer to Figure 8-Figure 10As shown, it is a schematic diagram of the second preferred embodiment of the power module 100. The difference between the first embodiment and the first embodiment is that the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically arranged straight copper strips of equal height, and the output electrode conductive layer 8 is also a straight copper strip. At this time, the two straight conductive strips are respectively arranged on the two arms of the frame of the output electrode conductive layer 8, and two front through holes 14 are opened at the front end of the outer frame 10 at the position of the output electrode conductive strip 9. The front through holes 14 are straight and their size is larger than the size of the output electrode conductive strip 9. The output electrode conductive strip 9 is arranged in the front through holes 14, and the top of the output electrode conductive strip 9 is higher than the upper surface of the outer frame 10.

[0051] Please continue to refer to Fig.11 and Fig.12 As shown, it is a schematic diagram of the third preferred embodiment of the power module, which differs from the second preferred embodiment in that the output electrode conductive strip 9 includes two annular cylindrical conductive strips, and the two annular cylindrical conductive strips are arranged on both sides of the frame of the output electrode conductive layer 8, and two circular through holes are opened at the front end of the outer frame 10 at the position of the output electrode conductive strip 9, and the size of the circular through holes is larger than the size of the output electrode conductive strip 9, and the output electrode conductive strip 9 is arranged in the circular through holes, and the top end thereof is higher than the upper surface of the outer frame 10.

[0052] In the present invention, the upper ends of the first electrode conductive strip 7, the second electrode conductive strip 70 and the output electrode conductive strip 9 are at the same height. In addition, the positive electrode conductive strip 6, the negative electrode conductive strip 7 and the output electrode conductive strip 9 can also adopt other similar shapes, mainly straight strips or columnar structures, to reduce the generation of inductance. Of course, the structure of the outer frame 10 also needs to be changed accordingly according to the shape of the conductive strip.

[0053] The output electrode conductive strip 9 can also be replaced by a wiring nose, directly led out from the output electrode conductive layer 8. The connection between the first electrode conductive strip 7, the second electrode conductive strip 70 and the output electrode conductive strip 9 and the conductive layer is mainly crimped, or through conductive glue, or through welding to achieve good conductive performance. The outer frame 10 and the insulating substrate 1 are fixed by gluing or mortise and tenon joint.

[0054] Please continue to refer to Fig.13 As shown, it is a schematic diagram of the fourth preferred embodiment of the power module, the first bridge arm power chip and the second bridge arm power chip are both single-tube packaged chips, that is, the outside of the first bridge arm power chip and the second bridge arm power chip are wrapped with a layer of resin, and then the lead pins are electrically connected to the external circuit. Fig.13The figure shows a power module after packaging with a single tube package chip. After packaging, the bridge arm power chip forms a gate 20, a source 22 and a heat dissipation drain 23 to be electrically connected to other circuits.

[0055] Please continue to refer to Fig.14 and Fig.15 As shown, in the fifth preferred embodiment of the power module of the present invention, the first electrode conductive strip 7 and the second electrode conductive strip 70 are divided into two sections (in other embodiments, they can also be divided into multiple sections), so that the thermal stress between the electrode and the insulating substrate can be reduced without affecting the conductivity, and the thermal deformation of the insulating substrate can be reduced. This structure is particularly beneficial for modules with welded strip electrodes. In other embodiments, the first electrode conductive strip 7 and the second electrode conductive strip 70 can be continuously extended, and at least one partition is included in the middle.

[0056] Please continue to refer to Fig.16 As shown, in the sixth preferred embodiment of the power module of the present invention, the output electrode conductive strip 9 is divided into two sections (it can also be divided into multiple sections in other embodiments), so that the thermal stress between the electrode and the insulating substrate can be reduced without affecting the conductivity, and the thermal deformation of the insulating substrate can be reduced. This structure is particularly beneficial for modules with welded strip electrodes. In other embodiments, the output electrode conductive strip 9 can be continuously extended and include at least one partition in the middle.

[0057] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A power module, characterized in that: The invention comprises a plurality of power modules, a first capacitor electrode conductive layer, a second capacitor electrode conductive layer, a filter capacitor, and an absorption capacitor; each power module comprises an insulating substrate, a first bridge arm conductive layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, a second bridge arm conductive layer arranged on the insulating substrate, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, a first bridge arm electrode conductive layer arranged on the insulating substrate, a first electrode conductive strip arranged on the first bridge arm electrode conductive layer, a second electrode conductive strip arranged on the second bridge arm conductive layer, an output electrode conductive layer arranged on the insulating substrate, and an output electrode conductive strip arranged on the output electrode conductive layer; the plurality of first bridge arm power chips are electrically connected to the first bridge arm electrode conductive layer respectively, and the first bridge arm conductive layer is electrically connected to the first bridge arm electrode conductive layer. The first capacitor electrode conductive layer is electrically connected to the output electrode conductive layer, and multiple second bridge arm power chips are respectively electrically connected to the output electrode conductive layer; wherein, the first electrode conductive strip is adjacent to the multiple first bridge arm power chips and extends along the arrangement path of the multiple first bridge arm power chips, and the second electrode conductive strip is adjacent to the multiple second bridge arm power chips and extends along the arrangement path of the multiple second bridge arm power chips; the first capacitor electrode conductive layer and the second capacitor electrode conductive layer are stacked, the filter capacitor is electrically connected between the first capacitor electrode conductive layer and the second capacitor electrode conductive layer, the absorption capacitor is electrically connected between the first capacitor electrode conductive layer and the second capacitor electrode conductive layer, the first capacitor electrode conductive layer is electrically connected to the first electrode conductive strip, and the second capacitor electrode conductive layer is electrically connected to the second electrode conductive strip.

2. The power module according to claim 1, characterized in that: The plurality of second bridge arm power chips are electrically connected to the first bridge arm conductive layer, and further electrically connected to the output electrode conductive layer.

3. The power module according to claim 1, characterized in that: The first electrode conductive strip and the second electrode conductive strip are symmetrically arranged frame-shaped copper strips of equal height. The opening of the first electrode conductive strip faces the first bridge arm power chip, and the opening of the second electrode conductive strip faces the second bridge arm power chip.

4. The power module according to any one of claims 1 to 3, characterized in that: An outer frame is fixedly provided on the periphery of the insulating substrate, and side through holes are opened on the sides of the outer frame at the positions of the first electrode conductive strip and the second electrode conductive strip. The side through holes correspond to the shapes of the first electrode conductive strip and the second electrode conductive strip, and the size of the side through holes is larger than the size of the first and second electrode conductive strips. The first and second electrode conductive strips are respectively arranged in the side through holes, and the top ends of the first and second electrode conductive strips are higher than the upper surface of the outer frame.

5. The power module according to claim 4, characterized in that: The power module further comprises a gate lead-out plate, which is arranged between the first and second bridge arm power chips and the output electrode conductive layer. The output electrode conductive layer is frame-shaped, and the gate lead-out plate is located in the frame-shaped opening of the output electrode conductive layer.

6. The power module according to claim 5, characterized in that: The output electrode conductive strip is frame-shaped and matches the shape of the output electrode conductive layer. A front through hole is provided at the front end of the outer frame at the position of the output electrode conductive strip. The front through hole corresponds to the shape of the output electrode conductive strip. The size of the front through hole is larger than the size of the output electrode conductive strip. The output electrode conductive strip is arranged in the front through hole, and the top end thereof is higher than the upper surface of the outer frame.

7. The power module according to claim 4, characterized in that: The first electrode conductive strip and the second electrode conductive strip are symmetrically arranged straight copper strips with the same height.

8. The power module according to claim 7, characterized in that: The output electrode conductive strip includes two straight conductive strips, which are respectively arranged on two arms of the frame of the output electrode conductive layer. Two front through holes are opened at the front end of the outer frame at the position of the output electrode conductive strip. The front through holes are straight and their size is larger than that of the output electrode conductive strip. The output electrode conductive strip is arranged in the front through holes, and the top of the output electrode conductive strip is higher than the upper surface of the outer frame.

9. The power module according to claim 7, characterized in that: The output electrode conductive strip includes two annular cylindrical conductive strips, which are arranged on both sides of the frame of the output electrode conductive layer. Two circular through holes are opened at the front end of the outer frame at the position of the output electrode conductive strips. The size of the circular through holes is larger than the size of the output electrode conductive strips. The output electrode conductive strip is arranged in the circular through holes, and its top end is higher than the upper surface of the outer frame.

10. The power module according to claim 1, characterized in that: The upper ends of the first electrode conductive strip, the second electrode conductive strip and the output electrode conductive strip are at the same height.

11. The power module according to claim 1, characterized in that: The first bridge arm power chip and the second bridge arm power chip are both single-tube packaged chips, and the first and second bridge arm power chips are both formed with a gate, a source and a heat dissipation drain.

12. The power module according to claim 1, characterized in that: The first electrode conductive strip and / or the second electrode conductive strip are / is in a continuously extending shape.

13. The power module according to claim 12, characterized in that: The first electrode conductive strip and / or the second electrode conductive strip comprises at least one partition in the middle.

14. The power module according to claim 12, characterized in that: The output electrode conductive strip includes at least one partition in the middle.

15. The power module according to claim 1, characterized in that: It also includes a heat sink, and the plurality of power modules are arranged on the heat sink.

16. The power module according to claim 11, characterized in that: It also includes a capacitor plate, and the first capacitor electrode conductive layer and the second capacitor electrode conductive layer are both arranged on the capacitor plate.

17. The power module according to claim 16, characterized in that: It also includes a plurality of pressing plates, and the capacitor plate is fixed to the heat sink through the plurality of pressing plates.

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