A three-dimensional on-line monitoring method and device for warping deformation and defects of a packaging module

Abstract

The present invention belongs to the technical field of encapsulation module monitoring, and discloses a three-dimensional on-line monitoring method and device for warping deformation and defects of an encapsulation module. The first warping information of a to-be-tested encapsulation module sample is obtained through a projection moire module, the second warping information of the to-be-tested encapsulation module sample is obtained through an ultrasonic module, and monitoring result information is obtained according to the first warping information and the second warping information. The present invention solves the problem in the prior art that the warping deformation and defects of the encapsulation module cannot be monitored on line, and can monitor the failure condition of the encapsulation module of an electronic device on line.

Description

Technical Field

[0001] The present invention relates to the technical field of package module monitoring, and in particular to a three-dimensional on-line monitoring method and device for warping deformation and defects of a package module. Background Art

[0002] At present, integrated circuit technology has penetrated into all fields of industry and social life, and the electronics industry has become the largest industry today. The development of the electronics industry and the wide application of its products have had an extremely profound impact on aspects such as the global economy and culture. From the perspective of both science and technology and economic development, the importance of semiconductors is extremely great.

[0003] In most current electronic products, the core units in computers, mobile phones or digital recorders are extremely closely related to semiconductors. The packaging technology of electronic devices is one of the key links restricting the development of integrated circuits. The warping problem caused by the differences in the sizes and material properties of various materials (substrate, adhesive layer, chip, and packaging material) during the packaging of electronic devices under the action of a large temperature difference has seriously affected the reliability, solderability, and yield of electronic devices. Therefore, the warping problem of electronic devices has become a major obstacle to the further development of electronic packaging technology.

[0004] In the semiconductor process, as various material layers and various semiconductor device structures are formed on the wafer surface, various stresses are generated on the wafer surface, causing the wafer to warp during the process. In the most ideal state, the wafer should not warp. Even if it cannot be completely flat, in the ideal state, the warping of the wafer should be a bowl shape that warps from the edge towards the front of the wafer and is symmetric about the vertical central axis of the wafer; in actual situations, due to the asymmetry of the stress on the front of the wafer, various asymmetrical warping forms of the wafer often occur, resulting in the wafer being prone to warping defects, leading to partial chip failure or even chip fragmentation.

[0005] In the prior art, it is difficult to achieve on-line monitoring of warpage defects of electronic devices in industrial production. There are many measurement methods for warpage deformation, such as electronic speckle interferometry, shadow moiré, projection moiré, and digital image correlation method (DIC), etc. These methods have their specific measurement accuracies and application scenarios, and their measurement areas and ranges are also different. Electronic speckle interferometry is not suitable for the measurement and monitoring of large-area warpage deformation such as wafers due to its expensive high-power laser. Shadow moiré is also not suitable for the measurement and monitoring of large-area warpage deformation due to the problem of its optical path setting. The digital image correlation method is not suitable for samples that cannot be surface-pretreated because a layer of speckles with specific gray levels needs to be sprayed on the surface of the sample. The projection moiré method is a modern optical measurement technology developed in the 1970s, and is mostly used for the detection of in-plane deformation, out-of-plane displacement, and surface topography. With the advantages of non-contact, fast, full-field measurement, high resolution, and high accuracy, the projection moiré method is widely used in many fields such as biological and medical detection, product detection, and reverse engineering. At present, there are mature equipment products for the projection moiré technology both at home and abroad, and the measurement accuracy for warpage is relatively high, reaching an accuracy of up to 1.5 microns. However, due to its own principle, the projection moiré technology can only measure the surface of an object and basically does not have the penetration ability, so its ability to detect internal defects of products is weak.

[0006] In addition, for the warpage deformation and defects of electronic devices, in the current industrial production process, usually only offline detection is carried out after the electronic devices fail. This method not only has a complex process and requires a large number of equipment, but also takes a long time and has poor test effects, and is not very helpful for improving the production process of electronic devices. How to effectively and reliably on-line monitor the warpage state of electronic devices is an urgent problem to be solved in current industrial production. Summary of the Invention

[0007] By providing a method and device for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module, the embodiments of the present application solve the problem that in the prior art, the warpage deformation and defects of a packaging module cannot be on-line monitored.

[0008] The embodiments of the present application provide a device for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module, including: a projection moiré module, an ultrasonic module, and a monitoring and analysis module;

[0009] The monitoring and analysis module is respectively connected to the projection moiré module and the ultrasonic module;

[0010] The projection moiré module is used to obtain the first warpage information of the packaging module sample to be measured;

[0011] The ultrasonic module is used to obtain the second warpage information of the packaging module sample to be measured;

[0012] The monitoring and analysis module is used to obtain monitoring result information based on the first warping information and the second warping information.

[0013] Preferably, the projection moiré module includes: a CCD camera and a grating projector;

[0014] The grating projector is used to project a grating onto the surface of the sample of the package module to be measured;

[0015] The CCD camera is used to continuously capture and collect the change of the grating on the surface of the sample of the package module to be measured to obtain the first warping information.

[0016] Preferably, the projection moiré module further includes: a first synchronous trigger;

[0017] The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronous trigger;

[0018] The grating projector is a grating projector array composed of multiple grating projectors.

[0019] Preferably, the ultrasonic module includes: an air-coupled ultrasonic probe, an ultrasonic signal transmitter-receiver, and a preamplifier;

[0020] The air-coupled ultrasonic probe is connected to the ultrasonic signal transmitter-receiver, the ultrasonic signal transmitter-receiver is connected to the preamplifier, and the preamplifier is connected to the monitoring and analysis module.

[0021] Preferably, the ultrasonic module further includes: a second synchronous trigger;

[0022] The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group is connected to the second synchronous trigger.

[0023] Preferably, the monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device;

[0024] The data storage device is used to store the information from the projection moiré module and the ultrasonic module and transmit it to the data analysis device;

[0025] The data analysis device is used to obtain warping deformation information based on the first warping information, obtain warping defect information based on the second warping information, and obtain the monitoring result information based on the warping deformation information and the warping defect information;

[0026] The monitoring display device is used to display the monitoring result information.

[0027] Preferably, the three-dimensional on-line monitoring device for warping deformation and defects of the encapsulation module further includes: an optical three-dimensional measurement calibrator;

[0028] The optical three-dimensional measurement calibrator is used for calibrating the internal parameters, external parameters and height of the camera.

[0029] Preferably, the three-dimensional on-line monitoring device for warping deformation and defects of the encapsulation module further includes: a planar placement table;

[0030] The sample of the encapsulation module to be measured is placed on the planar placement table.

[0031] On the other hand, the embodiment of the present application provides a three-dimensional on-line monitoring method for warping deformation and defects of an encapsulation module. Using the above device, the method includes the following steps:

[0032] Obtain the first warping information of the sample of the encapsulation module to be measured through the projection moire module;

[0033] Obtain the second warping information of the sample of the encapsulation module to be measured through the ultrasonic module;

[0034] Obtain the monitoring result information according to the first warping information and the second warping information.

[0035] Preferably, through the ultrasonic module, the second warping information is obtained by using the transmission method, the surface reflection method, the bottom surface reflection method of the V transmission method, and the bottom surface reflection method of the surface wave.

[0036] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0037] In the embodiment of the present application, the first warping information of the sample of the encapsulation module to be measured is obtained through projection moire, and the second warping information of the sample of the encapsulation module to be measured is obtained through ultrasonic waves. Then, the first warping information and the second warping information are combined and analyzed to obtain the monitoring result information, so as to realize the on-line monitoring of the failure situation of the encapsulation module of the electronic device in the actual industrial production process, changing the deadlock of the offline detection of the failed products in the industrial circle in the past. Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions in this embodiment, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are an embodiment of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 It is a schematic structural diagram of a three-dimensional on-line monitoring device for warping deformation and defects of an encapsulation module provided in Embodiment 1 of the present invention;

[0040] Figure 2 Schematic structural diagram of a three-dimensional on-line monitoring device for warpage deformation and defects of a packaging module provided in Embodiment 2 of the present invention;

[0041] Figure 3 Schematic structural diagram of a three-dimensional on-line monitoring device for warpage deformation and defects of a packaging module provided in Embodiment 3 of the present invention;

[0042] Figure 4 Schematic diagram of the principle of ultrasonic detection in a method for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module provided in Embodiment 4 of the present invention;

[0043] Figure 5 Schematic diagram of the principle of ultrasonic detection in a method for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module provided in Embodiment 5 of the present invention;

[0044] Figure 6 Schematic diagram of the principle of ultrasonic detection in a method for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module provided in Embodiment 6 of the present invention;

[0045] Figure 7 Schematic diagram of the principle of ultrasonic detection in a method for three-dimensional on-line monitoring of warpage deformation and defects of a packaging module provided in Embodiment 7 of the present invention. Detailed implementation manners

[0046] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementation manners.

[0047] This embodiment provides a three-dimensional on-line monitoring device for warpage deformation and defects of a packaging module, mainly including: a projection moiré module, an ultrasonic module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected to the projection moiré module and the ultrasonic module.

[0048] The projection moiré module is used to obtain the first warpage information of the packaging module sample to be measured; the ultrasonic module is used to obtain the second warpage information of the packaging module sample to be measured; the monitoring and analysis module is used to obtain the monitoring result information according to the first warpage information and the second warpage information.

[0049] The following further illustrates the present invention with specific embodiments.

[0050] Embodiment 1:

[0051] A three-dimensional on-line monitoring device for warpage deformation and defects of a packaging module provided in Embodiment 1 includes: a projection moiré module, an ultrasonic module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected to the projection moiré module and the ultrasonic module.

[0052] Among them, the projection moiré module includes: a CCD camera and a grating projector; the grating projector is used to project a grating onto the surface of the packaging module sample to be measured; the CCD camera is used to continuously photograph and collect the grating changes on the surface of the packaging module sample to be measured to obtain the first warpage information.

[0053] In a preferred solution, the projection moiré module further includes: a first synchronous trigger; the CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronous trigger; the grating projector is a grating projector array composed of multiple grating projectors.

[0054] Connect the first synchronous trigger and multiple CCD cameras respectively through data lines, and then connect the first synchronous trigger to a workstation (i.e., the monitoring and analysis module) that controls photographing and analysis. The first synchronous trigger is used to ensure that multiple CCD cameras can be triggered to take pictures simultaneously when taking pictures, so as to ensure that the pictures taken at the same moment can be synthesized into a single whole picture in the workstation.

[0055] Using a CCD camera array can realize on-line monitoring of large-area packaging modules and can improve the limitation of the camera's field of view size. Measuring through an array composed of multiple cameras, for example, the field of view of a 16-CCD camera array is 600*600mm, and the measurement accuracy can reach 4 microns, and the accuracy can reach 1.5 microns under a 240*240mm field of view. By using 64, 100, 200 or even more cameras to form an array in the present invention, it is theoretically possible to measure warpage deformation and defects under an infinitely large area.

[0056] The number of the grating projectors theoretically depends on whether the grating projected by the projector covers the entire surface of the packaging module sample to be measured. In order to achieve an infinitely large measurement area in theory, by increasing the number of grating projectors, that is, assembling the grating projectors in an array, the purpose of large-area monitoring can be achieved.

[0057] Among them, the ultrasonic module includes: an air-coupled ultrasonic probe, an ultrasonic signal transmitter-receiver, and a preamplifier; the air-coupled ultrasonic probe is connected to the ultrasonic signal transmitter-receiver, the ultrasonic signal transmitter-receiver is connected to the preamplifier, and the preamplifier is connected to the monitoring and analysis module.

[0058] According to application requirements, the air-coupled ultrasonic probe can be any one of a planar probe, a point-focusing probe, and a line-focusing probe. For example, a planar probe is suitable for large-area planar detection, and a point-focusing probe is suitable for detecting large objects with a larger thickness.

[0059] The preamplifier can improve the signal-to-noise ratio of the system, reduce the relative influence of external interference, facilitate reasonable layout, adjustment and use, and realize impedance conversion and matching.

[0060] In a preferred embodiment, the ultrasonic module further includes: a second synchronization trigger; the air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes; and the array-type air-coupled ultrasonic probe group is connected to the second synchronization trigger.

[0061] When online monitoring is performed on a large-area package module, a single ultrasonic probe may not be able to cover the entire area to be detected, so an array of air-coupled ultrasonic probes can be used to achieve large-area coverage. The second synchronization trigger can ensure that multiple ultrasonic probes work simultaneously.

[0062] In addition, a third synchronization trigger can be set between the CCD camera array and the array-type air-coupled ultrasonic probe group to ensure that the two work simultaneously and accurately.

[0063] Wherein, the monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device; the data storage device is used to store information from the projection moiré module and the ultrasonic module, and transmit it to the data analysis device; the data analysis device is used to obtain warping deformation information based on the first warping information, to obtain warping defect information based on the second warping information, and to obtain the monitoring result information based on the warping deformation information and the warping defect information; the monitoring display device is used to display the monitoring result information.

[0064] The judgment process of warpage deformation and defects is a combined analysis. The warpage deformation is completed by the projection moiré module. If the analysis result shows that the warpage deformation of the package module sample to be tested is obviously too large, it is combined with the ultrasonic module responsible for warpage defect monitoring to obtain a comprehensive analysis result. That is, the two need to be comprehensively analyzed to determine whether the sample to be tested is failed.

[0065] Since the projection moiré technique has high precision in measuring the warpage deformation of products, it can be used to online monitor the process of measuring the warpage deformation of large-area packaging modules that may have large warpage defects. Since the ultrasonic technique has characteristics such as fast response speed, large detection area, and can online monitor some objects to be measured that are difficult to contact or prohibited from contacting, it has relatively significant advantages in defect characterization. Therefore, it can be used to online monitor the characterization process of large-area packaging modules that may have large warpage defects. By combining the projection moiré technique with the ultrasonic technique, the warpage defects of electronic devices in industrial production can be further online monitored, the timeliness of warpage defect monitoring can be improved, unqualified failed devices can be found in time, and effective dynamic reference can be provided for the quality improvement of the production process of products, thereby improving the yield rate of electronic devices and reducing production costs.

[0066] In addition, the three-dimensional online monitoring device for the warpage deformation and defects of the packaging module further includes: an optical three-dimensional measurement calibrator and a planar mounting table. The optical three-dimensional measurement calibrator is used to calibrate the internal parameters, external parameters, and height of the camera, and establish a spatial coordinate system between the cameras and between the camera and the sample of the packaging module to be measured. The sample of the packaging module to be measured is placed on the planar mounting table.

[0067] Specifically, referring to Figure 1 , the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a grating projector array composed of multiple grating projectors. The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group can be divided into: a transmitting probe 3 and a receiving probe 4. The sample of the packaging module to be measured (such as a wafer or an OLED screen, etc.) 5 is placed on the planar mounting table, the transmitting probe 3 is located above the sample 5 of the packaging module to be measured, and the receiving probe 4 is located below the sample 5 of the packaging module to be measured. For example, the receiving probe 4 can be arranged inside the planar mounting table, and both the transmitting probe 3 and the receiving probe 4 are perpendicular to the sample 5 of the packaging module to be measured.

[0068] Embodiment 2:

[0069] A three-dimensional online monitoring device for the warpage deformation and defects of a packaging module provided by Embodiment 2, referring to Figure 2, the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a grating projector array composed of multiple grating projectors. The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes. Different from Embodiment 1, the probe in Embodiment 2 is a transmitting and receiving probe 3. The to-be-tested packaging module sample 4 is placed on the flat mounting table, and the transmitting and receiving probe 3 is located above the to-be-tested packaging module sample 4 and perpendicular to the to-be-tested packaging module sample 4.

[0070] Embodiment 3:

[0071] A three-dimensional on-line monitoring device for warpage deformation and defects of a packaging module provided in Embodiment 3, see Figure 3 , the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a grating projector array composed of multiple grating projectors. The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group can be divided into: a transmitting probe 3 and a receiving probe 4. The to-be-tested packaging module sample 5 is placed on the flat mounting table, and both the transmitting probe 3 and the receiving probe 4 are located above the to-be-tested packaging module sample 5, and both the transmitting probe 3 and the receiving probe 4 form a certain angle with the to-be-tested packaging module sample 5.

[0072] For the devices provided in Embodiments 1 - 3, the following is a reference parameter: (1) The projected moiré pattern area that can be emitted is 600mm × 600mm, the frequency is 50Hz, and the fringe density is adjustable from 2 to 50 lines; (2) The image resolution is 64 million pixels, the camera frame rate is 75fps, the frame rate at 64 million pixels is not less than 10fps during acquisition, the field of view is not less than 600mm × 600mm, and the warpage deformation measurement resolution is 4 microns (600mm × 600mm).

[0073] Using the above device, the present invention provides a three-dimensional on-line monitoring method for warpage deformation and defects of a packaging module, including the following steps:

[0074] Obtain the first warpage information of the to-be-tested packaging module sample through the projected moiré pattern module;

[0075] Obtain the second warpage information of the to-be-tested packaging module sample through the ultrasonic module;

[0076] Obtain the monitoring result information according to the first warpage information and the second warpage information.

[0077] Among them, the monitoring sequence method includes but is not limited to the following two:

[0078] (1) The online monitoring of warpage defects is carried out by simultaneously using ultrasonic and projection moiré functions.

[0079] (2) The online monitoring of warpage defects is carried out by alternately using ultrasonic and projection moiré functions in a specific repeated order.

[0080] The following is described in conjunction with specific embodiments.

[0081] Embodiment 4:

[0082] A method for three-dimensional online monitoring of warpage deformation and defects of a packaging module provided in Embodiment 4 uses the monitoring device provided in Embodiment 1. In Embodiment 4, through the ultrasonic module, the second warpage information is obtained by the transmission method. The schematic diagram of the principle of the transmission method is referred to Figure 4 . The ultrasonic transmitting probe emits an ultrasonic detection signal. Subsequently, the ultrasonic receiving probe receives the transmitted ultrasonic signal penetrating from the sample to be measured and inputs it into the workstation through a preamplifier to analyze and monitor the warpage defects of the sample.

[0083] Taking the device for three-dimensional online monitoring of warpage deformation and defects of a packaging module provided in Embodiment 4 as an example, the corresponding online monitoring method is as follows: In the projection moiré module, a high-speed grating projector projects a grating onto the surface of the sample, and an array of CCD cameras continuously captures the changes in the grating on the surface of the sample. The warpage defects of the sample are monitored through projection moiré analysis software; in the ultrasonic module, the workstation is used to control a highly sensitive array of air-coupled ultrasonic transmitting probe groups to emit ultrasonic signals, and then the array of air-coupled ultrasonic receiving probe groups continuously collects the ultrasonic fluctuation signals of the sample to be measured and inputs them into the workstation through a preamplifier to analyze and monitor the warpage defects of the sample. Through this entire set of ultrasonic and projection moiré systems, the purpose of online monitoring of warpage deformation and defects of a large-area packaging module is achieved.

[0084] Embodiment 5:

[0085] A method for three-dimensional online monitoring of warpage deformation and defects of a packaging module provided in Embodiment 5 uses the monitoring device provided in Embodiment 2. In Embodiment 5, through the ultrasonic module, the second warpage information is obtained by the surface reflection method. The schematic diagram of the principle of the surface reflection method is referred to Figure 5 . The ultrasonic transmitting and receiving probe emits an ultrasonic detection signal. Subsequently, the ultrasonic transmitting and receiving probe receives the ultrasonic signal reflected from the surface of the sample to be measured and inputs it into the workstation through a preamplifier to analyze and monitor the warpage defects of the sample.

[0086] Embodiment 6:

[0087] An online three-dimensional monitoring method for warping deformation and defects of a packaging module provided in Embodiment 6 uses the monitoring device provided in Embodiment 3. In Embodiment 6, the second warping information is obtained by the ultrasonic module using the bottom reflection method (V transmission method). For the schematic diagram of the principle of the bottom reflection method (V transmission method), refer to Figure 6 , the ultrasonic transmitting probe and the receiving probe are pre-adjusted at a certain angle in the area to be measured of the sample so that the reflected ultrasonic signal can be successfully collected by the receiving probe. First, the ultrasonic transmitting probe emits an ultrasonic detection signal, and then the ultrasonic receiving probe receives the transmitted ultrasonic signal reflected and penetrated from the bottom surface of the sample to be measured, and inputs it into the workstation through a pre-amplifier for analyzing and monitoring the warping defects of the sample.

[0088] Embodiment 7:

[0089] An online three-dimensional monitoring method for warping deformation and defects of a packaging module provided in Embodiment 7 uses the monitoring device provided in Embodiment 3. In Embodiment 7, the second warping information is obtained by the ultrasonic module using the bottom reflection method (surface wave). For the schematic diagram of the principle of the bottom reflection method (surface wave), refer to Figure 7 , the ultrasonic transmitting probe and the receiving probe are pre-adjusted at a certain angle in the area to be measured of the sample so that the reflected ultrasonic signal can be successfully collected by the receiving probe. First, the ultrasonic transmitting probe emits an ultrasonic detection signal, and then the ultrasonic receiving probe simultaneously receives the transmitted ultrasonic signal reflected and penetrated from the bottom surface of the sample to be measured and the surface wave signal reflected from the surface of the sample, and inputs it into the workstation through a pre-amplifier for analyzing and monitoring the warping defects of the sample.

[0090] An online three-dimensional monitoring method and device for warping deformation and defects of a packaging module provided in the embodiments of the present invention at least include the following technical effects:

[0091] The present invention can perform online monitoring on the warping defects of electronic devices in industrial production, improve the timeliness of warping defect monitoring, promptly discover unqualified failed devices, provide an effective dynamic reference for improving the quality of the product production process flow, thereby improving the yield rate of electronic devices and reducing production costs.

[0092] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. An on-line three-dimensional monitoring device for warping deformation and defects of a packaging module, characterized in that, Including: A projection moiré module, an ultrasonic module, and a monitoring and analysis module; The monitoring and analysis module is respectively connected to the projection moiré module and the ultrasonic module; The projection moiré module includes: a CCD camera and a grating projector; the grating projector is used to project a grating onto the surface of the sample of the package module to be measured; the CCD camera is used to continuously capture and collect the change of the grating on the surface of the sample of the package module to be measured, so as to obtain the first warpage information of the sample of the package module to be measured; The ultrasonic module is used to obtain the second warpage information of the sample of the package module to be measured; the ultrasonic module includes: an air-coupled ultrasonic probe, an ultrasonic signal transmitter-receiver, and a preamplifier; the air-coupled ultrasonic probe is connected to the ultrasonic signal transmitter-receiver, the ultrasonic signal transmitter-receiver is connected to the preamplifier, and the preamplifier is connected to the monitoring and analysis module; The monitoring and analysis module is used to obtain monitoring result information according to the first warpage information and the second warpage information.

2. The on-line three-dimensional monitoring device for warping deformation and defects of the encapsulation module according to claim 1, wherein The projection moiré module further includes: a first synchronization trigger; The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger; The grating projector is a grating projector array composed of multiple grating projectors.

3. The warpage deformation and defect three-dimensional online monitoring device for the encapsulation module according to claim 1, characterized in that The ultrasonic module further includes: a second synchronization trigger; The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of multiple air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group is connected to the second synchronization trigger.

4. The warpage deformation and defect three-dimensional on-line monitoring device for the encapsulation module according to claim 1, wherein The monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device; The data storage device is used to store the information from the projection moiré module and the ultrasonic module, and transmit it to the data analysis device; The data analysis device is used to obtain warpage deformation information according to the first warpage information, obtain warpage defect information according to the second warpage information, and obtain the monitoring result information according to the warpage deformation information and the warpage defect information; The monitoring display device is used to display the monitoring result information.

5. The three-dimensional on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, wherein, Also including: An optical three-dimensional measurement calibrator; The optical three-dimensional measurement calibrator is used to calibrate the internal parameters, external parameters, and height of the CCD camera.

6. The on-line three-dimensional monitoring device for warping deformation and defects of the encapsulation module according to claim 1, characterized in that, Also including: A planar placement table; The sample of the package module to be measured is placed on the planar placement table.

7. A three-dimensional on-line monitoring method for warping deformation and defects of a packaging module, characterized in that, Using the device for three-dimensional on-line monitoring of warpage deformation and defects of the package module as described in any one of claims 1-6, the method includes the following steps: Obtaining the first warpage information of the sample of the package module to be measured through the projection moiré module; Obtaining the second warpage information of the sample of the package module to be measured through the ultrasonic module; Obtaining monitoring result information according to the first warpage information and the second warpage information.

8. The method for three-dimensional on-line monitoring of warping deformation and defects of the encapsulation module according to claim 7, characterized in that, Through the ultrasonic module, the second warpage information is obtained by using the transmission method, the surface reflection method, the bottom surface reflection method of the V transmission method, or the bottom surface reflection method of the surface wave.

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