Circuit Board

Abstract

The embodiment of the present invention discloses a circuit board, including a circuit board body and a solder joint structure, wherein the solder joint structure includes a lead and a base. A plurality of solder joint structures are arranged in parallel and staggered on the circuit board body, wherein the leads of two adjacent solder joint structures are distributed on different surfaces of the solder joint body. A first solder joint area and a second solder joint area are provided on the base, and the solder joint area is used for soldering with the pins of the electronic component. The circuit board provided by the embodiment of the present invention can reduce the transmission impedance, increase the heat dissipation area, and increase the transmission power.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a circuit board. Background Art

[0002] PCB (Printed Circuit Board), whose Chinese name is printed circuit board, is also called printed circuit board. It is not only an important electronic component, but also a support for electronic components. Because it is made by electronic printing, it is also called printed circuit board. In recent years, with the continuous development of integrated circuit technology, the functions of printed circuit components have been continuously enhanced, especially the integration density of integrated circuits has been continuously increasing, the power requirements have been gradually increasing, and the signal frequency has been continuously rising. Printed circuits have gradually begun to emerge with more and more application problems. For example: the lead width is limited by the package size of the integrated circuit chip, so that the lower limit of the lead impedance is fixed, resulting in the problem of limited maximum transmission power; because the existing integrated circuit chips need to simultaneously arrange multiple pins (also called pins or leads) side by side to provide power transmission in parallel; thus, in traditional PCB technology, the following are adopted: Figure 1 The solder point lead method shown in the figure has the problem of serious signal interference between the leads due to the high density of the multiple solder point leads and the small spacing between the leads, and also limits the width of the leads. Summary of the invention

[0003] In view of this, the present invention provides a circuit board to solve the problems that the lower limit of the pin conduction impedance in the integrated circuit circuit board is difficult to reduce, the pin width is limited, and the signal interference between the pins is serious.

[0004] An embodiment of the present invention provides a circuit board, which includes a solder joint structure and a circuit board body, wherein the solder joint structure includes a lead (also called a pin, or a pin, or a signal line) and a base; the base of the solder joint structure penetrates the circuit board body, and a plurality of solder joint structures are arranged in parallel on the circuit board body, and the leads of at least one group of two adjacent solder joint structures are distributed on different surfaces of the circuit board body. In the embodiment of the present invention, the solder joint structures are arranged in parallel and staggered on the circuit board body, and the leads of adjacent solder joint structures are placed on different surfaces of the circuit board body, so that the distance between the leads is increased, thereby reducing the high-frequency signal interference between adjacent leads.

[0005] Furthermore, the solder joint structure also includes an extension portion, which is arranged at one end of the base; the extension portion extends in a direction where the lead is away from the base; the extension portion includes a first plane; the lead is arranged on the first plane; and the lead covers the first plane.

[0006] Furthermore, the lead includes a first end; the aforementioned extension portion includes a top surface, and the top surface is the aforementioned first plane; the first end of the lead is arranged on the top surface.

[0007] Furthermore, the thickness of the extension part is greater than the thickness of the lead and less than the difference between the thickness of the circuit board body and the thickness of the lead. The solder joint structure of the embodiment of the present invention ensures that when the cross-sectional area of ​​the lead or the cross-sectional area of ​​the base is greater than the contact area between the lead and the extension part, the contact area between the top surface of the extension part and the lead can be used as the area of ​​the narrowest conductive cross section in the solder joint structure, ensuring the narrowest conductive path of the solder joint structure and reducing the lower limit of the lead impedance.

[0008] Furthermore, the lead includes a second end, and a width of the second end of the lead is greater than a width of the first end of the lead.

[0009] Furthermore, the maximum value of the width of the second end of the lead is less than or equal to twice the width of the first end of the lead. When the width of the first end of the lead is determined, the width of the second end can be widened, and can be widened to twice the width of the first end at most. By widening the width of the lead, the area of ​​the lead is increased, the impedance of the lead is greatly reduced, the difference between the development and actual operation of integrated circuit (IC) components is reduced, and the reliability and life of the PCB circuit are improved; the heat dissipation area of ​​the lead is also greatly increased, the heat dissipation performance of the lead is improved, and the maximum transmission power is increased.

[0010] Furthermore, the solder joint structure includes a first solder joint area and a second solder joint area; the base includes a top end and a bottom end, the first solder joint area is located at the top end of the base, and the second solder joint area is located at the bottom end of the base.

[0011] Furthermore, the first solder joint area and the second solder joint area are of equal width. Setting the width of the solder joint areas on the solder joint structure to be equal can ensure that the two solder joint areas have the same soldering area when soldering the pins of the chip of the same specification, thereby ensuring a normal connection path.

[0012] Furthermore, the leads, the base and the extension part in the aforementioned circuit board are integrally formed.

[0013] By alternately arranging the solder joint structure in the circuit board and placing the positive and negative leads alternately on different surfaces of different circuit boards, the limitation of chip package size has been broken through, so that the lead width can be expanded while the relative distance between leads can be increased, reducing the high-frequency signal interference between adjacent leads. At the same time, the leads meet the requirements of the welding width of other components within the shortest distance, reducing the difficulty of wiring the circuit board.

[0014] Based on the implementations provided in the above aspects, the present invention can be further combined to provide more implementations. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of PCB solder joint leads in the prior art;

[0017] Figure 2 is a surface schematic diagram of a circuit board 200 provided in an embodiment of the present invention;

[0018] Figure 3 is a three-dimensional schematic diagram of a solder joint structure 300 provided in an embodiment of the present invention;

[0019] Figure 4 is a three-dimensional schematic diagram of a group of two adjacent welding structures 400 in a circuit board 200 provided in an embodiment of the present invention;

[0020] Figure 5 It is a three-dimensional schematic diagram of the connection between a circuit board and an electronic chip provided by an embodiment of the present invention;

[0021] Figure 6 It is a cross-sectional view of a double-sided IC chip direct connection on a PCB provided by an embodiment of the present invention;

[0022] Figure 7 It is a three-dimensional schematic diagram of another solder joint structure 700 provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] The embodiments of the present invention are described in detail below.

[0029] See also Figure 2 , is a schematic diagram of the surface of a circuit board 200 provided in an embodiment of the present invention. Figure 2 As shown, the circuit board 200 includes a circuit board body 201 and a plurality of solder joint structures 502. The solder joint structure 502 includes a lead and a base, and the base includes a top end and a bottom end, wherein the top end is connected to one end of the lead. The circuit board body 201 is divided into an upper surface and a lower surface. Figure 2 The upper surface is shown in FIG. 1 , and the lower surface is the other side. Figure 2 The bases of the plurality of solder joint structures 502 all penetrate the circuit board body 201, wherein the top and bottom ends of the bases and the leads connected to the top ends are exposed on the upper surface or the lower surface of the circuit board body 201. The plurality of solder joint structures 502 are arranged in parallel and staggered, wherein the leads of at least one group of two adjacent solder joint structures 502 are distributed on different surfaces of the circuit board body 501.

[0030] See also Figure 3 , is a three-dimensional schematic diagram of a solder joint structure 300 provided by an embodiment of the present invention. Figure 3As shown, the solder joint structure 300 includes a lead 301, a base 302 and an extension 303. The lead 301 is in the shape of a strip, wherein the narrower end (the end close to the base and the extension) is the first end of the lead 301, and the wider end (the end away from the base and the extension) is the second end of the lead 301. The first end of the lead 301 is integrally formed with the top of the base 302 and the extension 303. The width of the first end of the lead 301 is smaller than the width of the second end. The base 302 is in the shape of an oblate circle, wherein a first solder joint area 3021 is provided at the top, and a second solder joint area 3022 is provided at the bottom. The first solder joint area and the second solder joint area are used for soldering with an electronic chip. An extension 303 is also provided on the side of the base 302 near the top, and the extension is in the shape of a crescent column, and the extension 303 extends in the direction of the lead away from the upper end of the base 302. The extension 303 includes a first plane, which is a side on which the lead is provided. In this embodiment, the first plane is the upper surface of the extension portion 303. As shown in the figure, the upper surface of the extension portion 303 is covered by the lead 301, forming Figure 2 The dotted area E in FIG. 3 is the contact area between the extension portion 303 and the lead 301. In this embodiment, the thickness of the extension portion 303 is half of the thickness of the base portion 302; in some other embodiments, the thickness of the extension portion 303 is greater than the thickness of the lead 301, but less than the difference between the thickness of the base portion 302 and the thickness of the lead 301.

[0031] See also Figure 4 , is a three-dimensional schematic diagram of a group of two adjacent solder joint structures 400 in a circuit board 200 provided by an embodiment of the present invention. Figure 4 As shown in (a), 400 is a set of two adjacent solder joint structures on the circuit board 200. Figure 4As shown in (b), a group of solder joint structures 400 includes solder joint structures 401 and solder joint structures 402, wherein the lead and the top of the base of the solder joint structure 401 are placed at the top and exposed on the upper surface of the circuit board body, and the top surface is provided with a first solder joint area 4011, and the bottom of the base is placed at the bottom and exposed on the lower surface of the circuit board body, and the bottom surface is provided with a second solder joint area (not shown in the figure); the lead and the top of the base of the solder joint structure 402 are placed at the bottom and exposed on the lower surface of the circuit board body, and the top surface is provided with a first solder joint area (not shown in the figure) of the solder joint structure 402, and the bottom of the base is placed at the top and exposed on the upper surface of the circuit board body, and the bottom surface is provided with a second solder joint area 4022 of the solder joint structure 402. The solder joint structures are alternately arranged in the circuit board body, and the leads of two adjacent solder joint structures are one on the upper surface of the circuit board body and one on the lower surface of the circuit board body. Similarly, the first solder joint area and the second solder joint area are arranged in the same manner, that is, one of the first solder joint areas of the two adjacent solder joint structures is located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body; the second solder joint area is also located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body. On the same surface of the circuit board body, the first solder joint area is adjacent to the second solder joint area, and a minimum safety distance is maintained between the first solder joint area and the second solder joint area, which is equal to the distance between each lead in one side of the circuit board body. In this embodiment, the width of the first solder joint area and the second solder joint area are equal, and are both equal to the width of the first end of the lead.

[0032] See also Figure 5 , is a three-dimensional schematic diagram of a circuit board and an electronic chip connected according to an embodiment of the present invention. Figure 5 As shown, the electronic chip 501 is provided with a plurality of pins 5011, and the printed circuit board body 502 is provided with a queue formed by the aforementioned integrated circuit solder joint structure arranged in front and back, including a lead 5021, a first solder joint area 5022 and a second solder joint area 5023, wherein the width of the second end of the lead 5021 is twice that of the first end. In some other embodiments, the width of the second end is 1.5 times that of the first section. Each pin 5011 of the electronic chip 501 will be soldered to the first solder joint area 5022 or the second solder joint area 5023 on the printed circuit board body 502. Another electronic chip 503 is of the same type as the electronic chip 501, and includes a plurality of pins 5031, and each pin of the electronic chip 503 will be soldered to the first solder joint area and the second solder joint area on the lower surface of the printed circuit board body 502. The lead 5021 can be used to connect other electronic components or wires.

[0033] See also Figure 6 , is a cross-sectional view of a PCB double-sided IC chip direct connection provided by an embodiment of the present invention. Figure 6As shown, the solder joint structure runs through the circuit board body 601, wherein the lead 6021 and the first solder joint area (not shown in the figure) are located on the upper surface of the circuit board body 601, and the lower surface of the base 6023, that is, the second solder joint area (not shown in the figure) is located on the lower surface of the circuit board body, and the base 6023 is located in the circuit board body 601. The first solder joint area located on the upper surface can be welded to the pin 6031 of the electronic component 603, and the second solder joint area located on the lower surface can be welded to the pin 6041 of another electronic component 604. Through the above connection method, direct communication between two IC chips can be achieved.

[0034] See also Figure 7 , is a three-dimensional schematic diagram of another solder joint structure 700 provided by an embodiment of the present invention. Figure 7 As shown, the solder joint structure 700 includes a lead 701, a base 702, and an extension 703. The extension 703 is configured as a circular curved column, and includes a circular curved surface 7031. The circular curved surface is used to reduce electromagnetic interference and high-frequency signal corner reflection.

[0035] The solder joint structure of the embodiment of the present invention ensures that when the cross-sectional area of ​​the lead or the cross-sectional area of ​​the base is larger than the contact area between the lead and the extension part, the contact area between the top surface of the extension part and the lead can be used as the area of ​​the narrowest conductive cross section in the solder joint structure, ensuring the narrowest conductive path of the solder joint structure and reducing the lower limit of the lead impedance. When the width of the first end of the lead is determined, the width of the second end can be widened, and can be widened to twice the first end at most. By widening the width of the lead, the area of ​​the lead is increased, the impedance of the lead is greatly reduced, the difference between the development and actual operation of integrated circuit (IC) components is reduced, and the reliability and life of the PCB circuit are improved; the heat dissipation area of ​​the lead is greatly increased, the heat dissipation performance of the lead is improved, and the maximum transmission power is increased. By alternately arranging the solder joint structure in the circuit board and placing the leads alternately on different surfaces of different circuit boards, the limitation of the chip package size is broken, so that the relative distance between the leads can be increased while the lead width is expanded, and the high-frequency signal interference between adjacent leads is reduced. At the same time, the lead meets the requirements of the welding width of other components within the shortest distance, reducing the wiring difficulty of the circuit board.

[0036] The above are only some of the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field of the present invention can easily obtain various equivalent modifications or substitutions within the technical scope disclosed by the present invention without paying creative labor. These modifications or substitutions should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A circuit board, comprising a solder joint structure and a circuit board body, characterized in that: The solder joint structure comprises a lead and a base, the base of the solder joint structure penetrates the circuit board body, a plurality of the solder joint structures are arranged in parallel on the circuit board body, and the leads of at least one group of two adjacent solder joint structures are distributed on different surfaces of the circuit board body; The solder joint structure includes a first solder joint area and a second solder joint area; the base includes a top end and a bottom end, the first solder joint area is located at the top end, and the second solder joint area is located at the bottom end; the top end is connected to one end of the lead; one of the first solder joint areas of two adjacent solder joint structures is located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body; one of the second solder joint areas of two adjacent solder joint structures is located on the upper surface of the circuit board body, and the other is located on the lower surface of the circuit board body; The solder joint structure also includes an extension portion, which is arranged at one end of the base; the extension portion extends in a direction in which the lead is away from the base; the extension portion includes a first plane; the lead is arranged on the first plane; and the lead covers the first plane.

2. The circuit board according to claim 1, characterized in that: The lead includes a first end; the extended portion includes a top surface; and the top surface is the first plane.

3. The circuit board according to claim 2, characterized in that: The thickness of the extended portion is greater than the thickness of the lead, and less than the difference between the thickness of the circuit board body and the thickness of the lead.

4. The circuit board according to claim 2, characterized in that: The lead includes a second end having a width greater than that of the first end.

5. The circuit board according to claim 4, characterized in that: The maximum value of the width of the second end is less than or equal to twice the width of the first end.

6. The circuit board according to claim 5, characterized in that: The first solder joint area and the second solder joint area have the same width.

7. The circuit board according to claim 6, characterized in that: The first end is as wide as the first welding point area.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The lead is integrally formed with the base and the extension.

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