Sn-ball soldering disc cleaning mechanism

Abstract

The application provides a tin ball welding disc cleaning mechanism, which comprises a lower base plate, a ball separating disc and a rotating driving mechanism. The upper surface of the lower base plate is provided with a material falling port and a residue discharging slot at intervals. The ball separating disc is arranged on the upper surface of the lower base plate. The ball separating disc is provided with a plurality of ball separating holes in the circumferential direction. The material falling port and the residue discharging slot respectively face the circumferential line where the ball separating holes are located. The output end of the rotating driving mechanism is connected with the ball separating disc. The ball separating disc is driven to rotate by the rotating driving mechanism, so that the tin balls in the ball separating holes which do not fall into the material falling port fall into the residue discharging slot. When the tin balls do not effectively fall into the material falling port and are taken away by the ball separating disc, the upper surface of the lower base plate is also provided with the residue discharging slot which faces the circumferential line where the ball separating holes are located. Therefore, the tin balls taken away by the ball separating disc can fall into the residue discharging slot, so that the tin balls remaining in the ball separating holes of the ball separating disc are automatically cleaned without disassembly and cleaning, the ball supply efficiency is improved, and the ball separating disc cannot be stuck and cannot rotate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of tin ball welding, and particularly relates to a tin ball welding disc cleaning mechanism. BACKGROUND

[0002] At present, tin soldering is very popular in industrial production. With the development of technology and the rapid rise of labor costs, tin ball automatic welding equipment has replaced the traditional tin soldering mode of manual operation of electric soldering iron and become the main direction of the development of tin soldering technology.

[0003] In the ball separating mechanism of the existing tin ball automatic welding equipment, a substrate, a disc and a bottom plate are sequentially arranged from top to bottom, the substrate is provided with a first channel, the first channel is in communication with a ball storage space of a ball storage cylinder, the disc is provided with a ball separating hole, and the bottom plate is provided with a second channel in communication with a welding channel. By driving the disc to rotate, the tin balls in the first channel can fall to the second channel through the ball separating hole, so that the ball supply is realized. However, when the disc rotates to supply the ball, the tin ball may not effectively fall into the second channel (failure) and be taken away by the disc, and the ball remains in the ball separating hole of the disc, causing the tin ball to rub against the substrate and the bottom plate, resulting in the following disadvantages: the friction increases the torque, and even the disc is stuck, so that the disc cannot continue to rotate; the surface of the substrate and the bottom plate is damaged, the ball supply accuracy is reduced, and the service life of the ball separating mechanism is reduced; the damaged tin ball causes tin slag, causing pollution, and even the defective tin ball is sent to the work ball position for welding again, causing the welding defective product; the polluted ball separating mechanism needs to be disassembled and cleaned, which takes a long time, and needs to be reinstalled and debugged, affecting the production efficiency.

[0004] Therefore, there is an urgent need for a tin ball welding disc cleaning mechanism which can automatically clean the residual tin ball and has a long service life. SUMMARY

[0005] The present application aims to provide a tin ball welding disc cleaning mechanism which can automatically clean the residual tin ball and has a long service life.

[0006] To achieve the above-mentioned purpose, the present application provides a tin ball welding disc cleaning mechanism, which comprises a lower substrate, a ball separating disc and a rotating driving mechanism. The upper surface of the lower substrate is provided with a material falling port and a slag discharge slot in a spaced manner. The ball separating disc is arranged on the upper surface of the lower substrate. The ball separating disc is provided with a plurality of ball separating holes in the circumferential direction. The material falling port and the slag discharge slot respectively face the circumferential line where the ball separating holes are located. The output end of the rotating driving mechanism is connected with the ball separating disc. The ball separating disc is driven to rotate by the rotating driving mechanism, so that the tin ball in the ball separating hole which does not fall into the material falling port falls into the slag discharge slot.

[0007] Preferably, the inside of the lower substrate is provided with a slag discharge channel, one end of the slag discharge channel being in communication with the slag discharge slot.

[0008] Preferably, the other end of the slag discharge channel forms a slag discharge outlet on the side wall of the lower base plate.

[0009] Preferably, a vacuum generating device is further arranged at the slag discharge outlet and used for vacuumizing the slag discharge channel.

[0010] Preferably, an upper base plate is further arranged above the ball separating disc, the upper base plate is provided with a feeding channel, the feeding channel forms a feeding outlet on the lower surface of the upper base plate, the feeding outlet is opposite to the circumferential line where the ball separating holes are located, and the output end of the rotating driving mechanism penetrates through the upper base plate.

[0011] Preferably, the upper base plate is provided with a blowing hole, and the blowing hole is arranged opposite to the slag discharge notch.

[0012] Preferably, a blowing device is further arranged, and the output end of the blowing device is communicated with the blowing hole and used for blowing air to the blowing hole.

[0013] Preferably, a laser generator is further arranged, and the laser emitting direction of the laser generator is opposite to the blowing hole.

[0014] Preferably, a sealing ring is arranged between the lower base plate and the upper base plate and surrounds the ball separating disc.

[0015] Preferably, the lower surface of the upper base plate is provided with an annular groove, and the sealing ring is mounted in the annular groove.

[0016] Compared with the prior art, the rotating driving mechanism of the tin ball soldering disc cleaning mechanism can drive the ball separating disc to rotate, so that the tin balls located in the ball separating holes of the ball separating disc can fall into the feeding port. When the tin balls are not effectively fallen into the feeding port and are taken away by the ball separating disc, the upper surface of the lower base plate is further provided with the slag discharge notch opposite to the circumferential line where the ball separating holes are located, so that the tin balls taken away by the ball separating disc can fall into the slag discharge notch, thereby automatically and timely cleaning the tin balls remaining in the ball separating holes of the ball separating disc without disassembly and cleaning, improving the tin ball supply efficiency, avoiding the increase of the torque caused by the friction between the tin balls remaining in the ball separating holes and the lower base plate, thereby avoiding the ball separating disc from being stuck and unable to rotate, reducing the loss of the surface of the lower base plate, improving the service life of the tin ball soldering disc cleaning mechanism, and preventing the broken tin balls from falling into the feeding port again to ensure the soldering quality. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of the tin ball soldering disc cleaning mechanism.

[0018] Figure 2 is Figure 1An exploded view of the tin ball soldering disc cleaning mechanism.

[0019] Figure 3 A sectional view of the tin ball soldering disc cleaning mechanism of the present application.

[0020] Figure 4 is Figure 3 An enlarged view of A in FIG. 1.

[0021] Figure 5 is Figure 3 An enlarged view of B in FIG. 1.

[0022] Figure 6 A structural schematic view of the ball separating disc of the tin ball soldering disc cleaning mechanism of the present application.

[0023] Figure 7 A structural schematic view of the upper substrate of the tin ball soldering disc cleaning mechanism of the present application. DETAILED DESCRIPTION

[0024] In order to explain the technical content and structural features of the present application in detail, the following further explanation is made in combination with the embodiments and the accompanying drawings.

[0025] Please refer to Figures 1 to 5The tin ball welding disc cleaning mechanism 100 of the present application comprises a lower base plate 1, a ball separating disc 2, an upper base plate 3 and a rotating driving mechanism 4. The ball separating disc 2 is arranged on the upper surface of the lower base plate 1, and the upper base plate 3 is arranged above the ball separating disc 2, that is, the lower base plate 1, the ball separating disc 2 and the upper base plate 3 are arranged in sequence from bottom to top. Specifically, a separation piece 6 is arranged between the lower base plate 1 and the upper base plate 3, and the separation piece 6 is arranged in a spaced manner with the ball separating disc 2. In this embodiment, the separation piece 6 is arranged around the ball separating disc 2, but it is not limited thereto. The separation piece 6 can be arranged on one side or both sides of the ball separating disc 2 to separate the lower base plate 1 and the upper base plate 3. The upper surface of the lower base plate 1 is arranged with a material falling port 11 and a residue discharging slot 12 in a spaced manner. The upper base plate 3 is provided with a feeding channel 35. The feeding channel 35 forms a feeding outlet 31 on the lower surface of the upper base plate 3, and forms a feeding inlet 34 on the upper surface of the upper base plate 3. The tin balls can enter the feeding channel 35 from the feeding inlet 34 and drop out of the feeding outlet 31, but it is not limited thereto. The feeding inlet 34 can also be formed on the side wall of the upper base plate 3. The ball separating disc 2 is provided with a plurality of ball separating holes 21 in the circumferential direction. The material falling port 11, the residue discharging slot 12 and the feeding outlet 31 are respectively opposite to the circumferential line where the ball separating holes 21 are located. The rotating driving mechanism 4 is arranged on the upper base plate 3. The output end of the rotating driving mechanism 4 penetrates through the upper base plate 3 and is connected with the ball separating disc 2. The rotating driving mechanism 4 can drive the ball separating disc 2 to rotate, so that the tin balls 200 dropped out of the feeding outlet 31 fall into the material falling port 11 through the ball separating holes 21 of the ball separating disc 2. When the tin balls 200 are not effectively dropped into the material falling port 11 but are taken away by the ball separating disc 2, the rotating driving mechanism 4 continues to drive the ball separating disc 2 to rotate, so that the tin balls 200 in the ball separating holes 21 which are not dropped into the material falling port 11 fall into the residue discharging slot 12, thereby automatically cleaning the residual tin balls 200.

[0026] Please refer to Figures 2 to 5In the embodiment, the inner portion of the lower substrate 1 is provided with a residue discharging channel 13, one end of the residue discharging channel 13 is communicated with the residue discharging notch 12, so that the tin balls 200 falling into the residue discharging notch 12 can fall into the residue discharging channel 13. Specifically, the other end of the residue discharging channel 13 forms a residue discharging outlet 14 on the side wall of the lower substrate 1, so that the tin balls 200 located in the residue discharging channel 13 can be discharged from the residue discharging outlet 14. More specifically, the residue discharging notch 12 is an arc-shaped groove, which is also opposite to the circumferential line where the ball distributing holes 21 are located, so as to ensure that the tin balls 200 not falling into the material falling port 11 in the ball distributing holes 21 can all fall into the residue discharging notch 12 and then fall into the residue discharging channel 13 from the residue discharging notch 12. However, this is not limited, for example, the lower substrate 1 can only be provided with the residue discharging notch 12, the depth of the residue discharging notch 12 is greater than the diameter of the tin ball 200, so as to ensure that the tin ball 200 does not rub against the upper substrate 3 and the lower substrate 1, and the residual tin ball 200 is stored through the residue discharging notch 12, and the shape of the residue discharging notch 12 can be a long groove shape, so as to store more tin balls 200. In order to clean the residual tin balls 200 more conveniently and quickly, the tin ball soldering disc cleaning mechanism 100 of the present application is also provided with a vacuum generating device 5, which is arranged at the residue discharging outlet 14 and is used for vacuumizing the residue discharging channel 13. The vacuum generating device 5 is used for vacuumizing the residue discharging channel 13, so that the residue discharging channel 13 forms a vacuum, and the tin balls 200 located in the residue discharging channel 13 are sucked away.

[0027] Please refer to Figure 3 and Figure 5 In order to ensure that the tin balls 200 not falling into the material falling port 11 in the ball distributing holes 21 can all fall into the residue discharging notch 12, the tin ball soldering disc cleaning mechanism 100 of the present application is also provided with a blowing device, the upper substrate 3 is provided with a blowing hole 32, the blowing hole 32 is oppositely arranged with the residue discharging notch 12, and the output end of the blowing device (not shown in the figure) is communicated with the blowing hole 32 and is used for blowing the blowing hole 32. The blowing device is used for blowing the blowing hole 32, the tin balls 200 remaining in the ball distributing holes 21 of the ball distributing disc 2 are blown to fall into the residue discharging notch 12 and then fall into the residue discharging channel 13 from the residue discharging notch 12, so as to improve the cleaning efficiency of the residual tin balls 200. However, this is not limited, for example, the tin ball soldering disc cleaning mechanism 100 can be provided with a laser generator, the laser emitting direction of the laser generator is opposite to the blowing hole 32, the laser generator is used for emitting laser to knock down the tin balls 200 remaining in the ball distributing holes 21 of the ball distributing disc 2, so that the residual tin balls 200 are discharged from the residue discharging channel 13.

[0028] Please refer to Figure 2The sealing ring 7 is arranged between the lower substrate 1 and the upper substrate 3 and surrounds the ball separating disc 2, and specifically, the sealing ring 7 is arranged outside the separating disc 6. The sealing ring 7 seals the interval between the lower substrate 1 and the upper substrate 3, thereby ensuring the air tightness between the lower substrate 1 and the upper substrate 3, so that the air pressure can quickly reach the set value, thereby improving the ball supply speed, and the sealing ring 7 can reduce the processing requirements of the upper substrate 3, the lower substrate 1 and the separating disc 6 on the surface flatness and smoothness, thereby reducing the production cost. Further, the lower surface of the upper substrate 3 is provided with an annular groove 33, and the sealing ring 7 is installed in the annular groove 33. The annular groove 33 positions the sealing ring 7, facilitating the installation of the sealing ring 7.

[0029] Please refer to Figure 3 、 Figure 4 and Figure 7 The tin ball welding disc cleaning mechanism 100 further comprises a ball storage cylinder 8 installed on the upper substrate 3 and communicating with the feeding inlet 34. The ball storage cylinder 8 is used for storing tin balls 200 and feeding the tin balls 200 to the feeding inlet 34. The tin balls 200 in the ball storage cylinder 8 can enter the feeding channel 35 through the feeding inlet 34, and then fall into the ball separating holes 21 of the ball separating disc 2 from the feeding outlet 31, thereby realizing ball feeding. Specifically, the feeding outlet 31 is an arc-shaped groove, which can reduce the friction between the upper substrate 3 and the ball separating disc 2 on the one hand, and improve the ball feeding efficiency on the other hand. Further, the lower surface of the upper substrate 3 is provided with an arc-shaped groove 36 corresponding to the ball separating disc 2, and the groove 36 is arranged in a spaced manner with the feeding outlet 31. By arranging the groove 36, the friction between the upper substrate 3 and the ball separating disc 2 is further reduced.

[0030] Please refer to Figure 1 The rotating drive mechanism 4 comprises a rotating motor 41 and a rotating shaft 42. The output end of the rotating motor 41 is connected with the rotating shaft 42 and can drive the rotating shaft 42 to rotate. The rotating shaft 42 is connected with the ball separating disc 2, and specifically, the rotating shaft 42 is inserted into the center position of the ball separating disc 2. The rotating motor 41 drives the rotating shaft 42 to rotate, thereby driving the ball separating disc 2 to rotate.

[0031] In combination Figures 1 to 7 The specific working principle of the tin ball welding disc cleaning mechanism 100 is as follows:

[0032] The tin balls 200 in the storage cylinder 8 enter the feeding channel 35 through the feeding inlet 34. The rotation driving mechanism 4 drives the ball distributing disc 2 to rotate, so that the tin balls 200 located in the feeding channel 35 fall into the ball distributing holes 21 of the ball distributing disc 2 through the feeding outlet 31 respectively. When one of the ball distributing holes 21 of the ball distributing disc 2 rotates to correspond to the feeding port 11 of the lower base plate 1, the tin ball 200 located in the ball distributing hole 21 can fall into the feeding port 11, and the tin ball 200 can fall into the conveying channel of the lower base plate 1 through the feeding port 11 of the lower base plate 1 to perform laser welding by using the tin ball 200. If the tin ball 200 located in the ball distributing hole 21 is not effectively fallen into the feeding port 11 but is taken away by the ball distributing disc 2, when the tin ball 200 taken away by the ball distributing disc 2 rotates to a position corresponding to the slag discharging groove 12 of the lower base plate 1, the tin ball 200 remaining in the ball distributing hole 21 will fall into the slag discharging channel 13 through the slag discharging groove 12, and the vacuum generating device 5 performs vacuumization on the slag discharging channel 13, so as to quickly take away the remaining tin ball 200, thereby realizing cleaning of the remaining tin ball 200.

[0033] In summary, the rotation driving mechanism 4 of the tin ball welding disc cleaning mechanism 100 can drive the ball distributing disc 2 to rotate, so that the tin ball 200 located in the feeding outlet 31 falls into the feeding port 11 through the ball distributing hole 21 of the ball distributing disc 2. When the tin ball 200 is not effectively fallen into the feeding port 11 but is taken away by the ball distributing disc 2, since the upper surface of the lower base plate 1 is also provided with the slag discharging groove 12 opposite to the circumferential line where the ball distributing hole 21 is located, the tin ball 200 taken away by the ball distributing disc 2 can fall into the slag discharging groove 12, thereby automatically cleaning the tin ball 200 remaining in the ball distributing hole 21 of the ball distributing disc 2 in real time without disassembly and cleaning, improving the tin ball 200 supply efficiency, avoiding the tin ball 200 remaining in the ball distributing hole 21 from rubbing against the upper base plate 3 and the lower base plate 1 to increase the torque, thereby avoiding the ball distributing disc 2 from being stuck and unable to rotate, reducing the damage to the surfaces of the upper base plate 3 and the lower base plate 1, improving the service life of the tin ball welding disc cleaning mechanism 100, and preventing the broken tin ball 200 from falling into the feeding port 11 again, thereby ensuring the welding quality.

[0034] The above only discloses the preferred examples of the present application, and cannot limit the scope of the rights of the present application. Therefore, equivalent changes made according to the claims of the present application are all within the scope of the present application.

Claims

1. A soldering ball dishing cleaning mechanism, characterized by, The application relates to a tin ball separating device, which comprises a lower substrate, a tin ball separating disc, a rotating driving mechanism and a vacuum generating device, wherein the upper surface of the lower substrate is provided with a material dropping hole and a residue discharging slot in a spaced manner; the tin ball separating disc is arranged on the upper surface of the lower substrate; the tin ball separating disc is provided with a plurality of tin ball separating holes in a circumferential direction; the material dropping hole and the residue discharging slot respectively face the circumferential line where the tin ball separating holes are located; the output end of the rotating driving mechanism is connected with the tin ball separating disc; the tin ball separating disc is driven to rotate by the rotating driving mechanism, so that the tin balls in the tin ball separating holes which do not fall into the material dropping hole drop into the residue discharging slot; the residue discharging slot is in the shape of a long slot, so as to store more tin balls; the inside of the lower substrate is provided with a residue discharging channel; one end of the residue discharging channel is communicated with the residue discharging slot; the other end of the residue discharging channel forms a residue discharging outlet on the side wall of the lower substrate; the vacuum generating device is arranged on the residue discharging outlet and is used for vacuumizing the residue discharging channel.

2. The solder dolly cleaning mechanism of claim 1, wherein, The application further comprises an upper substrate, which is arranged above the tin ball separating disc; the upper substrate is provided with a material feeding channel; the material feeding channel forms a material feeding outlet on the lower surface of the upper substrate; the material feeding outlet faces the circumferential line where the tin ball separating holes are located; the output end of the rotating driving mechanism penetrates through the upper substrate.

3. The solder dolly cleaning mechanism of claim 2, wherein, The upper substrate is provided with a gas blowing hole, which is arranged opposite to the residue discharging slot.

4. The solder dolly cleaning mechanism of claim 3, wherein, The application further comprises a gas blowing device, the output end of which is communicated with the gas blowing hole and is used for blowing gas to the gas blowing hole.

5. The solder dolly cleaning mechanism of claim 3, wherein, The application further comprises a laser generator, the laser emitting direction of which faces the gas blowing hole.

6. The solder dolly cleaning mechanism of claim 2, wherein, A sealing ring is arranged between the lower substrate and the upper substrate and surrounds the tin ball separating disc.

7. The solder dolly cleaning mechanism of claim 6, wherein, The lower surface of the upper substrate is provided with an annular groove, and the sealing ring is arranged in the annular groove.

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