Package structure with multiple substrates

Abstract

The present invention relates to a packaging structure with multiple substrates. Exemplary embodiments relate to an electronic module that may include a first direct bonded metal (DBM) substrate, a second DBM substrate, a housing member, and a plurality of connection terminals. The first DBM substrate and the second DBM substrate may be aligned along the same plane. The housing member may be coupled to the first substrate and the second substrate, and the housing member may include a plurality of openings in a surface of the housing member. The plurality of connection terminals may be electrically coupled to at least one of the first DBM substrate and the second DBM substrate, wherein the connection terminals from the plurality of terminals may extend through openings from the plurality of openings of the housing member.

Description

[0001] Related Applications

[0002] This application claims priority to and the benefit of U.S. Non-Provisional Application No. 15 / 993,169, filed on May 30, 2018, which claims priority to and the benefit of U.S. Provisional Application No. 62 / 670,506, filed on May 11, 2018, both of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates generally to electronic modules and, in particular, to electronic modules having multiple substrates. Background Art

[0004] Electronic modules may have predetermined sizes and shapes. Therefore, the components that can be used within the electronic modules may be limited. Therefore, systems, methods, and devices are needed to address the deficiencies of the prior art and provide other novel and innovative features. Summary of the invention

[0005] In one general aspect, an electronic module may include a first direct bonded metal (DBM) substrate, a second DBM substrate, a housing member, and a plurality of connection terminals. The first DBM substrate and the second DBM substrate may be aligned along a same plane. The housing member may be coupled to the first substrate and the second substrate, and the housing member may include a plurality of openings in a surface of the housing member. The plurality of connection terminals may be electrically coupled to at least one of the first DBM substrate and the second DBM substrate, wherein the connection terminals from the plurality of terminals may extend through openings from the plurality of openings of the housing member. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figures 1A to 1C are various views of an electronic module according to embodiments described herein.

[0007] FIG. 2A to FIG. 2I , Figure 2K and Figure 2L are various views of an electronic module according to another exemplary embodiment.

[0008] Figure 2J yes Figure 2H Partial view of the electronics module (left).

[0009] Figure 2M and Figure 2N is a perspective view of the housing.

[0010] FIG. 3A to FIG. 3H is a view of another example of an electronic module according to another exemplary embodiment.

[0011] Figure 4A and Figure 4BAn electronic module according to another exemplary embodiment is shown.

[0012] Figure 5 is a schematic diagram illustrating a method for producing one or more of the electronic modules described herein. DETAILED DESCRIPTION

[0013] The electronic modules described herein (e.g., power integrated modules (PIMs)) can be used to provide or switch power to electronic components or devices in many technical fields. One component used in the electronic modules described herein is a direct bonded metal (DBM) substrate (e.g., direct bonded copper (DBC)), which can be constructed to provide interconnections to form circuits. DBM substrates can be used in power modules because they have a low coefficient of thermal expansion to ensure the desired thermal cycling performance. DBM substrates also have excellent electrical insulation and desired thermal diffusion properties.

[0014] The configurations described herein can include multiple DBM substrates within a single electronic module. Thus, the types (and functions) of DBM substrates that can be used in an electronic module are not limited. The configurations described herein allow for different designs without limiting a certain size of DBM substrate that can be utilized (e.g., coupled within a housing member).

[0015] Figures 1A to 1C A schematic diagram of an exemplary electronic module 10 is shown in accordance with an exemplary embodiment. Figure 1A is a top view of the electronic module 10; Figure 1B is a bottom view of the electronic module 10; and Figure 1C It is along Figure 1B The electronic module 10 is shown in a cross-sectional view taken along line A1.

[0016] like Figure 1A As shown, the electronic module 10 may include a housing 100. In some embodiments, the housing 100 may be made of a molded material such as a thermosetting material or an elastomeric material. In some embodiments, the housing 100 may be formed by, for example, an injection molding process.

[0017] like Figure 1B and Figure 1CAs shown, the electronic module 10 may include a first DBM substrate 110A and a second DBM substrate 110B, which are coupled to the housing 100. In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B are at least partially disposed in the housing 100. In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B are at least partially disposed outside the housing 100. In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B may be mechanically coupled to the housing 100. In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B may be coupled to the housing 100 using an adhesive (e.g., glue) or the like.

[0018] In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B may be a direct bonded copper (DCB) substrate. In some embodiments, the first DBM substrate 110A and / or the second DBM substrate 110B may be a direct bonded aluminum (DCA) substrate or an active metal brazing (AMB) substrate. Figures 1A to 1C , but in some embodiments, one or more of the DBM substrates 110A, 110B may include a dielectric layer disposed between two metal layers. In some embodiments, one or more of the metal layers may be patterned and may include electrical traces.

[0019] like Figure 1C As shown, the housing 100 includes a cavity 131. Although not shown in Figure 1C Although shown in FIG. 1 , in some embodiments, housing 100 includes more than one cavity. In some embodiments, housing 100 may define more than one cavity.

[0020] In this embodiment, semiconductor die 180A and 180B may be coupled (e.g., electrically coupled) to DBM substrates 110A, 110B, respectively. In some embodiments, more or less than one semiconductor die may be coupled to one or more of DBM substrates 110A, 110B. Semiconductor die 180A, 180B may be disposed within cavity 131. In some embodiments, one or more of semiconductor die 180A, 180B may be a power semiconductor die. In some embodiments, one or more of semiconductor die 180A, 180B may include a vertical metal oxide semiconductor field effect transistor (MOSFET) device, a bipolar junction transistor (BJT) device, a diode device, an application specific integrated circuit (ASIC), a passive component (e.g., a resistor, a capacitor, an inductor), and the like.

[0021] In some embodiments, the first DBM substrate 110A and the second DBM substrate 110B may be disposed adjacent to each other (e.g., side by side, transversely). In other words, the first DBM substrate 110A and the second DBM substrate 110B may be aligned along the same plane (plane P1) (e.g., the same horizontal plane, the bottom surface of each DBM substrate is flush and along the same plane). In some embodiments, the first DBM substrate 110A and the second DBM substrate 110B may be aligned in the same plane (e.g., aligned so that the DBM substrates 110A, 110B intersect and are aligned in the same horizontal plane).

[0022] Although not shown, in some embodiments, the first DBM substrate 110A and the second DBM substrate 110B may be aligned along the same direction in different planes. For example, the first DBM substrate 110A may be aligned along a first plane parallel to the second plane, and the second DBM substrate 110B may be aligned along the second plane.

[0023] Compared to conventional electronic modules, the configuration of the first and second DBM substrates 110A, 110B within the electronic module 10 reduces size and weight and provides higher reliability, efficiency, and power density, thereby improving performance. It also provides simpler repair, maintenance, and design. In addition, the number of manufacturing steps for producing the electronic module can be reduced.

[0024] In some embodiments, each of the DBM substrates 110A, 110B includes a plurality of connection terminals 120 electrically coupled thereto. In some embodiments, the plurality of connection terminals 120 may be coupled (e.g., attached, welded) to a surface (e.g., top) of the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, the plurality of connection terminals 120 may extend within a cavity of the housing 100. More specifically, the plurality of connection terminals 120 extend upward toward the top surface 117 of the housing 100. In some embodiments, the plurality of connection terminals 120 may extend in the same direction (e.g., the connection terminals extend in a parallel direction relative to the other connection terminals). In some embodiments, the plurality of connection terminals 120 may extend in different directions (e.g., the connection terminals extend in a non-parallel (e.g., orthogonal) direction relative to the other connection terminals).

[0025] FIG. 2A to FIG. 2H An electronic module 10 according to an exemplary embodiment is shown. FIG. 2A to FIG. 2H The electronic module 10 shown is Figures 1A to 1C A variation of the electronics module shown. Figure 2A is a perspective view of the electronic module 10 (without the substrate); Figure 2B yes Figure 2A A top view of the electronic module 10; Figure 2C yes Figure 2A A bottom view of the electronic module 10; Figure 2D Is from Figure 2A A side view of an exemplary electronic module when viewed from the long side; Figure 2E Is from Figure 2A A side view of the electronic module 10 when viewed from the short side; Figure 2F yes Figure 2A An exploded view of the electronic module 10; Figure 2G yes Figure 2A A half-section view of the electronic module 10; Figure 2H yes Figure 2G A cross-sectional view of the electronic module 10; and Fig.2I is with Figure 2H An enlarged view of the area associated with section A is shown.

[0026] See also Figure 2A , the electronic module 10 includes a housing 100. In some embodiments, the housing 110 may be substantially rectangular in shape with two long sides 105 and two short sides 107. The housing 100 may be other shapes, such as a square. The housing 100 may include a plurality of openings 115 at a surface 117 (e.g., a top surface) of the housing 100. The plurality of openings 115 may receive a plurality of connection terminals 120 (also referred to as connection pins), so that each of the plurality of connection terminals 120 extends through a corresponding opening 115 and extends above (e.g., above) the surface 117 of the housing 100. These connection terminals 120 may be used to electrically connect to a device (e.g., a printed circuit board (PCB), an electronic component) (not shown) outside the electronic module 10.

[0027] In some embodiments, the surface 117 of the housing 100 may include a groove 130. The groove 130 may be formed so that the groove 130 is deep enough to accommodate a device (not shown) mounted thereon. In addition, the groove 130 may be used to fix the device mounted on the housing 100. In other words, the sidewall 133 formed by (around) the groove 130 prevents the device from moving or sliding.

[0028] In some embodiments, the housing 100 may include a countersunk hole 150 for receiving a fastening member (e.g., a screw). In some embodiments, the countersunk hole 150 may be provided at least on a long side (e.g., a longitudinal side) 105 of the housing 100. In some embodiments, the countersunk hole 150 may be provided at both long sides 107 of the housing 100. The countersunk hole 150 helps to relieve stress when tightening via the screw. In some embodiments, a flat washer (not shown) may be used in the countersunk hole 150 to prevent loosening.

[0029] In some embodiments, the countersunk hole 150 can be provided on an extension member 155 extending from the housing 100. In some embodiments, the extension member 155 can extend from both long sides 105 of the housing 100. In some embodiments, the extension member 155 can be integrally molded with the housing 100.

[0030] In some embodiments, the housing 100 may include through holes 162. In a certain embodiment, at least two (or more) through holes 162 are defined in the surface 117 of the housing 100. The through holes 162 may facilitate or allow heat to be transferred out of the housing 100 (e.g., a cavity of the housing 100), for example, from one or more semiconductor devices disposed therein.

[0031] See also Figure 2F The electronic module 10 may further include a first DBM substrate 110A (e.g., a direct bonded copper (DBC) substrate) and a second DBM substrate 110B (e.g., a direct bonded copper (DBC) substrate). The housing 100 may seal the first DBM substrate 110A and the second DBM substrate 110B and / or other devices and / or components (e.g., a semiconductor die) (not shown).

[0032] In some embodiments, each of the plurality of connection terminals 120 may be any type of suitable connection terminal, such as a snap-on terminal, a crimp terminal, a spring terminal, an interlocking terminal, etc., having similar mechanical and electrical functions.

[0033] See also Figure 2G , the housing 100 may include a first cavity 132 and a second cavity 134 defined within the housing 100. The first cavity 132 may correspond to the first DBM substrate 110A, and the second cavity 134 may correspond to the second DBM substrate 110B. The cavities 132, 134 have sufficient size or dimensions to include at least a portion of the DBM substrates 110A, 110B, respectively. Each of the cavities 132, 134 may have sufficient size or dimensions to include one or more semiconductor dies (not shown).

[0034] like Figure 2G and Figure 2H As shown, the housing 100 may also include a plurality of posts 141A, 141B, 141C, 141D, and 141E extending toward the first DBM substrate 110A and the second DBM substrate 110B. The posts 141A, 141E may define a wall of the housing 100. The post 141C may define a wall (e.g., an inner wall) within the housing 100. The posts 141A (or wall) and the posts 141C (or inner wall) may be contiguous parts of the same wall that define the cavity 132. The posts 141E (or wall) and the posts 141C (or inner wall) may be contiguous parts of the same wall that define the cavity 134.

[0035] The plurality of pillars 141A, 141B, 141C, 141D, and 141E may be aligned in a direction perpendicular to the surface 117 of the housing 100 (and / or the DBM substrates 110A, 110B). One or more of the plurality of pillars 141A, 141B, 141C, 141D, and 141E may be aligned in a direction perpendicular to the surface 117 of the housing 100 to provide structural support. In addition to the plurality of pillars 141A, 141B, 141C, 141D, and 141E acting as support members, one or more of the plurality of pillars 141A, 141B, 141C, 141D, and 141E may also form at least a portion of one or more of the cavities 132, 134. For example, pillars 141A and 141C may define at least a portion of the first cavity 132, and pillars 141E and 141C may define at least a portion of the second cavity 134.

[0036] In some embodiments, at least one of the plurality of pillars 141A, 141B, 141C, 141D, 141E may contact one or more of the DBM substrates 110A, 110B or may support one or more of the DBM substrates 110A, 110B. For example, pillars 141A, 141B, and 141C contact the surface of the first DBM substrate 110A. Pillars 141A and 141C contact the peripheral portion of the first DBM substrate 110A, and pillar 141B contacts the middle portion of the first DBM substrate 110A. Similarly, pillars 141C, 141D, and 141E contact the surface of the second DBM substrate 110B. Pillars 141C and 141E contact the peripheral portion of the second DBM substrate 110B, and pillar 141D contacts the middle portion of the second DBM substrate 110B.

[0037] like Figure 2H As shown, post 141C is in contact with both first DBM substrate 110A and second DBM substrate 110B. In some embodiments, the plurality of posts 141A, 141B, 141C, 141D, 141E may be glued or welded to first DBM substrate 110A and / or second DBM substrate 110B.

[0038] See also Fig.2I (It is Figure 2H 141C contacts both the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, the post 141C may include a first groove 146A and a second groove 146B. The first groove 146A may be configured to receive a portion of the first DBM substrate 110A, and the second groove 146B may be configured to receive a portion of the second DBM substrate 110B.

[0039] In some embodiments, the first DBM substrate 110A may be a laminate including a dielectric layer (e.g., a ceramic material such as Al2O3 or AlN) 112 disposed between a first metal layer 111A (e.g., copper metal) and a second metal layer 111B (e.g., copper metal). Similarly, the second DBM substrate 110B may be a laminate including a dielectric layer 114 disposed between a first metal layer 113A (e.g., copper metal) and a second metal layer 131B (e.g., copper metal). Fig.2I As shown, the first recess 146A of the pillar 141C contacts the portion 115 of the dielectric layer 112, and the second recess 146B of the pillar 141C contacts the portion 116 of the dielectric layer 114. Since the first and second recesses 146A, 146B of the pillar 141C contact the respective dielectric layers 112, 114 of the first and second DBM substrates 110A, 110B, the pillar 141C may have a greater height than some of the other pillars (e.g., pillars 141B and 141D).

[0040] In some embodiments, to achieve desired adhesion and stability, an adhesive may be disposed between the first recess 146A of the column 141C and the portion 115 of the dielectric layer 112, and between the second recess 146B of the column 141C and the portion 116 of the dielectric layer 114. In some embodiments, the recesses 146A, 146B may be around the respective perimeters of the DBM substrates 110A, 110B. In some embodiments, the first recess 146A may be defined within the housing 100 such that each side (of the 4 sides) of the DBM substrate 110A may be disposed with one side (of the 4 sides) of the first recess 146A. The recesses 146A, 146B may surround all or at least a portion of the cavities 132, 134, respectively. Similarly, the second recess 146B may be defined within the housing 100 such that each side of the DBM substrate 110B may be disposed with one side of the second recess 146B.

[0041] In some embodiments, the pillars 141A and 141E may contact the respective DBM substrates 110A, 110B in a similar manner as the pillar 141C described above, except that the pillars 141A and 141E contact only one side of the respective first and second DBM substrates 110A, 110B. More specifically, since the pillars 141A, 141C, and 141E have the same height (contacting the respective first and second DBM substrates 110A, 110B), the pillars 141A and 141C define the first cavity 132 within the housing 100, and the pillars 141E and 141C define the second cavity 134 within the housing 100. In other words, the perimeter of the first DBM substrate 110A surrounded (e.g., enclosed, bounded, surrounded, closed) by the pillars 141A and 141C may define the first cavity 132. Similarly, the perimeter of the second DBM substrate 110B surrounded by the pillars 141E and 141C may define a second cavity 134 .

[0042] Figure 2J is a schematic diagram showing a view of the housing 100 associated with the cavity 132. In some embodiments, as Figure 2J As shown, the height J1 of pillars 141A and 141C may be greater than (e.g., taller than) the height J2 of pillar 141B because pillar 141B contacts a portion (top surface) of first DBM substrate 110A, while pillars 141A and 141C contact portion 115 of first DBM substrate 110A. Thus, pillars 141A and 141C may have a height greater than the height of pillar 141B.

[0043] Figure 2K 1 shows a perspective view of an exploded view of the electronic module 10. In this view, the cavities 132, 134 and the columns 141B, 141D are shown. Figure 2K As shown, posts 141A, 141E define a wall of housing 100. Post 141C defines a wall (e.g., an inner wall portion) within housing 100. Post 141A (or wall portion) and post 141C (or inner wall portion) are contiguous parts of the same wall that define cavity 132. Post 141E (or wall portion) and post 141C (or inner wall portion) are contiguous parts of the same wall that define cavity 134. Post 141C has a first side wall (on a first side) that defines a portion of cavity 132 and a second side wall (on a second side) that defines a portion of cavity 134.

[0044] like Figure 2KAs shown, column 141C includes a first groove 146A and a second groove 146B. First groove 146A may be configured to receive a portion of first DBM substrate 110A, and second groove 146B may be configured to receive a portion of second DBM substrate 110B. First groove 146A surrounds cavity 132, and second groove 146B surrounds cavity 146B. Although not shown in FIG. Figure 2K , but column 141C (or a portion thereof) may be replaced with a bridge member, which will be described in more detail below. The bridge member may include (or define) a portion of one or more grooves surrounding one or more of these cavities (e.g., cavities 132, 134).

[0045] Figure 2L The DBM substrates 110A, 110B are shown coupled to the housing 100 (and coupled to (eg, at least partially disposed within) the recesses 146A, 146B). Figure 2M and Figure 2L is a schematic diagram showing a view of the housing 100 of the DBM substrates 110A, 110B and the cavities 132, 134 defined therein.

[0046] FIG. 3A to FIG. 3E An electronic module 20 according to another exemplary embodiment is shown. Figure 3A is a perspective view of the electronic module 20; Figure 3B yes Figure 3A A perspective view of DBM substrates 110A, 110B; Figure 3C yes Figure 3A A perspective view of a bridge member 170; Figure 3D yes Figure 3A A cross-sectional view of the electronic module 20; and Figure 3E is with Figure 3D An enlarged view of the area associated with portion B is shown.

[0047] See also Figure 3A , the electronic module 20 may include a housing 100 , a first DBM substrate 110A, and a second DBM substrate 110B. Figure 3A The electronic module 20 and Figure 2A The electronic module 10 is similar to the Figure 3A The electronic module 20 includes a bridge member 170. To simplify the description, similar elements will not be discussed in further detail in this section.

[0048] See also Figure 3B, bridge member 170 is disposed between first DBM substrate 110A and second DBM substrate 110B. Bridge member 170 may be configured to support first and second DBM substrates 110A, 110B. Bridge member 170 may eliminate the need for post 141C in some embodiments. In some embodiments, bridge member 170 may be disposed horizontally (e.g., laterally) between first DBM substrate 110A and at least a portion of second DBM substrate 110B.

[0049] In some embodiments, the bridge member 170 can have the same length (e.g., short side) as the first and second DBM substrates 110A, 110B. In other words, the bridge member 170 has a certain dimension or size so as to be disposed between (e.g., cover) the opening 190 between (e.g., between) the first and second DBM substrates 110A, 110B. Figure 2F More specifically, the column 141C is disposed between the openings 190 (as shown in FIG. Fig.2I Instead, the bridge member 170 may be disposed between the openings 190 (as shown). Figure 3E 140 ), the opening is located between the first and second DBM substrates 110A, 110B. In some embodiments, the post 141C can be located on the bridge member 170 .

[0050] The bridge member 170 has a longitudinal length aligned along a line Q1, which may be orthogonal to the direction in which the DBM substrates 110A, 110B are aligned. The longitudinal length of the bridge member 170 may be aligned along a plane in which the DBM substrates 110A, 110B are aligned.

[0051] In some embodiments, the bridge member 170 can be coupled to both the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, the bridge member 170 can be coupled to the first DBM substrate 110A and the second DBM substrate 110B using an adhesive. For example, the coupling mechanism (e.g., the attachment mechanism) can be or include an epoxy adhesive, solder, etc. The attachment mechanism can be used to couple (e.g., adhere) the bridge member 170 to the first DBM substrate 110A and / or the second DBM substrate 110B.

[0052] See also Figure 3D, the housing 100 may include a plurality of posts 141A, 141B, 141C, 141D, and 141E extending (from an inner surface of the housing 100) toward the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, some of the plurality of posts 141A, 141B, 141D, 141E may contact the first DBM substrate and the second DBM substrate 110A, 110B. In some embodiments, posts 141A and 141B may contact the first DBM substrate 110A, and posts 141D and 141E may contact the second DBM substrate 110B. Post 141C may contact the bridge member 170. Since post 141C contacts the bridge member 170, post 141C may be shorter than posts 141A, 141B, 141D, 141E. For example, as Figure 3F 141C can be the shortest post (as indicated by height F1) because post 141C contacts bridge member 170 (e.g., is supported thereby). Post 141B (and 141D) can be the next shortest post (as indicated by height F2) because post 141B contacts a portion (top surface) of first DBM substrate 110A. In other words, post 141B is longer than post 141C. Post 141A (and post 141E) can be the longest post (as indicated by height F3) because post 141A contacts portion 115 of first DBM substrate 110A. Thus, post 141A can be the tallest post compared to the height of posts 141B and / or 141C.

[0053] In some embodiments, posts 141A, 141B, 141C, 141D, and 141E may be coupled to first DBM substrate 110A, second DBM substrate 110B, and / or bridge member 170 using a coupling mechanism, such as an adhesive.

[0054] See also Figure 3E (It is Figure 3D 141C may contact a surface (e.g., an upper surface) of bridge member 170. In some embodiments, post 141C may be coupled to (contact, attach to) bridge member 170 using a coupling mechanism (such as adhesive 182). In some embodiments, adhesive 182 may be excluded. In some embodiments, bridge member 170 may be vertically disposed between post 141C and at least a portion of first DBM substrate 110A and / or second DBM substrate 110B (as shown along lines M1 and M2).

[0055] In certain embodiments, the bridge member 170 may contact the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, the bridge member 170 may include a first groove 172A and a second groove 172B. The first groove 172A may be configured to receive the portion 115 of the first DBM substrate 110A, and the second groove 172B may be configured to receive the portion 116 of the second DBM substrate 110B. In some embodiments, one or more of the grooves 172A, 172B may be configured to receive a different portion (different from 115, 116) (e.g., a metal portion) of the DBM substrates 110A, 110B. As previously discussed, the grooves 172A, 172B of the bridge member 170 may contact the dielectric layer portions (which correspond to the portions 115 and 116) of the first DBM substrate 110A and the second DBM substrate 110B.

[0056] In some embodiments, the first groove 172A and the second groove 172B can be on opposite sides of the bridge member 170. In some embodiments, the first groove 172A can be aligned along the longitudinal length of the bridge member 170 in parallel with the second groove 172B.

[0057] In some embodiments, the first and second DBM substrates 110A, 110B can be coupled to the respective grooves 172A, 172B of the bridge member 170 using adhesive 176 for greater adhesion and stability. The adhesive 176 can be excluded in some embodiments.

[0058] Return to see Figure 3C , the bridge member 170 may include a contact member 175 extending from a side of the bridge member. The contact member 175 may be configured to electrically connect the first DBM substrate 110A and the second DBM substrate 110B together. For example, the contact member 175 provides electrical contact with a metal layer (e.g., a copper layer) of the first DBM substrate 110A and a metal layer (e.g., a copper layer) of the second DBM substrate 110B.

[0059] In some embodiments, the contact member 175 can be disposed within the bridge member 170. In other words, the contact member 175 can extend through the bridge member 170. In one embodiment, one end of the contact member 175 can be coupled (e.g., electrically coupled, attached) to the first DBM substrate 110A, extend through the bridge member 170, and the other end of the contact member 175 can be coupled to the second DBM substrate 110B.

[0060] In some implementations, the contact member 175 can be coupled (eg, attached) to the first DBM substrate 110A and the second DBM substrate 110B using a conductive element 179 (such as solder, conductive epoxy, etc.).

[0061] like Figure 3E As shown, the bridge member 170 may have a surface aligned along the surface of the DBM substrates 110A, 110B (aligned along the plane M3). Specifically, the bridge member 170 may have a surface aligned along the surface of the dielectric layer of the DBM substrates 110A, 110B.

[0062] like Figure 3C As shown, the bridge member may include two contact members 175 extending through the bridge member and attached to the first DBM substrate 110A and the second DBM substrate 110B. In some embodiments, the contact member 175A may be disposed near (or within) one end 171 of the bridge member 170, and the contact member 175B may be disposed near (or within) the other end 173 of the bridge member 170. In some embodiments, the end 171 may be opposite the end 173. In some embodiments, there may be more or less than two contact members 175 extending through the bridge member 170 and attached to the first DBM substrate 110A and the second DBM substrate 110B.

[0063] In some embodiments, the contact member 175 can be made of a conductive material such as a metal (eg, copper). Other suitable metals and / or materials for electrical connection can be used.

[0064] In some embodiments, the contact member 175 may have a bent portion 177 that extends downward toward the first DBM substrate 110A and the second DBM substrate 110B. The bent portion 177 may be configured to reduce stress applied to the contact member 175.

[0065] In some embodiments, the bridge member 170 can be made of plastic (eg, high temperature plastic). For example, the plastic can be made of molding compound or other materials that can withstand several hundred degrees reflow temperature (eg, about 260 degrees Celsius for 10 minutes).

[0066] like Figure 3G As shown, an enlarged portion K of the bridge member 170 and the electronic module 20 is shown. Figure 3G As shown, the bridge member 170 has an extension portion 174. The extension portion 174 has a surface aligned along the surface of the DBM substrates 110A, 110B (aligned along plane R1). Specifically, the extension portion 174 of the bridge member 170 may have a surface aligned along the surface of the dielectric layer of the DBM substrates 110A, 110B. The extension portion 174 and the portions of the DBM substrates 110A, 110B (aligned on the same plane) may be configured to be disposed in a groove (e.g., a single groove) of the housing 100 when coupled to the housing 100. The bridge member 170 and the DBM substrates 110A, 110B may define a subassembly (e.g., a bridge-substrate subassembly).

[0067] Figure 3H is a schematic diagram showing a view of the housing 100 of the DBM substrates 110A, 110B and the cavities 132, 134 defined therein. Figure 3H A bridge member 170 is shown disposed on post 141C. Bridge member 170 includes (or defines) grooves 172A, 172B that abut portions of grooves 346A, 346B surrounding cavities 132, 134. Contact member 175 is not shown in this view.

[0068] Figure 4A and Figure 4B An electronic module 30 is shown according to some exemplary embodiments. Figure 4A and Figure 4B The electronic module 30 and Figure 2A The electronic module 10 of the embodiment of the present invention is similar to the electronic module 10 of the embodiment of the present invention, except that the countersunk hole 150 is located at a different position. More specifically, the countersunk hole 150 can be located at one end side wall (e.g., the shorter side) 107 of the housing 100. In some embodiments, the countersunk hole 150 can be located at both end side walls 107 of the housing 100. The countersunk hole 150 can be integrally molded with the housing 100.

[0069] In some embodiments, other substrates may be used instead of DBM, such as direct bonded aluminum (DBA) substrates, active metal brazing (AMB) substrates, etc. In some embodiments, the electronic module may include three or more DBM substrates. The three or more DBM substrates may have certain sizes and functions to fit within the housing of the electronic module.

[0070] In some embodiments, a heat sink may be attached to the electronic module. The heat sink may be used to dissipate heat from the electronic module. In some embodiments, the heat sink may be made of a thermally conductive material such as copper, aluminum, etc.

[0071] In some embodiments, a highly thermally conductive silicone grease may be applied to the DBM substrate. In one embodiment, the silicone grease may be applied between the DBM substrate and the heat sink. In some embodiments, the silicone grease may be applied to one surface of the DBM substrate. In some embodiments, the silicone grease may be applied to the entire surface of the DBM substrate attached to the base plate and / or heat sink.

[0072] Figure 5 is a schematic diagram illustrating a method for producing one or more of the electronic modules described herein. Figure 5A receiving housing is shown (block 510), and a first DBM substrate and a second DBM substrate are coupled to the housing such that the first DBM substrate and the second DBM substrate are aligned along the same plane (block 520). In some embodiments, the first DBM substrate (or an edge thereof, or a perimeter thereof) may be disposed within a first recess defined within the housing. The second DBM substrate (or an edge thereof, or a perimeter thereof) may be disposed within a second recess defined within the housing. The first recess may be separate from the second recess.

[0073] In some embodiments, a method may include moving a connection terminal from a plurality of terminals coupled to at least one of the first DBM substrate and the second DBM substrate through an opening from a plurality of openings defined in the housing member.

[0074] In some embodiments, the method may include coupling a bridge member to the housing. The bridge member may include a first groove and a second groove. The first groove may be configured to receive a portion of the first DBM substrate (e.g., a dielectric layer, a metal layer), and the second groove may be configured to receive a portion of the second DBM substrate (e.g., a dielectric layer, a metal layer). In some embodiments, the method may include electrically coupling the dielectric layer and / or the metal layer of the first DBM substrate to the groove of the bridge member. In some embodiments, the first end of the bridge member and the second end of the bridge member may be disposed within the groove of the housing.

[0075] In some embodiments, the method may include electrically coupling a bridge member to the first DBM substrate and the second DBM substrate (eg, Figure 3B ). In such embodiments, the bridge member and the DBM substrate (which is coupled to the bridge member) can define a subassembly that can be coupled to the housing. At least a peripheral portion of the subassembly can be disposed within a recess (e.g., a single recess) within the housing (e.g., a recess around the perimeter of the housing). In some embodiments, the subassembly including the bridge member and at least two substrates can be disposed within a single recess within the housing.

[0076] As described herein, coupling, attaching or joining may refer to gluing, soldering, welding or sintering or other types of attachment.

[0077] In at least one general aspect, an electronic module may include a first direct bonded metal (DBM) substrate and a second DBM substrate. The first DBM substrate and the second DBM substrate may be aligned along a same plane. The electronic module may include a housing member coupled to the first substrate and the second substrate, wherein the housing member includes a plurality of openings in a surface of the housing member; and a plurality of connection terminals electrically coupled to at least one of the first DBM substrate and the second DBM substrate, wherein the connection terminals from the plurality of terminals extend through openings from the plurality of openings of the housing member.

[0078] In some embodiments, the housing member includes a post within a cavity of the housing member, the post being in contact with the first DBM substrate. In some embodiments, the housing member includes: a cavity; a first post disposed within the cavity and in contact with the metal layer of the first DBM substrate; and a second post disposed within the cavity and in contact with the dielectric layer of the first DBM substrate. The length of the first post is shorter than the length of the second post, and the first post is aligned in a direction perpendicular to a surface of the housing member.

[0079] In one general aspect, a module may include: a column disposed within a cavity of a housing member; and a bridge member disposed vertically between the column and both a first substrate and a second substrate. The bridge member may be disposed horizontally between the first substrate and the second substrate.

[0080] In some embodiments, the module may include a bridge member. The housing member includes: a cavity; a first column disposed in the cavity and in contact with the metal layer of the first DBM substrate; and a second column disposed in the cavity and in contact with the bridge member, wherein the second column is shorter than the first column. In some embodiments, the module may include a column disposed in the cavity of the housing member and adhesively coupled to a portion of the first DBM substrate. In some embodiments, the module may include a bridge member including a first groove and a second groove, the first groove being configured to receive a portion of the first DBM substrate, and the second groove being configured to receive a portion of the second DBM substrate.

[0081] In some embodiments, the module may include a bridge member including a contact member extending on at least one side of the bridge member. In some embodiments, the module may include a bridge member including a contact member disposed within the bridge member and in electrical contact with a metal layer of a first DBM substrate and a metal layer of a second DBM substrate. In some embodiments, the contact member is welded to the metal layer of the first substrate and welded to the metal layer of the second substrate. In some embodiments, the DBM first substrate and the second DBM substrate are each a direct bonded copper (DBC) substrate.

[0082] In another general aspect, an electronic module may include a first direct bonded metal (DBM) substrate, a second DBM substrate, wherein the first DBM substrate and the second DBM substrate are aligned along a same plane. The module may include a bridge member disposed between the first DBM substrate and the second DBM substrate, wherein the bridge member includes a first groove and a second groove. The first groove is configured to receive a portion of the first DBM substrate, and the second groove may be configured to receive a portion of the second DBM substrate. The module may include a housing member coupled to the first substrate, the second substrate, and the bridge member.

[0083] In some embodiments, a first groove of the bridge member contacts a dielectric layer of the first DBM substrate, and a second groove of the bridge member contacts a dielectric layer of the second DBM substrate. In some embodiments, the module may include a column disposed within a cavity of the housing member and coupled to a portion of the bridge member. In some embodiments, the bridge member is vertically disposed between the column and at least a portion of the first DBM substrate and the second DBM substrate. In some embodiments, the bridge member includes: a first contact member disposed at a first end of the bridge member; and a second contact member disposed at a second end of the bridge member, the second end being opposite to the first end.

[0084] In yet another general aspect, a method may include receiving a housing and coupling a first DBM substrate and a second DBM substrate to the housing such that the first DBM substrate and the second DBM substrate are aligned along a same plane and such that connecting terminals from a plurality of terminals coupled to at least one of the first DBM substrate and the second DBM substrate extend through openings from a plurality of openings defined within the housing member.

[0085] In some embodiments, a method may include coupling a bridge member to a housing, the bridge member including a first groove configured to receive a portion of a first DBM substrate and a second groove configured to receive a portion of a second DBM substrate.

[0086] In some embodiments, the method may include electrically coupling at least one of a dielectric layer or a metal layer of the first DBM substrate to the groove of the bridge member. In some embodiments, the method may include electrically coupling the bridge member to the first DBM substrate and the second DBM substrate before coupling the first DBM substrate and the second DBM substrate to the housing.

[0087] The specific structural and functional details disclosed herein are merely representative and are intended only for purposes of describing example embodiments. Example embodiments may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

[0088] Some embodiments may be implemented using various semiconductor processing and / or packaging technologies. Some embodiments may be implemented using various types of semiconductor processing technologies associated with semiconductor substrates, including but not limited to, for example, silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), and the like.

[0089] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit these embodiments. As used herein, unless otherwise explicitly indicated in the context, the singular forms "a", "an", and "the" are intended to also include plural forms. It should also be understood that when the terms "comprise" and / or "include" are used in this specification, the presence of the features, steps, operations, elements, and / or parts is specified, but the presence or addition of one or more other features, steps, operations, elements, parts, and / or groups thereof is not excluded.

[0090] It should also be understood that when an element such as a layer, a region or a substrate is mentioned on another element, connected to another element, electrically connected to another element, coupled to another element or electrically coupled to another element, the element may be directly on another element, connected to another element, or coupled to another element or one or more intermediate elements may exist. On the contrary, when an element is mentioned directly on another element or layer, directly connected to another element or layer, or directly coupled to another element or layer, there is no intermediate element or layer. Although the term directly on, directly connected to or directly coupled to may not be used throughout the entire detailed description, the element shown as directly on an element, directly connected or directly coupled can be mentioned in this manner. The claims of the present application may be revised to narrate the exemplary relationship described in the specification or shown in the drawings.

[0091] As used in this specification, singular forms may include plural forms unless the context clearly indicates a specific case. Spatially relative terms (e.g., above, above, above, below, below, below, below, etc.) are intended to cover different orientations of the device in use or operation, in addition to the orientations shown in the drawings. In some embodiments, the relative terms above and below may include vertically above and vertically below, respectively. In some embodiments, the term adjacent may include lateral adjacent or horizontal adjacent.

[0092] Exemplary embodiments of the present invention are described herein with reference to cross-sectional views, which are schematic diagrams of idealized embodiments (and intermediate structures) of the exemplary embodiments. Therefore, due to, for example, manufacturing techniques and / or tolerances, variations in the shapes illustrated can be expected. Therefore, the exemplary embodiments of the present invention should not be interpreted as being limited to the specific shapes of the regions shown herein, but rather include shape deviations caused by, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the device regions, nor are they intended to limit the scope of the exemplary embodiments.

[0093] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, a "first" element may be referred to as a "second" element without departing from the teachings of the embodiments of the present invention.

[0094] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the inventive concept belongs. It should also be understood that unless explicitly defined as such herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the relevant technical background and / or this specification, and not interpreted as an idealized or overly formal meaning.

[0095] Although certain features of the described embodiments have been described as described herein, many modifications, alternatives, variations, and equivalents will now occur to those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover all such modifications and variations that fall within the scope of the embodiments. It should be understood that these modifications and variations are presented only by way of example, not limitation, and that various changes in form and detail may be made. In addition to mutually exclusive combinations, any part of the apparatus and / or method described herein may be combined in any combination. The embodiments described herein may include various combinations and / or sub-combinations of the functions, components, and / or features of the different embodiments described.

Claims

1. An electronic module, comprising: a first directly bonded metal DBM substrate; a second direct bonded metal DBM substrate, the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate being aligned along a same plane; a housing member coupled to the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate, the housing member defining a cavity and including a plurality of openings into the cavity through a surface of the housing member; and A plurality of connection terminals electrically coupled to at least one of the first direct bond metal (DBM) substrate and the second direct bond metal (DBM) substrate, connection terminals from the plurality of connection terminals extending through the cavity and openings from the plurality of openings of the housing member.

2. The electronic module according to claim 1, wherein the housing member comprises: a first pillar disposed within the cavity and in contact with the metal layer of the first direct bond metal DBM substrate; and A second pillar is disposed in the cavity and contacts the dielectric layer of the first direct bonded metal DBM substrate, the length of the first pillar is shorter than the length of the second pillar, and the first pillar is aligned in a direction perpendicular to the surface of the housing member.

3. The electronic module according to claim 1, further comprising: a column, the column being disposed in the cavity of the housing member; and A bridge member is vertically disposed between both the first direct bonding metal DBM substrate and the second direct bonding metal DBM substrate and the pillar, and is horizontally disposed between the first direct bonding metal DBM substrate and the second direct bonding metal DBM substrate.

4. The electronic module according to claim 1, further comprising: A bridge member includes a first groove configured to receive a portion of the first direct bond metal (DBM) substrate and a second groove configured to receive a portion of the second direct bond metal (DBM) substrate.

5. The electronic module according to claim 1, further comprising: A bridge member includes a contact member extending on at least one side of the bridge member.

6. The electronic module according to claim 1, further comprising: A bridge member includes a contact member disposed within the bridge member and in electrical contact with the metal layer of the first direct bonded metal DBM substrate and the metal layer of the second direct bonded metal DBM substrate.

7. An electronic module comprising: a first directly bonded metal DBM substrate; a second direct bonded metal DBM substrate, the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate being aligned along a same plane; a housing member coupled to the first direct bonded metal (DBM) substrate and the second direct bonded metal (DBM) substrate, the housing member comprising a plurality of openings in a surface of the housing member; and A plurality of connection terminals electrically coupled to at least one of the first direct bonded metal (DBM) substrate and the second direct bonded metal (DBM) substrate, a connection terminal from the plurality of connection terminals extending through an opening from the plurality of openings from the housing member, the housing member including a post within a cavity of the housing member, the post contacting the first direct bonded metal (DBM) substrate.

8. An electronic module comprising: a first directly bonded metal DBM substrate; a second direct bonded metal DBM substrate, the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate being aligned along a same plane; a bridge member disposed between the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate, the bridge member comprising a first groove and a second groove, the first groove being configured to receive a portion of the first direct bonded metal DBM substrate, and the second groove being configured to receive a portion of the second direct bonded metal DBM substrate; and A housing member is coupled to the first direct bonded metal (DBM) substrate, the second direct bonded metal (DBM) substrate, and the bridge member. 9 . The electronic module of claim 8 , wherein the first groove of the bridge member contacts the dielectric layer of the first direct bonded metal (DBM) substrate, and the second groove of the bridge member contacts the dielectric layer of the second direct bonded metal (DBM) substrate.

10. A method for producing an electronic module, comprising: a housing receiving at least a portion of the cavity defined; as well as A first direct-bonded metal DBM substrate and a second direct-bonded metal DBM substrate are coupled to the housing such that the first direct-bonded metal DBM substrate and the second direct-bonded metal DBM substrate are aligned along the same plane, and a connecting terminal from a plurality of terminals coupled to at least one of the first direct-bonded metal DBM substrate and the second direct-bonded metal DBM substrate extends through the cavity and through an opening from a plurality of openings defined in the housing and exposed to the cavity, the connecting terminal being perpendicular to the same plane and the alignment of the first direct-bonded metal DBM substrate and the second direct-bonded metal DBM substrate.

11. The method according to claim 10, further comprising: A bridge member is coupled to the housing, the bridge member including a first groove configured to receive a portion of the first direct bond metal (DBM) substrate and a second groove configured to receive a portion of the second direct bond metal (DBM) substrate.

12. The method according to claim 10, further comprising: A bridge member is electrically coupled to the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate before coupling the first direct bonded metal DBM substrate and the second direct bonded metal DBM substrate to the housing.

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