Heat sink for wireless charging and electronic device having the heat sink

Abstract

The present disclosure provides a heat sink for wireless charging and an electronic device having the heat sink, the electronic device comprising: a power module that wirelessly transmits or receives power, and the power module comprises a coil portion that generates a magnetic field; and a heat sink that is disposed on one side of the power module. The heat sink comprises a linear conductor that is arranged to overlap the coil portion and a planar conductor that is disposed along the periphery of the linear conductor.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0055445 filed in the Korean Intellectual Property Office on May 15, 2018, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0002] The following description relates to a heat sink for wireless charging and an electronic device having the heat sink. Background Art

[0003] Wireless transmission technology is widely used in various electronic devices including various communication terminals / portable terminals such as smartphones and wearable devices.

[0004] In order for electronic devices to implement such wireless transmission technology, a heat dissipation method for the coil used for wireless transmission is required.

[0005] When a general conductive heat sink is used, an eddy current may be generated due to the transmission of electromagnetic waves, and current loss may occur due to the eddy current.

[0006] Current losses due to eddy currents may cause extremely low efficiency of wireless transmission or may create new hot spots. Summary of the invention

[0007] This summary is provided to introduce selected concepts in a simplified form and further describe the concepts in the following detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to assist in determining the scope of the claimed subject matter.

[0008] In one general aspect, an electronic device includes: a power module that wirelessly transmits or receives power and includes a coil portion that generates a magnetic field; and a heat sink disposed on one side of the power module. The heat sink includes a linear conductor arranged to overlap the coil portion and a planar conductor disposed along the periphery of the linear conductor.

[0009] The heat sink may include a cutting portion including a cutout extending from an inner periphery of the planar conductor to an outer periphery of the planar conductor.

[0010] The planar conductor may be electrically connected to ground.

[0011] The heat sink may include an insulating layer to which the linear conductor and the planar conductor are attached.

[0012] The linear conductor may include a first linear conductor attached to the first surface of the insulating layer and a second linear conductor attached to the second surface of the insulating layer, and the planar conductor may include a first planar conductor attached to the first surface of the insulating layer and a second planar conductor attached to the second surface of the insulating layer.

[0013] The first linear conductor and the second linear conductor may face different directions.

[0014] The heat sink may include an interlayer connection conductor electrically connecting the first surface conductor and the second surface conductor.

[0015] One end of each of the linear conductors may be connected to the planar conductor.

[0016] The linear conductors may each include a first end and a second end opposite to the first end, and the linear conductors may be arranged such that first linear conductors having the first end connected to the planar conductor alternate with second linear conductors having the second end connected to the planar conductor.

[0017] Each of the linear conductors may have a line width of 200 μm or less.

[0018] The linear conductor and the planar conductor may be formed using the same material.

[0019] The linear conductors may be separated from each other so as not to contact each other.

[0020] The electronic device may include a housing configured to accommodate the coil part and the heat sink inside. A first surface of the heat sink may be attached to an inner surface of the housing, and a second surface of the heat sink may be attached to the coil part.

[0021] In another general aspect, a heat sink for wireless charging is provided, the heat sink being disposed between a power transmitting module and a power receiving module. The heat sink comprises: an insulating layer; a plurality of first linear conductors disposed on a first surface of the insulating layer and electrically disconnected from each other; and a plurality of second linear conductors disposed on a second surface of the insulating layer and electrically disconnected from each other and from the plurality of first linear conductors.

[0022] The plurality of first linear conductors may be arranged with their length directions along a first direction, and the plurality of second linear conductors may be arranged with their length directions along a second direction different from the first direction.

[0023] The planar conductor may be disposed along an outer circumference of the plurality of first linear conductors or an outer circumference of the plurality of second linear conductors.

[0024] The planar conductor may have a cutout extending from an inner periphery of the planar conductor to an outer periphery of the planar conductor.

[0025] In another general aspect, an electronic device includes: a coil layer including a coil wiring configured to generate a magnetic field; a magnetic layer disposed on a first surface of the coil layer; an insulating layer disposed on a second surface of the coil layer; and a conductive layer including a plurality of linear conductors disposed on the insulating layer in parallel to each other, and the linear conductors are arranged to overlap with the coil wiring.

[0026] The conductive layer may further include a planar conductor provided on the insulating layer and arranged along an outer circumference of a region where the plurality of linear conductors overlap the coil wiring.

[0027] The cutting portion may cut the planar conductor, and the cutting portion may be a linear slit connecting a region where the plurality of linear conductors and the coil wiring overlap with a region outside the planar conductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective view schematically illustrating an electronic device according to an example.

[0029] Figure 2 It is along Figure 1 A cross-sectional view taken along line I-I'.

[0030] Figure 3 It is schematically shown Figure 1 A plan view of the heat sink is shown in FIG.

[0031] Figure 4 It is along Figure 3 A cross-sectional view taken along line II-II'.

[0032] Figure 5A and 5B 1 are a plan view and a rear view showing a heat sink according to an example.

[0033] Figure 6 It is along Figure 5A A cross-sectional view taken along line III-III'.

[0034] Fig. 7A and 7B 1 are a plan view and a rear view showing a heat sink according to an example.

[0035] Fig. 8A and 8B 1 are a plan view and a rear view showing a heat sink according to an example.

[0036] Fig. 9A and 9B1 are a plan view and a rear view showing a heat sink according to an example.

[0037] Fig.10 It is along Fig. 9A A cross-sectional view taken along line IV-IV'.

[0038] Fig.11 is a cross-sectional view schematically illustrating an electronic device according to an example.

[0039] Fig.12 is a cross-sectional view schematically showing a heat sink according to an example.

[0040] In all drawings and detailed description, the same reference numerals refer to the same elements. The drawings may not be drawn to scale, and the relative sizes, proportions, and depictions of the elements in the drawings may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0041] The following specific embodiments are provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example and is not limited to the order of operations set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0042] The features described herein may be implemented in different forms and shall not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0043] Here, it is noted that the use of the term "may" with respect to an example or embodiment (e.g., with respect to what an example or embodiment may include or implement) means that there is at least one example or embodiment that includes or implements such features, while all examples and embodiments are not limited thereto.

[0044] Throughout the specification, when an element such as a layer, a region, or a substrate is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” another element, or one or more other elements may be present therebetween. In contrast, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present therebetween.

[0045] As used herein, the term "and / or" includes any one and any combination of any two or more of the associated listed items.

[0046] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, a first member, component, region, layer, or portion referred to may also be referred to as a second member, component, region, layer, or portion.

[0047] For ease of description, spatially relative terms such as "above", "above", "below", and "below" may be used herein to describe the relationship of one element to another element as shown in the drawings. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, the elements described as being "above" or "above" relative to other elements will then be "below" or "below" relative to the other elements. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein will be interpreted accordingly.

[0048] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" list the existence of the stated features, quantities, operations, components, elements and / or their combinations, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0049] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0050] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the disclosure of the present application are also feasible.

[0051] In describing the examples, a power transmission module that transmits power and a power reception module that receives and stores power are collectively referred to as a wireless charging device.

[0052] Figure 1 is a perspective view schematically illustrating an electronic device according to an example. Figure 2 It is along Figure 1 A cross-sectional view taken along line I-I'.

[0053] Reference Figure 1 and Figure 2 According to the example, the electronic device is a wireless charging device, which may include a wireless power transmitting device that wirelessly transmits power and / or a wireless power receiving device that wirelessly receives and stores power. In this example, the wireless power transmitting device includes a charging device 20, and the wireless power receiving device includes a portable terminal 10 that receives power from the charging device 20 and stores the received power.

[0054] The charging device 20 is an example of an electronic device having a heat sink, but is not limited to this configuration. The portable terminal 10 including a wireless power receiving device may be included in the electronic device of this example.

[0055] The charging device 20 is used to charge the battery of the portable terminal 10 by using the power receiving module 11 of the portable terminal 10 .

[0056] The charging device 20 may convert household AC power supplied from an external power source into DC power, convert the DC power into an AC voltage of a specific frequency, and then transmit wireless power to the outside through the power transmission module 30 .

[0057] The charging device 20 includes a voltage converter 22 , a power transmission module 30 , a housing 50 , and a heat sink 70 .

[0058] The voltage converter 22 converts the household AC power supplied from the external power source into DC power, converts the DC power into an AC voltage of a specific frequency, and then supplies power to the power transmission module 30. When the DC power is directly supplied, the voltage converter 22 converts the supplied DC power into an AC voltage of a specific frequency, and then supplies power to the power transmission module 30.

[0059] The voltage converter 22 may be provided in the form of a circuit board on which electronic components are mounted, but is not limited to this configuration.

[0060] The power transmission module 30 transmits the power transmitted from the voltage converter 22 to the outside.

[0061] The power transmission module 30 may include a magnetic portion 32 and a coil portion 35 .

[0062] The magnetic portion 32 is formed in a flat plate shape (or sheet shape), is disposed on one surface of the coil portion 35, and is fixedly attached to the coil portion 35. The magnetic portion 32 is provided to effectively form a magnetic circuit of a magnetic field generated by the coil wiring of the coil portion 35. The magnetic portion 32 is formed using a material that easily forms a magnetic circuit, for example, a ferrite sheet may be used.

[0063] Meanwhile, although not shown, a metal sheet may be added to the outer surface of the magnetic portion 32 to autonomously cut off electromagnetic waves and magnetic flux leakage. The metal sheet may be formed using aluminum or the like, but is not limited to such a material.

[0064] The power receiving module 11 may include a magnetic portion 12 and a coil portion 15 similar to the magnetic portion 32 and the coil portion 35 of the power transmitting module 30 , and may be configured similarly to the power transmitting module 30 .

[0065] The housing 50 may be entirely formed using an insulating resin material, and protect components included in the housing 50 from external influences. For example, the housing 50 may be formed using a polycarbonate (PC) material, but is not limited to this material.

[0066] The housing 50 may be formed in a flat cylindrical shape or a rectangular parallelepiped shape, and has an accommodation space in which the voltage converter 22 , the power transmission module 30 , and the heat sink 70 may be accommodated.

[0067] The housing 50 according to this example may be divided into an upper case forming a charging surface on which the portable terminal 10 is seated and a lower case coupled to a lower portion of the upper case to provide an accommodation space.

[0068] Since the upper case has an upper surface on which the portable terminal 10 is mounted, the upper surface is formed as a flat surface. The heat sink 70 is provided on the lower surface (or inner surface) of the upper case. Therefore, one surface of the heat sink 70 may be attached to the inner surface of the housing 50, and the other surface of the heat sink 70 may be attached to the coil portion 35. In addition, the other surface of the heat sink 70 may be opposite to one surface of the heat sink 70.

[0069] Figure 3 It is schematically shown Figure 1 A plan view of the heat sink shown in FIG. Figure 4 It is along Figure 3 A cross-sectional view taken along line II-II'.

[0070] Reference Figure 3 and Figure 4 , the heat sink 70 includes an insulating layer 77 and a conductive layer 71. In addition, the heat sink 70 can be divided into a magnetic flux transmission portion S1 and a heat dissipation portion S2 according to its position.

[0071] The insulating layer 77 defines the entire area of ​​the heat sink 70 , and serves as a supporting member to which the conductive layer 71 is bonded and fixed.

[0072] The conductive layer 71 may be disposed on one surface of the insulating layer 77. The coil part 35 of the power transmission module 30 may be disposed in surface contact with the other surface of the insulating layer 77. In addition, the other surface of the insulating layer 77 may be opposite to one surface of the insulating layer 77.

[0073] The insulating layer 77 may be formed using materials such as PET (polyethylene terephthalate), PC (polycarbonate), PES (polyethersulfone), PI (polyimide), PMMA (polymethyl methacrylate), COP (cycloolefin polymer), etc., but is not limited to such materials.

[0074] In this example, since the charging device 20 is formed in a disc shape, the insulating layer 77 is also formed in a disc shape. Accordingly, if the charging device 20 is formed in a rectangular shape, the insulating layer 77 may also be formed in a rectangular shape.

[0075] The conductive layer 71 is attached to one surface of the insulating layer 77 and includes a plurality of linear conductors 72 provided in the magnetic flux transmission portion S1 and one area-type conductor 73 provided in the heat dissipation portion S2 .

[0076] The magnetic flux transfer portion S1 is a region disposed at the center of the insulating layer 77 and may be defined as a region where a wireless power signal (eg, a magnetic field) is formed during a wireless charging process.

[0077] A plurality of linear conductors 72 are provided in the magnetic flux transmission portion S1. The linear conductors 72 are separated from the planar conductors 73 and are separated from each other by a certain distance. Therefore, the linear conductors 72 are electrically insulated from each other.

[0078] The linear conductors 72 may be arranged to be spaced apart from each other by a certain gap P and arranged in parallel. Accordingly, the wireless power signal may be smoothly transmitted to the portable terminal 10 by using the gap P between the linear conductors 72 .

[0079] Furthermore, since the linear conductors 72 are separated from each other, the formation of a closed loop of eddy current in the magnetic flux transfer portion S1 during the wireless power transmission process can be suppressed, and thus, the current loss due to the eddy current can be minimized.

[0080] Therefore, the width or thickness of the linear conductor 72, the distance of the gap P between the linear conductors 72, etc. may be changed to reduce eddy current and improve heat dissipation performance.

[0081] Meanwhile, in this example, the gap P between the linear conductors 72 is formed as an empty space, but the gap P may also be filled with an insulating material.

[0082] The magnetic flux transmission portion S1 is provided at a position facing the coil portion 35 of the power transmission module 30. Therefore, the area of ​​the magnetic flux transmission portion S1 is formed to be the same as or similar to the area of ​​the coil portion 35.

[0083] In this example, disposed opposite or facing each other means that the magnetic flux transmission portion S1 is disposed to overlap the coil portion 35 when the magnetic flux transmission portion S1 is projected onto the coil portion 35 in a state where the magnetic flux transmission portion S1 is stacked on the coil portion 35 .

[0084] Meanwhile, the area of ​​the magnetic flux transfer portion S1 generally facing the coil portion 35 is an area where the coil wiring for wireless charging is disposed in the coil portion 35. Therefore, when the coil wiring is not disposed throughout the entire coil portion 35 but is disposed only above a portion of the coil portion 35, the magnetic flux transfer portion S1 may be configured as an area corresponding to the area in the coil portion 35 where the coil wiring is disposed (rather than corresponding to the entire coil portion 35).

[0085] The heat dissipation portion S2 is a region provided along the outer circumference of the magnetic flux transmission portion S1 , and may be defined as a region of the heat dissipation sheet 70 that does not face the coil portion 35 or the coil wiring.

[0086] The surface conductor 73 which may be configured as a single conductor is provided in the heat dissipation portion S2. The surface conductor 73 is provided on the surface of the insulating layer 77 and is provided over the entire periphery of the magnetic flux transfer portion S1. The heat dissipation portion S2 may be defined as the entire region in which the surface conductor 73 is provided.

[0087] In this example, since the insulating layer 77 is formed in a disk shape, the surface conductor 73 is formed in a circular ring shape along the outer circumference of the magnetic flux transmission portion S1, but it is not limited to this configuration. When the insulating layer 77 is formed in a rectangular shape, the surface conductor 73 may also be formed in a rectangular ring shape.

[0088] Furthermore, the annular shape formed by the planar conductor 73 in this example is a ring shape having a portion cut away by the cut portion 74 and is not a complete ring shape. However, the present disclosure is not limited to this configuration and includes a case where the ring shape is formed as a complete ring shape.

[0089] Therefore, in this example, the planar conductor 73 being formed in a circular ring shape means including a case where the planar conductor 73 is formed in a complete ring shape and a case where the planar conductor 73 is formed in a partially broken ring shape.

[0090] Since the surface conductor 73 of this example is arranged along the periphery of the magnetic flux transmission portion S1, the surface conductor 73 is arranged in an area where there is no magnetic field or the magnetic field is minimal during wireless charging. However, eddy currents may also be generated in the surface conductor 73 due to leakage magnetic flux. Therefore, in order to suppress the generation of eddy currents in the surface conductor 73, the heat dissipation portion S2 is provided with a cutting portion 74.

[0091] The cut portion 74 cuts the planar conductor 73 in its radial direction to form a cut extending from the inner periphery to the outer periphery of the planar conductor 73. Therefore, the cut portion 74 is formed as a linear gap connecting the magnetic flux transmission portion S1 and the outside of the planar conductor 73.

[0092] The surface conductor 73 is formed in a partially broken ring shape, not a complete ring shape, so that it is possible to prevent an eddy current having a center concentric with the surface conductor 73 from occurring in the surface conductor 73 .

[0093] The planar conductor 73 may also be electrically connected to the ground of the charging device 20. The planar conductor 73 may also provide a function of shielding electromagnetic waves.

[0094] The conductive layer 71 may be formed of a metal material having excellent electromagnetic wave transmittance and thermal diffusivity. For example, the conductive layer 71 may selectively use any one of materials such as copper, iron, nickel, tin, zinc, gold, silver, etc., or alloys thereof.

[0095] In this example, both the linear conductor 72 and the planar conductor 73 are formed of the same material and are disposed on the insulating layer 77 with the same thickness. However, the present disclosure is not limited to such materials and such configurations. For example, various configurations may be feasible, such as the linear conductor 72 and the planar conductor 73 may be formed of different materials or may have different thicknesses.

[0096] Meanwhile, although not shown, the heat sink 70 of this example may further include an adhesive layer. The adhesive layer bonds the heat sink 70 to the housing of the electronic device or the power transmission module. Therefore, the adhesive layer may be added on the insulating layer 77 or on the conductive layer 71. The adhesive layer may include at least one of a polymer resin, an acrylic resin, an epoxy resin, an EPDM (ethylene propylene diene monomer) resin, a CPE (chlorinated polyethylene) resin, a silicone resin, a polyurethane, a urea resin, a melamine formaldehyde resin, a phenolic resin, and an unsaturated ester resin.

[0097] You can also Figure 6 The protective layer 79 shown in FIG. 7 serves as an adhesive member.

[0098] The heat sink 70 according to this example is provided between the power transmission module 30 and the power reception module 11 to dissipate heat generated from the power transmission module 30 or the power reception module 11 .

[0099] Meanwhile, when the conductive material is provided in the power transmission module 30 and the power reception module 11, an eddy current is generated in the conductive material. In this case, current loss may increase.

[0100] Accordingly, the linear conductor 72 of this example is constructed to have a width smaller than the width at which the skin effect may occur. The heat sink 70 of this example can be provided in an electronic device that performs wireless charging in a frequency band of 100 KHz to 150 KHz. Therefore, the linear conductor 72 of this example is constructed to have a line width of 200 μm or less. Since the magnetic flux used for wireless charging passes through the linear conductor 72, the charging efficiency is not affected. In addition, since the linear conductor 72 is constructed to have a fine line width, the generation of eddy currents is suppressed, and the losses caused by eddy currents can be minimized.

[0101] Heat generated from the power transmission module 30 or the power reception module 11 is quickly dissipated to the outside of the heat sink 70 through the linear conductor 72 and the surface conductor 73 , and thus the heat can be removed more effectively.

[0102] Furthermore, since the linear conductor 72 is arranged to cross the magnetic flux transfer portion S1, the heat generated in the magnetic flux transfer portion S1 quickly moves through the linear conductor 72 along the length direction of the linear conductor 72. Therefore, the heat dissipation effect can be enhanced.

[0103] Furthermore, the conductive layer 71 of the heat sink 70 may also perform a function of removing noise generated during the wireless charging process, thereby performing a function of an electromagnetic wave shielding filter in addition to the heat dissipation function.

[0104] Meanwhile, in this example, although the conductive layer 71 is provided on the insulating layer 77, the present disclosure is not limited to this configuration. For example, the insulating layer may also be arranged between the plurality of linear conductors 72 and the planar conductor 73 constituting the conductive layer 71. In this configuration, the insulating layer is provided on the same plane as the conductive layer 71, and has a function of physically connecting the linear conductors 72 and the planar conductors 73 separated from each other while maintaining electrical insulation.

[0105] The insulating layer may also be omitted, and the linear conductor 72 and the planar conductor 73 may be configured to be directly attached to the coil portion 35 of the power transmission module 30 .

[0106] Meanwhile, the present disclosure is not limited to the above-described configuration and various configurations are possible.

[0107] Figure 5A and 5B 1 and 2 are a plan view and a rear view showing a heat sink 70 according to an example. Figure 6 It is along Figure 5A A cross-sectional view taken along line III-III'. Figure 5A is a plan view of the heat sink 70, and Figure 5B Shown relative to Figure 5A The rear surface of the heat sink 70 after the III-III' axis is rotated.

[0108] Reference FIG. 5A to FIG. 6 In the heat sink 70 of this example, the conductive layers 71 a and 71 b are respectively provided on two surfaces of the insulating layer 77 that are opposite to each other.

[0109] The first conductive layer 71a disposed on the first surface of the insulating layer 77 includes a first linear conductor 72a and a first planar conductor 73a. The first linear conductor 72a and the first planar conductor 73a of the first conductive layer 71a are arranged in parallel with each other. Figure 4 The linear conductor 72 and Figure 4 The planar conductor 73 is constructed in the same manner, and therefore a detailed description thereof is omitted.

[0110] The second conductive layer 71 b disposed on the second surface of the insulating layer 77 includes a second linear conductor 72 b and a second planar conductor 73 b .

[0111] The second surface conductor 73b can be formed into a shape similar to or identical to the first surface conductor 73a. For example, when the first surface conductor 73a is projected onto the second surface conductor 73b, the first surface conductor 73a and the second surface conductor 73b can overlap to form the same shape. However, the present disclosure is not limited to this configuration. Various configurations may be feasible, for example, the direction of the cutting portion 74 is arranged differently or the size of the cutting portion 74 is formed differently.

[0112] The second linear conductor 72 b is configured in a similar manner to the first linear conductor 72 a , but is disposed in a different direction from the first linear conductor 72 a .

[0113] More specifically, with respect to the length direction, when the first linear conductor 72a is disposed in a first direction (eg, a direction perpendicular to the cutting portion 74), the second linear conductor 72b may be disposed in a second direction different from the first direction (eg, the same direction as the cutting portion 74).

[0114] In this example, the first direction and the second direction are at right angles to each other. Therefore, when the second linear conductor 72b is disposed at right angles to the first linear conductor 72a and projected onto the first linear conductor 72a, the second linear conductor 72b and the first linear conductor 72a may overlap in a lattice shape.

[0115] However, the present disclosure is not limited to this configuration. The angle between the first direction and the second direction may be configured as various angles (such as 30°, 45°, or 60°). The first direction and the second direction may also be configured as the same direction.

[0116] Since the insulating layer 77 is provided between the first linear conductor 72a and the second linear conductor 72b, the first linear conductor 72a and the second linear conductor 72b are not electrically connected to each other. However, since each of the first planar conductor 73a and the second planar conductor 73b can be electrically connected to the ground of the charging device 20, the first planar conductor 73a and the second planar conductor 73b can be electrically connected to each other.

[0117] The first surface type conductor 73a and the second surface type conductor 73b may be electrically connected to each other through an interlayer connection conductor 76 provided in the insulating layer 77. However, the present disclosure is not limited to this configuration.

[0118] Furthermore, in this example, the first conductive layer 71a and the second conductive layer 71b are provided in both the magnetic flux transfer portion S1 and the heat dissipation portion S2. However, the present disclosure is not limited to this configuration. Various configurations may be feasible, for example, the first conductive layer 71a and the second conductive layer 71b may be provided only in the magnetic flux transfer portion S1, or one of the first conductive layer 71a and the second conductive layer 71b may be provided in the heat dissipation portion S2 and the other of the first conductive layer 71a and the second conductive layer 71b may be provided in the magnetic flux transfer portion S1, or vice versa.

[0119] In this example, a protective layer 79 may be attached to the surface of the first conductive layer 71a and the surface of the second conductive layer 71b. The protective layer 79 may be formed using an insulating material similar to the insulating layer 77 and may be configured as an insulating film similar to the insulating layer 77.

[0120] In this example, the protective layer 79 is provided on the surfaces of both the first conductive layer 71a and the second conductive layer 71b. However, various configurations may be possible, for example, the protective layer 79 is provided on only one of the first conductive layer 71a and the second conductive layer 71b.

[0121] When the heat sink 70 is constructed as in this example, heat is dissipated through the first conductive layer 71a and the second conductive layer 71b. In addition, heat is quickly transferred in two different directions through the first linear conductor 72a and the second linear conductor 72b, thereby improving the heat dissipation effect.

[0122] Furthermore, since the conductive layers 71a and 71b are stacked in two layers, the electromagnetic wave shielding effect can be improved.

[0123] Fig. 7A and 7B are a plan view and a rear view showing a heat sink 70 according to an example. Here, Fig. 7A is a plan view of the heat sink 70, and Figure 7B Shown relative to Fig. 7A The rear surface of the heat sink 70 after rotation about the III-III' axis.

[0124] Fig. 7A and 7B The heat sink 70 shown in FIG. Figure 5A and Figure 5B The heat sink 70 shown in FIG. 1 is similarly constructed and differs in that the cutout portion ( Figure 5A 74).

[0125] If the cutout portion is omitted, there is a possibility that eddy currents will be generated in the planar conductors 73a and 73b provided in the heat dissipation portion S2. Figure 2 35) or the coil wiring is sufficiently separated, the cutting portion can be omitted.

[0126] Fig. 8A and 8B 1 and 2 are a plan view and a rear view showing a heat sink 70 according to an example. Fig. 8A is a plan view of the heat sink 70, and Figure 8B Shown relative to Fig. 8A The rear surface of the heat sink 70 after rotation about the III-III' axis.

[0127] Reference Fig. 8A and Figure 8B The heat sink 70 according to this example has the linear conductors 72a all connected to the planar conductors 73a and the linear conductors 72b all connected to the planar conductors 73b. Therefore, all the linear conductors 72a and 72b are also electrically connected to the ground of the charging device 20.

[0128] In addition, in this example, both ends of the linear conductors 72a and 72b are not connected to the planar conductors 73a and 73b, and only one end of the linear conductors 72a and 72b is connected to the planar conductors 73a and 73b. Both ends of the linear conductor 72a are alternately connected to the planar conductor 73a, and both ends of the linear conductor 72b are alternately connected to the planar conductor 73b. For example, a first end of the linear conductor 72a is connected to the planar conductor 73a, and a second end of the linear conductor 72a provided on one or both sides of the linear conductor 72a is connected to the planar conductor 73a.

[0129] With the above-described configuration, the formation of a closed loop in the conductive layers 71 a and 71 b can be suppressed.

[0130] In this example, two conductive layers 71a and 71b are provided on both sides of the insulating layer 77, and the first linear conductor 72a and the second linear conductor 72b are arranged in different directions. However, the present disclosure is not limited to this configuration. Figure 3 In the example of FIG. 7 , only one conductive layer may be configured to be included on one surface of the insulating layer 77 .

[0131] Fig. 9A and 9B 1 and 2 are a plan view and a rear view showing a heat sink 70 according to an example. Fig.10 It is along Fig. 9A A cross-sectional view taken along line IV-IV'. Fig. 9A is a plan view of the heat sink 70, and Fig. 9B Shown relative to Fig. 9A The rear surface of the heat sink 70 after rotation about the IV-IV' axis.

[0132] Reference FIG. 9A to FIG. 10 , the heat sink 70 according to this example does not have a heat dissipation portion, and is configured only as a magnetic flux transmission portion.

[0133] Compared with other examples, the heat dissipation performance may be slightly reduced, but the generation of eddy current may be suppressed to the greatest extent and thus the eddy current loss may be minimized.

[0134] Meanwhile, in this example, two conductive layers 71a and 71b are provided on both sides of the insulating layer 77, and the first linear conductor 72a and the second linear conductor 72b are arranged in different directions. However, the present disclosure is not limited to this configuration. Various configurations are possible, such as one surface of the insulating layer 77 being configured to include only one conductive layer (such as Figure 3 In the example of ), or the first linear conductor 72a and the second linear conductor 72b are arranged in the same direction.

[0135] Fig.11is a cross-sectional view schematically illustrating an electronic device according to an example.

[0136] Reference Fig.11 , the electronic device according to this example is a portable terminal 10 having a heat sink 70 , and the portable terminal 10 can wirelessly receive and store power supplied from a charging device 20 .

[0137] The portable terminal 10 includes a terminal body 2 , a power receiving module 11 , a housing 5 , and a heat sink 70 .

[0138] The power receiving module 11 and the heat sink 70 are accommodated in an internal space formed by the terminal body 2 and the housing 5 .

[0139] The terminal body 2 includes various elements for driving the electronic device, such as a circuit board, a display, and a battery.

[0140] The power receiving module 11 may include Figure 2 The magnetic portion 32 and the coil portion 35 of the power transmission module 30 are similar to the magnetic portion 12 and the coil portion 15 , and may be configured similarly to the above-described power transmission module 30 .

[0141] The power receiving module 11 is provided between the housing 5 and the terminal body 2 . The magnetic portion 12 of the power receiving module 11 is placed on one side of the terminal body 2 , and the coil portion 15 is provided between the magnetic portion 12 and the housing 5 .

[0142] The housing 5 may be entirely formed with an insulating resin material or a conductive material, and may protect components included therein from external influences.

[0143] The heat sink 70 is provided between the coil portion 15 and the housing 5. Figure 4 The heat sink 70 shown in FIG. 1 is a heat sink 70 , but the present disclosure is not limited to this configuration. Any heat sink in the above-mentioned embodiments may be selectively used.

[0144] Accordingly, the heat generated in the coil portion 15 of the portable terminal 10 is diffused toward the entire housing 5 through the heat dissipation portion, and is discharged to the outside of the portable terminal 10 .

[0145] Although the heat sink 70 is provided inside the portable terminal 10 in the example, the heat sink 70 may be provided on the outer surface of the housing 5 .

[0146] In addition, the portable terminal 10 in this example refers to a mobile phone (or a smart phone), but the present disclosure is not limited to such a device. Any electronic device that is portable and can perform wireless communication (such as a laptop, a tablet PC, a wearable device, etc.) may be included.

[0147] Fig.12is a cross-sectional view schematically showing a heat sink 70 according to an example.

[0148] Reference Fig.12 , the heat sink 70 according to this example is independently formed without being bonded to the electronic device.

[0149] The heat sink 70 may be manufactured by using a separate substrate, and when the portable terminal 10 is charged, the heat sink 70 may be disposed between the portable terminal 10 and the charging device 20 .

[0150] A separate connection member 61 may be included to connect the surface conductor 73b to ground. A wiring (such as an insulated wiring) may be used as the connection member 61, and the connection member 61 may have one end connected to the surface conductor 73b and the other end connected to the external ground from the outside of the heat sink 70.

[0151] Despite Fig.12 The example uses Figure 6 The heat sink 70 shown in FIG. 1 is shown in FIG. 3 , but the present disclosure is not limited to this configuration. Any heat sink in the above examples may be selectively used.

[0152] Furthermore, the heat sink 70 of this example may be provided with a protection member 60 for protecting the insulating layer 77 and the conductive layers 71a and 71b from the external environment. The protection member 60 may provide a receiving space in which the insulating layer 77 and the conductive layers 71a and 71b are arranged, and may be formed using an insulating material.

[0153] For example, the protective member 60 may be provided in a film form on the surfaces of the insulating layer 77 and the conductive layers 71a and 71b, or may be formed using a hard resin material. However, the present disclosure is not limited to such a material and such a configuration. The protective member 60 may be omitted.

[0154] As explained above, the heat sink and the electronic device including the same can minimize the current loss due to the eddy current to maintain the wireless transmission efficiency and achieve effective heat dissipation.

[0155] While examples have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the disclosure as defined in the appended claims.

[0156] For example, although a heat sink having only one insulating layer has been described as an example, the configuration of the present disclosure is not limited thereto. The insulating layer may be configured as a plurality of layers, and a plurality of conductive layers may also be configured between the insulating layers.

[0157] Furthermore, the above-described examples may be implemented in combination with each other.

[0158] Although the present disclosure includes specific examples, it will be apparent after understanding the disclosure of the present application that various changes can be made to these examples in form and detail without departing from the spirit and scope of the claims and their equivalents. The examples described here are considered to be descriptive only, not for the purpose of limitation. The description of the features or aspects in each example will be considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the components in the described system, architecture, device or circuit are combined in a different manner, and / or the components in the described system, architecture, device or circuit are replaced or added by other components or their equivalents, suitable results can be obtained. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be understood to be included in the present disclosure.

Claims

1. An electronic device, comprising: a power module configured to wirelessly transmit or receive power and including a coil portion configured to generate a magnetic field; as well as a heat sink disposed on one side of the power module and including a linear conductor arranged to overlap the coil portion and a planar conductor disposed along an outer circumference of the linear conductor, The heat sink further comprises an insulating layer, the linear conductor and the planar conductor are attached to the insulating layer, The linear conductor includes a first linear conductor attached to the first surface of the insulating layer and a second linear conductor attached to the second surface of the insulating layer, and the planar conductor includes a first planar conductor attached to the first surface of the insulating layer and a second planar conductor attached to the second surface of the insulating layer, The first linear conductor and the second linear conductor face different directions.

2. The electronic device according to claim 1, wherein: The heat sink further includes a cutting portion including a cutout extending from an inner periphery of the planar conductor to an outer periphery of the planar conductor.

3. The electronic device according to claim 1, wherein: The planar conductor is electrically connected to ground.

4. The electronic device according to claim 1, wherein: The heat sink further includes an interlayer connection conductor that electrically connects the first surface conductor and the second surface conductor.

5. The electronic device according to claim 1, wherein: One end of each of the linear conductors is connected to the planar conductor.

6. The electronic device according to claim 1, wherein: Each of the linear conductors has a line width of 200 μm or less.

7. The electronic device according to claim 1, wherein: The linear conductor and the planar conductor are formed of the same material.

8. The electronic device according to claim 1, wherein: The linear conductors are separated from each other so as not to contact each other.

9. The electronic device according to claim 1, further comprising a housing configured to accommodate the coil portion and the heat sink inside. in, A first surface of the heat sink is attached to an inner surface of the housing, and a second surface of the heat sink is attached to the coil part.

10. A heat sink for wireless charging, arranged between a power transmitting module and a power receiving module, the heat sink comprising: Insulation layer; A plurality of first linear conductors are disposed on the first surface of the insulating layer and are electrically disconnected from each other; as well as a plurality of second linear conductors disposed on the second surface of the insulating layer and electrically disconnected from each other and from the plurality of first linear conductors, The plurality of first linear conductors are arranged with their length directions pointing in a first direction, and the plurality of second linear conductors are arranged with their length directions pointing in a second direction different from the first direction. 11 . The heat sink according to claim 10 , further comprising a planar conductor disposed along outer circumferences of the plurality of first linear conductors or outer circumferences of the plurality of second linear conductors. 12 . The heat sink of claim 11 , further comprising a cutout in the surface conductor extending from an inner periphery of the surface conductor to an outer periphery of the surface conductor.

13. An electronic device comprising: a coil layer including coil wiring configured to generate a magnetic field; A magnetic layer, disposed on the first surface of the coil layer; An insulating layer, disposed on the second surface of the coil layer; as well as a conductive layer including a plurality of linear conductors provided on the insulating layer in parallel with each other, and the plurality of linear conductors are arranged to overlap with the coil wiring, The conductive layer further includes a planar conductor disposed on the insulating layer and arranged along the periphery of an area where the plurality of linear conductors overlap the coil wiring. The linear conductor and the planar conductor are attached to the insulating layer, The linear conductor includes a first linear conductor attached to the first surface of the insulating layer and a second linear conductor attached to the second surface of the insulating layer, and the planar conductor includes a first planar conductor attached to the first surface of the insulating layer and a second planar conductor attached to the second surface of the insulating layer, The first linear conductor and the second linear conductor face different directions.

14. The electronic device according to claim 13, further comprising a cutting portion for cutting the planar conductor, wherein: The cut portion is a linear gap that connects a region where the plurality of linear conductors and the coil wiring overlap with a region outside the planar conductor.

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